Semiconductor avalanche energy testing device and testing method

Abstract

The invention relates to the technical field of semiconductor testing, and particularly discloses a semiconductor avalanche performance testing device and a testing method.The semiconductor avalanche performance testing device comprises a testing box, a testing mechanism is arranged in the testing box, the testing mechanism is used for conducting avalanche performance testing on a diode, and the testing mechanism comprises a testing mainboard which is fixedly installed in the testing box and used for testing the avalanche performance of the diode; the test mainboard is integrated with a test circuit system, and a power supply voltage is arranged below the test mainboard; and the blanking assembly is installed in the test box and located at the upper part of the test box, and the blanking assembly is used for sequentially arranging and conveying a plurality of stacked diodes. A plurality of stacked diodes can be processed in a centralized manner, a plurality of disorderly arranged diodes can be arranged in a row, then the diodes are tested at the same time, the arrangement function is integrated, each diode can be automatically arranged, and compared with single testing in the prior art, the testing efficiency is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor testing, and in particular to a semiconductor avalanche energy testing device and a testing method. Background Art

[0002] Semiconductor avalanche energy testing is a type of ultimate ability testing for power semiconductor devices, such as power field effect transistors (MOSFETs), etc. The main purpose of this test is to evaluate the maximum energy that a device can withstand in the avalanche breakdown state, so as to ensure that the device can withstand high voltages and surge currents in actual applications and avoid damage due to overload; When the prior art conducts a breakdown test on a diode, usually a single device is installed on a test bench. For example, in the patent with the publication number CN106405362A and the name "An Avalanche Diode Low-Frequency Parameter Testing Device", the avalanche diode is fixed in a card slot, and upper and lower test probes are respectively used to form a cooperation with the two poles of the avalanche diode. Four test cables form the Kelvin connection required for testing the low capacitance value of the avalanche diode, and each test cable is connected with a BNC connector. The BNC connector can be conveniently connected to various test instruments to test the low-frequency electrical parameters of the avalanche diode; Although the above prior art can test diodes, it can only test a single part individually. When multiple parts are tested simultaneously, multiple devices are required, and multiple diodes need to be installed on the test stations, resulting in low test efficiency. Summary of the Invention

[0003] The purpose of this part is to outline some aspects of the embodiments of the present invention and briefly introduce some preferred embodiments. Simplifications or omissions may be made in this part, as well as in the abstract and title of the present application, to avoid obscuring the purpose of this part, the abstract, and the title, but such simplifications or omissions shall not be used to limit the scope of the present invention.

[0004] The present invention provides a semiconductor avalanche energy testing device and a testing method, which can solve the problem of low test efficiency in the prior art. The specific solutions are as follows: On the one hand, the present invention provides a semiconductor avalanche energy testing device, including a test box. A test mechanism is arranged inside the test box, and the test mechanism is used to test the avalanche energy of diodes. The test mechanism includes: A test main board, fixedly installed inside the test box, integrated with a test circuit system, and a power supply voltage is arranged below the test main board.

[0005] A blanking component, installed inside the test box and located at the upper part of the test box. The blanking component is used to sequentially arrange and convey a plurality of stacked diodes; A commutation component, installed inside the test box and located at the conveying end of the blanking component, is used to make the pin directions of each diode face upward; An arrangement component, installed inside the test box and located on one side at the lower end of the commutation component, is used to arrange several diodes in a row; A testing component, installed inside the test box and located above the arrangement component, is used to conduct an overall test on a row of diodes; A discharging component is used to discharge the tested diodes from the test box.

[0006] Preferably, the discharging component includes: A third conveyor belt, arranged at one end of the arrangement component; There are two third driving rollers, respectively arranged at both ends of the third conveyor belt, and a driving device is installed at one end of one of the third driving rollers; A base, installed on the inner wall of the test box, and both ends of the two third driving rollers are rotatably connected to the top of the base.

