Magnetron sputtering rotating cathode short circuit processing jig

Abstract

The invention discloses a magnetron sputtering rotating cathode short-circuit processing jig, and relates to the technical field related to magnetron sputtering devices.During work, the jig is arranged in an alarm cavity and comprises a removing mechanism and a positioning motor, a rigid pipe is arranged on the removing mechanism, one section of the rigid pipe is connected with a removing sleeve, and the other section of the rigid pipe is connected with a rotating cathode. The positioning motor drives the moving track to drive the first motor and the second motor to transversely move, the first motor and the second motor drive the removing mechanism to rotate, the jig is directly arranged in the alarm cavity, short circuit treatment can be conducted in the vacuum environment, vacuum breaking and cavity opening are not needed, and therefore 50%-80% of time is saved, the treatment efficiency is greatly improved, and the work efficiency is improved. The negative influence on the production efficiency is reduced, the short-circuit part is processed by using the remote control device in the vacuum environment, the tedious vacuum breaking and cavity opening steps in a traditional manual processing mode are avoided, the whole processing process is faster and more efficient, and therefore the production efficiency is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of magnetron sputtering devices, and particularly to a magnetron sputtering rotating cathode short-circuit treatment jig. Background Art

[0002] Magnetron sputtering technology has become one of the main industrial coating technologies due to its remarkable advantages. Among them, the rotating target has a large surface area, which can improve the material utilization rate; rotation can evenly wear, which is beneficial to extend the target life; rotation can obtain a more uniform coating deposition; and the ion bombardment during rotation can make the coating denser. The above advantages enable the rotating target to be used in large-scale industrial coating to prepare large-area and high-quality functional films. These advantages also make magnetron sputtering widely used in the production and manufacturing of heterojunction solar cells. During the process of preparing silicon wafer coating by a magnetron sputtering vacuum coating device, the abnormal situation of cathode short circuit often occurs, resulting in equipment shutdown and affecting the production progress. At present, when this abnormal situation occurs, equipment maintenance personnel will first rotate the cathode motor forward and backward in the manual mode, and the silicon wafer may fall off due to rotation. If this method is ineffective, the vacuum will be broken and the cavity will be opened for treatment. After the vacuum-breaking and cavity-opening treatment is completed, it is necessary to re-pump the vacuum to meet the requirements of process production. The machine restart time is generally more than 3 to 4 hours, seriously affecting production.

[0003] In the prior art, the magnetron sputtering device for large aspect ratio pipes disclosed in the patent publication number CN222250936U includes a pipe, an electric slide rail, a key button, an air inlet pipe, an annular target system, a slide rail transmission device, and a vacuum system: the pipe has a cavity; the electric slide rail is located inside the cavity and is provided with a plurality of through holes; the key button is filled in the through holes; the air inlet pipe is communicated with the inside of the electric slide rail; the annular target system is slidably connected with the electric slide rail; the slide rail transmission device is located at one end of the pipe and is in transmission connection with the electric slide rail; the vacuum system is located at the other end of the pipe. However, there is no short-circuit treatment jig in this comparative technology, and it still relies on manual treatment, which is very inconvenient and inefficient. Summary of the Invention

[0004] The purpose of the present invention is to solve the problem that in the prior art, only manual use of cable ties can be used to directly treat the short-circuited part, or it is necessary to break the vacuum and open the cavity for treatment, with very low efficiency, and the target material may be scratched during this process. The present invention can use a remote control device to treat the short-circuited part in a vacuum environment, and provides a magnetron sputtering rotating cathode short-circuit treatment jig with convenient operation.

[0005] Another purpose of the present invention is to solve the problem that when the equipment is in a vacuum environment with a high temperature, using cable ties to treat the short-circuited part will cause melting, and the residue remains in the chamber, causing pollution and affecting the product quality. The present invention is provided with a cleaning mechanism, which has a better cleaning effect and is still not affected in a high-temperature vacuum environment, and provides a magnetron sputtering rotating cathode short-circuit treatment jig with better performance.

