Waveguide antenna structure

Abstract

The invention provides a waveguide antenna structure. An antenna structure according to one embodiment of the present invention comprises: a base layer in which a feed hole through which a directly fed RF signal passes is formed; a waveguide tube layer laminated on the upper portion of the base layer and having a waveguide tube communicating with the feed hole; and an antenna layer laminated on the upper portion of the waveguide layer and having one or more antenna holes for transmitting to the outside or receiving from the outside a signal passing through the feed hole and the waveguide.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefits of Korean Patent Application No. 10 - 2024 - 0004166, filed on January 10, 2024, the entire content of which is incorporated herein by reference. Technical field

[0003] The present invention relates to a waveguide antenna structure and device, and more particularly, to a waveguide antenna structure having a structure in which PCBs are stacked. Background art

[0004] Recently, antennas used in radars have evolved from PCB - type to waveguide - type.

[0005] Conventional waveguide - type antennas are made of aluminum structures or plastic injection - molded structures. However, in such structures, in order to supply signals to the antenna, a structure for transferring from a microstrip to a waveguide is required.

[0006] However, this method has disadvantages in terms of cost, antenna fabrication and fastening, and signal loss.

[0007] Therefore, it is necessary to develop a waveguide antenna technology that does not have a structure for transferring from a microstrip to a waveguide in a waveguide - type antenna. Summary of the invention

[0008] The present invention is for solving the above - described problems, and an object of the present invention is to provide a waveguide antenna structure of a direct - feeding method.

[0009] Another object of the present invention is to provide an antenna structure in which PCBs are stacked to form a waveguide.

[0010] Still another object of the present invention is to provide an antenna structure that can be fabricated by stacking PCBs so as to be used in combination with a chip having a direct - feeding structure.

[0011] The objects of the present invention are not limited to the above - mentioned objects, and other objects not mentioned can be clearly understood by those of ordinary skill in the technical field to which the present invention pertains.

[0012] According to an embodiment of the present invention, there is provided a waveguide antenna structure including: a base layer formed with a feeding hole through which a directly - fed RF signal passes; a waveguide layer stacked on the upper part of the base layer and having a waveguide communicating with the feeding hole; and an antenna layer stacked on the upper part of the waveguide layer and having an antenna for transmitting to the outside or receiving from the outside an RF signal passing through the feeding hole and the waveguide.

[0013] At this time, the antenna layer, the waveguide layer, and the base layer may respectively include: a substrate layer; a first protective layer and a second protective layer, which are respectively laminated on the upper surface and the lower surface of the substrate layer.

[0014] At this time, the substrate layer may be made of FR-4 material, and the first protective layer and the second protective layer may be made of a conductive material and may form a plating.

[0015] At this time, an adhesive layer may be interposed between the base layer and the waveguide layer and between the waveguide layer and the antenna layer, and a plurality of vias penetrating the base layer, the waveguide layer, and the antenna layer stacked on top of each other are formed in the base layer, the waveguide layer, and the antenna layer. When observed from the first direction after the layers are stacked, the plurality of vias are arranged in a manner surrounding the feed hole, the waveguide, and the antenna.

[0016] The antenna may be a slot antenna including a plurality of antenna holes.

[0017] At this time, the waveguide may extend in a second direction perpendicular to the first direction, the feed hole is formed on one end side of the waveguide toward the second direction, and one or more of the antenna holes are spaced apart from the feed hole toward the second direction and are arranged at a predetermined interval along the extending direction of the waveguide.

[0018] At this time, when observed from the first direction, the plurality of vias may be arranged in a rectangular shape extending along the extending direction of the waveguide.

[0019] At this time, when observed from the first direction, the interval between adjacent vias among the plurality of vias may be an interval of 1 / 2λ or less for the frequency of the RF signal passing through the waveguide.

[0020] At this time, the plurality of antenna holes may be arranged in two rows along the extending direction of the waveguide, and adjacent antenna holes can be arranged in an interleaved manner.

[0021] At this time, the via may have one of a circular, elliptical, quadrilateral, and rectangular cross-section.

[0022] At this time, two or more distribution waveguides connected to the other end may further be included at the other end of the waveguide. The two or more distribution waveguides include portions extending in the second direction or extending in a direction perpendicular to the second direction, and the interval between the second directions of the distribution waveguides is an interval of 1λ or less.

[0023] At this time, two or more fastening members for coupling the base layer, the waveguide layer, and the antenna layer may be included, and the two or more fastening members are disposed on both sides of the base layer, the waveguide layer, and the antenna layer so that the layers are coupled together.

[0024] At this time, a first plating layer may further be included, and the first plating layer is formed on the inner side surface of the waveguide and the inner side surface of the antenna hole.

