Preparation method of gas circuit board

Abstract

The invention discloses a preparation method of a gas circuit board, and relates to the technical field of microfluidics and the technical field of gas circuit boards, and the preparation method comprises the following steps: placing a first layer of silica gel pad above a lower hot pressboard; according to a preset sequence, a plurality of plastic plates are sequentially placed above the first layer of silica gel pad, each plastic plate is provided with an air hole and / or a flow channel, and the air holes and / or air channels, corresponding in position, among the plurality of plastic plates placed on the first layer of silica gel pad are aligned; placing a second layer of silica gel pad on the plurality of plastic plates; and according to preset hot pressing parameters, the motor is controlled to drive the upper hot pressing plate to press downwards to act on the second layer of silica gel pad, and the multiple plastic plates are pressed tightly to form the gas circuit plate. By adopting the scheme, the complexity and difficulty of the preparation process are reduced, and the preparation efficiency and success rate are improved.

Description

Technical Field

[0001] The present application relates to the technical fields of microfluidics and gas circuit boards, and particularly to a method for preparing a gas circuit board for a microfluidic nucleic acid amplification analyzer. Background Art

[0002] Microfluidic chip technology (Microfluidics) integrates basic operation units such as sample preparation, reaction, separation, and detection in the biological, chemical, and medical analysis processes onto a chip at the micron scale, and automatically completes the entire analysis process. Microfluidic chips are a hot area in the development of current micro total analysis systems.

[0003] Microfluidic chip analysis uses the chip as an operation platform, and is based on analytical chemistry, relies on microelectromechanical processing technology, features a microchannel network structure, and mainly targets life sciences at present. It is the focus of the development in the field of current micro total analysis systems. Its goal is to integrate the functions of an entire laboratory, including sampling, dilution, reagent addition, reaction, separation, detection, etc. on a microchip, and it can be used multiple times. During the production of microfluidic chips, various reagents such as lysis buffer, washing buffer, and elution buffer need to be pre-buried in the chips.

[0004] A microfluidic nucleic acid amplification analyzer is a multi-molecular detection platform that integrates sample and reagent mixing, nucleic acid lysis, nucleic acid washing and elution, nucleic acid amplification, and fluorescence signal detection, and has characteristics such as integration and automation, high throughput, low consumption of detection reagents, low sample volume requirements, and low pollution. It can provide a simpler, more efficient, and more economical multi-molecular detection solution for clinical use.

[0005] The gas circuit board is the most important component in a microfluidic nucleic acid amplification analyzer and is the operating brain of the microfluidic nucleic acid amplification analyzer; its main function is to transport positive-pressure air and negative-pressure air to the flow channels of the microfluidic chip, and by compressing and sucking the composite membrane, a membrane pump and a switching valve are formed between the composite membrane and the chip (which can also be called a substrate), thereby promoting or blocking the flow of reagents.

[0006] Currently, in the production of gas circuit boards, there are mainly two methods: one is to use a single-layer metal plate (such as an aluminum plate), process holes at the positions corresponding to the chips and then connect quick-connect fittings, and then connect the quick-connect fittings at the same working positions of each chip through air pipes; the other is to use multi-layer plastic plates, coat chemical reagents on the surface of the plates with various hole positions and flow channels processed, and then bond them together in pairs to prepare a gas circuit board.

[0007] Both have their own significant drawbacks. For the former, the functions completed by the gas circuit board are relatively simple, and it cannot achieve the control of complex microfluidic chips. Moreover, under the action of positive and negative pressure air, the trachea deforms greatly, and the accuracy of pressure and vacuum degree control is relatively low. For the latter, the gas circuit board needs to be coated and bonded pairwise between multiple plastic plates. The coating process is difficult to accurately control the coating amount. When the coating is less, the bonding is not firm. When the coating is more, it is easy to produce glue flow, thus blocking the air holes and gas circuits. Therefore, an overflow groove needs to be designed and processed, and the pairwise bonding process is relatively cumbersome. If it is a four-layer gas circuit board, it needs to be coated and bonded three times, which takes a long time and has a low success rate. Summary of the Invention

[0008] The embodiment of the present application provides a method for preparing a gas circuit board to solve the problems of complex preparation process, low preparation efficiency and low success rate of the gas circuit board in the prior art.

