Laminating device and laminating method

Abstract

The invention discloses a wafer combining device and a wafer combining method, the wafer combining device comprises a bearing assembly, a first bearing structure, a second bearing structure and a wafer combining assembly, the first bearing structure comprises a first bearing part for bearing a wafer, and the second bearing structure comprises a second bearing part for bearing a tray; the first driving mechanism is used for driving the first bearing structure and / or the second bearing structure to rotate along the first axis; the centering mechanism stretches out and draws back in the direction close to or away from the first axis so as to abut against the wafer and the tray; the orientation sensor is used for judging the directions of the wafer and the tray; the lifting mechanism is used for driving local parts of the wafer and / or the tray to ascend or descend; the bearing assembly further comprises at least one contraction mechanism, and the contraction mechanism drives the first bearing part to be switched between the contraction position and the bearing position relative to the first bearing structure. At the contraction position, the distance between the first bearing part and the first axis is greater than the radius of the wafer; in the bearing position, the distance between the first bearing part and the first axis is smaller than the radius of the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and particularly to a wafer bonding device and a wafer bonding method. Background Art

[0002] In the process of semiconductor manufacturing, wafers are usually picked up and placed from a tray in an automated manner (for example, in a manner of cooperation between a lifting mechanism and a manipulator). This picking and placing method places extremely high requirements on the center alignment accuracy of both the tray and the wafer. However, in semiconductor processes, the tray is prone to positional deviation after multiple translational and lifting movements, resulting in a reduction in the center alignment accuracy of both the tray and the wafer. In such a case, manual alignment operations on the tray and the wafer are often required, which are complex and affect the picking and placing efficiency of the wafer.

[0003] In addition, when performing the operation of placing the wafer on the tray (i.e., the wafer bonding operation), if the positions of the tray and the wafer have been corrected, and then the wafer is transported to the tray by the manipulator for wafer bonding, the wafer bonding accuracy between the wafer and the tray will be reduced due to the displacement generated by the manipulator, and even wafer bonding cannot be achieved. Therefore, it is necessary to adjust the wafer bonding method between the wafer and the tray. Summary of the Invention

[0004] The purpose of the present invention is to provide a wafer bonding device and a wafer bonding method. After calibrating the center positions of the wafer and the tray, when performing subsequent operations of adjusting the directions of the tray and the wafer and placing the wafer on the tray, the center positions or directions of the adjusted wafer or tray will no longer change, which can avoid frequent calibration and thus effectively improve the wafer bonding efficiency between the wafer and the tray.

[0005] To achieve the above purpose, the present invention is realized through the following technical solutions:

[0006] A wafer bonding device, comprising:

[0007] A main body part;

[0008] A loading component, which is arranged on the main body part and includes a first supporting structure and a second supporting structure. The first supporting structure includes a first supporting part for loading a wafer; the second supporting structure includes a second supporting part for loading a tray;

[0009] A first driving mechanism, connected to the loading component, for driving the first supporting structure and / or the second supporting structure to perform a rotational movement along a first axis to adjust the direction of the wafer and / or the tray;

[0010] A centering mechanism, which expands and contracts along a direction approaching or departing from the first axis to push against the wafer and the tray to calibrate the center positions of the wafer and the tray;

[0011] An orientation sensor, fixed relative to the main body portion, for determining the orientations of the wafer and the tray; and

[0012] A lifting mechanism, which can penetrate through the central position of the carrying assembly in the vertical direction for lifting and lowering movements, for driving a part of the wafer and / or the tray to move up or down. Wherein, the carrying assembly further includes at least one contraction mechanism, and the contraction mechanism drives the first supporting portion to switch between a contraction position and a carrying position relative to the first supporting structure; and when in the contraction position, the distance between the first supporting portion and the first axis is greater than the radius of the wafer; when in the carrying position, the distance between the first supporting portion and the first axis is less than the radius of the wafer.

[0013] Optionally, the centering mechanism includes:

[0014] A first centering portion, at the same horizontal height as the first supporting portion;

[0015] A second centering portion, at the same horizontal height as the second supporting portion; and

[0016] A second driving mechanism, connected to the first centering portion and the second centering portion, for driving the first centering portion and the second centering portion to perform telescopic movements of approaching or moving away from the first axis, so that the central axis of the wafer or the tray coincides with the first axis.

[0017] Optionally, the first supporting portion has a first bearing surface for bearing the wafer, and the first bearing surface is provided with multiple steps, and the height and width of a single step are not higher than 0.5 mm;

[0018] The second supporting portion has a second bearing surface for bearing the tray, and the second bearing surface is provided with multiple steps, and the height and width of a single step are not higher than 0.5 mm.

[0019] Optionally, the first supporting portion is located above the second supporting portion; when adjusting the orientation of the tray, the lifting mechanism supports the wafer and makes the wafer in a state of being separated from the first supporting portion.

[0020] Optionally, a first mark is provided on the wafer, and a second mark is provided on the tray, and the orientation sensor determines the orientations of the wafer or the tray based on detecting the first mark or the second mark;

[0021] The orientation sensor is electrically connected to the first driving mechanism. When the orientation sensor detects that the first mark or the second mark is located at a set position, a first driving mechanism stop signal is generated to adjust the orientation of the tray to be consistent with the orientation of the wafer.

[0022] Based on the same inventive concept, the present invention further provides a wafer bonding method using the wafer bonding device as described above. The tray is configured as a split tray having an inner tray and an outer tray or the tray is configured as an annular tray. The wafer bonding method includes:

[0023] Step S1: Place the wafer and the tray on the first supporting portion and the second supporting portion respectively, and calibrate the central positions of the wafer and the tray through the centering mechanism;

[0024] Step S2: Identify the orientations of the wafer and the tray, and adjust the orientation of the tray to be consistent with the orientation of the wafer. Wherein, if the first supporting structure and the second supporting structure are synchronously rotatably arranged, after directly or indirectly jacking up the wafer away from the first supporting portion through the lifting mechanism, then adjust the orientation of the tray to be consistent with the orientation of the wafer;

[0025] Step S3: After directly or indirectly jacking up the wafer away from the first supporting portion through the lifting mechanism, make the first supporting portion located at the retracted position; and

[0026] Step S4: Drive the wafer to fall downward through the lifting mechanism to place the wafer on the tray.

