Upper imprinting device with air bag structure, vacuum nanoimprinting equipment and method

Abstract

The invention discloses an upper imprinting device with an air bag structure and vacuum nano imprinting equipment and method. The upper imprinting device comprises an upper imprinting mold frame, an air bag assembly, an air bag driving device, an air bag vacuumizing device and a cavity vacuumizing device, the upper imprinting mold frame is in transmission connection with the upper mold frame driving device, and the upper imprinting mold frame is provided with an upper cavity; the air bag assembly is arranged in the upper cavity and comprises an upper locking ring plate, a lower locking ring plate and an air bag, the upper locking ring plate and the lower locking ring plate are concentrically arranged and connected with each other, and the edge of the air bag is clamped between the upper locking ring plate and the lower locking ring plate; the air bag forms a vacuum degree internal and external pressure difference under the action of the air bag vacuumizing device and the cavity vacuumizing device, and the air bag expands outwards to apply downward pressure to the central area of the wafer, so that the wafer generates corresponding deformation. According to the invention, the air bag expands and applies pressure under the vacuum pressure difference, thereby realizing the deformation of the central area of the wafer, and improving the fitting precision of the wafer and the mother board and the coining yield.

Description

Technical Field

[0001] The present invention belongs to the technical field of nanoimprinting, and in particular relates to an upper imprinting device with an airbag structure, a vacuum nanoimprinting device and a method. Background Art

[0002] Nanoimprint technology, as a high-precision micro-nanostructure manufacturing method, has become one of the core technologies in the fields of semiconductor manufacturing, optical device processing, biomedical sensors, etc. due to its ability to achieve high-resolution pattern transfer at the nanoscale. This technology directly transfers the nanoscale structure on the template to the target substrate (such as a wafer, etc.) by physical imprinting. It has the advantages of low cost, high resolution, and mass production. It is especially valuable in the preparation of next-generation integrated circuits, photonic crystals, and microfluidic chips.

[0003] The existing nanoimprint process mainly adopts the traditional soft imprint technology route: first, the microstructure on the rigid motherboard is replicated by a soft film (usually an elastic material such as PDMS) to form an elastic intermediate template, and then the intermediate template is used to perform a second imprint transfer on the wafer. Although this two-step process can adapt to the microscopic fluctuations on the wafer surface to a certain extent, its inherent multi-step process leads to low production efficiency, and the repeated use of the intermediate template will introduce pattern distortion and cumulative errors.

[0004] In order to simplify the process and improve processing efficiency, a hard motherboard (such as glass, quartz or silicon-based template) is directly bonded to the wafer, and the pattern transfer is completed in one go through methods such as heat pressing or UV curing. However, this technology faces significant challenges in practical applications: since both the motherboard and the wafer are rigid materials, it is difficult to completely eliminate the tiny gaps between the interfaces during the high-pressure bonding process, and it is very easy to entrain air to form microscopic bubbles. The presence of these bubbles will cause incomplete pattern transfer, structural deformation, and even damage to the photoresist layer, ultimately resulting in a reduction in wafer processing yield.

[0005] Therefore, a new nanoimprinting method that can retain the efficiency advantage of direct imprinting on a hard motherboard while effectively suppressing bubble generation and improving the consistency of pattern transfer has become a technical problem that urgently needs to be overcome in this field. Summary of the invention

[0006] In order to solve the above technical problems, the present invention proposes an upper imprinting device with an airbag structure, a vacuum nanoimprinting equipment and a method.

[0007] In order to achieve the above object, the technical solution of the present invention is as follows:

[0008] In a first aspect, the present invention discloses an upper stamping device with an airbag structure, comprising:

[0009] The upper imprinting die holder is drivingly connected to the upper die holder driving device, and the upper imprinting die holder has an upper cavity. The upper die holder driving device is used to drive the upper imprinting die holder to move up and down.

[0010] An airbag assembly is placed in the upper cavity. It includes an upper locking ring plate, a lower locking ring plate, and an airbag. The upper locking ring plate and the lower locking ring plate are concentrically arranged and connected to each other. The edge of the airbag is clamped between the upper locking ring plate and the lower locking ring plate to form a sealed and fixed structure.

