Micro LED laser mass welding device

Abstract

The Micro LED laser mass welding device specifically comprises a scanning galvanometer, a moving assembly and a feeding assembly, the moving assembly is connected with a light guide barrel and a reflection block which are distributed in a staggered mode, and a light equalizing lens and a focusing lens which are distributed in parallel are installed in the light guide barrel; the area covered by the laser beam guided by the scanning galvanometer in the first direction is a welding area; wherein the feeding assembly is used for conveying a PCB substrate provided with a plurality of Micro LED chips into or away from a welding area, and the reflection block is provided with a first detection camera in parallel; the moving assembly is used for driving the light guide cylinder and the reflection block to alternately enter or leave the welding area in the second direction. Through combined use of the light guide cylinder, the light equalizing lens and the focusing lens, an optical path is effectively optimized, laser energy distribution is more uniform, the focusing precision is higher, the welding quality is improved, and the defect rate is reduced. Therefore, the technical problem that in the prior art, energy distribution of laser beams output by a laser head is not uniform is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of laser welding, and particularly relates to a Micro LED laser mass welding device. Background Art

[0002] Micro LED (micro light-emitting diode) is a new display technology, which features using very small LEDs (usually less than 100 microns) as the light source for each pixel. Each Micro LED display consists of millions of tiny independent LED chips that can emit light and control colors independently. With the continuous progress of technology, Micro LED display technology is expected to be widely applied in multiple fields such as smart TVs, smartphones, wearable devices, augmented reality (AR) and virtual reality (VR) devices in the future.

[0003] In the prior art, in the manufacturing process of Micro LED display panels, it is necessary to transfer LED chips from a carrier board to a substrate, and use a laser beam with a high energy density to irradiate the contact points between the LED chips and the substrate, so that the solder melts and forms a firm solder joint, thereby realizing Micro LED laser mass welding. However, when applying the above laser mass welding technology to Micro LED chip welding, since the energy of the laser beam output by the laser head is mainly concentrated in the central area of the light spot, and the energy at the edge of the light spot is relatively low, the energy distribution of the laser beam is uneven, which easily leads to virtual soldering of the solder joints and makes it difficult to ensure the stability and repeatability of the welding process. Summary of the Invention

[0004] The purpose of the present invention is to provide a Micro LED laser mass welding device, which solves the technical problem of uneven energy distribution of the laser beam output by the laser head in the prior art.

[0005] To achieve this purpose, the present invention adopts the following technical solutions: A Micro LED laser mass welding device includes: a scanning galvanometer, a moving component, and a feeding component. The moving component is connected with light guide tubes and reflection blocks distributed in a staggered manner. A homogenizing lens and a focusing lens are installed in parallel in the light guide tubes. The area covered by the laser beam guided by the scanning galvanometer along the first direction is the welding area; Among them, the feeding component is used to convey a PCB substrate loaded with a plurality of Micro LED chips into or away from the welding area. A first detection camera for visually detecting the welding area is arranged in parallel on the reflection block; the moving component is used to drive the light guide tubes and the reflection blocks to alternately enter or away from the welding area along the second direction, and the first direction is perpendicular to the second direction.

[0006] Optionally, the moving component includes a moving base, on which a galvanometer scanner, a first detection camera, and a moving cylinder are mounted. The heights of the galvanometer scanner, the moving cylinder, and the first detection camera gradually decrease along a first direction. Wherein, a moving frame is fixedly connected to the telescopic rod of the moving cylinder. The light guide tube and the reflection block are both mounted on the moving frame. A plurality of hollow holes are formed in the moving frame, and a light passing hole is provided on the moving base.

[0007] Optionally, a first light source for providing light to the welding area is mounted on the moving frame. The reflection block is provided with a reflection surface arranged obliquely, and the reflection surface is arranged opposite to the first detection camera. Wherein, a boss in contact with the reflection block is provided on the moving frame. A fastening plate is fixedly connected to the moving frame. One end of the fastening plate is provided with a fastening portion hooked to the reflection surface, and the fastening portion is arranged obliquely.

[0008] Optionally, a suction component is mounted on the feeding component. The suction component includes a suction hood and a suction pipe communicated with the suction hood. Wherein, two openings for accommodating the PCB substrate to pass through are provided on the suction hood. A first protection lens located between the galvanometer scanner and the light homogenizing lens is mounted in the light guide tube. A second protection lens arranged opposite to the galvanometer scanner is mounted on the suction hood.