[0027] Optionally, the method for identifying the orientations of the wafer and the tray in step S2 includes: identifying the positions of the first mark on the wafer or the second mark on the tray, and using the polar angle of the first mark or the second mark in the preset polar coordinate system as the corresponding orientation of the wafer or the tray;

[0028] The method for adjusting the orientation of the tray to be consistent with the orientation of the wafer in step S2 includes: when the first driving mechanism only drives one of the first supporting structure and the second supporting structure to rotate, make the first driving mechanism drive the first supporting structure or the second supporting structure to rotate, and stop after identifying that the orientations of the wafer and the tray are consistent;

[0029] When the first driving mechanism drives the first supporting structure and the second supporting structure to rotate simultaneously, then after directly or indirectly jacking up the wafer away from the first supporting portion through the lifting mechanism, make the first driving mechanism drive the first supporting structure and the second supporting structure to rotate, and stop after identifying that the orientations of the wafer and the tray are consistent.

[0030] On the other hand, the present invention also provides a wafer bonding device, comprising:

[0031] A main body;

[0032] A carrying component, which is arranged on the main body and includes a first supporting structure and a second supporting structure. The first supporting structure includes a first supporting portion for carrying a wafer, and the second supporting structure includes a second supporting portion for carrying a tray and a third supporting portion located below the second supporting portion for supporting the wafer. The first supporting portion is located above the second supporting portion;

[0033] A first driving mechanism, which is connected to the second supporting structure and is used to drive the second supporting structure to perform a rotational motion along a first axis so as to adjust the direction of the wafer or the tray;

[0034] A centering mechanism, which expands and contracts along a direction approaching or departing from the first axis so as to push against the wafer and the tray to calibrate the central positions of the wafer and the tray;

[0035] An orientation sensor, which is fixed relative to the main body and is used to judge the directions of the wafer and the tray; and

[0036] A lifting mechanism, which can penetrate through the central position of the carrying component along the vertical direction to perform a lifting motion and is used to drive a part of the wafer and / or the tray to rise or fall. Wherein, the carrying component further includes at least one shrinking mechanism, and the shrinking mechanism drives the first supporting portion to switch between a shrinking position and a carrying position relative to the first supporting structure. When in the shrinking position, the distance between the first supporting portion and the first axis is greater than the radius of the wafer, and when in the carrying position, the distance between the first supporting portion and the first axis is less than the radius of the wafer.

[0037] Optionally, the centering mechanism includes:

[0038] A first centering portion, which is at the same horizontal height as the third supporting portion;

[0039] A second centering portion, which is at the same horizontal height as the second supporting portion; and

[0040] A second driving mechanism, which is connected to the first centering portion and the second centering portion and is used to drive the first centering portion and the second centering portion to perform an expanding and contracting motion approaching or departing from the first axis so as to make the central axis of the wafer or the tray coincide with the first axis.

[0041] Based on the same inventive concept, the present invention further provides a wafer bonding method using the wafer bonding device as described above. The tray is a split tray including an inner tray and an outer tray or the tray is an annular tray. The wafer bonding method includes:

[0042] Step S1: Place the wafer on the third supporting part, and calibrate the central position of the wafer through the centering mechanism;

[0043] Step S2: Identify the direction of the wafer, or identify and adjust the direction of the wafer to a preset direction;

[0044] Step S3: Push against the wafer through the lifting mechanism and leave the wafer on the first supporting part;

[0045] Step S4: Place the tray on the second supporting part, and calibrate the central position of the tray through the centering mechanism;

[0046] Step S5: Identify the direction of the tray, and drive the second supporting structure to rotate through the first driving mechanism to adjust the direction of the tray to be consistent with the direction of the wafer;

[0047] Step S6: Push against the inner tray through the lifting mechanism to indirectly lift the wafer upward or directly lift the wafer upward through the inner space of the annular tray; and

[0048] Step S7: The lifting mechanism descends to place the combination of the wafer and the inner tray or the wafer on the tray. Wherein, the first supporting part is located at the retracted position between Step S6 and Step S7.

[0049] Optionally, Step S3 includes:

[0050] Make the first supporting part located at the retracted position, the lifting mechanism jacks up the wafer above the first supporting part, then make the first supporting part located at the loading position, and the lifting mechanism descends to leave the wafer on the first supporting part.

[0051] The present invention has at least one of the following advantages compared with the prior art:

[0052] A wafer bonding device and a wafer bonding method provided by the present invention can calibrate the central positions of a wafer and a tray through a centering mechanism, and can adjust the directions of the wafer and the tray through the cooperation of an orientation sensor, a first driving mechanism, a bearing assembly and a lifting mechanism. After the calibration of the central positions of the wafer and the tray is completed in the present invention, when performing subsequent operations of adjusting the direction of the tray to be the same as that of the wafer and placing the wafer on the tray, the central position or direction of the adjusted wafer or tray will no longer change, which can avoid frequent calibration of the central position or direction of the wafer and the tray, thereby effectively improving the wafer bonding efficiency between the wafer and the tray, and further effectively improving the semiconductor process efficiency.

[0053] In the present invention, the first supporting portion can be switched between a retracted position and a bearing position relative to the first supporting structure; and when in the bearing position, the horizontal distance between the first supporting portion and the first axis is less than the radius of the wafer, so that the first supporting portion can support the wafer; when in the retracted position, the horizontal distance between the first supporting portion and the first axis is greater than the radius of the wafer, so as to provide an avoidance space for the lifting of the wafer.

