Thermal control device and method based on multi-class phase change coupling and used for electronic equipment

Abstract

The invention discloses a thermal control device and method based on multi-class phase change coupling and used for electronic equipment. The device comprises a shell and a containing cavity formed in the shell, the containing cavity comprises a first cavity body used for solid-liquid phase change and a second cavity body used for gas-liquid phase change, the first cavity body and the second cavity body are distributed up and down, a heat conduction framework is arranged between the first cavity body and the second cavity body, the second cavity body comprises a steam cavity and a liquid absorption core, and the liquid absorption core is filled with a liquid working medium; the first chamber comprises a composite phase change material composed of porous carbon foam and a phase change heat storage material. According to the embodiment of the invention, the heat is timely absorbed and exported by utilizing the characteristics of gas-liquid phase change ultrahigh heat conduction and solid-liquid phase change constant-temperature heat absorption, and the gas-liquid phase change ultrahigh heat conduction and the solid-liquid phase change constant-temperature heat absorption are fully coupled to show better thermal control performance, so that an efficient heat transfer process under multi-class phase change coupling can be realized; the device has the advantages of light weight, zero energy consumption, reliable performance, excellent uniform temperature, quick response and the like.

Description

Technical Field

[0001] This application belongs to the technical field of heat dissipation of electronic devices, and particularly relates to a thermal control device and method based on multi-class phase change coupling for electronic devices. Background Art

[0002] Phase change thermal control technology utilizes the constant temperature characteristics of heat absorption / exotherm during the phase change process and has received extensive attention in the industrial community in recent years. The phase change thermal control method based on passive thermal control technology can, in principle, perform reversible work infinitely many times, has high reliability, and has been gradually applied in aerospace, missile circuits, airborne traveling wave tubes, etc. However, it still cannot meet the lightweight thermal control requirements for high power, high heat flux density, and periodic thermal shock in the space environment. Summary of the Invention

[0003] An embodiment of this application provides a thermal control device and method based on multi-class phase change coupling for electronic devices, so as to at least solve the problem that the related technology cannot meet the lightweight thermal control requirements for high power, high heat flux density, and periodic thermal shock in the space environment.

[0004] In a first aspect, an embodiment of this application provides a thermal control device based on multi-class phase change coupling for electronic devices, including: a housing and a receiving cavity formed inside the housing; The receiving cavity includes a first chamber for solid-liquid phase change and a second chamber for gas-liquid phase change that are distributed vertically; a first outer surface of the housing close to the second chamber is in contact with the electronic device; a heat conduction skeleton is provided between the first chamber and the second chamber, and the inside of the heat conduction skeleton is hollow; The second chamber includes a steam chamber and a wick, and the wick is filled with a liquid working medium; after the second chamber absorbs the heat generated by the electronic device, the liquid working medium boils to generate steam, and then the steam in the steam chamber carries the heat into the hollow structure of the heat conduction skeleton, and, after the heat is transferred to the first chamber through the heat conduction skeleton, the steam condenses back into a liquid and flows back to the wick; The first chamber includes a composite phase change material composed of porous carbon foam and a phase change heat storage material; the first chamber is used to absorb and store the heat transferred by the heat conduction skeleton and the second chamber through the composite phase change material and transform from a solid state to a liquid state, and to return to a solid state after the heat is dissipated to the external space of the thermal control device through the housing.

[0005] In a second aspect, an embodiment of this application provides a thermal control method based on multi-class phase change coupling for electronic devices. The method is applied to the thermal control device based on multi-class phase change coupling for electronic devices as described in any one of the first aspect embodiments, and the method includes: After the second chamber absorbs the heat generated by the electronic device, the liquid working medium filled in the wick boils to generate steam, and then the steam in the steam chamber carries the heat into the hollow structure of the heat conduction skeleton; After the heat is transferred to the first chamber through the heat conduction skeleton, the steam condenses back into a liquid and flows back to the wick; The composite phase change material in the first chamber absorbs and stores the heat transferred from the heat conduction skeleton and the second chamber and transforms from a solid state to a liquid state, and returns to a solid state after dissipating the heat through the housing to the external space of the thermal control device. The composite phase change material is composed of porous carbon foam and a phase change heat storage material.

