Method for mounting bonding material adhesive

Abstract

The present invention relates to a bonding material attachment mounting method, and more particularly, to a bonding material attachment mounting method for mounting a bonding material attachment to a mounting groove formed in a mask so that the bonding material attachment can be mounted to an electrode of a substrate. According to the bonding material attachment mounting method, the area of a region where bonding material attachments are dense in a chamber is increased, and even small and light bonding material attachments can be effectively mounted in a mounting groove of a mask. In addition, according to the bonding material attachment mounting method of the present invention, by increasing the opportunity of contact between the bonding material attachment and the mounting groove of the mask, the bonding material attachment can be quickly mounted to the plurality of mounting grooves formed in the mask without falling on the ground.

Description

Technical Field

[0001] The present invention relates to a method for mounting a bonding material deposit, and more particularly to a method for mounting a bonding material deposit (bonding material deposits) in a mounting groove formed in a mask so that the bonding material deposit can be mounted on an electrode of a substrate. Background Art

[0002] When mounting semiconductor devices including large scale integration (LSI) and liquid crystal displays (LCD), in many cases, conductive balls such as solder balls are used for electrical connection.

[0003] A conductive ball in the form of fine particles having a diameter of 1 mm or less is mounted on a substrate for electrical mounting of the substrate. For this purpose, a mask having a mounting groove is generally mainly used. The following methods are mainly used: mounting the conductive ball in the mounting groove formed in the mask with the mask disposed on the substrate, or mounting the conductive ball in the mounting groove of the mask separately from the substrate and transferring and pasting it onto the substrate.

[0004] Recently, the size of the conductive ball has been reduced to about several tens of micrometers to several hundreds of micrometers, the substrate has become integrated, and the number of conductive balls to be mounted per unit area has also increased.

[0005] However, as the size of the conductive ball becomes smaller and the weight becomes lighter, it is difficult to mount the conductive ball on the mask according to the conventional method.

[0006] Disclosed in Japanese Patent Laid-Open Gazette No. 2010-177230 is as Figure 1The ball supply device shown above. The ball supply device as described above is often referred to as a "cyclone head". The conventional cyclone head as described above has a structure in which conductive balls are housed inside a cylindrical chamber and a cyclone-shaped air flow is formed inside the chamber by pins (28a). However, in the case of the conventional cyclone head as described above, if a very fast air flow in the form of a cyclone is formed inside the chamber similar to a tornado, the conductive balls will move in a direction parallel to the upper surface of the mask. However, since the mounting grooves of the mask are formed in the vertical direction and the conductive balls mainly move in the horizontal direction, there is a problem of low mounting efficiency of the conductive balls. In particular, as the size and weight of the conductive balls become smaller, a phenomenon similar to a tornado or a spout that causes the conductive balls to rise upward occurs inside the chamber. That is, instead of moving in the direction of the mounting grooves of the mask located on the lower side, the conductive balls move in the opposite direction, i.e., upward. It is difficult to effectively perform the conductive ball mounting process using the conventional cylindrical cyclone head as described above.

[0007] In addition, in the case of the conventional cyclone head formed in a cylindrical shape as Figure 1 shown, since the conductive balls are concentrated in the central part of the head rather than being evenly distributed inside the head, there is a problem of a decrease in the productivity of the process of mounting the conductive balls on the mask. That is, since the area of the effective region where the conductive balls are dense is relatively narrow, there is a problem of requiring a large amount of time in the process of passing through all parts of the mask with a narrow effective area when performing the operation of mounting the conductive balls on a mask with a relatively wide area.

[0008] Therefore, a method is needed that can effectively mount the bonding material attachment including the conductive balls as described above to the mounting grooves of the mask. In addition, a method is needed that can quickly and accurately mount the bonding material attachments one by one without omission to all the mounting grooves of the mask even when the size and weight of the bonding material attachments are small.

[0009] [Prior Art Documents]

[0010] [Patent Documents]

[0011] Japanese Patent Laid-Open Publication No. 2010-177230 (August 12, 2010) Summary of the Invention

[0012] [Problems to be Solved by the Invention]

[0013] The present invention is proposed to solve the above-described problems, and an object thereof is to provide a method for mounting a bonding material attachment that can quickly and accurately mount the conductive balls one by one without omission to the mounting grooves of the mask even when the size and weight of the conductive balls are small.

[0014] [Technical means for solving the problem]

[0015] In order to solve the problems described above, the present invention is a method for loading a bonding material attachment onto an installation groove of a mask formed with an installation groove, characterized by including the following steps: (a) horizontally arranging the mask; (b) arranging an installation head in a manner close to the upper surface of the mask, the installation head including: a head body including a first wall member and a second wall member arranged opposite to each other and extending parallel to each other in the horizontal direction, a first connecting member and a second connecting member respectively connecting both ends of the first wall member and the second wall member, a central chamber formed by being surrounded by the first wall member, the second wall member, the first connecting member, and the second connecting member to wait for the bonding material attachment, and a cover member covering the upper side of the central chamber; a first main nozzle formed along the length direction of the lower part of the first wall member so that compressed gas can be sprayed downward and inward of the central chamber; and a second main nozzle formed along the length direction of the lower part of the second wall member so that compressed gas can be sprayed downward and inward of the second wall member; (c) supplying the bonding material attachment into the interior of the central chamber of the installation head; (d) spraying compressed gas through the first main nozzle and the second main nozzle of the installation head respectively; and (e) while performing step (d), moving the installation head horizontally relative to the mask so that the bonding material attachment inside the central chamber of the installation head is loaded onto the installation groove of the mask.