[0006] To achieve the above object, the present invention provides the following technical solution: A jig for short - circuit treatment of a magnetron sputtering rotary cathode. When working, the jig is placed in an alarm chamber, and includes a cleaning mechanism and a positioning motor. A rigid tube is arranged on the cleaning mechanism. One end of the rigid tube is connected to a cleaning sleeve. The positioning motor drives a moving track to drive the first motor and the second motor to move horizontally, and the first motor and the second motor drive the cleaning mechanism to rotate.

[0007] Preferably, before working, the jig is located outdoors. There is a transition chamber between the alarm chamber and the outdoors, and a transparent window is arranged on one side of the alarm chamber.

[0008] Preferably, a limiting groove is arranged on the side of the rigid tube close to the first motor, and a fastener is arranged in the limiting groove to connect the first motor and the rigid tube.

[0009] Preferably, the rigid tube is integrally in an L - shaped structure, and the cleaning sleeve wraps one end of the rigid tube.

[0010] Preferably, several lighting blocks are arranged on one side of the outer shell of the jig, and the lighting blocks are evenly distributed.

[0011] Preferably, a battery and a PLC controller are installed on the outer shell of the jig.

[0012] Preferably, the length of the rigid tube connected to the first motor is greater than the length of the rigid tube connected to the second motor.

[0013] Preferably, one side of the jig is connected to a carrier plate, and the whole is a long - strip - shaped device.

[0014] Preferably, when the cleaning mechanism rotates, it crushes the silicon wafer at the short - circuit part. The cleaning mechanism has viscosity, and after crushing the silicon wafer, it adheres and removes the excess silicon wafer.

[0015] Preferably, the jig is equipped with a remote control device, and several buttons are arranged on the remote control device.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: The jig of the present invention is directly placed in the alarm chamber, and can process the short - circuit part in a vacuum environment without breaking the vacuum and opening the chamber, thus saving 50% - 80% of the time, greatly improving the processing efficiency, reducing the negative impact on production efficiency. By using the remote control device to process the short - circuit part in a vacuum environment, the cumbersome steps of breaking the vacuum and opening the chamber in the traditional manual processing method are avoided, making the whole processing process faster and more efficient, thus significantly improving the production efficiency.

[0017] The short - circuit removal mechanism of the present invention can effectively remove the short - circuit part in a high - temperature vacuum environment, avoid the generation of residues, thereby reducing the pollution of the process chamber, ensuring the product quality, and operating with a remote control device in a vacuum environment, making the whole processing process more simple and easy, without direct human intervention, reducing the operation difficulty and risk.

[0018] The design of the short - circuit removal mechanism of the present invention makes the removal effect of the short - circuit part more ideal, and it can still maintain good performance in a high - temperature vacuum environment, without the melting and pollution problems in the traditional cable tie treatment method, thus providing a short - circuit treatment solution with better performance. Brief Description of the Drawings

[0019] Figure 1 It is a schematic structural diagram of the present invention.

[0020] Figure 2 It is a schematic diagram of the short - circuit removal mechanism of the present invention.

[0021] Figure 3 It is an enlarged view of the partial structure C of the present invention.

[0022] Figure 4 It is an application schematic diagram of the present invention.

[0023] Figure 5 It is a schematic diagram of the remote control of the present invention.

[0024] Figure 6 It is another schematic structural diagram of the present invention.

[0025] In the figure: 1. First motor; 2. Rigid tube; 21. Limiting groove; 22. Fastening piece; 3. Removal sleeve; 4. Second motor; 5. Lighting block; 6. Moving track; 7. Fixture; 8. PLC controller; 9. Positioning motor; 10. Battery; 11. Remote control device; 12. Carrier board; 13. Button; 14. Removal mechanism; 15. Alarm chamber; 151. Transparent window; 16. Moving track; 17. Chamber door; 18. Transition chamber. Detailed Embodiments

[0026] The following are specific embodiments, in combination with the drawings, to further specifically describe the technical solutions of the present invention. The described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0027] Embodiment 1: Refer to Figures 1 to 5 , a magnetron sputtering rotary cathode short - circuit treatment fixture. During the use of a magnetron sputtering vacuum coating equipment, the cathode short - circuit problem has always been a relatively common fault, seriously affecting the normal operation and production efficiency of the equipment. To solve this problem, we designed a short - circuit treatment fixture aimed at quickly and accurately locating and treating the short - circuit point to restore the normal working state of the equipment.

