A probe card

Abstract

This application relates to a probe card of novel structure, which relates to the technical field of semiconductor testing equipment. The probe card includes a mounting bracket, on which a PCB is mounted, and an intermediate dielectric plate is mounted on one side of the PCB along its thickness direction. A plurality of probe units are mounted on the side of the intermediate dielectric plate facing away from the PCB, and the probe units, intermediate dielectric plate, and PCB are electrically connected in sequence. The plurality of probe units are spliced ​​together to form a test board, which is adapted to fit a wafer to be tested. This application has the effect of reducing the manufacturing cost of the probe card and the cost of wafer testing.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor testing equipment, and in particular to a probe card. Background Art

[0002] The probe card is a core tool used for wafer-level testing in the semiconductor manufacturing process. Its function is to use the probes on the probe card to contact the pads or bumps of the chip under test on the wafer before the chip is packaged, to achieve electrical signal transmission and testing, and to screen out defective products to reduce subsequent packaging costs.

[0003] MEMS probe card (Micro-Electro-Mechanical Systems Probe Card) is a probe card manufactured based on micro-electromechanical systems (MEMS) technology.

[0004] The MEMS probe card includes a reinforcement plate, a circuit board (PCB board), an intermediate dielectric board, a space conversion board and a probe layer. The reinforcement plate, the circuit board, the intermediate dielectric board, the space conversion board and the probe layer are connected in sequence, and the probe layer, the space conversion board, the intermediate dielectric board and the circuit board are electrically connected in sequence.

[0005] The probe layer refers to a micron-scale probe array used to directly contact the chip under test on the wafer, enabling electrical signal transmission and testing between the probe card and the chip under test. The space converter board generally uses an MLC board (Multi-Layer Ceramic, referred to as a multi-layer ceramic board) or an MLO board (Multi-Layer Organic, referred to as an organic substrate). The space converter board is mainly used for high-density electrical signal transmission while providing sufficient mechanical support. The intermediate dielectric board is mainly used for signal transfer, mechanical support and insulation protection, and its purpose is to achieve signal transmission between the space converter board and the circuit board. The circuit board is mainly used to connect to the test machine to realize the detection function. The role of the reinforcement board is to enhance structural stability and prevent the circuit board from deformation. In addition, the MEMS probe card also includes mounting brackets and reinforcement rings. The mounting brackets and reinforcement rings are mainly used for the installation and fixation of the reinforcement board, circuit board, intermediate dielectric board, space converter board and probe layer.

[0006] Because existing MEMS probe cards are circular, the diameter of the space transformer plate is typically over 300mm. This structure is suitable for wafers with a large number of chips under test. However, when the number of chips under test on a wafer is small, part of the space transformer plate area is unused, and the probes in this area are inoperative. The presence of these probes increases the manufacturing cost of the MEMS probe card, which in turn increases the cost of wafer testing. Summary of the Invention

[0007] The present application provides a probe card, the purpose of which is to adjust the structural layout on the MEMS probe card, reduce the number of invalid probes and increase the proportion of valid probes when the number of chips to be tested on the wafer is small, thereby reducing the manufacturing cost of the MEMS probe card and the wafer detection cost.

[0008] The present application provides a probe card that adopts the following technical solution:

[0009] A probe card includes a mounting bracket, a PCB board is arranged on the mounting bracket, and an intermediate dielectric board is arranged on one side of the PCB board along its own thickness direction; a plurality of probe units are arranged on the side of the intermediate dielectric board facing away from the PCB board, and the probe units, the intermediate dielectric board and the PCB board are electrically connected in sequence; a plurality of the probe units are spliced ​​together to form a detection board, and the detection board is adapted to the wafer to be tested.

[0010] By adopting the above technical solution, firstly, the probe card can realize the wafer detection function under the cooperation of the mounting bracket, PCB board, intermediate medium board and probe unit, thereby meeting the basic functions of the probe card.

