Aggregation module

Abstract

The present invention provides an aggregation module comprising a plurality of drivers for energizing each of a plurality of auxiliary devices mounted on a vehicle, a common substrate on which the plurality of drivers are mounted, a plurality of bus bars for supplying power to each of the plurality of drivers, and a module case for holding the substrate and the plurality of bus bars. Each of the plurality of bus bar bodies is a one-step molded article in which a plurality of bus bars are integrally molded, and the module housing holds each of the plurality of one-step molded articles.

Description

Technical Field

[0001] The present invention relates to an aggregation module having a driver for energizing auxiliary devices mounted on a vehicle. Background Art

[0002] Conventionally, various auxiliary devices (such as an electric pump, a valve device, etc.) have been mounted on a vehicle. Such auxiliary devices are energized by a driver. As a technology related to such a driver, for example, there is a technology described in Patent Document 1 whose source is shown below.

[0003] Patent Document 1 describes an inverter device. The inverter device includes a power module equipped with switching elements, a cooling module for cooling the power module, a control board having a control circuit for controlling the switching elements, an AC bus connected to the AC terminals of the power module, and a current sensor for detecting the current flowing through the AC bus. Patent Document

[0004] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2017-153228 Summary of the Invention

[0005] In the inverter device described in Patent Document 1, a control board on which the power module is mounted is provided on one side of the cooling module, and the AC bus and the current sensor are provided on the other side of the cooling module, thereby achieving miniaturization. However, as described above, various auxiliary devices are equipped on a vehicle, and if the above inverter device is provided for each auxiliary device, the size will increase. Therefore, when considering coping with multiple auxiliary devices, there is still room for improvement in terms of miniaturization.

[0006] Therefore, an aggregation module capable of miniaturization is sought.

[0007] The characteristic structure of the aggregation module according to the present invention is as follows: It includes a plurality of drivers for energizing respective ones of a plurality of auxiliary devices mounted on a vehicle, a common substrate on which the plurality of drivers are mounted, a plurality of bus bodies for supplying power to the plurality of drivers respectively, and a module housing for holding the substrate and the plurality of bus bodies. Each of the plurality of bus bodies is a primary formed product integrally formed from a plurality of buses, and the module housing holds each of the plurality of primary formed products.

[0008] If such a characteristic structure is set, a common substrate on which a plurality of drivers are mounted and a bus bar body integrally formed by a common module housing that supplies power to the plurality of drivers will be maintained. Therefore, compared with the case where, for example, each of the plurality of drivers is mounted on a separate substrate and the bus bar is separately provided from the substrate, miniaturization can be achieved. Therefore, the weight of the aggregation module can be reduced. In addition, when considering mounting on a vehicle, since miniaturization can be achieved, the degree of freedom of mounting can be increased. Furthermore, since a single formed product is produced as the bus bar body, the complexity of positioning each bus bar and manufacturing the module housing can also be eliminated. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a side sectional view of the aggregation module. Figure 2 It is a view when observing the substrate from above. Figure 3 It is a view showing an example of the bus bar body. Figure 4 It is a view when observing the bus bar body from above. Figure 5 It is a view showing another example of the bus bar body. Figure 6 It is a view showing another example of the bus bar body. DETAILED DESCRIPTION OF THE INVENTION

[0010] The aggregation module according to the present invention is configured to be able to mount a plurality of drivers on a substrate. Hereinafter, the aggregation module 1 of the present embodiment will be described.

[0011] Figure 1 It is a side sectional view of the aggregation module 1. As Figure 1 shown, the aggregation module 1 is configured to include a driver 82, a substrate 20, a bus bar body 90, and a module housing 30. In Figure 2 is a view when observing the substrate 20 from above.