[0054] When adjusting the direction of the tray in the present invention, the wafer that has completed the direction adjustment can remain stationary, so as to avoid frequent direction adjustment caused by the change of the direction of the wafer, and further improve the wafer bonding efficiency between the wafer and the tray. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 is a schematic cross-sectional view of a wafer bonding device provided in Embodiment 1 of the present invention;

[0056] Figure 2 is a top view of a wafer bonding device provided in Embodiment 1 of the present invention;

[0057] Figure 3 is a schematic structural view of a tray provided by the present invention;

[0058] Figure 4 is a schematic structural view of a wafer provided by the present invention;

[0059] Figure 5 is a schematic cross-sectional view of a wafer bonding device provided in Embodiment 2 of the present invention;

[0060] Figure 6 is a top view of a wafer bonding device provided in Embodiment 2 of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0061] The following further elaborates on a laminating device and a laminating method proposed by the present invention in conjunction with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the accompanying drawings are in a very simplified form and use non-precise scales, only for conveniently and clearly assisting in explaining the purpose of the embodiments of the present invention. In order to make the purpose, features, and advantages of the present invention more obvious and understandable, please refer to the accompanying drawings. It should be noted that the structures, scales, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those skilled in this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they do not have a substantial technical meaning. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the efficacy that the present invention can produce and the purpose that can be achieved, should still fall within the scope covered by the technical content disclosed by the present invention.

[0062] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including", or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the existence of additional identical elements in the process, method, article, or device comprising the said element.

[0063] Example 1

[0064] Combined with the attached Figures 1 to 4As shown in the figure, this embodiment provides a wafer bonding device, including: a main body part 110; a carrying component 120, which is arranged on the main body part 110 and includes a first supporting structure 121 and a second supporting structure 122. The first supporting structure 121 includes a first supporting part 1211 for carrying the wafer 101; the second supporting structure 122 includes a second supporting part 1221 for carrying the tray 102; a first driving mechanism 150, which is connected to the carrying component 120 and is used to drive the first supporting structure 121 and / or the second supporting structure 122 to perform a rotational movement along the first axis A-A to adjust the direction of the wafer 101 and / or the tray 102; a centering mechanism 130, which expands and contracts along the direction of approaching or departing from the first axis A-A to push against the wafer 101 and the tray 102 to calibrate the central positions of the wafer 101 and the tray 102; an orientation sensor 160, which is fixed relative to the main body part 110 and is used to judge the directions of the wafer 101 and the tray 102; and a lifting mechanism 140, which can penetrate through the central position of the carrying component 120 along the vertical direction to perform a lifting movement and is used to drive a part of the wafer 101 and / or the tray 102 to rise or fall. Wherein, the carrying component 120 further includes at least one contraction mechanism (not shown in the figure), and the contraction mechanism drives the first supporting part 1211 to switch between a contraction position and a carrying position relative to the first supporting structure 121; and in the carrying position, the horizontal distance between the first supporting part 1211 and the first axis A-A is less than the radius of the wafer 101, so that the first supporting part 1211 can carry the wafer 101; in the contraction position, the horizontal distance between the first supporting part 1211 and the first axis A-A is greater than the radius of the wafer 101 to provide a clearance space for the lifting of the wafer 101.

[0065] Specifically, in this embodiment, the number of the first supporting structure 121 and the second supporting structure 122 in the carrying component 120 can both be multiple, and the multiple first supporting structures 121 can be arranged at intervals along the circumferential direction of the carrying component 120 to stably carry the wafer 101; the multiple second supporting structures 122 can also be arranged at intervals along the circumferential direction of the carrying component 120 to stably carry the tray 102, but the present invention is not limited thereto.

[0066] Specifically, in this embodiment, the centering mechanism 130 can push against the wafer 101 carried on the first supporting portion 1211 and the tray 102 carried on the second supporting portion 1221 simultaneously or non-simultaneously, so that the central axes of the wafer 101 and the tray 102 coincide with the first axis A-A respectively, thereby realizing the calibration of the central positions of the wafer 101 and the tray 102. Optionally, the central axis of the main body portion 110 can be set to coincide with the first axis A-A, or the central axis of the lifting mechanism 140 can be set to coincide with the first axis A-A; preferably, the central axes of the main body portion 110 and the lifting mechanism 140 coincide. Optionally, the centering mechanism 130 and the first supporting structure 121 and the second supporting structure 122 are arranged in an interleaved manner, so that the movement trajectories of the centering mechanism 130, the first supporting structure 121 and the second supporting structure 122 do not interfere with each other, but the present invention is not limited thereto.

[0067] Specifically, in this embodiment, after the calibration of the central positions of the wafer 101 and the tray 102 is completed, the direction adjustment scheme of the wafer 101 and the tray 102 can be determined according to whether the first supporting structure 121 and the second supporting structure 122 rotate synchronously; wherein, if the first supporting structure 121 and the second supporting structure 122 do not rotate synchronously, the directions of the wafer 101 and the tray 102 can be adjusted respectively through the cooperation of the orientation sensor 160 and the first driving mechanism 150, so that the direction of the tray 102 is consistent with the direction of the wafer 101; if the first supporting structure 121 and the second supporting structure 122 rotate synchronously, the direction of the wafer 101 can be adjusted first through the cooperation of the orientation sensor 160 and the first driving mechanism 150, then the wafer 101 with the direction adjusted is lifted from the first supporting portion 1211 by the lifting mechanism 140 and supported, and then the direction of the tray 102 is adjusted through the cooperation of the orientation sensor 160 and the first driving mechanism 150, so that the direction of the tray 102 is consistent with the direction of the wafer 101.

[0068] Specifically, in this embodiment, after the direction adjustment of the wafer 101 and the tray 102 is completed, the first supporting portion 1211 can be switched from the carrying position to the retracted position through the retracting mechanism to create space for the wafer 101 to descend; then the lifting mechanism 140 is lowered to place the wafer 101 on the tray 102, thereby completing the wafer bonding of the wafer 101 and the tray 102.

[0069] As can be seen from the above, in this embodiment, after calibrating the central positions of the wafer 101 and the tray 102, when performing subsequent operations of adjusting the direction of the tray 102 to be consistent with the direction of the wafer 101 and placing the wafer 101 on the tray 102, the central positions of the wafer 101 and the tray 102 will no longer change, which can avoid frequent calibration of the central positions of the wafer 101 and the tray 102, thereby effectively improving the bonding efficiency of the wafer 101 and the tray 102, and further effectively improving the semiconductor process efficiency.