[0011] Secondly, since there are several probe units, they are spliced ​​together to form a test board, which is adapted to the wafer to be tested. Based on the structural design of the test board, the number, size, and layout of the probe units that make up the test board can be adjusted according to the actual requirements of the wafer to be tested, so that each probe unit on the test board can perform wafer testing, while reducing the number of unnecessary probe units. This can reduce the manufacturing cost of the probe card and the testing cost of the wafer.

[0012] Optionally, the probe unit includes a space conversion plate, which is electrically connected to the intermediate medium plate, and a plurality of microprobes are provided on the side of the space conversion plate away from the intermediate medium plate; the space conversion plate is a square plate, and two adjacent space conversion plates are detachably connected.

[0013] By adopting the above technical solution, the probe unit can realize the basic functions of the probe unit through the coordinated arrangement of the space conversion plate and a plurality of microprobes.

[0014] The space conversion plate adopts a square plate design, so that several space conversion plates can be closely spliced ​​together to form a flat and seamless detection plate, thereby improving the overall flatness and stability of the detection plate, ensuring good contact between the microprobe and the wafer surface, and improving the reliability and accuracy of the detection. In addition, the square plate design of the space conversion plate facilitates precise positioning and installation during splicing, improving the assembly efficiency and quality of the probe card. In addition, the square plate design of the space conversion plate is easier to process and produce, which can reduce manufacturing difficulty and cost, while improving product yield and consistency.

[0015] Optionally, a leveling mechanism is further included, which includes several leveling drivers, and the several leveling drivers are all arranged on the mounting bracket. The driving end of the leveling driver is connected to the detection plate, and the leveling driver is used to drive the detection plate to move slightly along its own thickness direction.

[0016] By adopting the above technical solution, the leveling mechanism can drive the detection plate to move slightly along its own thickness direction through the coordinated setting of several leveling drivers. This can perform multi-point leveling on the detection plate and improve the flatness of the detection plate, so that all probe units can contact the chip to be tested on the wafer surface simultaneously and evenly, thereby improving the accuracy and reliability of the detection.

[0017] In addition, by driving the inspection plate to move slightly along its own thickness direction through the leveling driver, it is possible to compensate for the parallelism deviation of the inspection plate caused by installation errors, uneven wafer surface or other external factors, thereby improving the adaptability of the probe card to different working conditions and enhancing the stability and repeatability of the inspection process.

[0018] Optionally, the leveling drive includes a center drive and an edge drive, wherein one center drive is provided and several edge drives are provided, the center drive is coaxially arranged with the PCB board, several edge drives are arranged around the center drive, and several edge drives are arranged in a ring shape, the center drive and the edge drive are both provided on the mounting bracket, and the driving ends of the center drive and the edge drive are both connected to the detection board.

[0019] By adopting the above technical solution, the leveling driver includes a central driver and a plurality of edge drivers, and the central driver is coaxially arranged with the PCB board, and the edge drivers are arranged in a ring around the central driver.

[0020] Among them, the center driver is coaxially arranged with the PCB board, so that the leveling force of the leveling mechanism can directly act on the center position of the detection board and align with the central axis of the PCB board. This can more effectively level the detection board as a whole, ensure that the detection board maintains a good balance during the leveling process, avoid tilting or twisting of the detection board due to the offset of the leveling force application point, and improve the accuracy and stability of leveling. The edge drivers are arranged in a ring around the center driver. This surrounding layout can evenly distribute the leveling force on the edge area of ​​the detection board, further enhancing the leveling effect and accuracy. Through the synergistic action of the center driver and the edge driver, the detection board can be fine-tuned at multiple points to achieve all-round and multi-angle precise leveling of the detection board, ensuring comprehensive and uniform contact between the microprobe and the wafer surface, and improving the reliability and consistency of detection.

[0021] Optionally, a splicing frame is further included, which is located between the intermediate medium plate and the probe unit, the driving ends of several leveling drivers are connected to the splicing frame, and several probe units are detachably connected to the splicing frame.

