Air-cooled radiator for evaporative electronic chip

Abstract

The utility model belongs to the field of air cooling radiators, and particularly relates to an air cooling radiator for an evaporative electronic chip, which comprises a heat conducting plate and a cooling fan, a mounting plate is arranged on the heat conducting plate, a mounting groove is formed in the top of the mounting plate, an arc-shaped block is fixedly connected to the inner wall of the mounting groove, and a clamping groove is formed in the bottom of the arc-shaped block; through the design of the structures such as the mounting groove, the arc-shaped block, the notch, the positioning plate and the convex edge, when the cooling fan is mounted, the convex edge is aligned with the notch and then the cooling fan is pressed downwards, so that the positioning plate extrudes the supporting plate to descend, meanwhile, after the positioning plate is rotated, the convex edge is rotated to the bottom of the arc-shaped block from the notch position, and after the cooling fan is loosened, under the action of the spring, the cooling fan is pressed downwards. The supporting plate abuts against the positioning plate so that the cooling fan can be positioned and installed, when the cooling fan needs to be maintained or replaced, the cooling fan can be easily disassembled without a tool, operation steps are greatly simplified, and time and labor cost are saved.

Description

Technical Field

[0001] This utility model relates to the field of air-cooled heat sinks, specifically an evaporative air-cooled heat sink for electronic chips. Background Technology

[0002] Chip evaporation is an important microelectronics manufacturing technology widely used in chip manufacturing. It involves evaporating materials on the chip surface and depositing them into a film to create functional devices. Specifically, it involves heating and evaporating liquid metal materials into vapor, which is then condensed on the chip surface to form a metal film. These chips generate a lot of heat during operation, and effective heat dissipation methods are necessary to ensure stable operation. Air cooling is a common method, using a cooling fan to remove heat and achieve a cooling effect. A Chinese utility model patent (publication number: CN220020233U) discloses a heat sink for electronic hardware. By incorporating a fan assembly, the fan can be flexibly disassembled, improving the heat sink's heat dissipation efficiency.

[0003] The above-mentioned device has good heat dissipation efficiency during use, and the cooling fan can be disassembled. However, there are still some shortcomings: Specifically, in some small electronic devices, when the cooling fan needs to be disassembled for maintenance or replacement, the operator needs to use tools to remove the fastening nuts one by one, which is cumbersome and time-consuming. In addition, due to the limited internal space of electronic devices, the operator's operating space is also limited, making the disassembly process more difficult. Therefore, in view of the above situation, an evaporative air-cooled heat sink for electronic chips is proposed. Utility Model Content

[0004] To overcome the problem of the cumbersome and time-consuming disassembly process of existing heat dissipation fans, this utility model proposes an evaporative air-cooled heat sink for electronic chips.

[0005] The technical solution adopted by this utility model to solve its technical problem is: an evaporative electronic chip air-cooled heat sink, including a heat-conducting plate and a heat dissipation fan. A mounting plate is provided on the heat-conducting plate. A mounting groove is opened on the top of the mounting plate. An arc-shaped block is fixedly connected to the inner wall of the mounting groove. A slot is opened at the bottom of the arc-shaped block. There are three arc-shaped blocks, which are distributed in a circular array on the mounting groove. There is a gap between two connected arc-shaped blocks. Multiple springs are fixedly connected in a circular array to the bottom surface of the inner wall of the mounting groove. A support plate is fixedly connected to the top of the multiple springs.

[0006] A positioning plate is fixedly connected to the outer wall of the cooling fan. The positioning plate has a circular structure and three protruding edges are fixedly connected to the outer wall of the positioning plate. The three protruding edges are evenly distributed on the positioning plate, and the top of each of the three protruding edges has a protrusion.

[0007] When the positioning plate is assembled on the mounting groove, the protrusion engages with the slot, the top of the protruding edge abuts against the bottom of the arc-shaped block, and the bottom of the positioning plate abuts against the top of the support plate.

[0008] Preferably, the bottom of the mounting plate has several through holes, all of which are connected to the mounting groove.

[0009] Preferably, the top of the tray has several perforated holes.

[0010] Preferably, the top of the heat-conducting plate is provided with several heat dissipation fins, and the heat-conducting plate is also provided with a liquid cooling pipe, with a water pump connected to the end of the liquid cooling pipe away from the heat-conducting plate.

[0011] Preferably, a support rod is fixedly connected to the corner of the top of the heat-conducting plate, and a mounting plate is fixedly connected to the top of the four support rods. There is a gap between the bottom of the mounting plate and the heat dissipation fins.

[0012] Preferably, the water pump has an inlet pipe and an outlet pipe, which are fixedly connected to the liquid cooling pipe.

[0013] Preferably, the protruding edge is a fan-shaped block, the protruding edge is integrally formed with the positioning plate, and the protrusion is a circular column structure.