[0025] At this time, the two or more fastening members may include bolt members, the heads of the bolt members are disposed on the antenna layer, the other end portion of the heads penetrates through the base layer and protrudes, and is coupled to an RF substrate on which an MMIC chip that generates an RF signal toward the feed hole is mounted.

[0026] At this time, an adhesive layer intervening between the base layer and the waveguide layer or between the antenna layer and the waveguide layer may further be included, and a second plating layer is formed between the base layer and the waveguide layer or between the antenna layer and the waveguide layer where the adhesive layer intervenes.

[0027] The antenna may be a horn antenna or a block antenna.

[0028] According to another aspect of the present invention, there is provided a waveguide antenna structure including: an MMIC chip that generates an RF signal; an RF substrate on one surface of which the MMIC chip is mounted and that has a feed hole for transmitting the RF signal generated in the MMIC chip; a waveguide layer laminated on the other surface of the RF substrate and having a waveguide communicating with the feed hole; and an antenna layer laminated on the upper portion of the waveguide layer and having one or more antenna holes for transmitting a signal to the outside or receiving a signal from the outside through the feed hole and the waveguide.

[0029] At this time, two or more fastening members for coupling the RF substrate, the waveguide layer, and the antenna layer may be included, and the two or more fastening members are disposed on both sides of the RF substrate, the waveguide layer, and the antenna layer so that the layers are coupled together.

[0030] At this time, a first plating layer may further be included, and the first plating layer is formed on the inner side surface of the waveguide and the inner side surface of the antenna hole.

[0031] At this time, the two or more fastening members may include bolt members, the heads of the bolt members are disposed on the antenna layer, the other end portion of the heads penetrates through the antenna layer and protrudes, and is coupled to the RF substrate.

[0032] At this time, an adhesive layer may further be included, and the adhesive layer intervenes between the antenna layer and the waveguide layer, and a plating layer is formed between the antenna layer and the waveguide layer where the adhesive layer intervenes.

[0033] At this time, the antenna layer and the waveguide layer may respectively include: a substrate layer; a first protective layer and a second protective layer, which are respectively laminated on the upper surface and the lower surface of the substrate layer.

[0034] At this time, the substrate layer may be made of FR-4 material, and the first protective layer and the second protective layer may be made of a material having conductivity and capable of forming plating.

[0035] At this time, an adhesive layer may intervene between the waveguide layer and the antenna layer, and a plurality of vias penetrating through the mutually laminated waveguide layer and antenna layer are formed between the waveguide layer and the antenna layer. When observed from the first direction after lamination of the layers, the plurality of vias are arranged to surround the feed hole, the waveguide, and one or more of the antenna holes.

[0036] At this time, the waveguide may extend in a second direction perpendicular to the first direction, the feed hole is formed at one end side of the waveguide toward the second direction, and one or more of the antenna holes are spaced apart from the feed hole toward the second direction and are arranged at a predetermined interval along the extending direction of the waveguide.

[0037] At this time, when observed from the first direction, the plurality of vias may be arranged in a rectangular shape extending along the extending direction of the waveguide.

[0038] At this time, when observed from the first direction, the interval between adjacent vias among the plurality of vias may be an interval of 1 / 2λ or less of the frequency of the RF signal passing through the waveguide.

[0039] At this time, two or more distribution waveguides connected to the other end may further be included at the other end of the waveguide. The two or more distribution waveguides include portions extending in the second direction or in a direction perpendicular to the second direction, and the interval between the second directions of the distribution waveguides is an interval of 1λ or less. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Exemplary embodiments of the present invention are described in detail with reference to the accompanying drawings, so that those of ordinary skill in the art can more clearly understand other objects, features, and advantages of the present invention, where:

[0041] Figure 1 is a perspective view of a PCB stacked waveguide antenna structure with a direct feeding method according to an embodiment of the present invention.

[0042] Figure 2 Top view of the PCB stacked waveguide antenna structure in the direct feeding mode according to an embodiment of the present invention.

[0043] Figure 3 Bottom view of the PCB stacked waveguide antenna structure in the direct feeding mode according to an embodiment of the present invention.

[0044] Figure 4 Cross-sectional view of the PCB stacked waveguide antenna structure in the direct feeding mode according to an embodiment of the present invention in the I-I' direction.

[0045] Figure 5 Cross-sectional view of the PCB stacked waveguide antenna structure in the direct feeding mode according to an embodiment of the present invention in the II-II' direction.

[0046] Figure 6 Top view showing a modified example of the via hole of the PCB stacked waveguide antenna structure in the direct feeding mode according to an embodiment of the present invention.

[0047] Figure 7 Cross-sectional view showing the distance relationship between the waveguide and the via hole of the PCB stacked waveguide antenna structure in the direct feeding mode according to an embodiment of the present invention.

[0048] Figure 8 Beam pattern chart of the PCB stacked waveguide antenna structure in the direct feeding mode according to an embodiment of the present invention.

