Miniature projector

Abstract

The invention relates to the technical field of projection, in particular to a miniature projector which comprises a shell, a projection module, a heat dissipation block, an air blower and a circuit board, a heat dissipation cavity is formed in the shell, and the heat dissipation cavity is provided with an assembly opening, an air inlet channel and an air outlet channel; the projection module is arranged in the shell and located on the outer side of the heat dissipation cavity. The heat dissipation block is arranged in the shell, the heat dissipation block is fixedly connected with the projection module in a heat conduction mode and connected to the assembly opening of the heat dissipation cavity in a sealing and covering mode, and the heat dissipation block is used for absorbing heat generated when the projection module works; the air blower is arranged in the heat dissipation cavity and is covered by the heat dissipation block; the air blower is used for enabling external air to enter the heat dissipation cavity through the air inlet channel and to be exhausted through the air outlet channel; the circuit board is arranged in the shell and electrically connected with the projection module and the air blower. The miniature projector is novel in structure, convenient to assemble, small in size and good in heat dissipation performance.

Description

Technical Field

[0001] This application relates to the field of projection technology, and particularly to a micro-projector. Background Art

[0002] A micro-projector, also known as a portable projector or mini-projector, miniaturizes, makes portable, and makes more user-friendly and practical the traditionally large projectors, bringing projection technology closer to life and entertainment. It has functions such as business office work, teaching, business trips, personal entertainment, and replacing a TV.

[0003] The characteristics of a micro-projector are its small size and portability. Therefore, its internal structure design is very compact, and the space between parts is very limited. Most existing micro-projectors have problems such as inconvenient assembly and poor heat dissipation performance. Summary of the Invention

[0004] This application provides a micro-projector to solve the technical problems in the prior art that most micro-projectors have inconvenient assembly and poor heat dissipation performance.

[0005] To solve the above technical problems, this application provides a micro-projector, including:

[0006] A housing, inside which there is a heat dissipation cavity having an assembly opening, an air inlet channel, and an air outlet channel;

[0007] A projection module, disposed inside the housing and outside the heat dissipation cavity;

[0008] A heat dissipation block, disposed inside the housing, thermally and fixedly connected to the projection module and sealingly connected to the assembly opening of the heat dissipation cavity, and the heat dissipation block is used to absorb the heat generated when the projection module works;

[0009] A blower, disposed inside the heat dissipation cavity and covered by the heat dissipation block, and the blower is used to allow external air to enter the heat dissipation cavity through the air inlet channel and be discharged through the air outlet channel;

[0010] A circuit board, disposed inside the housing and electrically connected to the projection module and the blower.

[0011] Preferably, the heat dissipation cavity includes a first width portion near the air inlet channel and a second width portion near the air outlet channel, and the width of the first width portion is greater than the width of the second width portion to form a stepped assembly structure for positioning and clamping the blower.

[0012] Preferably, the micro-projector further includes a speaker and a speaker rear cover. An acoustic cavity is further provided in the housing. The speaker is assembled in the acoustic cavity and electrically connected to the circuit board. The speaker rear cover is fixedly connected to the acoustic cavity. The housing is provided with a sound outlet hole corresponding to the speaker.

[0013] Preferably, the housing includes:

[0014] An outer housing, including a frame body and cover plates connected to both ends of the frame body. The frame body is provided with a light-transmitting area corresponding to the projection module;

[0015] An inner housing, including a bottom plate and a first surrounding wall provided on the bottom plate. The area surrounded by the first surrounding wall and the bottom plate forms the heat dissipation cavity;

[0016] The outer housing is a metal housing, and the inner housing is a plastic housing.

[0017] Preferably, the housing includes:

[0018] An outer housing, including a frame body and cover plates connected to both ends of the frame body. The frame body is provided with a light-transmitting area corresponding to the projection module;

[0019] An inner housing, including a bottom plate, a first surrounding wall and a second surrounding wall provided on the bottom plate. The area surrounded by the first surrounding wall and the bottom plate forms the heat dissipation cavity, and the area surrounded by the second surrounding wall and the bottom plate forms the acoustic cavity;

[0020] The outer housing is a metal housing, and the inner housing is a plastic housing.

