Semi-automatic film sticking machine capable of sticking front surface film and back surface film and film sticking method

Abstract

The invention provides a semi-automatic film sticking machine capable of sticking a front surface film and a back surface film and a film sticking method. The semi-automatic film pasting machine capable of pasting the front face film and the back face film comprises a machine table, a film pasting assembly, a cover plate, a film pressing assembly and a film supplying assembly, an annular cutter and a straight cutter are arranged in the cover plate, the film pasting assembly comprises a working disc, a centering mechanism and a lifting mechanism, the top of the edge of the working disc is an inclined face, a circle of gap exists between the working disc and the machine table, and the edge of the working disc is provided with an annular cutter. The centering mechanisms are arranged around the working disc, the tops of the inner sides of the centering mechanisms are inclined planes, the inner side faces of the centering mechanisms are embedded into the working disc, the outer side faces of the centering mechanisms are embedded into the machine table, and the lifting mechanism is arranged in the machine table and connected with all the centering mechanisms. The film pasting method comprises the steps of centering, film covering, film cutting and the like. According to the semi-automatic film sticking machine capable of sticking the front surface film and the back surface film and the film sticking method provided by the invention, the problems of large glue film waste and high processing cost are solved.

Description

Technical Field

[0001] The present invention relates to the field of wafer film sticking equipment, and particularly relates to a semi-automatic film sticking machine and a film sticking method capable of sticking front and back films. Background Art

[0002] Wafer film sticking includes two cases: front film sticking and back film sticking. For front film sticking, a front protective film needs to be stuck before grinding and thinning to ensure that the front of the wafer is free from pollution, scratches, indentation and other problems during back grinding and thinning. Back film sticking is a subsequent process in the semiconductor manufacturing industrial process. Before cutting the wafer, a protective film needs to be stuck on the back of the wafer and fixed on a metal frame to facilitate subsequent cutting. Among them, higher requirements are imposed on the cutting accuracy and other aspects of circular cutting for front film sticking, and currently only a fully automatic film sticking machine can be used for operation. When sticking the back film, the cutting tool cuts on the metal frame, so a relatively simple semi-automatic film sticking machine can be used for operation. When operating a fully automatic film sticking machine, machine change and film change operations exist according to product characteristics. Due to the structure of the machine, the film is reciprocally bent inside the machine, and nearly one meter of film will be wasted during machine change and film change. In the case of processing small batches of products, there are relatively frequent machine change and film change operations. Therefore, using a fully automatic film sticking machine for operation will cause a large amount of film waste and result in a high processing cost. Using a semi-automatic film sticking machine can solve the problem of film waste, but the current semi-automatic film sticking machine cannot realize sticking the front film of the wafer. Summary of the Invention

[0003] To solve the problems of large film waste and high processing cost, the present invention provides a semi-automatic film sticking machine and a film sticking method capable of sticking front and back films to solve the above problems.

[0004] A semi-automatic film sticking machine capable of sticking front and back films includes a machine table, a film sticking assembly, a cover plate, a film pressing assembly and a film feeding assembly successively arranged on the machine table. A circular cutting knife and a straight cutting knife are arranged in the cover plate. The film sticking assembly includes a working disk, a centering mechanism and a lifting mechanism. The top edge of the working disk is beveled and there is a circular gap between it and the machine table. A plurality of centering mechanisms are arranged around the working disk. The top inner side of the centering mechanism is beveled. The inner side surface of the centering mechanism is embedded into the working disk, and the embedding depth exceeds the beveled part of the working disk. The outer side surface is embedded into the machine table, and the embedding depth exceeds the gap between the working disk and the machine table. The lifting mechanism is arranged inside the machine table and is connected to all the centering mechanisms.

[0005] The circular cutting knife includes a bearing disk, a cutting knife mechanism and a roller mechanism. The cover plate is provided with a circular opening. The bearing disk is arranged on the top surface of the cover plate and is movably connected to the cover plate through a plain bearing arranged along the opening. The bearing disk is concentric with the circular opening of the cover plate, and the cutting knife mechanism and the roller mechanism are respectively arranged at both ends in the radial direction on the lower surface.

