Multi-wavelength semiconductor laser coupling and packaging structure
By adopting a multi-wavelength coupled package structure with interlaced light sources and optical components in semiconductor lasers, the combination of light sources and light sources burning are solved, and high power output and beam quality improvement are achieved.
Patent Information
- Application Number
- CN202510375075.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-27
- Publication Date
- 2025-07-08
AI Technical Summary
The existing semiconductor lasers cannot realize the combined use of light sources of different packaging structures when combining beams, and the collimation path of the light source causes the laser size to be large, which easily leads to burning and failure of the light source.
The multi-wavelength semiconductor laser coupled package structure is adopted, including a housing, a polarization beam combiner, a half-wave plate, a dichroic mirror and an aspherical coupled lens. By interlacing the light source and optical elements, the combined use of light sources of different package structures is realized, and the optical collimation path is optimized.
The LD light sources in different packaging forms are further combined to obtain higher power, avoiding the burning problem caused by the light sources illuminating each other, and reducing the size and spot quality improvement of the laser.
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Figure CN120280784A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a semiconductor laser, and more particularly to a multi-wavelength semiconductor laser coupling and packaging structure. Background Art
[0002] Compared with solid-state lasers and gas lasers, semiconductor lasers have the advantages of high efficiency, small size, long life, and low cost. With the progress of chip growth technology, the improvement of packaging capabilities, and the decline in costs, the application fields of semiconductor lasers have been continuously expanding, such as in the fields of medical aesthetics, industrial welding, cutting, communication, military, and display.
[0003] At present, conventional fiber-coupled semiconductor laser modules mostly output in single wavelength. At present, the beam combining methods of semiconductor fiber lasers are mainly divided into three categories and the multiplexing of the three methods. (1) Spatial beam combining: The chips are arranged on a heat sink or a housing with a height difference, and the height difference is used to achieve spatial misalignment, so that the beams of each chip do not block each other, and the beams are coupled into the fiber simultaneously at a certain height difference to achieve beam combining. In this way, although multi-beam combining is achieved and high-power output is obtained, due to the limitations of the optical elements NA and CA, there are disadvantages such as poor output spot quality and blurred edges, and it cannot be infinitely stacked. (2) Polarization beam combining: The beam combining is completed through the excellent polarization characteristics of the semiconductor laser chip. (3) Wavelength beam combining: Utilizing the excellent monochromaticity of the semiconductor laser chip, the beam combining is completed through different combinations of the reflection and transmittance of dichroic mirrors for different wavelengths; the beam sizes of polarization beam combining and wavelength beam combining are relatively smaller than that of spatial beam combining, and it is easier to obtain high-quality beams.
[0004] By using the above methods in combination, the packaging of multiple and multi-wavelength laser light sources can be realized, but there are the following problems in actual applications: (1) It is impossible to combine and use light sources with different packaging structures; (2) The light source collimation path makes the laser larger in size and easily causes the light source on the opposite side to burn out and fail. Summary of the Invention
[0005] The purpose of the present invention is to solve the above problems and provide a multi-wavelength semiconductor laser coupling and packaging structure that integrates chips with different wavelengths and packaging structures in a single housing to realize the combined use of light sources with different packaging structures.
[0006] The technical solution adopted by the present invention to solve its technical problems is:
[0007] A multi-wavelength semiconductor laser coupling and packaging structure includes a housing, which includes a plurality of light source regions divided by wavelength into different zones, a polarization beam combiner and a half-wave plate for combining beams of the same wavelength, a dichroic mirror for combining beams of different wavelengths, an aspherical coupling lens for focusing the beam onto a focal point, and an optical fiber for outputting the beam.
[0008] Further, the light source area includes a first light source area, a second light source area, and a third light source area.
[0009] Further, both the first light source area and the second light source area include a plurality of light sources arranged in two opposite columns, the two columns of light sources are arranged staggeredly, and a fast-axis collimating lens, a slow-axis collimating lens, and a first reflector are sequentially arranged along the optical path of the light emitted by the light sources in the first light source area and the second light source area.
[0010] Further, a second reflector, a first polarization beam combiner, a third reflector, and a fast-axis compression lens are further arranged on the optical path of the light emitted by the first light source area;
[0011] A fourth reflector and a second polarization beam combiner are further arranged on the optical path of the light emitted by the second light source area.
[0012] Further, half-wave plates are arranged on the incident surfaces of the optical paths of the first polarization beam combiner and the second polarization beam combiner.
[0013] Further, the third light source area includes a TO header and a plurality of light sources arranged side by side on the TO header, a aspherical collimating lens, a fifth reflector, and a third polarization beam combiner are further arranged on the optical path of the emitted light, and the fifth reflector is arranged in a stepped arrangement in the front-back direction in sequence.