[0021] Preferably, the outer housing is a metal housing, and the inner housing is a plastic housing.

[0022] Preferably, a plurality of screw posts are provided on the inner circumference of the frame body. The bottom plate is provided with a plurality of fixing holes corresponding to the plurality of screw posts and is respectively fixed to both ends of the screw posts by screws.

[0023] Preferably, concave steps are provided on the inner circumferences of both ends of the frame body for receiving and fitting with the cover plates.

[0024] Preferably, the cover plate and the frame body are fixed by adhesive.

[0025] Preferably, the circuit board is provided with two interfaces of TYPE-C 2.0 and TYPE-C 3.0.

[0026] Preferably, the dimensions of the length, width and height of the micro-projector range from (75.8±5)×(75.8±5)×(18.55±2) millimeters.

[0027] The beneficial effects of the present application are as follows: A heat dissipation cavity is provided inside the housing of the micro-projector provided in the present application. The heat dissipation cavity has an assembly opening, an air inlet channel, and an air outlet channel. The projection module is arranged inside the housing and is located outside the heat dissipation cavity. The heat dissipation block is arranged inside the housing. The heat dissipation block is thermally and fixedly connected to the projection module and is sealingly connected to the assembly opening of the heat dissipation cavity. The heat dissipation block is used to absorb the heat generated when the projection module works. The blower is arranged inside the heat dissipation cavity and is covered by the heat dissipation block. The blower is used to make the external air enter the heat dissipation cavity through the air inlet channel and be discharged through the air outlet channel. The circuit board is arranged inside the housing and is electrically connected to the projection module and the blower. The micro-projector provided in the present application has a novel structure, convenient assembly, small size, and good heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings. Among them:

[0029] Figure 1 is a perspective three-dimensional structure diagram of a micro-projector provided by an embodiment of the present application from one perspective;

[0030] Figure 2 is a perspective three-dimensional structure diagram of the micro-projector provided by an embodiment of the present application from another perspective;

[0031] Figure 3 is Figure 1 a perspective three-dimensional structure diagram of the micro-projector shown in FIG. when the cover plate, circuit board, projection module, and heat dissipation block are hidden;

[0032] Figure 4 is Figure 1 a perspective three-dimensional structure diagram of the micro-projector shown in FIG. when the cover plate and circuit board are hidden;

[0033] Figure 5 is Figure 1 an exploded structure diagram of the micro-projector shown in FIG. from one perspective;

[0034] Figure 6 is Figure 1 an exploded structure diagram of the micro-projector shown in FIG. from another perspective;

[0035] Figure 7 is Figure 6 an enlarged structure diagram of the partial components shown in FIG.

[0036] Description of reference numerals: 110, outer housing; 111, frame; 112, screw post; 113, recessed step; 114, dust-proof net; 115, cover plate; 120, inner housing; 121, bottom plate; 123, first surrounding wall; 124, second surrounding wall; 130, heat dissipation cavity; 130a, first width portion; 130b, second width portion; 131, assembly opening; 132, air inlet passage; 133, air outlet passage; 140, sound cavity; 141, sound outlet hole; 142, volume adjustment button; 210, projection module; 211, light-transmitting area; 220, heat dissipation block; 221, heat dissipation fins; 222, first folding plate; 223, second folding plate; 224, avoidance groove; 225, first screw; 226, positioning hole; 227, auxiliary heat-conducting member; 228, second screw; 229, third screw; 230, blower; 240, circuit board; 241, interface; 250, speaker; 260, speaker back cover. Detailed implementation manners

[0037] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0038] It should be noted that if there are directional indications (such as up, down, left, right, front, back,...) involved in the embodiments of the present application, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0039] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present application.

