Embedded shunting micro-channel radiator of electronic chip

Abstract

The invention discloses an embedded shunt micro-channel radiator of an electronic chip, and particularly relates to the technical field of heat dissipation devices.The embedded shunt micro-channel radiator comprises two first protective shells distributed in a bilateral symmetry mode, second protective shells are arranged on the lower sides of the two first protective shells, and circulating assemblies are fixedly installed on the inner surfaces of the two first protective shells; the ends, close to each other, of the two first protective shells and the ends, close to each other, of the two second protective shells are each fixedly provided with three heat exchange assemblies in a linear array mode. According to the embedded shunting micro-channel radiator of the electronic chip, through the arranged circulation assembly, sufficient heat exchange can be conducted on cooling liquid when the cooling liquid conducts heat exchange on the chip, so that the heat dissipation efficiency of the chip is improved, through the arranged heat exchange assembly, heat dissipation can be conducted on the cooling liquid in the heat exchange pipeline, and the heat dissipation efficiency of the chip is improved. And in the heat exchange process, through the arrangement of the special shape, the heat exchange efficiency with external air can be improved, so that the heat dissipation efficiency of the cooling liquid and the chip is improved.

Description

Technical Field

[0001] The invention relates to the technical field of heat dissipation devices, and in particular to an embedded shunt microchannel heat sink for an electronic chip. Background Art

[0002] Embedded split flow microchannel heat sink is a highly efficient technology for heat dissipation of electronic chips. It embeds micro channels into the heat sink to establish efficient heat conduction channels between the chip surface and the heat sink. The channels contain liquids, such as water or other coolants, which flow through these channels to take away the heat generated by electronic components.

[0003] Compared with traditional heat sinks, split-flow microchannel heat sinks have higher thermal management efficiency. Due to the high surface area and small size of the microchannel, it can significantly increase the heat conduction speed and reduce thermal resistance. In addition, the embedded design enables the heat sink to be closely integrated with the electronic chip, effectively avoiding heat concentration, thereby improving the stability and performance of the chip. This technology is particularly suitable for electronic products with high power density or requiring precise heat dissipation, such as high-performance processors, power amplifiers and high-efficiency power modules.

[0004] Chinese patent document CN118263209A discloses an embedded flow-dividing microchannel heat sink for electronic chips, which belongs to the field of heat sinks. Multiple flow-dividing micro-units are arranged in the flow channel. The flow-dividing micro-units include concave holes and spoiler structures. The spoilers are widened from the inlet to the outlet, and are staggered from left to right. The staggered gradual periodic arrangement design effectively avoids the long distance between the two groups of microstructures. The spoiler gradually widens along the flow direction, so that the coolant can be more fully utilized, and the high-temperature and low-temperature areas on the heat exchange surface of the microchannel heat sink are significantly reduced. The above patent document helps to reduce the temperature gradient along the flow direction, making the temperature distribution on the heat dissipation surface more uniform, thereby reducing the generation of thermal stress. In addition, this embedded structure is small in size and light in weight. The chip heat source and the heat sink are close to each other with a large temperature difference, and the heat dissipation efficiency is high.

[0005] Although the device in the above patent document can dissipate heat for the chip during use, it lacks the effect of circulating cooling of the liquid after the heat is dissipated in actual process, which may cause the coolant to always be in a high temperature state, thereby causing the chip temperature to be too high and cause overload. Summary of the invention

[0006] The main purpose of the present invention is to provide an embedded split-flow microchannel heat sink for an electronic chip, which can effectively solve the problem of lack of circulating cooling of the liquid after heat dissipation in the actual process, which may cause the coolant to always be in a high temperature state, thereby causing the chip temperature to be too high and cause overload.

