Packaging equipment for semiconductor production

Abstract

The invention provides semiconductor production packaging equipment which comprises a base, a first motor is fixedly connected into the base, the output end of the first motor penetrates through the base and is upwards and fixedly connected with a rotating disc, placing grooves are formed in the four ends of the upper portion of the rotating disc, a first transmission frame is arranged at one end of the outer side of the base, and a second transmission frame is arranged at the other end of the outer side of the base. The four ends of the bottom of the first transmission frame are fixedly connected with a first supporting frame, and one end of the outer side of the first transmission frame is fixedly connected with a third motor. According to the semiconductor packaging device, uninterrupted semiconductor packaging operation can be completed through automatic conveying and a rotating disc, after packaging is completed, the semiconductor is ejected out through cooperation with an ejection block in a containing groove, and the packaging efficiency is improved. Therefore, automatic loading and unloading packaging operation is completed, manual intervention is not needed, and the semiconductor packaging efficiency is greatly improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and specifically to a packaging device for semiconductor production. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. The silicon wafers used in silicon semiconductor circuits are called wafers, and their raw material is silicon. High-purity polysilicon is dissolved and doped into silicon crystal species, and then slowly pulled out to form a cylindrical single-crystal silicon. After the silicon ingot is ground, polished and sliced, it forms a silicon wafer, that is, a wafer;

[0003] During the production process of wafers, the wafers need to be packaged. An important step in packaging is to apply glue to the wafers. At this time, a dispensing machine is required to dispense glue on the dispensing points on the wafers. Usually, there are multiple dispensing points. When dispensing glue, the dispensing heads on the dispensing machine are required to dispense glue on the dispensing points respectively. And during the feeding and discharging processes of dispensing glue, manual assistance is required, which greatly increases the labor intensity of the entire device and reduces its production efficiency. Secondly, since the semiconductor dispensing machine heats and extrudes the glue, the glue will produce a wire-drawing situation during the rotation of the turntable, affecting the packaging effect. Summary of the Invention

[0004] (1) Technical Problems to be Solved

[0005] In view of the deficiencies of the prior art, the present invention provides a packaging device for semiconductor production, which solves the problem that manual assistance is required during the feeding and discharging processes of dispensing glue in the packaging device, which greatly increases the labor intensity of the entire device and reduces its production efficiency.

[0006] (2) Technical Solutions

[0007] To achieve the above objectives, the present invention is realized through the following technical solutions: A packaging device for semiconductor production, including a base, a first motor is fixedly connected inside the base, the output end of the first motor penetrates through the base and is fixedly connected upward with a rotating disk, placing grooves are opened at the four ends above the rotating disk, a first transmission frame is arranged at one end outside the base, four ends at the bottom of the first transmission frame are fixedly connected with first support frames, a third motor is fixedly connected at one end outside the first transmission frame, a first transmission belt is correspondingly arranged inside the first transmission frame, and a first guide plate is fixedly connected at one end of the first transmission frame close to the base;

[0008] At both upper ends of the base, there are fixedly connected brackets. At the top of the brackets, there is a fixedly connected top plate. In the middle above the top plate, there is a fixedly connected first cylinder. The extending end of the first cylinder penetrates through the top plate and is fixedly connected downward to a rubber head plate. At one end below the top plate, there is a fixedly connected connecting frame. Inside the connecting frame, there is a slot. At one inner end of the slot, there is a fixedly connected fifth motor. The output end of the fifth motor is fixedly connected to a lead screw. A threaded frame is threadedly connected to the lead screw;

[0009] The lower end of the threaded frame is fixedly connected to a fixed plate. At both ends of the fixed plate, there are fixedly connected sliding rods. A push plate is slidably connected to the sliding rods. A spring is sleeved on the sliding rods. One end of the spring is fixedly connected to the push plate, and the other end is fixedly connected to the threaded frame. At one end of the base close to the push plate, there is a second transmission frame.