[0011] An airbag driving device is drivingly connected to the airbag assembly and is used to drive the airbag assembly to move up and down.

[0012] An airbag vacuuming device is communicated with the inner cavity of the airbag through a pipeline.

[0013] A cavity vacuuming device is communicated with the upper cavity through a pipeline.

[0014] Wherein, under the action of the airbag vacuuming device and the cavity vacuuming device, the airbag forms an internal and external pressure difference in vacuum degree, and the airbag expands outwards and applies a downward pressure to the central area of the wafer, causing the corresponding deformation of the wafer.

[0015] The present invention discloses an upper imprinting device with an airbag structure. By expanding and applying pressure of the airbag under the vacuum pressure difference, it can accurately control the deformation of the wafer. Compared with the traditional rigid imprinting method, it can effectively avoid wafer damage caused by uneven pressure, realize uniform pressure application in the central area of the wafer, avoid local stress concentration caused by hard imprinting, reduce bubble residue and improve the fitting accuracy, and improve the fitting accuracy between the wafer and the master plate and the imprinting yield.

[0016] On the basis of the above technical solution, the following improvements can also be made:

[0017] As a preferred solution, the airbag driving device is drivingly connected to the airbag assembly through a leveling component, and the leveling component is used to adjust the parallelism of the airbag assembly relative to the wafer.

[0018] By adopting the above preferred solution, the angular deviation between the airbag assembly and the wafer is eliminated through the leveling component, ensuring the uniformity of pressure distribution and avoiding pattern distortion caused by inclination.

[0019] As a preferred solution, the leveling component includes:

[0020] An upper substrate, which is drivingly connected to the airbag driving device;

[0021] A lower adjusting plate, which is concentrically arranged with the upper substrate and is fixedly connected to the airbag assembly;

[0022] At least three adjusting columns, evenly distributed along the circumference of the lower adjusting plate, one end of the adjusting column is connected to the upper substrate, and the other end is connected to the lower adjusting plate;

[0023] Among them, by independently rotating each adjusting column, the corresponding area of the lower adjusting plate is driven to displace axially to adjust the parallelism between the lower adjusting plate and the airbag assembly.

[0024] Adopting the above preferred scheme, the multi-adjusting column independent control realizes the micron-level parallelism adjustment, ensures that the pressure applied by the airbag is evenly distributed on the wafer surface, avoids excessive or too small local pressure on the wafer caused by the inclination of the airbag, and further improves the uniformity of imprinting and the stability of product quality.

[0025] As a preferred scheme, the upper locking ring plate includes:

[0026] An outer ring part, the outer diameter of the outer ring part is the same as the outer diameter of the lower locking ring plate, and the outer ring part is fixedly connected to the lower locking ring plate;

[0027] An inner ring part, the inner ring part is placed above the middle area of the airbag;

[0028] At least three transverse ribs, the transverse ribs connect the outer ring part and the inner ring part, and the transverse ribs are evenly distributed along the circumference of the upper locking ring plate.

[0029] Adopting the above preferred scheme, the hollow structure (outer ring part, inner ring part and transverse ribs) of the upper locking ring plate reduces the overall weight while ensuring the fixing strength of the airbag, and reduces the energy consumption required to drive the lifting of the airbag assembly; the setting of the transverse ribs enhances the structural rigidity of the upper locking ring plate, and at the same time reduces the radial deformation when the airbag expands, ensuring the accuracy of pressure transmission.

[0030] As a preferred scheme, the outer diameter of the inner ring part is the same as the outer diameter of the lower adjusting plate of the leveling assembly, and the central axis of the inner ring part coincides with the central axis of the lower adjusting plate.

[0031] Adopting the above preferred scheme, the coaxial design ensures that the pressure transmission path is aligned, avoiding device wear or airbag rupture caused by eccentric load.

[0032] As a preferred scheme, a middle plate is fixedly connected to the upper surface of the airbag assembly, and at least three pressure sensors are provided between the middle plate and the lower adjusting plate of the leveling assembly, and the pressure sensors detect the inflation pressure of the airbag in real time.

[0033] Adopting the above preferred scheme, the airbag pressure is dynamically adjusted through the feedback of the pressure sensor to achieve closed-loop control, preventing overpressure from damaging the wafer or the imprinting adhesive layer.