[0009] The embodiment of the present application provides a method for preparing a gas circuit board, including:

[0010] Place the first layer of silica gel pad above the lower hot pressing plate;

[0011] Place a plurality of plastic plates on the upper part of the first layer of silica gel pad in a preset order. Each plastic plate has air holes and / or flow channels, and the air holes and / or gas circuits corresponding to each other are aligned between the plurality of plastic plates placed on the first layer of silica gel pad;

[0012] Place the second layer of silica gel pad on the plurality of plastic plates;

[0013] Control the motor to drive the upper hot pressing plate to press down according to the preset hot pressing parameters, acting on the second layer of silica gel pad, so as to press the plurality of plastic plates tightly to form a gas circuit board.

[0014] Further, the step of controlling the motor to drive the upper hot pressing plate to press down according to the preset hot pressing parameters, acting on the second layer of silica gel pad, so as to press the plurality of plastic plates tightly to form a gas circuit board includes:

[0015] Control the motor to drive the upper hot pressing plate to press down according to the preset pressure, acting on the second layer of silica gel pad;

[0016] Heat the upper hot pressing plate and the lower hot pressing plate to a preset temperature and maintain for a preset time;

[0017] After the preset time arrives, control the motor to drive the upper hot pressing plate to rise, so as to press the plurality of plastic plates tightly to form a gas circuit board.

[0018] Further, the step of controlling the motor to drive the upper hot pressing plate to press down according to the preset hot pressing parameters, acting on the second layer of silica gel pad, so as to press the plurality of plastic plates tightly to form a gas circuit board includes:

[0019] Heat up the upper hot pressing plate and the lower hot pressing plate to a preset temperature;

[0020] Control the motor to drive the upper hot pressing plate to press down according to a preset pressure, acting on the second layer of silica gel pad, and maintain for a preset duration;

[0021] After the preset duration arrives, control the motor to drive the upper hot pressing plate to rise, so as to press the multiple plastic plates tightly to form an air circuit board.

[0022] Further, the multiple plastic plates include four layers of plastic plates. From top to bottom, the thickness range of the first layer of plastic plate is 3.5 - 4.5 mm, the thickness range of the second layer of plastic plate is 4.5 - 5.5 mm, the thickness range of the third layer of plastic plate is 4.5 - 5.5 mm, and the thickness range of the fourth layer of plastic plate is 7.5 - 8.5 mm.

[0023] Further, the thickness of the first layer of plastic plate is 4 mm, the thickness of the second layer of plastic plate is 5 mm, the thickness of the third layer of plastic plate is 5 mm, and the thickness of the fourth layer of plastic plate is 8 mm.

[0024] Further, the material of the multiple plastic plates is polycarbonate PC material or polymethyl methacrylate PMMA material.

[0025] Further, the material of the multiple plastic plates is PC material;

[0026] The thickness range of the first layer of silica gel pad and the second layer of silica gel pad is 0.1 - 0.5 mm;

[0027] The preset hot pressing parameters include: preset pressure, preset temperature and preset duration;

[0028] The range of the preset pressure is 1800 - 1950 kg;

[0029] The range of the preset temperature is 140 - 150 degrees Celsius;

[0030] The range of the preset duration is 15 - 20 minutes.

[0031] Further, the thickness range of the first layer of silica gel pad and the second layer of silica gel pad is 0.3 mm;

[0032] The preset pressure is 1900 kg;

[0033] The preset temperature is 145 degrees Celsius;

[0034] The preset duration is 17 minutes.

[0035] Further, the material of the multiple plastic plates is PMMA;

[0036] The thickness range of the first layer of silica gel pad and the second layer of silica gel pad is 0.1 - 0.5 mm;

[0037] The preset hot pressing parameters include: preset pressure, preset temperature, and preset duration;

[0038] The range of the preset pressure is 1850 - 2100 kg;

[0039] The range of the preset temperature is 145 - 155 degrees Celsius;

[0040] The range of the preset duration is 19 - 24 minutes.