[0012] Equipped with a plurality of drivers 82, the above-mentioned drivers 82 supply power to each of the plurality of auxiliary devices 2 mounted on the vehicle. The plurality of auxiliary devices 2 mounted on the vehicle refer to a plurality of devices that assist in driving the auxiliary power source (for example, an engine, a rotating electric machine), and the above-mentioned power source (drive) causes the vehicle equipped with the polymerization module 1 to travel. As such auxiliary devices 2, there are, for example, a generator, a radiator, an oil pump, a water pump, an electric motor for driving these pumps, a valve device, and the like. Although a plurality of the above-mentioned auxiliary devices 2 are mounted on the vehicle, in the present embodiment, as the plurality of auxiliary devices 2, an electric motor 81, a water pump 3, and a valve device 4 are included. Details will be described later, but in the present embodiment, the electric motor 81 drives the valve device 4. The electric motor 81, the water pump 3, and the valve device 4 will be described later.

[0013] The driver 82 supplies power to the electric motor 81 and the water pump 3. The driver 82 can be configured to include a plurality of arm portions such as, for example, an H-bridge, a three-phase inverter, etc., and the arm portion has a high-side switching element and a low-side switching element connected in series with each other.

[0014] An operation instruction is transmitted from a control unit (not shown) to each driver 82. The operation instruction includes instruction values such as a rotation speed, an output torque, etc., and the driver 82 is controlled based on the above-mentioned instruction values. As a result, a current having a current value corresponding to the instruction value flows from the driver 82 to the coil of the electric motor 81 that drives the valve device 4 or the coil of the electric motor (not shown) of the water pump 3.

[0015] A plurality of drivers 82 are mounted on the substrate 20. In the present embodiment, a plurality of drivers 82 are mounted on a common substrate 20. That is, a plurality of drivers 82 are mounted on one substrate 20. In Figure 1 it, as the driver 82, a driver 82A that supplies power to the electric motor 81, a driver 82B that supplies power to the electric motor of the water pump 3A, and a driver 82C that supplies power to the electric motor of the water pump 3B are shown.

[0016] In the present embodiment, the electric motor 81, the driver 82A, the driver 82B, and the driver 82C are mounted on the substrate 20. Although the driver 82A, the driver 82B, and the driver 82C are constituted by using switching elements, the terminals of the switching elements can be fixed by soldering to lands provided on the substrate 20. Of course, the terminals of the switching elements can also be inserted and fixed to through holes provided on the substrate 20.

[0017] In addition, a control unit (not shown) for controlling at least one of the plurality of drivers 82 may be mounted on the substrate 20. For example, in the case of driving the motor 81 and the water pump 3 by PWM control, the control unit for controlling at least one of the plurality of drivers 82 corresponds to a PWM control unit. The control unit is not limited to the PWM control unit, and may be, for example, a power supply control unit provided at the input stage of the driver 82 and capable of blocking the power supplied to the driver 82.

[0018] From the viewpoints of heat dissipation and load resistance, such a substrate 20 is composed of a rigid substrate. In particular, by using a printed circuit board to form the substrate 20, the substrate can be realized at low cost.

[0019] A plurality of bus bodies 90 (see Figure 4 ) are provided, and the plurality of bus bodies 90 supply power to the respective plurality of drivers 82. The bus body 90 has a plurality of buses 80. For example, when the driver 82 is composed of an H bridge, the bus body 90 is configured to have two buses 80, and when the driver 82 is composed of a three-phase inverter, the bus body 90 is configured to have three buses 80. In the present embodiment, the case where the bus body 90 has three buses 80 will be described. The bus body 90 having three buses 80 is provided corresponding to the driver 82. That is, for example, when the driver 82 is composed of the driver 82A, the driver 82B, and the driver 82C as in the present embodiment, it is configured to include three bus bodies 90. It should be noted that, for example, by making two of the three bus bodies 90 common (supplying power to two drivers 82 through one bus body 90), a structure having two bus bodies 90 with respect to three drivers 82 can be formed.

