Environment-friendly wafer ultrasonic cleaning equipment

Abstract

The invention discloses environment-friendly wafer ultrasonic cleaning equipment, and relates to the field of wafer ultrasonic cleaning fluid recovery, the environment-friendly wafer ultrasonic cleaning equipment comprises a cleaning chamber and a recovery filtering chamber, the cleaning chamber is fixedly mounted at the top of the recovery filtering chamber and is used for cleaning wafers by using ultrasonic waves, and a cleaning recovery mechanism is fixedly mounted at the top of the recovery filtering chamber and is used for cleaning the wafers by using ultrasonic waves; a filtering mechanism is fixedly mounted in the recycling and filtering chamber and is communicated with the cleaning and recycling mechanism. The equipment is provided with the recycling and filtering chamber, and cleaning liquid flows into the filtering mechanism through the cleaning and recycling mechanism and is recycled after being filtered by double filter elements. By means of the cyclic utilization mode, consumption of the cleaning fluid is greatly reduced, the production cost is reduced, and meanwhile pollution of emission of the cleaning fluid to the environment is reduced. In addition, the backflow pipeline enables the cleaning liquid to naturally flow through the liquid level difference, use of extra power equipment is reduced, energy consumption is reduced, and the dual purposes of environmental protection and energy conservation are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer ultrasonic cleaning liquid recovery, and specifically to an environment-friendly wafer ultrasonic cleaning device. Background Technique

[0002] Wafer ultrasonic cleaning is a key technology for cleaning wafers in semiconductor manufacturing. It utilizes the characteristics of ultrasonic waves to effectively remove impurities on the wafer surface.

[0003] However, in the prior art, in traditional wafer cleaning equipment, the cleaning liquid is usually directly discharged after single use without effective recovery and reuse. This not only causes a large amount of waste of the cleaning liquid, increases the production cost, but also exerts great pressure on the environment. Especially with the expansion of the semiconductor industry scale, the consumption and cost problems of the cleaning liquid become more prominent. There is a need for a device that can efficiently recover and recycle the cleaning liquid to reduce resource waste and cost. And during the cleaning process, there are various types of impurities on the wafer surface, such as particulate contaminants, organic residues, metal ions, etc. Ordinary cleaning equipment is difficult to completely remove these impurities, resulting in impurity residues affecting the subsequent processing technology of the wafer and the chip performance. Summary of the Invention

[0004] The purpose of the present invention is to provide an environment-friendly wafer ultrasonic cleaning device to solve the problem proposed in the above background technique that the cleaning liquid is usually directly discharged after single use without effective recovery and reuse, which not only causes a large amount of waste of the cleaning liquid, increases the production cost, but also exerts great pressure on the environment.

[0005] To achieve the above purpose, the present invention provides the following technical solution: An environment-friendly wafer ultrasonic cleaning device, including a cleaning chamber and a recovery and filtration chamber. The cleaning chamber is fixedly installed on the top of the recovery and filtration chamber and is used for cleaning wafers using ultrasonic waves. A cleaning and recovery mechanism is fixedly installed on the top of the recovery and filtration chamber, and a filtration mechanism is fixedly installed inside the recovery and filtration chamber. The filtration mechanism is connected and communicated with the cleaning and recovery mechanism; The cleaning and recovery mechanism includes a partition table, an anti-overflow baffle, and a main cylinder. The main cylinder is fixedly installed at the center of the partition table. The anti-overflow baffle is fixedly installed on the upper surface of the partition table, surrounding and higher than the main cylinder. A movable plate is slidably connected inside the main cylinder. Both sides of the main cylinder are communicated with a reflux pipeline, and there is a height difference between the connection ports of the reflux pipeline and the main cylinder; The filtration mechanism includes a hollow tube, a first piston, and a second piston. The first piston and the second piston are symmetrically slidably connected inside the hollow tube. The hollow tube is connected and communicated with the reflux pipeline, and the hollow tube is perpendicular to the reflux pipeline. Two filter cores are provided at the junction of the reflux pipeline and the hollow tube.