[0034] As a preferred scheme, at least three ear plates are evenly arranged along the circumference of the middle plate, and each ear plate is detachably connected to the corresponding transverse rib through a quick-release lock.

[0035] With the above preferred solution, the quick-release structure facilitates the maintenance or replacement of the airbag assembly, reduces the equipment downtime, and improves the production efficiency.

[0036] As a preferred solution, guide columns are provided on both sides of the upper imprinting die carrier. The guide columns pass through the guide holes of the upper imprinting die carrier and are slidably engaged with the upper imprinting die carrier to limit the lifting path of the upper imprinting die carrier.

[0037] With the above preferred solution, the guide columns constrain the movement trajectory of the upper imprinting die carrier, avoid the cavity misalignment caused by yaw, and ensure the accurate alignment of the upper and lower die carriers.

[0038] In a second aspect, the present invention discloses a vacuum nanoimprinting device, including the above upper imprinting device and a lower imprinting device;

[0039] The lower imprinting device includes:

[0040] A lower imprinting die carrier having a lower cavity;

[0041] A master plate carrier placed in the lower cavity for fixing the master plate;

[0042] A wafer support ring placed in the lower cavity for carrying the wafer;

[0043] The wafer support ring is in transmission connection with a support ring driving device, and the support ring driving device is used to drive the wafer support ring to lift and lower.

[0044] The present invention discloses a vacuum nanoimprinting device. The upper and lower imprinting devices work together to achieve bubble-free bonding by controlling the deformation of the wafer and its contact with the master plate in stages.

[0045] In a third aspect, the present invention discloses a vacuum nanoimprinting method, which uses a vacuum nanoimprinting device for imprinting, including:

[0046] Step S1: Place the master plate coated with imprinting glue on the master plate carrier, and place the wafer on the wafer support ring;

[0047] Step S2: The upper imprinting device descends, and the upper cavity and the lower cavity are closed to form a sealed space;

[0048] Step S3: Use the cavity vacuuming device to evacuate the sealed space to a first vacuum degree;

[0049] Step S4: Use the airbag vacuuming device to evacuate the inner cavity of the airbag to a second vacuum degree, the second vacuum degree is less than the first vacuum degree, and the airbag expands under the action of the internal and external pressure difference of the vacuum degree,

[0050] The airbag applies downward pressure to the center area of ​​the wafer, causing the wafer to deform, with the edges of the wafer rising and the middle area bulging downward;

[0051] Step S5: the airbag driving device drives the airbag downward so that the downward protruding portion of the central area of ​​the wafer contacts the motherboard first;

[0052] Step S6: The support ring driving device drives the wafer support ring to slowly move downward, so that the contact surface of the wafer is completely attached to the motherboard in a diffusion manner.

[0053] The present invention discloses a vacuum nanoimprinting method. Based on the above vacuum nanoimprinting equipment, the wafer and the motherboard can be bonded in a more scientific way under a vacuum environment through unique airbag pressure and step-by-step bonding process, effectively reducing bubbles formed by residual air, and improving the integrity and accuracy of pattern transfer. The method is particularly suitable for nanoscale structure processing with extremely high precision requirements, and provides an efficient and reliable production process for the fields of semiconductor manufacturing, optical component preparation, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0055] Figure 1 A schematic structural diagram of an upper imprinting device provided in an embodiment of the present invention.

[0056] Figure 2 A schematic diagram of the internal structure of an upper imprinting device provided in an embodiment of the present invention.

[0057] Figure 3 A side view of the internal structure of the upper imprinting device provided in an embodiment of the present invention.

[0058] Figure 4 A schematic diagram of the connection between the middle plate and the airbag assembly provided in an embodiment of the present invention.

[0059] Figure 5 A schematic structural diagram of an upper locking ring plate provided in an embodiment of the present invention.

[0060] Figure 6 A schematic structural diagram of a lower imprinting device provided in an embodiment of the present invention.

[0061] Figure 7 A schematic structural diagram of a vacuum nanoimprinting device provided in an embodiment of the present invention.

[0062] Figure 8Partial schematic diagram of the vacuum nanoimprinting equipment provided by the embodiment of the present invention.