[0020] Each of the plurality of bus bodies 90 is configured as a primary molded product integrally formed by a plurality of buses 80. A side cross-sectional view of the bus body 90 is shown in Figure 3 . As shown in Figure 3 , the bus body 90 has a main body portion 91, a bus 80, a holding member 93, and a cover member 95. The main body portion 91 is formed in a rectangular parallelepiped shape using an insulating resin material. On one surface (for example, the top surface 91A) of the main body portion 91, a groove portion 92 is provided along a specified direction. The groove portion 92 is formed according to the number of buses 80 included in the bus body 90. In the example of Figure 3 , since the bus body 90 has three buses 80, three groove portions 92 are formed in the main body portion 91.

[0021] The bus bar 80 is received in the groove portion 92. In the present embodiment, one bus bar 80 is received in one groove portion 92. Therefore, the internal shape dimensions of the groove portion 92 are set to be slightly larger than the external shape dimensions of the bus bar 80 in terms of size. For the bus bar 80 received in the groove portion 92, in order to position it within the groove portion 92, it is held by the holding member 93. In Figure 3 the example of, the holding member 93 is provided at the bottom 92A of the groove portion 92, and further in a state where the bus bar 80 is placed on the holding member 93 provided at the bottom 92A, it is set to cover the bus bar 80. At this time, it is preferable to provide the holding member 93 including at least a part of the top surface 91A of the main body portion 91 and the bus bar 80. Thereby, the bus bar 80 received in the groove portion 92 can be clamped and held from the bottom 92A side and the top surface 91A side of the groove portion 92. For such a holding member 93, for example, an insulating thermosetting resin or a foaming adhesive can be used. In this case, in order to cure the thermosetting resin or the foaming adhesive, overheating can be performed using a heater or induction heating.

[0022] The cover member 95 is provided to cover the bus bar 80 held by the holding member 93 in a manner including at least a part of the main body portion 91. The cover member 95 is preferably formed of, for example, an insulating resin paste. By curing this resin paste, the moisture and waterproof properties against the bus bar 80 can be improved, and the mechanical strength can be improved. Such a bus bar body 90 is configured as a primary molded product integrally molded with the bus bar 80 by, for example, insert molding. In the present embodiment, a plurality of such primary molded products are formed. It should be noted that in Figure 1 for the sake of easy understanding, the holding member 93 and the cover member 95 are omitted.

[0023] Returning to Figure 1 , the module housing 30 holds the substrate 20 and the bus bar body 90. The module housing 30 is made of, for example, resin. The module housing 30 has a flow path housing 40 described later. In the present embodiment, the substrate 20 is held on the outer surface 41 of the flow path housing 40. A convex portion 42 protruding from the outer surface 41 is provided on the outer surface 41 of the flow path housing 40, and the substrate 20 is fastened and fixed by a bolt 43 in a state of being placed on the convex portion 42.

[0024] Moreover, a plurality of wall portions 48 standing upright from the outer surface 41 are formed in the flow path housing 40, and the top plate 46 is supported across the plurality of wall portions 48. Thereby, the substrate 20 is received in the space 47 surrounded by the flow path housing 40, the wall portions 48, and the top plate 46.

[0025] In addition, the module housing 30 holds each of the above-described multiple integrally formed articles. Each of the multiple integrally formed articles can be held, for example, by being fixed to the module housing 30 using bolts like the substrate 20, or holes can be formed in the module housing 30 in advance according to the external shape and dimensions of the integrally formed article, and the integrally formed article can be embedded in the holes for holding. In the present embodiment, the module housing 30 is composed of a secondary formed article formed by integrally forming the multiple integrally formed articles into one. That is, as described above, the module housing 30 is made of resin. At this time, each integrally formed article previously formed by insert molding can be further integrally formed by insert molding to form a secondary formed article. When the module housing 30 is formed into such a secondary formed article, it is preferable to fasten and fix the substrate 20 using bolts 43 after forming the secondary formed article.

