Semiconductor package assembly with interlayer cooling path

Abstract

A semiconductor package assembly includes: a first semiconductor package including a first semiconductor element and a first set of conductive patterns both exposed from a front surface of the first semiconductor package; an interposer mounted on the front surface of the first semiconductor package via a set of interconnect structures, where the interposer includes a second set of conductive patterns at a rear surface thereof, the second group of conductive patterns is aligned with the first group of conductive patterns so that the first group of conductive patterns and the second group of conductive patterns are electrically connected with each other through the group of interconnection structures; a second semiconductor package, the second semiconductor package being mounted on a front surface of the interposer; and wherein the interposer includes a cooling fluid inlet and a cooling fluid outlet, the cooling fluid inlet and the cooling fluid outlet passing through the interposer and defining a cooling fluid path between the interposer and the first semiconductor package.

Description

Technical Field

[0001] This application generally relates to semiconductor technology, and more particularly, to a semiconductor package assembly having an interlayer cooling path, and a method of fabricating a semiconductor package assembly. Background Art

[0002] The semiconductor industry has been facing complex integration challenges as consumers desire smaller, faster, and higher-performing electronic products and pack more and more functions into a single device. In some semiconductor packages, the Package-in-Package (PiP) or Package-on-Package (PoP) process is applied, which combines two or more integrated circuit packages together. PiP or PoP devices can use space more efficiently and reduce the length of the signal path between packages. In a typical PiP or PoP device, one or more pre-molded semiconductor packages can be mounted on another semiconductor package through an interposer or other similar structure.

[0003] However, it should be noted that some semiconductor components such as logic circuit chips or high-bandwidth memory chips in PiP or PoP devices may generate a large amount of heat during operation, and due to the compact package structure of PiP or PoP devices, the heat may not be dissipated well to the external environment. Therefore, further improvements to semiconductor package assemblies with integrated semiconductor components are needed. Summary of the Invention

[0004] An object of this application is to provide a semiconductor package assembly with improved heat dissipation.

[0005] According to one aspect of this application, a semiconductor package assembly is disclosed. The semiconductor package assembly includes: a first semiconductor package including a first semiconductor element and a first set of conductive patterns both exposed from a front surface of the first semiconductor package; an interposer mounted on the front surface of the first semiconductor package via a set of interconnect structures, wherein the interposer includes a second set of conductive patterns at its back surface, and the second set of conductive patterns is aligned with the first set of conductive patterns such that the first set of conductive patterns and the second set of conductive patterns are electrically connected to each other through the set of interconnect structures; a second semiconductor package mounted on a front surface of the interposer; and wherein the interposer includes a cooling fluid inlet and a cooling fluid outlet that pass through the interposer and define a cooling fluid path between the interposer and the first semiconductor package to allow fluid flow from the cooling fluid inlet through at least the exposed first semiconductor element to the cooling fluid outlet.

[0006] According to another aspect of the present application, a method for fabricating a semiconductor package assembly is provided. The method includes: providing a first semiconductor package, wherein the first semiconductor package includes a first semiconductor element and a first set of conductive patterns that are both exposed from a front surface of the first semiconductor package; attaching a set of interconnect structures on the front surface of the first semiconductor package and electrically connecting the set of interconnect structures to the first set of conductive patterns; mounting a fluid conduit on the front surface of the first semiconductor package to thermally couple the fluid conduit to the exposed first semiconductor element at least, wherein the fluid conduit includes an inlet portion and an outlet portion that extend vertically from the front surface of the first semiconductor package; mounting an interposer on the front surface of the first semiconductor package via the set of interconnect structures, wherein the interposer includes a second set of conductive patterns at its rear surface, the second set of conductive patterns being aligned with the first set of conductive patterns such that the first set of conductive patterns and the second set of conductive patterns are electrically connected to each other through the set of interconnect structures, and wherein the interposer includes a cooling fluid inlet and a cooling fluid outlet to allow the inlet portion and the outlet portion of the fluid conduit to pass through the interposer; and mounting a second semiconductor package on the front surface of the interposer.