[0070] Please also refer to Figure 1 and Figure 2 , the centering mechanism 130 includes: a first centering portion 1301, which is at the same horizontal height as the first supporting portion 1211 and is used to push against the wafer 101; a second centering portion 1302, which is at the same horizontal height as the second supporting portion and is used to push against the tray 102; and a second driving mechanism 1303, which is connected to the first centering portion 1301 and the second centering portion 1302 and is used to drive the first centering portion 1301 and the second centering portion 1302 to perform telescopic movement of approaching or departing from the first axis A-A, so that the central axis of the wafer 101 or the tray coincides with the first axis A-A.

[0071] Specifically, in this embodiment, the number of the first centering parts 1301 and the second centering parts 1302 can both be multiple. The multiple first centering parts 1301 can be arranged at intervals along the circumferential direction of the carrying component 120, and each first centering part 1301 can perform a telescopic movement of approaching or departing from the first axis A-A under the drive of the second drive mechanism 1303, so as to adjust the central position of the wafer 101 in multiple directions, thereby improving the calibration efficiency of the central position of the wafer 101. Similarly, the multiple second centering parts 1302 can also be arranged at intervals along the circumferential direction of the carrying component 120, and each second centering part 1302 can perform a telescopic movement of approaching or departing from the first axis A-A under the drive of the second drive mechanism 1303, so as to adjust the central position of the tray 102 in multiple directions, thereby improving the calibration efficiency of the central position of the tray 102. Optionally, the same second drive mechanism 1303 can simultaneously drive at least one first centering part 1301 and at least one second centering part 1302 to perform a telescopic movement of approaching or departing from the first axis A-A, so as to simultaneously adjust the central positions of the wafer 101 and the tray 102, thereby improving the calibration efficiency of the central positions of the wafer 101 and the tray 102. Optionally, the second drive mechanism 1303 can be installed on the main body part 110, and the second drive mechanism 1303 can be connected to the first centering part 1301 and the second centering part 1302 through a connecting rod 1304, but the present invention is not limited thereto.

[0072] Please also refer to Figure 1 and Figure 2 , the first supporting structure 121 and the second supporting structure 122 can be synchronously rotated; at this time, the carrying component 120 can further include a mounting base 123, the first supporting structure 121 and the second supporting structure 122 are both fixedly installed on the mounting base 123, and the mounting base 123 is rotationally connected to the main body part 110 through a bearing 170. Meanwhile, the first drive mechanism 150 is connected to the mounting base 123 to drive the first supporting structure 121 and the second supporting structure 122 on the mounting base 123 to rotate synchronously. In some embodiments, the first supporting structure 121 and the second supporting structure 122 can also be rotated out of sync. At this time, the first drive mechanism 150 only drives one of the first supporting structure 121 and the second supporting structure 122 to rotate, that is, when the first drive mechanism 150 drives the first supporting structure 121 to rotate, the second supporting structure 122 remains stationary, and when the first drive mechanism 150 drives the second supporting structure 122 to rotate, the first supporting structure 121 remains stationary, but the present invention is not limited thereto.

[0073] Please continue to refer to Figure 1 , the first supporting part 1211 is located above the second supporting part 1221; if the first supporting structure 121 and the second supporting structure 122 are synchronously rotated, when adjusting the direction of the tray 102, the lifting mechanism 140 supports the wafer 101 and makes the wafer 101 in a state of being separated from the first supporting part 1211.

[0074] Specifically, in this embodiment, as Figure 3 shown, the tray 102 can be configured as a split tray having an inner tray 1021 and an outer tray 1022, wherein the inner tray 1021 is used to carry the wafer 101, and the outer tray 1022 is used to carry the inner tray 1021 and / or the wafer 101; in this case, when adjusting the direction of the tray 102, the lifting mechanism 140 abuts against the inner tray 1021 and indirectly jacks up the wafer 101 upward to support the combination of the wafer 101 and the inner tray 1021 and separate the wafer 101 from the first supporting part 1211, so that when the first driving mechanism 150 drives the carrying component 120 to rotate to adjust the direction of the tray 102, the wafer 101 that has completed the direction adjustment can be kept stationary, thereby avoiding frequent direction or center adjustment caused by changes in the direction or center of the wafer 101, so as to improve the wafer bonding efficiency between the wafer 101 and the tray 102. Optionally, the outer tray 1022 is also provided with a receiving groove 1023 matching the wafer 101 to receive the wafer 101, but the present invention is not limited thereto.

[0075] In some embodiments, the tray 102 can also be configured as an annular tray, and the inner ring diameter of the annular tray is smaller than the diameter of the wafer 101, so that the annular tray can carry the wafer 101; at the same time, the inner ring diameter of the annular tray is also larger than the diameter of the lifting mechanism 140, so that the lifting mechanism 140 can pass through the inner space of the annular tray and directly jack up the wafer 101 upward to support the wafer 101 and separate the wafer 101 from the first supporting part 1211, so that when the first driving mechanism 150 drives the carrying component 120 to rotate to adjust the direction of the tray 102, the wafer 101 that has completed the direction adjustment can also be kept stationary, thereby avoiding frequent direction or center adjustment caused by changes in the direction or center of the wafer 101, so as to improve the wafer bonding efficiency between the wafer 101 and the tray 102.

[0076] Please also refer to Figure 1 , Figure 3 and Figure 4, a first mark 1011 is provided on the wafer 101, and a second mark 1024 is provided on the tray 102. The orientation sensor 160 determines the orientation of the wafer 101 based on the detected first mark 1011 and determines the orientation of the tray 102 based on the detected second mark 1024; optionally, the orientation sensor 160 uses the polar angle of the first mark 1011 or the second mark 1022 in a preset polar coordinate system as the corresponding orientation of the wafer 101 or the tray 102, and Figure 3 and Figure 4 as an example, the first mark 1011 is configured at the midpoint position of the flat edge of the wafer 101, and the second mark 1024 is configured at the V-tip position of the V-groove on the edge of the tray 102.