[0014] Preferably, the surface of the spring has an insulating coating.

[0015] The advantages of this utility model are:

[0016] 1. This utility model, through the design of a structure including an installation groove, an arc-shaped block, a notch, a positioning plate, and a protruding edge, allows for easy installation of the cooling fan. When the protruding edge is aligned with the notch and the cooling fan is pressed down, the positioning plate presses down on the support plate. Simultaneously, rotating the positioning plate causes the protruding edge to rotate from the notch position to the bottom of the arc-shaped block. After releasing the cooling fan, the support plate, under the action of the spring, contacts the positioning plate to achieve the positioning and installation of the cooling fan. This allows the cooling fan to be easily disassembled without tools when maintenance or replacement is required, greatly simplifying the operation steps and saving time and labor costs.

[0017] 2. This utility model uses the combination of slots and protrusions. When in use, after the positioning plate rotates, the protrusions engage with the slots, further enhancing the positioning effect of the positioning plate and improving the stability of the cooling fan after installation. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the assembly structure of an air-cooled heat sink.

[0020] Figure 2 This is a schematic diagram of the assembly structure of the cooling fan and the mounting plate;

[0021] Figure 3 This is a schematic diagram of the arc-shaped block structure;

[0022] Figure 4 This is a schematic diagram of the positioning plate.

[0023] In the diagram: 1. Heat-conducting plate; 2. Heat dissipation fins; 3. Mounting plate; 301. Mounting slot; 4. Arc-shaped block; 401. Slot; 5. Notch; 6. Spring; 7. Support plate; 8. Cooling fan; 9. Positioning plate; 901. Raised edge; 902. Protrusion; 10. Water pump; 11. Liquid cooling pipe. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0025] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.

[0026] This application discloses an evaporative air-cooled heat sink for electronic chips. (See also...) Figures 1-4 An evaporative electronic chip air-cooled heat sink includes a heat-conducting plate 1 and a cooling fan 8. A mounting plate 3 is provided on the heat-conducting plate 1. A mounting groove 301 is opened on the top of the mounting plate 3. An arc-shaped block 4 is fixedly connected to the inner wall of the mounting groove 301. A slot 401 is opened on the bottom of the arc-shaped block 4. There are three arc-shaped blocks 4, which are arranged in a circular array on the mounting groove 301. There is a gap 5 between two connected arc-shaped blocks 4. Multiple springs 6 are fixedly connected in a circular array to the bottom surface of the inner wall of the mounting groove 301. A support plate 7 is fixedly connected to the top of the multiple springs 6. The surface of the springs 6 has an insulating coating.

[0027] A positioning plate 9 is fixedly connected to the outer wall of the cooling fan 8. The positioning plate 9 has a circular structure. There are three protruding edges 901 fixedly connected to the outer wall of the positioning plate 9. The three protruding edges 901 are evenly distributed on the positioning plate 9. The top of each of the three protruding edges 901 has a protrusion 902.

[0028] When the positioning plate 9 is assembled on the mounting groove 301, the protrusion 902 engages with the slot 401, the top of the protrusion 901 abuts against the bottom of the arc block 4, and the bottom of the positioning plate 9 abuts against the top of the support plate 7.

[0029] Among them, the protruding edge 901 is a block in the shape of a fan, and the protruding edge 901 is integrally formed with the positioning plate 9, while the protrusion 902 is a cylindrical structure in the shape of a circle.

[0030] Reference Figure 1 and Figure 2 The bottom of the mounting plate 3 has several through holes, all of which are connected to the mounting groove 301.

[0031] The through holes facilitate airflow between the heat-conducting plate 1 and the cooling fan 8, thereby improving the heat dissipation effect.

[0032] Reference Figure 1 and Figure 2 The top of the tray 7 has several perforated holes.

[0033] The perforated holes are designed to facilitate airflow between the heat-conducting plate 1 and the cooling fan 8, thereby improving the heat dissipation effect.

[0034] Reference Figure 1 The top of the heat-conducting plate 1 is provided with several heat dissipation fins 2. The heat-conducting plate 1 is also provided with a liquid cooling pipe 11. The end of the liquid cooling pipe 11 away from the heat-conducting plate 1 is connected to a water pump 10. The water pump 10 has an inlet pipe and an outlet pipe. The inlet pipe and the outlet pipe are fixedly connected to the liquid cooling pipe 11.

[0035] The bottom of the heat-conducting plate 1 is coated with thermal grease. The side of the heat-conducting plate 1 with thermal grease is attached to the upper end of the electronic chip body, so that the entire heat sink is connected to the electronic chip body.

