A packaging control system for multi-chip production

Abstract

The present invention discloses a packaging control system for multi-chip production, which relates to the field of chip packaging technology. In the present invention, the first guide track and the second guide track are both connected to the conversion installation port, the first guide track is connected to the second guide track, and a plastic packaging component 1 and a plastic packaging component 2 are provided on one side of the conversion installation port. The track conversion component includes a third guide track connected to the first guide track, the lifting control component is provided with a flip control component, the support plate is provided with a hollow negative pressure part for adsorbing the chip, and the support plate is provided with four groups of elastic guide parts in a circumferential array. Through the combined action of the first guide track, the second guide track and the track conversion component, the present invention can enable the chip to achieve a 90° rotation in the same direction during the transportation process between the plastic packaging component 1 and the plastic packaging component 2, thereby realizing the plastic packaging processing of the four side surfaces of the chip on a closed-loop circuit. The efficiency of the chip packaging work is improved by this closed-loop circuit plastic packaging method.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip packaging, and in particular relates to a packaging control system for multi-chip production. Background Art

[0002] A chiplet, also known as a core particle or chiplet, is a type of die (bare die) that meets specific functions. Using die-to-die interconnect technology, multiple module chips are packaged together with the underlying base chip to form a system-on-chip, enabling a new form of IP reuse. Current mainstream system-on-chip (SoC) designs utilize photolithography to fabricate multiple computing units responsible for different types of tasks onto a single wafer. Chiplet+chiplet takes a complex SoC chip and decomposes it into distinct computing or functional units from the outset. Each unit is then manufactured separately using the most suitable semiconductor process. Advanced packaging technologies are then used to interconnect these units, ultimately integrating and packaging them into a system-on-chip set.

[0003] In the multi-chip manufacturing process, after completing the manufacturing of a single chip, it is often necessary to perform plastic sealing on its surroundings. The plastic sealing process is to use a polyester film coated with hot melt adhesive to bond the sealed items inside the plastic film through a laminating machine. Since the processing is carried out under a certain pressure and high temperature, and uses high-quality polyester film and hot melt adhesive with good transparency, the chip needs to be encapsulated and protected with plastic sealing resin after bonding at a certain pressure and temperature during production. The entire process requires the use of plastic sealing equipment.

[0004] However, existing chip encapsulation processes mostly involve directly securing the chip to a molding table. After encapsulating one side of the chip, the chip must be removed from the molding table, flipped over, and reattached to the molding table before encapsulating the other side. This encapsulation process requires frequent chip removal and repositioning, significantly impacting chip encapsulation efficiency. To address this issue, we have developed a packaging control system for multi-chip production to address these challenges. Summary of the Invention

[0005] The object of the present invention is to provide a packaging control system for multi-chip production, which solves the problems in the above-mentioned background technology through the specific structural design of the plastic sealing mechanism, trajectory conversion component and chip conveying mechanism.

[0006] In order to solve the above technical problems, the present invention is achieved through the following technical solutions: The present invention is a packaging control system for multi-core particle production, including a plastic sealing mechanism, the plastic sealing mechanism including a conversion installation port, a first guide track and a second guide track, the first guide track and the second guide track are both connected to the conversion installation port, the first guide track is connected to the second guide track, and a plastic sealing component 1 and a plastic sealing component 2 are provided on one side of the conversion installation port; a track conversion component, the track conversion component is rotatably installed inside the conversion installation port, the track conversion component includes a third guide track connected to the first guide track, when the control track is converted When the switching assembly rotates 180°, the third guide track is connected to the second guide track; the chip conveying mechanism, the chip conveying mechanism includes a lifting control assembly slidably arranged on the plastic sealing mechanism, and the lifting control assembly is provided with a flip control assembly; wherein, the flip control assembly includes a synchronously rotating support disk and a support plate, the support plate is provided with a hollow negative pressure part for adsorbing the chip, and four groups of elastic guide parts are arranged in a circumferential array on the support disk, and the elastic guide part includes a guide wheel part, and an electromagnet that magnetically repels the corresponding guide wheel part is installed on the support disk, and the chip is rotated 90° when the guide wheel part is controlled to pass through the third guide track.

[0007] In some embodiments, the molding mechanism also includes a molding carrier frame, the conversion mounting port is arranged on the molding carrier frame, and horizontal guide rails are fixedly arranged on the top and bottom of the molding carrier frame. The molding component one and the molding component two are both installed on the inner side of the molding carrier frame and arranged relative to each other. A power screw is rotatably arranged at the bottom of the molding carrier frame, and the power screw is connected to the output end of the power motor on the molding carrier frame.

[0008] In some embodiments, the first guide track includes a first guide groove and a second guide groove arranged on both sides of the conversion mounting port, the second guide groove is arranged above the first guide groove and both are connected to the conversion mounting port; the second guide track includes a third guide groove and a fourth guide groove arranged on both sides of the conversion mounting port, the fourth guide groove is arranged below the third guide groove and both are connected to the conversion mounting port, the third guide groove is connected to the second guide groove above it through a descending groove, and the fourth guide groove is connected to the first guide groove above it through an ascending groove.