[0009] Optionally, a first step, a second step, and a third step are sequentially arranged in the light guide tube along the first direction. The first step, the second step, and the third step are all arranged in a frustum shape. The suction hood is provided with a through mounting groove. Wherein, the focusing lens is lapped on the first step, the light homogenizing lens is lapped on the second step, the first protection lens is lapped on the third step, and the second protection lens is lapped in the mounting groove.

[0010] Optionally, at least one first adsorption hole is formed in the first step, at least one second adsorption hole is formed in the second step, and at least one third adsorption hole is formed in the third step. Wherein, the side wall of the light guide tube is provided with adsorption tubes respectively communicated with the first adsorption hole, the second adsorption hole, and the third adsorption hole. The adsorption tubes are communicated with the suction pipe through hoses. The height of the adsorption tubes in the first direction is less than the height of the light homogenizing lens.

[0011] Optionally, a fourth adsorption hole and a fifth adsorption hole are provided in the light guide tube. The fourth adsorption hole and the fifth adsorption hole are respectively communicated with the adsorption tube. The fourth adsorption hole is located between the focusing lens and the light homogenizing lens, and the fifth adsorption hole is located between the light homogenizing lens and the first protective lens.

[0012] Optionally, the feeding assembly includes a feeding base arranged along the third direction. A feeding plate is slidably connected to the feeding base, and a feeding motor for driving the feeding plate to move linearly is installed at one end of the feeding base. Wherein, at least one material suction hole for adsorbing the PCB substrate is provided on the feeding plate, and the first direction, the second direction, and the third direction are perpendicular to each other.

[0013] Optionally, it further includes a frame, and both the moving assembly and the feeding assembly are installed on the frame; a second detection assembly adjacent to the feeding assembly is further installed on the frame, and the second detection assembly is used for visual inspection of the Micro LED chips after laser welding.

[0014] Wherein, the second detection assembly includes a mounting rod fixedly installed on the frame and arranged along the first direction. A second light source and a second detection camera are sequentially arranged on the mounting rod; the height of the second light source in the first direction is lower than the height of the second detection camera and higher than the height of the PCB board.

[0015] Optionally, the Micro LED laser mass welding device performs laser welding by the following method, including: Step S1, conveying a PCB substrate loaded with a plurality of Micro LED chips to the welding area through the feeding assembly; Step S2, after moving the reflection block to a preset detection position through the material moving assembly, the first detection camera performs visual inspection on the welding area to identify the welding positions of a plurality of Micro LED chips; Step S3, after the moving assembly moves the light guide tube to a preset light guiding position, so that the scanning galvanometer, the light homogenizing lens, and the focusing lens are all on the same straight line; wherein, the reflection block is far away from the welding area; Step S4, according to the welding positions of a plurality of Micro LED chips, the laser beam output by the scanning galvanometer sequentially passes through the light homogenizing lens and the focusing lens to weld a plurality of Micro LED chips on the PCB substrate.

[0016] Compared with the prior art, the present invention has the following beneficial effects: A Micro LED laser mass soldering device provided by the present invention specifically includes: a galvanometer scanner, a moving component, and a feeding component. By setting the galvanometer scanner and the moving component, the laser beam can irradiate the welding area quickly and accurately, thereby improving the welding efficiency and meeting the requirements of large-scale production. Through the combined use of a light guide tube, a homogenizing lens, and a focusing lens, the optical path is effectively optimized, making the laser energy distribution more uniform and the focusing accuracy higher, thus improving the welding quality and reducing the defect rate. Due to the parallel setting of the reflection block and the first detection camera, it is convenient to perform real-time visual inspection on the welding area, and potential welding defects can be detected and corrected in a timely manner, improving the reliability of the overall production process. Since the moving component can alternately drive the light guide tube and the reflection block in the second direction, the structure is more compact, effectively utilizing the space and enabling the device to achieve a higher functional density in the same space. Through the setting of the feeding component, it can adapt to PCB substrates of different sizes and specifications, has strong compatibility, and meets the welding requirements of different Micro LED chips. The integrated setting of the present invention simplifies the operation process, reduces the necessity of manual intervention, and improves the automation level of the production line. Therefore, the present invention solves the technical problem of uneven energy distribution of the laser beam output by the laser head in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] The structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those who are familiar with this technology to understand and read, and are not used to limit the limited conditions under which the present invention can be implemented. Therefore, they do not have a substantial technical meaning. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed by the present invention.

