Substrate structure and manufacturing method thereof

Abstract

The invention provides a substrate structure and a manufacturing method thereof, relates to the technical field of semiconductor manufacturing, and aims to solve the problem that in the prior art, cracks are generated on the hole wall of a through hole under the action of thermal stress, and the cracks extend into a glass core plate in the length direction of the glass core plate, so that the quality of the substrate structure is influenced. The glass core plate comprises two opposite surfaces along the thickness direction of the glass core plate and a through hole penetrating through the glass core plate along the thickness direction of the glass core plate; an anti-crack expansion slot is formed in the position, corresponding to the end part of the through hole, in at least one surface of the glass core plate; and the anti-crack expansion slot is correspondingly positioned in at least partial circumferential direction of the through hole. The conductive layer is filled in the through hole; the anti-crack expansion slot is filled with the filling material layer; the brittleness of the filling material layer is smaller than that of the glass core plate, and the filling material layer and the conducting layer are made of different materials. The dielectric layers close to the glass core plate are arranged on the two faces of the glass core plate respectively and cover the filling material layers. The circuit layer is arranged on the dielectric layer and is electrically connected with the conductive layer.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and particularly relates to a substrate structure and a manufacturing method thereof. Background Art

[0002] In the prior art, a substrate structure generally includes a glass core board, and ABF layers and circuit layers located on the upper and lower surfaces of the glass core board. Among them, the glass core board has through holes penetrating its upper and lower surfaces, and the through holes are filled with copper, and the copper layer is used to realize the intercommunication of upper and lower signals.

[0003] In the actual process of manufacturing the substrate structure, the curing temperature of the ABF layer is generally 170°C to 220°C, and the electroplating temperature of the circuit layer is generally 20°C to 35°C. Since the thermal expansion coefficient of the copper filled in the through hole does not match that of the glass core board, with the progress of the electroplating of the circuit layers on the upper and lower surfaces of the glass core board and the ABF curing process, the change of temperature will cause a large thermal stress between the copper layer and the glass core board.

[0004] The thermal stress generates micro-cracks on the hole wall of the through hole, and the cracks will further extend into the glass core board along the length direction of the glass core board, thereby affecting the quality of the substrate structure. Summary of the Invention

[0005] The purpose of the present invention is to provide a substrate structure and a manufacturing method thereof, which are used to reduce the probability of cracks in the glass core board and improve the quality of the substrate structure.

[0006] In order to achieve the above purpose, the present invention provides the following technical solutions:

[0007] In the first aspect, the present invention provides a substrate structure. The substrate structure includes: a glass core board, a conductive layer, a filling material layer, a dielectric layer, and a circuit layer. The glass core board includes two opposite surfaces along the thickness direction of the glass core board; the glass core board has through holes penetrating the glass core board along the thickness direction of the glass core board; at least one surface of the glass core board is provided with anti-crack propagation grooves corresponding to the ends of the through holes; the anti-crack propagation grooves are correspondingly located at least partially circumferentially of the through holes. The conductive layer is filled in the through holes; the filling material layer is at least filled in the anti-crack propagation grooves; the brittleness of the filling material layer is less than that of the glass core board, and the material of the filling material layer is different from that of the conductive layer. The dielectric layers close to the glass core board are respectively arranged on the two surfaces of the glass core board and cover the filling material layer located in the opening area of the anti-crack propagation grooves. The circuit layer is arranged on the surface of the dielectric layer away from the glass core board; the circuit layer is electrically connected to the conductive layer. The dielectric layer and the circuit layer arranged in sequence along the direction away from the glass core board form a combined structure, and the substrate structure includes at least one combined structure.

[0008] In the substrate structure provided by the present invention, since the crack prevention and propagation grooves are correspondingly located at least partially circumferentially around the through holes, when a crack generated on the hole wall of the through hole due to thermal stress extends to both sides along the length direction of the glass core board, when the crack extends to the crack prevention and propagation grooves, part of the energy of the crack propagation is dissipated by the crack prevention and propagation grooves. The crack prevention and propagation grooves prevent the crack on one side of the crack prevention and propagation grooves from continuing to extend into the interior of the glass core board, improving the quality of the substrate structure. Further, since the filling material layer is at least filled in the crack prevention and propagation grooves, during the electroplating of the circuit layer and the curing of the dielectric layer, most of the thermal stress generated by the temperature change between the conductive layer and the glass core board acts on the filling material layer. Also, since the brittleness of the filling material layer is less than that of the glass core board, and the material of the filling material layer is different from that of the conductive layer. Based on this, on the one hand, the filling material layer can form a buffer zone at least partially circumferentially around the through hole or the conductive layer, and the filling material layer can absorb and disperse the thermal stress. At this time, the transfer of thermal stress into the glass core board can be reduced, thereby reducing or eliminating the probability of cracks being generated in the glass core board due to thermal stress, so as to improve the quality of the substrate structure. On the other hand, even if a tiny crack is generated on the hole wall of the through hole under the action of thermal stress, when the crack extends to both sides along the length direction of the glass core board, when the crack extends to the filling material layer, due to the brittleness of the filling material layer being less than that of the glass core board, and the material of the filling material layer being different from that of the conductive layer. At this time, the crack can basically not or completely not extend into the interior of the glass core board any more, thereby improving the quality of the substrate structure.

[0009] In one implementation, crack prevention and propagation grooves are provided at positions corresponding to the ends of the through holes on both sides of the glass core board; along the thickness direction of the glass core board, the two crack prevention and propagation grooves are spaced apart.

[0010] In one implementation, for the same through hole, the crack prevention and propagation grooves provided on both sides of the glass core board are both correspondingly located at a part of the circumference of the through hole, and the two crack prevention and propagation grooves are located on different sides of the through hole.

[0011] In one implementation, one crack prevention and propagation groove correspondingly surrounds one through hole.