[0009] In some embodiments, the trajectory conversion assembly also includes a trajectory conversion disk rotatably installed inside the conversion mounting port, a support ring is fixedly provided on one side of the trajectory conversion disk, an outer gear ring is fixedly provided on the circumferential side of the support ring, and the third guide track is provided on the other side of the trajectory conversion disk, and the third guide track is composed of a first conversion groove, a second conversion groove and an arc-shaped conversion groove, and the arc-shaped conversion groove is connected with the first conversion groove and the second conversion groove on both sides thereof, and the arc-shaped conversion groove is a quarter-circle structure.

[0010] In some embodiments, the lifting control assembly includes a U-shaped mounting frame mounted on a plastic-sealed carrier frame, the U-shaped mounting frame is provided with a limiting groove that slides with a horizontal guide rail, a support frame is fixedly provided on the top of the U-shaped mounting frame, a lifting cylinder is installed on the support frame, an internal threaded plate mounted on the power screw is fixed at the bottom of the U-shaped mounting frame, the internal threaded plate is threadedly connected to the power screw, a limiting channel and a limiting guide seat are provided on one side of the U-shaped mounting frame, and a U-shaped lifting plate connected to the output end of the lifting cylinder is provided on the inner side of the U-shaped mounting frame.

[0011] In some embodiments, the flip control assembly also includes a lifting frame slidably arranged on a limiting guide seat, and a first rotating shaft and a second rotating shaft are rotatably arranged on the lifting frame respectively, one end of the first rotating shaft passes through the limiting channel and the U-shaped lifting plate and is fixedly connected to the support plate, and a first transmission wheel is fixedly installed on the other end of the first rotating shaft, a positioning plate rotatably connected to the U-shaped lifting plate is fixed on the peripheral side of the first rotating shaft, and a second transmission wheel is fixedly installed on the peripheral side of the second rotating shaft, and the first transmission wheel and the second transmission wheel are connected by a transmission belt, and the support plate is fixedly arranged at the end of the second rotating shaft, and a negative pressure generator for controlling the negative pressure in the inner cavity of the hollow negative pressure part is installed on the support plate.

[0012] In some embodiments, the elastic guide portion also includes a first movable rod slidably arranged at an eccentric position of the support plate, a connecting plate fixed at one end of the first movable rod is connected to the support plate through a first elastic member, the guide wheel member is installed at the other end of the first movable rod, and pressure sensors are installed at the top and bottom of the U-shaped mounting frame.

[0013] In some embodiments, a first guide member is slidingly provided inside the second guide groove, a through groove is opened inside the second guide groove, a first magnetic plate fixed to the first guide member is provided on the outside of the plastic-sealed carrier frame, a conversion tooth plate meshing with the outer gear ring is fixed on one side of the first magnetic plate, a second magnetic plate is fixedly installed on the end of the conversion tooth plate, and a second moving rod is fixedly provided on the other side of the first magnetic plate; a first locking plate and a second locking plate are respectively installed on the plastic-sealed carrier frame, an electromagnet and a pressure sensor are installed on the first locking plate, an electromagnet magnetically attracted to the second magnetic plate is installed on the second locking plate, the electromagnet on the first locking plate is magnetically attracted to the first magnetic plate, the second moving rod slides through the first locking plate, and the connecting disk fixed at the end of the second moving rod is connected to the first locking plate by a second elastic member.

[0014] In some embodiments, an extension channel connected to the fourth guide groove is provided on the plastic-sealed carrier, a moving part is slidably arranged inside the extension channel, a second guide part is slidably arranged inside the fourth guide groove, the second guide part is connected to the moving part through a linkage rod, a moving plate fixed to the moving part is provided on the outside of the plastic-sealed carrier, a signal triggering part is fixed on one side of the moving plate, the moving plate and the limit mounting plate on the plastic-sealed carrier are connected by a third elastic part, and a pressure sensor is installed on the limit mounting plate.

[0015] The present invention has the following beneficial effects: 1. Through the cooperation between the first guide track, the second guide track and the track conversion component, the present invention can enable the chip to be rotated 90° in the same direction during the transportation process between the plastic packaging component 1 and the plastic packaging component 2, thereby realizing the plastic packaging processing of the four side surfaces of the chip on a closed-loop circuit. This closed-loop circuit plastic packaging method improves the efficiency of the entire chip packaging work.

[0016] 2. In the present invention, when the guide wheel member slides along the second guide groove and pushes the first guide member to move synchronously, the first magnetic plate that moves synchronously with the first guide member drives the second moving rod to move and stretch the second elastic member. At the same time, the moving conversion tooth plate drives the entire track conversion assembly to rotate counterclockwise until the first magnetic plate is firmly adsorbed on the first locking plate. The entire track conversion assembly rotates 180° counterclockwise. Through this control method, the automatic rotation of the track conversion assembly is realized, thereby improving the degree of automation of the entire packaging equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 This is a schematic diagram of the structure of the packaging control system for multi-chip production in the present invention.

[0019] Figure 2 for Figure 1 Schematic diagram of the structure from another angle.

[0020] Figure 3 It is a structural schematic diagram of the plastic sealing mechanism in the present invention.

[0021] Figure 4 for Figure 3 Schematic diagram of the structure from another angle.

[0022] Figure 5 It is a structural cross-sectional view of the plastic sealing mechanism in the present invention.

[0023] Figure 6 for Figure 5 A magnified view of the local structure at point A.

[0024] Figure 7 for Figure 5 A magnified view of the local structure at point B in the middle.

