Stepped conductive film coating and preparation method thereof

Abstract

The invention discloses a stepped conductive film coating and a preparation method thereof. The step-shaped conductive film coating comprises a step-shaped base material layer, an adhesion layer, a functional layer and a hardening protection layer which are sequentially arranged from bottom to top. Wherein the step-shaped base material layer is provided with a step part. The preparation method has the beneficial effects that a self-cleaning conductive coating structure with high hardness, high environmental adaptability and high adhesive force is obtained; by controlling the coating process, the stepped conductive film coating with continuous upper and lower electricity is obtained.

Description

Technical Field

[0001] The present invention relates to the field of conductive film coatings, and in particular, to a stepped conductive film coating and a preparation method thereof. Background Art

[0002] Aviation formation lights are designed to prevent fighter jets from colliding during night formation flights. They are essential external lighting fixtures for fighter jets and can provide clear visual information about the flight postures and orientations of other fighter jets to the pilots of adjacent fighter jets. In addition to considering their optical performance, the electromagnetic shielding effectiveness of aviation formation lights also needs to be considered, so aviation formation lights need to have conductivity. The new type of aviation formation light uses a stepped substrate, aiming to achieve an integrated connection with the fighter jet body. The stepped substrate has stepped portions. Electrical connection needs to be achieved above and below the steps, which poses high requirements for the design of the conductive film. Summary of the Invention

[0003] The purpose of the present invention is to solve the problems of stepped conductive film coatings in the prior art and provide a new type of stepped conductive film coating and a preparation method thereof.

[0004] To achieve the above purpose, a technical solution provided by the present invention is: a stepped conductive film coating, including: a stepped substrate layer, an adhesion layer, a functional layer, and a hardening protective layer arranged in sequence from bottom to top, wherein the stepped substrate layer has stepped portions.

[0005] As a preferred solution of the stepped conductive film coating, the substrate layer is selected from epoxy glass cloth boards, and its thickness is 1.1 - 1.6 mm.

[0006] As a preferred solution of the stepped conductive film coating, the stepped portions are formed by mechanical milling. The thickness below the steps is 0.4 - 0.8 mm, and the thickness above the steps is 0.4 - 0.8 mm.

[0007] As a preferred solution of the stepped conductive film coating, the adhesion layer is selected from polyurethane-modified acrylic resins, and the thickness of the adhesion layer is 1 - 5 μm.

[0008] As a preferred solution of the stepped conductive film coating, the functional layer is a conductive film coating. The conductive film coating is selected from conductive polymer composites containing silver nanowires or graphene. The thickness of the functional layer is 100 - 900 nm, and the surface resistance of the functional layer is controlled by controlling the mass ratio of the conductive materials.

[0009] As a preferred solution of the stepped conductive film coating, the hardening layer is selected from modified acrylic resins, and the thickness of the hardening layer is 10 - 30 μm.

[0010] As a preferred solution for the stepped conductive film coating, the hardening layer achieves the properties of self-cleaning, high hardness, and ultra-high protection through polymer selection.

[0011] The present invention provides a method for preparing a stepped conductive film coating, including:

[0012] Providing a stepped substrate layer, wherein the stepped substrate layer has a stepped portion; and, sequentially and precisely coating an adhesion layer, a functional layer, and a hardening protection layer on the stepped substrate layer.

[0013] As a preferred solution for the method for preparing a stepped conductive film coating, it is characterized in that the precise coating method includes: Meyer rod coating method and slot coating method.