[0012] In one implementation, the one-dimensional dimensions of the two crack prevention and propagation grooves located at both ends of the same through hole are the same, and the direction of the one-dimensional dimension of the crack prevention and propagation groove is perpendicular to the thickness direction of the glass core board;

[0013] And / or, the center of the crack prevention and propagation groove is located on the axis of the through hole, and the extending direction of the axis of the through hole is the same as the thickness direction of the glass core board.

[0014] In one implementation, the filler material layer is also disposed on the surface where the opening area of the crack arrest groove in the glass core board is located, and the conductive layer is exposed by the filler material layer; the dielectric layer close to the glass core board also covers the filler material layer located on the surface where the opening area of the crack arrest groove in the glass core board is located.

[0015] In a second aspect, the present invention also provides a manufacturing method of a substrate structure. The manufacturing method of the substrate structure includes:

[0016] Providing a glass core board; the glass core board includes two opposite surfaces along its thickness direction;

[0017] Along the thickness direction of the glass core board, a through hole penetrating the glass core board is opened;

[0018] Filling a conductive material in the through hole to form a conductive layer located in the through hole;

[0019] Along the thickness direction of the glass core board, a crack arrest groove is opened at a position corresponding to the end of the through hole in at least one surface of the glass core board; the crack arrest groove is correspondingly located at least partially circumferentially of the through hole;

[0020] At least filling a filler material in the crack arrest groove to form a filler material layer at least located in the crack arrest groove; the brittleness of the filler material layer is less than that of the glass core board, and the filler material is different from the conductive material.

[0021] For the beneficial effects of the second aspect and its various implementations in the present invention, reference can be made to the beneficial effects in the first aspect and its various implementations, which will not be elaborated here.

[0022] In one implementation, at least filling a filler material in the crack arrest groove to form a filler material layer at least located in the crack arrest groove includes:

[0023] Filling a filler material in the crack arrest groove to form a filler material layer located in the crack arrest groove and on the surface where the opening area of the crack arrest groove in the glass core board is located.

[0024] In one implementation, after filling a filler material in the crack arrest groove to form a filler material layer located in the crack arrest groove and on the surface where the opening area of the crack arrest groove in the glass core board is located, the manufacturing method of the substrate structure further includes:

[0025] Along the thickness direction of the filler material layer, a connection hole penetrating the filler material layer located on the conductive layer is opened to expose the conductive layer;

[0026] Filling a conductive material in the connection hole to form a conductive component located in the connection hole;

[0027] A dielectric layer is formed on the conductive member and on the filling material layer on the surface where the opening region of the crack propagation prevention groove in the glass core board is located;

[0028] A circuit layer is formed on the side of the dielectric layer away from the glass core board; the circuit layer is electrically connected to the conductive layer through the conductive member.

[0029] In one implementation, along the thickness direction of the glass core board, opening a crack propagation prevention groove at a position corresponding to the end of the through hole in at least one surface of the glass core board includes:

[0030] Along the thickness direction of the glass core board, crack propagation prevention grooves are opened at positions corresponding to the ends of the through holes on both surfaces of the glass core board; along the thickness direction of the glass core board, the two crack propagation prevention grooves are spaced apart. Description of the Drawings

[0031] The drawings described herein are used to provide a further understanding of the present invention, and constitute a part of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention, and do not constitute an improper limitation to the present invention. In the drawings:

[0032] Figure 1 It is a cross-sectional view of a substrate structure with cracks in the prior art;

[0033] Figure 2 is Figure 1 an enlarged schematic view of a partial structure in

[0034] Figure 3 It is a cross-sectional view of the first substrate structure in the embodiment of the present invention;

[0035] Figure 4 is in the embodiment of the present invention Figure 3 an enlarged schematic view of a partial structure in

[0036] Figure 5 It is a cross-sectional view of the glass core board with the first crack propagation prevention groove opened in the embodiment of the present invention;

[0037] Figure 6 It is a cross-sectional view of the glass core board with the second crack propagation prevention groove opened in the embodiment of the present invention;

[0038] Figure 7 It is a cross-sectional view of the glass core board with the third crack propagation prevention groove opened in the embodiment of the present invention;

[0039] Figure 8 It is a cross-sectional view of the glass core board with the fourth crack propagation prevention groove opened in the embodiment of the present invention;

[0040] Figure 9 It is a cross-sectional view of the glass core board with the fifth crack propagation prevention groove opened in the embodiment of the present invention;

[0041] Figure 10 Cross-sectional view of the glass core board with the sixth type of crack propagation prevention groove in the embodiment of the present invention;

[0042] Figure 11 Cross-sectional view of the glass core board with the seventh type of crack propagation prevention groove in the embodiment of the present invention;

[0043] Figure 12 Cross-sectional view of the glass core board with the eighth type of crack propagation prevention groove in the embodiment of the present invention;

[0044] Figure 13 Cross-sectional view of the glass core board with the ninth type of crack propagation prevention groove in the embodiment of the present invention;

[0045] Figure 14 Cross-sectional view of the glass core board with the tenth type of crack propagation prevention groove in the embodiment of the present invention;

[0046] Figure 15 Cross-sectional view of the glass core board with the eleventh type of crack propagation prevention groove in the embodiment of the present invention;

[0047] Figure 16 Cross-sectional view of the glass core board with the twelfth type of crack propagation prevention groove in the embodiment of the present invention;

[0048] Figure 17 Cross-sectional view of the glass core board with the thirteenth type of crack propagation prevention groove in the embodiment of the present invention;

[0049] Figure 18 Cross-sectional view of the glass core board with the fourteenth type of crack propagation prevention groove in the embodiment of the present invention;

[0050] Figure 19 Process of manufacturing the first substrate structure in the embodiment of the present invention Figure 1 ;

[0051] Figure 20 In the embodiment of the present invention Figure 19 Cross-sectional view of B-B' in;