[0010] Preferably, at four lower ends of the second transmission frame, there are fixedly connected second support frames. At the outer end of the second transmission frame, there is a fixedly connected fourth motor.

[0011] Preferably, inside the second transmission frame, there is a second transmission belt. At one end of the second transmission frame close to the push plate, there is a fixedly connected second guide plate.

[0012] Preferably, at four lower ends of the rotating disc, there are fixedly connected second cylinders. The extending ends of the second cylinders penetrate through the placing groove and are fixedly connected inward to top blocks.

[0013] Preferably, at one end of the base far from the second transmission frame, there is a connecting seat. A positioning frame is fixedly connected to the connecting seat. At the lower end of the positioning frame, there is a blowing head. A ventilation pipe penetrates through the upper end of the blowing head.

[0014] Preferably, at one end of the base far from the first transmission frame, there is a mounting plate. At one end below the mounting plate, there is a fixedly connected second motor. The output end of the second motor penetrates through the mounting plate and is fixedly connected upward to a first gear.

[0015] Preferably, in the middle above the mounting plate, there is a rotatably connected rotating frame. A second gear is fixedly connected to the rotating frame. The second gear meshes with the first gear.

[0016] Preferably, at the upper end of the rotating frame, there is a rotatably connected connecting rod. A fixed seat is fixedly connected to the base. Inside the fixed seat, there is a chute. A cutting knife is slidably connected inside the chute, and the other end of the connecting rod is rotatably connected to the cutting knife.

[0017] Working principle: When in use, install the entire encapsulation device on the production line. The semiconductor is transported by a robotic arm. The robotic arm conveys the semiconductor to the first conveyor belt 403. Start the third motor 402 to make the first conveyor belt 403 rotate, thereby driving the semiconductor to move. Under the action of the first guide plate 404, the semiconductor falls into the interior of the placement groove 105. At this time, the first motor 107 starts to drive the upper rotating disk 106 to rotate, so that the semiconductor wafer inside the placement groove 105 corresponds to the rubber head plate 104. Then, the first cylinder 103 starts to drive the rubber head plate 104 to descend, thereby performing an encapsulation operation on the semiconductor wafer inside the placement groove 105. After the encapsulation is completed, the second motor 301 starts to drive the first gear 302 to rotate. Under the meshing action, it drives the second gear 303 and the rotating frame 304 to rotate. And through the action of the connecting rod 305 and the fixed seat 308, the reciprocating motion of the cutting knife 307 can be realized, thereby cutting off the glue between the rubber head plate 104 and the semiconductor wafer to prevent wire drawing;

[0018] Subsequently, the rotating disk 106 rotates again, so that the semiconductor wafer inside the prevention groove 105 corresponds to the second transmission frame 5. At this time, the second cylinder 109 starts to drive the top block 108 to move upward, thereby ejecting the semiconductor wafer upward. And the fifth motor 608 starts to drive the lead screw 601 to rotate. Under the action of the threaded connection, the threaded frame 607 can drive the push plate 603 to move outward, thereby pushing the encapsulated semiconductor wafer onto the second guide plate 501. Through the guiding work of the second guide plate 501, the semiconductor wafer enters the second conveyor belt 502. Finally, start the fourth motor 503 to drive the second conveyor belt 502 to rotate and send it to the next process to complete the entire automatic encapsulation work of the semiconductor.

[0019] (III) Beneficial effects

[0020] The present invention provides an encapsulation device for semiconductor production. It has the following beneficial effects:

[0021] 1. By adopting the form of automatic transmission and a turntable, the present invention can complete uninterrupted semiconductor encapsulation operations. After the encapsulation is completed, it is ejected with the top block inside the placement groove, and cooperates with the pushing component in the middle of the turntable to send it onto the conveyor belt at the other end, completing the automatic loading and unloading encapsulation operation without manual intervention, greatly improving the efficiency of semiconductor encapsulation.

[0022] 2. By setting a gear assembly to rotate the rotating frame and completing the reciprocating motion of the cutting knife under the cooperation of a crank-slider assembly, the glue between the rubber head plate and the placement groove can be cut off, effectively avoiding the situation of wire drawing that is likely to occur during the rotation of the turntable.