[0040] As Figures 1 to 7 shown, an embodiment of the present application provides a micro-projector, which includes a housing, a projection module 210, a heat dissipation block 220, a blower 230, and a circuit board 240.

[0041] As Figure 3 shown, a heat dissipation cavity 130 is provided inside the housing. The heat dissipation cavity 130 has an assembly opening 131, an air inlet channel 132, and an air outlet channel 133.

[0042] Combined with Figure 3 and Figure 4 shown, the projection module 210 is disposed inside the housing and on the outer side of the heat dissipation cavity 130. The specific structure of the projection module 210 is not the focus of the invention and will not be elaborated in this application.

[0043] A heat dissipation block 220 is disposed inside the housing. The heat dissipation block 220 is made of a copper plate with good thermal conductivity ， The heat dissipation block 220 is thermally and fixedly connected to the projection module 210 and is hermetically connected at the assembly opening 131 of the heat dissipation cavity 130. The heat dissipation block 220 is used to absorb the heat generated when the projection module 210 works.

[0044] Combined with Figure 7 shown, heat dissipation fins 221 are further provided on the inner surface of the heat dissipation block 220. The heat dissipation fins 221 can be fixedly connected to the heat dissipation block 220 by laser welding. The heat dissipation fins 221 are disposed close to the air outlet channel 133.

[0045] First and second folding plates 222 and 223 integrally extend from the side of the heat dissipation block 220 close to the projection module 210. The first and second folding plates 222 and 223 are thermally connected to the projection module 210. Specifically, the first folding plate 222 is fixed to the side surface of the projection module 210 by a first screw 225. Correspondingly, the heat dissipation fins 221 are provided with corresponding avoidance grooves 224 to facilitate the assembly of the first screw 225. The second folding plate 223 is fixed to the front surface of the projection module 210 by a second screw 228 and a third screw 229. The side surface and the front surface of the projection module 210 are both heat source surfaces. The heat of the projection module 210 is transferred to the heat dissipation block 220 and the heat dissipation fins 221 through the first and second folding plates 222 and 223. An auxiliary heat conducting member 227 can be selectively provided on the outer surface of the heat dissipation block 220. The auxiliary heat conducting member 227 is fixed to the front surface of the projection module 210 by the second screw 228 and the third screw 229. The auxiliary heat conducting member 227 can increase the heat conduction path and improve the heat conduction efficiency. One end of the auxiliary heat conducting member 227 can be welded and fixed to the outer surface of the heat dissipation block 220, and the other end is fixed to the second folding plate 223.

[0046] The heat dissipation block 220 may also be provided with positioning holes 226 to facilitate the anti-fooling assembly of the heat dissipation block 220 and the inner housing 120 quickly. Combined with Figure 5 shown, the inner housing 120 is correspondingly provided with positioning posts 134 matching the positioning holes 226.

[0047] The blower 230 is disposed within the heat dissipation cavity 130 and covered by the heat dissipation block 220. The blower 230 is configured to allow external air to enter the heat dissipation cavity 130 through the air inlet passage 132 and discharge through the air outlet passage 133. The blower 230 is disposed near the air inlet passage 132. Combining Figure 5 as shown, a dust-proof net 114 is further provided on the housing corresponding to the air inlet passage 132.

[0048] The circuit board 240 is disposed within the housing and electrically connected to the projection module 210 and the blower 230.

[0049] As Figure 3 shown, the heat dissipation cavity 130 includes a first width portion 130a near the air inlet passage 132 and a second width portion 130b near the air outlet passage 133. The width of the first width portion 130a is greater than that of the second width portion 130b to form a stepped assembly structure for positioning and clamping the blower 230.