[0052] Figure 21 Process of manufacturing the first substrate structure in the embodiment of the present invention Figure 2 ;

[0053] Figure 22 In the embodiment of the present invention Figure 21 Cross-sectional view of C-C' in;

[0054] Figure 23 Process of manufacturing the first substrate structure in the embodiment of the present invention Figure 3 ;

[0055] Figure 24 In the embodiment of the present invention Figure 23 Cross-sectional view D-D' in

[0056] Figure 25 Process of manufacturing the first substrate structure in the embodiment of the present invention Figure 3 ;

[0057] Figure 26 In the embodiment of the present invention Figure 25 Cross-sectional view E-E' in

[0058] Figure 27 Process of manufacturing the first substrate structure in the embodiment of the present invention Figure 4 ;

[0059] Figure 28 Process of manufacturing the second substrate structure in the embodiment of the present invention Figure 1 ;

[0060] Figure 29 In the embodiment of the present invention Figure 28 Cross-sectional view F-F' in

[0061] Figure 30 Process of manufacturing the second substrate structure in the embodiment of the present invention Figure 2 ;

[0062] Figure 31 In the embodiment of the present invention Figure 30 Cross-sectional view G-G' in

[0063] Figure 32 Process of manufacturing the second substrate structure in the embodiment of the present invention Figure 3 ;

[0064] Figure 33 Cross-sectional view of the second substrate structure in the embodiment of the present invention

[0065] Reference numerals:

[0066] 1 - Substrate structure, 10 - Glass core board, 11 - Conductive layer, 12 - Filling material layer, 13 - Dielectric layer, 14 - Circuit layer, 15 - Through hole, 16 - Crack propagation prevention groove, 17 - Connection hole, 18 - Conductive member, 2 - Crack Detailed implementation manner

[0067] For the convenience of clearly describing the technical solutions of the embodiments of the present invention, in the embodiments of the present invention, terms such as "first" and "second" are used to distinguish identical or similar items with basically the same functions and roles. For example, the first threshold and the second threshold are only used to distinguish different thresholds, and do not limit their sequence. Those skilled in the art can understand that terms such as "first" and "second" do not limit the quantity and execution order, and the terms "first" and "second" do not necessarily limit them to be different.

[0068] It should be noted that in the present invention, words such as "exemplary" or "for example" are used to represent examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the present invention should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Exactly speaking, using words such as "exemplary" or "for example" aims to present relevant concepts in a specific way.

[0069] In the present invention, "at least one" means one or more, and "a plurality" means two or more. "And / or" describes the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone, where A and B can be singular or plural. The character " / " generally represents an "or" relationship between the front and back associated objects. "At least one (item)" or its similar expression refers to any combination of these items, including any combination of single item (item) or plural items (items). For example, at least one (item) of a, b or c can represent: a, b, c, the combination of a and b, the combination of a and c, the combination of b and c, or the combination of a, b and c, where a, b and c can be single or multiple.

[0070] Combined with the background technology, with the development of artificial intelligence and high-performance computing, the chip size supporting computing power is continuously increasing, and the requirements for the substrate size are also rapidly rising. Compared with organic substrates, glass substrates have gradually become a more concerned solution due to their superior flatness, low coefficient of thermal expansion (CTE), high stiffness and good electrical properties. However, as a brittle material, the strength of glass is extremely sensitive to defects, especially in the process links involving thermal stress and mechanical stress during the manufacturing process, the glass substrate faces a high risk of failure.

[0071] After filling copper in the through holes, due to the mismatch between the coefficient of thermal expansion of the copper filled in the through holes and that of the glass core board, with the progress of the electroplating and ABF curing processes of the circuit layers on the upper and lower surfaces of the glass core board, the change in temperature will cause large thermal stress between the copper layer and the glass core board.

[0072] See Figure 1 and Figure 2, the thermal stress generates minute cracks 2 on the pore wall of the through hole, and the cracks 2 will further extend towards the glass core board 10 along the length direction of the glass core board 10, thereby affecting the quality of the substrate structure 1.

[0073] To solve the above technical problems, the embodiments of the present invention provide a substrate structure and a manufacturing method thereof.

[0074] In a first aspect, the present invention provides a substrate structure. Refer to Figures 3 to 33 , the substrate structure 1 includes: a glass core board 10, a conductive layer 11, a filling material layer 12, a dielectric layer 13, and a circuit layer 14. The glass core board 10 includes two opposite surfaces along the thickness direction A of the glass core board 10; the glass core board 10 has a through hole 15 penetrating the glass core board 10 along the thickness direction A of the glass core board 10; at least one surface of the glass core board 10 is provided with a crack propagation prevention groove 16 corresponding to the end of the through hole 15; the crack propagation prevention groove 16 is correspondingly located at least partially circumferentially of the through hole 15. It should be noted that the depth of the above crack propagation prevention groove 16 is less than the thickness of the glass core board 10, and the depth direction of the crack propagation prevention groove 16 is consistent with the thickness direction of the glass core board 10. The conductive layer 11 is filled in the through hole 15; the filling material layer 12 is at least filled in the crack propagation prevention groove 16; the brittleness of the filling material layer 12 is less than that of the glass core board 10, and the material of the filling material layer 12 is different from that of the conductive layer 11. The dielectric layer 13 close to the glass core board 10 is respectively provided on two surfaces of the glass core board 10 and covers the filling material layer 12 located in the opening area of the crack propagation prevention groove 16. The circuit layer 14 is provided on the surface of the dielectric layer 13 away from the glass core board 10; the circuit layer 14 is electrically connected to the conductive layer 11. The dielectric layer 13 and the circuit layer 14 arranged in sequence along the direction away from the glass core board 10 form a combined structure, and the substrate structure 1 includes at least one combined structure. It should be noted that refer to Figures 5 to 18 , the inner wall of the crack propagation prevention groove 16 and the outer wall of the conductive layer 11 are spaced apart; and / or, the inner wall of the crack propagation prevention groove 16 abuts against the outer wall of the conductive layer 11. When the inner wall of the crack propagation prevention groove 16 and the outer wall of the conductive layer 11 are spaced apart, the distance between the inner wall of the crack propagation prevention groove 16 and the outer wall of the conductive layer 11 is not specifically limited as long as it can meet the actual needs.