[0006] Preferably, vertical plates are fixedly installed at both ends of the separation table, a positioning frame is fixedly installed at the top of the recycling and filtering chamber, the vertical plates are fixedly connected to the positioning frame, and a positioning plate is fixedly installed at the bottom of the recycling and filtering chamber.

[0007] Preferably, a reduction motor is fixedly installed on the upper surface of one end of the positioning plate, the output shaft of the reduction motor is fixedly connected to a crank, one end of the crank is fixedly connected to a transmission rod, one end of the transmission rod is rotatably connected to a push rod, and the push rod is rotatably connected to the first piston.

[0008] Preferably, a secondary rod is rotatably connected to the outer wall of the crank, one end of the secondary rod is rotatably connected to a connecting rod, the connecting rod is located above the hollow tube, and the connecting rod is fixedly connected to the second piston, and the second piston is located below the connecting rod.

[0009] Preferably, a cavity is formed inside the connecting rod, a vertical rod is fixedly installed on the lower surface of the movable plate, and the vertical rod is inserted into the cavity.

[0010] Preferably, a partition plate is fixedly installed on the inner side wall of the main cylinder, a notch is formed at the edge of the partition plate, a support column is fixedly installed on the upper surface of the partition plate, a turntable is rotatably connected to the top of the support column, and a small motor is fixedly installed on one side of the support column, and the output end of the small motor is meshed with the bottom of the turntable.

[0011] Preferably, a permeable plate is fixedly installed on the inner wall of the reflux pipeline, a plugging block is slidably connected inside the permeable plate, and a spring is fixedly connected between the plugging block and the permeable plate.

[0012] Preferably, a first arc-shaped plate and a second arc-shaped plate are respectively movably installed at the junction of the reflux pipeline and the main cylinder. The first arc-shaped plate is slidably connected to the reflux pipeline and the vertical plate. A water pump is fixedly installed inside one section of the reflux pipeline, and the water pump is located below the second arc-shaped plate.

[0013] Preferably, a communication hole is formed inside the separation table, the communication hole is communicated with the main cylinder, and the junction of the communication hole and the separation table is located between the main cylinder and the anti-overflow baffle.

[0014] Preferably, an electric cylinder is fixedly installed on the upper surface of the other end of the positioning plate, and one end of the piston of the electric cylinder is fixedly connected to the movable plate.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. In the present invention, a recycling and filtering chamber is provided in the equipment. The cleaning liquid flows into the filtering mechanism through the cleaning and recycling mechanism, and after being filtered by a double filter element, it is recycled. This recycling method significantly reduces the consumption of the cleaning liquid, lowers the production cost, and at the same time reduces the environmental pollution caused by the discharge of the cleaning liquid. In addition, the reflux pipeline utilizes the liquid level difference to make the cleaning liquid flow naturally, reducing the use of additional power equipment, lowering the energy consumption, and achieving the dual goals of environmental protection and energy conservation.

[0016] 2. In the present invention, the cleaning chamber uses ultrasonic waves to clean the wafers. The impact force generated by the explosion of the bubbles produced by the ultrasonic waves can effectively remove impurities such as particulate contaminants, organic residues, and metal ions on the surface of the wafers. The turntable rotates driven by a small motor, enabling the wafers to come into full contact with the cleaning liquid, and the cleaning is more uniform and thorough. The double filter element filters the cleaning liquid efficiently, avoiding secondary pollution of the wafers by impurities, ensuring the surface cleanliness of the wafers after cleaning, and contributing to improving the quality of subsequent processing technology and the chip performance.