[0006] The thermal control device and method based on multi-class phase change coupling for electronic devices according to the embodiments of the present application utilize the characteristics of ultra-high heat conduction of gas-liquid phase change and constant-temperature heat absorption of solid-liquid phase change to absorb and export heat in a timely manner. The two are fully coupled and exhibit better thermal control performance, can realize an efficient heat transfer process under multi-class phase change coupling, and have the advantages of light weight, zero energy consumption, reliable performance, excellent temperature uniformity, and fast response. Description of the Drawings

[0007] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

[0008] Figure 1 It is a schematic structural diagram of a thermal control device based on multi-class phase change coupling for electronic devices provided by an embodiment of the present application; Figure 2 It is a schematic internal structure diagram of the wick provided by an embodiment of the present application; Figure 3 It is a schematic flow diagram of a thermal control method based on multi-class phase change coupling for electronic devices provided by an embodiment of the present application.

[0009] Reference Signs: Housing 100, first chamber 200, porous carbon foam 210, second chamber 300, steam chamber 310, wick 320, gradient capillary structure 321, wettability-modified surface 322, support structure 323, heat conduction skeleton 400. Detailed Embodiments

[0010] Aspects of the present application and exemplary embodiments will be described in detail below. To make the objectives, technical solutions, and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application and not to limit the present application. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.

[0011] It should be noted that, in this document, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0012] During the on-orbit operation of spaceborne electronic equipment, its surface receives external heat fluxes such as solar radiation, planetary albedo, and planetary infrared radiation. The periodic change of the external environmental heat flux density will cause the electronic equipment to undergo periodic thermal shocks. In addition, most electronic equipment has a low standby heat generation and a large operating heat generation, with a rapid instantaneous temperature rise, forming an instantaneous thermal shock, which reduces the performance and service life of the electronic equipment. With the continuous development of thermal control technology, not only the maximum temperature of the electronic equipment needs to be controlled, but also higher requirements are put forward for its temperature uniformity. Especially for electronic equipment such as radar and microwave detection that have higher requirements for temperature uniformity, its detection accuracy level can be greatly improved as the temperature gradient decreases.

[0013] To meet the requirements of efficient heat transport, storage, and conversion in the thermal control process, traditional thermal control technologies based on single-phase gases or liquids are difficult to meet the thermal control needs under high heat fluxes. For example, natural / forced air cooling has deficiencies such as low specific heat capacity, poor thermal conductivity, and consumption of additional work, while the currently widely used liquid cooling also has disadvantages such as complex structure, large mass, and easy leakage. Especially for the operating environment of spaceborne electronic devices, due to the long-term vacuum environment, there is no convective heat transfer, and heat can only be conducted to its surface and dissipated by radiation to the cold black space. Solving the temperature rise problem of spaceborne electronic devices is much more difficult than that of ground-based electronic devices. To ensure the safe and stable operation of devices (or equipment), developing new, efficient, and safe thermal control technologies has become the common goal of the industry and academia.

[0014] Phase change thermal control technology utilizes the constant temperature characteristics of heat absorption / exotherm during the phase change process and has received extensive attention in the industrial and academic fields in recent years.

[0015] Patent CN113629323A discloses a temperature control system and method for a lithium battery pack based on the coupling of a phase change material and TEC liquid cooling. The circulation of the coolant in the temperature control system requires a water pump, and heat dissipation requires a fan, which has the disadvantages of high power consumption and high noise; Patent CN107567247B discloses a heat dissipation method for electronic devices that couples array jet and solid-liquid phase change. This method requires an external pump to drive the suspension to impact the target for heat exchange, and additional energy consumption is required during use. At the same time, this invention also does not involve a method for suppressing hot spots and improving the uniform temperature performance for electronic devices with different heat flux densities, and does not meet the high uniform temperature requirements of electronic devices; Patent CN107454797A discloses a pump-driven two-phase loop device for cooling high heat flux electronic devices. This device requires the driving force of an external pump to enable the liquid working medium to reach the evaporator in a timely and uniform manner, and additional energy consumption is required during use. Moreover, the entire device includes components such as a liquid reservoir, a filter, a sensor, and various valves, with a complex structure and a large volume, and there is a risk of liquid leakage and poor reliability; Patent CN115135118A discloses a multiphase-coupled phase change heat transfer device for hot spot suppression. In this invention, the steam generated after the working medium is heated needs to enter the heat exchange structure by means of buoyancy, and the liquid condensed after heat exchange needs to complete the reflux under the action of gravity, with poor anti-gravity ability and limited use layout methods, and it cannot be applied to the microgravity use environment of spaceborne electronic devices.