[0075] Refer to Figures 1 to 33, in the substrate structure 1 provided by the embodiment of the present invention, since the anti-crack propagation groove 16 is correspondingly located at least partially circumferentially around the through hole 15, when the crack 2 generated on the hole wall of the through hole 15 due to thermal stress extends towards both sides along the length direction of the glass core plate 10, when the crack 2 extends to the anti-crack propagation groove 16, part of the energy of the crack 2 propagation is dissipated by the anti-crack propagation groove 16, and the anti-crack propagation groove 16 prevents the crack 2 on one side of the anti-crack propagation groove 16 from continuing to extend into the interior of the glass core plate 10, improving the quality of the substrate structure 1. In other words, if the glass core plate 10 provided in this application is actually used to make the substrate structure 1 and there is no material filled in the anti-crack propagation groove 16, the anti-crack propagation groove 16 can also be used to block the crack 2 on one side of it from continuing to extend into the interior of the glass core plate 10.

[0076] Further, since the filling material layer 12 is at least filled in the anti-crack propagation groove 16, during the electroplating of the circuit layer 14 and the curing of the dielectric layer 13, most of the thermal stress generated by the temperature change between the conductive layer 11 and the glass core plate 10 acts on the filling material layer 12. Also, since the brittleness of the filling material layer 12 is less than that of the glass core plate 10, and the material of the filling material layer 12 is different from that of the conductive layer 11. Based on this, on the one hand, the filling material layer 12 can form a buffer zone at least partially circumferentially around the through hole 15 or the conductive layer 11, and the filling material layer 12 can absorb and disperse the thermal stress. At this time, the transfer of thermal stress into the glass core plate 10 can be reduced, thereby reducing or eliminating the probability of the glass core plate 10 generating cracks 2 due to thermal stress, so as to improve the quality of the substrate structure 1. On the other hand, even if a tiny crack 2 is generated on the hole wall of the through hole 15 under the action of thermal stress, when the crack 2 extends towards both sides along the length direction of the glass core plate 10 and the crack 2 extends to the filling material layer 12, due to the brittleness of the filling material layer 12 being less than that of the glass core plate 10, and the material of the filling material layer 12 being different from that of the conductive layer 11. At this time, the crack 2 can hardly or completely no longer extend into the interior of the glass core plate 10, thereby improving the quality of the substrate structure 1. In summary, the anti-crack propagation groove 16 filled with the filling material layer 12 can reduce or avoid the problems of cracks 2 and interface failure caused by thermal mismatch, thereby improving the reliability of the large-size substrate structure 1 in high-density packaging.

[0077] Exemplarily, the above through hole is a TGV (Through-Glass Via) hole. The number of the above through holes can be opened according to actual needs. For example, it can be 1, 2 or more. When the number of through holes is multiple, they are spaced apart along the length direction of the glass core plate. As for the aperture, shape, etc. of the through hole, they can be set according to actual needs and will not be specifically limited here.

[0078] The number of crack arrest grooves formed on at least one surface of the glass core board, as well as the cross-sectional shape and size of the crack arrest grooves, can be set according to actual needs. Exemplarily, for one surface of the glass core board, the crack arrest grooves correspond one-to-one with the through holes. Alternatively, for one surface of the glass core board, the number of crack arrest grooves is less than the number of through holes, that is, crack arrest grooves are formed only at the end positions of some of the through holes. It should be noted that even if crack arrest grooves are formed only at the end positions of some of the through holes, compared with the prior art, the number of cracks extending into the glass core board can be reduced, the probability of the glass core board cracking due to thermal stress can be decreased, and the quality of the substrate structure can be improved. Further, since the crack arrest grooves are correspondingly located at at least part of the circumferences of the through holes, the crack arrest grooves can be semi-circular ring-shaped, circular ring-shaped, square ring-shaped, pentagonal ring-shaped or other special-shaped ring-shaped, etc.

[0079] As a possible implementation manner, the material of the conductive layer is not limited to copper, and other materials that meet actual requirements can also be used. The conductive layer can achieve the intercommunication of upper and lower signals.

[0080] The brittleness of the filling material layer is less than that of the glass core board, and the material of the filling material layer is different from that of the conductive layer. As a possible implementation manner, the material of the above-mentioned filling material layer includes conductive materials or insulating materials.

[0081] Exemplarily, the material of the above-mentioned conductive material is not limited to copper, tungsten or titanium, and other materials that meet actual requirements can also be used. It should be noted that when the material of the conductive layer is copper, the material of the conductive material used to form the filling material layer can be tungsten or titanium.

[0082] The insulating material can be at least one or more of ABF, PI (Polyimide, translated as: polyimide) or ABF-like. Among them, ABF is an interlayer insulating resin material for substrates developed by Ajinomoto Co., Inc. in Japan, and ABF-like is an interlayer insulating resin with the same function as ABF developed by other material suppliers.

[0083] The material of the dielectric layer can be at least one or more of ABF, PI (Polyimide, translated as: polyimide) or ABF-like.

[0084] In this application, the material of the filling material layer is the same as that of the dielectric layer.

[0085] The above-mentioned circuit layer can include an inner circuit layer and an outer circuit layer. As for its specific division and structure, no detailed description is given here as long as it can meet actual requirements.

[0086] A dielectric layer and a circuit layer are sequentially arranged in a direction away from the glass core board to form a combined structure, and the substrate structure includes at least one combined structure. Exemplarily, three combined structures are formed on one surface of the glass core board.