[0025] Figure 8 Schematic diagram of the structure of the trajectory conversion component in the present invention.

[0026] Figure 9 for Figure 8 side view of the structure.

[0027] Figure 10 It is a structural schematic diagram of the chip conveying mechanism in the present invention.

[0028] Figure 11 It is a structural diagram of the lifting control component in the present invention.

[0029] Figure 12 for Figure 11 The structural front view.

[0030] Figure 13 Schematic diagram of the structure of the flip control component in the present invention.

[0031] Figure 14 for Figure 13 Rear view of the structure.

[0032] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0033] 1-plastic sealing mechanism, 101-conversion installation port, 102-plastic sealing component 1, 103-plastic sealing component 2, 104-plastic sealing carrier, 105-horizontal guide rail, 106-power screw, 107-power motor, 108-first guide groove, 109-second guide groove, 110-third guide groove, 111-fourth guide groove, 112-descending groove, 113-ascending groove, 114-first guide member, 115-through groove, 11 6-first magnetic plate, 117-conversion gear plate, 118-second magnetic plate, 119-second moving rod, 120-first locking plate, 121-second locking plate, 122-second elastic member, 123-extension channel, 124-moving member, 125-second guide member, 126-linking rod, 127-moving plate, 128-signal trigger part, 129-limit mounting plate, 130-third elastic member, 2-track conversion assembly, 201-third guide track, 202-track conversion disk, 203-support ring, 204-external gear ring, 205-first conversion groove, 206-second conversion groove, 207-arc conversion groove, 3-chip conveying mechanism, 4-lifting control assembly, 401-U-shaped mounting frame, 402-limiting groove, 403-support frame, 404-lifting cylinder, 405-internal thread plate, 406-limiting channel, 407-limiting guide seat, 4 08-U-shaped lifting plate, 5-flip control assembly, 501-support plate, 502-support plate, 503-hollow negative pressure part, 504-guide wheel, 505-lifting frame, 506-first rotating shaft, 507-second rotating shaft, 508-first transmission wheel, 509-positioning plate, 510-second transmission wheel, 511-transmission belt, 512-negative pressure generator, 513-first moving rod, 514-first elastic member, 6-chip. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0035] For specific embodiment 1, please refer to Figure 1-14The present invention is a packaging control system for multi-chip production, comprising a plastic sealing mechanism 1, a track conversion component 2 and a chip conveying mechanism 3; the plastic sealing mechanism 1 comprises a conversion installation port 101, a first guide track and a second guide track, the first guide track and the second guide track are both connected to the conversion installation port 101, the first guide track is connected to the second guide track, and a plastic sealing component 102 and a plastic sealing component 2 103 are provided on one side of the conversion installation port 101; the track conversion component 2 is rotatably mounted inside the conversion installation port 101, the track conversion component 2 comprises a third guide track 201 connected to the first guide track, when the control track conversion component 2 rotates 180 degrees, the third guide track 201 is connected to the second guide track; the chip conveying mechanism 3 comprises a sliding portion arranged on the plastic sealing mechanism The lifting control component 4 on the mechanism 1 is provided with a flipping control component 5; wherein, the flipping control component 5 includes a synchronously rotating support disk 501 and a support plate 502, the support plate 502 is provided with a hollow negative pressure portion 503 for adsorbing the chip 6, and four groups of elastic guide portions are arranged in a circumferential array on the support disk 501, the elastic guide portion includes a guide wheel member 504, and an electromagnet that magnetically repels the corresponding guide wheel member 504 is installed on the support disk 501. When the guide wheel member 504 is controlled to pass through the third guide track 201, the chip 6 is rotated 90° (in this way, the entire chip 6 can be flipped four times, and each time the flip is controlled to be flipped 90° to ensure that one side to be plasticized is arranged facing upward, so as to facilitate the plastic sealing process by the plastic sealing component 1 102 or the plastic sealing component 2 103).

[0036] In some embodiments, as Figure 3 、 Figure 4 and Figure 5 As shown, the plastic sealing mechanism 1 also includes a plastic sealing carrier frame 104, a conversion mounting port 101 is arranged on the plastic sealing carrier frame 104, and horizontal guide rails 105 are fixedly provided on the top and bottom of the plastic sealing carrier frame 104. The plastic sealing component 1 102 and the plastic sealing component 2 103 are both installed on the inner side of the plastic sealing carrier frame 104 and arranged relative to each other (the plastic sealing component 1 102 and the plastic sealing component 2 103 in this embodiment are both plastic sealing components commonly used in the prior art, which belong to the open conventional design, so their specific structure is not described here). A power screw 106 is rotatably provided at the bottom of the plastic sealing carrier frame 104, and the power screw 106 is connected to the output end of the power motor 107 on the plastic sealing carrier frame 104. The power motor 107 is controlled to open and close through the control system.

[0037] Furthermore, the first guide track includes a first guide groove 108 and a second guide groove 109 arranged on both sides of the conversion mounting port 101, the second guide groove 109 is arranged above the first guide groove 108 and both are connected to the conversion mounting port 101; the second guide track includes a third guide groove 110 and a fourth guide groove 111 arranged on both sides of the conversion mounting port 101, the fourth guide groove 111 is arranged below the third guide groove 110 and both are connected to the conversion mounting port 101, the third guide groove 110 and the second guide groove 109 above it are connected through a descending groove 112, and the fourth guide groove 111 and the first guide groove 108 above it are connected through an ascending groove 113 (that is, the second guide track presents a U-shaped structure, the first guide track is arranged above the second guide track and the two are connected).

