Heat dissipation structure of integrated power supply shell

Abstract

The invention relates to the technical field of integrated power supply shell heat dissipation, in particular to a heat dissipation structure of an integrated power supply shell, which comprises a power supply shell main body, a mounting plate main body is arranged on one side of the power supply shell main body, a plurality of first heat dissipation devices are arranged in the mounting plate main body, and the other ends of the first heat dissipation devices are inserted into the power supply shell main body. A first heat dissipation device is arranged on one side of the power supply shell body, a second heat dissipation device is arranged on one side of the power supply shell body, the second heat dissipation device and the first heat dissipation device are both used for dissipating heat of the power supply shell body so as to improve the heat dissipation efficiency of the power supply shell body, and heat in the power supply shell body can be transferred out of the power supply shell body by arranging a water circulation device and the second heat dissipation device; therefore, the power supply shell main body can be ensured to have good sealing performance, the waterproof performance and the dustproof performance of the power supply shell main body can be improved, and meanwhile, the water-cooling heat dissipation effect is far higher than the traditional natural heat dissipation or air-cooling heat dissipation effect.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated power supply housing heat dissipation, and specifically to a heat dissipation structure for an integrated power supply housing. Background Art

[0002] An integrated power supply is a complete set of equipment that combines devices such as an AC uninterruptible power supply (UPS), an inverter power supply (INV), and a DC / DC converter power supply for communication. It realizes unified monitoring and management by sharing a DC power storage battery pack.

[0003] As an efficient power supply, the heat dissipation problem of the integrated power supply stems from multiple challenges. Traditional natural heat dissipation or air cooling methods are inefficient and easily lead to component aging or even failure due to heat accumulation. With the increasing trend of equipment miniaturization, the contradiction between heat dissipation capacity and volume becomes more prominent. Especially in high-frequency scenarios such as 5G, temperature rise control has become a core issue. In addition, as an efficient power supply application, the integrated power supply needs to take into account protection requirements such as waterproofing and dustproofing, which further increases the complexity of the heat dissipation design.

[0004] The present invention aims to solve the technical problems existing in the prior art. For this purpose, a heat dissipation structure for an integrated power supply housing is proposed. Summary of the Invention

[0005] The purpose of the present invention is to provide a heat dissipation structure for an integrated power supply housing to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solutions:

[0007] A heat dissipation structure for an integrated power supply housing includes a main power supply housing. On one side of the main power supply housing, there is a main mounting plate. Inside the main mounting plate, there are several first heat dissipation devices. The other end of the first heat dissipation devices is inserted into the main power supply housing. On one side of the main power supply housing, there is a second heat dissipation device. Both the second heat dissipation device and the first heat dissipation devices are used to dissipate heat from the main power supply housing to improve the heat dissipation efficiency of the main power supply housing.

[0008] One side of the main mounting plate is fixedly connected with a water cooling device, which is used to cool the second heat dissipation device by water cooling. One end of the main power supply housing is provided with a water circulation device. One end of the water circulation device extends into the water cooling device. The water circulation device is used to realize water circulation and at the same time is used to cool the first heat dissipation devices by water cooling.

[0009] As a further solution of the present invention: The main body of the power supply housing includes a power supply housing. One side of the power supply housing is rotatably connected to a control board. A glass cover is rotatably connected to the power supply housing. An aluminum frame is arranged inside the power supply housing. The aluminum frame is threadedly connected to the power supply housing. The aluminum frame is used for installing the power supply. A positioning groove is arranged on one side of the power supply housing. The positioning groove is used for positioning the main body of the installation plate.

[0010] As a further solution of the present invention: The main body of the installation plate includes a support plate. A positioning pin is fixedly connected to one side of the support plate. The positioning pin cooperates with the support plate. A card slot is opened at one end of the support plate. A diversion groove is opened on one side of the support plate. The diversion groove is used for guiding water flow into the water cooling device.

[0011] As a further solution of the present invention: The water cooling device includes a water storage tank. The water storage tank is fixedly connected to the support plate. An inlet is opened on one side of the water storage tank. Water flow enters the water storage tank through the inlet. A sealing strip is arranged on one side of the water storage tank. A heat conducting member is arranged on one side of the water storage tank. The heat conducting member is composed of a plurality of V-shaped aluminum blocks. The heat conducting member is used for cooling the second heat dissipation device. A heat converter is arranged on one side of the water storage tank.