[0026] Power is supplied to the specified pads of the bus bar 80 of the bus bar body 90 and the substrate 20 via the wiring 97 and the press-fit 23. In addition, in Figure 1 the example of, the wiring 98 electrically connected to the bus bar 80 is provided inside the wall portion 48 and forms a connector portion 49 so as to protrude to the side opposite to the space 47 in the wall portion 48. Thereby, the power of the bus bar 80 can be taken out via the connector portion 49.

[0027] The motor 81 drives the valve device 4. In the present embodiment, a gear 81C is provided at one end of the rotation shaft 81B of the rotor 81A of the motor 81. A gear 81D that decelerates the rotation speed of the motor 81 is provided so as to mesh with the gear 81C, and it is configured such that the gear 81D meshes with the gear 4B provided on the rotation shaft 4A of the valve device 4. Thereby, the motor 81 can drive the valve device 4.

[0028] In addition, the motor 81 is provided such that the other end of the rotation shaft 81B penetrates the substrate 20 and is supported by the substrate 20 via the motor housing 81F. Regarding the fixing between the motor housing 81F and the substrate 20, for example, it can be fastened and fixed using bolts, or fixed by other methods. In addition, the electrical connection between the motor 81 and the substrate 20 can be made by inserting the press-fit 22 into the through hole 21 provided in the substrate 20.

[0029] In addition, as described above, the rotation shaft 81B of the motor 81 is supported by bearings in a state where a gear 81C is provided at one end and the other end is inserted into the concave portion 44 formed in the outer surface 41. Further, in the present embodiment, the rotation shaft 81E of the gear 81D is also supported by bearings in a state where it is inserted into the concave portion 45 formed in the outer surface 41. Therefore, the motor 81 and the gear 81D are held by the module housing 30.

[0030] The water pump 3 circulates the coolant in the cooling flow path 70. The cooling flow path 70 communicates with a device other than a power source such as an engine or a rotating electric machine, or a power source such as a generator or a battery, and the coolant discharged from the water pump 3 is supplied via the cooling flow path 70. The coolant is cooling water such as long-life coolant (LLC), insulating oil such as paraffin, or refrigerant condensate such as hydrofluorocarbons (HFCs) or hydrofluoroolefins (HFOs). Thereby, the supply target (engine, rotating electric machine, generator, battery, etc.) of the coolant can be cooled. As Figure 1 shown, in the present embodiment, two water pumps 3 are provided. When differentiating them, one water pump 3 is referred to as water pump 3A, and the other water pump 3 is referred to as water pump 3B for explanation.

[0031] The valve device 4 is configured to be able to adjust the amount of the coolant flowing in the cooling flow path 70 or switch the flow path based on the output of the electric motor 81. As Figure 1 shown, the valve device 4 is provided in the cooling flow path 70. The valve device 4 can be configured to adjust the coolant sucked by the water pump 3 or switch the flow path, or can be configured to adjust the amount of the coolant discharged from the water pump 3 or switch the flow path. In the present embodiment, the valve device 4 is provided in the cooling flow path 70 where the water pump 3A is provided.

[0032] In the present embodiment, on the basis of the substrate 20, the module housing 30 holds the water pump 3A, the water pump 3B, and the valve device 4 in addition to the substrate 20. In the present embodiment, the water pump 3A and the water pump 3B are arranged such that the blade portions 3A1 and 3B1 are located on the cooling flow path 70 side in the module housing 30, and the valve device 4 is arranged such that the valve portion 4C is located on the cooling flow path 70 side in the module housing 30.

[0033] The above-mentioned cooling flow path 70 is formed inside the flow path housing 40, and the coolant circulates in the cooling flow path 70. The flow path housing 40 is made of resin, and the cooling flow path 70 can be formed by, for example, drilling the cross section.