[0016] The phase change thermal control method based on passive thermal control technology can, in principle, perform reversible work infinitely many times and has high reliability. It has been gradually applied in aerospace, missile circuits, and airborne traveling wave tubes, etc. However, the current phase change thermal control method still has the following deficiencies: For the gas-liquid phase change process, the use requirement of ultra-thinning will compress the internal space of the vapor chamber. The storage of the liquid working medium is only distributed in the pores of the capillary layer. If the thickness of the capillary layer is further increased, the volume of the vapor space will be compressed, resulting in an increase in the operating resistance of the system, making its heat transfer and dissipation performance worse, and unable to transfer the heat in the area with higher temperature to other areas in time. On the other hand, the transient thermal shock will cause the rapid vaporization of the working medium in the local area. If a large amount of steam cannot be discharged in time and accumulates at the hot spot, it will cause a further increase in temperature, forming a vicious cycle, and there is a risk that the liquid working medium will burn dry due to the inability to replenish the liquid in time. For the solid-liquid phase change process, the low thermal conductivity of the commonly used single-component phase change material results in the inability to quickly transfer heat to the entire phase change material, seriously affecting the heat storage capacity of the phase change material.

[0017] In addition, the existing phase change thermal control technology mainly removes the heat generated by the device through an external radiator: if the heat conduction method is adopted, the heat conduction path is complex, and both the volume and mass are large, making it difficult to meet the requirements of lightweight and compactness of the spaceborne thermal control technology; if the convective heat transfer method is adopted, its supporting active cooling system requires additional energy consumption and has poor reliability.

[0018] To solve the problems of related technologies, the embodiments of the present application provide a thermal control device and method based on multi-class phase change coupling for electronic devices.

[0019] The following will combine the drawings and specifically describe the thermal control device based on multi-class phase change coupling for electronic devices provided by the embodiments of the present application through specific embodiments and their application scenarios.

[0020] It should be noted that the thermal control device of the embodiments of the present application is applicable to a variety of loads, that is, it can be used for a variety of electronic devices and a variety of scenarios, including but not limited to: spaceborne electronic devices, ground electronic devices.

[0021] Figure 1 The structural schematic diagram of the thermal control device based on multi-class phase change coupling for electronic devices provided by the embodiments of the present application is shown.

[0022] As Figure 1 shown, the thermal control device based on multi-class phase change coupling includes a housing 100 and a receiving cavity formed inside the housing. Among them, the receiving cavity includes a first chamber 200 for solid-liquid phase change and a second chamber 300 for gas-liquid phase change that are distributed up and down; the first outer surface of the housing 100 close to the second chamber 300 is in contact with the electronic device (i.e., the heat source); a heat conduction skeleton 400 is provided between the first chamber 200 and the second chamber 300, and the inside of the heat conduction skeleton 400 is hollow.

[0023] Specifically, the second chamber 300 includes a steam chamber 310 and a liquid wick 320, wherein the liquid wick 320 is filled with a liquid medium. Then, the second chamber 300 is used to absorb the heat generated by the electronic device, and the liquid medium boils to generate steam, and then the steam in the steam chamber 310 carries the heat into the hollow structure of the heat-conducting skeleton 400, and after the heat is transferred to the first chamber 200 through the heat-conducting skeleton 400, the steam condenses into liquid again and flows back to the liquid wick 320.

[0024] Specifically, the first chamber 200 includes a composite phase change material composed of porous carbon foam 210 and phase change heat storage material. Then, the first chamber 200 is used to absorb and store the heat transferred by the heat conductive skeleton 400 and the second chamber 300 through the composite phase change material and convert it from solid to liquid, and dissipate the heat to the external space of the thermal control device through the shell 100 and then restore it to solid.

[0025] It can be understood that, taking the application in spaceborne electronic equipment as an example, the first chamber 200 radiates heat to the cold black space through the shell 100 to achieve temperature control of the electronic equipment.