[0063] Wherein: 1 - upper imprinting device, 11 - upper imprinting die carrier, 12 - airbag assembly, 121 - upper locking ring plate, 1211 - outer ring part, 1212 - inner ring part, 1213 - transverse rib, 122 - lower locking ring plate, 123 - airbag, 13 - airbag driving device, 14 - upper die carrier driving device, 15 - leveling assembly, 151 - upper substrate, 152 - lower adjusting plate, 153 - adjusting column, 16 - intermediate plate, 161 - ear plate, 17 - pressure sensor, 18 - quick-release lock, 19 - guiding column, 2 - lower imprinting device, 21 - lower imprinting die carrier, 22 - master plate stage, 23 - wafer support ring, 24 - support ring driving device, 3 - wafer, 4 - master plate. Detailed implementation manners

[0064] The preferred implementation manners of the present invention will be described in detail below with reference to the accompanying drawings.

[0065] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0066] The expression of "including" an element is an "open-ended" expression, which only means that there is a corresponding component or step, and should not be construed as excluding additional components or steps.

[0067] In order to achieve the purpose of the present invention, in some embodiments of the upper imprinting device with an airbag structure, as Figures 1-5 shown, the upper imprinting device includes: an upper imprinting die carrier 11, an airbag assembly 12, an airbag driving device 13, an airbag vacuum pumping device (not shown in the figure) and a cavity vacuum pumping device (not shown in the figure).

[0068] The upper imprinting die carrier 11 is in transmission connection with the upper die carrier driving device 14, and the upper imprinting die carrier 11 has an upper cavity, and the upper die carrier driving device 14 is used to drive the upper imprinting die carrier 11 to move up and down.

[0069] The airbag assembly 12 is placed in the upper cavity, and it includes: an upper locking ring plate 121, a lower locking ring plate 122 and an airbag 123. The upper locking ring plate 121 and the lower locking ring plate 122 are concentrically arranged and connected to each other. The edge of the airbag 123 is clamped between the upper locking ring plate 121 and the lower locking ring plate 122 to form a sealed fixed structure.

[0070] The airbag driving device 13 is in transmission connection with the airbag assembly 12 and is used to drive the airbag assembly 12 to move up and down.

[0071] The airbag vacuuming device is communicated with the inner cavity of the airbag 123 through a pipeline; the cavity vacuuming device is communicated with the upper cavity through a pipeline.

[0072] Wherein, under the action of the airbag vacuuming device and the cavity vacuuming device, the airbag 123 forms an internal and external pressure difference in vacuum degree, and the airbag 123 expands outwards and exerts a downward pressure on the central area of the wafer 3, causing the corresponding deformation of the wafer 3.

[0073] The present invention discloses an upper imprinting device 1 with an airbag structure. By expanding and pressing the airbag under the vacuum pressure difference, it can accurately control the deformation of the wafer 3. Compared with the traditional rigid imprinting method, it can effectively avoid the damage of the wafer 3 caused by uneven pressure, realize uniform pressing on the central area of the wafer, avoid local stress concentration caused by hard imprinting, reduce bubble residue and improve the bonding accuracy, and improve the bonding accuracy and imprinting yield of the wafer 3 and the mother board 4.

[0074] In order to further optimize the implementation effect of the present invention, in some other embodiments, the remaining characteristic technologies are the same, and the difference is that the airbag driving device 13 is in transmission connection with the airbag assembly 12 through a leveling component 15, and the leveling component 15 is used to adjust the parallelism of the airbag assembly 12 relative to the wafer 3.

[0075] By adopting the above preferred solution, the angular deviation between the airbag assembly 12 and the wafer 3 is eliminated through the leveling component 15, ensuring the uniformity of the pressure distribution and avoiding pattern distortion caused by inclination.

[0076] Furthermore, the above leveling component 15 includes:

[0077] An upper substrate 151, which is in transmission connection with the airbag driving device 13;

[0078] A lower adjusting plate 152, which is concentrically arranged with the upper substrate 151 and is fixedly connected with the airbag assembly 12;

[0079] Three adjusting columns 153, which are evenly distributed along the circumference of the lower adjusting plate 152. One end of the adjusting column 153 is connected to the upper substrate 151, and the other end is connected to the lower adjusting plate 152;

[0080] Wherein, by independently rotating each adjusting column 153, the corresponding area of the lower adjusting plate 152 is driven to displace axially to adjust the parallelism of the lower adjusting plate 152 and the airbag assembly 12.

