PCB drilling method and drilling equipment and manufactured PCB
By introducing a special pad of the bias hole alarm module and a base ring into the PCB drilling equipment, the drilling deviation is detected in real time, which solves the problems of poor drilling accuracy and abnormal bias holes, and improves the accuracy of the drilling and product quality.
Patent Information
- Application Number
- CN202510378697.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-28
- Publication Date
- 2025-07-08
AI Technical Summary
In the prior art, there are problems of poor drilling hole position accuracy and abnormal hole deviation during PCB drilling, resulting in batch scrapping.
A PCB drilling equipment is adopted, equipped with a bias hole alarm module. By using a special pad with a base ring during the drilling process, the drilling tool and the short-circuit alarm signal of the conductive layer is used to detect the bias hole in real time to ensure the drilling accuracy.
Real-time monitoring of the drilling process is achieved, timely detection of biased hole abnormalities, reduce batch scrapping, and improve drilling accuracy and product quality.
Smart Images
Figure CN120282367A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of PCBs, and in particular to a PCB drilling method and drilling equipment and a manufactured PCB. Background Art
[0002] With the continuous development of the PCB industry, clients have higher and higher requirements for the quality and precision of PCB products. The drilling process is one of the important key processes for the production of PCB products, and the hole position accuracy is particularly important, especially the crimping hole. The crimping hole is a hole specially used to provide component pins for insertion and fixation, and directly realizes conductive communication and signal transmission through the contact between the pin and the copper wall of the hole. The accuracy of the crimping hole position can directly affect the use of the product. For this reason, customers are extremely concerned about the quality of the hole position accuracy of the crimping hole product.
[0003] However, drilling often results in abnormalities such as poor drilling position accuracy and off-center drilling. Such abnormalities are often not discovered in real time during the drilling process and are only reported after drilling. Rework is no longer possible after drilling, and batches of off-center holes are easily scrapped. Summary of the invention
[0004] In order to solve at least one of the above technical problems, the present application provides a PCB drilling method and drilling equipment and the manufactured PCB, and the technical solution adopted is as follows.
[0005] The present application provides a PCB.
[0006] The present application provides a PCB drilling device, wherein the drill of the drilling device is powered on, and the drilling device is provided with a deviation hole alarm module.
[0007] The present application provides a PCB drilling method, which includes the following process flow:
[0008] On the side of the single-sided conductive board where the conductive layer is located, a corresponding base material circle is opened according to the hole position drilled on the PCB; the radius of the base material circle is 2 to 3 mil larger than the radius of the hole position drilled on the PCB;
[0009] The insulating layer is pressed onto the conductive layer; before pressing, the lead wire is pre-placed on the side of the single-sided conductive plate where the conductive layer is located;
[0010] The PCB is attached to the insulating layer and positioned so that the preset holes on the PCB correspond to the base material circle;
[0011] The drill drills holes in the PCB at preset hole positions, and the drill is conductive, ensuring that the drill bar drills to the depth where the conductive layer is located; if the drill contacts the conductive layer on the side wall of the substrate circle, the drilling device triggers a short circuit alarm signal.
[0012] In certain embodiments of the present application, the diameter tolerance of the substrate ring is ±5 μm.
[0013] In certain embodiments of the present application, the substrate ring is obtained on the side where the conductive layer is located on the single-sided conductive plate by means of etching window opening.
[0014] In certain embodiments of the present application, the thickness of the single-sided conductive plate is 2 to 3 mm, and the drill bit does not drill through the single-sided conductive plate when drilling.
[0015] In certain embodiments of the present application, the conductive layer is set as a copper layer.
[0016] In certain embodiments of the present application, the shank of the drill bit penetrates the conductive layer.
[0017] In certain embodiments of the present application, the insulating layer is a PP layer. After lamination, the thickness of the insulating layer is 50 to 100 μm, and the surface hardness is 80 to 100 degrees.
[0018] In certain embodiments of the present application, a heat dissipation plate is arranged on the surface of the PCB, and the heat dissipation plate is set as an aluminum plate.