[0019] Figure 1 It is a three-dimensional structural schematic diagram of a Micro LED laser mass soldering device disclosed in an embodiment of the present invention; Figure 2 It is a partial exploded structural schematic diagram of a Micro LED laser mass soldering device disclosed in an embodiment of the present invention; Figure 3 It is one of the partial structural schematic diagrams of a Micro LED laser mass soldering device disclosed in an embodiment of the present invention; Figure 4 Schematic top - down partial structure view of a Micro LED laser mass soldering device disclosed in an embodiment of the present invention; Figure 5 is Figure 4 A - A sectional structure view of; Figure 6 Schematic structure view of a light guide cylinder in a Micro LED laser mass soldering device disclosed in an embodiment of the present invention; Figure 7 is Figure 6 Enlarged structure view at position B of; Figure 8 Second partial structure view of a Micro LED laser mass soldering device disclosed in an embodiment of the present invention; Figure 9 Exploded structure view of a suction component and a second protective lens in a Micro LED laser mass soldering device disclosed in an embodiment of the present invention.

[0020] Illustration description: 10. Scanning galvanometer; 20. Moving component; 21. Moving base; 211. Light - passing hole; 22. Moving cylinder; 23. Moving frame; 231. Hollow hole; 232. Boss; 24. First light source; 25. Fastening plate; 251. Fastening part; 30. Feeding component; 31. Feeding base; 32. Feeding plate; 321. Material - sucking hole; 33. Feeding motor; 40. Light guide cylinder; 41. First step; 42. Second step; 43. Third step; 44. First adsorption hole; 45. Second adsorption hole; 46. Third adsorption hole; 47. Adsorption tube; 48. Fourth adsorption hole; 49. Fifth adsorption hole; 50. Reflection block; 51. Reflecting surface; 60. Homogeneous light lens; 70. Focusing lens; 80. First detection camera; 90. Suction component; 91. Suction cover; 911. Opening; 912. Installation groove; 92. Suction pipe; 921. Connector; 100. First protective lens; 200. Second protective lens; 300. Frame; 400. Second detection component; 401. Installation rod; 402. Second light source; 403. Second detection camera. Detailed implementation manners

[0021] In order to make the object, features, and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the embodiments described below are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0022] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be an intermediate component present at the same time.

[0023] The technical solutions of the present invention will be further described below with reference to the accompanying drawings and through specific embodiments.

[0024] The embodiment of the present invention provides a Micro LED laser mass soldering device, as Figures 1 to 9 shown, including: a scanning galvanometer 10, a moving component 20, and a feeding component 30. The moving component 20 is connected with light guide tubes 40 and reflection blocks 50 distributed in a staggered manner. The light guide tubes 40 are internally installed with a homogenizing lens 60 and a focusing lens 70 distributed in parallel. The area covered by the laser beam guided by the scanning galvanometer 10 along the first direction is the welding area; in this embodiment, the homogenizing lens 60 is made of optical glass (such as fused quartz, etc.) or optical plastic (such as polycarbonate, etc.), and the focusing lens 70 is made of optical glass with a high refractive index (such as high-silicon-lead optical glass, optical fluoride glass, etc.); Among them, the feeding component 30 is used to convey a PCB substrate loaded with a plurality of Micro LED chips into or away from the welding area. The reflection block 50 is provided with a first detection camera 80 for visually detecting the welding area in parallel; the moving component 20 is used to drive the light guide tubes 40 and the reflection blocks 50 to alternately enter or away from the welding area along the second direction, and the first direction is perpendicular to the second direction.

[0025] It should be noted that for a Micro LED laser mass soldering device provided by the present invention, by setting a galvanometer scanner 10 and a moving component 20, the laser beam can irradiate the soldering area quickly and accurately, thereby improving the soldering efficiency and meeting the requirements of large-scale production. By using a combination of a light guide tube 40, a light homogenizing lens 60, and a focusing lens 70, the optical path is effectively optimized, making the laser energy distribution more uniform and the focusing accuracy higher, thereby improving the soldering quality and reducing the defect rate. Due to the parallel arrangement of the reflection block 50 and the first detection camera 80, it is convenient to perform real-time visual inspection on the soldering area, and potential soldering defects can be detected and corrected in a timely manner, improving the reliability of the overall production process. Since the moving component 20 can alternately drive the light guide tube 40 and the reflection block 50 in the second direction, the structure is more compact, the effective utilization of space is achieved, and a higher functional density can be realized by the device in the same space. By setting a feeding component 30, it can adapt to PCB substrates of different sizes and specifications, has strong compatibility, and meets the soldering requirements of different Micro LED chips. The integrated setting of the present invention simplifies the operation process, reduces the necessity of manual intervention, and improves the automation level of the production line. Therefore, the present invention solves the technical problem of uneven energy distribution of the laser beam output by the laser head in the prior art.