[0022] By adopting the above technical solution, since the splicing frame is arranged between the intermediate dielectric plate and the probe units, and the probe units are detachably connected to the splicing frame, the splicing frame can connect and support the probe units, allowing multiple probe units to be spliced ​​together to form a test board. At the same time, it also improves the flexibility of the splicing frame in assembling and disassembling the multiple probe units, thereby facilitating the replacement and maintenance of individual probe units and reducing the impact on other probe units.

[0023] Since the leveling driver is connected to the splicing frame, it is convenient to level the entire detection board, ensuring the stability and consistency of the probe unit during the leveling process, and avoiding local stress concentration or damage that may be caused by the leveling driver directly driving the probe unit.

[0024] Optionally, a plurality of positioning slots are provided on a side of the splicing frame facing away from the intermediate medium plate. The positioning slots are arranged in a one-to-one correspondence with the probe units, and the probe units are plugged into and matched with the positioning slots.

[0025] By adopting the above technical solution, positioning grooves are opened on the splicing frame, and the positioning grooves are arranged in a one-to-one correspondence with the probe units. The probe units are plugged into the positioning grooves. The setting of the positioning grooves provides the probe units with precise installation positions and guiding functions, reducing the errors and damage risks that may occur during the installation process.

[0026] Optionally, the number of the positioning grooves is not less than the number of the probe units.

[0027] By adopting the above technical solution, since the number of positioning slots is not less than the number of probe units, the number and layout of probe units on the splicing frame can be changed, thereby facilitating the detection board to adapt to wafers to be tested with different requirements, thereby improving the flexibility and scalability of the probe card in practical applications.

[0028] Optionally, the positioning groove passes through the splicing frame, and a number of intermediate plates are provided on the splicing frame. The intermediate plates are arranged one-to-one corresponding to the positioning grooves, and the intermediate plates are plugged into the corresponding positioning grooves; the intermediate plates are located between the corresponding probe units and the intermediate medium plates, and the intermediate medium plates and the corresponding probe units are both in contact with the intermediate plates, and a contact group is provided on the intermediate plate, and the probe units, the corresponding contact groups and the intermediate medium plates are electrically connected in sequence.

[0029] By adopting the above technical solution and disposing the intermediate plate, the probe unit is separated from the intermediate medium plate, thereby supporting and isolating the probe unit and preventing the disassembly and assembly of the probe unit from affecting the intermediate medium plate.

[0030] The setting of the contact group on the intermediate board realizes the electrical connection between the probe unit and the intermediate dielectric board after the probe unit is installed in the corresponding positioning groove. Therefore, when the probe unit needs to be disassembled, only the probe unit body needs to be disassembled, and no operation is required on the intermediate dielectric board. This simplifies the difficulty of disassembling the probe unit and reduces the impact of the disassembly of the probe unit on the probe card.

[0031] Optionally, the contact group includes several conductive long rods, which are embedded in the corresponding intermediate plate. The length direction of the conductive long rods is arranged along the thickness direction of the splicing frame. The conductive long rods are provided with a first elastic contact at one end facing the corresponding probe unit, and a second elastic contact at the other end. The first elastic contact is in contact with the corresponding probe unit, and the second elastic contact is in contact with the intermediate dielectric plate.

[0032] By adopting the above technical solution, the contact group is arranged by the coordination of the conductive long rod, the first elastic contact and the second elastic contact, the first elastic contact is in contact with the probe unit, the second elastic contact is in contact with the intermediate dielectric plate, and the first elastic contact and the second elastic contact are respectively arranged at both ends of the conductive long rod, which can realize the signal transmission between the probe unit and the intermediate dielectric plate. Among them, the first elastic contact automatically adapts to the position and shape of the probe unit through its own elastic deformation, ensuring good electrical contact between the first elastic contact and the probe unit, even when there is a certain installation error or slight displacement in the probe unit, it can maintain a stable connection, thereby improving the reliability and fault tolerance of the connection. Similarly, the second elastic contact is in contact with the intermediate dielectric plate, which can also achieve a stable electrical connection. At the same time, the setting of the second elastic contact leaves a deformation margin for the leveling work of the leveling mechanism.