[0019] The present application has at least the following beneficial effects: The drill bit device energizes the drill bit. When drilling, the drill bit penetrates the cutting surface of the PCB and makes the drill rod drill to the depth where the conductive layer is located on the single-sided conductive plate. If the position of the drill bit is offset or tilted, the side wall of the drill bit contacts the side wall of the substrate ring of the conductive layer, and the drill bit contacts the conductive layer and is short-circuited. Furthermore, the drill bit device triggers an alarm signal, indicating that the drilling is off-hole, so as to timely feedback the abnormality of the off-hole drilling, so as to stop the machine for inspection. The present application can be widely applied to the technical field of PCBs.
[0020] Some additional aspects and advantages of the present application will be given in part in the following description, some will become obvious from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The following further demonstrates the present application in conjunction with the drawings and embodiments. It should be noted that the embodiments shown in the following drawings are exemplary and are only used to explain the present application, and should not be construed as a limitation to the present application.
[0022] Figure 1 It is a cross-sectional schematic diagram of a single-sided conductive plate and a distribution schematic diagram of substrate rings on the conductive layer.
[0023] Figure 2 It is a cross-sectional view of a special backing plate after the insulating layer is laminated with the single-sided machine conductive plate.
[0024] Figure 3 It is a schematic diagram when the drill bit is drilling.
[0025] Figure 4 It is a schematic diagram of off-hole drilling caused by tilting when the drill bit is drilling.
[0026] Figure 5 It is a schematic diagram of the offset hole caused by the position offset of the drill bit during drilling.
[0027] Reference numerals: 100, drill bit; 211, base material; 212, conductive layer; 213, base material ring; 220, insulating layer; 300, PCB; 310, heat sink. Detailed implementation manners
[0028] The following combines Figures 1 to 5 The embodiments of the present application are described in detail, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application.
[0029] In the description of the present application, it should be understood that if terms such as "center", "middle part", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. are used to indicate the orientation or positional relationship, it is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it should not be construed as a limitation to the present application.
[0030] In the description of the present application, the meaning of "several" is more than one, the meaning of "multiple" is more than two, "greater than", "less than", "exceeding", etc. are understood as not including the number itself, and "above", "below", "within", etc. are understood as including the number itself. If the first and second are described only for the purpose of distinguishing technical features, they should not be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.
[0031] In the description of the present application, unless otherwise clearly specified and limited, the terms "set", "install", "connect", "connection" should be understood in a broad sense. For example: it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.
[0032] In the description of the present application, if there are descriptions of reference terms such as "an embodiment", "some embodiments", "an example", "some examples", "some embodiments", "schematic embodiments", "examples", "specific examples", "some examples", etc., it means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.
[0033] The present application relates to a PCB 300.
[0034] The present application relates to a drilling device for a PCB 300.
[0035] The drill bit 100 of the drilling device has a conical cutting head and a cylindrical shank, and the diameter of the shank is larger than the diameter of the cutting head.
[0036] During the process of drilling holes in the PCB 300 by the drilling device, the situations of off - hole mainly include: the drill bit 100 is inclined; the drill bit 100 is not inclined, but the drilling position of the drill bit 100 deviates from the preset hole position; the drill bit 100 is inclined and the drilling position deviates from the preset hole position.
[0037] The drilling device energizes the drill bit 100, and the drilling device has an off - hole alarm module, which can implement the off - hole alarm function. The energized drill bit 100 cooperates with an energized special backing plate. During the drilling process, if off - hole occurs, the drill bit 100 and the special backing plate conduct electricity to each other, and the off - hole alarm module triggers an alarm signal, so as to monitor in real time whether off - hole occurs during the drilling process. It is convenient to follow up the off - hole state of drilling in real time and confirm whether the drilling parameters need to be optimized and improved, reducing the abnormal situation of batch off - hole scrapping.
[0038] It should be noted that, in order to complete the off - hole detection of the PCB 300, the present application designs a special backing plate, which includes a base material 211, a conductive layer 212, and an insulating layer 220. The base material 211 serves as the carrier of the conductive layer 212 and the insulating layer 220. The conductive layer 212 is located on one surface of the base material 211. The conductive layer 212 has a base - material circle 213 corresponding to the hole positions on the PCB 300, and the insulating layer 220 is located on the surface of the conductive layer 212.
[0039] The combination of the conductive layer 212 and the base material 211 forms a single - sided conductive plate, and the base - material circle 213 is obtained by etching and opening windows on the conductive layer 212. The base - material circles 213 are distributed in the same way as the preset hole positions on the PCB 300, the base - material circles 213 correspond one by one to the preset hole positions on the PCB 300, and the hole positions of the base - material circles 213 are larger than the radii of the corresponding hole positions.