[0034] The radiator 50 is provided across the substrate 20 and the cooling flow path 70. In the present embodiment, one side of the radiator 50 is attached to the substrate 20 through a gap filler 54, and the other side of the radiator 50 is provided in a state of being exposed to the cooling flow path 70. As Figure 2As shown, the radiator 50 is preferably attached to the back side of, for example, the area of the substrate 20 where the driver 82 is installed. Further, it is preferably configured such that when the substrate 20 is viewed from above, at least in the portion where the cooling flow path 70 overlaps with the radiator 50, the cooling flow path 70 extends more outward than the radiator 50. That is, the cooling flow path 70 is preferably configured such that when the substrate 20 is viewed from above, the radiator 50 overlaps with the cooling flow path 70. Thereby, the heat from the driver 82 can be easily transferred to the radiator 50. It should be noted that a sealing member 56 (e.g., an O-ring) can be provided at the flange portion 55 of the radiator 50.

[0035] In the present embodiment, the radiator 50 is provided in the flow path housing 40 and has fins 51 that stand upright toward the inside of the cooling flow path 70. Thereby, the radiator 50 to which the heat from the driver 82 has been transferred can be directly cooled by the coolant flowing in the cooling flow path 70. Therefore, the driver 82 can be cooled more efficiently. In the radiator 50, the fins 51 can be configured to stand upright in a state of crossing (preferably being orthogonal) to the flow direction of the coolant flowing in the cooling flow path 70, and the fins 51 can also be configured to stand upright in a state of being parallel to the flow direction of the coolant flowing in the cooling flow path 70. Further, the radiator 50 can also be configured to have a plurality of plate-like members or pins instead of the fins 51.

[0036] In the present embodiment, a radiator 150 is provided in the module housing 30 across the bus bar body 90 and the cooling flow path 70. The radiator 150 is provided in a state where one side of the radiator 150 is attached to the bus bar body 90 through a gap filling material 154 and the other side of the radiator 150 is exposed to the cooling flow path 70. As Figure 4 shown, the radiator 150 is preferably attached to the back side of, for example, the area of the bus bar body 90 where the bus bar 80 is provided. Further, it is preferably configured such that when the bus bar body 90 is viewed from above, at least the cooling flow path 70 overlaps with the radiator 150. That is, the cooling flow path 70 can be configured such that when the bus bar body 90 is viewed from above, the radiator 150 overlaps with the cooling flow path 70. Thereby, the heat from the bus bar 80 can be easily transferred to the radiator 150. It should be noted that a sealing member 156 (e.g., an O-ring) is preferably provided at the flange portion 155 of the radiator 150.

[0037] As described above, by configuring to hold the bus bar body 90 having a plurality of bus bars 80 electrically connected to a plurality of drivers 82 using the module housing 30, the aggregation module 1 in which a plurality of drivers 82 and a plurality of bus bars 80 are aggregately provided can be configured. With such an aggregation module 1, miniaturization can be achieved even when a plurality of drivers 82 are provided on the substrate 20. Further, a plurality of drivers 82 can also be appropriately cooled.

[0038] [Other Embodiments] In the above-described embodiment, the case where the module housing 30 holds the motor 81, the gear 81D, the valve device 4, and the water pump 3 has been described. However, the module housing 30 may also be configured to hold at least one of the motor 81, the gear 81D, the valve device 4, and the water pump 3. Further, the module housing 30 may not hold the motor 81, the gear 81D, the valve device 4, and the water pump 3.

[0039] In the above-described embodiment, the case where the bus bar body 90 has the main body portion 91, the bus bar 80, the holding member 93, and the cover member 95 has been described. For example, the bus bar body 90 may also be configured to have any one of the main body portion 91, the bus bar 80, the holding member 93, and the cover member 95. Figure 5 A side cross-sectional view of such a bus bar body 90 is shown. In this case, it is preferable that the holding member 93 and the cover member 95 are shared. That is, it is preferable that one of the holding member 93 and the cover member 95 has a holding function of holding the bus bar 80 by the holding member 93 in the groove portion 92 and a function of the cover member 95 to improve the waterproof and mechanical strength. Specifically, as Figure 5 shown, it is preferable to house the bus bar 80 in the groove portion 92 of the main body portion 91 and to provide the cover member 95 (or the holding member 93) so as to include at least a part of the top surface 91A of the main body portion 91 and the bus bar 80 housed in the groove portion 92. It should be noted that at this time, the cover member 95 (or the holding member 93) may not be provided at the bottom 92A of the groove portion 92, or the cover member 95 (or the holding member 93) may be provided.