[0038] In some embodiments, as Figure 1 、 Figure 8 and Figure 9 As shown, the trajectory conversion assembly 2 also includes a trajectory conversion disk 202 rotatably mounted inside the conversion mounting port 101, a support ring 203 is fixedly provided on one side of the trajectory conversion disk 202, and an outer gear ring 204 is fixedly provided on the side surface of the support ring 203, and the third guide track 201 is provided on the other side of the trajectory conversion disk 202, and the third guide track 201 is composed of a first conversion groove 205, a second conversion groove 206 and an arc-shaped conversion groove 207. The arc-shaped conversion groove 207 is connected to the first conversion groove 205 and the second conversion groove 206 on both sides thereof, and the arc-shaped conversion groove 207 is a quarter-circle structure. In the initial state, the first conversion groove 205 is aligned with the first guide groove 108 and the two are connected, and the second conversion groove 206 is aligned with the second guide groove 109 and the two are connected. The entire chip conveying mechanism 3 is in the initial position (as shown in FIG. Figure 1 shown).

[0039] In some embodiments, as Figure 1 、 Figure 11 and Figure 12As shown, the lifting control assembly 4 includes a U-shaped mounting frame 401 sleeved on the plastic-sealed carrier frame 104, a limiting groove 402 is provided on the U-shaped mounting frame 401 to slide with the horizontal guide rail 105, a support frame 403 is fixedly provided on the top of the U-shaped mounting frame 401, a lifting cylinder 404 is installed on the support frame 403, and an internal thread plate 405 sleeved on the power screw 106 is fixed on the bottom of the U-shaped mounting frame 401, and the internal thread plate 405 is threadedly connected to the power screw 106 through the limiting groove 402. The matching relationship between the horizontal guide rail 105 and the matching relationship between the internal threaded plate 405 and the power screw 106 can realize the smooth reciprocating sliding of the entire lifting control component 4 along the plastic-sealed carrier frame 104. A limiting channel 406 and a limiting guide seat 407 are provided on one side of the U-shaped mounting frame 401. A U-shaped lifting plate 408 connected to the output end of the lifting cylinder 404 is provided on the inner side of the U-shaped mounting frame 401. In the initial state, the top of the U-shaped lifting plate 408 is against the top inside the U-shaped mounting frame 401.

[0040] In some embodiments, as Figure 1 、 Figure 13 and Figure 14 As shown, the flip control assembly 5 also includes a lifting frame 505 slidably arranged on the limiting guide seat 407 (the cooperation between the lifting frame 505 and the limiting guide seat 407 ensures the smooth up and down movement of the entire flip control assembly 5), and a first rotating shaft 506 and a second rotating shaft 507 are rotatably arranged on the lifting frame 505. One end of the first rotating shaft 506 passes through the limiting channel 406 and the U-shaped lifting plate 408 and is fixedly connected to the support plate 501 (when the U-shaped lifting plate 408 is controlled to move up and down, the first rotating shaft 506 can be driven to slide along the limiting channel 406, and in the initial state, the first rotating shaft 506 is against the top of the limiting channel 406). A first transmission wheel 508 is fixedly installed at the other end, a positioning plate 509 rotatably connected to the U-shaped lifting plate 408 is fixed to the side surface of the first rotating shaft 506, and a second transmission wheel 510 is fixedly installed on the side surface of the second rotating shaft 507. The first transmission wheel 508 and the second transmission wheel 510 are connected by a transmission belt 511, and the support plate 502 is fixedly set at the end of the second rotating shaft 507 (so that synchronous rotation between the support plate 501 and the support plate 502 can be achieved), and a negative pressure generator 512 for controlling the negative pressure in the inner cavity of the hollow negative pressure part 503 is installed on the support plate 502 (the negative pressure generator 512 is a conventional device in the prior art, so its structure is not described in detail).

[0041] When a chip 6 (the chip 6 is a single-core structure in a multi-core structure, which includes a conventional chip and a metal circuit layer) is pressed against the surface of the hollow negative pressure part 503, the negative pressure environment of the inner cavity of the hollow negative pressure part 503 is controlled by the negative pressure generator 512, so that the chip 6 is tightly adsorbed and fixed on the hollow negative pressure part 503, so that the position of the chip 6 on the hollow negative pressure part 503 is fixed. At this time, there is a certain distance between the top surface (first side) of the chip 6 and the plastic packaging component 102. Then, the U-shaped lifting plate 408 is controlled by the lifting cylinder 404 to move upward until it rests against the top of the U-shaped mounting frame 401. At this time, the first rotating shaft 506 just rests against the top of the limiting channel 406, and the first rotating shaft 506 is just aligned with the intersection of the first guide groove 108 and the rising groove 113. The top surface (first side) of the chip 6 is close to the bottom of the plastic packaging component 102. During the process, a guide wheel part 504 is slidably fitted inside the rising groove 113 (that is, the lower guide wheel part 504 is fitted in the rising groove 113, and the electromagnet at this position is in an energized and magnetic state, so that the lower guide wheel part 504 is inserted into the rising groove 113 under the action of the magnetic repulsion force). In the process of controlling the entire flip control component 5 to move upward by the lifting cylinder 404, the lower guide wheel part 504 gradually slides upward along the rising groove 113 from the intersection of the fourth guide groove 111 and the rising groove 113, and then the plastic sealing treatment of the top surface (first side) of the chip 6 is realized by the plastic sealing component 1 102 (of course, the plastic sealing component 1 102 and the plastic sealing component 2 103 can also be designed as a structure that can fine-tune the height up and down, for example, the height of the plastic sealing component 102 and the plastic sealing component 2 103 can be fine-tuned by the cylinder, and the specific setting is based on actual production needs) (step one).