[0077] It can be understood that the orientation sensor 160 is electrically connected to the first driving mechanism 150, and when the orientation sensor 160 detects that the first mark 1011 or the second mark 1024 is located at the set position, a first driving mechanism stop signal is generated to adjust the orientation of the tray 102 to be consistent with the orientation of the wafer 101.

[0078] Specifically, in this embodiment, when the first supporting structure 121 and the second supporting mechanism 122 are synchronously rotated, the first driving mechanism 150 drives the first supporting structure 121 and the second supporting mechanism 122 to rotate synchronously; when the orientation sensor 160 detects that the first mark 1011 is located at the set position, it means that the orientation of the wafer 101 is adjusted to the preset orientation. At this time, the orientation adjustment of the wafer 101 is completed, and the orientation sensor 160 sends the first driving mechanism stop signal to the first driving mechanism, so that the carrying component 120 stops rotating, so that the lifting mechanism 140 can push against the wafer 101 whose orientation has been adjusted to separate it from the first supporting portion 1211; after the lifting mechanism 140 jacks up the wafer 101 whose orientation has been adjusted, the first driving mechanism 150 continues to drive the first supporting structure 121 and the second supporting mechanism 122 to rotate synchronously. When the orientation sensor 160 detects that the second mark 1024 is located at the set position, it means that the orientation of the tray 102 is consistent with the orientation of the wafer 101. At this time, the orientation adjustment of the tray 102 is completed, and the orientation sensor 160 sends the first driving mechanism stop signal to the first driving mechanism 150, so that the carrying component 120 stops rotating, so that the lifting mechanism 140 can fall back to place the jacked-up wafer 101 on the tray 102, thereby completing the wafer bonding of the wafer 101 and the tray 102. Optionally, the orientation sensor 160 can be a CCD linear module or an image sensor, but the present invention is not limited thereto.

[0079] In some embodiments, when the first supporting structure 121 and the second supporting mechanism 122 are arranged to rotate out of sync, the first driving mechanism 150 can first drive the first supporting structure 121 to rotate. When the orientation sensor 160 detects that the first mark 1011 is located at the set position, it indicates that the orientation of the wafer 101 has been adjusted to the preset orientation. At this time, the orientation adjustment of the wafer 101 is completed, and the orientation sensor 160 sends a stop signal of the first driving mechanism to the first driving mechanism 150, so that the first supporting structure 121 stops rotating; Subsequently, the first driving mechanism 150 drives the second supporting mechanism 122 to rotate. When the orientation sensor 160 detects that the second mark 1024 is located at the set position, it indicates that the orientation of the tray 102 is consistent with the orientation of the wafer 101. At this time, the orientation adjustment of the tray 102 is completed, and the orientation sensor 160 sends a stop signal of the first driving mechanism to the first driving mechanism 150, so that the second supporting mechanism 122 stops rotating; After that, the wafer 101 is placed on the tray 102 through the lifting mechanism 140, and the wafer 101 and the tray 102 can be combined.

[0080] In addition, as Figure 1 shown, the first supporting portion 1211 has a first bearing surface (not shown in the figure) for bearing the wafer 101. The first bearing surface is provided with multiple levels of steps, and the height and width of a single step are not higher than 0.5 mm, so that the first supporting portion 1211 can bear wafers with different diameters, thereby making the wafer combining device have a wider applicability. Similarly, the second supporting portion 1221 has a second bearing surface (not shown in the figure) for bearing the tray 102. The second bearing surface is provided with multiple levels of steps, and the height and width of a single step are not higher than 0.5 mm, so that the second supporting portion 1221 can bear trays with different diameters, also making the wafer combining device have a wider applicability, but the present invention is not limited thereto.

[0081] Based on the same inventive concept, this embodiment further provides a wafer bonding method using the wafer bonding device as described above. The tray 102 is configured as a split tray having an inner tray 1021 and an outer tray 1022 or the tray 102 is configured as an annular tray. The wafer bonding method includes: Step S1, placing the wafer 101 and the tray 102 on the first supporting portion 1211 and the second supporting portion 1221 respectively, and simultaneously or non-simultaneously calibrating the central positions of the wafer 101 and the tray 102 through the centering mechanism 130; Step S2, identifying the directions of the wafer 101 and the tray 102, and adjusting the direction of the tray 102 to be the same as that of the wafer 101. Specifically, if the first supporting structure 121 and the second supporting structure 122 are synchronously rotatably arranged, after directly or indirectly abutting against the wafer 101 through the lifting mechanism 140 to separate the wafer 101 from the first supporting portion 1211, then adjusting the direction of the tray 102 to be the same as that of the wafer 101; Step S3, after directly or indirectly abutting against the wafer 101 through the lifting mechanism 140 to separate the wafer 101 from the first supporting portion 1211, moving the first supporting portion 1211 to the retracted position; Step S4, driving the wafer 101 to fall downward through the lifting mechanism 140 to place the wafer 101 on the tray 102.

[0082] Specifically, the method for identifying the directions of the wafer 101 and the tray 102 in Step S2 includes: identifying the positions of the first mark 1011 on the wafer 101 or the second mark 1024 on the tray 102 through the orientation sensor 160, and using the polar angle of the first mark 1011 or the second mark 1024 in a preset polar coordinate system as the corresponding direction of the wafer 101 or the tray 102.