[0040] In the above-described embodiment, the case where one bus bar 80 is housed in one groove portion 92 has been described. For example, as Figure 6 shown, it may be configured to house a plurality of bus bars 80 in one groove portion 92. In this case, it is preferable to provide the holding member 93 at the bottom 92A of one groove portion 92 formed in the main body portion 91 and to alternately laminate the bus bar 80 and the holding member 93 thereon. Further, at this time, by using one sheet-like member as the holding member 93, it can be set while being folded as Figure 6 shown. Of course, the holding member 93 may be provided individually between every two adjacent bus bars 80. In any case, among the plurality of bus bars 80, the holding member 93 between two adjacent bus bars 80 is preferably made of an insulating member.

[0041] In the above-described embodiment, the case where the control unit for controlling at least one of the plurality of drivers 82 is mounted on the substrate 20 has been described. However, the control unit may not be mounted on the substrate 20.

[0042] In the above-described embodiment, the case where the substrate 20 is supported on the outer surface 41 of the flow path housing 40 has been described. However, the substrate 20 may also be supported by a part different from the outer surface 41 of the flow path housing 40. For example, it may be supported in a state separated from the outer surface 41.

[0043] [Summary of the above-described embodiment] Hereinafter, the summary of the aggregation module 1 described above will be described.

[0044] (1) The aggregation module 1 includes a plurality of drivers 82 that individually energize a plurality of auxiliary devices 2 mounted on a vehicle, a common substrate 20 on which the plurality of drivers 82 are mounted, a plurality of bus bodies 90 that individually supply power to the plurality of drivers 82, and a module housing 30 that holds the substrate 20 and the plurality of bus bodies 90. Each of the plurality of bus bodies 90 is a primary formed product integrally formed by a plurality of buses 80, and the module housing 30 holds each of the plurality of primary formed products.

[0045] According to this structure, the common substrate 20 on which the plurality of drivers 82 are mounted and the bus body 90 formed by integrally forming the buses 80 that supply power to the plurality of drivers 82 are held by the common module housing 30. Therefore, compared with a case where, for example, the plurality of drivers 82 are individually mounted on separate substrates 20 and the buses 80 are separately provided from the substrates 20, miniaturization can be achieved. Therefore, the aggregation module 1 can be made lighter. In addition, when considering mounting on a vehicle, since miniaturization can be achieved, the degree of freedom of mounting can be increased. Furthermore, since the primary formed product is manufactured as the bus body 90, the complexity of positioning each bus 80 and manufacturing the module housing 30 can be eliminated.

[0046] (2) In the aggregation module 1 described in (1), it is preferable that the module housing 30 is constituted by a secondary formed product formed by integrally forming a plurality of primary formed products into one.

[0047] According to this structure, the bus body 90 can be easily held in the module housing 30. In addition, since the secondary formed product can be formed by molding the primary formed product with resin or the like, the positioning of the buses 80 is easy, and thus the molding accuracy can be improved. In this way, the module housing 30 that holds the plurality of buses 80 in a held state can be easily constituted.

[0048] (3) In the aggregation module 1 described in (1) or (2), it is preferable that the bus body 90 includes a main body portion 91 having a groove portion 92, a bus 80 housed in the groove portion 92, a holding member 93 that holds the bus 80 in the groove portion 92, and a cover member 95 that covers the bus 80 held by the holding member 93 so as to include at least a part of the main body portion 91.

[0049] According to this structure, by holding the component 93, multiple busbars 80 housed in the groove portion 92 of the main body portion 91 can be held while being positioned individually, and the waterproofness and mechanical strength of the busbars 80 can be improved by the cover component 95.