[0028] During operation, the fixture 7 is placed inside the alarm chamber 15. One side of the alarm chamber 15 is provided with a transparent viewing window 151, through which the internal short - circuit location can be directly seen.

[0029] Chamber doors 17 are provided between the alarm chamber 15, the outdoor area, and the transition chamber 18. Before operation, the fixture 7 is located outdoors. There is a transition chamber 18 between the alarm chamber 15 and the outdoor area. The fixture 7 and the carrier plate 12 first enter the transition chamber 18 from the outdoor area through the tracks provided in the chamber. Then, the transition chamber 18 is evacuated. The chamber door 17 between the transition chamber 18 and the alarm chamber 15 is opened, and then they are moved into the alarm chamber, realizing the conversion from the outdoor area to the alarm chamber 15.

[0030] The main function of the cleaning mechanism 14 on the fixture 7 is to knock down or crush the silicon wafers causing the cathode short - circuit through the rotating rigid tube 2. One end of the rigid tube 2 is connected with a cleaning sleeve 3. The cleaning sleeve 3 is made of high - temperature - resistant silica gel material, and the maximum temperature resistance can reach above 150°C. This design can not only effectively remove the short - circuited silicon wafers, but also protect the target material of the cathode from being scratched by the rigid tube 2, and at the same time play a certain protective role for the carrier plate 12.

[0031] The positioning motor 9 drives the moving track 6 to drive the first motor 1 and the second motor 4 to move horizontally. This precise movement control can ensure that the rigid tube 2 is accurately vertically located directly above the silicon wafer causing the short - circuit, providing accurate positioning for the subsequent cleaning operation.

[0032] The first motor 1 and the second motor 4, as the power sources, mainly function to drive the rotation of the rigid tube 2. Through remote control, these two motors can respectively drive the rigid tube 2 to rotate, causing the silicon wafers to fall off or be crushed. The length of the rigid tube 2 is designed according to the position where the silicon wafers fall, ensuring that it will not touch the bottom surface of the alarm chamber during rotation.

[0033] The lighting block 5 uses high - temperature - resistant LED lights, and the maximum temperature resistance can also reach above 150°C. After the equipment alarms, when the carrier plate 12 with the fixture 7 is transferred to the position of the alarm chamber through the external manual control knob switch, the lighting block 5 can provide sufficient brightness, enabling the operator to clearly see the specific position where the silicon wafers fall inside the chamber, as well as the positions of the carrier plate 12 and the fixture 7 through the external cathode observation window, thus providing visual support for accurately handling the short - circuit problem.

[0034] The housing of the fixture 7 is made of stainless steel material. This material has good strength and corrosion resistance, and can effectively protect the electrical components and structure inside the fixture 7, ensuring its stable operation in a harsh vacuum environment.

[0035] The PLC controller 8 is the control center of the fixture 7. It receives signals from the remote control device 11 to achieve precise control of the first motor 1, the second motor 4, the positioning motor 9, and the lighting block 5. A number of buttons 13 are provided on the remote control device 11. Operators can send different control signals through these buttons 13 to remotely control the various components of the fixture 7, improving the convenience and safety of operation.

[0036] The battery 10 provides high-temperature resistant power for the fixture 7 to ensure the stable operation of components such as the first motor 1, the second motor 4, the positioning motor 9, the PLC controller 8, and the high-temperature resistant LEDs in a vacuum environment.

[0037] The carrier plate 12 is used to carry substrates such as silicon wafers and complete the thin film deposition process in a vacuum environment. When dealing with short circuit problems, the fixture 7 is installed and fixed on the carrier plate 12, and the carrier plate 12 is conveyed to the alarm chamber position through an external manual control knob switch.