[0007] According to yet another aspect of the present application, a method for fabricating a semiconductor package assembly is provided. The method includes: providing a first semiconductor package, wherein the first semiconductor package includes a first semiconductor element and a first set of conductive patterns that are both exposed from a front surface of the first semiconductor package; attaching a set of interconnect structures on the front surface of the first semiconductor package and electrically connecting the set of interconnect structures to the first set of conductive patterns; mounting an interposer on the front surface of the first semiconductor package via the set of interconnect structures, wherein the interposer includes a second set of conductive patterns at its rear surface, the second set of conductive patterns being aligned with the first set of conductive patterns such that the first set of conductive patterns and the second set of conductive patterns are electrically connected to each other through the set of interconnect structures, and wherein the interposer includes a cooling fluid inlet and a cooling fluid outlet that pass through the interposer and define a cooling fluid path between the interposer and the first semiconductor package; and mounting a second semiconductor package on the front surface of the interposer.

[0008] It should be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and do not limit the present invention. Additionally, the accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The drawings referred to in this specification form a part of this specification. The features shown in the drawings illustrate only some embodiments of the present application, rather than all embodiments of the present application, unless the specific implementation clearly indicates otherwise, and readers of this specification should not make inferences to the contrary.

[0010] Figure 1A Shows a semiconductor package assembly according to an embodiment of the present application.

[0011] Figure 1B Shows Figure 1A An exemplary layout of fluid pipes on a first semiconductor package of the semiconductor package assembly shown in.

[0012] Figure 2 Shows a semiconductor package assembly according to an embodiment of the present application.

[0013] Figure 3A Shows a semiconductor package assembly according to an embodiment of the present application, and Figure 3B and 3C Shows Figure 3A Two examples of an interposer in the semiconductor package assembly shown in.

[0014] Figures 4A to 4I Shows a method for manufacturing a semiconductor package assembly according to an embodiment of the present application.

[0015] Throughout the drawings, the same reference numerals will be used to refer to the same or similar parts. Detailed Description of Specific Embodiments

[0016] The following detailed description of exemplary embodiments of the present application refers to the accompanying drawings that form a part of the description. The drawings illustrate specific exemplary embodiments in which the present application may be practiced. The detailed description including the drawings describes these embodiments in sufficient detail to enable those skilled in the art to practice the present application. Those skilled in the art may further utilize other embodiments of the present application and make logical, mechanical, and other changes without departing from the spirit or scope of the present application. Therefore, readers of the following detailed description should not interpret the description in a limiting sense, and only the appended claims define the scope of the embodiments of the present application.

[0017] In this application, unless otherwise expressly stated, the use of the singular includes the plural. In this application, unless otherwise specified, the use of "or" means "and / or". In addition, the use of the term "including" and other forms such as "includes" and "included" is not restrictive. Additionally, unless otherwise specifically stated, terms such as "element" or "component" cover elements and components that include a single unit and elements and components that include more than one sub-unit. Further, the section headings used herein are for organizational purposes only and should not be construed as limiting the subject matter described.

[0018] As used herein, for ease of description, spatial relative terms such as "under", "below", "above", "over", "on", "upper", "lower", "left", "right", "vertical", "horizontal", "side", etc. may be used herein to describe the relationship of one element or feature to another element(s) or feature(s), as shown in the figures. Except for the orientation depicted in the figures, the spatially relative terms are intended to cover different orientations of the device in use or operation. The device may be oriented otherwise (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein may be interpreted accordingly. It is to be understood that when an element is referred to as "connected to" or "coupled to" another element, the element may be directly connected to or coupled to the other element, or intervening elements may be present.

[0019] As described above, conventional semiconductor package components may not have satisfactory heat dissipation performance due to their compact structure and the large amount of heat generated by the semiconductor elements encapsulated within the semiconductor package components. To address the heat dissipation problem, the inventors of the present application have conceived an invention having a cooling path that passes through the semiconductor package component, particularly through the internal space of the semiconductor package component to dissipate the heat generated and accumulated therein. In this way, the heat dissipation performance of the semiconductor package component can be significantly improved.