[0087] As a possible implementation, refer to Figures 7 to 15 、 Figure 17 and Figure 18 , anti-crack propagation grooves 16 are provided at positions corresponding to the ends of the through holes 15 on both sides of the glass core board 10; along the thickness direction A of the glass core board 10, the two anti-crack propagation grooves 16 are spaced apart.

[0088] That is, an anti-crack propagation groove is provided at the position at both ends of each through hole. As for the depth to which the two anti-crack propagation grooves extend into the glass core board, the one-dimensional dimensions of the two anti-crack propagation grooves are not specifically limited here and can be set according to actual conditions. Among them, the direction of the one-dimensional dimension of the anti-crack propagation groove is perpendicular to the thickness direction of the glass core board. When the cross-section of the anti-crack propagation groove is a regular quadrilateral, the one-dimensional dimension can refer to the length or width or diagonal dimension of the anti-crack propagation groove, etc. When the cross-section of the anti-crack propagation groove is a circular ring or a semi-circular ring, the one-dimensional dimension can refer to the ring width of the anti-crack propagation groove. It should be noted that the ring width refers to the difference between the outer diameter and the inner diameter of the anti-crack propagation groove. When the cross-section of the anti-crack propagation groove is an elliptical ring, the one-dimensional dimension can refer to the difference between the outer major axis and the inner major axis or the difference between the outer minor axis and the inner minor axis of the anti-crack propagation groove.

[0089] Refer to Figures 6 to 11 , for the convenience of description, the two sides of the glass core board 10 are respectively named the first side and the second side. The anti-crack propagation groove 16 with the opening area located on the first side is named the first anti-crack propagation groove, and the anti-crack propagation groove 16 with the opening area located on the second side is named the second anti-crack propagation groove. For the same through hole 15, the depth of the first anti-crack propagation groove can be equal to the depth of the second anti-crack propagation groove; or, the depth of the first anti-crack propagation groove can be less than the depth of the second anti-crack propagation groove; or, the depth of the first anti-crack propagation groove can be greater than the depth of the second anti-crack propagation groove. For multiple through holes provided on the glass core board, the magnitude relationship between the depths of the multiple first anti-crack propagation grooves and the depths of the multiple second anti-crack propagation grooves can be at least one or more of the magnitude relationships between the depth of the first anti-crack propagation groove and the depth of the second anti-crack propagation groove in the case of one through hole above. The one-dimensional dimensions of the two anti-crack propagation grooves are the same, and no repeated description is made here.

[0090] Refer to Figure 4 、 Figures 6 to 15 、 Figure 17 and Figure 18, along the thickness direction A of the glass core board 10, the glass core board 10 is sequentially divided into upper, middle, and lower regions. When anti-crack propagation grooves 16 are provided at positions corresponding to the ends of the through holes 15 on both sides of the glass core board 10, and the anti-crack propagation grooves 16 are filled with a filling material layer 12, the number of buffer zones is increased, the ability to absorb and disperse thermal stress is enhanced, and the transfer of thermal stress to the glass core board 10 is further reduced, thereby reducing or eliminating the probability of cracks 2 occurring in the upper and lower regions of the glass core board 10 caused by thermal stress, so as to further improve the quality of the substrate structure 1.

[0091] It should be noted that referring to Figures 6 to 15 、 Figure 17 and Figure 18 , when anti-crack propagation grooves 16 are provided at positions corresponding to the ends of the through holes 15 on both sides of the glass core board 10, for the same through hole 15, the two anti-crack propagation grooves 16 may both be correspondingly located in a partial circumference of the through hole 15, or each anti-crack propagation groove 16 correspondingly surrounds the through hole 15, or one anti-crack propagation groove 16 is correspondingly located in a partial circumference of the through hole 15, and the other anti-crack propagation groove 16 correspondingly surrounds the through hole 15.

[0092] As a possible implementation, referring to Figures 6 to 8 、 Figures 13 to 15 , at the same through hole 15, the anti-crack propagation grooves 16 provided on the two sides of the glass core board 10 are both correspondingly located in a partial circumference of the through hole 15. At this time, the two anti-crack propagation grooves 16 are located on the same side of the through hole 15, or the two anti-crack propagation grooves 16 are located on different sides of the through hole 15.

[0093] In some embodiments, referring to Figure 8 and Figure 14 , the two anti-crack propagation grooves 16 are located on different sides of the through hole 15. Compared with the two anti-crack propagation grooves 16 being located on the same side of the through hole 15, the probability of the mechanical strength of the glass core board 10 being reduced due to the concentrated distribution of the two anti-crack propagation grooves 16 can be reduced at this time. Based on this, the probability of the glass core board 10 being broken during the subsequent lamination process to form the substrate structure 1 can be reduced, the integrity of the glass core board 10, and the yield rate of the substrate structure 1 including the glass core board 10 are improved.

[0094] Combined with Figure 1 、 Figure 8 and Figure 14, since the cracks 2 in the upper and lower regions of the glass core board 10 are generally located on different sides of the through hole 15, in some embodiments, the two crack arrest grooves 16 located on different sides of the through hole 15 respectively cover the regions where the cracks 2 are originally generated. At this time, the buffer zone formed by the filling material layer 12 in the crack arrest groove 16 can be fully utilized to effectively absorb and disperse the thermal stress, reduce or eliminate the transfer of the thermal stress into the glass core board 10, thereby further reducing or eliminating the probability of the glass core board 10 generating cracks 2 due to the thermal stress, so as to further improve the quality of the substrate structure 1.

[0095] As a possible implementation manner, whether the crack arrest groove 16 is opened at the position corresponding to the end of the through hole 15 on one side of the glass core board 10, or the crack arrest grooves 16 are opened at the positions corresponding to the ends of the through hole 15 on both sides of the glass core board 10, one crack arrest groove 16 correspondingly surrounds one through hole 15. In other words, one crack arrest groove 16 completely surrounds one through hole 15, and the through hole 15 is located in the inner ring of the crack arrest groove 16.