[0081] With the above - preferred solution, the multiple adjustment columns 153 are independently controlled to achieve micron - level parallelism adjustment, ensuring that the pressure exerted by the airbag is evenly distributed on the surface of the wafer 3, avoiding excessive or insufficient local pressure on the wafer 3 caused by the inclination of the airbag, and further improving the uniformity of imprinting and the stability of product quality.

[0082] In order to further optimize the implementation effect of the present invention, in some other embodiments, the remaining characteristic technologies are the same, and the difference lies in that the upper locking ring plate 121 includes:

[0083] An outer ring portion 1211, the outer diameter of the outer ring portion 1211 is the same as the outer diameter of the lower locking ring plate 122, and the outer ring portion 1211 is fixedly connected to the lower locking ring plate 122;

[0084] An inner ring portion 1212, the inner ring portion 1212 is placed above the middle area of the airbag 123;

[0085] Five transverse ribs 1213, the transverse ribs 1213 connect the outer ring portion 1211 and the inner ring portion 1212, and the transverse ribs 1213 are evenly distributed along the circumferential direction of the upper locking ring plate 121.

[0086] With the above - preferred solution, the hollow - out structure of the upper locking ring plate 121 (the outer ring portion 1211, the inner ring portion 1212 and the transverse ribs 1213) ensures the fixing strength of the airbag 123 while reducing the overall weight and the energy consumption required to drive the airbag assembly 12 to lift; the setting of the transverse ribs 1213 enhances the structural rigidity of the upper locking ring plate 121 and reduces the radial deformation when the airbag expands, ensuring the accuracy of pressure transmission.

[0087] Furthermore, the outer diameter of the above - mentioned inner ring portion 1212 is the same as the outer diameter of the lower adjusting plate 152 of the leveling assembly 15, and the central axis of the inner ring portion 1212 coincides with the central axis of the lower adjusting plate 152.

[0088] With the above - preferred solution, the coaxial design ensures that the pressure transmission path is aligned, avoiding device wear or airbag rupture caused by eccentric loads.

[0089] Furthermore, a middle plate 16 is fixedly connected to the upper surface of the above - mentioned airbag assembly 12, and three pressure sensors 17 are provided between the middle plate 16 and the lower adjusting plate 152 of the leveling assembly 15, and the pressure sensors 17 detect the expansion pressure of the airbag in real - time.

[0090] With the above - preferred solution, the airbag pressure is dynamically adjusted through the feedback of the pressure sensors 17 to achieve closed - loop control, preventing over - pressure from damaging the wafer 3 or the imprinting adhesive layer. The pressure sensors can be, but are not limited to, Zhuohang Precision - ZHA11 + 10KG + ZHYA01 - 0~10V.

[0091] Further, three ear plates 161 are arranged on the middle plate 16 at equal intervals along its circumferential direction, and each ear plate 161 is detachably connected to the corresponding transverse rib 1213 through a quick-release lock 18.

[0092] With the above preferred solution, the quick-release structure facilitates the maintenance or replacement of the airbag assembly 12, reduces the equipment downtime, and improves the production efficiency.

[0093] In order to further optimize the implementation effect of the present invention, in some other embodiments, the remaining characteristic technologies are the same, and the difference lies in that guide columns 19 are provided on both sides of the upper imprinting die holder 11. The guide columns 19 pass through the guide holes of the upper imprinting die holder 11 and are slidably matched with the upper imprinting die holder 11 to limit the lifting path of the upper imprinting die holder 11.

[0094] With the above preferred solution, the guide columns 19 restrict the movement trajectory of the upper imprinting die holder 11, avoid the cavity misalignment caused by yaw, and ensure the accurate alignment of the upper and lower die holders.

[0095] In some other embodiments, as Figures 7-8 shown, the present invention also discloses a vacuum nanoimprinting device, including the above-mentioned upper imprinting device 1 and lower imprinting device 2.