[0007] To achieve the above object, the technical solution adopted by the present invention is:

[0008] An embedded shunt microchannel radiator for an electronic chip, comprising two protective cases I distributed symmetrically left and right. A protective case II is provided at the lower side of each of the two protective cases I. A one-way valve is fixedly connected to the common end of the protective case I on the left and the protective case II on the left that are close to each other. Support platforms are fixedly connected to the sides close to each other at the right ends of the protective case I on the right and the protective case II on the right. A micro booster pump is fixedly connected to the common end of the two support platforms close to each other. Circulation components are fixedly installed on the inner surfaces of the two protective cases I. Three heat exchange components are fixedly installed in a linear array at the ends of the two protective cases I close to each other and at the ends of the two protective cases II close to each other. Three mounting holes are linearly arrayed and opened at the ends of the two protective cases I close to each other and at the ends of the two protective cases II close to each other.

[0009] Preferably, the circulation component includes two L-shaped rods I fixedly connected to the bottom walls of the two protective cases I. The two L-shaped rods I are distributed symmetrically left and right. Two L-shaped rods II are fixedly connected to the top walls of the two protective cases II. Three connecting pipes are fixedly connected in a linear array to the sides close to each other on the outer surfaces of the two L-shaped rods I and the sides close to each other on the outer surfaces of the two L-shaped rods II. Heat exchange pipes are fixedly connected to the common ends of the connecting pipes on the left and the connecting pipes on the right that are close to each other. A liquid adding pipe is fixedly connected to the upper part of the outer surface of the L-shaped rod I on the left. The upper part of the outer surface of the liquid adding pipe penetrates through the protective case I on the same side and extends to the outside. A threaded cap is threadedly connected to the upper end of the liquid adding pipe. A flow disturbing component is fixedly installed on the inner surface of the L-shaped rod I on the right. A connecting component is fixedly installed at the lower part of the inner surface of the L-shaped rod I on the right. The connecting pipes on the same side are respectively located on the inner surfaces of the mounting holes on the same side.

[0010] Preferably, the lower end of the L-shaped rod I on the left is fixedly connected to the output end of the one-way valve, the upper end of the L-shaped rod II on the left is fixedly connected to the input end of the one-way valve, and the upper end of the L-shaped rod II on the right is fixedly connected to the output end of the micro booster pump.

[0011] Preferably, the flow disturbing component includes a mounting rod fixedly connected to the upper part of the inner surface of the L-shaped rod I on the right. Two hollow cylinders are rotatably connected to the outer surface of the mounting rod in a linear array. Rotating columns are fixedly connected to the outer surfaces of the two hollow cylinders. A number of stirring blades are fixedly connected in an annular array to the outer surfaces of the two rotating columns.

[0012] Preferably, a number of flow disturbing blocks are fixedly connected in a linear array to the inner surface of the L-shaped rod I on the right.

[0013] Preferably, both of the two rotating columns are conically arranged, and a number of the stirring blades are all arc-shaped.

[0014] Preferably, the connection component includes a main pipe, the outer surface of the main pipe is fixedly connected to the lower part of the inner surface of the first L-shaped rod, a secondary pipe is fixedly connected to the lower part of the inner surface of the main pipe, and the secondary pipe is fixedly connected to the input end of the micro booster pump.

[0015] Preferably, the heat exchange component includes six special-shaped heat exchange fins. The left and right ends of the three special-shaped heat exchange fins on the upper side are respectively fixedly connected to the right end of the first protective shell on the left side and the right end of the first protective shell on the right side. The left and right ends of the three special-shaped heat exchange fins on the lower side are respectively fixedly connected to the right end of the second protective shell on the left side and the right end of the first protective shell on the right side. Placement holes penetrating from the left side of the inner surface to the right side are formed in the inner surfaces of the six special-shaped heat exchange fins.

[0016] Preferably, the six heat exchange pipes are respectively located inside the six placement holes, and the six special-shaped heat exchange fins are all arranged in a plurality of X shapes.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. Through the circulation component provided in the present invention, when the coolant exchanges heat with the chip, the coolant can be fully heat-exchanged, thereby improving the heat dissipation efficiency of the chip. Moreover, during the heat dissipation process, the effect of circulating heat exchange can be achieved in cooperation with the one-way valve and the micro booster pump.