[0023] 3. The present invention can clean impurities and dust inside the placement groove by setting up a ventilation pipe and a blowing head, preventing certain impacts during the encapsulation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 The front view of a packaging device for semiconductor production proposed by the present invention;

[0025] Figure 2 The top view of a packaging device for semiconductor production proposed by the present invention;

[0026] Figure 3 The schematic structural diagram of the rotating disk of a packaging device for semiconductor production proposed by the present invention;

[0027] Figure 4 The schematic structural diagram of the push plate assembly of a packaging device for semiconductor production proposed by the present invention;

[0028] Figure 5 The schematic structural diagram of the cutting tool assembly of a packaging device for semiconductor production proposed by the present invention.

[0029] Wherein, 1. Base; 101. Bracket; 102. Top plate; 103. Cylinder 1; 104. Rubber head plate; 105. Placement groove; 106. Rotating disk; 107. Motor 1; 108. Top block; 109. Cylinder 2; 2. Connecting seat; 201. Positioning frame; 202. Blowing head; 203. Ventilation pipe; 3. Mounting plate; 301. Motor 2; 302. Gear 1; 303. Gear 2; 304. Rotating frame; 305. Connecting rod; 306. Slide groove; 307. Cutting tool; 308. Fixed seat; 4. Transmission frame 1; 401. Support frame 1; 402. Motor 3; 403. Transmission belt 1; 404. Guide plate 1; 5. Transmission frame 2; 501. Guide plate 2; 502. Transmission belt 2; 503. Motor 4; 504. Support frame 2; 6. Connecting frame; 601. Lead screw; 602. Grooved opening; 603. Push plate; 604. Slide bar; 605. Spring; 606. Fixed plate; 607. Threaded frame; 608. Motor 5. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0031] Embodiment:

[0032] As Figures 1-5As shown in the figure, an encapsulation device for semiconductor production provided by an embodiment of the present invention includes a base 1. Inside the base 1, a first motor 107 is fixedly connected. The output end of the first motor 107 penetrates through the base 1 and is fixedly connected upward to a rotating disk 106. At the four ends above the rotating disk 106, placement grooves 105 are provided. By starting the first motor 107, the rotating disk 106 can be driven to rotate, and the placement grooves 105 can correspond to semiconductor wafers, thus facilitating continuous encapsulation operations. At one end on the outer side of the base 1, a first transmission frame 4 is provided. At the four ends of the bottom of the first transmission frame 4, first support frames 401 are fixedly connected. At one end on the outer side of the first transmission frame 4, a third motor 402 is fixedly connected. Inside the first transmission frame 4, a first transmission belt 403 is correspondingly arranged. At one end of the first transmission frame 4 close to the base 1, a first guide plate 404 is fixedly connected. A sprocket is installed on the output end of the third motor 402, and a chain is arranged at the inner end of the first transmission belt 403. The chain and the sprocket cooperate with each other, so that the third motor 402 can drive the first transmission belt 403 to rotate to ensure the conveying operation of semiconductor wafers. And in order to ensure that the semiconductor can accurately enter the inside of the placement groove 105, limit belts are installed on both the first transmission belt 403 and the first guide plate 404 to ensure the stability during its transmission;

[0033] At both ends above the base 1, brackets 101 are fixedly connected. At the top of the brackets 101, a top plate 102 is fixedly connected. In the middle above the top plate 102, a first cylinder 103 is fixedly connected. The extending end of the first cylinder 103 penetrates through the top plate 102 and is fixedly connected downward to a rubber head plate 104. At one end below the top plate 102, a connecting frame 6 is fixedly connected. Inside the connecting frame 6, a slot 602 is provided. At one end inside the slot 602, a fifth motor 608 is fixedly connected. The output end of the fifth motor 608 is fixedly connected to a lead screw 601. A threaded frame 607 is threadedly connected to the lead screw 601. By starting the first cylinder 103, the rubber head plate 104 can be driven to perform lifting adjustment, so as to correspond to the semiconductor wafer inside the placement groove 105, thus completing its encapsulation operation;