[0049] Figure 9 Cross-sectional view showing various modified examples of the waveguide of the PCB stacked waveguide antenna structure in the direct feeding mode according to an embodiment of the present invention.

[0050] Figure 10 Cross-sectional view of the PCB stacked waveguide antenna structure in the direct feeding mode according to the second embodiment of the present invention.

[0051] Figure 11 Cross-sectional view of the PCB stacked waveguide antenna structure in the direct feeding mode according to the third embodiment of the present invention.

[0052] Figure 12 Cross-sectional view of the PCB stacked waveguide antenna structure in the direct feeding mode according to the fourth embodiment of the present invention.

[0053] Figure 13 Cross-sectional view of the PCB stacked waveguide antenna structure in the direct feeding mode according to the fifth embodiment of the present invention.

[0054] Figure 14Cross-sectional view of a PCB stacked waveguide antenna structure with a direct feeding method according to the sixth embodiment of the present invention.

[0055] Figure 15 Cross-sectional view of a PCB stacked waveguide antenna structure with a direct feeding method according to the seventh embodiment of the present invention. Detailed implementation manners

[0056] Hereinafter, embodiments of the present invention will be described in detail so that those of ordinary skill in the technical field to which the present invention pertains can easily implement the embodiments. However, the present invention can be embodied in various different forms and is not limited to the embodiments described in this specification. In order to accurately describe the present invention, parts irrelevant to the description are omitted from the drawings, and throughout this specification, the same or similar reference numerals are assigned to the same or similar structural elements.

[0057] The words and terms used in this specification and the claims should not be construed restrictively based on their ordinary or dictionary meanings, but should be interpreted in accordance with the principle that the inventor can appropriately define the concept of the terms in order to best explain his invention, so as to conform to the meanings and concepts of the technical idea of the present invention.

[0058] It should be understood that terms such as "including" or "having" in this specification are used to specify the existence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and do not preclude the existence or additional possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof in advance.

[0059] The words and terms used in this specification and the claims should not be construed restrictively based on their ordinary or dictionary meanings, but should be interpreted in accordance with the principle that the inventor can appropriately define the concept of the terms in order to best explain his invention, so as to conform to the meanings and concepts of the technical idea of the present invention.

[0060] Therefore, the embodiments described in this specification and the structures shown in the drawings are only a preferred embodiment of the present invention and do not represent all the technical ideas of the present invention. From the perspective of the application of the present invention, the corresponding structures can have various equivalent technical solutions and variations that can replace them.

[0061] A waveguide antenna structure according to an embodiment of the present invention is a waveguide antenna structure having a base layer and an antenna layer. A pipeline is formed by routing on a stacked PCB, and vias are formed on both side portions of the pipeline. After the waveguide is formed, the base layer has a feeding hole in a manner capable of directly feeding the waveguide, and the antenna layer is used to transmit or receive RF signals transmitted from the waveguide.

[0062] Accordingly, the waveguide antenna structure of an embodiment of the present invention can have a simple structure and can be directly fed, thereby reducing signal loss. Hereinafter, the waveguide antenna structure of an embodiment of the present invention will be described in detail with different drawings. In this specification, for clarity of explanation, the thicknesses of the respective layers constituting the waveguide antenna structure are shown in an exaggerated manner.

[0063] Figure 1 FIG. 4 is a perspective view of a PCB stacked type waveguide antenna structure with a direct feeding method according to an embodiment of the present invention. Figure 2 FIG. 5 is a top view of a PCB stacked type waveguide antenna structure with a direct feeding method according to an embodiment of the present invention. Figure 3 FIG. 6 is a bottom view of a PCB stacked type waveguide antenna structure with a direct feeding method according to an embodiment of the present invention. Figure 4 FIG. 7 is a cross-sectional view taken along the line I-I' of a PCB stacked type waveguide antenna structure with a direct feeding method according to an embodiment of the present invention. Figure 5 FIG. 8 is a cross-sectional view taken along the line II-II' of a PCB stacked type waveguide antenna structure with a direct feeding method according to an embodiment of the present invention.

[0064] Referring to Figures 1 to 5 , the waveguide antenna structure 10 of an embodiment of the present invention includes an antenna layer 20, a waveguide layer 30, and a base layer 40.

[0065] The antenna layer 20 is the layer disposed on the uppermost side in the waveguide antenna structure of an embodiment of the present invention, and is a layer on which an antenna for transmitting or receiving a radio frequency (RF) signal transmitted through a waveguide described later is disposed.

[0066] In an embodiment of the present invention, the antenna formed on the antenna layer 20 may be a slot antenna. However, the antenna formed on the antenna layer 20 is not limited thereto, and various types of antennas such as a horn antenna or a patch antenna that can transmit or receive an RF signal may be used.