[0007] Preferably, the blanking component includes: A channel, the width of which matches the width of the diode; A disc, fixedly connected to one end of the channel, fixedly connected to the inner wall of the test box, and there is an arc transition at the connection between the disc and the channel, and the disc and the channel have an inclined angle; A cover plate, fixedly connected to a part of the top of the disc, and the height of the gap formed between the bottom of the cover plate and the bottom of the inner wall of the disc is greater than the thickness of a single diode and less than the sum of the thicknesses of two diodes.

[0008] Preferably, the blanking component further includes: A disturbing rod, rotatably installed inside the disc, and through the rotation of the disturbing rod, several diodes inside the disc can enter the channel; A first motor, fixedly installed on the top inner wall of the test box, and the bottom output shaft of the first motor is fixedly connected to the top end of the disturbing rod; There are two first driving rollers, and the two first driving rollers are rotatably installed on the top inner wall of the test box through a mounting frame; A first conveyor belt, both ends of which are respectively wound around the two first driving rollers, and with the rotation of the first driving rollers, the first conveyor belt can be driven to move, and the first conveyor belt is installed inside the channel.

[0009] Preferably, the commutation component includes: A support block, the bottom of the support block is fixedly connected to the inner wall of the test box; A vertical groove, the vertical groove is opened in the middle of the support block, and the width of the vertical groove matches the thickness of a single diode; A slope, arranged inside the vertical groove, which can make the diode slide to the side close to the arranging component below the vertical groove.

[0010] Preferably, the commutation component further includes: An arc-shaped plate, the arc-shaped plate is fixedly connected to the top of the support block, and a through groove is opened on one side of the arc-shaped plate, and the through groove can make the pins of the diode abut against the arc-shaped plate; Wherein, when the pins of the diode face the arc-shaped plate, when the diode is conveyed to the upper part of the support block by the first conveyor belt, the pins can move towards the arc-shaped plate. As the first conveyor belt moves, the pins of the diode slide above the arc-shaped plate, and finally the diode is flipped.

[0011] Preferably, the commutation component further includes: A narrow groove, opened in the middle of the slope; A first step and a second step, both the first step and the second step are fixedly connected inside the narrow groove; Wherein, when the pins of the diode face downwards, the pins can be inserted into the narrow groove, and then one of the pins abuts against the first step. Then, due to the center of gravity of the diode, the diode starts to rotate around one of the pins. When it rotates to the horizontal state, the other pin abuts against the second step. Along with the center of gravity of the diode, the diode continues to rotate so that the pins face upwards.

[0012] Preferably, the arranging component includes: A mounting seat, the mounting seat is fixedly installed on the inner wall of the test box; Two second transmission rollers, two of the second transmission rollers are rotatably installed at both ends of the mounting seat; A second conveyor belt, both ends of the second conveyor belt are respectively wound around the outer walls of the two second transmission rollers; A telescopic rod, fixedly installed on the inner wall of the test box, one end of the telescopic rod is a telescopic end, and a spherical ball is arranged in the middle of the telescopic end; A stop block, arranged at one end of the second conveyor belt; A second motor, fixedly installed on the top of the mounting seat, and the output shaft of the second motor is connected to one end of the stop block.

[0013] Preferably, the test component includes: A sliding seat, fixedly connected to the mounting seat, and a sliding groove is opened on its outer wall; Test bench, inside which multiple groups of test contacts are integrated, capable of corresponding to the pins on a row of diodes and connected to the test main board through a cable, and the test bench is slidably connected to the sliding groove; First rack, fixedly connected to the top of the sliding seat, and the first rack is slidably connected to one end of the sliding seat; Second rack, slidably mounted on the top of the sliding seat, and the second rack is arranged crosswise with the first rack; Gear, arranged between the first rack and the second rack, and meshed with the first rack and the second rack respectively.

[0014] On the other hand, the present invention provides a semiconductor avalanche energy test method, including the following steps: S1. Place the diodes to be tested into the blanking component, and sequentially convey the diodes to the commutation component through the blanking component; S2. The commutation component turns the pins of each diode upward to play a commutation role; S3. The diodes completed in commutation in S2 fall onto the arranging component, and the arranging component arranges each diode; S4. The test component simultaneously tests the diodes arranged in a row in S3; S5. The tested diodes fall onto the discharging component, and then are discharged from the test box to complete the avalanche energy test of the diodes.