[0041] Further, the thickness range of the first layer of silica gel pad and the second layer of silica gel pad is 0.2 mm;

[0042] The preset pressure is 1950 kg;

[0043] The preset temperature is 149 degrees Celsius;

[0044] The preset duration is 22 minutes.

[0045] The beneficial effects of this application include:

[0046] For the method for preparing an air circuit board provided by the embodiment of this application, first, place the first layer of silica gel pad above the lower hot pressing plate, and place multiple plastic plates on top of the first layer of silica gel pad in a preset order. Each plastic plate has air holes and / or air channels, and the air holes and / or channels corresponding to each other in position between the multiple plastic plates placed on the first layer of silica gel pad are aligned. Then, place the second layer of silica gel pad on the multiple plastic plates, and control the motor to drive the upper hot pressing plate to press down according to the preset hot pressing parameters, acting on the second layer of silica gel pad, so as to press the multiple plastic plates tightly to form an air circuit board. By using the above method for preparing an air circuit board provided by the embodiment of this application, compared with the existing preparation process of coating and bonding two by two between multiple plastic plates, there is no need to coat reagents between the plastic plates. After aligning and placing multiple plastic plates, only hot pressing is required by a hot press, which reduces the complexity and difficulty of the preparation process, and improves the preparation efficiency and success rate.

[0047] Moreover, a layer of silica gel pad is placed above and below the multiple plastic plates respectively. Based on the toughness of the silica gel pad, during the hot pressing process, the pressure can act more evenly on each layer of plastic plate, so that the uneven places on the plastic plate can also be applied with a certain degree of pressure, thereby improving the adhesion effect between each layer of plastic plate and further improving the success rate of preparing the air circuit board.

[0048] Other features and advantages of the present application will be set forth in the following description, and in part will be obvious from the description, or may be learned by practice of the present application. The objectives and other advantages of the present application may be realized and attained by the structure particularly pointed out in the written description, claims, as well as the drawings. Description of the Drawings

[0049] The drawings are used to provide a further understanding of the present application and constitute a part of the description. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation to the present application. In the drawings:

[0050] Figure 1 is a flowchart of the method for preparing an air path board provided by an embodiment of the present application;

[0051] Figure 2 is a schematic diagram of a multi-layer plastic board for preparing an air path board provided by an embodiment of the present application;

[0052] Figure 3 is a schematic diagram of the method for preparing an air path board provided by an embodiment of the present application. Detailed Embodiments

[0053] In order to provide a solution for reducing the complexity and difficulty of the air path board preparation process and improving the efficiency and success rate of air path board preparation, an embodiment of the present application provides a method for preparing an air path board. The following describes the preferred embodiments of the present application with reference to the accompanying drawings of the description. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present application and are not used to limit the present application. And without conflict, the embodiments in the present application and the features in the embodiments may be combined with each other.

[0054] An embodiment of the present application provides a method for preparing an air path board, as Figure 1 shown, including:

[0055] Step 11: Place the first layer of silica gel pad above the lower hot pressing plate;

[0056] Step 12: Place a plurality of plastic boards on the first layer of silica gel pad in a preset order. Each plastic board has air holes and / or flow channels, and the air holes and / or air paths corresponding to each other in position are aligned between the plurality of plastic boards placed on the first layer of silica gel pad;

[0057] Step 13: Place the second layer of silica gel pad on the plurality of plastic boards;

[0058] Step 14: Control the motor to drive the upper hot pressing plate to press down according to the preset hot pressing parameters, acting on the second layer of silica gel pad, so as to press the plurality of plastic boards tightly to form an air path board.

[0059] Using the above-mentioned air circuit board preparation method provided by the embodiments of the present application, compared with the existing preparation process of coating and bonding between multiple plastic plates pairwise, there is no need to coat reagents between plastic plates. After aligning and placing multiple plastic plates, only hot pressing is required by a hot press, which reduces the complexity and difficulty of the preparation process, and improves the preparation efficiency and success rate.

[0060] Moreover, a layer of silicone pad is respectively placed above and below the multiple plastic plates. Based on the toughness of the silicone pad, during the hot pressing process, the pressure can act more evenly on each layer of plastic plates, so that uneven places on the plastic plates can also be applied with a certain degree of pressure, thereby improving the adhesion effect between each layer of plastic plates and further increasing the success rate of air circuit board preparation.