[0096] Since the crack arrest groove 16 is also filled with the filling material layer 12, not only the area of the buffer zone is increased at this time, the ability to absorb and disperse the thermal stress is further improved, and the transfer of the thermal stress into the glass core board 10 is further reduced, thereby reducing or eliminating the probability of the glass core board 10 generating cracks 2 due to the thermal stress, so as to further improve the quality of the substrate structure 1. At the same time, the above buffer zone can comprehensively protect the glass core board 10 corresponding to the depth (or thickness) of the crack arrest groove 16 to ensure the quality of this part of the glass core board 10.

[0097] As a possible implementation manner, see Figures 3 to 10 、 Figures 12 to 17 , the crack arrest grooves 16 are opened at the positions corresponding to the ends of the through hole 15 on both sides of the glass core board 10, and at the same through hole 15, the crack arrest grooves 16 opened on the two sides of the glass core board 10 are both correspondingly located in a partial circumference of the through hole 15, or when each crack arrest groove 16 correspondingly surrounds one through hole 15, along the thickness direction of the glass core board 10, the one-dimensional dimensions of the two crack arrest grooves 16 located at both ends of the same through hole 15 are the same.

[0098] In the case of adopting the above technical solution, on the premise that the crack prevention and expansion groove 16 filled with the filling material layer 12 can effectively prevent the crack 2 from expanding and absorb and disperse the thermal stress, compared with the situation where the one-dimensional size of one crack prevention and expansion groove 16 is larger than that of the other crack prevention and expansion groove 16, when the one-dimensional sizes of the two crack prevention and expansion grooves 16 located at both ends of the same through hole 15 in this application are the same, the size of the groove opening can be reduced, and correspondingly, the area of the effective region in the glass core board 10 can be increased. Based on this, not only the mechanical strength of the glass core board 10 can be ensured, but also the utilization rate of the glass core board 10 can be improved.

[0099] As a possible implementation manner, the center of the crack prevention and expansion groove is located on the axis of the through hole, and the extending direction of the axis of the through hole is consistent with the thickness direction of the glass core board.

[0100] In the case of adopting the above technical solution, on the one hand, since the filling material layer is also filled in the crack prevention and expansion groove, not only the area of the buffer zone is increased at this time, the ability to absorb and disperse the thermal stress is further improved, and the transfer of the thermal stress into the glass core board is further reduced, thereby reducing or eliminating the probability of the glass core board generating cracks due to the thermal stress, so as to further improve the quality of the substrate structure. At the same time, the above buffer zone can comprehensively protect the glass core board corresponding to the depth (or thickness) of the crack prevention and expansion groove to ensure the quality of this part of the glass core board. On the other hand, the sizes of the crack prevention and expansion grooves in the circumferential direction of the through hole or the conductive layer are uniform. Compared with the situation where the one-dimensional size of the crack prevention and expansion groove on one side of the same through hole is larger than that of the crack prevention and expansion groove on the other side, the size of the groove opening can be reduced, and correspondingly, the area of the effective region in the glass core board can be increased. Based on this, not only the mechanical strength of the glass core board can be ensured, but also the utilization rate of the glass core board can be improved.

[0101] As a possible implementation manner, refer to Figure 24 、 Figure 26 and Figure 27 or Figures 29 to 33 , the filling material layer 12 is also arranged on the surface where the opening area of the crack prevention and expansion groove 16 in the glass core board 10 is located, and the filling material layer 12 exposes the conductive layer 11; the dielectric layer 13 close to the glass core board 10 also covers the filling material layer 12 on the surface where the opening area of the crack prevention and expansion groove 16 in the glass core board 10 is located.

[0102] At this time, the filling material layer 12 disposed on the surface where the opening area of the anti-crack propagation groove 16 in the glass core plate 10 is located can be used as a protective layer to further protect the glass core plate 10, provide support for the surface of the glass core plate 10, and further improve the mechanical strength of the glass core plate 10, so as to avoid the probability of the glass core plate 10 being broken during the later process of laminating to form the substrate structure 1, improve the integrity of the glass core plate 10, and the yield rate of the substrate structure 1 including the glass core plate 10.

[0103] In some embodiments, referring to Figure 3 and Figure 4 , when the material of the filling material layer 12 is the same as that of the dielectric layer 13, on the one hand, the filling material layer 12 can be used as a part of the dielectric layer 13. At this time, the raw material consumption of the dielectric layer 13 during the later formation of the substrate structure 1 can be reduced, and the manufacturing cost of the substrate structure 1 can be lowered. On the other hand, the repulsion between the filling material layer 12 and the dielectric layer 13 can be avoided, and the bonding strength between the filling material layer 12 and the dielectric layer 13 can be improved, thereby improving the quality of the substrate structure 1.

[0104] Secondly, the present invention also provides a manufacturing method of a substrate structure. Referring to Figures 19 to 33 , the manufacturing method of the substrate structure includes:

[0105] Step 101: Provide a glass core plate 10; the glass core plate 10 includes two opposite surfaces along its thickness direction;

[0106] Step 102: Referring to Figure 19 and Figure 20 , along the thickness direction of the glass core plate 10, a through hole 15 penetrating the glass core plate 10 is opened;

[0107] Exemplarily, the above through hole 15 can be formed by means of laser or etching. Other descriptions of the through hole 15 can refer to the first aspect and will not be elaborated here.

[0108] Step 103: Referring to Figure 21 and Figure 22 , a conductive material is filled in the through hole 15 to form a conductive layer 11 located in the through hole 15;

[0109] Exemplarily, the material of the above conductive material is not limited to copper, tungsten or titanium, and can also be other materials that meet the actual requirements.

[0110] Optionally, a conductive layer located in the through hole can be formed by means of deposition, electroplating, etc.