[0015] Compared with the prior art, the present invention can at least achieve one of the following beneficial effects: 1. Through the test component, the present invention can centrally process several stacked diodes, arrange several disorderly arranged diodes in a row, and then simultaneously test them, integrating the arranging function, enabling each diode to be automatically arranged. Compared with the single test in the prior art, the test efficiency is significantly improved.

[0016] 2. Through the blanking component, the present invention can rearrange several diodes, enabling several diodes to be arranged in an orderly manner in the forward or reverse direction, thus facilitating the next centralized test work and avoiding manual sorting.

[0017] 3. Through the commutation component, the present invention can unify the directions of the diodes, make the pins on each diode face upward, and then through the arranging component, several diodes can be arranged in a row, facilitating the test work.

[0018] 4. The arranging component and the test component of the present invention can work in coordination. After the arranging component is completed, the test component can synchronously carry out the test work, thereby further improving the test efficiency.

[0019] Other features and advantages of the present invention will be set forth in the following description, and in part will be obvious from the description, or may be learned by practice of the present invention. The objectives and other advantages of the present invention may be realized and attained by the structure particularly pointed out in the written description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings. Among them: Figure 1 is the overall three-dimensional view of the present invention; Figure 2 is the first perspective schematic view of the test mechanism of the present invention; Figure 3 is the second perspective schematic view of the test mechanism of the present invention; Figure 4 is the third perspective schematic view of the test mechanism of the present invention; Figure 5 is the fourth perspective schematic view of the test mechanism of the present invention; Figure 6 is the three-dimensional view of the discharging assembly of the present invention; Figure 7 is the three-dimensional view of the blanking assembly of the present invention; Figure 8 is the three-dimensional view of the disc and the channel of the present invention; Figure 9 is the three-dimensional view of the commutation assembly of the present invention; Figure 10 is the principle schematic view of the commutation assembly of the present invention; Figure 11 is the sectional view of the commutation assembly of the present invention; Figure 12 is the three-dimensional view of the arranging assembly of the present invention; Figure 13 is the partial three-dimensional view of the arranging assembly of the present invention; Figure 14 is the state change diagram of the stopper of the present invention; Figure 15 is the default state diagram of the stopper of the present invention; Figure 16 is the three-dimensional view of the test assembly of the present invention.

[0021] Among them, the reference numerals are as follows: 100, a semiconductor avalanche energy test device; 200, a test mechanism; 201. Test main board; 202. Blanking component; 2021. Channel; 2022. Disc; 2023. Cover plate; 2024. Disturbing rod; 2025. First motor; 2026. First driving roller; 2027. First conveyor belt; 203. Reversing component; 2031. Support block; 2032. Vertical groove; 2033. Arc plate; 2034. Ramp; 2035. Narrow groove; 2036. First step; 2037. Second step; 204. Arranging component; 2041. Mounting seat; 2042. Second driving roller; 2043. Second conveyor belt; 2044. Telescopic rod; 2045. Telescopic end; 2046. Sphere; 2047. Second motor; 2048. Stop block; 205. Testing component; 2051. Sliding seat; 2052. Test bench; 2053. Chute; 2054. Cable; 2055. First rack; 2056. Second rack; 2057. Gear; 2058. Connecting rod; 206. Third conveyor belt; 207. Third driving roller; 208. Base; 300. Diode. Detailed implementation manner

[0022] Next, the preferred embodiments of the present invention will be specifically described in conjunction with the accompanying drawings, where the accompanying drawings form a part of the present invention and are used together with the embodiments of the present invention to explain the principles of the present invention.