[0050] The micro-projector may further include a speaker 250 and a speaker back cover 260. An acoustic cavity 140 is further provided within the housing. The speaker 250 is assembled within the acoustic cavity 140 and electrically connected to the circuit board 240. The speaker back cover 260 and the acoustic cavity 140 can be fixedly connected by ultrasonic welding. The housing is provided with a sound outlet hole 141 corresponding to the speaker 250. In the embodiment of the present application, the sound outlet hole 141 is located on the upper surface side of the micro-projector. The speaker 250 and the speaker back cover 260 are disposed within the housing in a horizontal posture, thereby making the product structure compact and reducing the thickness of the micro-projector product. In an alternative embodiment, a volume adjustment button 142 may be provided on the side surface of the housing.

[0051] In one embodiment, the housing includes an outer housing 110 and an inner housing 120. The outer housing 110 includes a frame body 111 and cover plates 115 connected to both ends of the frame body 111. The frame body 111 is provided with a light-transmitting area 211 corresponding to the projection module 210. The inner housing 120 includes a bottom plate 121 and a first surrounding wall 123 disposed on the bottom plate 121. The area surrounded by the first surrounding wall 123 and the bottom plate 121 forms the heat dissipation cavity 130. Among them, the outer housing 110 is a metal housing, and the inner housing 120 is a plastic housing.

[0052] In another embodiment, the housing includes an outer housing 110 and an inner housing 120. The outer housing 110 includes a frame body 111 and cover plates 115 connected to both ends of the frame body 111. The frame body 111 is provided with a light-transmitting area 211 corresponding to the projection module 210. The inner housing 120 includes a bottom plate 121, a first surrounding wall 123, and a second surrounding wall 124 disposed on the bottom plate 121. The area surrounded by the first surrounding wall 123 and the bottom plate 121 forms the heat dissipation cavity 130, and the area surrounded by the second surrounding wall 124 and the bottom plate 121 forms the acoustic cavity 140. The outer housing 110 is a metal housing, and the inner housing 120 is a plastic housing.

[0053] As shown Figure 5 in the figure, a plurality of screw posts 112 are provided on the inner circumference of the housing 111. The bottom plate 121 and the circuit board 240 are provided with a plurality of fixing holes corresponding to the plurality of screw posts 112 and are respectively fixed to both ends of the screw posts 112 by screws.

[0054] Furthermore, recessed steps 113 are provided on the inner circumferences at both ends of the housing 111 for receiving the cover plate 115. The cover plate 115 and the housing 111 can be fixed by adhesive.

[0055] In the embodiment of the present application, the circuit board 240 is provided with two interfaces 241, namely TYPE-C 2.0 and TYPE-C 3.0, which has good versatility. After connecting to a mobile phone, a tablet computer, a notebook computer or a desktop computer through a TYPE-C data cable, projection can be performed.

[0056] The length, width and height dimensions of the micro-projector provided by the present application range from 75.8 ± 5 * 75.8 ± 5 * 18.55 ± 2 mm.

[0057] In addition, magnets can be provided on the inner surface side of the cover plate 115 at the bottom of the micro-projector provided by the present application, so that the micro-projector can be conveniently fixed by magnetic attraction, thereby improving the user experience.

[0058] In summary, it is easy for those skilled in the art to understand that the housing of the micro-projector provided by the present application is provided with a heat dissipation cavity 130, and the heat dissipation cavity 130 has an assembly opening 131, an air inlet channel 132 and an air outlet channel 133; the projection module 210 is arranged in the housing and is located outside the heat dissipation cavity 130; the heat dissipation block 220 is arranged in the housing, and the heat dissipation block 220 is thermally and fixedly connected to the projection module 210 and is hermetically connected to the assembly opening 131 of the heat dissipation cavity 130. The heat dissipation block 220 is used to absorb the heat generated when the projection module 210 works; the blower 230 is arranged in the heat dissipation cavity 130 and is covered by the heat dissipation block 220. The blower 230 is used to make external air enter the heat dissipation cavity 130 through the air inlet channel 132 and be discharged through the air outlet channel 133; the circuit board 240 is arranged in the housing and is electrically connected to the projection module 210 and the blower 230. The micro-projector provided by the present application has a novel structure, convenient assembly, small size and good heat dissipation performance.