[0083] The method of adjusting the direction of the tray 102 to be consistent with the direction of the wafer 101 in the step S2 includes: when the first driving mechanism 150 drives only one of the first supporting structure 121 and the second supporting structure 122 to rotate, the first driving mechanism 150 drives the first supporting structure 121 or the second supporting structure 122 to rotate, and stops after the orientation sensor 160 recognizes that the directions of the wafer 101 and the tray 102 are consistent; or, when the first driving mechanism 150 drives the first supporting structure 121 and the second supporting structure 122 to rotate simultaneously, after the lifting mechanism 140 directly or indirectly abuts against the wafer 101 to separate it from the first supporting portion 1211, the first driving mechanism 150 drives the first supporting structure 121 and the second supporting structure 122 to rotate, and stops after recognizing that the directions of the wafer 101 and the tray 102 are consistent. More specifically, the lifting mechanism 140 directly abutting against the wafer 101 means that the lifting mechanism 140 directly jacks up the wafer 101 through the inner space of the annular tray; the lifting mechanism 140 indirectly abutting against the wafer 101 means that the lifting mechanism 140 abuts against the inner tray 1021 to indirectly jack up the wafer 101, but the present invention is not limited thereto.

[0084] Embodiment II

[0085] Combined with the attached Figures 3 to 6As shown in the figure, this embodiment provides an assembling device, which includes: a main body part 110; a carrying component 120', which is arranged on the main body part 110 and includes a first supporting structure 121' and a second supporting structure 122'. The first supporting structure 121' includes a first supporting part 1211' for carrying the wafer 101. The second supporting structure 122' includes a second supporting part 1221' for carrying the tray 102 and a third supporting part 1222' located below the second supporting part 1221'. The third supporting part 1222' is used to support the wafer 101, and the first supporting part 1211' is located above the second supporting part 1221'; a first driving mechanism 150, which is connected to the second supporting structure 122' and is used to drive the second supporting structure 122' to rotate along the first axis A-A to adjust the direction of the wafer 101 or the tray 102; a centering mechanism 130, which expands and contracts along the direction of approaching or departing from the first axis A-A to push against the wafer 101 and the tray 102 to calibrate the central positions of the wafer 101 and the tray 102; an orientation sensor 160, which is fixed relative to the main body part 110 and is used to judge the directions of the wafer 101 and the tray 102; and a lifting mechanism 150, which can penetrate through the central position of the carrying component 120' in the vertical direction to perform lifting motion and is used to drive a part of the wafer 101 and / or the tray 102 to rise or fall. Wherein, the carrying component 120' further includes at least one contraction mechanism (not shown in the figure), and the contraction mechanism drives the first supporting part 1211' to switch between a contraction position and a carrying position relative to the first supporting structure 121'; and in the carrying position, the horizontal distance between the first supporting part 1211' and the first axis A-A is less than the radius of the wafer 101, so that the first supporting part 1211' can carry the wafer 101; in the contraction position, the horizontal distance between the first supporting part 1211' and the first axis A-A is greater than the radius of the wafer 101 to provide a clearance space for the lifting of the wafer 101.

[0086] Specifically, the difference between this embodiment and the first embodiment is that the wafer 101 carried on the third supporting portion 1222' is pushed by the centering mechanism 130, so that the central axis of the wafer 101 coincides with the first axis A-A, thereby realizing the calibration of the central position of the wafer 101. After the calibration of the central position of the wafer 101 is completed, the direction of the wafer 101 can be adjusted first through the cooperation of the orientation sensor 160 and the first driving mechanism 150; then the wafer 101 whose direction has been adjusted is lifted from the third supporting portion 1222' by the lifting mechanism 140 and the wafer is left on the first supporting portion 1211'; subsequently, the centering mechanism 130 is used to push the tray 102 carried on the second supporting portion 1221', so that the central axis of the tray 102 coincides with the first axis A-A, thereby realizing the calibration of the central position of the tray 102. After the calibration of the central position of the tray 102 is completed, the direction of the tray 102 is adjusted through the cooperation of the orientation sensor 160 and the first driving mechanism 150, so that the direction of the tray 102 is consistent with the direction of the wafer 101. After the direction adjustment of the wafer 101 and the tray 102 is completed, the wafer 101 can be lifted from the first supporting portion 1211' by the lifting mechanism 140 and the wafer is carried; then the first supporting portion 1211' is switched from the carrying position to the retracted position by the retracting mechanism 140 to create space for the wafer 101 to descend; subsequently, the lifting mechanism 140 is lowered to place the wafer 101 on the tray 102, thereby completing the wafer bonding of the wafer 101 and the tray 102.

[0087] As can be seen from the above, in this embodiment, after the calibration of the central positions of the wafer 101 and the tray 102 is completed, when performing the subsequent operations of adjusting the direction of the tray 102 to be consistent with the direction of the wafer 101 and placing the wafer 101 on the tray 102, the central positions of the wafer 101 and the tray 102 will not change anymore, and it is also possible to avoid frequent calibration of the central positions of the wafer 101 and the tray 102, thereby effectively improving the wafer bonding efficiency of the wafer 101 and the tray 102, and further effectively improving the semiconductor process efficiency.

[0088] Please continue to refer to Figure 5, the difference between this embodiment and the first embodiment is further that the centering mechanism 130 includes: a first centering part 1301, which is at the same horizontal height as the third supporting part 1222', and is used to push against the wafer 101; a second centering part 1302, which is at the same horizontal height as the second supporting part 1221', and is used to push against the tray 102; and a second driving mechanism 1303, which is connected to the first centering part 1301 and the second centering part 1302, and is used to drive the first centering part 1301 and the second centering part 1302 to perform telescopic movement closer to or away from the first axis A-A, so that the central axis of the wafer 101 or the tray 102 coincides with the first axis A-A.

[0089] In addition, in this embodiment, a first mark 1011 is provided on the wafer 101, a second mark 1024 is provided on the tray 102, and the orientation sensor 160 determines the orientation of the wafer 101 or the tray 102 based on detecting the first mark 1011 or the second mark 1024. The orientation sensor 160 is electrically connected to the first driving mechanism 150, and when the orientation sensor 160 detects that the first mark 1011 or the second mark 1024 is at a set position, a first driving mechanism stop signal is generated to adjust the orientation of the tray 102 to be consistent with the orientation of the wafer 101.