[0014] Compared with the prior art, the beneficial effects of the present invention are at least as follows: The materials from bottom to top are epoxy glass cloth board, polyurethane-modified acrylic resin, conductive composite polymer material, and modified acrylic resin. By controlling the structural characteristics and thickness of each layer, a conductive coating structure with self-cleaning, high hardness, high environmental adaptability, and high adhesion is obtained; among them, epoxy glass cloth board is selected as the substrate layer to meet the mechanical strength of the aviation formation lights; polyurethane-modified acrylic resin is selected as the first adhesion layer to enhance the adhesion of the substrate; conductive composite material is selected as the conductive layer to enhance the adhesion of the coating system by forming chemical bonds between the polymer and the adhesion layer; modified acrylic resin is selected as the hardening protection layer to achieve self-cleaning, high hardness, and high environmental adaptability through the selection of modified materials. Through the precise coating method and the control of the coating process, the conductive continuity above and below the step is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic structural diagram of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] The present invention will be further described in detail below with reference to the accompanying drawings through specific embodiments. It should be noted here that the description of these embodiments is for helping to understand the present invention, but does not constitute a limitation to the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0017] Please refer to Figure 1 , which shows a stepped conductive film coating. The stepped conductive film coating from bottom to top is a stepped substrate layer, a first adhesion layer, a second functional layer, and a third hardening protection layer.

[0018] The stepped substrate layer is made of epoxy glass cloth board. The thickness of the epoxy glass cloth board is 1.3 mm. The stepped substrate has a stepped portion. The processing technology of the stepped portion is mechanical milling. The thickness under the step is 0.8 mm, and the thickness on the step is 0.5 mm.

[0019] The material of the adhesion layer is polyurethane-modified acrylic resin. The thickness of the polyurethane-modified acrylic resin adhesion layer is 2 μm.

[0020] The functional layer is a conductive film coating. The material of the conductive film coating is silver nanowire-polyurethane composite material. The thickness of the conductive coating is 200 nm.

[0021] The material of the hardening layer is modified acrylic resin. The thickness of the hardening layer is 21 μm.

[0022] The precision coating method uses slot coating method, which can control the thickness of each layer to an accuracy of 100 nm.

[0023] The hardness test is carried out on the embodiment, and the hardness is 5H; the environmental adaptability test is carried out, and the test results are shown in Table 1; the adhesion test shows that the conductive film coating has high hardness, high environmental adaptability and good adhesion.

[0024]

[0025]

[0026] The above only expresses the implementation modes of the present invention, and the description is relatively specific and detailed, but it cannot be understood as a limitation to the scope of the invention patent. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent should be subject to the appended claims.

Claims

1. A stepped conductive film coating, characterized in that, Comprising: A stepped substrate layer, an adhesion layer, a functional layer, and a hardened protective layer arranged in sequence from bottom to top, wherein the stepped substrate layer has a stepped portion.

2. The stepped conductive film coating according to claim 1, characterized in that, The substrate layer is selected from epoxy glass cloth boards, and its thickness is 1.1 - 1.6 mm.

3. The stepped conductive film coating according to claim 1, wherein The stepped portion is formed by mechanical milling. The thickness below the step is 0.4 - 0.8 mm, and the thickness above the step is 0.4 - 0.8 mm.

4. The stepped conductive film coating according to claim 1, wherein The adhesion layer is selected from polyurethane-modified acrylic resins, and the thickness of the adhesion layer is 1 - 5 µm.

5. The stepped conductive film coating according to claim 1, wherein The functional layer is a conductive film coating. The conductive film coating is selected from conductive polymer composites containing silver nanowires or graphene. The thickness of the functional layer is 100 - 900 nm, and the surface resistance of the functional layer is controlled by controlling the mass ratio of the conductive materials.

6. The stepped conductive film coating according to claim 1, wherein The hardened layer is selected from modified acrylic resins, and the thickness of the hardened layer is 10 - 30 µm.

7. The stepped conductive film coating according to claim 6, characterized in that, The hardened layer realizes the performance of self-cleaning, high hardness, and ultra-high protection through polymer selection.

8. A method for preparing a stepped conductive film coating, characterized in that, Comprising: Providing a stepped substrate layer, wherein the stepped substrate layer has a stepped portion; and, sequentially and precisely coating an adhesion layer, a functional layer, and a hardened protective layer on the stepped substrate layer.

9. The preparation method of the stepped conductive film coating according to claim 8, characterized in that, The method of precise coating includes: Mayer rod coating method and slot coating method.

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