Chip packaging structure

Abstract

The invention relates to the technical field of chip packaging, and particularly discloses a chip packaging structure which comprises a packaging machine, a sealing structure and a cleaning mechanism, the sealing structure comprises an outer frame and an inner frame, the inner frame is longitudinally installed in the outer frame in a sliding mode, and a containing cavity for containing a bonding wire is formed between the inner frame and the outer frame; air ports are formed in the positions, corresponding to the bonding wires, of the side wall of the inner frame, multiple sets of partition pieces are installed on the outer wall of the inner frame, a rotary table and a first driving piece are installed on the packaging machine, an adsorption piece is arranged at the lower end of the rotary table, the cleaning mechanism comprises a blowing piece and a cleaning piece, and the blowing piece is installed at the lower end of the rotary table; an air outlet hole capable of being communicated with the air port is formed in the blowing part, the cleaning part is installed at the lower end of the blowing part, and the distance between the cleaning part and the rotary table can be matched with the vertical movement of the rotary table; impurities on the surface of the chip can be adsorbed through the cleaning part, and meanwhile, the bonding wire part can be purged through the purging part, so that the cleaning effect is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and particularly relates to a chip packaging structure. Background Art

[0002] Chip packaging refers to fixing a semiconductor chip (die) on a substrate, connecting the electrodes of the chip to an external circuit through techniques such as wire bonding or flip chip, and encapsulating the chip with a packaging material (such as plastic, ceramic, metal, etc.) to form a complete chip module. Among them, wire bonding is one of the most common electrical connection methods, and fine metal wires (usually gold wires or aluminum wires) are used to connect the electrodes of the chip to the pins on the packaging substrate to form bonding wires.

[0003] During packaging, in order to ensure subsequent packaging effects and the performance of the chip, first, impurities on the surfaces of the chip and the substrate need to be cleaned. Then, the outer frame is placed on the substrate, and the cover plate is covered on the upper end of the outer frame. Next, epoxy resin glue is injected into the space enclosed by the outer frame, the substrate, and the cover plate for curing treatment to ensure that the glue is completely cured. After curing is completed, the packaged chip module is inspected and tested to ensure the sealing performance of the package.

[0004] The patent document with the publication number CN118866774B discloses a chip packaging structure and a chip packaging method, including a workbench, a substrate holder installed on the top of the workbench, a support frame installed on one side wall of the workbench, a first electric sliding table installed on one side wall of the support frame, a compatible limiting component drivingly connected to the output end of the first electric sliding table, a packaging component installed on the compatible limiting component, and two groups of edge grinding components symmetrically arranged. During use, two groups of adsorption mud adhesives are pushed to fit on the surface of the chip and penetrate into the openings on the surface of the chip for impurity adsorption. And during the process of pushing the adsorption mud adhesive for adsorption, the second sliding plate can be driven to slide and buffer in the second socket plate, avoiding the problem of chip damage caused by excessive pressure, improving the impurity adsorption effect, and at the same time improving the chip packaging accuracy.

[0005] However, when using the above-mentioned packaging structure to clean the impurities on the chip surface, there are still some other problems. First, when the adsorption glue mud moves, if there are impurities (such as hard particles) attached to its surface, these impurities may scratch the chip surface and break the protective layer on the chip surface, thereby affecting the reliability of the chip. Second, when using the adsorption glue mud to clean the bonding wire part, it is easy to cause damage to the bonding wire and affect the normal operation of the chip. Summary of the Invention

[0006] The present invention provides a chip packaging structure, aiming to solve the problems existing in the packaging structure in the related art, that is, when cleaning the chip, scratches may be scratched on the chip surface, affecting the chip quality, and it is not convenient to clean the bonding wire part.

[0007] A chip packaging structure of the present invention includes a packaging machine, a workbench is provided on the packaging machine, and further includes a sealing structure and a cleaning mechanism; The sealing structure includes an outer frame and an inner frame. The inner frame is longitudinally slidably installed inside the outer frame, and there is a receiving cavity for accommodating bonding wires between the two. Air vents are provided on the side wall of the inner frame corresponding to the position of each bonding wire. A multi-group separator is installed on the outer wall of the inner frame. Each group of separators includes two partitions, and the two partitions are respectively installed on both sides of the air vent. A turntable and a driving member one are installed on the packaging machine. The driving member one is used to drive the turntable to move longitudinally, and an adsorbing member for adsorbing the outer frame is provided at the lower end of the turntable; The cleaning mechanism includes a purging member and a cleaning member. The purging member is installed at the lower end of the turntable. An air outlet hole that can communicate with the air vent is provided on the purging member. After the gas in the purging member is discharged from the air outlet hole, it will flow through the air vent into the channel formed between the two partitions to purge the bonding wires. The cleaning member is installed at the lower end of the purging member and can clean the impurities on the chip surface, and the distance between the cleaning member and the turntable can be adapted to the up and down movement of the turntable.