[0020] Figure 1A FIG. 100 shows a semiconductor package component 100 according to an embodiment of the present application. As Figure 1A shown, the semiconductor package component 100 has two semiconductor packages that are stacked together through an interposer. Accordingly, the semiconductor elements encapsulated within the lower semiconductor package of the two semiconductor packages are embedded within the entire semiconductor package component 100 and are relatively far from the external environment. It should be noted that while Figure 1A two semiconductor packages are shown as an example, more semiconductor packages may be integrated within the semiconductor package component 100 as needed.

[0021] As Figure 1AAs shown, semiconductor package 100 includes a first semiconductor package 101. The first semiconductor package 101 may include a first substrate 102, and at least one semiconductor element 104 mounted on the first substrate 102. In some embodiments, the semiconductor element 104 may be a semiconductor die or a smaller semiconductor package that can be mounted on the front surface of the first substrate 102 via solder bumps 106 or similar structures. Additionally, a set of conductive structures 108, such as stacked solder bumps or copper pillars, may be mounted on the front surface of the first substrate 102 in parallel with the first semiconductor element 104. A mold cap 110 is formed on the first substrate 102 to encapsulate the first semiconductor element 104 and the set of conductive structures 108, and to protect them from the external environment and damage. In some embodiments, the mold cap 110 may be made partially or entirely of a polymer composite material, such as an epoxy resin with fillers, an epoxy acrylate with fillers, or a polymer with appropriate fillers.

[0022] The first semiconductor package 101 has a front surface (facing upward in the direction shown in Figure 1A ), and a back surface opposite the front surface. Below the back surface, solder bumps may be mounted to the first semiconductor package 101 to allow the entire semiconductor package assembly 100 to be mounted or connected to an external device when needed. On the other hand, the front surface of the first semiconductor package serves as a platform and support surface for other components of the semiconductor package assembly 100. The mold cap 110 is formed such that its front surface is part of the front surface of the first semiconductor package 101, while the first semiconductor element 104 and the set of conductive structures 108 are exposed from the front surface of the first semiconductor package 101 as another part of the front surface of the first semiconductor package 101. In some embodiments, the mold cap 110 may be formed with an excess of molding material above the first semiconductor element 104 and the set of conductive structures 108, and the molding material may be thinned to some extent later to expose the front surfaces of the first semiconductor element 104 and the set of conductive structures 108. The set of conductive structures 108 is exposed as a set of conductive patterns, and other components formed above the first semiconductor package 101 may be electrically coupled to the first substrate 102 and the solder bumps below it; in the case where the first semiconductor element 104 is exposed and not covered by the mold cap 110, a heat dissipation path is formed through the exposed front surface of the first semiconductor element 104 to allow direct dissipation of heat generated by the first semiconductor element 104.

[0023] Still referring to Figure 1A, the interposer 112 is mounted on the front surface of the first semiconductor package 101 via a set of interconnect structures 116. Specifically, the interposer 112 includes another set of conductive patterns, such as contact pads, at its back surface, and the other set of conductive patterns is aligned with the set of conductive patterns on the front surface of the first semiconductor package 101. In this way, the two sets of conductive patterns can be electrically connected to each other through the set of interconnect structures 116. In some embodiments, the interposer 112 may include one or more insulating or passivation layers, one or more conductive vias formed through the insulating layer, and one or more conductive layers formed above or between the insulating layers. The conductive vias and the conductive layers together form various interconnect structures in the interposer 112. Since the interposer 112 is supported on the first semiconductor package 101 by the interconnect structures 116 and thus does not directly contact the first semiconductor package 101, a gap is formed between the interposer 112 and the first semiconductor package 101. The height of the gap is substantially equal to the height of the set of interconnect structures 116. In some embodiments, the set of interconnect structures 116 may be solder bumps, and in some alternative embodiments, the set of interconnect structures 116 may be other interconnect components, such as metal pillars or e-Bar (conductive bar) modules. In addition to electrically connecting the two sets of conductive patterns to each other, the interconnect structures 116 can provide mechanical support for the interposer 112 and the components mounted thereon.