[0026] That is to say, based on the thermal control device of multiple phase change coupling, the liquid working medium exchanges heat with the target object (i.e., the electronic device to be cooled) in the gas-liquid phase change layer (i.e., the second chamber 300), and the liquid working medium boils to generate steam. The steam carries heat and enters the hollow structure of the heat-conducting skeleton 400 under the action of the liquid wick 320, releases the heat to the external solid-liquid phase change layer (i.e., the first chamber 200) through the heat-conducting skeleton 400, and then re-condenses into liquid, completing the heat absorption and heat expansion process, and returns to the heating area under the action of the liquid wick 320, repeating the heat absorption and vaporization process; at the same time, the phase change heat storage material, on the one hand, quickly, efficiently and evenly absorbs and stores the heat from the gas-liquid phase change layer equivalent to the phase change latent heat and changes from solid to liquid, and on the other hand, radiates the stored heat to the cold black space through the shell 100 for heat dissipation, realizing phase change heat absorption and radiation cooling in parallel heat dissipation, and the phase change heat storage material releases the stored heat to the cold black space and restores the solid phase state to cope with the next round of phase change cycle.

[0027] Therefore, the heat is absorbed and exported in time by utilizing the ultra-high thermal conductivity of gas-liquid phase change and the constant temperature heat absorption of solid-liquid phase change. The two are fully coupled to show better thermal control performance, and can realize efficient heat transfer process under multiple types of phase change coupling. It has the advantages of light weight, zero energy consumption, reliable performance, excellent temperature uniformity, and fast response.

[0028] In some embodiments, the interior of the heat-conducting skeleton 400 is a hollow structure and is connected to the gas-liquid phase change layer. The heat-conducting skeleton 400 is vertically distributed in the solid-liquid phase change layer.

[0029] In some embodiments, a liquid absorption core 320 is provided inside the gas-liquid phase change layer and the hollow structure of the heat conduction framework 400, and a liquid working medium is filled in a perfusion manner. Among them, the liquid working medium may include, for example, deionized water, methanol, acetone, etc., and this embodiment does not make specific limitations on this.

[0030] Further, referring to Figure 2 , it is a schematic diagram of the internal structure of the liquid absorption core 320 in the second chamber 300. As Figure 2 shown, the liquid absorption core 320 has a "forest"-shaped bionic structure, including a gradient capillary structure 321, a wettability-modified surface 322, and a support structure 323.

[0031] Optionally, the liquid absorption core 320 is locally encrypted to form a gradient capillary structure, that is, a gradient liquid absorption core with a "forest"-shaped bionic structure, which provides power for the internal circulation of the liquid working medium and has a small flow resistance.

[0032] It can be seen that the liquid absorption core 320 is a gradient capillary structure, and the porosity of the first region with a large heat flux density in the gradient capillary structure is smaller than the porosity of the regions other than the first region in the gradient capillary structure. That is to say, a smaller effective pore diameter is adopted where the heat flux density is large to increase the liquid absorption capacity, and a larger porosity is adopted in other places to reduce the flow resistance.

[0033] Optionally, the inside of the liquid absorption core 320 includes a support structure 323 made of a porous metal material. In this way, based on this support structure 323, the strength of the liquid absorption core 320 can be increased, and the liquid reflux can also be enhanced.

[0034] Optionally, the surface of the liquid absorption core 320 is obtained through wettability modification. That is, the liquid absorption core 320 adopts a wettability-modified surface to further improve the evaporation and condensation efficiency.

[0035] Further, in some alternative embodiments, the solid-liquid phase change layer is filled with a porous carbon foam 210, and the porous carbon foam 210 is a layered cavity structure, and the carbon layer has a multi-stage porous structure inside. In this way, the porous carbon foam 210 can adsorb and encapsulate the phase change heat storage material, thereby forming a composite phase change material with excellent thermal conductivity and extremely high energy storage density, that is, the composite medium formed by the coupling of the two is a solid-liquid phase change region, having the performance of high-power density heat storage and excellent heat transfer. Among them, for the phase change heat storage material, such as but not limited to: paraffin, fatty acids, polyols, etc., this embodiment does not make specific limitations on this.

[0036] Thus, the composite phase change material efficiently, rapidly, and uniformly absorbs and stores heat equivalent to the latent heat of phase change from the heat source and transforms it into a liquid state. At the same time, the heat is radiated to the cold black space through the housing 100 for heat dissipation, achieving parallel heat dissipation of phase change heat absorption and radiation cooling. The phase change material releases heat and returns to the solid phase state to cope with the next round of phase change cycle.

[0037] As an optional embodiment, the material of the housing 100 is metal, especially metal with a high thermal conductivity coefficient, such as but not limited to: aluminum or copper.