[0008] Place the combined outer frame and inner frame on the workbench, drive the turntable to move downward through the driving member one, and adsorb the outer frame through the adsorbing member. Then drive the turntable to move upward through the driving member one, and at the same time drive the outer frame to move upward. During this process, the inner frame will move downward relative to the outer frame under the action of gravity, so that the lower end of the inner frame is lower than the lower end of the outer frame; place the bonded chip and substrate on the workbench, drive the turntable to move downward through the driving member one, and at the same time drive the outer frame, the purging member and the cleaning member to move downward. During this process, the lower end of the inner frame will first contact the substrate surface. At this time, the cleaning member just moves above the chip to clean the impurities on the chip surface, and at the same time avoid scratching the chip surface; then as the turntable and the outer frame continue to move downward, the inner frame and the cleaning member remain stationary, and the purging member blows air into the receiving cavity through the air outlet hole and the air vent, and purges the bonding wires through the channel between the two partitions to avoid damaging the bonding wires; when the lower end of the outer frame contacts the substrate surface, the assembly between the outer frame, the inner frame and the substrate is completed. Subsequently, the adsorbing member releases the adsorption on the outer frame, and drives the turntable, the purging member and the cleaning member to move upward synchronously through the driving member one and withdraw from the inside of the inner frame; finally, inject glue for curing treatment to obtain a complete chip module.

[0009] Preferably, the sealing structure further includes a cover plate which can close the upper end of the outer frame, so as to form a filling cavity for filling glue by enclosing the outer frame, the inner frame and the cover plate. A cavity for accommodating glue is provided inside the turntable. A pipe communicating with the inside of the turntable is connected to the upper end of the turntable. A through hole is provided on the cover plate, and the cover plate can be installed outside the pipe through the through hole. A second driving member for driving the turntable to rotate is provided on the encapsulator.

[0010] The effect is that through the coordinated control of the rotation and longitudinal movement of the turntable, the automatic assembly of the cover plate can be realized, and at the same time, the optimization of the glue injection path can be realized.

[0011] Preferably, a chute is longitudinally provided on the inner wall of the outer frame, a slider is fixedly installed on the outer wall of the inner frame, and the inner frame is longitudinally slidably matched with the chute through the slider. An opening is provided at the lower end of the chute, so that the inside of the chute communicates with the accommodating cavity. The width of the opening is smaller than the width of the slider to prevent the slider from disengaging from the chute.

[0012] The effect is that as the glue in the accommodating cavity gradually increases, the glue can enter the inside of the chute through the opening at the lower end of the chute. When solidifying, a mechanical interlocking structure can be formed between the inner frame and the outer frame, making the fixing effect between the inner frame and the outer frame better.

[0013] Preferably, the adsorbing member includes a plurality of suction cups and a third driving member for driving the suction cups to adsorb. Mounting parts for installing the suction cups are provided on both sides of the turntable, and the lower ends of the suction cups are at the same height as the lower end of the turntable.

[0014] Preferably, the purging member is an airbag. The airbag is installed at the lower end of the turntable. The airbag is formed by an elastic material, and an air outlet hole is provided on the side wall of the airbag. When the adsorbing member adsorbs the outer frame, the lower end of the turntable can close the upper end of the outer frame.

[0015] The effect is that the airbag can expand under the gravity of the cleaning member to automatically supplement gas. During the assembly process of the sealing structure, the gas can be automatically discharged through the compression of the airbag to perform directional purging on the bonding wire part, and at the same time, the distance between the cleaning member and the chip can be ensured to be constant, avoiding damage to the chip.

[0016] Preferably, the cleaning member is cleaning mud. The cleaning mud is formed by a flexible material. A housing is installed at the lower end of the airbag. The shape of the housing is adapted to the shape inside the inner frame, and the lower end of the housing is open. The cleaning mud is detachably installed in the housing.

[0017] Preferably, the first driving member is provided on the encapsulator, and the output end extends vertically downward. The output end of the first driving member is connected to a U-shaped frame. The turntable is rotatably installed on the U-shaped frame. The second driving member is installed on the U-shaped frame, and the output end extends horizontally.

[0018] Preferably, an air duct is longitudinally formed on the inner wall of the inner frame, and the lower end of the air duct communicates with the air port, so that the air outlet communicates with the air port through the air duct.