[0006] The cutting tool mechanism includes a mounting plate, a slide rail, a slider, and a cutting tool. The mounting plate is arranged along the radial direction of the carrier disk, and one end close to the center is connected to the carrier disk through a vertical rod, the middle position is connected to the carrier disk through a spring vertical rod, and the cutting tool is provided at the outer end. The lower end of the cutting tool inclines outward, and the inclination angle is the same as that of the inclined surface part of the working disk. On the side of the mounting plate close to the carrier disk, the slide rail is arranged along the radial direction and is connected to the slider. The slide rail extends below the cover plate. A guiding end is provided on the outer side of the slider. The guiding end can move along the slide rail between the mounting plate and the cover plate, causing the cutting tool to move downward by a fixed distance. The carrier disk is provided with a notch along the movement track of the slider for the slider to protrude upward to the top surface of the carrier disk.

[0007] In a preferred embodiment of the semi-automatic film laminating machine capable of laminating front and back films provided by the present invention, an ion blower is provided on the side of the machine table. The control circuit of the ion blower is connected to the machine table, and the air exhaust direction of the ion blower points to the working disk.

[0008] In a preferred embodiment of the semi-automatic film laminating machine capable of laminating front and back films provided by the present invention, the film pressing assembly is an automatic film pressing assembly, including an actuating mechanism arranged in the machine table and a roller mechanism located above the machine table. Through grooves are arranged along both sides of the film laminating assembly on the machine table, and both ends of the roller mechanism are connected to the actuating mechanism in the through grooves.

[0009] In a preferred embodiment of the semi-automatic film laminating machine capable of laminating front and back films provided by the present invention, the inner top of the centering mechanism is an arc-shaped inclined surface, the lower part of the inner side is an arc-shaped flat wall, and the inner side is a silica gel soft block. The vertical projections of the arc-shaped flat walls at the lower parts of all the inner sides of the centering mechanism are aligned with the same circle, and the center of the circle is concentric with the working disk. When the centering mechanism reaches the highest position, the inclined surface part at its top is higher than the working disk; when it reaches the lowest position, its top surface is lower than the inclined surface part at the edge of the working disk.

[0010] In a preferred embodiment of the semi-automatic film laminating machine capable of laminating front and back films provided by the present invention, the cutting tool mechanism further includes a temperature control unit. The temperature control unit is arranged at a position close to the cutting tool on the side of the mounting plate close to the working disk, and its control circuit is connected to the machine table.

[0011] In a preferred embodiment of the semi-automatic film laminating machine capable of laminating front and back films provided by the present invention, the roller mechanism includes a mounting frame and rollers. One end of the mounting frame close to the center is connected to the carrier disk through a vertical rod, the middle position is connected to the carrier disk through a spring vertical rod, and the rollers are provided at the outer end. The movement tracks of the rollers coincide with those of the cutting tool.

[0012] A film pasting method for a semi-automatic film pasting machine based on a film that can be pasted on the front and back sides of a wafer, comprising the following steps: Step 1: Place the wafer on the working plate; Step 2: Control the centering mechanism to rise and align the wafer with the center of the working plate; Step 3: After fixing the wafer, control the centering mechanism to lower; Step 4: Pull out the adhesive film from the film supply assembly and cover it on the wafer; Step 5: Control the film pressing assembly to press the adhesive film and the wafer tightly; Step 6: Close the cover plate. At this time, the cutting knife does not contact the adhesive film. Operate the sliding head to move outwards and embed it between the mounting plate and the cover plate, so that the cutting knife contacts the adhesive film. Continue to operate the sliding head to move circumferentially for one or more circles to cut the adhesive film along the wafer; Step 7: Operate the straight cutting knife to reciprocate to cut the adhesive film as a whole; Step 8: Open the cover plate and remove the excess adhesive film; Step 9: Loosen the wafer, remove it and transfer it to the next process.

[0013] Compared with the prior art, the semi-automatic film pasting machine and film pasting method for pasting films on the front and back sides of a wafer provided by the present invention have the following beneficial effects: 1. The solution provided by the present invention improves the existing semi-automatic film pasting machine, enabling it to meet the requirements of wafer front-side film pasting, greatly reducing the waste of adhesive film, lowering the equipment cost and consumable cost of wafer front-side film pasting, and facilitating the full combination of the wafer and the adhesive film. At the same time, the equipment can still meet the original back-side film pasting function.