[0038] In addition, in some optional embodiments, fins are provided on the second outer surface of the housing 100 close to the first chamber 200 ( Figure 1 not shown in the figure). In this way, by providing integrally formed fins, the heat is radiated to the cold black space through the housing 100 and the fins on its top for heat dissipation, which can expand the area of the outer surface, thereby improving the efficiency of heat radiation to the cold black space and enhancing the heat dissipation efficiency.

[0039] In addition, it should be noted that the thermal control device based on multi-class phase change coupling for electronic devices in the embodiments of the present application can withstand a heat flux density of 50 - 80 W / cm 2 , with an average temperature better than 1 °C and a thermal shock resistance time exceeding 5 min.

[0040] Thus, the thermal control device based on multi-class phase change coupling for electronic devices in the embodiments of the present application realizes the integration of "storage - conduction - expansion - dissipation" of heat through the coupling of the heat absorption and heat expansion processes in the gas - liquid phase change layer and the heat storage and heat dissipation processes in the solid - liquid phase change layer, controls the temperature of high - heat - flux - density electronic devices, and achieves the purpose of lightweight thermal control for space - borne electronic devices with high power, high heat flux density, periodic thermal shock, or transient thermal shock in the space environment, and has the advantages of good temperature uniformity, simple structure, zero energy consumption, large heat transfer coefficient, etc.

[0041] Furthermore, the present application also provides a thermal control method based on multi-class phase change coupling for electronic devices. It should be noted that this method can use the thermal control device based on multi-class phase change coupling in any of the above embodiments to perform heat dissipation control and temperature control on the electronic device.

[0042] Refer to Figure 3 , which is a schematic flow chart of a thermal control method based on multi-class phase change coupling for electronic devices in the embodiments of the present application. As Figure 3 shown, the thermal control method based on multi-class phase change coupling for electronic devices may specifically include the following steps: S301. After the second chamber absorbs the heat generated by the electronic device, the liquid working medium filled in the wick boils to generate steam, and then the steam in the steam chamber carries the heat into the hollow structure of the heat conduction framework; S302. After the heat is transferred to the first chamber through the heat-conducting skeleton, the steam re-condenses into liquid and flows back to the wick. S303. The composite phase change material in the first chamber absorbs and stores the heat transferred by the heat-conducting skeleton and the second chamber and transforms from solid state to liquid state, and returns to solid state after dissipating the heat to the external space of the thermal control device through the housing. The composite phase change material is composed of porous carbon foam and a phase change heat storage material.

[0043] In specific implementation, starting from the characteristics of heat and mass directional transport under gas-liquid-solid phase change coupling and the mechanism of enhanced phase change heat dissipation, three-dimensional gas-liquid-solid phase change coupling is used to achieve the absorption and export of heat, transfer a large amount of heat in the form of latent heat, significantly improve the heat exchange capacity, and achieve efficient thermal control of electronic devices.

[0044] In specific implementation, a wick with a bionic gradient structure is designed for material design, and the surface of the wick is modified for wettability, which can strengthen the phase change, improve the evaporation and condensation efficiency, thereby improving the thermal conductivity and temperature uniformity. Therefore, the thermal control device prepared by this technology has strong anti-gravity ability and flexible use and layout methods.

[0045] In specific implementation, a carbon foam-based phase change energy storage composite medium is adopted, which has good shape stability and no leakage during melting. Moreover, the introduction of a high-thermal-conductivity porous carbon skeleton improves the thermal conductivity.

[0046] In specific implementation, the original housing space of the device can be used to fill the phase change material, without additional volume increase and without affecting the internal space of the device, and it can be applied to other devices that need heat storage.

[0047] It can be seen that the thermal control method based on multi-class phase change coupling for electronic devices in the embodiments of the present application has a wide range of applications, diverse applicable loads, and has the advantages of zero energy consumption, good temperature uniformity, simple structure, large heat transfer coefficient, large heat storage density, and stable working performance. It can be applied to the temperature control of electronic devices with short-time high heat generation characteristics, intermittent heat generation characteristics, or in a periodically temperature-fluctuating environment.

[0048] At the same time, it has excellent heat transfer performance such as high-temperature-uniformity temperature control, high-thermal-conductivity-rate heat dissipation, and high-power-density heat storage, can greatly improve performance such as heat flux density, energy storage density, and energy quality ratio, and achieve the lightweight, compactness, and anti-thermal-shock of the thermal control device for spaceborne electronic devices, and is especially suitable for space and some special application scenarios.