[0090] In addition, in this embodiment, the first supporting part 1211' has a first bearing surface for bearing the wafer 101, and the first bearing surface is provided with multiple levels of steps, and the height and width of a single step are not higher than 0.5 mm; the second supporting part 1221' has a second bearing surface for bearing the tray 102, and the second bearing surface is provided with multiple levels of steps, and the height and width of a single step are not higher than 0.5 mm; the third supporting part 1222' has a third bearing surface for bearing the wafer 101, and the third bearing surface is provided with multiple levels of steps, and the height and width of a single step are not higher than 0.5 mm.

[0091] Based on the same inventive concept, this embodiment also provides a wafer combining method for the wafer combining device described above. The tray 101 is a split tray including an inner tray 1021 and an outer tray 1022, or the tray 102 is an annular tray. The wafer combining method includes: Step S1, placing the wafer 101 on the third supporting portion 1222′, and calibrating the central position of the wafer 101 through the centering mechanism 130; Step S2, identifying the orientation of the wafer 101, or identifying and adjusting the orientation of the wafer 101 to a preset orientation; Step S3, pressing against the wafer 101 through the lifting mechanism 140 and leaving the wafer 101 on the first supporting portion 1211′; Step S4, placing the tray 102 on the second supporting portion 1221′, and calibrating the central position of the tray 102 through the centering mechanism 130; Step S5, identifying the orientation of the tray 102, and driving the second supporting structure 122′ to rotate through the first driving mechanism 150 to adjust the orientation of the tray 102 to be consistent with the orientation of the wafer 101; Step S6, pressing against the inner tray 1021 through the lifting mechanism 140 to indirectly lift the wafer 101 upward, or directly lifting the wafer 101 upward through the inner space of the annular tray; and Step S7, the lifting mechanism 140 retracts to place the combination of the wafer 101 and the inner tray 1021 or the wafer 101 on the tray 102, wherein the first supporting portion 1211′ is located at the retracted position between Step S6 and Step S7.

[0092] Specifically, in Step S2, when the first driving mechanism 150 drives the second supporting structure 122′ to rotate and the orientation sensor 160 detects that the first mark 1011 is at the set position, it means that the orientation of the wafer 101 is adjusted to the preset orientation. At this time, the orientation adjustment of the wafer 101 is completed, and the orientation sensor 160 sends a stop signal of the first driving mechanism to the first driving mechanism 150, so that the second supporting structure 122′ stops rotating.

[0093] Step S3 includes: making the first supporting portion 1211′ located at the retracted position, the lifting mechanism 140 lifting the wafer 101 above the first supporting portion 1211′, then making the first supporting portion 1211′ located at the loading position, and the lifting mechanism 140 retracting, so that the wafer 101 is left on the first supporting portion 1211′.

[0094] In the step S5, the first driving mechanism 150 drives the second supporting mechanism 122' to rotate. When the orientation sensor 160 detects that the second mark 1024 is located at the set position, it indicates that the direction of the tray 102 is consistent with the direction of the wafer 101. At this time, the direction adjustment of the tray 102 is completed, and the orientation sensor 160 sends a first driving mechanism stop signal to the first driving mechanism 150 to stop the rotation of the second supporting mechanism 122'.

[0095] In summary, for the wafer bonding device and method provided by the present invention, the centering mechanism can calibrate the central positions of the wafer and the tray. Through the cooperation of the orientation sensor, the first driving mechanism, the bearing assembly, and the lifting mechanism, the directions of the wafer and the tray can be adjusted. After the central positions of the wafer and the tray are calibrated in the present invention, when performing subsequent operations of adjusting the direction of the tray to be consistent with the direction of the wafer and placing the wafer on the tray, the central positions or directions of the adjusted wafer or tray will no longer change, which can avoid frequent calibration of the central positions or directions of the wafer and the tray, thereby effectively improving the wafer bonding efficiency between the wafer and the tray, and further effectively improving the semiconductor process efficiency. In the present invention, the first supporting portion can be switched between a retracted position and a bearing position relative to the first supporting structure; and when in the bearing position, the horizontal distance between the first supporting portion and the first axis is less than the radius of the wafer, so that the first supporting portion can support the wafer; when in the retracted position, the horizontal distance between the first supporting portion and the first axis is greater than the radius of the wafer, so as to provide an avoidance space for the lifting of the wafer. When adjusting the direction of the tray in the present invention, the wafer whose direction has been adjusted can remain stationary, thereby avoiding frequent direction adjustment caused by changes in the direction or central position of the wafer, and further improving the wafer bonding efficiency between the wafer and the tray.

[0096] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be construed as a limitation of the present invention. After those skilled in the art have read the above content, various modifications and alternatives to the present invention will be obvious. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims

1. A laminating device, characterized in that, Comprising: A main body portion; A carrying assembly, which is arranged on the main body portion and includes a first supporting structure and a second supporting structure. The first supporting structure includes a first supporting portion for carrying a wafer; The second supporting structure includes a second supporting portion for carrying a tray; A first driving mechanism, connected to the carrying assembly, for driving the first supporting structure and / or the second supporting structure to perform a rotational movement along a first axis to adjust the directions of the wafer and / or the tray; A centering mechanism, which expands and contracts along a direction approaching or departing from the first axis to push against the wafer and the tray to calibrate the central positions of the wafer and the tray; An orientation sensor, fixed relative to the main body portion, for judging the directions of the wafer and the tray; And A lifting mechanism, which can penetrate through the central position of the carrying assembly in the vertical direction to perform a lifting movement for driving a part of the wafer and / or the tray to move up or down. Wherein, the carrying assembly further includes at least one contraction mechanism, and the contraction mechanism drives the first supporting portion to switch between a contraction position and a carrying position relative to the first supporting structure; and at the contraction position, the distance between the first supporting portion and the first axis is greater than the radius of the wafer; at the carrying position, the distance between the first supporting portion and the first axis is less than the radius of the wafer.

2. The laminating device according to claim 1, wherein, The centering mechanism includes: A first centering portion, at the same horizontal height as the first supporting portion; A second centering portion, at the same horizontal height as the second supporting portion; and A second driving mechanism, connected to the first centering portion and the second centering portion, for driving the first centering portion and the second centering portion to perform an expansion and contraction movement approaching or departing from the first axis so that the central axis of the wafer or the tray coincides with the first axis.