[0061] As Figure 2 shown, for multiple plastic plates used to prepare the air circuit board, the number of layers of plastic plates included can be determined according to the application requirements of the air circuit board. For example, it can include four layers of plastic plates, which are the first layer of plastic plate, the second layer of plastic plate, the third layer of plastic plate, and the fourth layer of plastic plate from top to bottom in sequence.

[0062] According to the application requirements of the air circuit board, various sizes of air holes and flow channels can be processed at designated positions on each layer of plastic plate, and the air holes and / or flow channels on each layer of plastic plate are corresponding in position. Thus, after hot pressing into an air circuit board, an air circuit is formed in the air circuit board, and complex air supply and air suction functions can be realized during the use of the air circuit board.

[0063] The thickness of each layer of plastic plate can also be set according to actual application requirements. For example, from top to bottom, the thickness range of the first layer of plastic plate can be 3.5 - 4.5 mm, the thickness range of the second layer of plastic plate can be 4.5 - 5.5 mm, the thickness range of the third layer of plastic plate can be 4.5 - 5.5 mm, and the thickness range of the fourth layer of plastic plate can be 7.5 - 8.5 mm.

[0064] Furthermore, the thickness of the first layer of plastic plate can be 4 mm, the thickness of the second layer of plastic plate can be 5 mm, the thickness of the third layer of plastic plate can be 5 mm, and the thickness of the fourth layer of plastic plate can be 8 mm.

[0065] In the embodiments of the present application, the materials of the multiple plastic plates can be PC (polycarbonate) material or PMMA (polymethyl methacrylate) material.

[0066] In the embodiments of the present application, the preset hot pressing parameters used for hot pressing can be set based on the material, number of layers, thickness of the plastic plate, and the thickness of the silicone pad.

[0067] Example 1:

[0068] In Embodiment 1 of the present application, the materials of the multiple plastic plates are PC materials. The multiple plastic plates include four layers of plastic plates, and the thickness of the four layers of plastic plates is also adopted. That is, the thickness of the first layer of plastic plate can be 4 mm, the thickness of the second layer of plastic plate can be 5 mm, the thickness of the third layer of plastic plate can be 5 mm, and the thickness of the fourth layer of plastic plate can be 8 mm;

[0069] The thickness range of the first layer of silicone pad and the second layer of silicone pad can be 0.1 - 0.5 mm;

[0070] The preset hot pressing parameters include: preset pressure, preset temperature, and preset duration. Among them, the preset duration is the duration of applying the preset pressure at the preset temperature;

[0071] The range of the preset pressure can be 1800 - 1950 kg;

[0072] The range of the preset temperature can be 140 - 150 degrees Celsius;

[0073] The range of the preset duration can be 15 - 20 minutes.

[0074] Further, preferably, the thickness range of the first layer of silicone pad and the second layer of silicone pad is 0.3 mm;

[0075] Correspondingly, the preset pressure is 1900 kg;

[0076] The preset temperature is 145 degrees Celsius;

[0077] The preset duration is 17 minutes.

[0078] According to the above Embodiment 1, 4 experiments are carried out, and the experimental data obtained are shown in Table 1 below:

[0079] Serial Number Material Pressure (kg) Temperature (°C) Time (min) Presence of Bubbles Presence of Cracks Compression Amount (mm) Remarks 1 PC 1900 145 17 None None 0.08 Qualified 2 PC 1900 145 17 None None 0.1 Qualified 3 PC 1900 145 17 None None 0.09 Qualified 4 PC 1900 145 17 None None 0.12 Qualified

[0080] Table 1: Experimental data of Embodiment 1

[0081] It can be seen from the experimental data in Table 1 above that when preparing the gas path board using Embodiment 1, there are no bubbles and cracks between the layers of the obtained gas path board, and the compression amount meets the requirements. Qualified products are obtained in all 4 experiments.