[0096] The lower imprinting device 2 includes: a lower imprinting die holder 21, a mother board carrier 22, a wafer support ring 23, and a support ring driving device 24.

[0097] The lower imprinting die holder 21 has a lower cavity. The mother board carrier 22 is placed in the lower cavity for fixing the mother board 4. The wafer support ring 23 is placed in the lower cavity for carrying the wafer 3. The wafer support ring 23 is in transmission connection with the support ring driving device 24, and the support ring driving device 24 is used to drive the wafer support ring 23 to lift.

[0098] The present invention discloses a vacuum nanoimprinting device. The upper and lower imprinting devices 2 cooperate to control the deformation of the wafer 3 in stages to contact the mother board 4, so as to achieve bubble-free bonding.

[0099] In some other embodiments, the present invention also discloses a vacuum nanoimprinting method, which uses a vacuum nanoimprinting device to achieve nanoimprinting, including:

[0100] Step S101: Place the mother board 4 coated with imprinting glue on the mother board carrier 22, and place the wafer 3 on the wafer support ring 23;

[0101] Step S102: The upper imprinting device 1 descends, and the upper cavity and the lower cavity are closed to form a sealed space;

[0102] Step S103: Use the cavity vacuum pumping device to pump the sealed space to the first vacuum degree;

[0103] Step S104: The airbag vacuuming device is used to evacuate the airbag cavity to a second vacuum degree, the second vacuum degree is less than the first vacuum degree, and the airbag 123 expands under the action of the pressure difference between the inside and outside of the vacuum degree.

[0104] The airbag 123 applies downward pressure to the central area of ​​the wafer 3, causing the wafer 3 to deform, with the edge of the wafer 3 rising and the middle area bulging downward;

[0105] Step S105: the airbag driving device 13 drives the airbag downward, so that the downwardly protruding portion of the central area of ​​the wafer 3 contacts the motherboard 4 first;

[0106] Step S106: the support ring driving device 24 drives the wafer support ring 23 to slowly move downward, so that the contact surface of the wafer 3 is completely attached to the motherboard 4 in a diffusion manner.

[0107] Furthermore, in some other embodiments, when the airbag driving device 13 drives the airbag downward so that the downwardly protruding portion of the central area of ​​the wafer 3 contacts the motherboard 4, the pressure sensor detects the pressure of the airbag in real time.

[0108] It is worth noting that in step S106 , when the wafer support ring 23 moves downward, the airbag driving device 13 does not operate and the airbag assembly 12 is fixed.

[0109] The present invention discloses a vacuum nanoimprinting method. Based on the above vacuum nanoimprinting equipment, a unique airbag pressurization and step-by-step bonding process are used to enable a wafer 3 and a motherboard 4 to be bonded in a more scientific manner under a vacuum environment, thereby effectively reducing bubbles formed by residual air, and improving the integrity and accuracy of pattern transfer. The method is particularly suitable for nanoscale structure processing with extremely high precision requirements, and provides an efficient and reliable production process for the fields of semiconductor manufacturing, optical component preparation, etc.

[0110] In the description of the present invention, it is necessary to understand that the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inside", "front", "center", "both ends" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0111] In the present invention, unless otherwise clearly specified or limited, terms such as "installation", "setting", "connection", "fixation", "swivel connection" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. Unless otherwise clearly limited, for those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0112] The above has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of the present invention claimed is defined by the appended claims and their equivalents.

Claims

1. An upper stamping device with an airbag structure, characterized in that, Comprising: An upper imprinting die holder, which is in transmission connection with an upper die holder driving device, and the upper imprinting die holder has an upper cavity, and the upper die holder driving device is used to drive the upper imprinting die holder to lift and lower; An airbag assembly, which is placed in the upper cavity, and includes: an upper locking ring plate, a lower locking ring plate and an airbag. The upper locking ring plate and the lower locking ring plate are concentrically arranged and connected to each other. The edge of the airbag is clamped between the upper locking ring plate and the lower locking ring plate to form a sealed fixed structure; An airbag driving device, which is in transmission connection with the airbag assembly and is used to drive the airbag assembly to lift and lower; An airbag vacuum pumping device, which is communicated with the inner cavity of the airbag through a pipeline; A cavity vacuum pumping device, which is communicated with the upper cavity through a pipeline; Wherein, under the action of the airbag vacuum pumping device and the cavity vacuum pumping device, the airbag forms an internal and external pressure difference in vacuum degree, and the airbag expands outwards, applying a downward pressure to the central area of the wafer, so that the wafer generates corresponding deformation.