[0014] Further, a reflective film needs to be plated on the reflecting surface of the reflector, and the coating material is a high-reflection film with extremely low absorption rate for the wavelength band of the used LD light source.
[0015] Further, a dichroic mirror is arranged at the front end of the aspherical coupling lens.
[0016] The beneficial effects of the present invention are as follows:
[0017] 1. The present invention includes a housing made of aluminum alloy to reduce the overall weight, the surface of the housing is plated with nickel-gold, and includes a plurality of light source areas divided into different zones according to wavelengths, a polarization beam combiner and a half-wave plate for combining light beams of the same wavelength, a dichroic mirror for combining light beams of different wavelengths, an aspherical coupling lens for focusing the light beam onto the focal point, and an optical fiber for outputting the light beam. Further combined packaging of LD light sources in different packaging forms is realized to obtain higher power.
[0018] 2. Both the first light source area and the second light source area of the present invention include a plurality of light sources arranged in two opposite columns, the two columns of light sources are arranged staggeredly, and a fast-axis collimating lens, a slow-axis collimating lens, and a first reflector are sequentially arranged along the optical path of the light emitted by the light sources in the first light source area and the second light source area. The first light source area, the second light source area, and the third light source area are separated by partitions, the light sources are arranged in a staggered manner, and the housing establishes corresponding partitions, avoiding the problem of the side light irradiating each other and burning out the LD chip. Brief Description of the Drawings
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0020] Figure 1 It is a schematic structural diagram of the present invention;
[0021] Figure 2 It is a schematic diagram of the optical path simulation of the present invention;
[0022] Figure 3 It is a schematic diagram of the focus simulation of the present invention.
[0023] In the figure: housing 1, first light source area 2, second light source area 3, third light source area 4, light source 5, fast-axis collimating lens 6, slow-axis collimating lens 7, first reflector 8, second reflector 9, first polarization beam combiner 10, third reflector 11, fast-axis compression lens 12, fourth reflector 13, second polarization beam combiner 14, half-wave plate 15, aspheric collimating lens 16, fifth reflector 17, third polarization beam combiner 18, dichroic mirror 19, aspheric coupling lens 20, optical fiber 21, TO header 22. Detailed Description of the Embodiments
[0024] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0025] The fast-axis collimating lens is a key optical element used in a laser system, mainly used to collimate the beam in the fast-axis direction of the laser to improve the beam quality and transmission efficiency.
[0026] The slow-axis collimating lens is an optical element used to adjust and control the divergence angle of the beam in the slow-axis direction. It is usually used in conjunction with the fast-axis collimating lens to optimize the overall quality of the laser beam.
[0027] A polarization beam combiner is an optical device used to combine two beams of light with orthogonal polarization states. Its working principle is based on the polarization characteristics of light and optical interference effects. When two beams of light with perpendicular polarization directions (such as P-polarized light and S-polarized light) are incident on the polarization beam combiner, through an optical thin film or a specially designed optical structure, one beam of light will be reflected and the other beam will be transmitted. By precisely controlling the phase matching and interference conditions, the two beams of light achieve energy superposition inside the beam combiner, and finally a high-power and high-quality beam of light is synthesized.
[0028] A half-wave plate is an optical element used to change the polarization state of light. It manipulates polarized light by introducing a phase difference and is a commonly used polarization control device in optical experiments and optical communications. A half-wave plate is usually made of a birefringent crystal (such as quartz, calcite, or mica). When polarized light passes through the half-wave plate, the birefringent property of the crystal decomposes the light into two orthogonal polarization components (ordinary light and extraordinary light), which have different propagation speeds in the crystal, thus generating a phase difference. For a half-wave plate, the design goal is to make the phase difference between the two polarization components be π (180°).
[0029] A dichroic mirror, also known as a beam splitter or dual-wavelength mirror, is an important element widely used in the optical field, which can exhibit obvious reflection or transmission characteristics at different wavelengths. The working principle of the dichroic mirror is based on light interference and reflection. Its core is to achieve selective reflection and transmission of light at specific wavelengths through multi-layer thin film coatings. The thickness and refractive index of these thin films are precisely designed so that at specific wavelengths, the ratio of reflected light to transmitted light meets specific requirements.
[0030] A fast-axis collimating lens is an optical element specifically used in laser systems, mainly used to collimate and compress the beam divergence angle in the fast-axis direction of the laser, thereby improving the beam quality and transmission efficiency.