[0017] 3. In the present invention, the partition table, vertical plate, positioning frame, and positioning plate of the equipment are interconnected to construct a stable structural framework, ensuring the stability and reliability of each component during operation. The setting of components such as electric cylinders and reduction motors makes the operation of the equipment more precise and controllable. Moreover, the design of each component of the equipment is reasonable, facilitating inspection and maintenance. Regularly checking the wear conditions of components such as the filter element, spring, plugging block, and arc plate and replacing them in a timely manner can ensure the long-term stable operation of the equipment, reduce equipment failures and downtime, and improve production efficiency. Description of the Drawings

[0018] Figure 1 is a schematic structural diagram of an environmentally friendly wafer ultrasonic cleaning equipment of the present invention; Figure 2 is a schematic internal structure diagram of the recycling and filtering chamber of an environmentally friendly wafer ultrasonic cleaning equipment of the present invention; Figure 3 is a schematic plan structure diagram of the cleaning and recycling mechanism and the filtering mechanism of an environmentally friendly wafer ultrasonic cleaning equipment of the present invention; Figure 4 is a schematic internal structure diagram of the cleaning and recycling mechanism and the filtering mechanism of an environmentally friendly wafer ultrasonic cleaning equipment of the present invention; Figure 5 is a schematic plan structure diagram of the cleaning and recycling mechanism and the filtering mechanism of an environmentally friendly wafer ultrasonic cleaning equipment of the present invention; Figure 6 is a schematic plan structure diagram of the filtering mechanism of an environmentally friendly wafer ultrasonic cleaning equipment of the present invention; Figure 7 is a schematic exploded view of the movable plate and the connecting rod structure of an environmentally friendly wafer ultrasonic cleaning equipment of the present invention; Figure 8Schematic diagram of the operation process of an environmentally friendly wafer ultrasonic cleaning device of the present invention;

[0019] In the figure: 1. Cleaning chamber; 2. Recycling and filtering chamber; 3. Cleaning and recycling mechanism; 4. Filtering mechanism; 5. Positioning plate; 6. Positioning frame; 31. Partition table; 32. Anti-overflow baffle; 33. Turntable; 34. Vertical plate; 35. Main cylinder; 36. Return pipeline; 37. Partition board; 38. Support column; 39. Small motor; 310. Communication hole; 311. Notch; 312. Movable plate; 313. Electric cylinder; 314. Permeation plate; 315. Plugging block; 316. First arc plate; 317. Second arc plate; 318. Vertical rod; 319. Filter element; 320. Water pump; 41. Reduction motor; 42. Hollow tube; 43. First piston; 44. Second piston; 45. Push rod; 46. Transmission rod; 47. Crank; 48. Sub-rod; 49. Connecting rod; 410. Cavity. Detailed implementation mode

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] Embodiment 1: Refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 shown in the figure: An environmentally friendly wafer ultrasonic cleaning device includes a cleaning chamber 1 and a recycling and filtering chamber 2. The cleaning chamber 1 is fixedly installed on the top of the recycling and filtering chamber 2 and is used to clean wafers using ultrasonic waves. A cleaning and recycling mechanism 3 is fixedly installed on the top of the recycling and filtering chamber 2, and a filtering mechanism 4 is fixedly installed inside the recycling and filtering chamber 2. The filtering mechanism 4 is communicated with the cleaning and recycling mechanism 3; The cleaning and recycling mechanism 3 includes a partition table 31, an anti-overflow baffle 32, and a main cylinder 35. The main cylinder 35 is fixedly installed at the center of the partition table 31. The anti-overflow baffle 32 is fixedly installed on the upper surface of the partition table 31, surrounding and higher than the main cylinder 35. A movable plate 312 is slidably connected inside the main cylinder 35. Both sides of the main cylinder 35 are communicated with a return pipeline 36, and there is a height difference between the connection ports of the return pipeline 36 and the main cylinder 35; The filtering mechanism 4 includes a hollow tube 42, a first piston 43 and a second piston 44. The first piston 43 and the second piston 44 are symmetrically and slidably connected inside the hollow tube 42. The hollow tube 42 communicates with the return pipeline 36 and is perpendicular to the return pipeline 36. There are two filter cores 319 at the junction of the return pipeline 36 and the hollow tube 42.