[0024] In Figure 1A the embodiment shown, the fluid conduit 124 is mounted between the first semiconductor package 101 and the interposer 112. The fluid conduit 124 can be in direct or indirect thermal contact with the exposed first semiconductor element 104 through the thermal interface material layer 114. The fluid conduit 124 forms a cooling fluid path between the interposer 112 and the first semiconductor package 101, and the cooling fluid path allows fluid to flow at least through the exposed first semiconductor element 104. Thus, heat can be dissipated from the first semiconductor element 104 at the central part of the semiconductor package assembly 100 to the external environment through the fluid flow. In some embodiments, the fluid flow can be a liquid flow, such as a specific coolant (e.g., water), and alternatively, the fluid flow can be a gas flow, such as an air flow, or a mixed gas and liquid flow, such as a liquid nitrogen flow.

[0025] It can be understood that the fluid conduit 124 can lead to the external environment or be in fluid communication with a coolant source external to the semiconductor package assembly 100 to allow for a continuous cooling process during the operation of the semiconductor package assembly 100. Thus, the coolant fluid inlet 120 and the coolant fluid outlet 122 can be formed in the interposer 112 and can pass through the interposer 112. Accordingly, the fluid conduit 124 can pass through the interposer 112 at the coolant fluid inlet 120 and at the coolant fluid outlet 122, and thus the fluid flow inside the fluid conduit 124 can flow in the direction from the coolant fluid inlet 120 to the coolant fluid outlet 122 (as Figure 1A shown) and carry heat away from the first semiconductor element 104 to the external environment. In some embodiments, a pump (not shown) can be in fluid communication with the fluid conduit 124 to pump coolant into the fluid conduit 124 and cause the coolant to flow within the fluid conduit 124. For example, the pump can be disposed external to the first semiconductor package 101 and the interposer 112. In some embodiments, a plurality of semiconductor package assemblies similar to the semiconductor package assembly 100 shown in Figure 1A are installed in an electronic system, and correspondingly, at least a portion of the fluid conduits of these semiconductor package assemblies can all be coupled to the pump and share the fluid driving capacity of the pump. Additionally, in addition to the exposed front surface of the first semiconductor element 104, the fluid conduit 124 can extend along certain other regions of the front surface of the first semiconductor package 101 to absorb heat generated or accumulated in these regions. For example, the fluid conduit 124 can be adjacent to or close to the solder bumps 116, and thus can draw heat from the solder bumps 116.

[0026] In some embodiments, the fluid conduit 124 is formed of a metal material or alloy that has good thermal conductivity and is suitable for heat dissipation. It can be understood that the fluid conduit 124 should be electrically isolated from the solder bumps 116 to avoid unwanted electrical connections between the solder bumps 116 and other conductive structures. For example, a buffer layer of an insulating material can be filled between the solder bumps 116 and the fluid conduit 124, and / or between the fluid conduit 124 and other contact pads on the back surface of the interposer 112. In some other embodiments, the fluid conduit 124 can be made of other materials having good thermal conductivity.

[0027] Since the first semiconductor element 104 can have a square or rectangular layout, the fluid conduit 124 can preferably have a similar layout. In some embodiments, the fluid conduit 124 can include a plurality of branches extending between the coolant inlet 120 and the coolant outlet 122 to increase its contact area with the first semiconductor element 104. In some alternative embodiments, the fluid conduit 124 can have a zigzag shape that meanders along the front surface of the first semiconductor package 101. It will be appreciated that the fluid conduit 124 can take other suitable shapes to increase its contact area with the first semiconductor package 101, or particularly with the first semiconductor element 104.

[0028] Figure 1B Shown Figure 1A An exemplary layout of the fluid conduit 124 on the first semiconductor package 101 of the semiconductor package assembly 100 shown in. As Figure 1B shown, the front surface of the first semiconductor element 104 is exposed and not covered by the mold cover 110 of the first semiconductor package 101. The fluid conduit 124 has a central portion 124a that substantially overlaps the exposed front surface of the first semiconductor element 104 to absorb heat therefrom. In addition, the fluid conduit 124 has an inlet portion 124b upstream of the central portion 124a for receiving coolant, and an outlet portion 124c downstream of the central portion 124a for discharging coolant from the central portion 124a to dissipate heat to the outside, such as to a coolant pool or tank. As mentioned above, the central portion 124a can take other shapes, such as a branched shape, a zigzag shape, or a spiral shape. In addition, the solder bumps 116 mounted on the first semiconductor package 101 can be arranged around the first semiconductor element 104 and thus may not be in direct contact with the fluid conduit 124.