[0038] When the magnetron sputtering vacuum coating equipment alarms, first install and fix the fixture 7 on the carrier plate 12. Then, preliminarily determine the approximate location of the alarm through the magnetron sputtering equipment monitoring software. Next, turn on the lighting block 5 on the fixture 7, and use the light it provides to accurately determine the specific location of the cathode short circuit through the external cathode observation window.

[0039] After determining the short circuit location, convey the carrier plate 12 with the fixture 7 installed on it to the alarm chamber position through the external manual control knob switch. At this time, the operator can send signals through the remote control device 11 to control the positioning motor 9 to drive the first motor 1 or the second motor 4 to move horizontally, so that the rigid tube 2 is vertically located directly above the silicon wafer causing the short circuit.

[0040] Further control the first motor 1 or the second motor 4 through the remote control device 11 to drive the rigid tube 2 to rotate, so that the rigid tube 2 vertically contacts the silicon wafer causing the cathode short circuit, thereby knocking down or crushing the silicon wafer. In this process, the cleaning sleeve 3 can not only assist in cleaning the silicon wafer, but also protect the cathode target and the carrier plate 12 from damage.

[0041] After completing the cleaning operation, move the fixture 7 installed and fixed on the carrier plate 12 outside the chamber. Restart the equipment for testing. If the equipment alarm disappears and the magnetron sputtering equipment monitoring software shows no abnormality, it can be confirmed that the cathode short circuit abnormality problem has been successfully solved.

[0042] A limit slot 21 is provided on the side of the rigid tube 2 close to the first motor 1, and a fastener 22 is built in the limit slot 21 to connect the first motor 1 and the rigid tube 2. This design can not only ensure the connection stability between the first motor 1 and the rigid tube 2, but also facilitate disassembly and maintenance, improving the operability and service life of the fixture 7.

[0043] The rigid tube 2 is integrally of an L structure, and the cleaning sleeve 3 wraps one end of the rigid tube 2. This structural design enables the rigid tube 2 to more accurately contact the short-circuited silicon wafer during rotation, and the wrapping of the cleaning sleeve 3 further enhances the protection effect on the cathode target and the carrier plate 12. On one side of the housing of the jig 7, a plurality of lighting blocks 5 are provided, and these lighting blocks 5 are evenly distributed. Such a layout can ensure uniform light distribution when observing the situation in the chamber, avoid lighting dead corners, enable the operator to more clearly see the specific position where the silicon wafer drops and the positions of the carrier plate 12 and the jig 7, thereby improving the accuracy and efficiency of the operation.

[0044] The battery 10 and the PLC controller 8 are installed on the housing of the jig 7. This design not only facilitates installation and maintenance, but also makes the internal structure of the jig 7 more compact and improves space utilization. At the same time, the stainless steel housing also plays a good protective role for the battery 10 and the PLC controller 8, ensuring their stable operation in a vacuum environment.

[0045] The length of the rigid tube 2 connected to the first motor 1 is greater than the length of the rigid tube 2 connected to the second motor 4. This design can flexibly select the first motor 1 or the second motor 4 for cleaning operations according to the short-circuit conditions at different positions, improving the applicability and flexibility of the jig 7. This short-circuit treatment jig can quickly and accurately locate and handle the cathode short-circuit problem in the magnetron sputtering vacuum coating equipment, greatly reducing the equipment downtime, improving the production efficiency, and reducing the production cost. Through reasonable design and high-quality material selection, the jig 7 can effectively protect the cathode target and the carrier plate 12 from damage while removing the short-circuited silicon wafer, ensuring the normal operation of the equipment and the quality stability of the product.

[0046] Remote control is carried out by using the remote control device 11, which is easy to operate, avoids the operator directly entering the alarm chamber for maintenance, improves the operation safety, and also reduces the influence of human factors on the equipment and product quality.

[0047] The jig 7 is applicable to various models of magnetron sputtering vacuum coating equipment, and has wide applicability and popularization value. In the future development, with the continuous progress and improvement of technology, this short-circuit treatment jig is expected to be applied in more vacuum coating equipment, providing strong support for the development of industries such as semiconductors, optics, and electronics.