[0019] Preferably, the opposite sides of the two partitions are both inclined surfaces, and the inclined surfaces are inclined away from the other partition from top to bottom.

[0020] The effect is that the design of the inclined surface can guide the air flow to wash the surface of the bonding wire in a more gentle manner, and at the same time can increase the contact area between the inner frame and the substrate, so that the fixing effect between the inner frame and the substrate is better.

[0021] Preferably, notches for accommodating pins are provided at the lower ends of the outer frame and the inner frame.

[0022] The beneficial effects of the present invention are as follows: The present invention is provided with a sealing structure and a cleaning mechanism. By providing a slidable outer frame and inner frame to form a sealing structure, the bonding wire and the cleaning mechanism are effectively isolated during the cleaning process to prevent damage caused by physical contact. At the same time, the rapid and precise assembly of the sealing structure is realized. During the assembly process, the impurities on the surface of the chip can be adsorbed and cleaned by the cleaning part, and the bonding wire part can be non-contact cleaned by the purging part. It has the advantages of preventing scratching the surface of the chip during the cleaning process, avoiding damage to the bonding wire, improving the cleaning effect and the assembly efficiency of the sealing structure. Description of the Drawings

[0023] Figure 1 is a schematic diagram of the overall structure of the present invention.

[0024] Figure 2 is a schematic diagram of the assembly structure of the encapsulation machine and the cleaning mechanism of the present invention.

[0025] Figure 3 is a schematic diagram of the structure of the present invention cut longitudinally.

[0026] Figure 4 is the Figure 3 enlarged schematic diagram of part A in

[0027] Figure 5 is a schematic diagram of the assembly structure of the turntable, purging part and cleaning part of the present invention.

[0028] Figure 6 is a schematic diagram of the assembly structure of the outer frame and the inner frame of the present invention.

[0029] Figure 7 is a schematic diagram of the assembly structure of the sealing structure and the substrate of the present invention.

[0030] Figure 8 is a schematic diagram of the assembly structure of the substrate and the chip of the present invention.

[0031] Reference numerals: 1. Encapsulation machine; 11. Turntable; 111. Pipeline; 12. First driving member; 13. Second driving member; 14. U-shaped frame; 15. Suction cup; 21. Outer frame; 211. Slide groove; 22. Inner frame; 221. Air port; 222. Partition plate; 223. Slide block; 224. Air duct; 23. Cover plate; 231. Through hole; 3. Air bag; 31. Air outlet hole; 4. Cleaning mud; 41. Housing; 51. Substrate; 52. Chip; 53. Pin; 54. Bonding wire. Detailed implementation manners

[0032] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the accompanying drawings. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as a limitation to the present invention.

[0033] As Figures 1 to 8 shown, a chip encapsulation structure of the present invention includes an encapsulation machine 1, a sealing structure, and a cleaning mechanism.

[0034] A workbench is provided on the encapsulation machine 1, and a processing station for placing workpieces is provided on the workbench. When encapsulating the chip 52, first, the chip 52 is fixed on the substrate 51, and the pins 53 of the chip 52 are connected to the pins 53 on the substrate 51 by wire bonding to form bonding wires 54. Then, the substrate 51 is placed on the processing station, and the chip 52 is encapsulated with the sealing structure to form a complete chip 52 module. During the encapsulation process, the encapsulation machine 1 is used to realize the assembly between the sealing structure and the chip 52, and the cleaning mechanism is used to clean the impurities on the surfaces of the substrate 51 and the chip 52 to ensure the reliability and tightness of subsequent encapsulation.

[0035] As Figures 1 to 8As shown, the sealing structure includes an outer frame 21, an inner frame 22, and a cover plate 23. Both the outer frame 21 and the inner frame 22 are in a loop shape. The size of the outer frame 21 is adapted to the size of the substrate 51. The inner frame 22 is longitudinally slidably installed inside the outer frame 21, and a receiving cavity for accommodating the bonding wire 54 is formed between them. Both the lower ends of the outer frame 21 and the inner frame 22 are provided with notches for accommodating the pins 53, realizing the function of avoiding the pins 53 on the surface of the substrate 51. At the same time, it can effectively fix the position of the pins 53 during the subsequent glue filling process, preventing the pins 53 from shifting due to the flow of glue. The cover plate 23 can be pressed on the upper end of the outer frame 21 and close the outer frame 21 to form a filling cavity for filling glue by enclosing the outer frame 21, the inner frame 22, and the cover plate 23. A plurality of air vents 221 are opened in the area near the bottom of the side wall of the inner frame 22, and each air vent 221 corresponds to the position of the bonding wire 54. Multi-component separators are installed on the outer wall of the inner frame 22. Each component of the separator includes two oppositely arranged plate-like structures, such as partition plates 222, and the two partition plates 222 are respectively installed on both sides of the air vent 221, thus forming a directional air flow channel to restrict the direction of gas flow.