[0026] As Figures 1 to 5 shown, the moving component 20 includes a moving base 21, on which a galvanometer scanner 10, a first detection camera 80, and a moving cylinder 22 are installed. The heights of the galvanometer scanner 10, the moving cylinder 22, and the first detection camera 80 gradually decrease along the first direction; Among them, a moving frame 23 is fixedly connected to the telescopic rod of the moving cylinder 22. Both the light guide tube 40 and the reflection block 50 are installed on the moving frame 23. A plurality of hollow holes 231 are formed on the moving frame 23, and a light passing hole 211 is provided on the moving base 21. In this embodiment, the hollow holes 231 can be circular, square, strip-shaped or other shapes. By setting the hollow holes 231, the weight of the moving frame 23 can be reduced, facilitating the stable driving of the moving frame 23 to perform linear movement by the moving cylinder 22. The light passing hole 211 is circularly arranged, and the moving base 21 is arranged in a frame structure. The galvanometer scanner 10 provides a laser beam through a commonly used laser in the art, which will not be elaborated here. The light guide tube 40 can be fastened to the moving frame 23 by screws or fixed to the moving frame 23 by glue bonding.

[0027] It should be noted that the hollow holes 231 provided on the moving frame 23 effectively reduce the overall weight of the moving frame 23 by reducing the material consumption, which can reduce the power required for the moving cylinder 22 to drive the moving frame 23, correspondingly improve the stability of the moving frame 23, and ensure the reliability of the equipment during high-speed or high-frequency movement. Since the moving base 21 adopts a frame structure and is provided with light passing holes 211 at the same time; it not only provides the necessary strength support, but also ensures the unobstructed passage of the laser beam, preventing the accuracy and efficiency of the welding process from being affected by physical obstacles. Since the hollow holes 231 provide a variety of shape options (such as circular, square, rectangular, etc.), the structure of the moving frame 23 can be optimized according to specific requirements and mechanical properties, which helps to better meet the weight and stability requirements in specific application scenarios. By the coordinated use of the scanning galvanometer 10 and the laser, the emission of the laser beam can be efficiently and accurately controlled, promoting the efficient progress of the welding process. In addition, since the scanning galvanometer 10, the moving cylinder 22, and the first detection camera 80 are arranged in a decreasing order of height along the first direction, the interference on the laser path can be minimized.

[0028] As Figures 1 to 5 shown, a first light source 24 for providing illumination to the welding area is installed on the moving frame 23, and a reflecting surface 51 is provided on the reflecting block 50 in an inclined surface setting, and the reflecting surface 51 is disposed opposite to the first detection camera 80; in this embodiment, the reflecting block 50 is arranged in a triangular prism shape; the reflecting block 50 can be made of aluminum alloy or other metals with high reflectivity to ensure its excellent reflection performance, so as to maximize the utilization of the light emitted by the light source. The triangular prism shape of the reflecting block 50 is formed by precision machining, and each surface is polished to reduce the scattering of light and improve the reflection effect. The inclined surface angle of the reflecting surface 51 can be adjusted according to the light source angle and the requirements of the detection camera in actual applications to achieve the best light focusing and reflection effects. The first light source 24 can be a high-brightness LED lamp or a white light LED, and the first light source 24 can be equipped with an adjustable power control circuit to adjust the illumination intensity according to needs, achieving higher flexibility to adapt to different welding materials or application requirements.

[0029] Among them, a boss 232 in contact with the reflection block 50 is provided on the moving frame 23. A fastening plate 25 is fixedly connected to the moving frame 23. One end of the fastening plate 25 is provided with a fastening portion 251 hooked to the reflection surface 51, and the fastening portion 251 is inclined. In this embodiment, the fastening plate 25 and the moving frame 23 are fixedly connected by screws, and the fastening portion 251 and the fastening plate 25 are integrally formed. One side surface of the reflection block 50 is closely attached to the moving frame 23, and the other side surface of the reflection block 50 is closely attached to the fastening plate 25. The above two side surfaces of the reflection block 50 are vertically arranged. In the specific implementation process, when the moving frame 23 is in the first position, the reflection block 50 is located in the welding area; when the moving frame 23 is in the second position, the light guide cylinder 40 is located in the welding area; when the moving frame 23 is in the third position, both the light guide cylinder 40 and the reflection block 50 are away from the welding area; by the extending action of the moving cylinder 22, the moving frame 23 is sequentially in the first position, the second position, and the third position. Due to the moving action of the moving assembly 20, when the moving frame 23 is in the first position, the welding device performs a detection operation; when the moving frame 23 is in the second position, the welding device is in the first welding state to realize laser welding of a uniform laser beam; when the moving frame 23 is in the second position, the welding device is in the second welding state, emitting a laser beam with a Gaussian distribution, and can weld application objects with low requirements for welding accuracy.