[0012] As a further solution of the present invention: The second heat dissipation device includes a heat conducting aluminum block. The heat conducting aluminum block is fixedly connected to the power supply housing. One end of the heat conducting aluminum block penetrates through the aluminum frame and the power supply housing. The heat conducting aluminum block is in contact with the aluminum frame. The other end of the heat dissipation plate is fixedly connected with a V-shaped groove. A number of V-shaped grooves are opened on the other side of the V-shaped groove. The V-shaped grooves cooperate with the heat conducting member.

[0013] As a further solution of the present invention: The water circulation device includes a box body. The box body is fixedly connected to the support plate. A water pump is arranged on one side of the box body. The other end of the water pump extends into the water storage tank. A connecting pipe is arranged on one side of the box body. A ball valve is rotatably connected to the connecting pipe. A rotating rod is fixedly connected to one side of the ball valve. The rotating rod penetrates through the card slot. The other end of the connecting pipe is fixedly connected with a shunt pipe. The shunt pipe is used for water cooling and temperature reduction of the first heat dissipation device.

[0014] As a further solution of the present invention: The first heat dissipation device includes a heat conducting pipe. Two sealing plates are arranged on the cylindrical surface of the heat conducting pipe. Both sealing plates are fixedly connected to the support plate. The two sealing plates are respectively located on both sides of the diversion groove. A number of heat dissipation fins are arranged on the cylindrical surface of the heat conducting pipe. All the heat dissipation fins are located between the two sealing plates. The other side of the heat conducting pipe extends into the power supply housing.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. By setting the water circulation device and the second heat dissipation device, the heat inside the main body of the power supply housing can be transferred outside the main body of the power supply housing, which can ensure that the main body of the power supply housing has good sealing performance, thereby improving the waterproof and dustproof performance of the main body of the power supply housing.

[0016] 2. A number of heat dissipation fins are provided on the cylindrical surface of the water circulation device of the apparatus. At the same time, a number of V-shaped grooves are formed on one side of the second heat dissipation device, and a number of heat conduction members are respectively inserted into the number of V-shaped grooves, which can increase the heat dissipation area, thereby improving the heat dissipation efficiency. At the same time, the apparatus evenly scatters the water in the box body on the heat dissipation fins through the shunt pipe to avoid cooling the sealing plate through water cooling. Then the water flow enters the water storage tank to cool the heat conduction members through water cooling, and the heat dissipation effect is much higher than that of traditional natural heat dissipation or air-cooled heat dissipation. Description of the Drawings

[0017] Figure 1 It is a schematic structural diagram of the heat dissipation structure of the integrated power supply housing.

[0018] Figure 2 It is Figure 1 a side view of.

[0019] Figure 3 It is Figure 1 an internal sectional view of.

[0020] Figure 4 It is a schematic structural diagram of the second heat dissipation device in the heat dissipation structure of the integrated power supply housing.

[0021] Figure 5 It is a schematic structural diagram of the water cooling device in the heat dissipation structure of the integrated power supply housing.

[0022] 1 - Power supply housing main body, 2 - Installation plate main body, 3 - Water circulation device, 4 - First heat dissipation device, 5 - Water cooling device, 6 - Second heat dissipation device, 101 - Power supply housing, 102 - Control board, 103 - Glass cover, 104 - Positioning groove, 105 - Aluminum frame, 201 - Support plate, 202 - Card slot, 203 - Positioning pin, 204 - Diversion groove, 301 - Box body, 302 - Rotating rod, 303 - Water pump, 304 - Connecting pipe, 305 - Ball valve, 306 - Shunt pipe, 401 - Sealing plate, 402 - Heat dissipation fins, 403 - Heat conduction pipe, 501 - Water storage tank, 502 - Heat converter, 503 - Heat conduction member, 504 - Sealing strip, 505 - Water inlet, 601 - Heat-conducting aluminum block, 602 - Heat dissipation plate, 603 - V-shaped groove. Detailed Embodiment