[0050] (4) In the polymerization module 1 described in (3), it is preferable to house one busbar 80 in one groove portion 92.

[0051] According to this structure, the module housing 30 is formed into a structure that holds multiple busbars 80 respectively, so short circuits between the multiple busbars 80 can be prevented. Therefore, short - circuit failures of the driver 82 can be prevented.

[0052] (5) In the polymerization module 1 described in (2), multiple busbars 80 can be housed in one groove portion 92, and an insulating component is provided between two adjacent busbars 80 among the multiple busbars 80.

[0053] According to this structure, multiple busbars 80 can be laminated and arranged in one groove portion 92. Therefore, compared with the case of arranging one busbar 80 in one groove portion 92, the size of the busbar body 90 in the direction (width direction) along which the multiple busbars 80 are arranged can be reduced. Therefore, the degree of freedom in configuration when mounting the polymerization module 1 on a vehicle can be improved.

[0054] (6) In the polymerization module 1 described in (1) or (2), it is preferable that the module housing 30 has a flow - path housing 40 in which a cooling flow - path 70 for the coolant to flow is formed inside.

[0055] According to this structure, the substrate 20 and the busbars 80 are polymerized by the polymerization module 1, and further the cooling flow - path 70 is polymerized by the flow - path housing 40. Therefore, the module housing 30 can be miniaturized.

[0056] (7) In the polymerization module 1 described in (6), it is preferable that a radiator 150 is provided in the module housing 30 across the busbar body 90 and the cooling flow - path 70.

[0057] According to this structure, since the radiator 150 is provided across the busbar body 90 having the busbars 80 and the cooling flow - path 70, the heat generated in the busbars 80 can be released to the coolant flowing in the cooling flow - path 70 via the radiator 150. Therefore, the busbars 80 can be cooled appropriately, and a polymerization module 1 with excellent cooling effect can be realized. In addition, by forming a structure that transfers the heat generated in the driver 82 to the busbars 80, the driver 82 can also be cooled by the busbars 80 and the radiator 150. Industrial availability

[0058] The present invention can be used in an aggregation module having a driver for energizing auxiliary equipment mounted on a vehicle. Symbol description

[0059] 1: Aggregation module, 2: Auxiliary equipment, 20: Substrate, 30: Module housing, 40: Flow path housing, 70: Cooling flow path, 80: Busbar, 82: Driver, 90: Busbar body, 91: Main body portion, 92: Groove portion, 93: Holding member, 95: Cover member, 150: Radiator.

Claims

1. An aggregation module, comprising: a plurality of drivers, each of the drivers energizing a plurality of auxiliary devices mounted on a vehicle; a common substrate on which a plurality of the drivers are mounted; a plurality of bus bars, each of the bus bars supplying power to a plurality of the drivers; and a module housing that holds the substrate and the plurality of bus bars, each of the plurality of bus bars being a primary formed product integrally formed from a plurality of bus bars, the module housing holding each of the plurality of primary formed products.

2. The aggregation module according to claim 1, wherein the module housing is formed of a secondary formed product obtained by integrally forming the plurality of primary formed products into one.

3. The aggregation module according to claim 1 or 2, wherein the bus bar includes a main body portion having a groove portion, the bus bar received in the groove portion, a holding member that holds the bus bar in the groove portion, and a lid member that covers the bus bar held by the holding member so as to include at least a part of the main body portion.

4. The aggregation module according to claim 3, wherein one of the bus bars is received in one of the groove portions.

5. The aggregation module according to claim 3, wherein a plurality of the bus bars are received in one of the groove portions, and an insulating member is provided between two adjacent ones of the plurality of bus bars.

6. The aggregation module according to claim 1 or 2, wherein the module housing has a flow path housing in which a cooling flow path for allowing a coolant to flow is formed inside.

7. The aggregation module according to claim 6, wherein in the module housing, a radiator is provided across the bus bar and the cooling flow path.

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