[0033] Optionally, the splicing frame is provided with a plurality of mounting grooves on a side facing the intermediate medium plate, the mounting grooves are arranged in a one-to-one correspondence with the positioning grooves, and the positioning grooves are arranged at the bottom of the corresponding mounting grooves; the intermediate plates are arranged in a one-to-one correspondence with the mounting grooves, the intermediate plates are plugged into the corresponding mounting grooves, and the intermediate plates are detachably connected to the splicing frame.

[0034] By adopting the above technical solution, the installation slot provides space for the intermediate board. Furthermore, because the installation slot is located on the side of the splicing frame facing the intermediate dielectric board, if the contact group on the intermediate board is damaged, the intermediate board can be removed and replaced from the side of the splicing frame facing the intermediate dielectric board. This reduces the impact on the probe unit and avoids the need to disassemble and reassemble the entire test board due to problems with the intermediate board, thereby improving the targetedness and efficiency of repairs.

[0035] In summary, this application includes at least one of the following beneficial technical effects:

[0036] 1. The present application forms a detection board by splicing several probe units, which enables the detection board to be flexibly adjusted according to the number and layout of chips on the wafer to be tested, so that the detection board adapts to the wafer to be tested, so that each probe unit on the detection board can perform wafer detection, while reducing the number of unnecessary probe units, which can reduce the manufacturing cost of the probe card and the detection cost of the wafer.

[0037] 2. This application uses a leveling mechanism to perform multi-point leveling on the test board, thereby improving the flatness and levelness of the test board, and further improving the accuracy and reliability of the probe card detection.

[0038] 3. This application improves the flexibility of the probe unit by setting up the splicing frame and the intermediate plate, making it easier for the probe board to adapt to the wafer to be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 This is a schematic diagram of the overall structure of the probe card of Example 1 of the present application.

[0040] Figure 2 This is a schematic cross-sectional structural diagram of the probe card of Example 1 of the present application.

[0041] Figure 3 yes Figure 2 Schematic diagram of the locally enlarged structure of part A.

[0042] Figure 4 It is a schematic diagram of the partial structure of the probe unit of Example 1 of the present application.

[0043] Figure 5 This is a schematic diagram of the arrangement of several leveling actuators in Example 1 of the present application.

[0044] Figure 6 This is a schematic diagram of another arrangement of several leveling actuators in Example 1 of the present application.

[0045] Figure 7 This is a schematic diagram of the cross-sectional structure of the probe card of Example 2 of the present application.

[0046] Figure 8 yes Figure 7 Schematic diagram of the locally enlarged structure of part B.

[0047] Figure 9 It is a schematic diagram of the overall structure of the splicing frame and several probe units of Example 2 of the present application.

[0048] Figure 10 It is a schematic cross-sectional structural diagram of the splicing frame and several probe units of Example 2 of the present application.

[0049] Figure 11 It is a schematic diagram of the overall structure of the conductive long rod, the first elastic contact and the second elastic contact of the present application.

[0050] In the figure, 1. mounting bracket; 2. PCB board; 3. intermediate medium board; 4. probe unit; 41. fixing frame; 42. space conversion board; 43. micro probe; 5. detection board; 6. leveling driver; 61. center driver; 62. edge driver; 7. reinforcement board; 8. splicing frame; 81. positioning slot; 82. intermediate board; 83. mounting slot; 84. contact group; 841. conductive long rod; 842. first elastic contact; 843. second elastic contact. DETAILED DESCRIPTION

[0051] The following is combined with Figure 1 -Attached Figure 11 , further details of this application are given.