[0023] As Figure 1 shown, this embodiment provides a semiconductor avalanche energy testing device 100 that can perform avalanche energy testing on the diode 300. A semiconductor avalanche energy testing device 100 includes: A test box 101 is installed on the ground. An audible and visual alarm 102 is provided at the top of the test box 101. An observation port is provided at the front end of the test box 101, and a transparent plate 103 is installed in the observation port. A control button 104 is provided on one side of the front of the test box 101. There are several control buttons 104. A display 105 is provided on one side of the test box 101. The display 105 is fixed to one side of the test box 101 through an extension plate. An industrial computer is integrated inside the display 105.

[0024] As Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 shown, a semiconductor avalanche energy testing device 100 further includes a testing mechanism 200. The testing mechanism 200 is installed inside the test box 101 and is used to perform avalanche energy testing on the diode 300. The testing mechanism 200 includes: The test main board 201 is fixedly installed inside the test box 101 and integrated with a test circuit system. A power supply voltage is provided below the test main board 201.

[0025] The blanking component 202 is installed inside the test box 101 and located at the upper part of the test box 101. The blanking component 202 is used to convey a number of stacked diodes 300 in sequence. The commutation component 203 is installed inside the test box 101 and located at the conveying end of the blanking component 202. The commutation component 203 is used to make the pin directions of each diode 300 face upward, so as to facilitate subsequent avalanche energy tests on each diode 300. The arrangement component 204 is installed inside the test box 101 and located on one side below the commutation component 203. The arrangement component 204 is used to arrange a number of diodes 300 in a row. The test component 205 is installed inside the test box 101 and located above the arrangement component 204. The test component 205 is used to conduct an overall test on a row of diodes 300. It further includes Figure 6 The discharging component as shown. The discharging component is installed at the conveying end of the arrangement component 204. After the diodes 300 are tested by the test component 205, a number of diodes 300 fall onto the discharging component and then are discharged from the test box 101.

[0026] As Figure 7 shown, the blanking component 202 includes: The channel 2021, and the width of the channel 2021 matches the width of the diode 300. The disc 2022 is fixedly connected to one end of the channel 2021. The disc 2022 is fixedly connected to the inner wall of the test box 101. An arc transition is provided at the connection between the disc 2022 and the channel 2021. The disc 2022 and the channel 2021 have an inclined angle, which can make the diode 300 slide from the disc 2022 into the channel 2021. The cover plate 2023 is fixedly connected to a part of the top of the disc 2022. The height of the gap formed between the bottom of the cover plate 2023 and the bottom of the inner wall of the disc 2022 is greater than the thickness of a single diode 300 and less than the sum of the thicknesses of two diodes 300. The disturbing rod 2024 is rotatably installed inside the disc 2022. Through the rotation of the disturbing rod 2024, a number of diodes 300 in the disc 2022 can be made to enter the channel 2021. The first motor 2025 is fixedly installed on the top inner wall of the test box 101. The bottom output shaft of the first motor 2025 is fixedly connected to the top end of the disturbing rod 2024. The first motor 2025 can drive the disturbing rod 2024 to rotate. The first drive roller 2026, there are two, such as Figure 4 shown, the two first drive rollers 2026 are rotatably mounted on the top inner wall of the test box 101 through a mounting frame. Among them, the mounting frame is fixedly connected to the top inner wall of the test box 101, and both ends of the first drive roller 2026 are rotatably connected to both ends of the mounting frame. A driving device is installed on one of the first drive rollers 2026; The first conveyor belt 2027, both ends of the first conveyor belt 2027 are respectively wound around the two first drive rollers 2026. As the first drive roller 2026 rotates, it can drive the first conveyor belt 2027 to move. The first conveyor belt 2027 is installed inside the channel 2021; It should be noted that Figure 7 the ratio of the blanking component 202 in Figure 8 is not the ratio of the actual application scenario. In actual application, the ratio between components is more inclined to Figure 8 shown, so that more diodes 300 can be accommodated inside the disc 2022, and the efficiency of the diodes 300 entering the channel 2021 will be higher.