[0014] 2. In the solution provided by the present invention, a centering mechanism is provided to calibrate the wafer to be in the center of the working plate when manually placing the wafer, meeting the processing requirements of wafer front-side film pasting. It solves the problem that there will inevitably be some offsets when manually placing the wafer, and it is necessary to continuously suck and release vacuum to adjust the placement position. Through the combination of the silicone soft block and the telescopic clamping block, flexible contact is provided during wafer positioning, avoiding surface damage caused by hard clamping, and ensuring that the wafer is centered and fixed.

[0015] 3. In the solution provided by the present invention, the blade of the circumferential cutting knife is inclined, and at the same time, the edge of the working plate is also adapted to be inclined to achieve bevel cutting. Bevel cutting ensures that the edge of the wafer with the adhered adhesive film is smooth and free of burrs, avoiding water ingress at the joint of the adhesive film and the wafer due to the existence of burrs and foreign objects during subsequent grinding work, resulting in grinding cracks, and fully meeting the processing requirements of wafer front-side film pasting.

[0016] 4. In the solution provided by the present invention, the blade does not contact the adhesive film when covering the lower cover plate. Under the design of the inclined blade, if the blade contacts the adhesive film when covering the lower cover plate, the gap between the blade and the wafer is too small, and the vibration when covering the lower cover plate is likely to cause damage to the wafer. Further, the downward movement of the cutting tool is achieved by moving the sliding head along the radial direction, ensuring that the cutting tool moves at a fixed height and trajectory in each cutting, and ensuring that the cutting edge is smooth and free of burrs.

[0017] 5. In the solution provided by the present invention, a temperature control unit is provided for the blade of the circumferential cutting tool. When cutting the back mask film, it is not necessary to control the blade temperature. When cutting the front mask film, maintaining a stable temperature of the blade can optimize the cutting effect and reduce the burrs generated during cutting. Adjusting the temperature range can adapt to different materials of adhesive films (such as UV films, blue films), enhancing the versatility of the equipment. Description of the Drawings

[0018] Figure 1 is a schematic structural diagram of a semi-automatic film laminating machine; Figure 2 is a cross-sectional view of the cover plate in the semi-automatic film laminating machine; Figure 3 is a schematic structural diagram of the semi-automatic film laminating machine after removing the cover plate; Figure 4 is Figure 2 a schematic structural diagram when the centering mechanism is raised; Figure 5 is a schematic structural diagram of the film laminating method, including Figure 5 -a, Figure 5 -b, Figure 5 -c, Figure 5 -d, where 5-a is a schematic structural diagram of step 2 in the film laminating method, 5-b is a schematic structural diagram of step 3 in the film laminating method, 5-c is a schematic structural diagram of step 5 in the film laminating method, and 5-d is a schematic structural diagram of step 6 in the film laminating method.

[0019] Reference numerals in the figures: machine platform 1, film laminating assembly 2, front positioning bar 21, working disk 22, rear positioning bar 23, centering mechanism 24, cover plate 3, hinge 31, straight cutting tool 32, circumferential cutting tool 33, carrier disk 331, mounting plate 332, slide rail 333, sliding head 334, guiding end 335, cutting tool 336, temperature control unit 337, mounting bracket 338, roller 339, roller mechanism 41, film supply assembly 5, ion blower 6, adhesive film 7, wafer 8. Detailed Embodiments

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0021] Please refer to simultaneouslyFigures 1 to 4 , which are respectively the structural schematic diagram of the semi-automatic film pasting machine for the front and back films provided by the present invention, the cross-sectional view of part of the structure at the position of the cover plate 3, and the structural schematic diagram when the centering mechanism 24 descends and rises after removing the cover plate 3.

[0022] The semi-automatic film pasting machine for the front and back films includes a machine table 1, a film pasting assembly 2, a cover plate 3, a film pressing assembly, a film supply assembly 5 and an ion blower 6.