2. The upper stamping device according to claim 1, characterized in that, The airbag driving device is in transmission connection with the airbag assembly through a leveling component, and the leveling component is used to adjust the parallelism of the airbag assembly relative to the wafer.

3. The upper stamping device according to claim 2, characterized in that, The leveling component includes: An upper substrate, which is in transmission connection with the airbag driving device; A lower adjusting plate, which is concentrically arranged with the upper substrate, and the lower adjusting plate is fixedly connected with the airbag assembly; At least three adjusting columns, which are evenly distributed along the circumference of the lower adjusting plate. One end of the adjusting column is connected with the upper substrate, and the other end is connected with the lower adjusting plate; Wherein, by independently rotating each of the adjusting columns, the corresponding area of the lower adjusting plate is driven to displace axially to adjust the parallelism of the lower adjusting plate and the airbag assembly.

4. The upper embossing device according to claim 3, characterized in that, The upper locking ring plate includes: An outer ring part, the outer diameter of which is the same as that of the lower locking ring plate, and the outer ring part is fixedly connected with the lower locking ring plate; An inner ring part, which is placed above the middle area of the airbag; At least three transverse ribs, which connect the outer ring part and the inner ring part, and the transverse ribs are evenly distributed along the circumference of the upper locking ring plate.

5. The upper embossing device according to claim 4, characterized in that, The outer diameter of the inner ring part is the same as the outer diameter of the lower adjusting plate of the leveling component, and the central axis of the inner ring part coincides with the central axis of the lower adjusting plate.

6. The upper stamping device according to claim 4, characterized in that, A middle plate is fixedly connected to the upper surface of the airbag assembly, and at least three pressure sensors are arranged between the middle plate and the lower adjusting plate of the leveling component, and the pressure sensors are used to detect the expansion pressure of the airbag in real time.

7. The upper embossing device according to claim 6, characterized in that, At least three ear plates are evenly arranged along the circumference of the middle plate, and each ear plate is detachably connected to the corresponding transverse rib through a quick-release lock.

8. The upper embossing device according to claim 1, characterized in that, Guide columns are arranged on both sides of the upper imprinting die holder. The guide columns pass through the guide holes of the upper imprinting die holder and are in sliding fit with the upper imprinting die holder to limit the lifting path of the upper imprinting die holder.

9. A vacuum nanoimprinting device, characterized in that, Comprising the upper imprinting device according to any one of claims 1-8 and a lower imprinting device; The lower imprinting device includes: A lower imprinting die holder, which has a lower cavity; A mother board carrier, which is placed in the lower cavity and is used to fix the mother board; A wafer support ring, which is placed in the lower cavity and used to carry the wafer; The wafer support ring is in transmission connection with a support ring driving device, and the support ring driving device is used to drive the wafer support ring to lift and lower.

10. A vacuum nanoimprinting method, characterized in that, Performing imprinting by using the vacuum nanoimprinting device as claimed in claim 9, including: Step S1: Place the master plate coated with imprinting glue on the master plate stage, and place the wafer on the wafer support ring; Step S2: The upper imprinting device moves downward, and the upper cavity and the lower cavity are closed to form a sealed space; Step S3: Use the cavity vacuum pumping device to pump the sealed space to a first vacuum degree; Step S4: Use the airbag vacuum pumping device to pump the inner cavity of the airbag to a second vacuum degree, the second vacuum degree is less than the first vacuum degree, and the airbag expands under the action of the internal and external pressure difference of the vacuum degree, The airbag applies a downward pressure to the central area of the wafer, causing the wafer to deform, the edge of the wafer to warp, and the central area to bulge downward; Step S5: The airbag driving device drives the airbag to move downward, so that the bulging part in the central area of the wafer contacts the master plate first; Step S6: The support ring driving device drives the wafer support ring to slowly move downward, so that the contact surface of the wafer is completely attached to the master plate in a diffusing manner.

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