[0019] 2. Through the heat exchange component provided in the present invention, the coolant inside the heat exchange pipeline can be dissipated, and during the heat exchange process, through its special shape setting, the heat exchange efficiency with the external air can be improved, thereby improving the subsequent heat dissipation efficiency of the coolant and the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 is a schematic diagram of the overall structure of another perspective of the present invention;

[0022] Figure 3 is a schematic diagram of the complete position of the circulation component structure of the present invention;

[0023] Figure 4 is a schematic diagram of the partial structure cross-section of the present invention;

[0024] Figure 5 is a schematic diagram of the heat exchange component structure of the present invention;

[0025] Figure 6 is a schematic diagram of the partial structure of the circulation component of the present invention;

[0026] Figure 7 Schematic diagram of the half-sectional structure of the spoiler component of the present invention;

[0027] Figure 8 Schematic diagram of the structure of the spoiler component of the present invention;

[0028] Figure 9 Schematic diagram of the local structural section of the present invention;

[0029] Figure 10 For the present invention Figure 4 Enlarged schematic diagram of the structure at position A in the present invention.

[0030] In the figure: 1. First protective shell; 2. Second protective shell; 3. Check valve; 4. Support platform; 5. Micro booster pump; 6. Circulation component; 61. First L-shaped rod; 60. Second L-shaped rod; 62. Connecting pipe; 63. Heat exchange pipe; 64. Liquid adding pipe; 65. Threaded cap; 66. Spoiler component; 661. Mounting rod; 662. Hollow cylinder; 663. Rotating column; 664. Stirring blade; 665. Spoiler block; 67. Connecting component; 671. Main pipe; 672. Sub-pipe; 7. Heat exchange component; 71. Special-shaped heat exchange fins; 72. Placing hole; 8. Mounting hole. Specific embodiments

[0031] In order to make the technical means, creative features, achieved purposes and functions of the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0032] Embodiment 1, as Figure 1 And Figure 2 Shown, an embedded shunt microchannel radiator for an electronic chip includes two first protective shells 1 distributed symmetrically left and right. At the lower sides of both first protective shells 1, there are second protective shells 2. At one end where the left first protective shell 1 and the left second protective shell 2 are close to each other, a check valve 3 is fixedly connected. At one side where the right ends of the right first protective shell 1 and the right second protective shell 2 are close to each other, a support platform 4 is fixedly connected. At one end where the two support platforms 4 are close to each other, a micro booster pump 5 is fixedly connected. On the inner surfaces of both first protective shells 1, a circulation component 6 is fixedly installed. By setting the circulation component 6, when the coolant exchanges heat with the chip, the coolant can be fully exchanged, thereby improving the heat dissipation efficiency of the chip. And during the heat dissipation process, the effect of circulating heat exchange can be achieved in cooperation with the check valve 3 and the micro booster pump 5;

[0033] At one end where the two first protective shells 1 are close to each other and at one end where the two second protective shells 2 are close to each other, three heat exchange components 7 are fixedly installed in a linear array. By setting the heat exchange components 7, the coolant inside the heat exchange pipeline can be dissipated, and during the heat exchange process, through its special shape setting, the heat exchange efficiency with the external air can be improved, thereby improving the subsequent heat dissipation efficiency of the coolant and the chip;

[0034] Three mounting holes 8 are linearly arrayed at one end where two protective cases one 1 are close to each other and one end where two protective cases two 2 are close to each other.

[0035] Embodiment 2, on the basis of Embodiment 1, for the purpose of effectively exchanging heat of the chip.

[0036] Specifically, refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 and Figure 9 The circulation component 6 includes a first L-shaped rod 61 fixedly connected to the bottom wall of two protective cases one 1. The two first L-shaped rods 61 are symmetrically distributed left and right. Two second L-shaped rods 60 are fixedly connected to the top walls of two protective cases two 2. Three connecting pipes 62 are fixedly connected in a linear array on one side where the outer surfaces of the two first L-shaped rods 61 are close to each other and one side where the outer surfaces of the two second L-shaped rods 60 are close to each other. One end where the connecting pipe 62 on the left side and the connecting pipe 62 on the right side are close to each other are fixedly connected with a heat exchange pipe 63. A liquid adding pipe 64 is fixedly connected to the upper part of the outer surface of the left first L-shaped rod 61. The upper part of the outer surface of the liquid adding pipe 64 penetrates through the same-side protective case one 1 and extends to the outside. A threaded cap 65 is threadedly connected to the upper end of the liquid adding pipe 64. A flow disturbing component 66 is fixedly installed on the inner surface of the right first L-shaped rod 61. A connecting component 67 is fixedly installed on the lower part of the inner surface of the right first L-shaped rod 61. The same-side connecting pipes 62 are respectively located on the inner surface of the same-side mounting holes 8.