[0052] Example 1: A probe card, referring to Figure 1 and Figure 2 , including a mounting bracket 1, a PCB board 2, an intermediate medium board 3 and several probe units 4. The mounting bracket 1, the PCB board 2, the intermediate medium board 3 are coaxially connected in sequence, and the several probe units 4 are arranged on the side of the intermediate medium board 3 away from the PCB board 2, and the several probe units 4 are spliced ​​together to form a detection board 5, and the probe units 4, the intermediate medium board 3 and the PCB board 2 are electrically connected in sequence.

[0053] In this embodiment, the specific number and positions of the probe units 4 are determined according to the number and positions of the chips on the wafer to be tested.

[0054] The coordinated arrangement of the PCB board 2, the intermediate dielectric board 3, and the probe units 4 ensures that the probe card can perform wafer inspection. Since there are multiple probe units 4, and these multiple probe units 4 are spliced ​​together to form the inspection board 5, the number and layout of the probe units 4 can be flexibly adjusted according to the actual needs of the wafer to be tested, thereby improving the utilization rate of the probe units 4 and reducing unnecessary space waste and production costs.

[0055] Reference Figure 3 and Figure 4The probe unit 4 includes a fixing frame 41 , a space transformer 42 and a plurality of microprobes 43 . The fixing frame 41 is sleeved on the outside of the space transformer 42 , and the plurality of microprobes 43 are arranged on the space transformer 42 .

[0056] In this embodiment, the microprobe 43 is located on a side of the space transformer 42 facing away from the intermediate dielectric plate 3 , and the space transformer 42 is electrically connected to the intermediate dielectric plate 3 .

[0057] The probe unit 4 cooperates with the space transformer 42 and the microprobe 43 . When the probe unit 4 contacts the chip under test on the wafer, signals can be transmitted between the intermediate medium plate 3 and the chip under test, thus satisfying the function of the probe unit 4 .

[0058] Reference Figure 1 and Figure 4 In this embodiment, the space transformer 42 is a square plate, and the size of the space transformer 42 is set according to actual requirements. The probe units 4 are arranged in a matrix or in a circle.

[0059] Since the space transformer 42 is a square plate, the fixing frame 41 is also a square frame, which in turn makes the probe unit 4 have a square structure. This makes it easy to splice several probe units 4 into the detection board 5, and this structure makes the probe unit 4 modular. Based on the modularity of the probe unit 4, when the detection board 5 structure is designed according to the wafer to be tested, each probe unit 4 in the detection board 5 can perform detection work, so this can reduce the number of inoperative microprobes 43 and reduce the area of ​​the unused space transformer 42, thereby improving material utilization and reducing costs.

[0060] Reference Figure 2 and Figure 3 A leveling mechanism is further provided between the mounting bracket 1 and the detection plate 5. The leveling mechanism includes a plurality of leveling actuators 6. The leveling actuators 6 are provided on the mounting bracket 1, and the driving ends of the leveling actuators 6 are connected to the detection plate 5. In this embodiment, the leveling actuators 6 are electromagnetic micro motors.

[0061] The leveling mechanism, through the cooperation of several leveling actuators 6, can level the test plate 5. This ensures that the microprobes 43 can simultaneously contact the chips under test on the wafer, thereby ensuring the reliability of the test. Furthermore, the coordination of the external sensor and the closed-loop control of the leveling actuators 6 can further improve the adjustment accuracy of the test plate 5.

[0062] Reference Figure 2 and Figure 3In this embodiment, the leveling actuator 6 includes a central actuator 61 and edge actuators 62. The central actuator 61 and the edge actuators 62 have the same structure. There is one central actuator 61 and multiple edge actuators 62. Both the central actuator 61 and the edge actuators 62 are mounted on the mounting bracket 1, and the driving ends of the central actuator 61 and the edge actuators 62 are connected to the detection board 5. The central actuator 61 is coaxially arranged with the intermediate dielectric plate 3, and the multiple edge actuators 62 are arranged around the central actuator 61 and arranged in a ring shape.