[0029] Returning to Figure 1A , the second semiconductor package 118 is further mounted on the front surface of the interposer 112 to improve the integration of the entire semiconductor package assembly 100. The second semiconductor package 118 can have a second substrate and a second semiconductor element mounted on the second substrate, similar in configuration and structure to the first semiconductor package 101. However, by means of the fluid conduit 124 that introduces a separate heat dissipation path extending into the semiconductor package assembly 100 and is mounted between the interposer 112 and the first semiconductor package 101, the second semiconductor package 118 stacked above the first semiconductor package 101 does not significantly affect the heat dissipation performance of the semiconductor package assembly 100. In addition, although Figure 1A not shown in, an additional mold cover can be formed on the first semiconductor package 101 or on the interposer 112 to encapsulate the corresponding components formed thereon. The additional mold cover does not block the fluid passage within the fluid conduit 124 and thus does not affect heat dissipation through the fluid conduit 124.

[0030] In Figure 1A the illustrated embodiment, the second semiconductor package 118 includes a second semiconductor element, such as a semiconductor die or a smaller semiconductor package mounted on a second substrate, and the second semiconductor element is remote from the first semiconductor element 104 of the first semiconductor package 101. In some alternative embodiments, especially when three or more semiconductor packages are stacked together, the second semiconductor package may be mounted on the interposer in a manner similar to the first semiconductor package, and the second semiconductor element may also face the interposer from the front surface of the interposer. That is, the two semiconductor packages may be mounted substantially symmetrically with respect to the interposer. In this case, a fluid conduit may also extend between the interposer and the second semiconductor package for dissipating heat generated by the second semiconductor element. Optionally, a separate fluid conduit may be mounted on the front surface of the interposer for the second semiconductor package.

[0031] Figure 2 FIG. shows a semiconductor package assembly 200 according to an embodiment of the present application. As Figure 2 shown, the structure of the semiconductor package assembly 200 is similar to Figure 1A the structure of the semiconductor package assembly 100 shown in

[0032] Figure 3A FIG. shows a semiconductor package assembly 300 according to an embodiment of the present application, and Figure 3B and 3C FIG. shows Figure 3A two examples of the interposer in the semiconductor package assembly 300 shown in

[0033] As Figure 3AAs shown, semiconductor package assembly 300 includes a first semiconductor package 301 and a second semiconductor package 318 that are connected to each other via an interposer 312 and a set of interconnect structures 316. The set of interconnect structures 316 elevates the interposer 312 and creates a space between the interposer 312 and the front surface of the first semiconductor package 301 that can be used for heat dissipation. For example, air can be introduced from the external environment through a cooling fluid inlet 320 into the space below the interposer 312. In this way, for example, through a cooling fluid outlet 322 that also passes through the interposer 312, the air can carry the heat generated by the first semiconductor package 301, particularly by a first semiconductor element 304 exposed from the front surface of the semiconductor package 301, outside the semiconductor package assembly 300. Thus, the cooling fluid inlet 320 and the cooling fluid outlet 322 together define a cooling fluid path between the interposer 312 and the first semiconductor package 301 to allow fluid flow from the cooling fluid inlet 320 to the cooling fluid outlet 322.

[0034] As Figure 3B and 3C shown in, a plurality of vents 321 that can pass through the interposer 312 can be formed at or adjacent to the periphery of the interposer 312. In operation, depending on the direction of the air flow in the space defined by the interposer 312 and the first semiconductor package 301, some of the vents 321 can act as cooling fluid inlets, while other vents can act as cooling fluid outlets. In some preferred embodiments, the vents 321 can surround the first semiconductor element to ensure that the air flow can pass through the front surface of the first semiconductor element. Solder bumps 328 are formed on the front surface of the interposer 312 and at its central portion such that a second semiconductor package (not shown) can be mounted on the interposer 312 through the solder bumps 328.