[0036] The cleaning mechanism includes a purging part and a cleaning part. The purging part is installed at the lower end of the turntable 11. A plurality of air outlet holes 31 that can communicate with the air vents 221 are provided on the purging part. After the gas in the purging part is discharged from the air outlet holes 31, it will flow through the air vents 221 into the air flow channel formed between the two partition plates 222 to realize non-contact purging of the bonding wire 54. The cleaning part is installed at the lower end of the purging part and can clean the impurities on the surface of the chip 52. The distance between the cleaning part and the turntable 11 can be adapted to the up and down movement of the turntable 11 to ensure a constant cleaning distance between the cleaning part and the surface of the chip 52 during the encapsulation process. A turntable 11 and a first driving part 12 are installed on the encapsulation machine 1. The first driving part 12 is used to drive the turntable 11 to move longitudinally. An adsorbing part for adsorbing the outer frame 21 is provided at the lower end of the turntable 11.

[0037] During operation, first place the combined outer frame 21 and inner frame 22 on the workbench. Drive the turntable 11 to move downward by the first driving member 12, so that the purging member and the cleaning member enter the interior of the inner frame 22, and then adsorb the outer frame 21 through the adsorbing member. Then drive the turntable 11 to move upward by the first driving member 12, and at the same time drive the outer frame 21 to move upward. During this process, the inner frame 22 will move downward relative to the outer frame 21 under the action of gravity until the inner frame 22 is at the lowest limit position where it can slide relative to the outer frame 21, making the lower end of the inner frame 22 lower than the lower end of the outer frame 21. At this time, the turntable 11 and the outer frame 21 continue to move upward, and the inner frame 22 will move upward synchronously. Next, place the bonded chip 52 and substrate 51 on the workbench, drive the turntable 11 to move downward by the first driving member 12, and at the same time drive the outer frame 21, the purging member and the cleaning member to move downward. During this process, the lower end of the inner frame 22 will first contact the surface of the substrate 51. At this time, the cleaning member just moves above the chip 52 to clean the impurities on the surface of the chip 52. Then as the turntable 11 and the outer frame 21 continue to move downward, the inner frame 22 and the cleaning member remain stationary, and the purging member blows air into the accommodating cavity through the air outlet hole 31 and the air port 221, and purges and cleans the bonding wire 54 through the channel between the two partition plates 222 until the lower end of the outer frame 21 touches the surface of the substrate 51, completing the assembly between the outer frame 21, the inner frame 22 and the substrate 51. Subsequently, the adsorbing member releases the adsorption of the outer frame 21, and drives the turntable 11, the purging member and the cleaning member to move upward synchronously and withdraw from the interior of the inner frame 22. At this time, the cover plate 23 can be pressed on the upper end of the outer frame 21 to form a filling cavity between the cover plate 23, the outer frame 21 and the substrate 51, and then inject epoxy resin glue into the filling cavity for curing treatment to obtain a complete chip 52 module. In addition, during the process of injecting the glue, the bonding wire 54 can be isolated and protected by the inner frame 22, so that the glue gradually flows into the accommodating cavity through the air port 221 and covers and protects the bonding wire 54, rather than directly impacting the bonding wire 54, thereby avoiding damage to the bonding wire 54.

[0038] Therefore, dynamic sealing can be achieved through the relative sliding of the outer frame 21 and the inner frame 22, and the positioning reference is ensured by the action of gravity that the inner frame 22 first contacts the substrate 51. By keeping the cleaning distance between the cleaning member and the surface of the chip 52 constant, the cleaning effect of impurities is ensured, and at the same time damage to the chip 52 is avoided. By forming a directional air flow channel through the air port 221 and the partition plate 222, non-contact cleaning of the bonding wire 54 is achieved, avoiding damage to the bonding wire 54 caused by traditional physical contact cleaning.