[0031] As Figure 1 shown, a multi-wavelength semiconductor laser coupling and packaging structure includes a housing 1. The material of the housing 1 is aluminum alloy to reduce the overall weight, and the surface of the housing is nickel-gold plated. It includes a number of light source regions divided by wavelength, a polarization beam combiner and a half-wave plate 15 for combining beams of the same wavelength, a dichroic mirror 19 for combining beams of different wavelengths, an aspherical coupling lens 20 for focusing the beam onto the focal point, and an optical fiber 21 for outputting the beam. It realizes further combined packaging of LD light sources in different packaging forms to obtain higher power.
[0032] The light source region includes a first light source region 2, a second light source region 3, and a third light source region 4. The first light source region 2 is located below, the second light source region 3 is located in the upper right, and the third light source region 4 is located in the upper left. As Figure 2 shown, it optimizes the optical collimation path and reduces the volume of the housing.
[0033] Half-wave plates 15 are provided at the beam combining positions of the first light source area, the second light source area, and the third light source area to convert P and S light, so as to achieve beam combining by using a PBS.
[0034] Both the first light source area 2 and the second light source area 3 include a plurality of light sources 5 arranged in two opposite columns. The two columns of light sources 5 are arranged staggeredly. Along the optical path of the light emitted by the light sources 5, a fast-axis collimating lens 6, a slow-axis collimating lens 7, and a first reflector 8 are sequentially provided in the first light source area 2 and the second light source area 3. The first light source area 2, the second light source area 3, and the third light source area 4 are separated by partitions. The light sources 5 are arranged in a staggered manner and the housing establishes corresponding partitions, avoiding the problem that the side lights irradiate each other and cause the LD chip to burn out.
[0035] On the optical path of the light emitted by the first light source area 2, a second reflector 9, a first polarization beam combiner 10, a third reflector 11, and a fast-axis compression lens 12 are further provided; among them, the 638 nm beam of the first light source area 2 needs to be further reduced in size in the fast-axis direction by the fast-axis compression lens 12.
[0036] On the optical path of the light emitted by the second light source area 3, a fourth reflector 13 and a second polarization beam combiner 14 are further provided.
[0037] The light source 5 in the first light source area 2 is a 638 nm LD COS light source, and the light source 5 in the second light source area 3 is an 808 nm LD COS light source.
[0038] The divergent laser light emitted by the light sources in the first light source area 2 and the second light source area 3, after being collimated and shaped by the fast-axis collimating lens 6 and the slow-axis collimating lens 7, is respectively reflected by the reflectors of the corresponding wavelengths to the corresponding polarization beam combiners 10 according to the Figure 2 path shown.
[0039] Half-wave plates 15 are provided on the incident surfaces of the optical paths of the first polarization beam combiner 10 and the second polarization beam combiner 14. The incident surface of the polarization beam combiner integrates a half-wave plate, so as to superpose and combine the same-wavelength light beams, reducing their total size by half.
[0040] The third light source area 4 includes a TO header 22 and a plurality of light sources 5 arranged side by side on the TO header 22. The TO header 22 is made of nickel-gold plated copper. On the optical path of the emitted light, an aspheric collimating lens 16, a fifth reflector 17, and a third polarization beam combiner 18 are further provided. The fifth reflector 17 is arranged in a stepped manner in the front-back direction. The divergent light beam emitted by the light source 5 is collimated by the aspheric collimating lens 16, and the light beam is arranged in a staggered manner by the fifth reflector 17 of the corresponding wavelength according to the Figure 2The optical path shown is reflected to the third polarization beam combiner 18. One side of the incident beam needs to pass through the corresponding half-wave plate, so as to superpose and combine the same-wavelength beams, reducing its total size by half. The light source 5 in the third light source area 4 is a 525nm LD TO9 light source.
[0041] The reflecting surface of the mirror needs to be coated with a reflective film, and the coating material is a high-reflection film with extremely low absorption rate for the LD light source band used.
[0042] A dichroic mirror 19 is provided at the front end of the aspherical coupling lens 20. The three light sources respectively reflect or project the light beams to the aspherical coupling lens 20 by the dichroic mirrors 19 corresponding to their wavelengths. The aspherical coupling lens 20 is installed in the coupling carrier and limited and fixed. The aspherical coupling lens 20 focuses the light beam to the focal point, and the simulation size is as Figure 3 shown, and the light is coupled into the optical fiber 21, and finally the light beam is output from the optical fiber 21.