[0022] In this embodiment, the overall structure: The device consists of a cleaning chamber 1 and a recycling and filtering chamber 2. The cleaning chamber 1 is located at the top of the recycling and filtering chamber 2. The cleaning chamber 1 uses ultrasonic waves to clean the wafers. The recycling and filtering chamber 2 is responsible for the recycling and filtering of the cleaning liquid. The two work together to ensure the efficient progress of the cleaning process. This device uses clean water as the cleaning liquid. The cleaning and recycling mechanism 3 Component composition and functions: The partition table 31 is used to support and fix the main cylinder 35, and at the same time reasonably divides the top space of the recycling and filtering chamber 2. The overflow prevention baffle 32 surrounds the main cylinder 35 and is higher than it, which can effectively prevent the cleaning liquid from overflowing, ensure the safe operation of the device, and avoid environmental pollution or equipment damage caused by the outflow of the cleaning liquid. The main cylinder 35 is a key component for storing and circulating the cleaning liquid. The movable plate 312 can slide inside it. The change in the position of the movable plate 312 will affect the pressure and circulation path of the cleaning liquid in the main cylinder 35. Design of the return pipeline 36: There is a height difference between the connection ports of the return pipelines 36 on both sides of the main cylinder 35 and the main cylinder 35. This design utilizes the principle of liquid level difference, enabling the cleaning liquid to flow naturally between the main cylinder 35 and the return pipeline 36, providing power for the circulation of the cleaning liquid, reducing the use of additional power equipment, and lowering energy consumption. Filtering mechanism 4: The first piston 43 and the second piston 44 in the hollow tube 42 slide symmetrically. By the movement of the pistons, the pressure inside the hollow tube 42 is changed, thereby controlling the flow direction and speed of the cleaning liquid in the hollow tube 42. There are two filter cores 319 at the junction of the return pipeline 36 and the hollow tube 42, which can double-filter the cleaning liquid flowing from the main cylinder 35 into the hollow tube 42, effectively removing impurities in the cleaning liquid, ensuring the cleanliness of the cleaning liquid flowing back to the main cylinder 35, improving the cleaning effect, and reducing the secondary pollution of the wafers by impurities.

[0023] Embodiment 2: According to Figure 3 、 Figure 4 and Figure 5As shown in the figure, the cleaning and recycling mechanism 3 includes a partition table 31, an anti-overflow baffle 32, and a main cylinder 35. The main cylinder 35 is fixedly installed at the center of the partition table 31. The anti-overflow baffle 32 is fixedly installed on the upper surface of the partition table 31, surrounding and higher than the main cylinder 35. An activity plate 312 is slidably connected inside the main cylinder 35. Both sides of the main cylinder 35 are communicated with a reflux pipeline 36, and there is a height difference between the connection ports of the reflux pipeline 36 and the main cylinder 35. Vertical plates 34 are fixedly installed at both ends of the partition table 31. A positioning frame 6 is fixedly installed at the top of the recycling and filtering chamber 2. The vertical plates 34 are fixedly connected to the positioning frame 6. A positioning plate 5 is fixedly installed at the bottom of the recycling and filtering chamber 2. A partition plate 37 is fixedly installed on the inner side wall of the main cylinder 35. A notch 311 is opened at the edge of the partition plate 37. A support column 38 is fixedly installed on the upper surface of the partition plate 37. A turntable 33 is rotatably connected to the top of the support column 38. A small motor 39 is fixedly installed on one side of the support column 38. The output end of the small motor 39 is meshed with the bottom of the turntable 33. A permeable plate 314 is fixedly installed on the inner wall of the reflux pipeline 36. A plugging block 315 is slidably connected inside the permeable plate 314. A spring is fixedly connected between the plugging block 315 and the permeable plate 314. First and second arc-shaped plates 316 and 317 are respectively movably installed at the junction of the reflux pipeline 36 and the main cylinder 35. The first arc-shaped plate 316 is slidably connected to the reflux pipeline 36 and the vertical plate 34. A water pump 320 is fixedly installed inside one section of the reflux pipeline 36, and the water pump 320 is located below the second arc-shaped plate 317. A communication hole 310 is opened inside the partition table 31. The communication hole 310 is communicated with the main cylinder 35, and the junction of the communication hole 310 and the partition table 31 is located between the main cylinder 35 and the anti-overflow baffle 32. An electric cylinder 313 is fixedly installed on the upper surface of the other end of the positioning plate 5. One end of the piston of the electric cylinder 313 is fixedly connected to the activity plate 312.