[0039] Such as Figures 1 to 5As shown in the figure, a cavity for storing glue is provided inside the turntable 11. A pipe 111 communicating with the inside of the turntable 11 is connected to the upper end of the turntable 11 for injecting and discharging glue, and a solenoid valve is provided at the pipe 111. A through hole 231 is provided on the cover plate 23, and the cover plate 23 can be detachably fixed to the outside of the pipe 111 by inserting and installing through the through hole 231, realizing the detachable fixation between the cover plate 23 and the turntable 11. A first driving member 12 is provided on the encapsulation machine 1, and the output end extends vertically downward. The output end of the first driving member 12 is connected to a U-shaped frame 14. The first driving member 12 can be a cylinder, an electric push rod, etc. The turntable 11 is rotatably installed on the U-shaped frame 14. A second driving member 13 for driving the turntable 11 to rotate is provided on the encapsulation machine 1. The second driving member 13 is installed on the U-shaped frame 14, and the output end extends horizontally. The second driving member 13 can be a motor.

[0040] Specifically, in the initial state, the lower end of the turntable 11 faces downward. At this time, by driving the turntable 11 to move downward through the first driving member 12, the outer frame 21 can be adsorbed by the adsorbing member. Subsequently, the turntable 11 is driven by the first driving member 12 to rise to a predetermined height, and the outer frame 21 and the inner frame 22 are driven to move upward. After placing the bonded substrate 51 and the chip 52 on the workbench, the turntable 11 is driven by the first driving member 12 to move downward again, realizing the assembly of the outer frame 21, the inner frame 22 and the substrate 51. During this process, the surface of the chip 52 is cleaned by the cleaning member, and the bonding wire 54 is cleaned by the purging member. During the adsorption of the outer frame 21, the cover plate 23 can be placed on the upper end of the turntable 11 manually or by mechanical assistance, so that the cover plate 23 is fixed to the outside of the pipe 111 through the through hole 231. After the assembly of the outer frame 21 is completed, the turntable 11 is driven by the first driving member 12 to move upward, so that the cleaning member and the purging member withdraw from the inner frame 22. Then, the turntable 11 is driven by the second driving member 13 to rotate 180 degrees, so that the upper end of the turntable 11 faces downward, and at the same time, the cover plate 23 moves to the lower side of the turntable 11. Then, the turntable 11 is driven by the first driving member 12 to move downward again, pressing the cover plate 23 against the upper end of the outer frame 21 to complete the automatic installation of the outer frame 21 and the cover plate 23. Then, the solenoid valve is opened, and the glue is injected from the cavity of the turntable 11 into the filling cavity through the pipe 111. After the glue injection is completed, the solenoid valve is closed. The turntable 11 is driven by the first driving member 12 to move upward, and then the turntable 11 is driven by the second driving member 13 to rotate for resetting. Therefore, through the coordinated control of the rotation and longitudinal movement of the turntable 11, the optimization of the glue injection path and the double guarantee of the sealing performance are realized.

[0041] As Figures 2 to 6As shown in the figure, in order to achieve longitudinal sliding between the outer frame 21 and the inner frame 22, a sliding groove 211 is longitudinally provided on the inner wall of the outer frame 21, and a sliding block 223 is fixedly installed on the outer wall of the inner frame 22. The inner frame 22 can longitudinally slide and cooperate with the sliding groove 211 through the sliding block 223. An opening is provided at the lower end of the sliding groove 211, so that the inside of the sliding groove 211 communicates with the accommodation cavity, and the width of the opening is smaller than the width of the sliding block 223 to prevent the sliding block 223 from detaching from the sliding groove 211. In addition, in order to improve the fixing effect between the outer frame 21 and the cover plate 23, a convex block adapted to the sliding groove 211 is connected to the peripheral side of the cover plate 23. When the cover plate 23 is buckled on the upper end of the outer frame 21, the convex block can be stuck in the sliding groove 211.

[0042] Specifically, when the glue is injected into the inner frame 22 through the pipeline 111, the glue will flow into the accommodation cavity through the air vents 221 on the side wall of the inner frame 22. As the glue in the accommodation cavity gradually increases, the glue can enter the inside of the sliding groove 211 through the opening at the lower end of the sliding groove 211 and flow upward along the inner wall of the sliding groove 211 to cover the contact surface between the sliding block 223 and the sliding groove 211. During the curing process, the glue forms a glue layer that wraps the sliding block 223 and fills the sliding groove 211, so that the outer frame 21 and the inner frame 22 form a mechanical interlocking structure, making the fixing effect between the outer frame 21 and the inner frame 22 better. The design that the width of the opening of the sliding groove 211 is smaller than the width of the sliding block 223 prevents the sliding block 223 from detaching through the opening when sliding in the sliding groove 211.