[0082] Embodiment 2:

[0083] In Embodiment 2 of the present application, the materials of the multiple plastic plates are PMMA materials. The multiple plastic plates include four layers of plastic plates, and the thickness of the four layers of plastic plates is also adopted. That is, the thickness of the first layer of plastic plate can be 4 mm, the thickness of the second layer of plastic plate can be 5 mm, the thickness of the third layer of plastic plate can be 5 mm, and the thickness of the fourth layer of plastic plate can be 8 mm;

[0084] The thickness range of the first layer of silicone pad and the second layer of silicone pad is 0.1 - 0.5 mm;

[0085] The preset hot pressing parameters include: preset pressure, preset temperature, and preset duration. Among them, the preset duration is the duration of applying the preset pressure at the preset temperature;

[0086] The range of the preset pressure can be 1850 - 2100 kg;

[0087] The range of the preset temperature can be 145 - 155 degrees Celsius;

[0088] The range of the preset duration can be 19 - 24 minutes.

[0089] Further, preferably, the thickness range of the first layer of silicone pad and the second layer of silicone pad is 0.2 mm;

[0090] Correspondingly, the preset pressure is 1950 kg;

[0091] The preset temperature is 149 degrees Celsius;

[0092] The preset duration is 22 minutes.

[0093] According to the above-mentioned Embodiment 2, 4 experiments were conducted, and the experimental data obtained are shown in Table 2 below:

[0094] Serial Number Material Pressure (kg) Temperature (°C) Time (min) Presence of Bubbles Presence of Cracks Compression Amount (mm) Remarks 1 PMMA 1950 149 22 None None 0.1 Qualified 2 PMMA 1950 149 22 None None 0.13 Qualified 3 PMMA 1950 149 22 None None 0.1 Qualified 4 PMMA 1950 149 22 None None 0.12 Qualified

[0095] Table 2: Experimental data of Embodiment 2

[0096] As can be seen from the experimental data in Table 2 above, when using Embodiment 2 to prepare the gas path board, there are no bubbles and cracks between the layers of the obtained gas path board, and the compression amount meets the requirements. Qualified products were obtained in all 4 experiments.

[0097] In the embodiment of the present application, for the process of applying hot pressing described in step 14 above, the following two methods can be specifically adopted:

[0098] Method 1:

[0099] According to the preset pressure, control the motor to drive the upper hot pressing plate to press down, acting on the second layer of silicone pad. That is, under the push of the motor, the upper hot pressing plate presses the second layer of silicone pad, multiple plastic plates, and the first layer of silicone pad placed in sequence on the lower hot pressing plate;

[0100] Heat the upper hot pressing plate and the lower hot pressing plate to the preset temperature and maintain for the preset duration;

[0101] After the preset duration arrives, control the motor to drive the upper hot pressing plate to rise, so as to realize pressing the multiple plastic plates tightly to form a gas path board.

[0102] Method 2:

[0103] Heat up the upper hot pressing plate and the lower hot pressing plate to a preset temperature;

[0104] Control the motor to drive the upper hot pressing plate to press down according to a preset pressure, acting on the second layer of silica gel pads, and maintaining for a preset duration, that is, under the push of the motor, the upper hot pressing plate presses the second layer of silica gel pads, multiple plastic plates and the first layer of silica gel pads placed in sequence on the lower hot pressing plate;

[0105] After the preset duration arrives, control the motor to drive the upper hot pressing plate to rise, so as to press the multiple plastic plates tightly to form a gas circuit board.

[0106] In summary, adopting the above gas circuit board preparation method provided by the embodiments of the present application, compared with the existing preparation process of coating and bonding between multiple plastic plates two by two, there is no need to coat reagents between plastic plates, eliminating the risk of glue overflow. After aligning and placing multiple plastic plates, only hot pressing with a hot press is required, which can be processed and formed at one time, reducing the complexity and difficulty of the preparation process, and improving the preparation efficiency and success rate.

[0107] Moreover, a layer of silica gel pads are respectively placed above and below the multiple plastic plates. Based on the toughness of the silica gel pads, during the hot pressing process, the pressure can act more evenly on each layer of plastic plates, so that uneven places on the plastic plates can also be applied with a certain degree of pressure, thereby improving the adhesion effect between each layer of plastic plates and further improving the success rate of gas circuit board preparation.