[0027] As a possible embodiment, as Figure 9 、 Figure 10 、 Figure 11 shown, the commutation component 203 includes: The support block 2031, the bottom of the support block 2031 is fixedly connected to the inner wall of the test box 101; The vertical groove 2032, the vertical groove 2032 is opened in the middle of the support block 2031, and the width of the vertical groove 2032 matches the thickness of a single diode 300; As one of the methods for commuting the diode 300, it includes: The arc plate 2033, the arc plate 2033 is fixedly connected to the top of the support block 2031, and a through groove is opened on one side of the arc plate 2033, and this through groove can make the pin of the diode 300 abut against the arc plate 2033; The ramp 2034, which is arranged inside the vertical groove 2032, can allow the diode 300 to slide to the lower side of the vertical groove 2032 close to the alignment component 204; In the above solution, when the pins of the diode 300 face the arc plate 2033, when the diode 300 is conveyed by the first conveyor belt 2027 to above the support block 2031, the pins can move towards the arc plate 2033. As the first conveyor belt 2027 moves, the pins of the diode 300 slide above the arc plate 2033, finally causing the diode 300 to flip and then fall into the vertical groove 2032. When the pins of the diode 300 are on the side away from the arc plate 2033, after the first conveyor belt 2027 conveys the diode 300 above the vertical groove 2032, the center of gravity of the diode 300 is far from the first conveyor belt 2027, so the diode 300 will directly fall into the vertical groove 2032. In this way, through the above method, the pins of each diode 300 can be in an upward state; As another method for circularizing the diode 300, it includes: A narrow groove 2035 is opened in the middle of the slope 2034; The first step 2036 and the second step 2037, as Figure 11 shown, both the first step 2036 and the second step 2037 are fixedly connected inside the narrow groove 2035; In the above solution, when the pins of the diode 300 face downwards, the pins can be inserted into the narrow groove 2035, and then one of the pins abuts against the first step 2036. Then, due to the center of gravity of the diode 300, the diode 300 starts to rotate around one of the pins. When it rotates to the horizontal state, the other pin abuts against the second step 2037. Along with the center of gravity of the diode 300, the diode 300 continues to rotate to make the pins face upwards. When the pins of the diode 300 face upwards, the diode 300 can slide along the slope 2034 all the way to the bottom of the slope 2034. In this way, through the above method, the pins of each diode 300 can also be in an upward state.

[0028] As a possible embodiment, as Figure 12 、 Figure 13 、 Figure 14 、 Figure 15 shown, the arranging assembly 204 includes: A mounting seat 2041, and the mounting seat 2041 is fixedly installed on the inner wall of the test box 101; There are two second transmission rollers 2042, and the two second transmission rollers 2042 are rotatably installed at both ends of the mounting seat 2041; The second conveyor belt 2043, the two ends of the second conveyor belt 2043 are respectively wound around the outer walls of the two second transmission rollers 2042, and can move synchronously with the second transmission rollers 2042. The mounting seat 2041, the second transmission rollers 2042 and the second conveyor belt 2043 have an inclined angle, so that when the diode 300 falls from the vertical groove 2032, it can fall on the second conveyor belt 2043, and through the inclined shape, the gravity of the diode 300 itself can be used to achieve automatic alignment; The telescopic rod 2044 is fixedly mounted on the inner wall of the test box 101. One end of the telescopic rod 2044 is a telescopic end 2045. A ball 2046 is disposed in the middle of the telescopic end 2045. An arc transition is disposed between the ball 2046 and the telescopic end 2045. A stopper 2048 is provided at one end of the second conveyor belt 2043; The second motor 2047 is fixedly mounted on the top of the mounting base 2041. The output shaft of the second motor 2047 is connected to one end of the stopper 2048. The stopper 2048 is driven to rotate by the second motor 2047, so that the stopper 2048 can leave one end of the second conveyor belt 2043. In the above scheme, after the diode 300 falls on the second conveyor belt 2043, as the second conveyor belt 2043 moves, all the diodes 300 can be concentrated at one end of the second conveyor belt 2043 and blocked by the block 2048, and the telescopic end 2045 is extended to support one end of the diode 300. While supporting, the telescopic end 2045 can block the diode 300 under the vertical groove 2032 to prevent leakage. The function of the ball 2046 is to allow the diode 300 in the vertical groove 2032 to shrink into the vertical groove 2032 when the telescopic end 2045 is extended (the specific reason will be mentioned below).