[0035] In some embodiments, a fan (not shown) can be mounted at the cooling fluid inlet 320 on the front surface of the interposer 312 to blow air into the cooling fluid path below the interposer 312. The improved air flow within the fluid path can enhance heat dissipation from the first semiconductor package. Refer back to Figure 3A, in some embodiments, a spacer or a frame 327 may be formed between the interposer 312 and the first semiconductor package 301, or specifically, between the interposer 312 and the mold cap 310 of the first semiconductor package 301. The frame 301 may be formed at or adjacent to the periphery of the interposer 312 and may generally seal the space below the interposer 312 at its periphery. In this way, the air blown into the cooling fluid path will not leak to the outside at the periphery of the interposer 312 and can thus generally pass through the exposed surface of the first semiconductor element 304 and improve the efficiency of heat dissipation. In some embodiments, an open inlet or port 325 may be disposed on the front surface of the interposer 312, at the cooling fluid inlet 320 or further at the cooling fluid outlet 322 to direct the air flow through these vents.

[0036] Figures 4A to 4I FIG. shows a method for fabricating a semiconductor package assembly according to an embodiment of the present application. The method can be used to fabricate Figure 1A the semiconductor package assembly 100 shown in, and can be used to fabricate, with some modifications, Figure 2 the semiconductor package assembly 200 shown in or Figure 3A the semiconductor package assembly 300 shown in.

[0037] As Figure 4A shown, a first substrate 402 is provided, and a set of conductive structures 408, such as metal pillars, may be mounted on the front surface of the first substrate 402. The conductive structures 408 may be aligned with and connected to a set of conductive patterns (not shown) on the first substrate 402 for electrical connection.

[0038] Next, as Figure 4B shown, a first semiconductor element 404 is mounted on the first substrate 402 via solder bumps 406. In some embodiments, an underfill material 407 may be filled between the first semiconductor element 404 and the first substrate 402 and around the solder bumps 406 to enhance the attachment of the first semiconductor element 404 to the first substrate 402. The first semiconductor element 404 may have a height equal to or less than the height of the conductive structures 408. Next, a mold cap 410 may be formed on the first substrate 402 to encapsulate the first semiconductor element 404 and the conductive structures 408, as Figure 4C shown. For example, the mold cap 410 may be formed using an injection molding process or a compression molding process. In some other embodiments, the mold cap 410 may be formed using solder paste printing, transfer molding, liquid encapsulation molding, vacuum pressing, spin coating, or any other suitable process.

[0039] Next, as Figure 4DAs shown, for example, a grinding process can be used to remove an excess portion of the molded material of the mold cover 410 that is higher than the front surface of the first semiconductor element 404 to expose the front surface of the first semiconductor element 404. It can be understood that the higher portion of the conductive structure 408 can be removed together with the excess molded material of the mold cover 410. Thus, the front surface of the conductive structure 408 can be exposed as a set of conductive patterns, and the set of conductive patterns can be later attached to a set of interconnect structures 416 such as solder bumps, as Figure 4E shown. The first substrate 402, the first semiconductor element 404, the conductive structure 408, and the mold cover 410 can together form a first semiconductor package 401 that will be later connected to other components.

[0040] Next, as Figure 4F shown, a fluid conduit 424 can be mounted on the front surface of the first semiconductor package 401 to at least thermally couple the fluid conduit 424 to the exposed first semiconductor element 404. In some embodiments, the fluid conduit 424 can be attached to the front surface of the first semiconductor element 404 via a thermal interface material layer 414, which can improve heat transfer between the fluid conduit 424 and the first semiconductor element 404. The fluid conduit 424 can be isolated from the solder bumps 416 to avoid unwanted electrical connections therebetween. When the semiconductor package assembly is in operation, the fluid conduit 424 can accommodate a liquid coolant such as water or a gas coolant such as air. In some embodiments, if air is used for cooling, the fluid conduit 424 can be omitted. In this case, the steps shown in Figure 4F can be omitted. In the example shown in Figure 4F the fluid conduit 424 can have an inlet portion and an outlet portion that extend vertically from the front surface of the first semiconductor package 401, and a central portion that extends between the inlet portion and the outlet portion and contacts the first semiconductor package 401.