[0030] It should be noted that the reflection block 50 is fixedly installed on the moving frame 23 through the fastening plate 25, ensuring that the position of the reflection block 50 remains stable during the movement of the device, not easily loosening or shifting, thereby ensuring the consistency of laser welding and detection. Due to the triangular prism shape of the reflection block 50 and the inclined setting of the reflection surface 51, light can be efficiently reflected and directed towards the first detection camera 80. Through the structural setting of the reflection block 50, it is ensured that the first detection camera 80 can obtain the best imaging effect, further improving the accuracy and reliability of welding quality detection.

[0031] As Figure 1 、 Figure 8 and Figure 9 shown, a suction component 90 is installed on the feeding component 30. The suction component 90 includes a suction hood 91 and a suction pipe 92 connected to the suction hood 91; in this embodiment, a suction opening is formed through the side wall of the suction hood 91, and the suction opening is connected to the suction hood 91; Among them, two openings 911 for accommodating the passing of the PCB substrate are provided on the suction hood 91. A first protective lens 100 located between the scanning galvanometer 10 and the light homogenizing lens 60 is installed inside the light guide tube 40, and a second protective lens 200 opposite to the scanning galvanometer 10 is installed on the suction hood 91. In this embodiment, both the first protective lens 100 and the second protective lens 200 can be made of optical glass or high-strength plastic (such as polycarbonate) materials to provide good optical performance and resist the damage of the laser. The thickness of the first protective lens 100 is 1 - 5 mm, and the thickness of the second protective lens 200 is 20 - 50 mm. In order to reduce light loss, an anti-reflection coating can be added to the surface of the first protective lens 100. The suction pipe 92 is connected to a commonly used vacuum pumping device in the art, which will not be elaborated here.

[0032] It should be noted that through the settings of the suction hood 91 and the suction pipe 92, the smoke, gas or particulate matter generated during the welding process can be effectively removed, the welding area can be kept clean, the efficiency and accuracy of laser welding can be ensured, and the welding defects caused by impurity contamination can be reduced. Through the settings of the first protective lens 100 and the second protective lens 200, the galvanometer and other optical devices can be effectively protected from burning, dust and contamination. The first protective lens 100 and the second protective lens 200 are in appropriate positions in the optical path, which can also ensure the quality and consistency of the laser beam and further improve the stability of welding.

[0033] As Figures 1 to 7 shown, a first step 41, a second step 42 and a third step 43 are sequentially arranged along the first direction inside the light guide tube 40. The first step 41, the second step 42 and the third step 43 are all arranged in a frustum shape. The suction hood 91 is provided with a through mounting groove 912. In the specific implementation process, the light guide tube 40, the first step 41, the second step 42 and the third step 43 are an integrally formed structure, and the inner diameters of the first step 41, the second step 42 and the third step 43 increase in sequence. The light guide tube 40 is made of aluminum alloy or high-strength plastic (such as polycarbonate), and the light guide tube 40, the first step 41, the second step 42 and the third step 43 are integrally formed by methods such as turning and milling to ensure the unity of its structure and the consistency of its optical performance.

[0034] Among them, the focusing lens 70 is lapped on the first step 41, the light homogenizing lens 60 is lapped on the second step 42, the first protective lens 100 is lapped on the third step 43, and the second protective lens 200 is lapped in the mounting groove 912. In this embodiment, the second protective lens 200 can be bonded in the mounting groove 912 or can be fixedly connected by screws.