[0029] As a possible embodiment, Figure 16 As shown, the test component 205 includes: The sliding seat 2051 is fixedly connected to the mounting seat 2041, and a sliding groove 2053 is formed on its outer wall; The test bench 2052 has multiple test contacts integrated therein, which can correspond to the pins on a row of diodes 300 and are connected to the test main board 201 via a flat cable 2054. The test bench 2052 is slidably connected to the slide slot 2053; The first rack 2055 is fixedly connected to the top of the sliding seat 2051, and the first rack 2055 is slidably connected to one end of the sliding seat 2051; The second rack 2056 is slidably mounted on the top of the sliding seat 2051, and the second rack 2056 is cross-arranged with the first rack 2055; The gear 2057 is disposed between the first rack 2055 and the second rack 2056 and can mesh with the first rack 2055 and the second rack 2056 respectively. The second rack 2056 is fixedly connected to the telescopic end 2045 through the connecting rod 2058. To prevent the connecting rod 2058 and the telescopic end 2045 from being blocked by the diode 300 in the vertical groove 2032 during telescoping, the diode 300 can be pushed into the vertical groove 2032 by the spherical ball 2046, so that the telescopic end 2045 and the connecting rod 2058 can pass through smoothly. In the above solution, when the number of diodes 300 on the second conveyor belt 2043 reaches a predetermined number, the telescopic end 2045 starts to extend and presses against the outermost diode 300. In this state, the second rack 2056 just drives the gear 2057 to rotate, so that the first rack 2055 and the test bench 2052 descend, and the contacts on the test bench 2052 contact the pins on the diode 300, thus starting the test, and the test data can be reflected on the display 105 for the convenience of the detection personnel to observe.

[0030] As a possible embodiment, as Figure 6 shown, the discharging assembly includes: The third conveyor belt 206 is disposed below the conveying end of the second conveyor belt 2043; There are two third driving rollers 207, which are respectively disposed at both ends of the third conveyor belt 206, and a driving device is installed at one end of one of the third driving rollers 207; The base 208 is installed on the inner wall of the test box 101, and both ends of the two third driving rollers 207 are rotatably connected to the top of the base 208.

[0031] Embodiment 2: The technical solution of this embodiment is different from that of Embodiment 1 in that this embodiment provides a semiconductor avalanche energy test device, including the following steps: S1. Put the diode 300 to be tested into the blanking assembly 202, and the blanking assembly 202 sequentially conveys the diode 300 onto the commutation assembly 203; S2. The commutation assembly 203 turns the pins of each diode 300 upward to play a commutation role; S3. The diodes 300 completed in commutation in S2 fall onto the arranging assembly 204, and the arranging assembly 204 arranges each diode 300; S4. The test assembly 205 simultaneously tests the diodes 300 arranged in a row in S3; S5. The tested diodes fall onto the discharging assembly, and then are discharged from the test box 101 to complete the avalanche energy test of the diodes 300.

[0032] In the description of this specification, the descriptions referring to terms such as "one embodiment", "example", "specific example", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0033] In the description of the embodiments of this application, the terms "first", "second", "third", "fourth", etc. (if any) in the specification, claims, and the above-mentioned drawings are used to distinguish similar objects and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments of the embodiments of this application described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0034] Parallel: The parallel defined in this application is not limited to absolute parallelism. This definition of parallel can be understood as substantially parallel, allowing for situations where it is not absolutely parallel due to factors such as assembly tolerances, design tolerances, and the influence of structural flatness. A small angular range of errors is allowed. For example, within an assembly error range of less than 10 degrees, it can all be understood as a parallel relationship.

[0035] Perpendicular: The perpendicular defined in this application is not limited to an absolutely perpendicular intersection (an included angle of 90 degrees). A relationship where it is not an absolutely perpendicular intersection due to factors such as assembly tolerances, design tolerances, and the influence of structural flatness is allowed. A small angular range of errors is allowed. For example, within an assembly error range of 80 degrees to 100 degrees, it can all be understood as a perpendicular relationship.