[0041] Next, as Figure 4G shown, an interposer 412 is mounted on the first semiconductor package 401 via the solder bumps 416. The interposer 412 can have vents 420 and 422 to allow the fluid conduit 424 to pass through, or specifically to allow the inlet portion and the outlet portion of the fluid conduit to pass through. The interposer 412 can have a set of conductive patterns at its rear surface, and the set of conductive patterns can be aligned with and connected to the solder bumps 416. In this way, the interposer 412 can be electrically coupled to the first semiconductor package 401. In some embodiments, an additional adhesive material such as a molded material can be filled between the interposer 412 and the first semiconductor package 401 to enhance its connection.

[0042] Next, as Figure 4HAs shown, the second semiconductor package 418 is mounted, for example, on the front surface of the interposer 412 via solder bumps. The second semiconductor package 418 can be formed separately. Next, as Figure 4I shown, solder bumps 430 can be mounted on the back surface of the first semiconductor package 401 to serve as an interface between the semiconductor package assembly and an external device or system. In some embodiments, a mold cap can be formed on the interposer 412 to encapsulate the interposer 412 and the second semiconductor package 418.

[0043] After Figures 4A to 4I the respective steps shown, a semiconductor package assembly can be obtained. In some embodiments, a pump can be mounted together with a fluid conduit and be in fluid communication with the fluid conduit. The pump can be used to pump a coolant into the fluid conduit and cause the coolant to flow within the fluid conduit. In some other embodiments where no fluid conduit is mounted, a fan can be mounted on the interposer at a coolant fluid inlet to blow air into a coolant fluid path within the semiconductor package assembly.

[0044] The discussion herein includes many illustrative figures showing various portions of a semiconductor package assembly having an interlayer cooling path and methods for fabricating such a semiconductor package assembly. For clarity of illustration, such figures do not show all aspects of every example semiconductor package. Any of the example packages provided herein can share any or all features with any or all of the other packages provided herein.

[0045] The various embodiments have been described with reference to the drawings. However, it will be apparent that various modifications and changes can be made thereto without departing from the broader scope of the invention as set forth in the appended claims, and additional embodiments can be implemented. Additionally, other embodiments will be apparent to those skilled in the art by considering the specification and practice of one or more embodiments of the invention disclosed herein. Accordingly, it is intended that the present application and the examples herein be considered only as exemplary, with the true scope and spirit of the invention being indicated by the list of appended exemplary claims.

Claims

1. A semiconductor packaging component, characterized in that, The semiconductor packaging assembly includes: A first semiconductor package, the first semiconductor package including a first semiconductor element and a first set of conductive patterns that are both exposed from a front surface of the first semiconductor package; An interposer, the interposer being mounted on the front surface of the first semiconductor package via a set of interconnect structures, wherein the interposer includes a second set of conductive patterns at its rear surface, the second set of conductive patterns being aligned with the first set of conductive patterns such that the first set of conductive patterns and the second set of conductive patterns are electrically connected to each other through the set of interconnect structures; A second semiconductor package, the second semiconductor package being mounted on the front surface of the interposer; and Wherein the interposer includes a coolant inlet and a coolant outlet, the coolant inlet and the coolant outlet passing through the interposer and defining a coolant flow path between the interposer and the first semiconductor package to allow fluid flow from the coolant inlet through at least the exposed first semiconductor element to the coolant outlet.

2. The semiconductor package component according to claim 1, wherein, The semiconductor packaging assembly further includes: A fluid conduit, the fluid conduit being mounted between the first semiconductor package and the interposer, wherein the fluid conduit passes through the coolant inlet and the coolant outlet to form the coolant flow path in the fluid conduit.

3. The semiconductor packaging component according to claim 2, wherein The semiconductor packaging assembly further includes: A thermal interface material layer, the thermal interface material layer being formed between the fluid conduit and the exposed first semiconductor element.