[0049] It should be noted that some embodiments of the present application have been described above. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the above embodiments and still achieve the desired results. Additionally, the processes depicted in the drawings do not necessarily require the specific order or sequential order shown to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0050] Reference to "embodiments" in the present application means that specific features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments.

[0051] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", "connected to", and "attached" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0052] In the embodiments of the present application, the same reference numerals represent the same components, and for the sake of brevity, in different embodiments, the detailed description of the same components is omitted. It should be understood that the thickness, length, width, and other dimensions of various components shown in the drawings of the embodiments of the present application, as well as the overall thickness, length, width, and other dimensions of the integrated device, are only for illustrative purposes and should not constitute any limitation to the present application.

[0053] The "plurality" mentioned in the present application refers to two or more (including two).

[0054] Although the present application has been described with reference to the preferred embodiments, various improvements can be made to it and components therein can be replaced with equivalents without departing from the scope of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

[0055] It should also be noted that the exemplary embodiments mentioned in the present application describe some methods or systems based on a series of steps or devices. However, the present application is not limited to the order of the above steps, that is, the steps can be executed in the order mentioned in the embodiments, can be different from the order in the embodiments, or several steps can be executed simultaneously.

[0056] As described above, this is only the specific implementation manner of the present application. Those skilled in the art can clearly understand that for the convenience and conciseness of description, the specific working processes of the systems, modules, and units described above can refer to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present application.

Claims

1. A thermal control device based on multi-class phase change coupling for an electronic device, characterized in that, Comprising: A housing and a receiving cavity formed inside the housing; The receiving cavity includes a first chamber for solid-liquid phase change and a second chamber for gas-liquid phase change which are distributed vertically; a first outer surface of the housing close to the second chamber is in contact with an electronic device; a heat conduction framework is provided between the first chamber and the second chamber, and the interior of the heat conduction framework is hollow; The second chamber includes a steam chamber and a wick, and the wick is filled with a liquid working medium; after the second chamber absorbs the heat generated by the electronic device, the liquid working medium boils to generate steam, and then the steam in the steam chamber carries the heat into the hollow structure of the heat conduction framework, and, after the heat is transferred to the first chamber through the heat conduction framework, the steam re-condenses into a liquid and flows back to the wick; The first chamber includes a composite phase change material formed by porous carbon foam and a phase change heat storage material; the first chamber is used to absorb and store the heat transferred by the heat conduction framework and the second chamber through the composite phase change material and transform from a solid state to a liquid state, and to restore to a solid state after the heat is dissipated to the external space of the thermal control device through the housing.

2. The device according to claim 1, characterized in that, The wick is a gradient capillary structure, and the porosity of a first region with a large heat flux density in the gradient capillary structure is less than the porosity of a region other than the first region in the gradient capillary structure.

3. The device according to claim 1, characterized in that, The interior of the wick includes a support structure made of a porous metal material.

4. The device according to claim 1, characterized in that, The surface of the wick is obtained by wettability modification.

5. The device according to claim 1, characterized in that, Fins are provided on a second outer surface of the housing close to the first chamber.

6. The device according to claim 1, characterized in that, The housing material is metal.

7. The device according to claim 1, characterized in that, The porous carbon foam has a layered cavity structure, and the carbon layer has a multi-stage porous structure inside.

8. The device according to claim 1, characterized in that, The liquid working medium includes: deionized water, methanol or acetone.

9. A thermal control method based on multi-class phase change coupling for an electronic device, characterized in that, The method is applied to a thermal control device based on multi-class phase change coupling for an electronic device according to any one of claims 1-8, and the method includes: After the second chamber absorbs the heat generated by the electronic device, the liquid working medium filled in the wick boils to generate steam, and then the steam in the steam chamber carries the heat into the hollow structure of the heat conduction framework; After the heat is transferred to the first chamber through the heat conduction framework, the steam re-condenses into a liquid and flows back to the wick; The composite phase change material in the first chamber absorbs and stores the heat transferred by the heat conduction framework and the second chamber and transforms from a solid state to a liquid state, and restores to a solid state after the heat is dissipated to the external space of the thermal control device through the housing, and the composite phase change material is formed by porous carbon foam and a phase change heat storage material.

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