[0040] The conductive layer 212 is pre - provided with leads so that the conductive layer 212 can be electrified.
[0041] This application relates to a drilling method for a PCB 300. The drilling method is implemented based on the above - mentioned drilling equipment, and the problem of drilling deviation can be detected online during the drilling process.
[0042] To implement this drilling method, this application uses a special conductive backing plate to replace the ordinary backing plate. During the drilling process, the drilling equipment conducts electricity for the drill bit 100. After the drill bit 100 drills through the cutting surface of the PCB 300, it further drills into the special backing plate. If the drill bit 100 is short - circuited, it indicates that the drilling is deviated, and the drilling equipment emits an alarm signal.
[0043] The drilling method includes the following technological processes.
[0044] S1, on the side of the single - sided conductive plate where the conductive layer 212 is located, corresponding substrate rings 213 are opened according to the hole positions of the drilled holes on the PCB 300.
[0045] S2, the insulating layer 220 is laminated on the conductive layer 212, and the insulating layer 220 covers the conductive layer 212 to obtain a special backing plate. Before lamination, leads are pre - arranged on the side of the single - sided conductive plate where the conductive layer 212 is located.
[0046] S3, the PCB 300 is attached to the insulating layer 220, and the cutting surface of the drilled hole on the PCB 300 is in contact with the insulating layer 220. The PCB 300 is positioned so that the preset hole positions on the PCB 300 correspond to the substrate rings 213.
[0047] S4, the drill bit 100 drills holes in the PCB 300 according to the preset hole positions, and the drill bit 100 is conductive to ensure that the shank of the drill bit 100 drills to the depth where the conductive layer 212 is located.
[0048] It should be noted that during the drilling process, when the leads are connected to the drilling equipment, the conductive layer 212 can be electrified. If the drill bit 100 contacts the conductive layer 212 on the side wall of the substrate ring 213 and the drill bit 100 is interconnected with the conductive layer 212, the drilling equipment triggers a short - circuit alarm signal, indicating that drilling deviation occurs, thereby realizing real - time monitoring of whether drilling deviation occurs during the drilling process. If an alarm signal occurs, the drilling equipment stops.
[0049] Before performing step S1, it is necessary to first manufacture the single - sided conductive plate and the special backing plate.
[0050] The conductive layer 212 is arranged on the surface of the substrate 211 to obtain a single - sided conductive plate. The substrate ring 213 is obtained by etching and opening windows on the side of the single - sided conductive plate where the conductive layer 212 is located: a film is pasted on the surface of the conductive layer 212, etched, and the film is removed, and then the substrate ring 213 is obtained.
[0051] The hole positions of the base material circle 213 correspond to the preset hole positions on the PCB 300, and the hole sizes of the base material circle 213 are larger than those of the holes on the PCB 300. The radius of the base material circle 213 is 2 to 3 mils larger than the radius of the hole positions for drilling on the PCB 300. It should be noted that if the difference between the radius of the base material circle 213 and the radius of the hole positions for drilling on the PCB 300 is too large, even if the drill bit 100 has an off-hole situation, the drill hole may not be able to contact the conductive layer 212, then the alarm signal cannot be triggered, and it is difficult to ensure the accuracy of off-hole detection for drilling.
[0052] The diameter tolerance of the base material circle 213 is ±5 μm, which ensures the size accuracy of the hole positions of the base material circle 213, ensures the uniformity of the unilateral spacing between the hole positions of the base material circle 213 and those on the PCB 300, and improves the accuracy of off-hole detection.
[0053] The thickness of the single-sided conductive board is 2 to 3 mm, which ensures that the cutting head of the drill bit 100 can drill into the base material 211 of the single-sided conductive board without drilling through the base material 211. In this case, on the one hand, the shank of the drill bit 100 can drill to the depth of the conductive layer 212, ensuring that the maximum diameter of the drill bit 100 drills to the conductive layer 212 to ensure the accuracy of off-hole detection. On the other hand, when the drill bit 100 drills, it does not drill through the single-sided conductive board, avoiding damage to the drill bit 100 when it contacts the tabletop.