[0037] Further, the lower end of the left first L-shaped rod 61 is fixedly connected to the output end of the one-way valve 3. The upper end of the left second L-shaped rod 60 is fixedly connected to the input end of the one-way valve 3. The upper end of the right second L-shaped rod 60 is fixedly connected to the output end of the micro booster pump 5.

[0038] Further, the connecting component 67 includes a main pipe 671. The outer surface of the main pipe 671 is fixedly connected to the lower part of the inner surface of the first L-shaped rod 61. A sub-pipe 672 is fixedly connected to the lower part of the inner surface of the main pipe 671. The sub-pipe 672 is fixedly connected to the input end of the micro booster pump 5.

[0039] Further, the heat exchange component 7 includes six special-shaped heat exchange fins 71. The left and right ends of the three upper special-shaped heat exchange fins 71 are respectively fixedly connected to the right end of the left protective case one 1 and the right end of the right protective case one 1. The left and right ends of the three lower special-shaped heat exchange fins 71 are respectively fixedly connected to the right end of the left protective case two 2 and the right end of the right protective case one 1. A placement hole 72 penetrating from the left inner surface to the right inner surface is opened on the left inner surface of the six special-shaped heat exchange fins 71.

[0040] Further, the six heat exchange tubes 63 are respectively located inside the six placement holes 72, and the six special-shaped heat exchange fins 71 are all arranged in a number of X shapes.

[0041] Before using the device, the rear ends of the first protective case 1 and the second protective case 2 can be installed on both sides of the chip by means of buckles or any clamping methods in the prior art. Usually, some common installation means in the prior art such as bolts and clamps are used to install on both sides of the chip to ensure stable contact.

[0042] Therefore, the above installation methods are all conventional designs in the prior art. In this solution, it is only necessary to satisfy the installation of the first protective case 1 and the second protective case 2 on both sides of the chip, and this solution will not be elaborated in detail.

[0043] After installing the first protective case 1 and the second protective case 2 on both sides of the chip, at this time, the rear ends of the six heat exchange components 7 are all attached to the chip surface. As can be seen from the above, the six special-shaped heat exchange fins 71 are all arranged in a number of X shapes. By setting the special-shaped heat exchange fins 71 in an X shape compared with the traditional linear special-shaped heat exchange fins 71, the heat dissipation surface area can be effectively increased, more surfaces are exposed to the air, thereby improving the heat conduction and dissipation efficiency. The X-shaped design helps to optimize the air flow path, making the air flow more evenly through the heat dissipation fins, reducing dead corners and the situation of too fast local air flow, thereby improving the heat dissipation efficiency. By increasing the surface area and improving the air flow, the X-shaped special-shaped heat exchange fins 71 can effectively improve the heat dissipation performance. Especially in the case of high heat load, it can take away heat more quickly and reduce the temperature.