[0035] It should be noted that the integrally formed structure of the light guide tube 40, the first step 41, the second step 42, and the third step 43 not only improves production efficiency but also ensures precise fit between components. This design helps reduce assembly errors and significantly improves the overall performance of the optical system. Through the sequentially increasing inner diameter setting, the laser beam can be effectively guided, and the beam scattering gradually decreases when passing through different steps, maintaining the stability and directivity of the light, thereby improving the focusing accuracy of the laser and enhancing the welding quality. Through the arrangement of the first protective lens 100 and the second protective lens 200, the damage of the laser beam to the built-in optical components is effectively prevented, and at the same time, the influence of dust and other pollutants on the optical performance of the optical components can be reduced.

[0036] As Figures 5 to 9 shown, at least one first adsorption hole 44 is provided on the first step 41, at least one second adsorption hole 45 is provided on the second step 42, and at least one third adsorption hole 46 is provided on the third step 43; in the specific implementation process, the first adsorption hole 44, the second adsorption hole 45, and the third adsorption hole 46 are all set as round holes or square holes; Among them, the side wall of the light guide tube 40 is provided with adsorption tubes 47 respectively communicating with the first adsorption hole 44, the second adsorption hole 45, and the third adsorption hole 46, and the adsorption tubes 47 are communicated with a suction pipe 92 through a hose (not shown); the height of the adsorption tubes 47 in the first direction is less than the height of the light homogenizing lens 60.

[0037] Specifically, a connector 921 is provided on the suction pipe 92. One end of the hose is connected to the adsorption tube 47, and the other end of the hose is connected to the connector 921. A fourth adsorption hole 48 and a fifth adsorption hole 49 are provided in the light guide tube 40. The fourth adsorption hole 48 and the fifth adsorption hole 49 are respectively communicated with the adsorption tube 47. The fourth adsorption hole 48 is located between the focusing lens 70 and the light homogenizing lens 60, and the fifth adsorption hole 49 is located between the light homogenizing lens 60 and the first protective lens 100.

[0038] It should be noted that through the arrangement of the first adsorption hole 44, the second adsorption hole 45, and the third adsorption hole 46, since the adsorption tubes 47 are communicated with the suction pipe 92 through a hose, the focusing lens 70, the light homogenizing lens 60, and the first protective lens 100 can be adsorbed and fixed. Through the arrangement of the fourth adsorption hole 48 and the fifth adsorption hole 49, the air in the light guide tube 40 can be suctioned to prevent smoke from accumulating in the light guide tube 40, enabling the laser beam to pass through smoothly and enhancing the welding quality.

[0039] As Figure 1 and Figure 8As shown in the figure, the feeding component 30 includes a feeding base 31 arranged along the third direction. A feeding plate 32 is slidably connected to the feeding base 31. One end of the feeding base 31 is provided with a feeding motor 33 for driving the feeding plate 32 to move linearly. Among them, at least one material suction hole 321 for adsorbing the PCB substrate is provided on the feeding plate 32, and the first direction, the second direction, and the third direction are perpendicular to each other. In this embodiment, the material suction hole 321 is a round hole, and a plurality of material suction holes 321 are distributed in a matrix on the feeding plate 32.

[0040] It should be noted that the material suction hole 321 and the suction component 90 are both connected through the same vacuum pumping device, or can be respectively connected through two independent vacuum pumping devices. Through the setting of the material suction hole 321, the PCB substrate can be stably positioned on the feeding plate 32, ensuring no displacement during welding or other processing, thereby reducing processing errors and improving production efficiency. Through the linear movement of the feeding plate 32, the PCB substrate can be quickly transported to the welding area, reducing the material change time and the equipment idle time, thereby enhancing the continuity and efficiency of the entire production process.

[0041] As Figure 1 and Figure 8 shown in the figure, it further includes a frame 300. The moving component 20 and the feeding component 30 are both installed on the frame 300. A second detection component 400 adjacent to the feeding component 30 is also installed on the frame 300. The second detection component 400 is used for visually detecting the Micro LED chips after laser welding. Among them, the second detection component 400 includes a mounting rod 401 fixedly installed on the frame 300 and arranged along the first direction. A second light source 402 and a second detection camera 403 are sequentially arranged on the mounting rod 401. The height of the second light source 402 in the first direction is lower than the height of the second detection camera 403 and higher than the height of the PCB board. In this embodiment, both the first detection camera 80 and the second detection camera 403 can select high-resolution CCD or CMOS cameras, and the second light source 402 can adopt a high-brightness LED light source. The first light source 24 and the second light source 402 are both annular light sources.