[0023] The film pasting assembly 2 includes a front positioning strip 21, a working disk 22, a rear positioning strip 23, a centering mechanism 24 and a lifting mechanism. The cover plate 3 includes a hinge 31, a straight cutting knife 32 and a circular cutting knife 33. The film pressing assembly includes a roller mechanism 41 and an operating mechanism.

[0024] The front of the machine table 1 is an operation panel, and on the top are successively arranged a front positioning strip 21, a working disk 22, a rear positioning strip 23, a roller mechanism and a film supply assembly 5. The film supply assembly 5 preferably adopts a quick film changing mechanism with good expandability and convenient maintenance, a modular unwinding and rewinding mechanism, which supports the quick replacement and tension adjustment of the adhesive film to reduce the abnormal downtime.

[0025] On both sides of the machine table 1, at a position roughly between the rear positioning strip 23 and the roller mechanism 41, there is a hinge 31 connecting the cover plate 3. When the cover plate 3 is closed, it covers the area where the front positioning strip 21, the working disk 22 and the rear positioning strip 23 are located. Among them, the circular cutting knife 33 is aligned with the working disk 22, and the straight cutting knife 32 is aligned with the rear positioning strip 23. An ion blower 6 is arranged on the left side of the machine table 1, and its control circuit is connected to the operation panel, and its air outlet direction points to the working disk 22 to eliminate static electricity.

[0026] Both the front positioning strip 21 and the rear positioning strip 23 are used for the paste positioning of the adhesive film 7. After pulling out the adhesive film 7 from the film supply assembly 5, they are respectively pasted to the head end and the middle position of the adhesive film 7. The rear positioning strip 23 is also used to carry the blade of the straight cutting knife 32 as the position for cutting the adhesive film 7.

[0027] On both sides of the top of the machine table 1, starting from below the roller mechanism 41 to the position of the front positioning strip 21, there is respectively a through groove leading to the inside of the machine table 1 below. The two ends of the roller mechanism 41 are provided with downward extending support arms, which extend into the machine table 1 and are connected to the operating mechanism. The operating mechanism includes the functions of lifting and moving forward and backward. The film pressing assembly is the same as the similar assembly in the existing semi-automatic film pasting machine in terms of structure and function, so it will not be elaborated here.

[0028] The working disk 22 is used to place the wafer 8 and is provided with a negative pressure fixing mechanism. There is a gap between the edge of the working disk 22 and the machine table 1 for accommodating the cutting knife 336. The position of the edge of the working disk 22 near the top is a bevel for adapting to the inclination angle of the cutting knife 336.

[0029] The centering mechanism 24 is an arc-shaped block structure. Its inner side is embedded in the working disk 22, the outer side crosses the gap and is embedded in the machine table 1, and the bottom extends into the machine table 1 and is connected to the lifting mechanism, and makes a lifting movement under the drive of the lifting mechanism. The depth of the inner side of the centering mechanism 24 embedded in the working disk 22 is slightly greater than the depth of the inclined plane area of the working disk 22.

[0030] Four centering mechanisms 24 are arranged at equal intervals around the working disk 22. The inner side walls of all centering mechanisms 24, the working disk 22, and the outer side walls of all centering mechanisms 24 successively form three concentric circles. The circle formed by the inner side walls of the centering mechanism 24 is the actual placement position of the wafer.

[0031] The position of the inner side of the centering mechanism 24 near the top is an inclined plane, which naturally pushes the wafer 8 to be centered during the rising process. When reaching the highest position, the inclined plane part of the centering mechanism 24 is higher than the working disk 22, and the flat wall part of the centering mechanism 24 abuts against the wafer 8. At the lowest position, the top surface of the centering mechanism 24 is lower than the inclined plane area of the working disk 22 to avoid the blade of the circumferential cutting knife 33. The position where the centering mechanism 24 contacts the wafer 8 uses a silica gel soft block to avoid bumping and damage.

[0032] The cover plate 3 is provided with a straight cutting knife 32 at the position corresponding to the rear positioning strip 23 and a circumferential cutting knife 33 at the position corresponding to the working disk 22.