[0036] During the operation of the electronic chip body, the heat-conducting plate 1 absorbs the heat generated by the electronic chip body and dissipates it through several heat dissipation fins 2. Then, the water pump 10 is started by the external control system. When the water pump 10 is running, the water pump 10 makes the coolant in the liquid cooling pipe 11 flow in the liquid cooling pipe 11, so that the liquid cooling pipe 11 carries away the heat absorbed by the heat-conducting plate 1, thereby improving the heat dissipation efficiency of the heat-conducting plate 1 for the electronic chip body.

[0037] At the same time, the cooling fan 8 is started again. The cooling fan 8 dissipates heat from the liquid cooling pipe 11, the heat conduction plate 1 and several heat dissipation fins 2 simultaneously, so that the airflow at the top of the electronic chip body is smooth and the heat dissipation efficiency of the heat sink is improved.

[0038] Reference Figure 1 and Figure 2 Each corner of the top of the heat-conducting plate 1 is fixedly connected with a support rod, and the top of the four support rods is fixedly connected with a mounting plate 3. There is a gap between the bottom of the mounting plate 3 and the heat dissipation fins 2.

[0039] The gaps prevent damage to the heat dissipation fins 2 while also improving airflow and enhancing heat dissipation.

[0040] Working principle: When installing the cooling fan 8, first align the protruding edge 901 on the positioning plate 9 with the notch 5, then press the cooling fan 8 downwards, causing the positioning plate 9 to descend and press against the support plate 7. Under pressure, the support plate 7 compresses the spring 6, causing it to deform. At the same time, rotate the positioning plate 9 by 60°, causing the protruding edge 901 to rotate from the position of the notch 5 to the bottom of the arc block 4. After releasing the cooling fan 8, under the reset action of the spring 6, the support plate 7 moves upwards, causing the support plate 7 to abut against the positioning plate 9. Simultaneously, the protrusion 902 engages with the slot 401, thereby achieving the positioning and installation of the cooling fan 8. This allows the cooling fan 8 to be easily disassembled without tools when maintenance or replacement is required, greatly simplifying the operation steps and saving time and labor costs.

[0041] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. An evaporative air-cooled heat sink for electronic chips, comprising a heat-conducting plate (1), wherein a mounting plate (3) is disposed on the heat-conducting plate (1), characterized in that: The mounting plate (3) has a mounting groove (301) on its top. An arc-shaped block (4) is fixedly connected to the inner wall of the mounting groove (301). A slot (401) is provided at the bottom of the arc-shaped block (4). There are three arc-shaped blocks (4) arranged in a circular array on the mounting groove (301). There is a gap (5) between two connected arc-shaped blocks (4). Multiple springs (6) are fixedly connected in a circular array on the bottom surface of the inner wall of the mounting groove (301). A support plate (7) is fixedly connected to the top of the multiple springs (6). It also includes a cooling fan (8), and a positioning plate (9) is fixedly connected to the outer wall of the cooling fan (8). The positioning plate (9) has a circular structure and a protruding edge (901) is fixedly connected to the outer wall of the positioning plate (9). There are three protruding edges (901), which are evenly distributed on the positioning plate (9). The top of each of the three protruding edges (901) has a protrusion (902). When the positioning plate (9) is assembled on the mounting groove (301), the protrusion (902) engages with the slot (401), the top of the protruding edge (901) abuts against the bottom of the arc block (4), and the bottom of the positioning plate (9) abuts against the top of the support plate (7).

2. The evaporative air-cooled heat sink for electronic chips according to claim 1, characterized in that: The bottom of the mounting plate (3) has several through holes, and all of the through holes are connected to the mounting groove (301).

3. The evaporative air-cooled heat sink for electronic chips according to claim 1, characterized in that: The top of the tray (7) has several perforated holes.

4. The evaporative air-cooled heat sink for electronic chips according to claim 1, characterized in that: The top of the heat-conducting plate (1) is provided with several heat dissipation fins (2), and the heat-conducting plate (1) is also provided with a liquid cooling pipe (11). The end of the liquid cooling pipe (11) away from the heat-conducting plate (1) is connected to a water pump (10).

5. The evaporative air-cooled heat sink for electronic chips according to claim 4, characterized in that: Each of the four heat-conducting plates (1) has a support rod fixedly connected to the corner of its top. The top of each of the four support rods is fixedly connected to an mounting plate (3). There is a gap between the bottom of the mounting plate (3) and the heat dissipation fins (2).

6. The evaporative air-cooled heat sink for electronic chips according to claim 4, characterized in that: The water pump (10) has an inlet pipe and an outlet pipe, which are fixedly connected to the liquid cooling pipe (11).

7. The evaporative air-cooled heat sink for electronic chips according to claim 1, characterized in that: The protruding edge (901) is a block in the shape of a fan, and the protruding edge (901) is integrally formed with the positioning plate (9). The protrusion (902) is a cylindrical structure in the shape of a circle.

8. The evaporative air-cooled heat sink for electronic chips according to claim 1, characterized in that: The surface of the spring (6) has an insulating coating.

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