[0016] [Effects of the invention]

[0017] The method for loading a bonding material attachment of the present invention increases the area of the region where the bonding material attachments are dense inside the chamber, and even small and light bonding material attachments can be effectively loaded onto the installation groove of the mask.

[0018] In addition, the method for loading a bonding material attachment of the present invention increases the contact opportunity between the bonding material attachment and the installation groove of the mask, so that the bonding material attachments can be quickly loaded onto a plurality of installation grooves formed in the mask one by one without omission. Description of the drawings

[0019] Figure 1 It is a diagram for explaining the structure of a conventional conductive ball mounting head.

[0020] Figure 2 It is a perspective view of an installation head according to an embodiment for implementing the method for loading a bonding material attachment of the present invention.

[0021] Figure 3 is Figure 2 exploded perspective view of the mounting head shown in

[0022] Figure 4 is Figure 2 sectional view taken along line IV-IV of the mounting head shown in

[0023] Figure 5 is Figure 2 sectional view taken along line V-V of the mounting head shown in

[0024] Figure 6 is a perspective view of a mounting head according to another embodiment of the method for mounting a bonding material attachment for implementing the present invention.

[0025] Figure 7 is Figure 6 exploded perspective view of the mounting head shown in

[0026] Figure 8 is Figure 6 sectional view taken along line VIII-VIII of the mounting head shown in

[0027] Figure 9 is Figure 6 sectional view taken along line IX-IX of the mounting head shown in

[0028] Explanation of reference numerals in the drawings

[0029] 28a: pin

[0030] 100, 200: mounting head

[0031] 101, 201: head body

[0032] 102, 202: central chamber

[0033] 105: ion generator

[0034] 110, 210: first wall member

[0035] 111, 211: first main nozzle

[0036] 120, 220: second wall member

[0037] 121, 221: second main nozzle

[0038] 130, 230: first connecting member

[0039] 131: first connecting main nozzle

[0040] 140, 240: second connecting member

[0041] 141: second connecting main nozzle

[0042] 150, 250: Cover member

[0043] 161: First connection guiding member

[0044] 162: Second connection guiding member

[0045] 171, 271: First guiding member

[0046] 172, 272: Second guiding member

[0047] 180, 280: Control unit

[0048] 291: First outer nozzle

[0049] 292: Second outer nozzle

[0050] 1111: First flow path

[0051] 1211: Second flow path

[0052] 1711, 2711: First guiding pin

[0053] 1712, 2712: First guiding groove

[0054] 1721, 2721: Second guiding pin

[0055] 1722, 2722: Second guiding groove

[0056] B: Conductive ball

[0057] H: Mounting groove

[0058] IV-IV, IX-IX, V-V, VIII-VIII: Lines

[0059] M: Mask Detailed implementation mode

[0060] Hereinafter, with reference to the drawings, the method for mounting a bonding material attachment according to the present invention will be described in detail. First, with reference to the drawings, the structure of the mounting head for implementing the method for mounting a bonding material attachment of the present invention will be described.

[0061] The present invention is used to mount attachment materials of bonding materials such as conductive balls (bonding material deposits or connecting material deposits) into the mounting grooves of a mask. Hereinafter, the case of mounting conductive balls onto a mask will be exemplified by taking an example of the attachment material of the bonding material as described above. However, the attachment material of the bonding material is not limited to conductive balls, and may be various other connection elements such as copper pillars and copper pins used to connect electrodes of a chip and a substrate.

[0062] Figure 2 is a perspective view of a mounting head according to an embodiment of a method for mounting an attachment material of a bonding material for implementing the present invention, Figure 3 is Figure 2 a separated perspective view of the mounting head shown in Figure 4 is Figure 2 a sectional view taken along line IV-IV of the mounting head shown in Figure 5 is Figure 2 a sectional view taken along line V-V of the mounting head shown in

[0063] Referring to Figures 2 to 5 , the mounting head 100 used in the implementation of the method for mounting an attachment material of a bonding material according to this embodiment is formed including a head body 101, a first main nozzle 111, and a second main nozzle 121.

[0064] The head body 101 is formed including a first wall member 110, a second wall member 120, a first connecting member 130, a second connecting member 140, a central chamber 102, and a cover member 150.

[0065] The first wall member 110 and the second wall member 120, and the first connecting member 130 and the second connecting member 140 are connected to each other and form an outer periphery surrounding the central chamber 102, and the cover member 150 is formed to cover the upper part of the central chamber 102. The conductive ball B to be mounted into the mounting groove H of the mask M is received and waits in the central chamber 102.

[0066] The first wall member 110 and the second wall member 120 are arranged opposite to each other and are formed to extend parallel to each other in the horizontal direction. The first connecting member 130 and the second connecting member 140 are respectively connected to both ends of the first wall member 110 and the second wall member 120.

[0067] The first main nozzle 111 is formed to extend along the length direction of the lower part of the first wall member 110 so that compressed gas can be jetted downward inside the central chamber 102. In the case of this embodiment, the first main nozzle 111 is formed to penetrate the lower surface of the first wall member 110.

[0068] The second main nozzle 121 is formed along the longitudinal direction of the lower part of the second wall member 120 so as to be able to inject compressed gas downward and inward of the central chamber 102. In the case of this embodiment, the second main nozzle 121 is formed so as to penetrate the lower surface of the second wall member 120 so as to be able to inject compressed gas at the junction of the lower surface of the second wall member 120 and the inner wall surface.