[0033] The blade of the straight cutting knife 32 is vertically arranged and perpendicular to the rear positioning strip 23. After covering the cover plate 3, the blade of the straight cutting knife 32 contacts the adhesive film, and the operating handle presses the blade, and the pressing direction is the same as the orientation of the blade, so that the blade vertically cuts the adhesive film 7. The operating handle drives the blade to move along the transverse track on the cover plate 3 to cut the adhesive film 7 along the rear positioning strip 23. The straight cutting knife 32 is the same as the similar components in the existing semi-automatic film laminating machine in terms of structure and function, so it will not be elaborated here.

[0034] The circumferential cutting knife 33 includes a carrier plate 331, a cutting mechanism and a roller mechanism. The cutting mechanism includes a mounting plate 332, a slide rail 333, a slide head 334, a guiding end 335, a cutting knife 336, and a temperature control unit 337. The roller mechanism includes a mounting frame 338 and a roller 339.

[0035] A circular opening is provided in the middle of the cover plate 3. The diameter of the carrier plate 331 is larger than the diameter of the opening, and it is installed on the top of the cover plate 3 at an angle concentric with the opening. A circle of plain bearings is provided around the opening to connect with the carrier plate 331, so that the carrier plate 331 can rotate along the opening.

[0036] On the lower surface of the carrier plate 331, a mounting plate 332 is provided at one radial end. One end of the mounting plate 332 is close to the center of the carrier plate 331, and it is connected to the carrier plate 331 by two vertical rods on both sides; the two sides in the middle position are connected to the carrier plate 331 by another two vertical rods, and springs are provided between the tops of the vertical rods and the upper surface of the carrier plate 331 to push the right end of the mounting plate 332 upward; the right end of the mounting plate 332 further extends below the cover plate 3.

[0037] On the upper surface of the mounting plate 332, a slide rail 333 is provided along the radius of the carrier plate 331 and a slider 334 that slides along the slide rail 333. A handle is provided at the top of the slider 334, and an opening is provided on the carrier plate 331 within the running track range of the handle for convenient gripping.

[0038] The slider 334 is provided with a wedge-shaped guiding end 335 on the side facing the outside of the carrier plate 331, and its tip is used to insert between the mounting plate 332 and the cover plate 3. A ball is provided on the top surface of the guiding end 335, which abuts against the cover plate 3 when inserted between the mounting plate 332 and the cover plate 3.

[0039] The thickness of the guiding end 335 is slightly greater than the gap between the mounting plate 332 and the cover plate 3 in the horizontal state. That is, when the guiding end 335 is inserted between the mounting plate 332 and the cover plate 3, the mounting plate 332 will be squeezed, driving the vertical rod at the middle position of the mounting plate 332 to move downward, and at the same time causing a small amount of deformation of the vertical rod near the center, making the right end of the mounting plate 332 move slightly downward.

[0040] A cutter 336 is provided at the rightmost end of the mounting plate 332, and a temperature control unit 337 is provided on the lower surface of the mounting plate 332 near the cutter 336. The lower end of the cutter 336 is inclined outward, and the inclination angle is the same as that of the inclined surface part of the working plate 22. The control circuit of the temperature control unit 337 is connected to the operation panel of the machine tool 1 to keep the cutter 336 at a specific temperature during operation.

[0041] After the cover plate 3 is closed, the cutter 336 has not yet contacted the adhesive film. By holding the handle and pushing the slider 334 to move, the guiding end 335 is inserted between the mounting plate 332 and the cover plate 3, so that the cutter 336 contacts the adhesive film. Then hold the handle and push the carrier plate 331 to rotate, cutting one or more circles around the edge of the wafer to cut the adhesive film. After completion, retract the slider 334.

[0042] On the lower surface of the carrier plate 331, a mounting bracket 338 is provided at the other radial end. One end of the mounting bracket 338 is close to the center of the carrier plate 331 and is connected to the carrier plate 331 through a vertical rod; the middle position is connected to the carrier plate 331 through another vertical rod, and a spring is provided between the lower end of the vertical rod and the lower surface of the carrier plate 331 to push the left end of the mounting bracket 338 downward. The left end of the mounting bracket 338 is bent downward, and a roller 339 is provided at the end. When the carrier plate 331 rotates, the movement track of the roller 339 coincides with that of the cutting tool 336 to press the cutting position.