[0111] Step 104: Referring to Figures 20 to 24 , or referring to Figure 28 and Figure 29, along the thickness direction of the glass core board 10, anti-crack propagation grooves 16 are formed at positions corresponding to the ends of the through holes 15 on at least one surface of the glass core board 10; the anti-crack propagation grooves 16 are correspondingly located at at least part of the circumferences of the through holes 15;

[0112] Exemplarily, the above anti-crack propagation grooves can be formed by means such as laser induction or etching. Other descriptions of the anti-crack propagation grooves can be referred to in the first aspect and will not be elaborated here.

[0113] It should be noted that referring to Figures 5 to 18 , the inner wall of the anti-crack propagation groove 16 and the outer wall of the conductive layer 11 are spaced apart; and / or, the inner wall of the anti-crack propagation groove 16 abuts against the outer wall of the conductive layer 11. When the inner wall of the anti-crack propagation groove 16 and the outer wall of the conductive layer 11 are spaced apart, the distance between the inner wall of the anti-crack propagation groove 16 and the outer wall of the conductive layer 11 is not specifically limited as long as it can meet the actual needs.

[0114] Step 105: Refer to Figures 24 to 26 , or refer to Figures 29 to 31 , at least a filling material is filled in the anti-crack propagation groove 16 to form a filling material layer 12 at least located in the anti-crack propagation groove 16; the brittleness of the filling material layer 12 is less than that of the glass core board 10, and the material of the filling material layer 12 is different from that of the conductive layer 11. Related descriptions of the material of the filling material layer 12 can be referred to in the first aspect and will not be elaborated here.

[0115] For the beneficial effects of the second aspect and its various implementation manners in the embodiments of the present invention, reference can be made to the beneficial effects in the first aspect and its various implementation manners, which will not be elaborated here.

[0116] It should be noted that the above filling material can be filled only in the anti-crack propagation groove, or a filling material is filled in the anti-crack propagation groove to form a filling material layer located in the anti-crack propagation groove and on the surface of the glass core board where the opening area of the anti-crack propagation groove is located.

[0117] In an alternative manner, referring to Figures 24 to 27 , or referring to Figures 29 to 32 , after filling a filling material in the anti-crack propagation groove 16 to form a filling material layer 12 located in the anti-crack propagation groove 16 and on the surface of the glass core board 10 where the opening area of the anti-crack propagation groove 16 is located, the manufacturing method of the substrate structure 1 further includes:

[0118] First, along the thickness direction of the filling material layer 12, a connection hole 17 is formed through the filling material layer 12 located on the conductive layer 11 to expose the conductive layer 11;

[0119] Exemplarily, as described in the foregoing, the filling material layer 12 on the surface where the opening area of the anti-crack propagation groove 16 in the glass core plate 10 is located completely covers the surface of the glass core plate 10. Therefore, the filling material layer 12 must cover the conductive layer 11 within the through hole 15. In order to achieve the electrical connection between the conductive layer 11 and the later-formed circuit layer 14, a connection hole 17 is formed at the filling material layer 12 on the conductive layer 11 to expose the conductive layer 11. For example, the above connection hole 17 can be formed by means such as laser or etching.

[0120] Next, a conductive material is filled in the connection hole 17 to form a conductive member 18 within the connection hole 17;

[0121] Exemplarily, the material of the above conductive material is not limited to copper, tungsten or titanium, and can also be other materials that meet the actual requirements.

[0122] Optionally, deposition, electroplating and other methods can be used to form the conductive member 18 within the connection hole 17.

[0123] Next, a dielectric layer 13 is formed on the conductive member 18 and the filling material layer 12 on the surface where the opening area of the anti-crack propagation groove 16 in the glass core plate 10 is located;

[0124] Exemplarily, the material of the dielectric layer can be at least one or more of ABF, PI (Polyimide, translated as: polyimide) or ABF-like. As for the method of forming the dielectric layer, reference can be made to the prior art and will not be described in detail here.

[0125] Next, a circuit layer 14 is formed on one side of the dielectric layer 13 away from the glass core plate 10; the circuit layer 14 is electrically connected to the conductive layer 11 through the conductive member 18.

[0126] In one example, the dielectric layer and the circuit layer arranged in sequence in the direction away from the glass core plate form a combined structure, and the substrate structure includes at least one combined structure.

[0127] The above circuit layer can include an inner circuit layer and an outer circuit layer. As for its specific division and structure, it will not be described in detail here as long as it can meet the actual requirements.

[0128] The one-dimensional dimension of the above conductive member can be set according to the actual situation and will not be specifically limited here. As a possible implementation, refer to Figure 4 or Figure 33, the one-dimensional dimension of the above-mentioned conductive member 18 is smaller than the one-dimensional dimension of the conductive layer 11, and the directions of the one-dimensional dimensions of the conductive member 18 and the conductive layer 11 are both perpendicular to the thickness direction of the glass core board 10. At this time, not only can the damage to the filling material layer 12 on the surface where the opening area of the crack propagation prevention groove 16 in the glass core board 10 is located be reduced, but also the formation time of the conductive member 18 can be shortened, and the manufacturing efficiency of the substrate structure 1 can be improved.

[0129] When the cross-section of the conductive member is a regular quadrilateral, the one-dimensional dimension can refer to the length or width or diagonal dimension of the conductive member, etc. When the cross-section of the conductive member is circular, the one-dimensional dimension can refer to the diameter of the conductive member. When the cross-section of the conductive member is elliptical, the one-dimensional dimension can refer to the major axis or minor axis of the conductive member, etc. The same applies to the conductive layer and will not be elaborated here.