[0048] In summary, this magnetron sputtering rotary cathode short-circuit treatment jig effectively solves the equipment cathode short-circuit problem through reasonable design, high-quality material selection, and precise control methods, improves the production efficiency and the stability of equipment operation, and has significant application advantages and broad market prospects.

[0049] Example 2: Refer toFigures 1 to 5 , a jig for short - circuit treatment of a magnetron - sputtering rotary cathode. The jig 7 is placed inside the alarm chamber 15. A transparent window 151 is provided on one side of the alarm chamber 15, through which the internal short - circuit point can be directly seen. The cleaning mechanism 14 knocks down or crushes the silicon wafer causing the cathode short - circuit through the rotating rigid tube 2. One end of the rigid tube 2 is connected with a cleaning sleeve 3, and the cleaning sleeve 3 is made of high - temperature - resistant silica gel material, with a maximum temperature resistance of over 150 °C. This design can not only effectively remove the short - circuited silicon wafer, but also protect the target of the cathode from being scratched by the rigid tube 2, and at the same time play a certain protective role for the carrier plate 12.

[0050] The positioning motor 9 drives the moving track 6 to drive the first motor 1 and the second motor 4 to move horizontally. This precise movement control can ensure that the rigid tube 2 is accurately vertically above the silicon wafer causing the short - circuit, providing accurate positioning for subsequent cleaning operations.

[0051] The first motor 1 and the second motor 4 serve as power sources, and their main function is to drive the rotation of the rigid tube 2. Through remote control, these two motors can drive the rigid tube 2 to rotate respectively, causing the silicon wafer to fall off or be crushed. The length of the rigid tube 2 is designed according to the position where the silicon wafer drops, ensuring that it will not touch the bottom surface of the alarm chamber during rotation.

[0052] The lighting block 5 uses high - temperature - resistant LED lights, and the maximum temperature resistance can also reach over 150 °C. After the equipment alarms, when the carrier plate 12 with the jig 7 is transferred to the position of the alarm chamber through an external manual control knob switch, the lighting block 5 can provide sufficient brightness, enabling the operator to clearly see the specific position where the silicon wafer drops in the chamber, as well as the positions of the carrier plate 12 and the jig 7 through the external cathode observation window, thus providing visual support for accurately handling the short - circuit problem.

[0053] The outer shell of the jig 7 is made of stainless steel material, which has good strength and corrosion resistance, and can effectively protect the electrical components and structures inside the jig 7, ensuring its stable operation in a harsh vacuum environment.

[0054] The PLC controller 8 is the control center of the jig 7. It receives signals from the remote control device 11, thus realizing precise control of the first motor 1, the second motor 4, the positioning motor 9, and the lighting block 5. A number of buttons 13 are provided on the remote control device 11. The operator can send different control signals through these buttons 13 to remotely control each component of the jig 7, improving the convenience and safety of operation.

[0055] The battery 10 provides high - temperature - resistant power for the jig 7, ensuring the stable operation of components such as the first motor 1, the second motor 4, the positioning motor 9, the PLC controller 8, and the high - temperature - resistant LEDs in a vacuum environment.

[0056] The carrier plate 12 is used to carry substrates such as silicon wafers and complete the thin film deposition process in a vacuum environment. When dealing with short circuit problems, the fixture 7 is installed and fixed on the carrier plate 12, and the carrier plate 12 is conveyed to the alarm chamber position through an external manual control knob switch.

[0057] When the magnetron sputtering vacuum coating equipment alarms, first install and fix the fixture 7 on the carrier plate 12. Then, preliminarily determine the approximate alarm position through the magnetron sputtering equipment monitoring software. Next, turn on the lighting block 5 on the fixture 7, and use the light it provides to accurately determine the specific position of the cathode short circuit through the external cathode observation window.

[0058] After determining the short circuit position, convey the carrier plate 12 with the fixture 7 installed on it to the alarm chamber position through the external manual control knob switch. At this time, the operator can send a signal through the remote control device 11 to control the positioning motor 9 to drive the first motor 1 or the second motor 4 to move horizontally, so that the rigid tube 2 is vertically located directly above the silicon wafer causing the short circuit.