[0043] Please refer to Figure 5 , which is a schematic structural diagram of the film pasting method provided by the present invention. What is shown in the figure is a schematic diagram of the position of a centering mechanism 24.

[0044] The film pasting method includes: Step 1: Place the wafer 8 on the working plate 22.

[0045] Step 2: Control the lifting mechanism to drive all the centering mechanisms 24 to rise. During the rising process, the inclined surface inside the centering mechanism 24 naturally pushes the wafer 8 to the center of the working plate 22.

[0046] The state at this time is as shown in Figure 5 -a.

[0047] Step 3: Control the negative pressure fixing mechanism of the working plate 22 to fix the wafer 8. At the same time, control the lifting mechanism to drive all the centering mechanisms 24 to descend.

[0048] The state at this time is as shown in Figure 5 -b.

[0049] Step 4: Pull out the adhesive film 7 from the film supply assembly 5 and paste the leading end of the adhesive film 7 on the front positioning strip 21. At this time, the adhesive film 7 is suspended above the wafer 8.

[0050] Step 5: Control the action mechanism to drive the roller mechanism to move.

[0051] The roller mechanism first moves forward to above the rear positioning strip 23 and descends to press the adhesive film 7 against the rear positioning strip 23, so that the adhesive film 7 is pasted and fixed to the rear positioning strip 23.

[0052] Then the roller mechanism rises, moves forward to the front of the rear positioning strip 23, descends to press the adhesive film 7 against the top surface of the machine table 1, and then the roller mechanism continues to move forward to a position close to the front positioning strip 21. During the movement, the rollers in the roller mechanism simultaneously press the adhesive film 7 against the machine table 1 and the wafer 8, so that the adhesive film 7 is pasted and fixed to both the machine table 1 and the wafer 8.

[0053] Finally, the roller mechanism rises and moves backward to the initial position.

[0054] The state at this time is as shown in Figure 5 -c.

[0055] Step 6: Cover the lower cover plate 3. At this time, the cutting knife 336 has not yet contacted the adhesive film.

[0056] First, operate the sliding head 334 to move so that the guiding end 335 is inserted between the mounting plate 332 and the cover plate 3, making the cutting knife 336 contact the adhesive film. Then hold the handle and push the carrier plate 331 to rotate, cutting in a circle or multiple circles to cut the adhesive film along the edge of the wafer.

[0057] The state at this time is as shown in Figure 5 -d.

[0058] After the operation is completed, retract the sliding head 334, and the cutting knife 336 returns to the initial height under the action of the spring.

[0059] Step 7: Operate the straight cutting knife 32 to cut the adhesive film 7 along the rear positioning strip 23.

[0060] Step 8: Open the cover plate 3 and remove the excess adhesive film.

[0061] Step 9: Control the negative pressure fixing mechanism of the working disk 22 to release the wafer 8, remove the wafer 8 and transfer it to the next process.

[0062] The above are only the embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification of the present invention, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A semi-automatic film laminating machine capable of laminating films on the front and back sides, comprising a machine table, a film laminating assembly, a cover plate, a film pressing assembly, and a film supply assembly sequentially arranged on the machine table, wherein a circular cutting knife and a straight cutting knife are provided in the cover plate, and the characteristics are as follows: The film laminating assembly includes a working plate, a centering mechanism, and a lifting mechanism. The top edge of the working plate is beveled, and there is a circular gap between it and the machine table. A plurality of centering mechanisms are arranged around the working plate. The top inner side of the centering mechanism is beveled. The inner side surface of the centering mechanism is embedded in the working plate, and the embedding depth exceeds the beveled part of the working plate. The outer side surface is embedded in the machine table, and the embedding depth exceeds the gap between the working plate and the machine table. The lifting mechanism is arranged in the machine table and is connected to all the centering mechanisms; The cutting ring knife includes a bearing plate, a cutting knife mechanism, and a roller mechanism. The cover plate is provided with a circular opening. The bearing plate is arranged on the top surface of the cover plate and is movably connected to the cover plate through a plain bearing arranged along the opening. The bearing plate is concentric with the circular opening of the cover plate, and the cutting knife mechanism and the roller mechanism are respectively arranged at both radial ends of the lower surface; The cutting knife mechanism includes a mounting plate, a slide rail, a sliding head, and a cutting knife. The mounting plate is arranged along the radial direction of the bearing plate. One end close to the center of the circle is connected to the bearing plate through a vertical rod, the middle position is connected to the bearing plate through a spring vertical rod, and a cutting knife is arranged at the outer end. The lower end of the cutting knife inclines outward, and the inclination angle is the same as the beveled part of the working plate. The mounting plate is provided with the slide rail along the side facing the bearing plate and is connected to the sliding head. The slide rail extends below the cover plate. The outer side of the sliding head is provided with a guiding end, and the guiding end can move along the slide rail between the mounting plate and the cover plate, causing the cutting knife to move down a fixed distance. The bearing plate is provided with a notch along the movement track of the sliding head for the sliding head to protrude upward to the top surface of the bearing plate.