[0024] In this embodiment, the wafer to be cleaned is placed on the turntable 33 inside the main cylinder 35 to ensure the stable position of the wafer. Check whether the connections of all components of the equipment are firm, whether the cleaning liquid is sufficient, and whether the filter element 319 is normal to prepare for cleaning. The partition table 31 is connected to the positioning frame 6 through the vertical plate 34 to ensure its own structural stability. The turntable 33 is installed on the support column 38 on the upper surface of the partition plate 37 to determine the position of the wafer. Start the equipment, turn on the ultrasonic generator to generate ultrasonic waves in the cleaning chamber 1, and at the same time start the small motor 39. The small motor 39 drives the turntable 33 to rotate, causing the wafer to rotate accordingly. Wafer cleaning stage: The small motor 39 continuously drives the turntable 33. Under the action of ultrasonic waves, a large number of bubbles are generated in the cleaning liquid in the cleaning chamber 1. The explosion of the bubbles is used to complete the cleaning of the wafer surface, causing the impurities on the wafer surface to detach. As the cleaning progresses, the cleaning liquid gradually increases, and the wafer will finally be immersed in the cleaning liquid. The cleaning liquid will flow into other areas of the main cylinder 35 through the communication holes 310 inside the partition table 31 to prevent the cleaning liquid from overflowing. The cleaning liquid flows into the bottom of the main cylinder 35 through the notch 311 at the edge of the partition plate 37 on the inner side wall of the main cylinder 35; Cleaning liquid circulation and filtration stage: When the liquid level rises to a certain extent, the electric cylinder 313 pulls the movable plate 312 downward, causing the movable plate 312 to move below the first arc-shaped plate 316, allowing the cleaning liquid to flush open the first arc-shaped plate 316 and enter the return pipe 36. During this process, the vertical rod 318 slides in the cavity 410 of the connecting rod 49 to prevent the movable plate 312 from tilting. The deceleration motor 41 on the upper surface of one end of the positioning plate 5 starts, driving the crank 47 to rotate. The crank 47 pushes the push rod 45 through the transmission rod 46, causing the first piston 43 and the second piston 44 to move away from each other. Under the action of the piston movement, negative pressure is generated in the hollow tube 42, thereby sucking the cleaning liquid in the return pipe 36 into the hollow tube 42. When the cleaning liquid flows through the junction of the return pipe 36 and the hollow tube 42, it is filtered by the filter element 319. Subsequently, the first piston 43 and the second piston 44 move closer to each other, pressing the cleaning liquid in the hollow tube 42 into the return pipe 36, and finally flowing back into the main cylinder 35 from the second arc-shaped plate 317 for recycling. An osmotic plate 314 is provided in the return pipe 36 to ensure the normal flow of the cleaning liquid. During the process of the first piston 43 and the second piston 44 moving away from each other to generate suction and extract the cleaning liquid, the left blocking block 315 will move away from the osmotic plate 314, allowing the cleaning liquid to flow into the hollow tube 42. At this time, the right blocking block 315 will fit on the osmotic plate 314 to prevent the cleaning liquid from flowing out. When the first piston 43 and the second piston 44 move closer to each other to press out the cleaning liquid, the left blocking block 315 will fit on the osmotic plate 314, while the right blocking block 315 will move away from the osmotic plate 314. At this time, the cleaning liquid can enter the right return pipe 36, and as the first piston 43 and the second piston 44 continuously move closer and farther away, the cleaning liquid will be continuously pressed into the right return pipe 36 and finally be pumped out by the water pump 320 and re-discharged back into the main cylinder 35. The pressure of the cleaning liquid will flush open the second arc-shaped plate 317; Equipment stop and maintenance stage: After the cleaning is completed, turn off the ultrasonic generator and the small motor 39, stop the cleaning and wafer rotation, regularly check the pollution condition of the filter element 319, and replace the filter element 319 in a timely manner; check the wear condition of components such as springs, blocking blocks 315, and arc-shaped plates, and replace them in a timely manner if damaged to ensure the normal operation of the equipment.