[0063] Reference Figure 5 , the number of edge drivers 62 is preferably four, that is, the number of leveling drivers 6 is five, and the five leveling drivers 6 are arranged in an X shape.

[0064] In this embodiment, the edge drivers 62 are disposed around the central driver 61 , and the edge drivers 62 and the central driver 61 are arranged in a matrix as a whole.

[0065] Reference Figure 6 The number of edge drivers 62 is preferably eight, that is, the number of leveling drivers 6 is nine, and the nine leveling drivers 6 are arranged in a three-by-three matrix.

[0066] In this embodiment, the driving end of the leveling driver 6 is connected to the fixing frame 41 .

[0067] With the cooperation of the multiple leveling actuators 6, the test board 5 can be leveled at multiple points, thereby improving the adjustment accuracy of the test board 5. The multiple leveling actuators 6 have two different arrangements, allowing the probe card to be freely selected based on its actual size, which can improve the adaptability of the leveling mechanism.

[0068] Reference Figure 2 The probe card further includes a reinforcing plate 7, which is an annular plate and is located on the PCB 2. The reinforcing plate 7 is coaxially connected to the PCB 2. The provision of the reinforcing plate 7 can increase the strength of the PCB 2, thereby ensuring the service life of the probe card.

[0069] The implementation principle of the embodiment of the present application is: when performing wafer inspection, the number, size and layout of the probe units 4 that constitute the inspection board 5 are adjusted according to the number and layout relationship of the chips on the wafer to be tested. This can ensure that every probe unit 4 on the inspection board 5 is used, or every probe unit 4 on the inspection board 5 is used as much as possible, thereby reducing the number of unnecessary probe units 4, reducing the manufacturing cost of the probe card, and the inspection cost of the wafer.

[0070] Example 2: A probe card, referring to Figure 7 and Figure 8The difference between this embodiment and embodiment 1 is that the probe card further includes a splicing frame 8 , which is coaxially arranged with the intermediate dielectric plate 3 and is located between the intermediate dielectric plate 3 and the probe unit 4 .

[0071] Reference Figure 7 and Figure 9 , several probe units 4 are installed on the splicing frame 8, and the driving ends of several leveling drivers 6 are connected to the splicing frame 8.

[0072] Since the probe units 4 can be mounted on the splicing frame 8 , the probe units 4 are detachably connected to the splicing frame 8 , which facilitates the installation and removal of a plurality of probe units 4 on the probe card.

[0073] Reference Figure 9 and Figure 10 The splicing frame 8 is provided with a plurality of positioning grooves 81 , which are arranged in one-to-one correspondence with the probe units 4 , and the fixing frame 41 is plugged into the corresponding positioning grooves 81 , and the fixing frame 41 and the splicing frame 8 are detachably connected.

[0074] The positioning grooves 81 are provided so that the probe unit 4 can be plugged into and matched with the corresponding positioning grooves 81 , thereby improving the installation accuracy of the probe unit 4 .

[0075] Reference Figure 9 and Figure 10 In this embodiment, the number of the positioning grooves 81 is not less than the number of the probe units 4 , and some of the positioning grooves 81 are arranged in a one-to-one correspondence with the probe units 4 .

[0076] Since the number of positioning slots 81 is greater than or equal to the number of probe units 4, the position of the probe unit 4 on the splicing frame 8 can be adjusted, so that the layout of the probe unit 4 on the detection board 5 can be freely adjusted, which can adapt to different wafers to be tested, thereby improving the applicability of the probe card and reducing manufacturing costs.

[0077] In this embodiment, the fixing frame 41 and the splicing frame 8 are mounted by screws.

[0078] Reference Figure 8 and Figure 10 A plurality of mounting grooves 83 are provided on the side of the splicing frame 8 facing away from the intermediate medium plate 3. The mounting grooves 83 are arranged in a one-to-one correspondence with the positioning grooves 81, and the positioning grooves 81 are provided at the bottom of the corresponding mounting grooves 83. The area of ​​the mounting grooves 83 is larger than that of the positioning grooves 81.