[0043] As Figures 1 to 5 shown in the figure, the suction attachment includes a plurality of suction cups 15 and a third driving member for driving the suction cups 15 to perform suction. Installation parts for installing the suction cups 15 are provided on both sides of the turntable 11. The number of suction cups 15 can be four or six, which are evenly distributed on the installation parts on both sides of the turntable 11, and the distance between adjacent suction cups 15 can be adjusted according to the size of the outer frame 21. The material of the suction cup 15 can be silicone or rubber, and its suction surface can be provided with corrugated textures to increase the contact friction force. The third driving member can be a pneumatic pump or a vacuum generator, and is respectively connected to each suction cup 15 through an independent air passage to realize independent adjustment of the suction force of a single suction cup 15.

[0044] As Figures 2 to 5As shown, the purging member is an airbag 3. The airbag 3 is fixedly installed at the lower end of the turntable 11 through a snap structure, which is convenient for disassembly and replacement. The airbag 3 is formed by an elastic material, such as silicone or rubber material, and has the characteristics of compression and rebound. It can play a role in buffering and gas storage during the cleaning process. The air outlet holes 31 are distributed in an array on the circumferential side wall of the airbag 3. The lower end of the suction cup 15 is at the same height as the lower end of the turntable 11, so that when the suction attachment adsorbs the outer frame 21, the lower end of the turntable 11 and the upper end of the outer frame 21 can be at the same height, and then the upper end of the outer frame 21 can be closed by the turntable 11. The cleaning member is a cleaning mud 4. The cleaning mud 4 is made of flexible materials such as silicone and rubber, and has good plasticity and adsorption, which can avoid the risk of scratching caused by rigid contact with the chip 52. A housing 41 is installed at the lower end of the airbag 3. The housing 41 is made of hard plastic or metal material, and its outer shape matches the inner contour of the inner frame 22. When the suction attachment adsorbs the outer frame 21, a sealed space can be formed between the turntable 11 and the housing 41, preventing the gas in the airbag 3 from escaping after being discharged from the air outlet holes 31, making the air flow concentrate on the bonding wire 54 area and enhancing the directional purging effect on the bonding wire 54. The lower end of the housing 41 is open, and the cleaning mud 4 is detachably installed in the housing 41 by means of snap or magnetic attraction, etc., which is convenient for replacement and cleaning.

[0045] Specifically, in the initial state, the airbag 3 expands downward due to the gravity of the cleaning mud 4, causing the outside gas to flow into the airbag 3 through the air outlet holes 31, so that the airbag 3 maintains a certain expanded state. When the turntable 11 is driven downward by the first driving member 12, the outer frame 21 adsorbed by the suction cup 15 can be driven to move downward synchronously. During this process, the inner frame 22 will first contact the surface of the substrate 51, and at the same time, the lower end of the cleaning mud 4 just contacts the surface of the chip 52, and the impurities on the surface of the chip 52 are cleaned by its adsorption performance. Then, as the turntable 11 and the outer frame 21 continue to move downward, the inner frame 22 and the cleaning mud 4 remain stationary, so that the turntable 11 moves downward relative to the cleaning mud 4. During this process, the airbag 3 is compressed, and the air inside it is discharged outward through the air outlet holes 31 and acts on the surface of the bonding wire 54 through the directional channel, purging the impurities on the surface of the bonding wire 54. When the turntable 11 is driven upward by the first driving member 12, the airbag 3 and the cleaning mud 4 can be driven to withdraw from the inner frame 22. During this process, the airbag 3 will expand again under the gravity of the cleaning mud 4 to supplement the gas in the airbag 3 and prepare for the next purging.

[0046] As Figures 4 to 7As shown, an air passage 224 is formed on the inner wall of the inner frame 22. The air passage 224 extends longitudinally along the inner wall of the inner frame 22, and its cross-sectional shape can be rectangular or semi-circular. The lower end of the air passage 224 communicates with the air port 221, and the upper end extends to a region close to the top of the inner frame 22, forming a complete gas transmission path to ensure that the air outlet 31 can communicate with the air port 221 through the air passage 224. A flow guide groove or a smooth coating can be provided on the inner wall of the air passage 224 to further reduce the flow resistance. During the downward movement of the airbag 3 driven by the turntable 11, the air outlet 31 on the side wall of the airbag 3 is aligned with the top of the air passage 224. When the gas enters the air passage 224, it is restricted by the longitudinal channel and cannot diffuse laterally, so it acts on the channel formed by the two partition plates 222 at the air port 221, effectively covering the area where the bonding wire 54 is located and enhancing the cleaning effect on the bonding wire 54.