[0059] Further control the first motor 1 or the second motor 4 through the remote control device 11 to drive the rigid tube 2 to rotate, so that the rigid tube 2 vertically contacts the silicon wafer causing the cathode short circuit, thereby knocking down or crushing the silicon wafer. During this process, the cleaning sleeve 3 can not only assist in removing the silicon wafer, but also protect the cathode target and the carrier plate 12 from damage.

[0060] After completing the cleaning operation, move the fixture 7 installed and fixed on the carrier plate 12 outside the chamber. Restart the equipment for testing. If the equipment alarm disappears and the magnetron sputtering equipment monitoring software shows no abnormality, it can be confirmed that the cathode short circuit abnormality problem has been successfully solved.

[0061] A limit groove 21 is provided on one side of the rigid tube 2 close to the first motor 1, and a fastener 22 is built in the limit groove 21 to connect the first motor 1 and the rigid tube 2. This design can not only ensure the connection stability between the first motor 1 and the rigid tube 2, but also facilitate disassembly and maintenance, improving the operability and service life of the fixture 7.

[0062] The rigid tube 2 is integrally of an L structure, and the cleaning sleeve 3 wraps one end of the rigid tube 2. This structural design enables the rigid tube 2 to more accurately contact the short-circuited silicon wafer when rotating, and at the same time, the wrapping of the cleaning sleeve 3 further enhances the protection effect on the cathode target and the carrier plate 12.

[0063] On one side of the housing of the fixture 7, several lighting blocks 5 are provided, and these lighting blocks 5 are evenly distributed. Such a layout can ensure uniform light distribution when observing the situation inside the chamber, avoid lighting dead spots, enable the operator to more clearly see the specific position where the silicon wafer drops and the positions of the carrier plate 12 and the fixture 7, thereby improving the accuracy and efficiency of the operation.

[0064] The battery 10 and the PLC controller 8 are installed on the housing of the fixture 7. This design not only facilitates installation and maintenance, but also makes the internal structure of the fixture 7 more compact, improving space utilization. At the same time, the stainless steel housing also plays a good protective role for the battery 10 and the PLC controller 8, ensuring their stable operation in a vacuum environment.

[0065] The length of the rigid tube 2 connected to the first motor 1 is greater than the length of the rigid tube 2 connected to the second motor 4. This design can flexibly select the first motor 1 or the second motor 4 for the clearing operation according to the short-circuit conditions at different positions, improving the applicability and flexibility of the fixture 7.

[0066] While clearing the short-circuited silicon wafer, the fixture 7 can effectively protect the cathode target and the carrier plate 12 from damage, ensuring the normal operation of the equipment and the quality stability of the product. Using the remote control device 11 for remote control, the operation is simple, avoiding the operator directly entering the alarm chamber for maintenance, improving the operation safety, and at the same time reducing the influence of human factors on the equipment and product quality.

[0067] One side of the fixture 7 is connected to the carrier plate 12, and the whole is a long-strip device. This long-strip design enables the fixture 7 to better adapt to the space layout inside the alarm chamber, facilitating short-circuit treatment operations at different positions. At the same time, the long-strip structure is also beneficial to the installation and disassembly of the fixture 7, improving the operation convenience.

[0068] According to a magnetron sputtering rotary cathode short-circuit treatment fixture as claimed in claim 7, characterized in that the silicon wafer at the short-circuit point is crushed when the clearing mechanism rotates. During the rotation of the clearing mechanism 14, through its special structural design and material selection, it can effectively crush the silicon wafer causing the cathode short circuit. This crushing method can not only completely remove the short-circuit point, but also avoid damage to the surrounding normal structures, ensuring the normal operation of the equipment.