[0069] Refer to Figure 4 , the first main nozzle 111 is formed to be inclined in a direction closer to the central chamber 102 as it goes downward along the first wall member 110. Guided by the inclined structure of the first main nozzle 111 as described above, the conductive ball B at a position close to the inner wall of the first wall member 110 moves in a direction away from the first wall member 110 (that is, toward the central chamber 102).

[0070] Similar to the first main nozzle 111, the second main nozzle 121 is also formed to be inclined in a direction closer to the central chamber 102 as it goes downward along the second wall member 120.

[0071] In the case of this embodiment, the first main nozzle 111 and the second main nozzle 121 are formed to be inclined in opposite directions, and the inclination angle of the first main nozzle 111 with respect to the first wall member 110 is formed to be the same as the inclination angle of the second main nozzle 121 with respect to the second wall member 120.

[0072] A plurality of first guiding grooves 1712 and a plurality of second guiding grooves 1722 are respectively formed at the first main nozzle 111 and the second main nozzle 121. The first guiding grooves 1712 and the second guiding grooves 1722 as described above respectively guide the injection directions of the compressed gas ejected from the first main nozzle 111 and the second main nozzle 121. In the case of this embodiment, the first guiding grooves 1712 and the second guiding grooves 1722 are respectively formed at fixed intervals along the extending directions of the first wall member 110 and the second wall member 120.

[0073] In addition, in the case of this embodiment, the plurality of first guiding grooves 1712 and the plurality of second guiding grooves 1722 are respectively formed by a first guiding member 171 and a second guiding member 172 arranged at the first main nozzle 111 and the second main nozzle 121. The first guiding member 171 and the second guiding member 172 respectively include a plurality of first guiding pins 1711 and a plurality of second guiding pins 1721. The first guiding groove 1712 is formed between the plurality of first guiding pins 1711, and the second guiding groove 1722 is formed between the plurality of second guiding pins 1721.

[0074] A plurality of first guide pins 1711 are formed to be inclined such that they travel more toward the extending direction (length direction) of the first wall member 110 as they go toward the lower side of the first wall member 110, and a plurality of second guide pins 1721 are formed to be inclined such that they travel more toward the extending direction (length direction) of the second wall member 120 as they go toward the lower side of the second wall member 120. Through the first guide pins 1711 and the second guide pins 1721 as described above, the compressed gas ejected from the first main nozzle 111 and the second main nozzle 121 is ejected not in a direction perpendicular to the length direction of the first wall member 110 and the second wall member 120 but in an inclined direction.

[0075] In the case of this embodiment, as Figure 3 shown, a plurality of first guide grooves 1712 and a plurality of second guide grooves 1722 formed by the first guide pins 1711 and the second guide pins 1721 as described above are formed to be inclined in opposite directions to each other, and their inclination angles are formed to be the same as each other.

[0076] On the other hand, a first flow path 1111 and a second flow path 1211 connected to the first main nozzle 111 and the second main nozzle 121 are respectively formed in the first wall member 110 and the second wall member 120. The pressure of the compressed gas supplied to the first flow path 1111 and the second flow path 1211 is controlled by a control unit 180. In the case of this embodiment, the control unit 180 controls the pressures of the compressed gas supplied to the first flow path 1111 and the second flow path 1211 to be different from each other. That is, the control unit 180 is fixedly maintained in a state where the pressure of the compressed gas supplied to the first flow path 1111 is greater than the pressure of the compressed gas supplied to the second flow path 1211.

[0077] First connection main nozzles 131 and second connection main nozzles 141 are also respectively formed at a first connection member 130 and a second connection member 140 that connect the first wall member 110 and the second wall member 120 to each other. Similar to the first main nozzle 111 and the second main nozzle 121 described above, the first connection main nozzles 131 and the second connection main nozzles 141 are respectively formed to extend along the extending direction of the first connection member 130 and the second connection member 140 at the lower parts of the first connection member 130 and the second connection member 140 so as to be able to eject compressed gas toward the lower inner sides of the first connection member 130 and the second connection member 140, respectively. In addition, the first connection main nozzles 131 and the second connection main nozzles 141 are respectively formed to be inclined in a direction closer to the central chamber 102 as they go toward the lower parts of the first connection member 130 and the second connection member 140.

[0078] The first connecting main nozzle 131 and the second connecting main nozzle 141 may be formed in such a way that they can be respectively connected to the first main nozzle 111 and the second main nozzle 121, or may be formed in such a way that they are not connected to the first main nozzle 111 and the second main nozzle 121.

[0079] Referring to Figure 3 , at the first connecting main nozzle 131 and the second connecting main nozzle 141, first connecting guiding members 161 and second connecting guiding members 162 are also arranged in a form similar to that of the first guiding member 171 and the second guiding member 172 described above.

[0080] As Figure 3 shown, the inner wall surfaces where the first connecting member 130 and the second connecting member 140 are respectively connected to the central chamber 102 are formed as concave curved surfaces.

[0081] The control unit 180 keeps the pressure of the compressed gas supplied to the first connecting main nozzle 131 and the second connecting main nozzle 141 fixed.

[0082] An ionizer 105 may be provided on the inner wall surface formed by the central chamber 102, the first wall member 110, the second wall member 120, etc. or on the flow path of the compressed gas. When performing the conductive ball loading process using very small and light conductive balls B, the conductive balls B may adhere to the inner wall surface of the central chamber or the mask M, etc. due to static electricity. At this time, the control unit 180 as described above actuates the ionizer 105 to eliminate static electricity, thereby improving the quality and productivity of the conductive ball loading process.