[0059] The above are all the preferred embodiments of the present application, and the protection scope of the present application is not limited accordingly. Therefore, all equivalent changes made according to the structure, shape and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A micro-projector, characterized in that, Comprising: A housing, within which a heat dissipation cavity (130) is provided. The heat dissipation cavity (130) has an assembly opening (131), an air inlet passage (132), and an air outlet passage (133); A projection module (210), disposed within the housing and outside the heat dissipation cavity (130); A heat dissipation block (220), disposed within the housing. The heat dissipation block (220) is thermally and fixedly connected to the projection module (210) and is sealingly connected to the assembly opening (131) of the heat dissipation cavity (130). The heat dissipation block (220) is used to absorb the heat generated when the projection module (210) operates; A blower (230), disposed within the heat dissipation cavity (130) and covered by the heat dissipation block (220). The blower (230) is used to allow external air to enter the heat dissipation cavity (130) through the air inlet passage (132) and be discharged through the air outlet passage (133); A circuit board (240), disposed within the housing and electrically connected to the projection module (210) and the blower (230).

2. The micro-projector according to claim 1, wherein: The heat dissipation cavity (130) includes a first width portion near the air inlet passage (132) and a second width portion near the air outlet passage (133). The width of the first width portion is greater than the width of the second width portion to form a stepped assembly structure for positioning and clamping the blower (230).

3. The micro-projector according to claim 1, wherein: The micro-projector further includes a speaker (250) and a speaker rear cover (260). A sound cavity (140) is also provided within the housing. The speaker (250) is assembled within the sound cavity (140) and is electrically connected to the circuit board (240). The speaker rear cover (260) is fixedly connected to the sound cavity (140). The housing is provided with a sound outlet hole (141) corresponding to the speaker (250).

4. The micro-projector according to claim 1, characterized in that, The housing includes: An outer housing (110), including a frame body (111) and cover plates (115) connected to both ends of the frame body (111). The frame body (111) is provided with a light transmission area (211) corresponding to the projection module (210); An inner housing (120), including a bottom plate (121) and a first surrounding wall (123) provided on the bottom plate (121). The area surrounded by the first surrounding wall (123) and the bottom plate (121) forms the heat dissipation cavity (130); The outer housing (110) is a metal housing, and the inner housing (120) is a plastic housing.

5. The micro-projector according to claim 3, wherein The housing includes: An outer housing (110), including a frame body (111) and cover plates (115) connected to both ends of the frame body (111). The frame body (111) is provided with a light transmission area (211) corresponding to the projection module (210); The inner housing (120) includes a bottom plate (121), a first surrounding wall (123) and a second surrounding wall (124) provided on the bottom plate (121). The area enclosed by the first surrounding wall (123) and the bottom plate (121) forms the heat dissipation cavity (130), and the area enclosed by the second surrounding wall (124) and the bottom plate (121) forms the sound cavity (140). The outer housing (110) is a metal housing, and the inner housing (120) is a plastic housing.

6. The micro-projector according to claim 4 or 5, characterized in that, A plurality of screw posts (112) are provided on the inner circumference of the frame body (111). The bottom plate (121) and the circuit board (240) are provided with a plurality of fixing holes corresponding to the plurality of screw posts (112) and are respectively fixed to both ends of the screw posts (112) by screws.

7. The micro-projector according to claim 6, characterized in that, Concave steps (113) are provided on the inner circumferences at both ends of the frame body (111) for receiving the cover plate (115).

8. The micro-projector according to claim 7, characterized in that, The cover plate (115) and the frame body (111) are fixed by adhesive.

9. The micro-projector according to claim 1, characterized in that, The circuit board (240) is provided with two interfaces (241) of TYPE-C 2.0 and TYPE-C 3.

0.

10. The micro-projector according to claim 1, characterized in that, The length, width and height dimensions of the micro-projector range from (75.8±5)×(75.8±5)×(18.55±2) millimeters.

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