[0069] The cleaning mechanism 14 has adhesiveness and can stick away the redundant wafers after crushing the silicon wafers. The adhesive material on the surface of the cleaning mechanism 14 can adsorb the residues of the crushed silicon wafers, preventing them from scattering in the chamber again and causing secondary pollution or short circuit. This design greatly improves the thoroughness of short-circuit treatment and the cleanliness of the equipment, reducing the workload and time of subsequent maintenance. The fixture 7 is equipped with a remote control device 11, and a number of buttons 13 are arranged on the remote control device 11. The use of the remote control device 11 enables the operator to remotely control the various actions of the fixture 7 outside the equipment, including the rotation of the cleaning mechanism 14, crushing the silicon wafers, and sticking away the residues, etc. The buttons 13 are reasonably designed with a clear layout, and each button corresponds to a specific function, facilitating the operator to perform operations quickly and accurately, improving work efficiency and safety.

[0070] When the magnetron sputtering vacuum coating equipment gives an alarm and it is suspected that there is a cathode short-circuit problem, first install the fixture 7 on the carrier plate 12 and move the carrier plate 12 to an appropriate position of the equipment. After preliminarily determining the approximate location of the alarm through the monitoring software of the magnetron sputtering equipment, the operator sends a signal using the remote control device 11 to control the movement and positioning of the fixture 7, so that the cleaning mechanism 14 accurately aligns with the short-circuit point. Then, start the rotation of the cleaning mechanism 14 through the remote control device 11, crush the silicon wafers at the short-circuit location, and use its adhesiveness to stick away the redundant silicon wafer residues. After completing the cleaning operation, move the carrier plate 12 out of the equipment, restart the equipment for testing, and confirm whether the short-circuit problem has been solved.

[0071] For those skilled in the art, the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention.

Claims

1. A magnetron sputtering rotary cathode short - circuit treatment fixture, characterized in that, During operation, the fixture is placed in the alarm chamber, which includes a cleaning mechanism and a positioning motor. A rigid tube is provided on the cleaning mechanism, and one end of the rigid tube is connected to a cleaning sleeve. The positioning motor drives a moving track to drive the first motor and the second motor to move horizontally, and the first motor and the second motor drive the cleaning mechanism to rotate.

2. The short - circuit treatment fixture for a magnetron sputtering rotary cathode according to claim 1, characterized in that, Before operation, the fixture is located outdoors. There is a transition chamber between the alarm chamber and the outdoors, and a transparent window is provided on one side of the alarm chamber.

3. A magnetron sputtering rotary cathode short - circuit treatment jig according to claim 1 or 2, characterized in that, A limit groove is provided on the side of the rigid tube close to the first motor, and a fastener is placed in the limit groove to connect the first motor and the rigid tube.

4. A magnetron sputtering rotary cathode short - circuit treatment jig according to claim 1 or 2, characterized in that, The rigid tube is in an overall L structure, and the cleaning sleeve wraps one end of the rigid tube.

5. A magnetron sputtering rotary cathode short - circuit treatment jig according to claim 1 or 2, characterized in that, Several lighting blocks are provided on one side of the outer shell of the fixture, and the lighting blocks are evenly distributed.

6. A magnetron sputtering rotary cathode short - circuit treatment jig according to claim 5, characterized in that, A battery and a PLC controller are installed on the outer shell of the fixture.

7. A magnetron sputtering rotary cathode short - circuit treatment jig according to claim 1 or 6, characterized in that, The length of the rigid tube connected to the first motor is greater than the length of the rigid tube connected to the second motor.

8. A magnetron sputtering rotary cathode short-circuit treatment fixture according to claim 1 or 6, characterized in that, One side of the fixture is connected to a carrier plate, and it is an overall long-strip device.

9. The magnetron sputtering rotary cathode short-circuit treatment jig according to claim 8, characterized in that, When the cleaning mechanism rotates, it crushes the silicon wafer at the short-circuit point. The cleaning mechanism has adhesiveness, and after crushing the silicon wafer, it adheres and removes the excess silicon wafer.

10. A magnetron sputtering rotary cathode short - circuit treatment fixture according to claim 1 or 9, characterized in that, The fixture is equipped with a remote control device, and several buttons are provided on the remote control device.

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