[0034] The lower end of the threaded frame 607 is fixedly connected to a fixing plate 606. Both ends of the fixing plate 606 are fixedly connected to sliding rods 604. A push plate 603 is slidably connected to the sliding rods 604. A spring 605 is sleeved on the sliding rods 604. One end of the spring 605 is fixedly connected to the push plate 603, and the other end is fixedly connected to the threaded frame 607. One end of the base 1 close to the push plate 603 is provided with a second transmission frame 5. Starting the fifth motor 608 can drive the lead screw 601 to rotate. Under the action of screw connection, the threaded frame 607 can drive the push plate 603 to move outwards, so as to push the encapsulated semiconductor wafer onto the second guide plate 501. Through the guiding work of the second guide plate 501, the semiconductor wafer enters the second conveyor belt 502. Finally, starting the fourth motor 503 can drive the second conveyor belt 502 to rotate and send it to the next process to complete the entire semiconductor automated encapsulation work;

[0035] Four ends at the lower part of the second transmission frame 5 are fixedly connected to a second support frame 504. The outer end of the second transmission frame 5 is fixedly connected to a fourth motor 503. The second conveyor belt 502 is arranged inside the second transmission frame 5. One end of the second transmission frame 5 close to the push plate 603 is fixedly connected to a second guide plate 501. A sprocket is installed on the output end of the fourth motor 503, and a chain is arranged at the inner end of the second conveyor belt 502. The chain and the sprocket cooperate with each other, so that the fourth motor 503 can drive the second conveyor belt 502 to rotate to ensure the conveying operation of the semiconductor wafer. Limiting belts are installed on both the second conveyor belt 502 and the second guide plate 501 to ensure the stability during its transmission, so that the encapsulated semiconductor can enter the next production process;

[0036] Four ends at the bottom of the rotating disk 106 are fixedly connected to second cylinders 109. The extending ends of the second cylinders 109 penetrate through the placement groove 105 and are fixedly connected to a top block 108 inside. By starting the second cylinders 109, the top block 108 can be driven to move upwards, so as to push the semiconductor wafer inside the placement groove 105 upwards and complete its falling-off operation;

[0037] One end of the base 1 far from the second transmission frame 5 is provided with a connecting seat 2. A positioning frame 201 is fixedly connected to the connecting seat 2. A blowing head 202 is arranged at the lower end of the positioning frame 201. A ventilation pipe 203 penetrates through the upper end of the blowing head 202. The ventilation pipe 203 can be connected to an external fan, so that air is sprayed downwards through the air outlet head 202 to clean the dust and impurities inside the placement groove 105 and ensure the encapsulation effect;

[0038] One end of the base 1 away from the first transmission frame 4 is provided with a mounting plate 3. One end below the mounting plate 3 is fixedly connected with a second motor 301. The output end of the second motor 301 penetrates through the mounting plate 3 and is fixedly connected with a first gear 302 upward. The middle part above the mounting plate 3 is rotatably connected with a rotating frame 304. A second gear 303 is fixedly connected to the rotating frame 304. The second gear 303 meshes with the first gear 302. The upper end of the rotating frame 304 is rotatably connected with a connecting rod 305. A fixed seat 308 is fixedly connected to the base 1. A chute 306 is opened inside the fixed seat 308. A cutter 307 is slidably connected inside the chute 306. And the other end of the connecting rod 305 is rotatably connected to the cutter 307. When the second motor 301 is started, it drives the first gear 302 to rotate. Under the meshing action, it drives the second gear 303 and the rotating frame 304 to rotate. And through the action of the connecting rod 305 and the fixed seat 308, the reciprocating motion of the cutter 307 can be realized, so as to cut off the glue between the rubber head plate 104 and the semiconductor wafer, preventing the occurrence of wire drawing