[0025] Example three: According to Figure 4 、Figure 5 , Figure 6 and Figure 7 As shown in Figure 5 , Figure 6 and Figure 7 , the filtering mechanism 4 includes a hollow tube 42, a first piston 43 and a second piston 44. The first piston 43 and the second piston 44 are symmetrically and slidably connected inside the hollow tube 42. The hollow tube 42 communicates with the return pipeline 36 and is perpendicular to the return pipeline 36. There are two filter cores 319 at the junction of the return pipeline 36 and the hollow tube 42. On the upper surface of one end of the positioning plate 5, a deceleration motor 41 is fixedly installed. The output shaft of the deceleration motor 41 is fixedly connected to a crank 47. One end of the crank 47 is fixedly connected to a transmission rod 46. One end of the transmission rod 46 is rotatably connected to a push rod 45. The push rod 45 is rotatably connected to the first piston 43. A secondary rod 48 is rotatably connected to the outer wall of the crank 47. One end of the secondary rod 48 is rotatably connected to a connecting rod 49. The connecting rod 49 is located above the hollow tube 42. The connecting rod 49 is fixedly connected to the second piston 44. The second piston 44 is located below the connecting rod 49. A cavity 410 is formed inside the connecting rod 49. A vertical rod 318 is fixedly installed on the lower surface of the movable plate 312. The vertical rod 318 is inserted into the cavity 410.

[0026] In this embodiment, when the environmentally friendly wafer ultrasonic cleaning equipment is turned on, the deceleration motor 41 on the upper surface of one end of the positioning plate 5 is powered on and started, providing a power source for a series of subsequent movements. The output shaft of the deceleration motor 41 drives the crank 47 to perform a circular motion. One end of the crank 47 is connected to the transmission rod 46, which swings as the crank 47 rotates. The transmission rod 46 pushes the push rod 45, causing the first piston 43 to perform a reciprocating linear motion inside the hollow tube 42. At the same time, the secondary rod 48 rotatably connected to the outer wall of the crank 47 also rotates with the crank 47. The secondary rod 48 drives the connecting rod 49 to move. Since the connecting rod 49 is fixedly connected to the second piston 44, the second piston 44 performs a reciprocating linear motion corresponding to the first piston 43 inside the hollow tube 42, and their moving directions are opposite. Under the relative movement of the first piston 43 and the second piston 44, a pressure difference is formed inside the hollow tube 42. When the first piston 43 and the second piston 44 move away from each other, a negative pressure is generated to suck the cleaning liquid in the main cylinder 35 into the hollow tube 42 through the return pipeline 36. When the cleaning liquid flows through the junction of the return pipeline 36 and the hollow tube 42, the two filter cores 319 filter it, intercepting pollutants such as impurity particles and metal chips in the cleaning liquid. Subsequently, the first piston 43 and the second piston 44 move closer to each other, pressing the cleaning liquid out of the hollow tube 42 and returning it to the main cylinder 35 from the hollow tube 42, realizing the recycling of the cleaning liquid. The cavity 410 inside the connecting rod 49 is used to accommodate the vertical rod 318.

[0027] Usage method and working principle of this device: Preparation stage: Place the wafer steadily on the turntable 33 inside the main cylinder 35. Check whether all connection parts of the equipment are firm, whether the cleaning liquid is sufficient, and whether the filter element 319 is normal. When starting the equipment, turn on the ultrasonic generator to generate ultrasonic waves in the cleaning chamber 1. At the same time, start the small motor 39 to drive the turntable 33 to rotate, so that the wafer rotates accordingly, preparing for cleaning, ensuring that the wafer can be evenly washed during the cleaning process and improving the cleaning effect.