[0042] It should be noted that the setting of the second detection component 400 ensures that after the laser welding is completed, precise visual inspection of the Micro LED chip can be carried out. This inspection process is crucial for detecting the welding quality, identifying defects, and ensuring the product qualification rate. By arranging the second light source 402 and the second detection camera 403 on the same mounting rod 401 and along the first direction, the space is effectively saved and the system layout is made more compact. Since the height of the second light source 402 in the first direction is set lower than that of the second detection camera 403 but higher than the height of the PCB board, on the one hand, it can ensure that the object to be measured (Micro LED chip) after laser welding can obtain uniform illumination, and on the other hand, it can avoid the influence of reflection and shadow on the detection result, thereby improving the imaging quality.

[0043] In the specific implementation process, the Micro LED laser mass welding device performs laser welding using the following method, including: Step S1, the PCB substrate loaded with a plurality of Micro LED chips is conveyed to the welding area through the feeding component 30; Step S2, after the moving component moves the reflection block 50 to the preset detection position, the first detection camera 80 performs visual inspection on the welding area to identify the welding positions of a plurality of Micro LED chips; Step S3, after the moving component 20 moves the light guide cylinder 40 to the preset light guide position, so that the scanning galvanometer 10, the homogenizing lens 60, and the focusing lens 70 are all on the same straight line; wherein, the reflection block 50 is away from the welding area; Step S4, according to the welding positions of a plurality of Micro LED chips, the laser beam output by the scanning galvanometer 10 sequentially passes through the homogenizing lens 60 and the focusing lens 70 to weld a plurality of Micro LED chips on the PCB substrate.

[0044] It should be noted that through the setting of step S1, the PCB substrate is accurately positioned to the welding area, preparing for the subsequent welding process; the efficient feeding system improves the working efficiency of the entire production line and avoids position deviation caused by human errors. Through the setting of step S2, real-time welding position detection can be achieved, ensuring accurate identification of the chip position before welding, thereby improving the quality of the final product; the visual inspection in this part can effectively reduce welding defects and ensure the accurate position of each Micro LED chip. In step S3, since the scanning galvanometer 10, the homogenizing lens 60 and the focusing lens 70 are all on the same straight line, the alignment accuracy of the optical components is optimized to the best state, ensuring the transmission efficiency and focusing effect of the laser beam. Step S3 can ensure that the laser beam does not bend or scatter during the welding process, thereby improving the welding accuracy and consistency. In step S4, through accurate control of the output of the laser beam, efficient and precise welding is achieved. The laser beam is first evenly distributed by the homogenizing lens 60 and then focused on the welding point of the Micro LED chip through the focusing lens 70, thereby forming high-intensity laser energy in the welding area and ensuring that the welding quality meets the expected standard.

[0045] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A Micro LED laser mass soldering device, characterized in that, Including: A scanning galvanometer (10), a moving component (20), and a feeding component (30). The guiding light cylinders (40) and reflecting blocks (50) are connected to the moving component (20) and are distributed in a staggered manner. A light homogenizing lens (60) and a focusing lens (70) are installed in the guiding light cylinder (40) in parallel distribution. The area covered by the laser beam guided by the scanning galvanometer (10) along the first direction is the welding area. Among them, the feeding component (30) is used to convey a PCB substrate loaded with a plurality of Micro LED chips into or away from the welding area. A first detection camera (80) for visually detecting the welding area is arranged in parallel with the reflecting block (50). The moving component (20) is used to drive the guiding light cylinder (40) and the reflecting block (50) to alternately enter or leave the welding area along the second direction, and the first direction is perpendicular to the second direction.

2. The Micro LED laser mass soldering device according to claim 1, wherein, The moving component (20) includes a moving base (21). The scanning galvanometer (10), the first detection camera (80), and a moving cylinder (22) are installed on the moving base (21). The heights of the scanning galvanometer (10), the moving cylinder (22), and the first detection camera (80) gradually decrease along the first direction. Among them, a moving frame (23) is fixedly connected to the telescopic rod of the moving cylinder (22). The guiding light cylinder (40) and the reflecting block (50) are both installed on the moving frame (23). A plurality of hollow holes (231) are formed in the moving frame (23), and a light passing hole (211) is provided on the moving base (21).

3. The Micro LED laser mass soldering device according to claim 2, characterized in that, A first light source (24) for providing light to the welding area is installed on the moving frame (23). A reflecting surface (51) is arranged on the reflecting block (50) in an inclined manner, and the reflecting surface (51) is arranged opposite to the first detection camera (80). Among them, a boss (232) in contact with the reflecting block (50) is provided on the moving frame (23). A fastening plate (25) is fixedly connected to the moving frame (23). One end of the fastening plate (25) is provided with a fastening portion (251) hooked to the reflecting surface (51), and the fastening portion (251) is arranged in an inclined shape.