[0044] When starting the micro-booster pump 5, as described above, the lower end of the left L-shaped rod one 61 is fixedly connected to the output end of the one-way valve 3, the upper end of the left L-shaped rod two 60 is fixedly connected to the input end of the one-way valve 3, the upper end of the right L-shaped rod two 60 is fixedly connected to the output end of the micro-booster pump 5, and the auxiliary pipe 672 is fixedly connected to the input end of the micro-booster pump 5. Therefore, the output end of the micro-booster pump 5 can transmit the coolant inside the right L-shaped rod one 61 from the main pipe 671 and the auxiliary pipe 672 to the L-shaped rod two 60 fixedly connected to its input end. The thrust generated during transmission can transmit the coolant from the three heat exchange tubes 63 on the lower side into the L-shaped rod two 60 on the right side. The six heat exchange tubes 63 are respectively located inside the six placement holes 72. Therefore, during the process of the coolant flowing from the three heat exchange tubes 63 on the lower side into the left L-shaped rod two 60, under the heat exchange effect of the special-shaped heat exchange fins 71, the heat inside the heat exchange tubes 63 can be exchanged into the air, thereby reducing the temperature of the coolant. Subsequently, the left L-shaped rod two 60 is pushed upward by the thrust of the output end of the micro-booster pump 5 and transmitted into the input end of the one-way valve 3, and then transmitted again from the output end of the one-way valve 3 into the left L-shaped rod one 61, and then pumped into the three heat exchange tubes 63 on the upper side. The heat exchange process between the three heat exchange tubes 63 on the upper side and the special-shaped heat exchange fins 71 is the same as the above heat exchange process. For specific reference to the above operation steps, no more details will be described here. The coolant after heat exchange in the three heat exchange tubes 63 on the upper side will be sucked into the right L-shaped rod one 61 again by the input end of the micro-booster pump 5 for reciprocating work, and the one-way valve 3 can prevent the coolant from flowing back into the L-shaped rod two 60 fixedly connected to its output end;

[0045] When the coolant needs to be added after long-term use, just rotate and open the threaded cap 65, add the coolant from the liquid adding pipe 64 into the left L-shaped rod one 61, and then rotate and close the threaded cap 65;

[0046] Therefore, by the cooperation of the set circulation component 6 and the heat exchange component 7, heat exchange and heat dissipation treatment can be realized for the coolant after heat exchange on the chip surface, thereby improving the subsequent heat dissipation efficiency of the chip.

[0047] Both the above-mentioned one-way valve 3 and the micro-booster pump 5 are conventional designs in the prior art, and their specific working principles are as follows:

[0048] One-way valve 3:

[0049] When the fluid flows in the designed direction, the fluid pressure pushes the valve flap or valve plate open, and the fluid can freely pass through the one-way valve 3. When the fluid flows, the valve flap inside the one-way valve 3 is pushed open by the pressure, allowing the fluid to flow through the valve seat;

[0050] When the fluid attempts to flow in the reverse direction, the fluid pressure acts in the opposite direction on the valve flap, causing the valve flap to close or closely contact the valve seat, preventing the fluid from passing through the check valve 3. At this time, the check valve 3 functions as a check valve to prevent the reverse flow of the fluid.

[0051] Micro booster pump 5:

[0052] When the micro booster pump 5 is started, the intake port or the liquid inlet of the micro booster pump 5 begins to suck in liquid or gas from the outside. According to the type of the pump, for the liquid or gas, the working elements inside the micro booster pump 5, such as pistons, diaphragms, gears, screws, etc., start to move, sucking the fluid into the pump chamber;

[0053] Through the mechanical structure inside the micro booster pump 5, such as pistons, diaphragms, gears, etc., the fluid is compressed or pushed into a smaller space. During this process, the fluid inside the micro booster pump 5 is compressed by the mechanical movement, resulting in an increase in the fluid pressure.

[0054] Therefore, both the above-mentioned check valve 3 and the micro booster pump 5 are conventional settings in the prior art, and their specific installation methods, circuit connection methods, and control methods are all conventional designs, and will not be elaborated in detail in this solution.

[0055] Embodiment 3. On the basis of Embodiment 2, this embodiment aims to achieve the purpose of disturbing the flow and dissipating heat of the coolant after heat exchange.

[0056] Specifically, referring to Figure 4 、 Figure 7 、 Figure 8 and Figure 10 ,the flow disturbing component 66 includes a mounting rod 661 fixedly connected to the upper part of the inner surface of the right L-shaped rod 61. Two hollow cylinders 662 are rotatably connected to the outer surface of the mounting rod 661 in a linear array. Rotating columns 663 are fixedly connected to the outer surfaces of the two hollow cylinders 662. A plurality of stirring blades 664 are fixedly connected to the outer surfaces of the two rotating columns 663 in an annular array.