3. The wafer bonding device according to claim 1, wherein The first supporting portion has a first bearing surface for carrying the wafer, and the first bearing surface is provided with multiple levels of steps, and the height and width of a single step are not higher than 0.5 mm; The second supporting portion has a second bearing surface for carrying the tray, and the second bearing surface is provided with multiple levels of steps, and the height and width of a single step are not higher than 0.5 mm.

4. The laminating device according to claim 1, wherein The first supporting portion is located above the second supporting portion; when adjusting the direction of the tray, the lifting mechanism supports the wafer and makes the wafer in a state of being separated from the first supporting portion.

5. The laminating device according to claim 1, wherein, A first mark is provided on the wafer, and a second mark is provided on the tray, and the orientation sensor determines the direction of the wafer or the tray based on detecting the first mark or the second mark; The orientation sensor is electrically connected to the first driving mechanism, and when the orientation sensor detects that the first mark or the second mark is located at a set position, a first driving mechanism stop signal is generated to adjust the direction of the tray to be consistent with the direction of the wafer.

6. A lamination method using the lamination device according to any one of claims 1-5, wherein the tray is configured as a split tray having an inner tray and an outer tray or the tray is configured as an annular tray, characterized in that, The wafer bonding method includes: Step S1: Place the wafer and the tray on the first supporting part and the second supporting part respectively, and calibrate the central positions of the wafer and the tray through the centering mechanism; Step S2: Identify the orientations of the wafer and the tray, and adjust the orientation of the tray to be the same as that of the wafer. Wherein, if the first supporting structure and the second supporting structure are synchronously rotatably arranged, first directly or indirectly push against the wafer through the lifting mechanism to separate the wafer from the first supporting part, and then adjust the orientation of the tray to be the same as that of the wafer; Step S3: After directly or indirectly pushing against the wafer through the lifting mechanism to separate the wafer from the first supporting part, place the first supporting part in the retracted position; and Step S4: Drive the wafer to fall downward through the lifting mechanism to place the wafer on the tray.

7. The wafer bonding method according to claim 6, wherein the method for identifying the orientations of the wafer and the tray in step S2 includes: identifying the positions of the first mark on the wafer or the second mark on the tray, and using the polar angle of the first mark or the second mark in the preset polar coordinate system as the corresponding orientation of the wafer or the tray; the method for adjusting the orientation of the tray to be the same as that of the wafer in step S2 includes: when the first driving mechanism drives only one of the first supporting structure and the second supporting structure to rotate, drive the first supporting structure or the second supporting structure to rotate by the first driving mechanism, and stop after identifying that the orientations of the wafer and the tray are the same; when the first driving mechanism drives the first supporting structure and the second supporting structure to rotate simultaneously, after directly or indirectly pushing against the wafer through the lifting mechanism to separate the wafer from the first supporting part, drive the first supporting structure and the second supporting structure to rotate by the first driving mechanism, and stop after identifying that the orientations of the wafer and the tray are the same.

8. A laminating device, characterized in that, including: a main body part; a loading assembly, which is arranged on the main body part and includes a first supporting structure and a second supporting structure. The first supporting structure includes a first supporting part for loading the wafer, the second supporting structure includes a second supporting part for loading the tray and a third supporting part located below the second supporting part for supporting the wafer, and the first supporting part is located above the second supporting part; a first driving mechanism, connected to the second supporting structure, for driving the second supporting structure to perform a rotational movement along a first axis to adjust the orientation of the wafer or the tray; a centering mechanism, which expands and contracts along a direction approaching or departing from the first axis to push against the wafer and the tray to calibrate the central positions of the wafer and the tray; an orientation sensor, fixed relative to the main body part, for judging the orientations of the wafer and the tray; and A lifting mechanism that can penetrate the central position of the bearing component vertically to perform lifting motion, and is used to drive a part of the wafer and / or the tray to rise or fall. Wherein, the bearing component further includes at least one contraction mechanism, and the contraction mechanism drives the first supporting portion to switch between a contraction position and a bearing position relative to the first supporting structure. When in the contraction position, the distance between the first supporting portion and the first axis is greater than the radius of the wafer; when in the bearing position, the distance between the first supporting portion and the first axis is less than the radius of the wafer.

9. The laminating device according to claim 8, characterized in that, The centering mechanism includes: A first centering portion at the same horizontal height as the third supporting portion; A second centering portion at the same horizontal height as the second supporting portion; and A second driving mechanism connected to the first centering portion and the second centering portion, and is used to drive the first centering portion and the second centering portion to perform telescopic motion of approaching or departing from the first axis, so that the central axis of the wafer or the tray coincides with the first axis.

10. A laminating method using the laminating device according to any one of claims 8-9, characterized in that, The tray is a split tray including an inner tray and an outer tray or the tray is an annular tray. The wafer bonding method includes: Step S1: Place the wafer on the third supporting portion, and calibrate the central position of the wafer through the centering mechanism; Step S2: Identify the direction of the wafer, or identify and adjust the direction of the wafer to a preset direction; Step S3: The lifting mechanism abuts against the wafer and leaves the wafer on the first supporting portion; Step S4: Place the tray on the second supporting portion, and calibrate the central position of the tray through the centering mechanism; Step S5: Identify the direction of the tray, and drive the second supporting structure to rotate through the first driving mechanism to adjust the direction of the tray to be consistent with the direction of the wafer; Step S6: The lifting mechanism abuts against the inner tray to indirectly lift the wafer upward or directly lift the wafer upward through the inner space of the annular tray; and Step S7: The lifting mechanism falls back to place the combination of the wafer and the inner tray or the wafer on the tray. Wherein, the first supporting portion is in the contraction position between Step S6 and Step S7.

11. The lamination method according to claim 10, wherein The Step S3 includes: Make the first supporting portion in the contraction position, the lifting mechanism jacks up the wafer above the first supporting portion, then make the first supporting portion in the bearing position, and the lifting mechanism falls back so that the wafer is left on the first supporting portion.

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