[0043] When the LD light sources are all of different wavelengths, wavelength beam combination is performed using a dichroic mirror. The dichroic mirror needs to reflect the light beam corresponding to the wavelength of the LD light source and sequentially transmit the light beams of the subsequent chip LD light sources, and the corresponding reflectivity and transmittance should be as high as possible
[0044] When there are LD light sources with the same wavelength, polarization devices are used to complete the beam combination of the same wavelength, and then a dichroic mirror is used to combine different wavelengths. The polarization devices need to cooperate with half-wave plates to match the polarization characteristics and high transmittance of the corresponding LD light source wavelengths.
[0045] The fast-axis collimating lens, slow-axis collimating lens, half-wave plate, and coupling lens need to be coated with a high-transmission film, and the coating material is a high-transmission film with extremely low absorption rate for the LD light source band used.
[0046] The divergent laser light emitted by the 638nm LD COS light source and 808nm LD COS light source with a stepped staggered distribution in the first light source area and the second light source area in the housing, after being collimated and shaped by the fast-axis collimating lens and the slow-axis collimating lens, are respectively reflected by the mirrors corresponding to their wavelengths once according to the Figure 2 path shown to the corresponding polarization beam combiner. The incident surface on one side of the polarization beam combiner is integrated with a half-wave plate, so as to superpose and combine the same-wavelength beams, reducing its total size by half. Among them, the 638nm light beam needs to be further reduced in size in the fast-axis direction by a fast-axis compression lens; the 525nm LD TO9 light source is assembled in the TO socket and then installed in the third light source area of the housing. The divergent light beam emitted by it is collimated by an aspherical collimating lens, and the light beam is arranged in a staggered manner by the mirror corresponding to its wavelength according to the Figure 2The shown optical path is reflected to the corresponding polarization beam combiner. One side of the incident beam needs to pass through a half-wave plate, so as to superpose and combine the same-wavelength beams, reducing its total size by half. Then, the three light sources respectively reflect or project the beams to the aspherical coupling lens by dichroic mirrors of corresponding wavelengths. The aspherical coupling lens is installed in the coupling carrier and limited and fixed. The aspherical coupling lens focuses the beams to the focal point, and the simulation size is as Figure 3 shown, and the light is coupled into the optical fiber. Finally, the beam is output from the optical fiber.
[0047] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "left", "right", "up", "down", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation to the present invention.
[0048] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, a direct connection, or an indirect connection through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
Claims
1. A multi-wavelength semiconductor laser coupling and packaging structure, comprising a housing (1), characterized in that It includes several light source regions divided by wavelength, a polarization beam combiner and a half-wave plate (15) for combining light beams of the same wavelength, a dichroic mirror (19) for combining light beams of different wavelengths, an aspherical coupling lens (20) for focusing the light beam onto a focal point, and an optical fiber (21) for outputting the light beam.
2. The multi-wavelength semiconductor laser coupling and packaging structure according to claim 1, characterized in that, The light source regions include a first light source region (2), a second light source region (3), and a third light source region (4).
3. The multi-wavelength semiconductor laser coupling and packaging structure according to claim 2, characterized in that, Both the first light source region (2) and the second light source region (3) contain several light sources (5) arranged in two opposite columns. The two columns of light sources (5) are arranged staggeredly. Along the optical path of the light emitted by the light sources (5), a fast-axis collimating lens (6), a slow-axis collimating lens (7), and a first reflector (8) are sequentially arranged in the first light source region (2) and the second light source region (3).
4. The multi-wavelength semiconductor laser coupling and packaging structure according to claim 3, wherein, On the optical path of the light emitted by the first light source region (2), there are also a second reflector (9), a first polarization beam combiner (10), a third reflector (11), and a fast-axis compression lens (12); On the optical path of the light emitted by the second light source region (3), there are also a fourth reflector (13) and a second polarization beam combiner (14).
5. The multi-wavelength semiconductor laser coupling and packaging structure according to claim 4, wherein Half-wave plates (15) are arranged on the incident surfaces of the optical paths of the first polarization beam combiner (10) and the second polarization beam combiner (14).
6. The multi-wavelength semiconductor laser coupling and packaging structure according to claim 2, wherein, The third light source region (4) includes a TO header (22) and several light sources (5) arranged side by side on the TO header (22). On the optical path of the emitted light, there are also an aspherical collimating lens (16), a fifth reflector (17), and a third polarization beam combiner (18). The fifth reflector (17) is arranged in a stepped manner in sequence along the front-back direction.
7. A multi-wavelength semiconductor laser coupling and packaging structure according to claim 1, characterized in that The reflecting surface of the reflector needs to be coated with a reflective film, and the coating material is a high-reflection film with extremely low absorption rate for the LD light source band used.
8. A multi-wavelength semiconductor laser coupling and packaging structure according to claim 1, characterized in that, A dichroic mirror (19) is provided at the front end of the aspherical coupling lens (20).