2. The semi-automatic film laminating machine capable of laminating front and back films according to claim 1, characterized in that: An ion blower is arranged on the side surface of the machine table. The control circuit of the ion blower is connected to the machine table, and the air exhaust direction of the ion blower points to the working plate.

3. The semi-automatic film laminating machine capable of laminating front and back films according to claim 1, wherein: The film pressing assembly is an automatic film pressing assembly, including an action mechanism arranged in the machine table and a roller mechanism located above the machine table. The machine table is provided with through grooves along both sides of the film laminating assembly, and both ends of the roller mechanism are connected to the action mechanism in the through grooves.

4. The semi-automatic film laminating machine capable of laminating the front and back films according to any one of claims 1 to 3, characterized in that: The top inner side of the centering mechanism is an arc-shaped bevel, the lower part of the inner side surface is an arc-shaped flat wall, and the inner side surface is a silica gel soft block. The vertical projections of the arc-shaped flat walls at the lower parts of the inner side surfaces of all the centering mechanisms are aligned with the same circle, and the center of the circle is concentric with the working plate.

5. The semi-automatic film laminating machine capable of laminating front and back films according to claim 4, characterized in that: When the centering mechanism reaches the highest position, the beveled part of its top is higher than the working plate; when it reaches the lowest position, its top surface is lower than the beveled part of the edge of the working plate.

6. The semi-automatic film laminating machine capable of laminating front and back films according to any one of claims 1 to 3, characterized in that: The cutting knife mechanism further includes a temperature control unit. The temperature control unit is arranged at a position close to the cutting knife on the side of the mounting plate facing the working plate, and its control circuit is connected to the machine table.

7. The semi-automatic film laminating machine capable of laminating front and back films according to any one of claims 1 to 3, characterized in that: The roller mechanism includes a mounting frame and a roller. One end of the mounting frame close to the center of the circle is connected to the bearing plate through a vertical rod, the middle position is connected to the bearing plate through a spring vertical rod, and a roller is arranged at the outer end. The roller coincides with the movement track of the cutting knife.

8. A film pasting method for a semi-automatic film pasting machine capable of pasting front and back films according to any one of claims 1 to 3, characterized in that, It includes the following steps: Step 1: Place the wafer on the working plate; Step 2: Control the centering mechanism to rise and align the wafer with the center of the worktable; Step 3: After fixing the wafer, control the centering mechanism to lower; Step 4: Pull out the adhesive film from the film supply assembly and cover it on the wafer; Step 5: Control the film pressing assembly to press the adhesive film against the wafer; Step 6: Close the lower cover plate. At this time, the cutting knife does not contact the adhesive film. Operate the sliding head to move outwards and embed it between the mounting plate and the cover plate, so that the cutting knife contacts the adhesive film. Continue to operate the sliding head to move circumferentially for one or more turns to cut the adhesive film along the wafer; Step 7: Operate the straight cutting knife to reciprocate to cut the adhesive film as a whole; Step 8: Open the cover plate and remove the excess adhesive film; Step 9: Loosen the wafer, remove it and transfer it to the next process.

Images