[0083] Hereinafter, the process of implementing the bonding material attachment method according to the present invention using the mounting head 100 configured as described above will be described.

[0084] First, a mask M having a mounting groove H for mounting the conductive ball B is horizontally arranged (step (a)). At this time, a substrate may be arranged below the mask M, or a conductive ball support such as an adsorption plate may be arranged. When a substrate is arranged below the mask M, the conductive ball B is directly mounted on the substrate through the mounting groove H of the mask M. When a conductive ball support is arranged below the mask M, the conductive ball B mounted in the mounting groove H is transferred to the conductive ball support and then transferred to the substrate again for bonding.

[0085] Next, the mounting head 100 configured as described above is arranged in a manner close to the upper surface of the mask M (step (b)).

[0086] In the state as described above, the conductive ball B is supplied into the central chamber of the mounting head 100 and stored (step (c)).

[0087] Next, the control unit 180 uses a mechanical component such as a pneumatic regulator to fixedly supply compressed gas to each nozzle by using the pressures set for the first main nozzle 111 and the second main nozzle 121 and the first connecting main nozzle 131 and the second connecting main nozzle 141 (step (d)). The compressed gas may be air or nitrogen. Other gases than air and nitrogen may also be supplied through the nozzles.

[0088] At this time, as described above, the control unit 180 may keep the pressure of the compressed gas supplied to the first flow path 1111 the same as the pressure of the compressed gas supplied to the second flow path 1211, or may keep the pressure of the first flow path 1111 different from the pressure of the second flow path 1211. Usually, the control unit 180 may keep the pressure of the first flow path 1111 different from the pressure of the second flow path 1211. In addition, the control unit 180 may keep the pressure of the first flow path 1111 and the pressure of the second flow path 1211 fixed over time, or may adjust the pressure of the first flow path 1111 and the pressure of the second flow path 1211 so as to change in a fixed pattern over time such as a sine wave or a pulse wave.

[0089] Since the first main nozzle 111 and the second main nozzle 121 and the first connecting main nozzle 131 and the second connecting main nozzle 141 are respectively formed in a manner inclined in a direction closer to the central chamber 102 toward the lower side, the compressed gas ejected from each nozzle forms a gas flow toward the central chamber 102. That is, when the mounting head 100 according to the present embodiment is arranged in a state of being close to the mask M, a gas flow is formed between the mask M and the lower surface of the mounting head 100, so that a gas flow toward the inside of the central chamber 102 is formed between the lower surfaces of the first wall member 110 and the second wall member 120 and the first connecting member 130 and the second connecting member 140 and the mask M. Through the gas flow as described above, the conductive balls B inside the central chamber 102 do not leak outside the central chamber 102 but stay inside the central chamber 102.

[0090] Since the first wall member 110 and the second wall member 120 are arranged parallel to each other and are formed in a manner extending in the length direction, and the compressed gas is ejected from the first main nozzle 111 and the second main nozzle 121 along the length direction with a uniform pressure, the conductive balls B are distributed relatively uniformly inside the central chamber 102 along the length direction of the central chamber 102. That is, the conductive balls B are distributed in the form of a long extended line inside the central chamber 102.

[0091] In the state described above, the mounting head 100 is horizontally transferred in a direction perpendicular to the first wall member 110 and the second wall member 120 (step (e)). The process described above is performed using a separate transfer unit that horizontally transfers the mounting head 100. Inside the central chamber 102, the conductive balls B are arranged in a long line along the extending direction of the central chamber 102. When the mounting head 100 is horizontally transferred in the state described above, while covering the upper surface of the mask M with a relatively wide area, the process of mounting the conductive balls B is performed. As described above, the mounting head 100 has a structure that extends long and rectangular, so that the conductive balls B can be effectively mounted on all the mounting grooves H of the mask M with a relatively wide area quickly and without omission. As described above, the method for mounting the bonding material attachment of the present invention is compared with Figure 1 the method using the conventional cyclone head shown in FIG. has a dramatically higher productivity.

[0092] In addition, if the pressures of the first main nozzle 111 and the second main nozzle 121 are set to be different from each other as described above, and the control unit 180 maintains the pressure of either the first main nozzle 111 or the second main nozzle 121 to be greater than the pressure of the other, a gas flow that further improves the mounting efficiency of the conductive balls B is formed inside the central chamber 102. For example, when the pressure of the first main nozzle 111 is made greater than the pressure of the second main nozzle 121, an overall gas flow that moves from the first wall member 110 toward the second wall member 120 is formed at the lower inner side of the central chamber 102. The gas flow that moves from the lower part of the central chamber 102 toward the second wall member 120 collides with the inner wall of the second wall member 120 and rises upward, and moves from the upper part of the central chamber 102 along the cover member 150 toward the inner wall of the first wall member 110. As described above, the gas flow that moves from the upper part of the central chamber 102 toward the first wall member 110 and collides with the first wall member 110 collides with the inner wall of the first wall member 110 and moves downward. If the process described above occurs continuously, a flow of gas that rotates at high speed is formed inside the central chamber 102 around a virtual rotation axis that extends in a direction parallel to the extending directions of the first wall member 110 and the second wall member 120 (i.e., the horizontal direction). Therefore, since a gas flow that strongly descends along the inner wall surface of the first wall member 110 (i.e., a downward air flow) is formed near the first wall member 110, the probability that the conductive balls B descend along the gas flow described above and are installed in the mounting grooves H of the mask M increases dramatically. In addition, since the conductive balls B that descend from the vicinity of the first wall member 110 are in close contact with the surface of the mask M and move toward the second wall member 120, the probability of being installed in the mounting grooves H of the mask M during the process described above also becomes high.