[0028] Cleaning stage: Inside the cleaning chamber 1, a large number of bubbles are generated in the cleaning liquid under the action of ultrasonic waves. The impact force generated by the explosion of the bubbles impacts the surface of the wafer, causing the impurities on the wafer surface to break away. As the cleaning continues, the cleaning liquid continuously increases. Part of the cleaning liquid flows into the main cylinder 35 through the communication hole 310 inside the partition table 31 to prevent the cleaning liquid from overflowing, and the rest of the cleaning liquid flows into the bottom of the main cylinder 35 through the notch 311 at the edge of the partition plate 37 on the inner side wall of the main cylinder 35; Cleaning liquid circulation and filtration stage Piston-driven circulation: The reduction motor 41 on the positioning plate 5 is started, and its output shaft drives the crank 47 to perform a circular motion. The crank 47 pushes the push rod 45 through the transmission rod 46, so that the first piston 43 makes a reciprocating linear motion inside the hollow tube 42. At the same time, the auxiliary rod 48 rotatably connected to the outer wall of the crank 47 drives the connecting rod 49, so that the second piston 44 makes a reciprocating linear motion in the hollow tube 42 in the opposite direction to the first piston 43. This relative motion of the pistons forms a pressure difference inside the hollow tube 42, providing power for the circulation of the cleaning liquid; Filtration process: When the first piston 43 and the second piston 44 move away from each other, a negative pressure is generated inside the hollow tube 42, sucking the cleaning liquid in the main cylinder 35 into the hollow tube 42 through the return pipe 36. When the cleaning liquid flows through the junction of the return pipe 36 and the hollow tube 42, it is double-filtered by the two filter elements 319, effectively intercepting pollutants such as impurity particles and metal chips in the cleaning liquid, ensuring the cleanliness of the cleaning liquid flowing back into the main cylinder 35. After that, the first piston 43 and the second piston 44 move closer to each other, pressing the filtered cleaning liquid into the return pipe 36 and finally flowing back into the main cylinder 35, realizing the recycling of the cleaning liquid. When the piston extracts the cleaning liquid, one side of the blocking block 315 moves away, allowing the cleaning liquid to flow into the hollow tube 42, and the other side of the blocking block 315 fits against the permeable plate 314 to prevent the cleaning liquid from flowing out. When the piston presses out the cleaning liquid, the states of the two blocking blocks 315 are opposite, ensuring that the cleaning liquid flows along the predetermined path. In addition, the water pump 320 provided in part of the return pipe 36 enhances the circulation power of the cleaning liquid, and the pressure of the cleaning liquid can also push open the second arc-shaped plate 317 to assist the smooth circulation of the cleaning liquid, further improving the circulation efficiency and cleaning effect; Stop and maintenance process: After cleaning is completed, turn off the ultrasonic generator and the small motor 39 to stop cleaning and wafer rotation. Regularly check the contamination of the filter element 319 and replace the contaminated filter element 319 in a timely manner. At the same time, check the wear conditions of components such as springs, plugging blocks 315, and arc-shaped plates.

[0029] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements on some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An environmentally friendly wafer ultrasonic cleaning device, comprising a cleaning chamber (1) and a recycling and filtering chamber (2), the cleaning chamber (1) is fixedly installed on the top of the recycling and filtering chamber (2) and is used for cleaning wafers using ultrasonic waves, and is characterized in that: A cleaning and recycling mechanism (3) is fixedly installed at the top of the recycling and filtering chamber (2), and a filtering mechanism (4) is fixedly installed inside the recycling and filtering chamber (2). The filtering mechanism (4) is communicated with the cleaning and recycling mechanism (3). The cleaning and recycling mechanism (3) includes a partition table (31), an overflow prevention baffle (32), and a main cylinder (35). The main cylinder (35) is fixedly installed at the center of the partition table (31). The overflow prevention baffle (32) is fixedly installed on the upper surface of the partition table (31), surrounding and higher than the main cylinder (35). An activity plate (312) is slidably connected inside the main cylinder (35). Both sides of the main cylinder (35) are communicated with a reflux pipeline (36), and there is a height difference between the connection port of the reflux pipeline (36) and the main cylinder (35). The filtering mechanism (4) includes a hollow tube (42), a first piston (43), and a second piston (44). The first piston (43) and the second piston (44) are symmetrically slidably connected inside the hollow tube (42). The hollow tube (42) is communicated with the reflux pipeline (36), and the hollow tube (42) is perpendicular to the reflux pipeline (36). Two filter cores (319) are arranged at the junction of the reflux pipeline (36) and the hollow tube (42).