[0036] In the embodiments of this application, the devices or elements indicated by or implied do not have to have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation on the embodiments of this application. In the description of the embodiments of this application, the meaning of "a plurality" is two or more, unless otherwise precisely and specifically defined.

[0037] As used herein, the term "plurality" means two or more. As used herein, the term "and / or" is merely a description of the relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A alone, both A and B present, or B alone.

[0038] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and utilize the present invention well. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A semiconductor avalanche energy test device, comprising a test box (101), wherein a test mechanism (200) is arranged inside the test box (101), and the test mechanism (200) is used for performing avalanche energy test on a diode (300), and is characterized in that: The test mechanism (200) includes: A test main board (201), fixedly installed inside the test box (101), integrated with a test circuit system, and a power supply voltage is provided below the test main board (201); A blanking component (202), installed inside the test box (101) and located at the upper part of the test box (101), and the blanking component (202) is used to convey a plurality of stacked diodes (300) in sequence; A commutation component (203), installed inside the test box (101) and located at the conveying end of the blanking component (202), and the commutation component (203) is used to make the pin directions of each diode (300) face upward; An arrangement component (204), installed inside the test box (101) and located on one side below the commutation component (203), and the arrangement component (204) is used to arrange a plurality of diodes (300) in a row; A test component (205), installed inside the test box (101) and located above the arrangement component (204), and the test component (205) is used to perform an overall test on a row of diodes (300); A discharging component, used to discharge the tested diodes (300) from the test box.

2. The semiconductor avalanche energy testing device according to claim 1, wherein: The discharging component includes: A third conveyor belt (206), arranged at one end of the arrangement component (204); Two third driving rollers (207), respectively arranged at both ends of the third conveyor belt (206), and a driving device is installed at one end of one of the third driving rollers (207); A base (208), installed on the inner wall of the test box (101), and both ends of the two third driving rollers (207) are rotatably connected to the top of the base (208).

3. A semiconductor avalanche energy test device according to claim 1, characterized in that: The blanking component (202) includes: A channel (2021), the width of the channel (2021) matching the width of the diode (300); A disc (2022), fixedly connected to one end of the channel (2021), fixedly connected to the inner wall of the test box (101), with an arc transition provided at the connection between the disc (2022) and the channel (2021), and the disc (2022) and the channel (2021) having an inclination angle; A cover plate (2023), fixedly connected to a part of the top of the disc (2022), and the height of the gap formed between the bottom of the cover plate (2023) and the bottom inner wall of the disc (2022) is greater than the thickness of a single diode (300) and less than the sum of the thicknesses of two diodes (300).

4. A semiconductor avalanche energy test device according to claim 3, characterized in that: The blanking component (202) further includes: A disturbing rod (2024), rotatably installed inside the disc (2022), and through the rotation of the disturbing rod (2024), a plurality of diodes (300) inside the disc (2022) can enter the channel (2021); The first motor (2025) is fixedly installed at the top of the inner wall of the test box (101), and the bottom output shaft of the first motor (2025) is fixedly connected to the top end of the disturbance rod (2024); There are two first transmission rollers (2026), and the two first transmission rollers (2026) are rotatably installed at the top of the inner wall of the test box (101) through a mounting bracket; The first conveyor belt (2027), both ends of the first conveyor belt (2027) are respectively wound around the two first transmission rollers (2026), and with the rotation of the first transmission rollers (2026), it can drive the first conveyor belt (2027) to move. The first conveyor belt (2027) is installed inside the channel (2021).

5. A semiconductor avalanche energy test device according to claim 1, characterized in that: The commutation assembly (203) includes: The support block (2031), the bottom of the support block (2031) is fixedly connected to the inner wall of the test box (101); The vertical groove (2032) is opened in the middle of the support block (2031), and the width of the vertical groove (2032) matches the thickness of a single diode (300); The ramp (2034) is arranged inside the vertical groove (2032), and it can make the diode (300) slide to the lower side of the vertical groove (2032) close to the arrangement assembly (204).