[0130] As a possible implementation, see Figure 4 or Figure 33 , along the thickness direction of the glass core board 10, opening the crack propagation prevention groove 16 at the position corresponding to the end of the through hole 15 in at least one side of the glass core board 10 includes: opening the crack propagation prevention groove 16 at the positions corresponding to the ends of the through hole 15 on both sides of the glass core board 10 along the thickness direction of the glass core board 10; along the thickness direction of the glass core board 10, the two crack propagation prevention grooves 16 are spaced apart. The description of this part can refer to the first aspect and will not be elaborated here.

[0131] Although the present invention has been described in conjunction with various embodiments herein, however, in the process of implementing the claimed invention, those skilled in the art can understand and achieve other variations of the disclosed embodiments by viewing the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality of cases. A single processor or other unit can implement several functions recited in the claims. Certain measures are recited in mutually different dependent claims, but this does not mean that these measures cannot be combined to produce good results.

[0132] Although the present invention has been described in combination with specific features and their embodiments, it is obvious that various modifications and combinations can be made without departing from the spirit and scope of the present invention. Accordingly, the present specification and the drawings are merely exemplary descriptions of the present invention defined by the appended claims, and are considered to have covered any and all modifications, variations, combinations, or equivalents within the scope of the present invention. Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention is also intended to include these changes and modifications.

Claims

1. A substrate structure, characterized in that, Comprising: A glass core board, the glass core board including two opposite surfaces along the thickness direction of the glass core board; the glass core board having a through hole penetrating the glass core board along the thickness direction of the glass core board; at least one surface of the glass core board having a crack propagation prevention groove opened at a position corresponding to the end of the through hole; the crack propagation prevention groove corresponding to be located at least partially circumferentially of the through hole; A conductive layer filled in the through hole; A filling material layer filled at least in the crack propagation prevention groove; the brittleness of the filling material layer is less than that of the glass core board, and the material of the filling material layer is different from the material of the conductive layer; A dielectric layer, the dielectric layers close to the glass core board are respectively disposed on two surfaces of the glass core board, and cover the filling material layer located in the opening area of the crack propagation prevention groove; A circuit layer disposed on a surface of the dielectric layer away from the glass core board; the circuit layer is electrically connected to the conductive layer; The dielectric layer and the circuit layer sequentially disposed in a direction away from the glass core board form a combined structure, and the substrate structure includes at least one such combined structure.

2. The substrate structure according to claim 1, wherein Crack propagation prevention grooves are opened at positions corresponding to the ends of the through hole on both surfaces of the glass core board; along the thickness direction of the glass core board, the two crack propagation prevention grooves are spaced apart.

3. The substrate structure according to claim 2, characterized in that, At the same through hole, the crack propagation prevention grooves opened on the two surfaces of the glass core board are both correspondingly located at a part of the circumference of the through hole, and the two crack propagation prevention grooves are located on different sides of the through hole.

4. The substrate structure according to claim 1 or 2, characterized in that, One crack propagation prevention groove correspondingly surrounds one through hole.

5. The substrate structure according to claim 4, wherein The one-dimensional dimensions of the two crack propagation prevention grooves located at both ends of the same through hole are the same, and the direction of the one-dimensional dimension of the crack propagation prevention groove is perpendicular to the thickness direction of the glass core board; And / or, the center of the crack propagation prevention groove is located on the axis of the through hole, and the extending direction of the axis of the through hole is the same as the thickness direction of the glass core board.

6. The substrate structure according to claim 1, wherein The filling material layer is further disposed on the surface of the glass core board where the opening area of the crack propagation prevention groove is located, and the filling material layer exposes the conductive layer; The dielectric layer close to the glass core board further covers the filling material layer on the surface of the glass core board where the opening area of the crack propagation prevention groove is located.

7. A manufacturing method of a substrate structure, characterized in that Comprising: Providing a glass core board; the glass core board including two opposite surfaces along its thickness direction; Along the thickness direction of the glass core board, opening a through hole penetrating the glass core board; Filling a conductive material in the through hole to form a conductive layer located in the through hole; Along the thickness direction of the glass core board, opening a crack propagation prevention groove at a position corresponding to the end of the through hole in at least one surface of the glass core board; the crack propagation prevention groove corresponding to be located at least partially circumferentially of the through hole; At least filling a filling material in the crack propagation prevention groove to form a filling material layer at least located in the crack propagation prevention groove; the brittleness of the filling material layer is less than that of the glass core board, and the material of the filling material layer is different from the material of the conductive layer.

8. The manufacturing method of the substrate structure according to claim 7, characterized in that, At least filling a filling material in the anti-crack propagation groove to form a filling material layer located at least in the anti-crack propagation groove includes: Filling a filling material in the anti-crack propagation groove to form a filling material layer located in the anti-crack propagation groove and on the surface of the glass core board where the opening area of the anti-crack propagation groove is located.

9. The manufacturing method of the substrate structure according to claim 8, wherein, After filling a filling material in the anti-crack propagation groove to form a filling material layer located in the anti-crack propagation groove and on the surface of the glass core board where the opening area of the anti-crack propagation groove is located, the manufacturing method of the substrate structure further includes: Along the thickness direction of the filling material layer, opening a connection hole penetrating the filling material layer located on the conductive layer to expose the conductive layer; Filling a conductive material in the connection hole to form a conductive component located in the connection hole; Forming a dielectric layer on the conductive component and on the filling material layer on the surface of the glass core board where the opening area of the anti-crack propagation groove is located; Forming a circuit layer on one side of the dielectric layer away from the glass core board; the circuit layer is electrically connected to the conductive layer through the conductive component.

10. The manufacturing method of the substrate structure according to claim 7, characterized in that, Along the thickness direction of the glass core board, opening an anti-crack propagation groove at a position corresponding to the end of the through hole in at least one side of the glass core board includes: Along the thickness direction of the glass core board, opening anti-crack propagation grooves at positions corresponding to the ends of the through holes on both sides of the glass core board; along the thickness direction of the glass core board, the two anti-crack propagation grooves are spaced apart.

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