4. The semiconductor package component according to claim 2, wherein, The fluid conduit includes a plurality of branches extending between the coolant inlet and the coolant outlet.

5. The semiconductor package component according to claim 2, wherein The fluid conduit has a zigzag shape that meanders along the front surface of the first semiconductor package.

6. The semiconductor packaging component according to claim 2, wherein, The semiconductor packaging assembly further includes: A pump, the pump being in fluid communication with the fluid conduit to pump coolant into the fluid conduit and cause the coolant to flow within the fluid conduit.

7. The semiconductor packaging component according to claim 2, wherein The fluid conduit is formed of a metallic material or alloy, and the fluid conduit is electrically isolated from the set of interconnect structures.

8. The semiconductor package component according to claim 1, characterized in that, The semiconductor packaging assembly further includes: A fan, the fan being mounted at the coolant inlet on the front surface of the interposer to blow air into the coolant flow path.

9. The semiconductor packaging component according to claim 1, wherein The first semiconductor package further includes: A first substrate, the first semiconductor element being mounted at the first substrate; A set of conductive structures, the set of conductive structures being mounted on the first substrate; A mold cap, the mold cap encapsulating the first semiconductor element and the set of conductive structures, wherein the mold cap forms the front surface of the first semiconductor package and exposes the front surfaces of the first semiconductor element and the set of conductive structures as the first set of conductive patterns.

10. A method for manufacturing a semiconductor packaging component, characterized in that, The method includes: Providing a first semiconductor package, wherein the first semiconductor package includes a first semiconductor element and a first set of conductive patterns that are both exposed from a front surface of the first semiconductor package; Attaching a set of interconnect structures on the front surface of the first semiconductor package and electrically connecting the set of interconnect structures to the first set of conductive patterns; A fluid conduit is mounted on the front surface of the first semiconductor package to thermally couple at least the fluid conduit to the exposed first semiconductor element, wherein the fluid conduit includes an inlet portion and an outlet portion that extend vertically from the front surface of the first semiconductor package; An interposer is mounted on the front surface of the first semiconductor package via the set of interconnect structures, wherein the interposer includes a second set of conductive patterns at its rear surface, the second set of conductive patterns being aligned with the first set of conductive patterns such that the first set of conductive patterns and the second set of conductive patterns are electrically connected to each other via the set of interconnect structures, and wherein the interposer includes a coolant inlet and a coolant outlet to allow the inlet portion and the outlet portion of the fluid conduit to pass through the interposer; and A second semiconductor package is mounted on the front surface of the interposer.

11. The method according to claim 10, wherein Before mounting the fluid conduit on the front surface of the first semiconductor package, the method further includes: Forming a thermal interface material layer on the exposed first semiconductor element.

12. The method according to claim 10, wherein The method further includes: Mounting a pump in fluid communication with the fluid conduit, the pump being configured to pump coolant into the fluid conduit and cause the coolant to flow within the fluid conduit.

13. A method for manufacturing a semiconductor package component, characterized in that, The method includes: Providing a first semiconductor package, wherein the first semiconductor package includes a first semiconductor element and a first set of conductive patterns that are both exposed from the front surface of the first semiconductor package; Attaching a set of interconnect structures on the front surface of the first semiconductor package and electrically connecting the set of interconnect structures to the first set of conductive patterns; Mounting an interposer on the front surface of the first semiconductor package via the set of interconnect structures, wherein the interposer includes a second set of conductive patterns at its rear surface, the second set of conductive patterns being aligned with the first set of conductive patterns such that the first set of conductive patterns and the second set of conductive patterns are electrically connected to each other via the set of interconnect structures, and wherein the interposer includes a coolant inlet and a coolant outlet, the coolant inlet and the coolant outlet passing through the interposer and defining a coolant flow path between the interposer and the first semiconductor package; and Mounting a second semiconductor package on the front surface of the interposer.

14. The method according to claim 13, characterized in that, The method further includes: Mounting a fan at the coolant inlet on the front surface of the interposer to blow air into the coolant flow path.

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