[0079] Reference Figure 8 and Figure 10 A plurality of intermediate plates 82 are provided on the splicing frame 8. The intermediate plates 82 are arranged in one-to-one correspondence with the mounting slots 83. The intermediate plates 82 are plugged into the corresponding mounting slots 83, and the intermediate plates 82 are connected to the splicing frame 8 by screws.

[0080] Reference Figure 8 and Figure 10 The intermediate plate 82 is located between the corresponding probe unit 4 and the intermediate medium plate 3, and the intermediate plate 82 is in contact with the corresponding probe unit 4 and the intermediate medium plate 3, and a contact group 84 is provided on the intermediate plate 82, and the contact group 84 is electrically connected to the intermediate medium plate 3 and the probe unit 4.

[0081] The intermediate plate 82 is configured to support the corresponding probe unit 4. The contact group 84 on the intermediate plate 82 is configured to electrically connect the probe unit 4 to the intermediate dielectric plate 3. This allows the probe unit 4 to automatically establish an electrical connection with the intermediate dielectric plate 3 after being installed in the corresponding positioning slot 81, facilitating rapid assembly of the probe card. The installation slot 83 limits the position of the intermediate plate 82. Furthermore, since the intermediate plate 82 can be removed from the side of the splicing frame 8 facing the intermediate dielectric plate 3, damage to the intermediate plate 82 during maintenance is prevented, potentially affecting the probe units 4 on the splicing frame 8.

[0082] In this embodiment, refer to Figure 10 and Figure 11 The contact group 84 includes a plurality of conductive rods 841, which are embedded in the corresponding intermediate plate 82. The length direction of the conductive rods 841 is arranged along the thickness direction of the corresponding intermediate plate 82. The conductive rods 841 are provided with a first elastic contact 842 at one end facing the corresponding probe unit 4, and a second elastic contact 843 at the other end.

[0083] Reference Figure 8 and Figure 11 The first elastic contact 842 contacts the corresponding probe unit 4 , and the second elastic contact 843 contacts the intermediate dielectric plate 3 .

[0084] The first elastic contact 842 and the second elastic contact 843 are both springs or springs made of conductive materials, or elastic conductive parts assembled by springs or springs.

[0085] The contact group 84 realizes the electrical connection between the intermediate medium plate 3, the second elastic contact 843, the conductive long rod 841, the first elastic contact 842 and the corresponding probe unit 4 in sequence through the coordinated setting of the conductive long rod 841, the first elastic contact 842 and the second elastic contact 843, thereby ensuring the normal transmission of the signal. The setting of the first elastic contact 842 is that after the probe unit 4 is installed, the first elastic contact 842 presses against the corresponding probe unit 4 through its own deformation, thereby ensuring the stability of the electrical connection. Similarly, the setting of the second elastic contact 843 realizes the stability of the electrical connection between the second elastic contact 843 and the intermediate medium plate 3. In addition, the setting of the second elastic contact 843 leaves a deformation margin for the leveling work of the leveling mechanism.

[0086] The implementation principle of the embodiment of the present application is as follows: a splicing frame 8 is added between the intermediate dielectric board 3 and the probe units 4. The probe units 4 on the splicing frame 8 can be freely installed, removed, and adjusted in position, thereby enabling the layout of the probe units 4 on the detection board 5 to be adjusted, so that the detection board 5 can adapt to more wafers to be tested, thereby improving the applicability of the detection board 5. At the same time, when a single probe unit 4 is damaged, the corresponding probe unit 4 can be directly replaced, which can reduce the repair time and cost of the probe card.

[0087] The examples of this specific embodiment are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, any equivalent changes made based on the structure, shape, and principle of this application should be included in the scope of protection of this application.