4. The Micro LED laser mass soldering device according to claim 3, wherein A suction component (90) is installed on the feeding component (30). The suction component (90) includes a suction cover (91) and a suction pipe (92) communicated with the suction cover (91). Among them, two openings (911) for accommodating the passing of the PCB substrate are provided on the suction cover (91). A first protection lens (100) is installed in the guiding light cylinder (40) between the scanning galvanometer (10) and the light homogenizing lens (60). A second protection lens (200) arranged opposite to the scanning galvanometer (10) is installed on the suction cover (91).

5. The Micro LED laser mass soldering device according to claim 4, wherein, Inside the light guide tube (40), a first step (41), a second step (42), and a third step (43) are sequentially arranged along a first direction. The first step (41), the second step (42), and the third step (43) are all arranged in a frustum shape. The suction hood (91) is provided with an installation groove (912) in a penetrating manner; Among them, the focusing lens (70) is lapped on the first step (41), the light homogenizing lens (60) is lapped on the second step (42), the first protective lens (100) is lapped on the third step (43), and the second protective lens (200) is lapped in the installation groove (912).

6. The Micro LED laser mass soldering device according to claim 5, characterized in that, At least one first adsorption hole (44) is opened on the first step (41), at least one second adsorption hole (45) is opened on the second step (42), and at least one third adsorption hole (46) is opened on the third step (43); Among them, the side wall of the light guide tube (40) is provided with adsorption tubes (47) respectively communicating with the first adsorption hole (44), the second adsorption hole (45), and the third adsorption hole (46). The adsorption tubes (47) are communicated with the suction tube (92) through hoses; the height of the adsorption tubes (47) in the first direction is less than the height of the light homogenizing lens (60).

7. The Micro LED laser mass soldering device according to claim 6, wherein, A fourth adsorption hole (48) and a fifth adsorption hole (49) are arranged inside the light guide tube (40). The fourth adsorption hole (48) and the fifth adsorption hole (49) are respectively communicated with the adsorption tubes (47). The fourth adsorption hole (48) is located between the focusing lens (70) and the light homogenizing lens (60), and the fifth adsorption hole (49) is located between the light homogenizing lens (60) and the first protective lens (100).

8. The Micro LED laser mass soldering device according to any one of claims 1 to 7, characterized in that, The feeding component (30) includes a feeding base (31) arranged along a third direction. A feeding plate (32) is slidably connected to the feeding base (31). One end of the feeding base (31) is installed with a feeding motor (33) for driving the feeding plate (32) to move linearly; Among them, at least one material suction hole (321) for adsorbing a PCB substrate is arranged on the feeding plate (32). The first direction, the second direction, and the third direction are perpendicular to each other.

9. The Micro LED laser mass soldering device according to any one of claims 1 to 7, characterized in that, It further includes a frame (300). The moving component (20) and the feeding component (30) are both installed on the frame (300); a second detection component (400) adjacent to the feeding component (30) is also installed on the frame (300). The second detection component (400) is used for visually detecting the Micro LED chips after laser welding; Among them, the second detection component (400) includes a mounting rod (401) fixedly installed on the frame (300) and arranged along the first direction. A second light source (402) and a second detection camera (403) are sequentially arranged on the mounting rod (401); the height of the second light source (402) in the first direction is lower than the height of the second detection camera (403) and higher than the height of the PCB board.

10. The Micro LED laser mass soldering device according to any one of claims 1 to 7, characterized in that, The Micro LED laser mass soldering device performs laser soldering by the following method, including: Step S1, conveying a PCB substrate loaded with a plurality of Micro LED chips to the soldering area through a feeding component (30); Step S2, after moving the reflection block (50) to a preset detection position through a material moving component, the first detection camera (80) performs visual detection on the soldering area to identify the soldering positions of a plurality of Micro LED chips; Step S3, after the moving component (20) moves the light guide cylinder (40) to a preset light guiding position, so that the scanning galvanometer (10), the homogenizing lens (60), and the focusing lens (70) are all on the same straight line; among them, the reflection block (50) is away from the soldering area; Step S4, according to the soldering positions of a plurality of Micro LED chips, the laser beam output by the scanning galvanometer (10) sequentially passes through the homogenizing lens (60) and the focusing lens (70) to solder a plurality of Micro LED chips on the PCB substrate.

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