[0093] The foregoing refers to Figure 1In the conventional cyclone head described, since a gas flow is formed that rotates around a rotation axis extending in the vertical direction along the inner wall surface of a chamber formed in a cylindrical shape, the efficiency of actually mounting the conductive ball B on the mounting groove H of the mask M is lower than that of the present invention. That is, referring to Figure 1 The conventional cyclone head described has the following problem: it is difficult to form the movement of the conductive ball B that moves toward the surface of the mask M at an angle close to perpendicular.

[0094] However, in the present invention, since a gas flow that moves the conductive ball B toward the front surface of the mask M or the mounting groove H is effectively generated, there is an advantage that the productivity of the conductive ball mounting process is dramatically improved. In particular, by configuring the mounting head 100 itself to be in a shape extending in the length direction, the volume of the mounting head 100 itself of the present invention is not much different from the conventional one and can also cover a wide area of the mask M. Therefore, the bonding material attachment method of the present invention can easily shorten the operation time of the conductive ball mounting process.

[0095] On the other hand, as described above, by using the first guide member 171 and the second guide member 172 to configure the mounting head 100 such that the compressed gas ejected from the first main nozzle 111 and the second main nozzle 121 is ejected in a direction inclined with respect to the inner wall surfaces of the first wall member 110 and the second wall member 120, the mounting performance of the conductive ball B can also be improved in other ways.

[0096] In the above-described case, a gas flow that moves from the first wall member 110 toward the second wall member 120 at the lower part of the central chamber 102 is formed in an oblique direction inclined with respect to the extending direction of the first wall member 110. The gas flow formed through the above-described path serves to increase the possibility of contact between the conductive ball B and the upper surface of the mask M. If it crosses between the first wall surface and the second wall surface in an inclined direction compared to the case of crossing perpendicularly between the first wall surface and the second wall surface, the distance that the conductive ball B travels via the upper surface of the mask M increases. Therefore, the possibility of contact between the conductive ball B and the upper surface of the mask M increases and the probability of mounting the conductive ball B on the mounting groove H increases. In addition, even when the pressures of the first main nozzle 111 and the second main nozzle 121 are uneven for some reason along the length directions of the first wall member 110 and the second wall member 120, because Figure 3The diagonal gas flow formed by the first guiding groove 1712 and the second guiding groove 1722 as shown can also guide the distribution of the conductive balls B inside the central chamber 102 to be relatively uniform along the length directions of the first wall member and the second wall member. By the method described above, the possibility that the conductive balls B are not loaded into the mounting grooves H in a specific area of the mask M passed through by the mounting head 100 can be reduced. Additionally, even when the diagonal flow of the conductive balls B is formed inside the central chamber 102 through the first guiding groove 1712 and the second guiding groove 1722 as described above, since the gas flow that descends along the inner wall surface of the first wall member 110 is still maintained, the conductive balls B move forward toward the mounting grooves H through this gas flow and the loading efficiency is improved.

[0097] On the other hand, the bonding material attachment loading method of the present invention can also be implemented by a method of setting the pressure of the first main nozzle 111 and the pressure of the second main nozzle 121 to be different along the direction of horizontally transporting the mounting head 100. For example, when horizontally transporting the mounting head 100 to the right with Figure 4 as a reference, the bonding material attachment loading method can also be implemented by a method of making the pressure of the second main nozzle 121 greater than the pressure of the first main nozzle 111. In this case, while the conductive balls B gather toward the rear side with respect to the transporting direction of the mounting head 100, the density of the conductive balls B increases on the side closer to the first main nozzle 111. As described above, by increasing the density of the conductive balls B in a specific area, the loading efficiency of the conductive balls B can be improved. On the contrary, when horizontally transporting the mounting head 100 to the left with Figure 4 as a reference, the bonding material attachment loading method is implemented by a method of operating with the pressure of the first main nozzle 111 greater than the pressure of the second main nozzle 121.

[0098] In addition, when the size of the conductive balls B is very small, the following step (d) can also be implemented: spraying the pressure of the compressed gas supplied to the first main nozzle 111 and the second main nozzle 121 in the form of a pulse wave. When the size of the conductive balls B is extremely small, the weight of the conductive balls B is very small so that they can float and drift even in a very weak air flow. In this case, if the compressed gas is supplied to the first main nozzle 111 and the second main nozzle 121 in the form of a pulse wave, when the pressure drops instantaneously, the conductive balls B also fall downward and contact the surface of the mask M, and the probability of being loaded into the mounting grooves H becomes greater.

[0099] In addition, the step (c) of supplying the conductive balls B to the central chamber and the step (b) of arranging the mounting head in a manner close to the upper surface of the mask M can be reversed in order with each other, and the step (c) can also be implemented while implementing the step (d) or the step (e).

[0100] As described above, an example of the method for mounting a bonding material attachment and the mounting head 100 for implementing the method of the present invention has been described. However, the mounting head used in the present invention is not limited to the form described and shown above.

[0101] For example, as described above, the first guide pin 1711 and the second guide pin 1721 are respectively formed obliquely with respect to the extending directions of the first wall member 110 and the second wall member 120. However, differently, the first guide pin and the second guide pin may be respectively configured to be formed in a direction perpendicular to the extending directions of the first wall member and the second wall member. In this case, the directions of the first guide groove and the second guide groove formed by the first guide pin and the second guide pin also become directions perpendicular to the extending directions of the first wall member and the second wall member.