6. The semiconductor avalanche energy test device according to claim 5, wherein: The commutation assembly (203) further includes: The arc-shaped plate (2033), the arc-shaped plate (2033) is fixedly connected to the top end of the support block (2031), and a through groove is opened on one side of the arc-shaped plate (2033), and this through groove can make the pins of the diode (300) abut against the arc-shaped plate (2033); Among them, when the pins of the diode (300) face the arc-shaped plate (2033), when the diode (300) is transported to the upper side of the support block (2031) by the first conveyor belt (2027), the pins can move towards the arc-shaped plate (2033). With the movement of the first conveyor belt (2027), the pins of the diode (300) slide upwards along the arc-shaped plate (2033), and finally the diode (300) is flipped.

7. The semiconductor avalanche energy test device according to claim 5, characterized in that: The commutation assembly (203) further includes: The narrow groove (2035) is opened in the middle of the ramp (2034); The first step (2036) and the second step (2037), both the first step (2036) and the second step (2037) are fixedly connected inside the narrow groove (2035); Among them, when the pins of the diode (300) face downwards, the pins can be inserted into the narrow groove (2035), and then one of the pins abuts against the first step (2036). Then, due to the center of gravity of the diode (300), the diode (300) starts to rotate around one of the pins. When it rotates to the horizontal state, the other pin abuts against the second step (2037). With the center of gravity of the diode (300), the diode (300) continues to rotate, making the pins face upwards.

8. A semiconductor avalanche energy test device according to claim 1, characterized in that: The arrangement assembly (204) includes: Mounting base (2041), the mounting base (2041) is fixedly installed on the inner wall of the test box (101); Second drive rollers (2042), there are two of them, and the two second drive rollers (2042) are rotatably installed at both ends of the mounting base (2041); Second conveyor belt (2043), both ends of the second conveyor belt (2043) are respectively wound around the outer walls of the two second drive rollers (2042); Expansion rod (2044), fixedly installed on the inner wall of the test box (101), one end of the expansion rod (2044) is a telescopic end (2045), and a spherical ball (2046) is arranged in the middle of the telescopic end (2045); Stop block (2048), arranged at one end of the second conveyor belt (2043); Second motor (2047), fixedly installed on the top of the mounting base (2041), and the output shaft of the second motor (2047) is connected to one end of the stop block (2048).

9. The semiconductor avalanche energy testing device according to claim 8, wherein: The test assembly (205) includes: Sliding seat (2051), fixedly connected to the mounting base (2041), and a chute (2053) is provided on its outer wall; Test bench (2052), multiple groups of test contacts are integrated inside the test bench (2052), which can correspond to the pins on a row of diodes (300), and are connected to the test main board (201) through a wiring harness (2054), and the test bench (2052) is slidably connected to the chute (2053); First rack (2055), fixedly connected to the top of the sliding seat (2051), and the first rack (2055) is slidably connected to one end of the sliding seat (2051); Second rack (2056), slidably installed on the top of the sliding seat (2051), and the second rack (2056) is arranged crosswise with the first rack (2055); Gear (2057), arranged between the first rack (2055) and the second rack (2056), and meshes with the first rack (2055) and the second rack (2056) respectively.

10. A method for testing the avalanche energy of a semiconductor, using a semiconductor avalanche energy testing device according to any one of claims 1-9, characterized in that, It includes the following steps: S1. Place the diode (300) to be tested into the blanking component (202), and the blanking component (202) sequentially conveys the diode (300) onto the commutation component (203); S2. The commutation component (203) turns the pins of each diode (300) upward to play a commutation role; S3. The diodes (300) whose commutation is completed in S2 fall onto the arrangement component (204), and the arrangement component (204) arranges each diode (300); S4. The test component (205) simultaneously tests the diodes (300) arranged in a row in S3; S5. The tested diodes fall onto the discharging component, and then are discharged from the test box (101) to complete the avalanche energy test of the diodes (300).

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