[0054] It should be noted that the shank of the drill bit 100 penetrates the conductive layer 212 so that the shank at the maximum diameter of the drill bit 100 drills to the conductive layer 212, ensuring the accuracy of the off-hole detection signal. If the shank at the maximum diameter still does not trigger the alarm signal, it means there is no off-hole situation.
[0055] The conductive layer 212 is set as a copper layer. On the premise of ensuring the conductive connection performance, a thin copper layer is preferably used as much as possible, and the copper layer does not exceed 1 / 2 OZ. The thin copper layer has small etching side etching, which is convenient for controlling the uniformity and size of the etching window opening. In some examples, the copper layer is 1 / 3 OZ.
[0056] The special backing plate is made by laminating the insulating layer 220 with the single-sided conductive board after etching window opening. The lamination of the insulating layer 220 and the single-sided conductive board should ensure that the obtained special backing plate has a uniform thickness and a flat surface.
[0057] The insulating layer 220 is a PP layer, and the PP layer covers the copper layer. The thickness of the insulating layer 220 after lamination is 50 to 100 μm, ensuring a flat and uniform surface after lamination.
[0058] The surface hardness of the insulating layer 220 is 80 to 100 degrees, meeting the hardness requirements of the special backing plate and better suppressing the burrs on the cutting surface of the drill hole on the PCB 300.
[0059] When the insulating layer 220 is laminated with the single-sided conductive plate, it should be ensured that one end of the pre-set lead remains in contact with the conductive layer 212, and the other end extends outside the special electric plate so that the lead can be energized.
[0060] Before drilling, a heat sink 310 is arranged on the surface of the PCB 300. The heat sink 310 is used to dissipate heat for the drill bit 100. The heat sink 310 is stacked on the surface of the PCB 300 on the side away from the special backing plate.
[0061] The heat sink 310 is made of an aluminum plate, and the aluminum plate has good thermal conductivity.
[0062] The embodiments of the present application have been described in detail in conjunction with the accompanying drawings. However, the present application is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the art, various changes can be made without departing from the purpose of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.
Claims
1. A drilling method for a PCB, characterized in that: including On the side of the single-sided conductive board where the conductive layer is located, corresponding substrate circles are opened according to the hole positions of the drilled holes on the PCB; the radius of the substrate circle is 2 to 3 mils larger than the radius of the hole positions of the drilled holes on the PCB. The insulating layer is laminated on the conductive layer; leads are pre-placed on the side of the single-sided conductive board where the conductive layer is located before lamination. The PCB is attached to the insulating layer and positioned, and the pre-set hole positions on the PCB correspond to the substrate circles. The drill bit drills the PCB according to the pre-set hole positions, the drill bit is conductive, and it is ensured that the shank of the drill bit drills to the depth where the conductive layer is located; if the drill bit touches the conductive layer on the side wall of the substrate circle, the drilling equipment triggers an alarm signal for short circuit.
2. The drilling method of the PCB according to claim 1, wherein: The diameter tolerance of the substrate circle is ±5 μm.
3. The drilling method of the PCB according to claim 1 or 2, characterized in that: The substrate circle is obtained by etching and opening a window on the side of the single-sided conductive board where the conductive layer is located.
4. The drilling method of the PCB according to claim 1, characterized in that: The thickness of the single-sided conductive board is 2 to 3 mm, and the drill bit does not drill through the single-sided conductive board when drilling.
5. The drilling method of the PCB according to claim 1 or 4, characterized in that: The conductive layer is set as a copper layer.
6. The drilling method of the PCB according to claim 1, wherein: The shank of the drill bit penetrates the conductive layer.
7. The drilling method of the PCB according to claim 1, wherein: The insulating layer is a PP layer, and the thickness of the insulating layer after lamination is 50 to 100 μm, and the surface hardness is 80 to 100 degrees.
8. The drilling method of the PCB according to claim 1, characterized in that: A heat dissipation plate is arranged on the surface of the PCB, and the heat dissipation plate is set as an aluminum plate.
9. A drilling device for a PCB, characterized in that: The drilling equipment is applied to the drilling method according to any one of claims 1 to 8, the drill bit of the drilling equipment is energized, and the drilling equipment has an off-hole alarm module.
10. A PCB, characterized in that: The PCB is obtained by using the drilling method according to any one of claims 1 to 8.