[0047] As Figure 6 and Figure 7 shown, the opposite sides of the two partition plates 222 are both inclined surfaces, which are inclined downward and away from the other partition plate 222 from top to bottom. The inclined side walls of the partition plates 222 form a gradually expanding channel structure from top to bottom, enabling the air flow to gradually diffuse during longitudinal flow, guiding the air flow to cover the surface of the bonding wire 54 in a smoother manner, enhancing the scouring ability of impurities on both sides of the bonding wire 54, and at the same time avoiding damage to the bonding wire 54 caused by concentrated impact of the air flow. In addition, the design of the inclined surface can increase the contact area between the inner frame 22 and the substrate 51, making the fixing effect between the inner frame 22 and the substrate 51 better.

[0048] The working process of the packaging structure of the present invention is as follows: In the initial state, the turntable 11 is lifted to a set height by the first driving member 12 so that there is enough space below the turntable 11 for placing the workpiece. At this time, the airbag 3 expands downward due to the gravity of the cleaning mud 4, causing the outside air to flow into the inside of the airbag 3 through the air outlet 31, keeping the airbag 3 in a certain inflated state. The combined outer frame 21 and inner frame 22 are placed on the workbench, and at the same time, the cover plate 23 is placed on the upper end of the turntable 11.

[0049] The turntable 11 is driven by the first driving member 12 to move downward, so that the purging member and the cleaning member enter the inside of the inner frame 22. When the lower end of the suction cup 15 contacts the outer frame 21, the third driving member is started, and the outer frame 21 is adsorbed by the suction cup 15. Then, the turntable 11 is driven by the first driving member 12 to move upward, and at the same time, the outer frame 21 is driven to move upward. During this process, the inner frame 22 will move downward relative to the outer frame 21 under the action of gravity, so that the slider 223 slides downward along the chute 211 until the slider 223 is located at the lowermost end of the chute 211. At this time, the inner frame 22 is located at the lowest limit position where it can slide relative to the outer frame 21, so that the lower end of the inner frame 22 is lower than the lower end of the outer frame 21. Then, the turntable 11 and the outer frame 21 are driven by the first driving member 12 to continue to move upward, and the inner frame 22 will move upward synchronously. When the turntable 11 moves up to the set height, the bonded chip 52 and the substrate 51 are placed on the workbench. Then, the turntable 11 is driven by the first driving member 12 to move downward, and at the same time, the outer frame 21, the airbag 3 and the cleaning mud 4 are driven to move downward. During this process, the lower end of the inner frame 22 will first contact the surface of the substrate 51, and at the same time, the lower end of the cleaning mud 4 just contacts the surface of the chip 52, and the impurities on the surface of the chip 52 are removed by its adsorption performance. Then, as the turntable 11 and the outer frame 21 continue to move downward, the inner frame 22 and the cleaning mud 4 remain stationary. During this process, the airbag 3 is compressed, and the gas inside it is discharged outward through the air outlet 31 and flows downward along the air duct 224, and then flows into the channel formed between the two partition plates 222 from the air port 221, and the bonding wires 54 are purged and cleaned until the lower end of the outer frame 21 contacts the surface of the substrate 51, and the assembly between the outer frame 21, the inner frame 22 and the substrate 51 is completed.

[0050] Subsequently, the third driving member is turned off, the adsorption of the outer frame 21 by the suction cup 15 is released, and the turntable 11, the airbag 3 and the cleaning mud 4 are driven by the first driving member 12 to move upward synchronously and withdraw from the inside of the inner frame 22. Then, the turntable 11 is driven by the second driving member 13 to rotate 180 degrees, so that the upper end of the turntable 11 faces downward. Then, the turntable 11 is driven by the first driving member 12 to move downward again, and the cover plate 23 is pressed on the upper end of the outer frame 21 to complete the automatic installation of the outer frame 21 and the cover plate 23, and a filling cavity is formed between the cover plate 23, the outer frame 21 and the substrate 51. Then, the solenoid valve is opened, and the epoxy resin glue stored in the turntable 11 is injected into the filling cavity. The glue will flow into the accommodating cavity through the air port 221. As the glue in the accommodating cavity gradually overflows, the glue can enter the inside of the chute 211 through the opening at the lower end of the chute 211 and flow upward along the inner wall of the chute 211. After the glue injection is completed, the solenoid valve is closed, the turntable 11 is driven by the first driving member 12 to move upward, and then the turntable 11 is driven by the second driving member 13 to rotate and reset. The encapsulated chip 52 is sent to the next process for curing treatment to ensure that the glue is completely cured, and a complete chip 52 module is obtained.