[0102] In addition, as described above, the first guide groove 1712 and the second guide groove 1722 are respectively formed by the first guide member 171 and the second guide member 172. However, differently, the first guide groove and the second guide groove may be formed without using the first guide member 171 and the second guide member 172. That is, the first guide groove and the second guide groove may be provided by respectively forming irregularities on the inner wall surfaces of the first main nozzle and the second main nozzle.

[0103] Depending on the situation, the method for mounting a bonding material attachment may also be implemented using a mounting head having a structure without the first guide groove 1712 and the second guide groove 1722.

[0104] In addition, the structures and shapes of the first guide groove and the second guide groove or the first guide member and the second guide member may also be deformed into various other forms than those described above.

[0105] In addition, as described above, the first main nozzle 111 and the second main nozzle 121 are respectively formed in a manner that is inclined in a direction closer to the central chamber 102 as it goes downward. However, the structures of the first main nozzle and the second main nozzle are not limited to the above. A mounting head configured in the following manner may also be used: instead of using the inclined structures of the first main nozzle and the second main nozzle, other additional configurations are used to adjust the directions of the compressed gas ejected from the first main nozzle and the second main nozzle.

[0106] In addition, as described above, the first main nozzle 111 and the second main nozzle 121 are respectively formed in such a manner as to penetrate the lower surfaces of the first wall member 110 and the second wall member 120. However, depending on the situation, a mounting head having a structure in which the first main nozzle and the second main nozzle are respectively formed in such a manner as to penetrate the side wall surfaces of the central chambers of the first wall member and the second wall member may also be used to implement the method for mounting the bonding material attachment. With the above-described configuration, the movement of the conductive ball B that strongly descends toward the mask M can also be formed between the first wall member and the second wall member as described above. In addition, a mounting head having a structure in which the first main nozzle and the second main nozzle are respectively formed in such a manner as to penetrate the boundary between the lower surface and the inner wall surface of the first wall member and the second wall member may also be used.

[0107] In addition, the inclination angle of the first main nozzle with respect to the first wall member and the inclination angle of the second main nozzle with respect to the second wall member may be formed to be different from each other. By using the method of configuring the inclination angles of the first main nozzle and the second main nozzle to be different as described above, the downward movement of the conductive ball B caused by the rotation of the compressed gas can also be guided inside the central chamber. In particular, if the inclination angles of the first main nozzle and the second main nozzle are respectively configured to be different as described above, various forms of air flow inside the central chamber can be formed even when the control unit controls the pressures of the compressed gas supplied to the first main nozzle and the second main nozzle to be the same as each other.

[0108] In addition, as described above, the first connection guide member 161 and the second connection guide member 162 formed in a similar form to the first guide member 171 and the second guide member 172 are also arranged in the first connection main nozzle 131 and the second connection main nozzle 141, but a mounting head having a structure without the first connection guide member 161 and the second connection guide member 162 may also be used. In addition, a mounting head including a first connection guide member and a second connection guide member having a structure different from the structure shown in the figure may also be used.

[0109] Next, with reference to Figures 6 to 9 , the mounting head 200 according to another embodiment for implementing the method for mounting the bonding material attachment according to the present invention will be described.

[0110] Figure 6 is a perspective view of a mounting head according to another embodiment for implementing the method for mounting the bonding material attachment according to the present invention, Figure 7 is Figure 6 a separated perspective view of the mounting head shown in Figure 8 is Figure 6 a cross-sectional view taken along line VIII-VIII of the mounting head shown in Figure 9 is Figure 6 a cross-sectional view taken along line IX-IX of the mounting head shown in

[0111] Reference Figures 6 to 9 , the mounting head 200 according to another embodiment is the same as the mounting head 100 of the embodiment described with reference to Figures 2 to 5 above, and includes a head body 201, a first main nozzle 211, and a second main nozzle 221. The head body 201 includes a first wall member 210, a second wall member 220, a first connecting member 230, a second connecting member 240, a central chamber 202, and a cover member 250. In addition, the mounting head 200 of this embodiment further includes a first connecting member 230 and a second connecting member 240. In the following, the components with the same names as those of the mounting head 100 described with reference to Figures 2 to 5 above are omitted from specific description, and only different component symbols are given for description.

[0112] According to the mounting head 200 of this embodiment, a first outer nozzle 291 and a second outer nozzle 292 are respectively arranged outside the first main nozzle 211 and the second main nozzle 221.

[0113] The first outer nozzle 291 is formed in such a way as to extend along the length direction of the first wall member 210 at the lower part of the first wall member 210. The first outer nozzle 291 is arranged outside compared with the first main nozzle 211. The first outer nozzle 291 is formed in such a way as to penetrate the lower surface of the first wall member 210. Through the above structure, the first outer nozzle 291 is formed to be able to jet compressed gas toward the lower side of the first wall member 210.

[0114] The second outer nozzle 292 is formed in such a way as to extend along the length direction of the second wall member 220 at the lower part of the second wall member 220. The second outer nozzle 292 is arranged outside compared with the second main nozzle 221. The second outer nozzle 292 is formed in such a way as to penetrate the lower surface of the second wall member 220. Through the above structure, the second outer nozzle 292 is formed to be able to jet compressed gas toward the lower side of the second wall member 220.