[0108] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, the element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0109] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these changes and variations.

Claims

1. A method for preparing an air circuit board, characterized in that, Including: Place the first layer of silicone pad above the lower hot pressing plate; Place multiple plastic plates above the first layer of silicone pad in a preset order. Each plastic plate has air holes and / or flow channels, and the air holes and / or air paths corresponding in position are aligned between the multiple plastic plates placed on the first layer of silicone pad; Place the second layer of silicone pad on the multiple plastic plates; According to preset hot pressing parameters, control the motor to drive the upper hot pressing plate to press down, acting on the second layer of silicone pad, so as to press the multiple plastic plates tightly to form an air path plate.

2. The method according to claim 1, characterized in that, The step of "According to preset hot pressing parameters, control the motor to drive the upper hot pressing plate to press down, acting on the second layer of silicone pad, so as to press the multiple plastic plates tightly to form an air path plate" includes: According to preset pressure, control the motor to drive the upper hot pressing plate to press down, acting on the second layer of silicone pad; Heat the upper hot pressing plate and the lower hot pressing plate to a preset temperature and maintain for a preset duration; After the preset duration arrives, control the motor to drive the upper hot pressing plate to rise, so as to press the multiple plastic plates tightly to form an air path plate.

3. The method according to claim 1, characterized in that, The step of "According to preset hot pressing parameters, control the motor to drive the upper hot pressing plate to press down, acting on the second layer of silicone pad, so as to press the multiple plastic plates tightly to form an air path plate" includes: Heat the upper hot pressing plate and the lower hot pressing plate to a preset temperature; According to preset pressure, control the motor to drive the upper hot pressing plate to press down, acting on the second layer of silicone pad and maintain for a preset duration; After the preset duration arrives, control the motor to drive the upper hot pressing plate to rise, so as to press the multiple plastic plates tightly to form an air path plate.

4. The method according to claim 1, characterized in that, The multiple plastic plates include four layers of plastic plates. From top to bottom, the thickness range of the first layer of plastic plate is 3.5 - 4.5 mm, the thickness range of the second layer of plastic plate is 4.5 - 5.5 mm, the thickness range of the third layer of plastic plate is 4.5 - 5.5 mm, and the thickness range of the fourth layer of plastic plate is 7.5 - 8.5 mm.

5. The method according to claim 4, characterized in that, The thickness of the first layer of plastic plate is 4 mm, the thickness of the second layer of plastic plate is 5 mm, the thickness of the third layer of plastic plate is 5 mm, and the thickness of the fourth layer of plastic plate is 8 mm.

6. The method according to claim 4 or 5, characterized in that, The material of the multiple plastic plates is polycarbonate PC material or polymethyl methacrylate PMMA material.

7. The method according to claim 6, wherein The material of the multiple plastic plates is PC material; The thickness range of the first layer of silicone pad and the second layer of silicone pad is 0.1 - 0.5 mm; The preset hot pressing parameters include: preset pressure, preset temperature and preset duration; The range of the preset pressure is 1800 - 1950 kg; The range of the preset temperature is 140 - 150 degrees Celsius; The range of the preset duration is 15 - 20 minutes.

8. The method according to claim 7, wherein The thickness range of the first layer of silicone pad and the second layer of silicone pad is 0.3 mm; The preset pressure is 1900 kg; The preset temperature is 145 degrees Celsius; The preset duration is 17 minutes.

9. The method according to claim 6, wherein The material of the multiple plastic plates is PMMA material; The thickness range of the first layer of silicone pad and the second layer of silicone pad is 0.1 - 0.5 mm; The preset hot pressing parameters include: preset pressure, preset temperature, and preset duration; The range of the preset pressure is 1850 - 2100 kg; The range of the preset temperature is 145 - 155 degrees Celsius; The range of the preset duration is 19 - 24 minutes.

10. The method according to claim 9, characterized in that, The thickness of the first layer of silicone pad and the second layer of silicone pad ranges from 0.2 mm; The preset pressure is 1950 kg; The preset temperature is 149 degrees Celsius; The preset duration is 22 minutes.

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