[0051] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A chip packaging structure, comprising a packaging machine (1), and a workbench is provided on the packaging machine (1), characterized in that, It also includes a sealing structure and a cleaning mechanism; The sealing structure includes an outer frame (21) and an inner frame (22). The inner frame (22) is longitudinally slidably installed inside the outer frame (21), and there is a receiving cavity for accommodating bonding wires (54) between the two. Air vents (221) are provided at positions corresponding to each bonding wire (54) on the side wall of the inner frame (22). A multi-component separator is installed on the outer wall of the inner frame (22). Each component separator includes two partitions (222), and the two partitions (222) are respectively installed on both sides of the air vent (221). A turntable (11) and a first driving member (12) are installed on the encapsulation machine (1). The first driving member (12) is used to drive the turntable (11) to move longitudinally. An adsorbing member for adsorbing the outer frame (21) is provided at the lower end of the turntable (11); The cleaning mechanism includes a purging member and a cleaning member. The purging member is installed at the lower end of the turntable (11). An air outlet hole (31) capable of communicating with the air vent (221) is provided on the purging member. After the gas in the purging member is discharged from the air outlet hole (31), it will flow through the air vent (221) into the channel formed between the two partitions (222) to purge the bonding wires (54). The cleaning member is installed at the lower end of the purging member and can clean the impurities on the surface of the chip (52), and the distance between the cleaning member and the turntable (11) can be adapted to the up and down movement of the turntable (11).

2. A chip packaging structure according to claim 1, characterized in that, The sealing structure further includes a cover plate (23). The cover plate (23) can close the upper end of the outer frame (21) so as to form a filling cavity for filling glue by enclosing the outer frame (21), the inner frame (22) and the cover plate (23). A cavity for accommodating glue is provided inside the turntable (11). A pipe (111) communicating with the inside of the turntable (11) is connected to the upper end of the turntable (11). A through hole (231) is provided on the cover plate (23). The cover plate (23) can be installed outside the pipe (111) through the through hole (231). A second driving member (13) for driving the turntable (11) to rotate is provided on the encapsulation machine (1).

3. A chip packaging structure according to claim 1, wherein, A chute (211) is longitudinally arranged on the inner wall of the outer frame (21). A slider (223) is fixedly installed on the outer wall of the inner frame (22). The inner frame (22) is longitudinally slidably matched with the chute (211) through the slider (223). An opening is provided at the lower end of the chute (211) so that the inside of the chute (211) communicates with the receiving cavity. The width of the opening is smaller than the width of the slider (223) to prevent the slider (223) from disengaging from the chute (211).

4. A chip packaging structure according to claim 1, characterized in that, The adsorbing member includes a plurality of suction cups (15) and a third driving member for driving the suction cups (15) to adsorb. Mounting parts for installing the suction cups (15) are provided on both sides of the turntable (11). The lower ends of the suction cups (15) and the lower end of the turntable (11) are at the same height.

5. A chip packaging structure according to claim 4, wherein, The purging member is an airbag (3). The airbag (3) is installed at the lower end of the turntable (11). The airbag (3) is formed by an elastic material. The air outlet hole (31) is provided on the side wall of the airbag (3). When the adsorbing member adsorbs the outer frame (21), the lower end of the turntable (11) can close the upper end of the outer frame (21).

6. A chip packaging structure according to claim 5, characterized in that, The cleaning part is a cleaning mud (4), the cleaning mud (4) is formed by a flexible material, a housing (41) is installed at the lower end of the airbag (3), the shape of the housing (41) is adapted to the shape inside the inner frame (22), the lower end of the housing (41) is open, and the cleaning mud (4) is detachably installed in the housing (41).

7. A chip packaging structure according to claim 2, characterized in that The first driving part (12) is arranged on the encapsulator (1), and the output end extends vertically downward. The output end of the first driving part (12) is connected with a U-shaped frame (14), the turntable (11) is rotatably installed on the U-shaped frame (14), and the second driving part (13) is installed on the U-shaped frame (14), and the output end extends horizontally.

8. A chip packaging structure according to claim 1, characterized in that, An air passage (224) is longitudinally formed on the inner wall of the inner frame (22), the lower end of the air passage (224) is communicated with the air port (221), so that the air outlet hole (31) is communicated with the air port (221) through the air passage (224).

9. A chip packaging structure according to claim 1, characterized in that, One side of each of the two partition plates (222) is beveled, and the bevel slopes downward and away from the other partition plate (222) from top to bottom.

10. A chip packaging structure according to claim 1, characterized in that, Notches for accommodating the pins (53) are provided at the lower ends of the outer frame (21) and the inner frame (22).

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