[0042] Next, the electromagnet at the position of the first guide groove 108 is controlled to be energized and magnetized, and the corresponding guide wheel component 504 is inserted into the first guide groove 108 under the action of the magnetic repulsive force, and then the electromagnet at the lower position is controlled to be de-energized and demagnetized so that the lower guide wheel component 504 is separated from the rising groove 113 (that is, at this time only one guide wheel component 504 is fitted in the first guide groove 108, and the guide wheel components 504 in other directions are in their original state). Then, the power motor 107 controls the power screw 106 to rotate and drive the entire chip conveying mechanism 3 to move with the chip 6 toward the direction of the plastic packaging component 2 103. When the guide wheel component 504 in the first guide groove 108 enters the first conversion groove 205 and slides into the second conversion groove 206 along the arc conversion groove 207, the support plate 501 rotates clockwise under the action of the arc conversion groove 207. After rotating 90°, under the joint action of the first transmission wheel 508, the second transmission wheel 510 and the transmission belt 511, the hollow negative pressure part 503 on the support plate 502 rotates 90° clockwise. At this time, the top surface (second side) of the chip 6 faces upward until the guide wheel member 504 slides along the second guide groove 109 into the intersection of the second guide groove 109 and the descending groove 112. At this time, the first rotating shaft 506 is just aligned with the descending groove 112, and the top surface (second side) of the chip 6 is close to the bottom of the second plastic packaging component 103. Then, the trajectory conversion component 2 is controlled to rotate 180° counterclockwise, so that the first conversion groove 205 is aligned with the third guide groove 110 and the two are connected, and the second conversion groove 206 is aligned with the fourth guide groove 111 and the two are connected. At the same time, the plastic packaging processing of the top surface (second side) of the chip 6 is realized by the second plastic packaging component 103 (step 2).

[0043] Next, the entire flip control assembly 5 is controlled to move downward by the lifting cylinder 404 until the bottom of the U-shaped lifting plate 408 abuts against the bottom of the U-shaped mounting frame 401. At this time, the first rotating shaft 506 just abuts against the bottom of the limiting channel 406, and the first rotating shaft 506 just aligns with the intersection of the descending groove 112 and the third guide groove 110. The electromagnet at the position of the third guide groove 110 is controlled to be energized and magnetized. Under the action of the magnetic repulsive force, the corresponding guide wheel 504 is inserted into the third guide groove 110, and then the upper The electromagnet at the position is powered off and demagnetized, so that the upper guide wheel 504 is separated from the descending groove 112 (that is, at this time, only one guide wheel 504 is fitted in the third guide groove 110, and the guide wheels 504 in other directions are in their original state). Then, the power motor 107 controls the power screw 106 to rotate and drive the entire chip conveying mechanism 3 to move with the chip 6 toward the direction of the plastic packaging component 102. When the guide wheel 504 in the third guide groove 110 enters the first conversion groove 205 and rotates along the arc During the process of the slot change 207 sliding into the second conversion slot 206, the support plate 501 rotates 90° clockwise again under the action of the arc-shaped conversion slot 207. Under the joint action of the first transmission wheel 508, the second transmission wheel 510 and the transmission belt 511, the hollow negative pressure portion 503 on the support plate 502 rotates 90° clockwise again. At this time, the top surface (third side surface) of the chip 6 faces upward until the guide wheel member 504 slides along the fourth guide slot 111 into the intersection of the fourth guide slot 111 and the rising slot 113. At this time, the first rotating shaft 506 is just aligned with the rising groove 113, and then the lifting cylinder 404 is used to control the entire flip control component 5 to move upward to complete the reset. At this time, the top surface (the third side) of the chip 6 is close to the bottom of the plastic packaging component 102, and the first rotating shaft 506 is just aligned with the intersection of the first guide groove 108 and the rising groove 113. Then the trajectory conversion component 2 is controlled to rotate 180° in the opposite direction to complete the reset, and at the same time, the plastic packaging component 102 is used to realize the plastic packaging process of the top surface (the third side) of the chip 6 (step three).

[0044] Next, the electromagnet at the position of the first guide groove 108 is controlled to be energized and magnetized again, and the corresponding guide wheel member 504 is inserted into the first guide groove 108 under the action of the magnetic repulsive force. Then, the electromagnet at the lower position is controlled to be de-energized and demagnetized so that the lower guide wheel member 504 is separated from the ascending groove 113 (that is, at this time only one guide wheel member 504 is fitted in the first guide groove 108, and the guide wheel members 504 in other directions are in their original state). Then, the power motor 107 is used to control the power screw 106 to rotate and drive the entire chip conveying mechanism 3 to carry the chip 6 toward the direction close to the plastic packaging component 2 103. Move until the guide wheel member 504 slides along the second guide groove 109 into the intersection of the second guide groove 109 and the descending groove 112. At this time, the first rotating shaft 506 is just aligned with the descending groove 112, and the top surface (fourth side) of the chip 6 is close to the bottom of the second plastic packaging component 103. Then, the trajectory conversion component 2 is controlled to rotate 180° counterclockwise again, so that the first conversion groove 205 is aligned with the third guide groove 110 and the two are connected, and the second conversion groove 206 is aligned with the fourth guide groove 111 and the two are connected. At the same time, the plastic packaging processing of the top surface (fourth side) of the chip 6 is realized through the second plastic packaging component 103 (step four).