Claims

1. A probe card, characterized in that: include: A mounting bracket (1) is provided with a PCB board (2) on the mounting bracket (1), and an intermediate dielectric board (3) is provided on one side of the PCB board (2) along its thickness direction; a plurality of probe units (4) are provided on a side of the intermediate dielectric board (3) facing away from the PCB board (2), and the probe units (4), the intermediate dielectric board (3) and the PCB board (2) are electrically connected in sequence; a plurality of the probe units (4) are spliced ​​together to form a detection board (5), and the detection board (5) is adapted to the wafer to be tested; It also includes a leveling mechanism, the leveling mechanism including a plurality of leveling drivers (6), and the plurality of leveling drivers (6) are all arranged on the mounting bracket (1); It also includes a splicing frame (8), the splicing frame (8) is located between the intermediate medium plate (3) and the probe unit (4), the driving ends of the plurality of leveling drivers (6) are connected to the splicing frame (8), and the plurality of probe units (4) are detachably connected to the splicing frame (8); A plurality of positioning grooves (81) are provided on a side of the splicing frame (8) facing away from the intermediate medium plate (3), the positioning grooves (81) are arranged in a one-to-one correspondence with the probe units (4), and the probe units (4) are plugged into and matched with the positioning grooves (81); The positioning groove (81) passes through the splicing frame (8), and a plurality of intermediate plates (82) are provided on the splicing frame (8), and the intermediate plates (82) are provided in a one-to-one correspondence with the positioning groove (81), and the intermediate plates (82) are plugged into and matched with the corresponding positioning groove (81); the intermediate plates (82) are located between the corresponding probe units (4) and the intermediate medium plates (3), and the intermediate medium plates (3) and the corresponding probe units (4) are both in contact with the intermediate plates (82), and a contact group (84) is provided on the intermediate plate (82), and the probe units (4), the corresponding contact group (84) and the intermediate medium plates (3) are electrically connected in sequence; The contact group (84) includes a plurality of conductive long rods (841), the conductive long rods (841) being embedded in the corresponding intermediate plate (82), the length direction of the conductive long rods (841) being arranged along the thickness direction of the splicing frame (8), the conductive long rods (841) being provided with a first elastic contact (842) at one end facing the corresponding probe unit (4), and a second elastic contact (843) at the other end, the first elastic contact (842) being in contact with the corresponding probe unit (4), and the second elastic contact (843) being in contact with the intermediate medium plate (3).

2. The probe card according to claim 1, wherein: The probe unit (4) comprises a space conversion plate (42), the space conversion plate (42) is electrically connected to the intermediate medium plate (3), and a plurality of microprobes (43) are provided on a side of the space conversion plate (42) facing away from the intermediate medium plate (3); the space conversion plate (42) is a square plate, and two adjacent space conversion plates (42) are detachably connected.

3. The probe card according to claim 1, wherein: The leveling driver (6) includes a central driver (61) and an edge driver (62), wherein one central driver (61) is provided and a plurality of edge drivers (62) are provided. The central driver (61) is coaxially arranged with the PCB board (2), and a plurality of edge drivers (62) are arranged around the central driver (61), and the plurality of edge drivers (62) are arranged in a ring shape. The central driver (61) and the edge drivers (62) are both provided on the mounting bracket (1), and the driving ends of the central driver (61) and the edge drivers (62) are both connected to the splicing frame (8).

4. The probe card according to claim 1, wherein: The number of the positioning grooves (81) is not less than the number of the probe units (4).

5. The probe card according to claim 1, wherein: The splicing frame (8) is provided with a plurality of mounting grooves (83) on one side facing the intermediate medium plate (3), the mounting grooves (83) are arranged in a one-to-one correspondence with the positioning grooves (81), and the positioning grooves (81) are opened at the bottom of the groove corresponding to the mounting groove (83); the intermediate plates (82) are arranged in a one-to-one correspondence with the mounting grooves (83), the intermediate plates (82) are plugged into and matched with the corresponding mounting grooves (83), and the intermediate plates (82) are detachably connected to the splicing frame (8).

Images