[0023] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0024] The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplicity and clarity and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0025] Please refer to Figures 1-5 , the heat dissipation structure of the integrated power supply housing, including the power supply housing main body 1. On one side of the power supply housing main body 1, there is an installation plate main body 2. Inside the installation plate main body 2, there are several first heat dissipation devices 4. The other end of the first heat dissipation device 4 is inserted into the power supply housing main body 1. On one side of the power supply housing main body 1, there is a second heat dissipation device 6. Both the second heat dissipation device 6 and the first heat dissipation device 4 are used to dissipate heat from the power supply housing main body 1 to improve the heat dissipation efficiency of the power supply housing main body 1. By setting the water circulation device 3 and the second heat dissipation device 6, the heat inside the power supply housing main body 1 can be transferred outside the power supply housing main body 1, and good sealing performance of the power supply housing main body 1 can be ensured, thereby improving the waterproof and dustproof performance of the power supply housing main body 1;

[0026] On one side of the installation plate main body 2, a water cooling device 5 is fixedly connected. The water cooling device 5 is used to cool the second heat dissipation device 6 by water cooling. At one end of the power supply housing main body 1, there is a water circulation device 3. One end of the water circulation device 3 extends into the water cooling device 5. The water circulation device 3 is used to realize the water circulation, and at the same time, the water circulation device 3 is used to cool the first heat dissipation device 4 by water cooling, thereby cooling the power supply housing main body 1. The effect of water cooling is much higher than that of traditional natural cooling or air cooling.

[0027] Please refer to Figure 1 、 Figure 2 And Figure 4 , the power supply housing main body 1 includes a power supply housing 101. On one side of the power supply housing 101, a control board 102 is rotatably connected. The power supply housing 101 is rotatably connected with a glass cover 103. Inside the power supply housing 101, there is an aluminum frame 105. The aluminum frame 105 is threadedly connected to the power supply housing 101. The aluminum frame 105 is used for installing the power supply. On one side of the power supply housing 101, there is a positioning groove 104. The positioning groove 104 is used to position the installation plate main body 2.

[0028] Please refer to Figure 1 、 Figure 3 And Figure 5, the main body 2 of the installation plate includes a support plate 201. A positioning pin 203 is fixedly connected to one side of the support plate 201. The positioning pin 203 cooperates with the support plate 201. A card slot 202 is provided at one end of the support plate 201. A diversion groove 204 is provided on one side of the support plate 201. The diversion groove 204 is used to guide water flow into the water cooling device 5. The diversion groove 204 diverts the water scattered on the surface of the heat dissipation fins 402, so that the water sprinkled on the surface of the heat dissipation fins 402 returns to the water storage tank 501 through the heat dissipation fins 402 and the water inlet 505.

[0029] Please refer to Figure 2 and Figure 5 , the water cooling device 5 includes a water storage tank 501. The water storage tank 501 is fixedly connected to the support plate 201. A water inlet 505 is provided on one side of the water storage tank 501. Water flow enters the water storage tank 501 through the water inlet 505. A sealing strip 504 is provided on one side of the water storage tank 501. A heat conducting member 503 is provided on one side of the water storage tank 501. The heat conducting member 503 is composed of a plurality of V-shaped aluminum blocks. The heat conducting member 503 is used to cool the second heat dissipation device 6. A heat converter 502 is provided on one side of the water storage tank 501. The heat of the heat dissipation plate 602 is transferred to the heat conducting member 503 and then absorbed by the water inside the water storage tank 501. A heat converter 502 is provided on one side of the water storage tank 501, which can cool the water in the water storage tank 501 to prevent the water temperature in the water storage tank 501 from being too high and affecting heat dissipation.

[0030] Please refer to Figure 4 , the second heat dissipation device 6 includes a heat conducting aluminum block 601. The heat conducting aluminum block 601 is fixedly connected to the power supply housing 101. One end of the heat conducting aluminum block 601 penetrates through the aluminum frame 105 and is in contact with the power supply housing 101. The heat conducting aluminum block 601 is in contact with the aluminum frame 105. The other end of the heat dissipation plate 602 is fixedly connected to a V-shaped groove 603. A number of V-shaped grooves 603 are provided on the other side of the V-shaped groove 603. The V-shaped groove 603 cooperates with the heat conducting member 503. The V-shaped groove 603 increases the contact area with the heat conducting member 503, which can improve the heat dissipation efficiency. Since the power supply is installed on the aluminum frame 105 and the heat conducting aluminum block 601 is in contact with the aluminum frame 105, the heat will also be transferred to the heat dissipation plate 602 through the aluminum frame 105 and the heat conducting aluminum block 601.