[0045] Next, the entire chip conveying mechanism 3 is controlled to move the chip 6 to the position of the plastic packaging component 102 (that is, the chip conveying mechanism 3 returns to the initial position) in the same control method as step three. At this time, the top surface (first side surface) of the chip 6 is facing upward again, and the guide wheel 504 slides along the fourth guide groove 111 to the intersection of the fourth guide groove 111 and the ascending groove 113. At this time, the first rotating shaft 506 is just aligned with the ascending groove 113, thus completing the plastic packaging process of the four sides of the chip 6. Subsequently, the negative pressure generator 512 is used to control the release of the negative pressure environment in the inner cavity of the hollow negative pressure part 503, so that the chip 6 falls off the hollow negative pressure part 503 for collection. After the next chip 6 is adsorbed and fixed on the hollow negative pressure part 503, the plastic packaging process can be continued in the same control method as above.

[0046] Specific embodiment 2, based on specific embodiment 1, as Figure 11 and Figure 13As shown, the elastic guide portion also includes a first moving rod 513 slidably arranged at an eccentric position of the support plate 501, and a connecting plate fixed at one end of the first moving rod 513 is connected to the support plate 501 through a first elastic member 514. The guide wheel member 504 is installed at the other end of the first moving rod 513. Pressure sensors are installed at the top and bottom of the U-shaped mounting bracket 401. When the electromagnet at a certain position on the control support plate 501 is energized and magnetized, the guide wheel member 504 moves and is inserted into the guide groove at the corresponding position under the action of the magnetic repulsive force. At this time, the first elastic member 514 at this position is compressed, and the guide wheel member 504 is installed on the U-shaped mounting bracket 401. A pressure sensor is provided at both the inner top and the inner bottom. When the U-shaped lifting plate 408 is controlled to move downward until the bottom of the U-shaped lifting plate 408 abuts against the inner bottom of the U-shaped mounting frame 401, the pressure sensor at the inner bottom of the U-shaped mounting frame 401 transmits the pressure signal to the control system, which controls the closure of the lifting cylinder 404. When the U-shaped lifting plate 408 is controlled to move upward until the top of the U-shaped lifting plate 408 abuts against the inner top of the U-shaped mounting frame 401, the pressure sensor at the inner top of the U-shaped mounting frame 401 transmits the pressure signal to the control system, which controls the closure of the lifting cylinder 404.

[0047] In some embodiments, as Figure 4 、 Figure 5 、 Figure 6 and Figure 7As shown, a first guide member 114 is slidingly provided inside the second guide groove 109, a through groove 115 is opened inside the second guide groove 109, a first magnetic plate 116 fixed to the first guide member 114 is provided on the outside of the plastic-sealed carrier 104, a conversion tooth plate 117 engaged with the outer gear ring 204 is fixed on one side of the first magnetic plate 116, a second magnetic plate 118 is fixedly installed on the end of the conversion tooth plate 117, and a second moving rod 119 is fixedly provided on the other side of the first magnetic plate 116; the plastic-sealed carrier 1 04, a first locking plate 120 and a second locking plate 121 are respectively installed. The first locking plate 120 is installed with an electromagnet and a pressure sensor. The second locking plate 121 is installed with an electromagnet that is magnetically attracted to the second magnetic plate 118. The electromagnet on the first locking plate 120 is magnetically attracted to the first magnetic plate 116. The second movable rod 119 slides through the first locking plate 120. The connecting disk fixed at the end of the second movable rod 119 is connected to the first locking plate 120 via a second elastic member 122.In the initial state, the electromagnet on the second locking plate 121 is in a powered and magnetized state. The second magnetic plate 118 is firmly adsorbed on the second locking plate 121 under the action of a strong magnetic attraction. When the guide wheel 504 slides from the second conversion slot 206 into the second guide slot 109, the electromagnet on the second locking plate 121 is controlled to be powered off and demagnetized. At the same time, the electromagnet on the first locking plate 120 is controlled to be powered on and magnetized. As the guide wheel 504 slides along the second guide slot 109 and pushes the first guide member 114 to move synchronously, the first magnetic plate 118 that moves synchronously with the first guide member 114 is 116 drives the second moving rod 119 to move and stretch the second elastic member 122, and at the same time the moving conversion gear plate 117 drives the entire track conversion assembly 2 to rotate counterclockwise until the first magnetic plate 116 abuts against the first locking plate 120 (at this time the first magnetic plate 116 is firmly adsorbed on the first locking plate 120), and the entire track conversion assembly 2 rotates 180 degrees counterclockwise. At this time, the guide wheel member 504 just moves to the intersection of the second guide groove 109 and the descending groove 112. At this time, the first rotating shaft 506 just aligns with the descending groove 112, and the first locking plate 120 is firmly adsorbed on the first locking plate 120. The pressure sensor transmits the pressure signal to the control system, which controls the power motor 107 to be turned off. After the plastic sealing process of a certain side of the chip 6 is completed by the plastic sealing component 2 103, the U-shaped lifting plate 408 is controlled to move downward so that the guide wheel 504 at the intersection of the second guide groove 109 and the descending groove 112 enters the interior of the descending groove 112 until the first rotating shaft 506 is just aligned with the intersection of the descending groove 112 and the third guide groove 110. When the control system receives the pressure signal from the pressure sensor at the bottom of the U-shaped mounting frame 401, it controls the start of the power. Motor 107 drives the entire chip conveyor mechanism 3, carrying the chip 6, back to the position of plastic package assembly 102. It then de-energizes the electromagnet on the first locking plate 120 and simultaneously energizes the electromagnet on the second locking plate 121. Under the elastic restoring force of the second elastic member 122, the conversion gear plate 117 moves in the opposite direction, driving the entire trajectory conversion assembly 2 to rotate 180° in the opposite direction to complete the reset (the entire trajectory conversion assembly 2 is made of lightweight material). At this point, the second magnetic plate 118 is firmly attached to the second locking plate 121 again under the strong magnetic attraction.