[0115] In addition, the first outer nozzle 291, like the first main nozzle 211, is formed in such a way as to be inclined in a direction closer to the central chamber 202 as it goes toward the lower side of the first wall member 210. The second outer nozzle 292 is also, like the second main nozzle 221, formed in such a way as to be inclined in a direction closer to the central chamber 202 as it goes toward the lower side of the second wall member 220.

[0116] The first outer nozzle 291 and the second outer nozzle 292 as described above respectively assist the first main nozzle 211 and the second main nozzle 221. A gas flow from the outside to the inside of the central chamber 202 is formed through the gap between the head body 201 and the mask M. The conductive balls B inside the central chamber 202 are prevented from falling outside the central chamber 202 by the compressed gas ejected from the first outer nozzle 291 and the second outer nozzle 292 as described above. Additionally, depending on the situation, the compressed gas ejected from the first outer nozzle 291 and the second outer nozzle 292 serves to assist the pressure of the compressed gas ejected from the first main nozzle 211 and the second main nozzle 221 to guide the movement of the conductive balls B inside the central chamber 202 at a sufficient speed.

[0117] Additionally, depending on the situation, it is also possible to implement a mounting head in which the first outer nozzle 291 and the second outer nozzle 292 are formed in an inclined manner as described above and the first main nozzle and the second main nozzle are formed in the vertical direction. In this case, the compressed gas ejected vertically downward from the first main nozzle and the second main nozzle naturally flows into the central chamber 202 through the compressed gas in the inclined direction ejected from the first outer nozzle and the second outer nozzle.

[0118] The control unit 280 can perform step (d) and step (e) while adjusting the pressure of the first main nozzle 211 and the pressure of the second main nozzle 221 using various methods as described above. At this time, the control unit 280 can keep the pressure of the first outer nozzle 291 the same as the pressure of the second outer nozzle 292, and can also keep the pressure of the first outer nozzle 291 different from the pressure of the second outer nozzle 292.

[0119] Additionally, the control unit 280 can also guide the gas flow inside the central chamber 202 by making the pressure of the first outer nozzle 291 greater than the pressure of the second outer nozzle 292 and making the pressures of the first main nozzle 211 and the second main nozzle 221 the same as each other.

[0120] Additionally, in the case of this embodiment, as Figure 8 shown, the inclination angle of the first outer nozzle 291 with respect to the first wall member 210 and the inclination angle of the second outer nozzle 292 with respect to the second wall member 220 can be made the same as each other, or the inclination angle of the first outer nozzle 291 with respect to the first wall member 210 and the inclination angle of the second outer nozzle 292 with respect to the second wall member 220 can be made different from each other, and the change in the gas flow inside the central chamber 202 can be guided.

[0121] Additionally, in the case of this embodiment, as Figure 7As shown, the first guiding member 271 and the second guiding member 272 also each have a plurality of first guiding pins 2711 and a plurality of second guiding pins 2721. A plurality of first guiding grooves 2712 and a plurality of second guiding grooves 2722 are formed by the first guiding member 271 and the second guiding member 272 respectively arranged on the first main nozzle 211 and the second main nozzle 221. In the case of this embodiment, different from the mounting head described with reference to Figures 2 to 5 the plurality of first guiding pins 2711 and the plurality of second guiding pins 2721 do not incline more downward relative to the extending direction of the first wall member 210 and the second wall member 220 but extend in the vertical direction. As described above, the extending directions of the plurality of first guiding pins 2711 and the plurality of second guiding pins 2721 can be deformed differently as needed.

[0122] The mounting head 200 according to this embodiment, like the mounting head 100 described with reference to the foregoing Figures 2 to 5 can also be designed and changed in various forms.

Claims

1. A method for loading a bonding material attachment in a mounting groove formed in a mask, the method comprising: Step a: Horizontally arranging the mask ； Step b: Arranging a mounting head in a manner close to the upper surface of the mask, the mounting head comprising: A head body, comprising: A first wall member and a second wall member, arranged opposite to each other and extending horizontally in parallel; A first connecting member and a second connecting member, respectively connecting both ends of the first wall member and the second wall member; A central chamber, surrounded by the first wall member, the second wall member, the first connecting member, and the second connecting member to hold the bonding material attachment therein; and A cover member, covering the upper side of the central chamber; A first main nozzle, extending in the length direction of the first wall member at the lower part of the first wall member to discharge compressed gas to the inner lower part of the central chamber; and A second main nozzle, extending in the length direction of the second wall member at the lower part of the second wall member to discharge compressed gas to the inner lower part of the second wall member; Step c: Supplying the bonding material attachment to the central chamber of the mounting head; Step d: Discharging compressed gas through the first main nozzle and the second main nozzle of the mounting head respectively; and Step e: Horizontally moving the mounting head relative to the mask while performing step d so that the bonding material attachment in the central chamber of the mounting head is loaded into the mounting groove of the mask.

2. The method according to claim 1, performed using the mounting head, wherein The first main nozzle is formed to be inclined in a direction approaching the central chamber on the lower side of the first wall member, and the second main nozzle is formed to be inclined in a direction approaching the central chamber on the lower side of the second wall member.

3. The method according to claim 2, performed using the mounting head, wherein The first main nozzle is formed to communicate with the lower surface of the first wall member, and the second main nozzle is formed to communicate with the lower surface of the second wall member.

4. The method according to claim 2, performed using the mounting head, wherein The first main nozzle is formed to communicate with the wall surface at one side of the central chamber of the first wall member, and the second main nozzle is formed to communicate with the wall surface at the said side of the central chamber of the second wall member.