[0031] Please refer to Figure 1 , Figure 2 and Figure 3, the water circulation device 3 includes a box body 301, the box body 301 is fixedly connected to the support plate 201, a water pump 303 is arranged on one side of the box body 301, the other end of the water pump 303 extends into the water storage tank 501, a connecting pipe 304 is arranged on one side of the box body 301, a ball valve 305 is rotatably connected to the connecting pipe 304, a rotating rod 302 is fixedly connected to one side of the ball valve 305, the rotating rod 302 penetrates through the card slot 202, the other end of the connecting pipe 304 is fixedly connected to a flow dividing pipe 306, the flow dividing pipe 306 cools the first heat dissipation device 4 by water cooling. The water pump 303 pumps the water in the water storage tank 501 into the box body 301, and then the water is sprinkled on the surface of the heat dissipation fins 402 through the connecting pipe 304 and the flow dividing pipe 306 to cool the heat dissipation fins 402.

[0032] Please refer to Figure 3 , the first heat dissipation device 4 includes a heat conduction pipe 403, two sealing plates 401 are arranged on the cylindrical surface of the heat conduction pipe 403, both of the two sealing plates 401 are fixedly connected to the support plate 201, the sealing plates 401 are used for sealing to prevent water from entering the power supply housing 101 through the connection between the heat conduction pipe 403 and the support plate 201. The two sealing plates 401 are respectively located on both sides of the diversion groove 204. A number of heat dissipation fins 402 are arranged on the cylindrical surface of the heat conduction pipe 403, and a number of heat dissipation fins 402 are all located between the two sealing plates 401. The other side of the heat conduction pipe 403 extends into the power supply housing 101. When the temperature inside the power supply housing 101 of the power supply increases, according to heat transfer, that is, the temperature of the heat conduction pipe 403 extending into the power supply housing 101 increases, the water inside the heat conduction pipe 403 evaporates to cool the heat conduction pipe 403, and the water vapor moves along the heat conduction pipe 403 to the upper part of the heat conduction pipe 403, and the water vapor is condensed through the heat conduction pipe 403, that is, the heat is transferred to the heat dissipation fins 402.

[0033] The working principle of the present invention is as follows: As the temperature inside the power supply housing 101 rises with the use of the power supply, according to heat transfer, that is, the temperature of the heat conduction tube 403 extending into the power supply housing 101 rises. The water inside the heat conduction tube 403 evaporates to cool the heat conduction tube 403. The water vapor moves along the heat conduction tube 403 to the upper part of the heat conduction tube 403, and the water vapor is condensed by the heat conduction tube 403, that is, the heat is transferred to the heat dissipation fins 402. At the same time, since the power supply is installed on the aluminum frame 105, the heat conduction aluminum block 601 is in contact with the aluminum frame 105, that is, the heat will also be transferred to the heat dissipation plate 602 through the aluminum frame 105 and the heat conduction aluminum block 601. Since the heat conduction member 503 enters the V-shaped groove 603 and fits with the heat dissipation plate 602, the heat of the heat dissipation plate 602 is transferred to the heat conduction member 503 and then absorbed by the water inside the water storage tank 501. A heat converter 502 is provided on one side of the water storage tank 501, which can cool the water inside the water storage tank 501 to prevent the water temperature in the water storage tank 501 from being too high and affecting heat dissipation. At the same time, the water pump 303 pumps the water in the water storage tank 501 into the box body 301, and then the water is sprinkled on the surface of the heat dissipation fins 402 through the connecting pipe 304 and the shunt pipe 306 to cool the heat dissipation fins 402. Among them, a diversion groove 204 is opened on one side of the support plate 201, and the diversion groove 204 diverts the water scattered on the surface of the heat dissipation fins 402, so that the water sprinkled on the surface of the heat dissipation fins 402 returns to the water storage tank 501 through the heat dissipation fins 402 and the water inlet 505.