[0039] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An encapsulation device for semiconductor production, comprising a base (1), characterized in that: Inside the base (1), a first motor (107) is fixedly connected. The output end of the first motor (107) penetrates through the base (1) and is fixedly connected upward to a rotating disk (106). At the four ends above the rotating disk (106), placing grooves (105) are provided. At one end on the outer side of the base (1), a first transmission frame (4) is arranged. At the four ends of the bottom of the first transmission frame (4), first support frames (401) are fixedly connected. At one end on the outer side of the first transmission frame (4), a third motor (402) is fixedly connected. Inside the first transmission frame (4), a first transmission belt (403) is correspondingly arranged. At one end of the first transmission frame (4) close to the base (1), a first guide plate (404) is fixedly connected; At the two ends above the base (1), brackets (101) are fixedly connected. At the top of the brackets (101), a top plate (102) is fixedly connected. In the middle above the top plate (102), a first cylinder (103) is fixedly connected. The extending end of the first cylinder (103) penetrates through the top plate (102) and is fixedly connected downward to a rubber head plate (104). At one end below the top plate (102), a connecting frame (6) is fixedly connected. Inside the connecting frame (6), a slot (602) is provided. At one end on the inner side of the slot (602), a fifth motor (608) is fixedly connected. The output end of the fifth motor (608) is fixedly connected to a lead screw (601). A threaded frame (607) is threadedly connected to the lead screw (601); At the lower end of the threaded frame (607), a fixing plate (606) is fixedly connected. At the two ends of the fixing plate (606), slide bars (604) are fixedly connected. A push plate (603) is slidably connected to the slide bars (604). A spring (605) is sleeved on the slide bars (604). One end of the spring (605) is fixedly connected to the push plate (603), and the other end is fixedly connected to the threaded frame (607). At one end of the base (1) close to the push plate (603), a second transmission frame (5) is arranged.

2. The encapsulation device for semiconductor production according to claim 1, wherein: At the four ends below the second transmission frame (5), second support frames (504) are fixedly connected. At the outer end of the second transmission frame (5), a fourth motor (503) is fixedly connected.

3. A packaging device for semiconductor production according to claim 1, characterized in that: Inside the second transmission frame (5), a second transmission belt (502) is arranged. At one end of the second transmission frame (5) close to the push plate (603), a second guide plate (501) is fixedly connected.

4. A packaging device for semiconductor production according to claim 1, characterized in that: At the four ends of the bottom of the rotating disk (106), second cylinders (109) are fixedly connected. The extending ends of the second cylinders (109) penetrate through the placing grooves (105) and are fixedly connected inward to top blocks (108).

5. A semiconductor production packaging device according to claim 1, characterized in that: At one end of the base (1) away from the second transmission frame (5), a connecting seat (2) is arranged. On the connecting seat (2), a positioning frame (201) is fixedly connected. At the lower end of the positioning frame (201), a blowing head (202) is arranged. An air vent pipe (203) penetrates through the upper end of the blowing head (202).

6. A semiconductor production packaging device according to claim 1, characterized in that: One end of the base (1) far from the first transmission frame (4) is provided with a mounting plate (3). One end below the mounting plate (3) is fixedly connected with a second motor (301), and the output end of the second motor (301) penetrates through the mounting plate (3) and is fixedly connected with a first gear (302) upward.

7. An encapsulation device for semiconductor production according to claim 6, characterized in that: In the middle above the mounting plate (3), a rotating frame (304) is rotatably connected. A second gear (303) is fixedly connected to the rotating frame (304), and the second gear (303) meshes with the first gear (302).

8. An encapsulation device for semiconductor production according to claim 7, characterized in that: The upper end of the rotating frame (304) is rotatably connected with a connecting rod (305). A fixed seat (308) is fixedly connected to the base (1). A chute (306) is opened inside the fixed seat (308). A cutter (307) is slidably connected inside the chute (306), and the other end of the connecting rod (305) is rotatably connected to the cutter (307).

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