[0048] In some embodiments, as Figure 4 and Figure 7As shown, the plastic packaging carrier 104 is provided with an extension channel 123 connected to the fourth guide groove 111, and a moving part 124 is slidably provided inside the extension channel 123. A second guide part 125 is slidably provided inside the fourth guide groove 111. The second guide part 125 is connected to the moving part 124 through a linkage rod 126. A moving plate 127 fixed to the moving part 124 is provided on the outside of the plastic packaging carrier 104. A signal trigger part 128 is fixedly provided on one side of the moving plate 127. The moving plate 127 is connected to the limiting mounting plate 129 on the plastic packaging carrier 104 through a third elastic member 130. A pressure sensor is installed on the limiting mounting plate 129. When the power motor 107 drives the entire chip conveying mechanism 3 to move the chip 6 back to the plastic packaging component 102 position, the chip 6 moves along the fourth guide groove. The guide wheel member 504 sliding inside 111 pushes the second guide member 125 to move, and the movable member 124 moving synchronously with the second guide member 125 drives the movable plate 127 to move and compresses the third elastic member 130 until the signal triggering part 128 rests on the limit mounting plate 129. At this time, the control system receives the pressure signal from the pressure sensor on the limit mounting plate 129, and controls to shut down the power motor 107. The guide wheel member 504 sliding along the fourth guide groove 111 just moves to the intersection of the fourth guide groove 111 and the rising groove 113. When the entire flip control assembly 5 is controlled to move upward and complete the reset by the lifting cylinder 404, the signal triggering part 128 completes the reset under the elastic restoring force of the third elastic member 130, and the second guide member 125 returns to the fourth guide groove 111.

[0049] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0050] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the content of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A packaging control system for multi-chip production, characterized in that: include: A plastic sealing mechanism (1), the plastic sealing mechanism (1) comprising a conversion installation port (101), a first guide track and a second guide track, the first guide track and the second guide track both being connected to the conversion installation port (101), the first guide track being connected to the second guide track, and a plastic sealing component 1 (102) and a plastic sealing component 2 (103) being provided on one side of the conversion installation port (101); A track conversion assembly (2), the track conversion assembly (2) being rotatably mounted inside the conversion mounting port (101), the track conversion assembly (2) comprising a third guide track (201) communicating with the first guide track, and when the track conversion assembly (2) is controlled to rotate 180°, the third guide track (201) is connected to the second guide track; A chip conveying mechanism (3), the chip conveying mechanism (3) comprising a lifting control component (4) slidably arranged on the plastic sealing mechanism (1), the lifting control component (4) being provided with a flipping control component (5); The flip control assembly (5) comprises a synchronously rotating support disc (501) and a support plate (502), the support plate (502) being provided with a hollow negative pressure portion (503) for adsorbing the chip (6), the support disc (501) being provided with four groups of elastic guide portions in a circumferential array, the elastic guide portions comprising guide wheel members (504), and the support disc (501) being provided with an electromagnet that magnetically repels the corresponding guide wheel member (504), so that when the guide wheel member (504) passes through the third guide track (201), the chip (6) is rotated 90°. The third guide track (201) consists of a first conversion groove (205), a second conversion groove (206) and an arc-shaped conversion groove (207); the arc-shaped conversion groove (207) is connected to the first conversion groove (205) and the second conversion groove (206) on both sides thereof; the arc-shaped conversion groove (207) is a quarter-circle structure.

2. A packaging control system for multi-chip production according to claim 1, characterized in that: The plastic packaging mechanism (1) further comprises a plastic packaging carrier (104), the conversion mounting port (101) is arranged on the plastic packaging carrier (104), the top and bottom of the plastic packaging carrier (104) are fixedly provided with horizontal guide rails (105), the plastic packaging component 1 (102) and the plastic packaging component 2 (103) are both installed on the inner side of the plastic packaging carrier (104) and arranged relative to each other, and a power screw (106) is rotatably provided at the bottom of the plastic packaging carrier (104), and the power screw (106) is connected to the output end of a power motor (107) on the plastic packaging carrier (104).