[0034] In the description of this specification, the descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0035] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. Heat dissipation structure of an integrated power supply housing, including a main power supply housing, characterized in that, On one side of the main body of the power supply housing, there is a main mounting plate. Inside the main mounting plate, there are several first heat dissipation devices. The other end of the first heat dissipation device is inserted into the main body of the power supply housing. On one side of the main body of the power supply housing, there is a second heat dissipation device. Both the second heat dissipation device and the first heat dissipation device are used to dissipate heat from the main body of the power supply housing to improve the heat dissipation efficiency of the main body of the power supply housing. On one side of the main mounting plate, a water cooling device is fixedly connected. The water cooling device is used to cool the second heat dissipation device by water cooling. At one end of the main body of the power supply housing, there is a water circulation device. One end of the water circulation device extends into the water cooling device. The water circulation device is used to realize the water circulation, and at the same time, the water circulation device is used to cool the first heat dissipation device by water cooling.

2. The heat dissipation structure of the integrated power supply housing according to claim 1, wherein The main body of the power supply housing includes a power supply housing. On one side of the power supply housing, a control board is rotatably connected. A glass cover is rotatably connected to the power supply housing. Inside the power supply housing, there is an aluminum frame, and the aluminum frame is threadedly connected to the power supply housing. The aluminum frame is used to install the power supply. On one side of the power supply housing, there is a positioning groove, and the positioning groove is used to position the main mounting plate.

3. The heat dissipation structure of the integrated power supply housing according to claim 2, characterized in that, The main mounting plate includes a support plate. On one side of the support plate, a positioning pin is fixedly connected. The positioning pin cooperates with the support plate. At one end of the support plate, there is a card slot. On one side of the support plate, there is a diversion groove, and the diversion groove is used to guide the water flow into the water cooling device.

4. The heat dissipation structure of the integrated power supply housing according to claim 3, characterized in that, The water cooling device includes a water storage tank. The water storage tank is fixedly connected to the support plate. On one side of the water storage tank, there is a water inlet, and the water flow enters the water storage tank through the water inlet. On one side of the water storage tank, there is a sealing strip. On one side of the water storage tank, there is a heat conducting member. The heat conducting member is composed of multiple V-shaped aluminum blocks. The heat conducting member is used to cool the second heat dissipation device. On one side of the water storage tank, there is a heat converter.

5. The heat dissipation structure of the integrated power supply housing according to claim 4, wherein, The second heat dissipation device includes a heat conducting aluminum block. The heat conducting aluminum block is fixedly connected to the power supply housing. One end of the heat conducting aluminum block penetrates through the aluminum frame and the power supply housing, and the heat conducting aluminum block is in contact with the aluminum frame. At the other end of the heat dissipation plate, a V-shaped groove is fixedly connected. On the other side of the V-shaped groove, there are several V-shaped grooves, and the V-shaped grooves cooperate with the heat conducting member.

6. The heat dissipation structure of the integrated power supply housing according to claim 1, wherein The water circulation device includes a box body. The box body is fixedly connected to the support plate. On one side of the box body, there is a water pump. The other end of the water pump extends into the water storage tank. On one side of the box body, there is a connecting pipe. The connecting pipe is rotatably connected to a ball valve. On one side of the ball valve, a rotating rod is fixedly connected. The rotating rod penetrates through the card slot. The other end of the connecting pipe is fixedly connected to a shunt pipe, and the shunt pipe is used to cool the first heat dissipation device by water cooling.

7. The heat dissipation structure of the integrated power supply housing according to claim 6, characterized in that The first heat dissipation device includes a heat conducting pipe. On the cylindrical surface of the heat conducting pipe, there are two sealing plates. Both sealing plates are fixedly connected to the support plate. The two sealing plates are respectively located on both sides of the diversion groove. On the cylindrical surface of the heat conducting pipe, there are several heat dissipation fins. All the heat dissipation fins are located between the two sealing plates. The other side of the heat conducting pipe extends into the power supply housing.

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