5. The method according to any one of claims 2 to 4, performed using the mounting head, wherein The inclination angle of the first main nozzle with respect to the first wall member and the inclination angle of the second main nozzle with respect to the second wall member are formed to be different from each other.

6. The method according to any one of claims 1 to 4, performed using the mounting head, wherein The first main nozzle includes a plurality of first guiding grooves arranged in a direction in which the first wall member extends to guide the discharge direction of compressed gas, and the second main nozzle includes a plurality of second guiding grooves arranged in a direction in which the second wall member extends to guide the discharge direction of compressed gas.

7. The method according to claim 6, carried out using the mounting head, wherein The plurality of first guiding grooves of the first main nozzle are formed to be inclined and extend in a direction in which the first wall member extends downward, and the plurality of second guiding grooves of the second main nozzle are formed to be inclined and extend in a direction in which the second wall member extends downward.

8. The method according to claim 7, carried out using the mounting head, wherein The plurality of first guiding grooves of the first main nozzle are formed by a plurality of first guiding pins arranged on the first main nozzle, and the plurality of second guiding grooves of the second main nozzle are formed by a plurality of second guiding pins arranged on the second main nozzle.

9. The method according to claim 7, carried out using the mounting head, wherein The plurality of first guiding grooves of the first main nozzle and the plurality of second guiding grooves of the second main nozzle are formed to be inclined in opposite directions.

10. The method according to any one of claims 1 to 4, wherein In step d, The pressures of the compressed gas supplied to the first main nozzle and the second main nozzle of the mounting head are independently adjusted to discharge the compressed gas.

11. The method according to claim 10, wherein In step d, The pressures of the compressed gas supplied to the first main nozzle and the second main nozzle of the mounting head are discharged differently from each other.

12. The method according to claim 11, wherein In step e, the mounting head is moved in a direction perpendicular to the first wall member and the second wall member, In step d, while maintaining the pressure of the nozzle located in front of the moving direction of the mounting head among the first main nozzle and the second main nozzle to be greater than the pressure of the nozzle located behind the moving direction of the mounting head, the compressed gas is discharged.

13. The method according to claim 10, wherein In step d, The pressures of the compressed gas supplied to the first main nozzle and the second main nozzle of the mounting head are discharged in a pulse form.

14. The method according to claim 10, carried out using the mounting head, wherein The first main nozzle includes a plurality of first guiding grooves arranged along the extending direction of the first wall member to guide the discharge direction of compressed gas, and the second main nozzle includes a plurality of second guiding grooves arranged along the extending direction of the second wall member to guide the discharge direction of compressed gas.

15. The method according to claim 14, carried out using the mounting head, wherein The plurality of first guiding grooves of the first main nozzle are formed to be inclined and extend in a direction in which the first wall member extends downward, and the plurality of second guiding grooves of the second main nozzle are formed to be inclined and extend in a direction in which the second wall member extends downward.

16. The method according to claim 15, implemented using the mounting head, wherein the plurality of first guiding grooves of the first main nozzle are formed by a plurality of first guiding pins arranged on the first main nozzle, and the plurality of second guiding grooves of the second main nozzle are formed by a plurality of second guiding pins arranged on the second main nozzle.

17. The method according to claim 16, implemented using the mounting head, wherein the plurality of first guiding grooves of the first main nozzle and the plurality of second guiding grooves of the second main nozzle are formed to be inclined in opposite directions to each other.

18. The method according to any one of claims 1 to 4, implemented using the mounting head, the mounting head further comprising: a first outer nozzle formed to extend along the length direction of the lower part of the first wall member outside the first main nozzle so as to be able to discharge compressed gas in the downward direction of the first wall member; and a second outer nozzle formed to extend along the length direction of the lower part of the second wall member outside the second main nozzle so as to be able to discharge compressed gas in the downward direction of the second wall member.

19. The method according to claim 18, implemented using the mounting head, wherein the first outer nozzle is formed to be inclined in a direction closer to the central chamber as it goes downward of the first wall member, the second outer nozzle is formed to be inclined in a direction closer to the central chamber as it goes downward of the second wall member.

20. The method according to claim 19, implemented using the mounting head, wherein the first outer nozzle is formed to communicate with the lower surface of the first wall member, the second outer nozzle is formed to communicate with the lower surface of the second wall member.

21. The method according to claim 20, implemented using the mounting head, wherein the inclination angle of the first outer nozzle with respect to the first wall member and the inclination angle of the second outer nozzle with respect to the second wall member are formed to be different from each other.

22. The method according to claim 19, wherein in step d, the pressures of the compressed gas supplied to the first main nozzle, the second main nozzle, the first outer nozzle, and the second outer nozzle of the mounting head are independently adjusted to discharge the compressed gas.

23. The method according to claim 22, wherein in step d, the pressures of the compressed gas supplied to the first main nozzle and the second main nozzle of the mounting head are discharged to be different from each other.

24. The method according to claim 23, wherein in step e, the mounting head is transferred in a direction perpendicular to the first wall member and the second wall member, In step d, compressed gas is discharged while maintaining the pressure of the nozzle among the first main nozzle and the second main nozzle that is in front of the transfer direction of the mounting head to be greater than the pressure of the nozzle that is behind the transfer direction of the mounting head.

25. The method according to claim 22, wherein in step d, the pressure of the compressed gas supplied to the first main nozzle and the second main nozzle of the mounting head is discharged in a pulse form.

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