3. A packaging control system for multi-chip production according to claim 2, characterized in that: The first guide track comprises a first guide groove (108) and a second guide groove (109) arranged on both sides of the conversion installation opening (101), the second guide groove (109) being arranged above the first guide groove (108) and both being in communication with the conversion installation opening (101); The second guide track comprises a third guide groove (110) and a fourth guide groove (111) arranged on both sides of the conversion installation opening (101); the fourth guide groove (111) is arranged below the third guide groove (110) and both are connected to the conversion installation opening (101); the third guide groove (110) is connected to the second guide groove (109) above it via a descending groove (112); and the fourth guide groove (111) is connected to the first guide groove (108) above it via an ascending groove (113).

4. A packaging control system for multi-chip production according to claim 3, characterized in that: The track conversion assembly (2) further comprises a track conversion disk (202) rotatably mounted inside the conversion mounting port (101), a support ring (203) being fixedly mounted on one side of the track conversion disk (202), an outer gear ring (204) being fixedly mounted on a circumferential side of the support ring (203), and the third guide track (201) being disposed on the other side of the track conversion disk (202).

5. A packaging control system for multi-chip production according to claim 4, characterized in that: The lifting control assembly (4) includes a U-shaped mounting frame (401) sleeved on the plastic-encapsulated carrier frame (104), the U-shaped mounting frame (401) is provided with a limiting groove (402) that slides with the horizontal guide rail (105), a support frame (403) is fixedly provided on the top of the U-shaped mounting frame (401), a lifting cylinder (404) is installed on the support frame (403), an internal thread plate (405) sleeved on the power screw (106) is fixed on the bottom of the U-shaped mounting frame (401), the internal thread plate (405) is threadedly connected to the power screw (106), a limiting channel (406) and a limiting guide seat (407) are provided on one side of the U-shaped mounting frame (401), and a U-shaped lifting plate (408) connected to the output end of the lifting cylinder (404) is provided on the inner side of the U-shaped mounting frame (401).

6. A packaging control system for multi-chip production according to claim 5, characterized in that: The flip control assembly (5) further comprises a lifting frame (505) slidably arranged on the limiting guide seat (407), wherein a first rotating shaft (506) and a second rotating shaft (507) are rotatably arranged on the lifting frame (505), one end of the first rotating shaft (506) passes through the limiting channel (406) and the U-shaped lifting plate (408) and is fixedly connected to the support plate (501), and a first transmission wheel (508) is fixedly installed on the other end of the first rotating shaft (506), and the first rotating shaft (506) is rotatably arranged on the first rotating shaft (506). A positioning plate (509) is fixed on the side and is rotatably connected to the U-shaped lifting plate (408). A second transmission wheel (510) is fixedly installed on the side of the second rotating shaft (507). The first transmission wheel (508) and the second transmission wheel (510) are connected via a transmission belt (511). The support plate (502) is fixedly arranged at the end of the second rotating shaft (507). A negative pressure generator (512) for controlling the negative pressure in the inner cavity of the hollow negative pressure part (503) is installed on the support plate (502).

7. A packaging control system for multi-chip production according to claim 6, characterized in that: The elastic guide portion further comprises a first movable rod (513) slidably arranged at an eccentric position of the support plate (501); a connecting plate fixedly arranged at one end of the first movable rod (513) is connected to the support plate (501) via a first elastic member (514); the guide wheel member (504) is mounted at the other end of the first movable rod (513); and pressure sensors are mounted on the top and bottom of the U-shaped mounting frame (401).

8. The packaging control system for multi-chip production according to claim 7, characterized in that: A first guide member (114) is slidably provided inside the second guide groove (109), a through groove (115) is provided inside the second guide groove (109), a first magnetic plate (116) fixed to the first guide member (114) is provided on the outside of the plastic-encapsulated carrier (104), a conversion tooth plate (117) meshed with the outer tooth ring (204) is fixed on one side of the first magnetic plate (116), a second magnetic plate (118) is fixedly installed on the end of the conversion tooth plate (117), and a second moving rod (119) is fixedly provided on the other side of the first magnetic plate (116); The plastic-encapsulated carrier frame (104) is respectively mounted with a first locking plate (120) and a second locking plate (121), the first locking plate (120) is mounted with an electromagnet and a pressure sensor, the second locking plate (121) is mounted with an electromagnet that is magnetically attracted to the second magnetic plate (118), the electromagnet on the first locking plate (120) is magnetically attracted to the first magnetic plate (116), the second movable rod (119) slides through the first locking plate (120), and the connecting disk fixed at the end of the second movable rod (119) is connected to the first locking plate (120) via a second elastic member (122).

9. A packaging control system for multi-chip production according to claim 8, characterized in that: An extension channel (123) communicating with the fourth guide groove (111) is provided on the plastic-encapsulated carrier (104); a moving member (124) is slidably provided inside the extension channel (123); a second guide member (125) is slidably provided inside the fourth guide groove (111); the second guide member (125) is connected to the moving member (124) via a linkage rod (126); a moving plate (127) fixed to the moving member (124) is provided on the outside of the plastic-encapsulated carrier (104); a signal triggering portion (128) is fixedly provided on one side of the moving plate (127); the moving plate (127) is connected to a limit mounting plate (129) on the plastic-encapsulated carrier (104) via a third elastic member (130); and a pressure sensor is installed on the limit mounting plate (129).

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