[0057] Furthermore, a plurality of flow disturbing blocks 665 are fixedly connected to the inner surface of the right L-shaped rod 61 in a linear array.

[0058] Furthermore, both of the two rotating columns 663 are tapered, and all of the plurality of stirring blades 664 are arc-shaped.

[0059] When the three heat exchange tubes 63 on the upper side suck the coolant after heat exchange through the input end of the micro booster pump 5 into the first L-shaped rod 61 on the right side, since the two rotating columns 663 are respectively located under the uppermost heat exchange tube 63 and the heat exchange tube 63 in the middle of the upper side, and the two rotating columns 663 are both conically arranged, and several stirring blades 664 are all arc-shaped, when the coolant impacts the surface of the rotating column 663, the water flow follows the surface of the rotating column 663 and impacts on the surface of several stirring blades 664. The kinetic energy and pressure of the water flow act on the surface of several stirring blades 664, and several stirring blades 664 are arc-shaped. Therefore, the water flow can push several stirring blades 664 to drive the rotating column 663 and the hollow cylinder 662 to rotate on the surface of the mounting rod 661, generating mechanical energy, so as to achieve the effect of stirring the heat-exchanged coolant. After the coolant is stirred, the temperature inside it can be kept consistent, avoiding the situation that the temperature at the head and tail is inconsistent, resulting in the reduction of the subsequent heat exchange effect;

[0060] And in this solution, a number of flow disturbing blocks 665 are fixedly connected in a linear array on the inner surface of the first L-shaped rod 61 on the right side, so that when the coolant enters the first L-shaped rod 61 on the right side, the coolant will impact the surface of a number of flow disturbing blocks 665, thereby generating a flow disturbing effect. The flow disturbance can change the flow path of the coolant, reduce the stagnant flow area near the heat exchange surface, and thus improve the convective heat transfer ability between the coolant and the heat exchange surface. Through the flow disturbance, the flow of the coolant becomes more irregular, generating more turbulence, which helps to improve the heat exchange efficiency of the fluid, because the turbulence can effectively enhance the heat transfer between the fluid and the hot surface;

[0061] The flow disturbance increases the flow instability of the fluid, prompting the coolant to form a turbulent flow. The turbulence can break the boundary layer of the coolant, enabling the heat to be carried away from the heat source surface faster, reducing the thermal resistance. The increase in the turbulence of the fluid makes the distribution of heat in the coolant more uniform, thereby enhancing the overall cooling efficiency. Compared with the laminar flow, the turbulence can effectively promote the heat transfer;

[0062] The flow disturbance can also help the coolant flow more evenly, avoiding the phenomenon of local overheating or overcooling when the coolant flows through the heat exchange surface. Without the flow disturbance, the flow of the coolant may cause higher temperatures in some areas, resulting in uneven heat exchange and affecting the overall cooling effect. Through the flow disturbance, the flow rate and temperature distribution of the coolant are balanced, avoiding these problems and ensuring the stable operation of the heat exchange process.

[0063] The foregoing has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments, and what is described in the above embodiments and the specification is only to illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. An embedded shunt microchannel radiator for an electronic chip, comprising two protective cases 1 which are symmetrically distributed left and right, and characterized in that: A protective shell 2 (2) is provided on the lower side of the two protective shells 1 (1); a one-way valve (3) is fixedly connected to one end of the protective shell 1 (1) on the left side and the protective shell 2 (2) on the left side, and a support platform (4) is fixedly connected to one side of the right end of the protective shell 1 (1) on the right side and the protective shell 2 (2) on the right side, and a micro booster pump (5) is fixedly connected to one end of the two support platforms (4) close to each other; a circulation component (6) is fixedly installed on the inner surface of the two protective shells 1 (1); three heat exchange components (7) are fixedly installed in a linear array at one end of the two protective shells 1 (1) close to each other and one end of the two protective shells 2 (2) close to each other; three mounting holes (8) are opened in a linear array at one end of the two protective shells 1 (1) close to each other and one end of the two protective shells 2 (2) close to each other.