2. The environmentally friendly wafer ultrasonic cleaning device according to claim 1, wherein: Vertical plates (34) are fixedly installed at both ends of the partition table (31). A positioning frame (6) is fixedly installed at the top of the recycling and filtering chamber (2). The vertical plates (34) are fixedly connected to the positioning frame (6). A positioning plate (5) is fixedly installed at the bottom of the recycling and filtering chamber (2).

3. The environmentally friendly wafer ultrasonic cleaning equipment according to claim 2, wherein: A speed reduction motor (41) is fixedly installed on the upper surface of one end of the positioning plate (5). The output shaft of the speed reduction motor (41) is fixedly connected to a crank (47). One end of the crank (47) is fixedly connected to a transmission rod (46). One end of the transmission rod (46) is rotatably connected to a push rod (45). The push rod (45) is rotatably connected to the first piston (43).

4. An environmentally friendly wafer ultrasonic cleaning device according to claim 3, characterized in that: A secondary rod (48) is rotatably connected to the outer wall of the crank (47). One end of the secondary rod (48) is rotatably connected to a connecting rod (49). The connecting rod (49) is located above the hollow tube (42). The connecting rod (49) is fixedly connected to the second piston (44). The second piston (44) is located below the connecting rod (49).

5. An environment-friendly wafer ultrasonic cleaning device according to claim 4, characterized in that: A cavity (410) is opened inside the connecting rod (49). A vertical rod (318) is fixedly installed on the lower surface of the activity plate (312). The vertical rod (318) is inserted into the cavity (410).

6. The environmentally friendly wafer ultrasonic cleaning device according to claim 1, wherein: A partition plate (37) is fixedly installed on the inner side wall of the main cylinder (35). A notch (311) is opened at the edge of the partition plate (37). A support column (38) is fixedly installed on the upper surface of the partition plate (37). A turntable (33) is rotatably connected to the top of the support column (38). A small motor (39) is fixedly installed on one side of the support column (38). The output end of the small motor (39) is meshed with the bottom of the turntable (33).

7. An environmentally friendly wafer ultrasonic cleaning device according to claim 1, characterized in that: A permeable plate (314) is fixedly installed on the inner wall of the reflux pipeline (36). A plugging block (315) is slidably connected inside the permeable plate (314). A spring is fixedly connected between the plugging block (315) and the permeable plate (314).

8. An environmentally friendly wafer ultrasonic cleaning device according to claim 1, characterized in that: At the joints of the reflux pipeline (36) and the main cylinder (35), a first arc-shaped plate (316) and a second arc-shaped plate (317) are respectively installed movably. The first arc-shaped plate (316) is slidably connected to the reflux pipeline (36) and the vertical plate (34). A water pump (320) is fixedly installed inside a section of the reflux pipeline (36), and the water pump (320) is located below the second arc-shaped plate (317).

9. An environmentally friendly wafer ultrasonic cleaning device according to claim 1, characterized in that: A communication hole (310) is formed inside the partition table (31). The communication hole (310) communicates with the main cylinder (35), and the joint of the communication hole (310) and the partition table (31) is located between the main cylinder (35) and the anti-overflow baffle (32).

10. An environmentally friendly wafer ultrasonic cleaning device according to claim 2, wherein: An electric cylinder (313) is fixedly installed on the upper surface of the other end of the positioning plate (5), and one end of the piston of the electric cylinder (313) is fixedly connected to the movable plate (312).

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