2. The embedded shunt microchannel heat sink for an electronic chip according to claim 1, characterized in that: The circulation assembly (6) comprises two L-shaped rods (61) fixedly connected to the bottom walls of the protective shells (1), the two L-shaped rods (61) being symmetrically distributed on the left and right, the top walls of the two protective shells (2) being fixedly connected to the L-shaped rods (60), the sides of the outer surfaces of the two L-shaped rods (61) close to each other and the sides of the outer surfaces of the two L-shaped rods (60) close to each other are both fixedly connected to three connecting tubes (62) in a linear array, and the ends of the connecting tubes (62) on the left and the connecting tubes (62) on the right close to each other are both fixedly connected to the L-shaped rods (60) on the top walls. A heat exchange tube (63) is connected, a liquid adding tube (64) is fixedly connected to the upper portion of the outer surface of the L-shaped rod (61) on the left side, the upper portion of the outer surface of the liquid adding tube (64) penetrates the protective shell (1) on the same side and extends to the outside, a threaded cover (65) is threadedly connected to the upper end of the liquid adding tube (64), a spoiler assembly (66) is fixedly installed on the inner surface of the L-shaped rod (61) on the right side, a connecting assembly (67) is fixedly installed on the lower portion of the inner surface of the L-shaped rod (61) on the right side, and the connecting tubes (62) on the same side are respectively located on the inner surface of the mounting hole (8) on the same side.

3. The embedded shunt microchannel heat sink for an electronic chip according to claim 2, characterized in that: The lower end of the L-shaped rod 1 (61) on the left side is fixedly connected to the output end of the one-way valve (3), the upper end of the L-shaped rod 2 (60) on the left side is fixedly connected to the input end of the one-way valve (3), and the upper end of the L-shaped rod 2 (60) on the right side is fixedly connected to the output end of the micro booster pump (5).

4. An embedded shunt microchannel heat sink for an electronic chip according to claim 3, characterized in that: The spoiler assembly (66) includes a mounting rod (661) fixedly connected to the upper inner surface of the L-shaped rod (61) on the right side, the outer surface of the mounting rod (661) is rotatably connected to two hollow cylinders (662) in a linear array, the outer surfaces of the two hollow cylinders (662) are fixedly connected to rotating columns (663), and the outer surfaces of the two rotating columns (663) are fixedly connected to a plurality of stirring blades (664) in a circular array.

5. An embedded shunt microchannel heat sink for an electronic chip according to claim 4, characterized in that: The inner surface of the L-shaped rod (61) located on the right side is linearly arrayed and fixedly connected with several interference flow blocks (665).

6. An embedded shunt microchannel heat sink for an electronic chip according to claim 4, wherein: Both of the two rotating columns (663) are conical, and a plurality of the stirring blades (664) are all arc-shaped.

7. An embedded shunt microchannel heat sink for an electronic chip according to claim 1, characterized in that: The connecting component (67) includes a main pipe (671), the outer surface of the main pipe (671) is fixedly connected to the lower part of the inner surface of the L-shaped rod one (61), a secondary pipe (672) is fixedly connected to the lower part of the inner surface of the main pipe (671), and the secondary pipe (672) is fixedly connected to the input end of the micro booster pump (5).

8. An embedded shunt microchannel heat sink for an electronic chip according to claim 2, characterized in that: The heat exchange component (7) includes six special-shaped heat exchange fins (71). The left and right ends of the three special-shaped heat exchange fins (71) located on the upper side are respectively fixedly connected to the right end of the protection shell one (1) on the left side and the right end of the protection shell one (1) on the right side. The left and right ends of the three special-shaped heat exchange fins (71) located on the lower side are respectively fixedly connected to the right end of the protection shell two (2) on the left side and the right end of the protection shell one (1) on the right side. Placing holes (72) penetrating from the left side of the inner surface to the right side are formed in the left sides of the inner surfaces of the six special-shaped heat exchange fins (71).

9. An embedded shunt microchannel heat sink for an electronic chip according to claim 8, characterized in that: Six of the heat exchange tubes (63) are respectively located inside the six placing holes (72), and the six special-shaped heat exchange fins (71) are all arranged in a plurality of X shapes.

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