[0067] In this embodiment, referring to Figure 1 and Figure 2 , the slot antenna formed on the antenna layer 20 may include a plurality of antenna holes 21.

[0068] As shown in Figure 1 and Figure 2 , the plurality of antenna holes 21 may include six slots 21a, 21b, 21c, 21d, 21e, 21f, and when viewed from Figure 2 , the six slots 21a, 21b, 21c, 21d, 21e, 21f are arranged in two columns along the y-axis direction. At this time, the size, number, and arrangement of the antenna holes may vary according to the characteristics of the antenna.

[0069] In this embodiment, six slots 21a, 21b, 21c, 21d, 21e, and 21f are formed so as to penetrate the antenna layer 20 in the vertical direction. At this time, the six slots 21a, 21b, 21c, 21d, 21e, and 21f are arranged in a staggered manner between adjacent slots, and the transmitted or received RF signals are sent or received through waveguides.

[0070] The shape, size, configuration, etc. of the six slots can be changed according to the operating frequency, performance, etc. of the transmitted or received RF signals. The arrangement and structure of such slot antennas are well-known structures, and thus, a detailed description thereof is omitted.

[0071] Refer to Figure 4 , in an embodiment of the present invention, the antenna layer 20 may include: a first substrate 24; and a first protective layer 22 and a second protective layer 26, which are formed on the upper side surface and the lower side surface of the first substrate 24, respectively, when observed from Figure 4 .

[0072] At this time, the first substrate 24 may be formed in a row from a material such as FR-4. However, the material forming the first substrate 24 is not limited thereto, and the first substrate 24 may be formed from a well-known material capable of forming a substrate.

[0073] At this time, the first substrate 24 may be formed in a thin plate shape. At this time, the thickness of the first substrate 24 may have various thicknesses according to the operating frequency and performance of the antenna and the waveguide, and this can be changed according to the design.

[0074] On the other hand, the first protective layer 22 and the second protective layer 26 of the first substrate 24 may be formed to have conductivity and may be formed from a material capable of achieving plating, for example, a form in which a copper foil and a copper plating are combined. The thickness of the antenna layer 20 may also be changed according to the thicknesses of the first protective layer 22 and the second protective layer 26.

[0075] Refer to Figure 4 , a waveguide layer 30 is coupled to the lower part of the antenna layer 20.

[0076] The waveguide layer 30 may include: a second substrate 34 and a first protective layer 32 and a second protective layer 36, which are formed on the upper surface and the lower surface of the second substrate 34, respectively.

[0077] The second substrate 34 may be formed from a material such as FR-4 in the same manner as the first substrate 24. However, the material of the second substrate 34 is not limited thereto. And the first protective layer 32 and the second protective layer 36 formed on the upper surface and the lower surface of the second substrate 34 can be formed in the same manner as the first protective layer 22 and the second protective layer 26 formed on the first substrate.

[0078] On the other hand, referring to Figure 4 and Figure 5 , a waveguide 31 is formed on the second substrate 34.

[0079] As can be seen from Figure 4 and Figure 5 , the waveguide 31 can be formed into a rectangle with a length extending along the y-axis direction in cross-section, and can also be formed into a rectangle with a predetermined width and height along the x-axis direction in cross-section. The inside of the waveguide 31 can be filled with air. At this time, the design of the width and height in the x-axis direction and the length in the y-axis direction of the waveguide 31 can vary according to the frequency and performance of the RF signal. In Figure 5 , the arrow I indicates the moving direction of the RF signal from the base layer to the antenna layer. According to an embodiment of the present invention, a plurality of waveguides can be formed on the second substrate to form a waveguide antenna structure, and the plurality of waveguides can be individually connected corresponding to a plurality of feed holes. At this time, the plurality of waveguides can be respectively used for transmission or reception. At least one transmission waveguide and one reception waveguide can be provided in one waveguide antenna structure. In this specification, for the sake of simplifying the drawings, in the waveguide antenna structure, a structure in which one waveguide 31 is connected to one feed hole 41 is shown.

[0080] In an embodiment of the present invention, the antenna layer 20 and the waveguide layer 30 can be bonded by an adhesive layer 50. As an example, the adhesive layer 50 can be formed using an adhesive such as a bonding sheet, prepreg, or glue.

[0081] On the other hand, referring to Figure 4 and Figure 5 , in an embodiment of the present invention, a base layer 40 is bonded to the lower part of the waveguide layer 30.

[0082] The base layer 40 can include a first protective layer 42 and a second protective layer 46 formed on the upper and lower surfaces of the third substrate 44 and the third substrate 44.

[0083] The third substrate 44 can be formed of FR-4 material similar to the first substrate 24 and the second substrate 34. However, the material forming the third substrate 44 is not limited thereto, and the third substrate 44 can be formed of a known material capable of forming a substrate.

[0084] The third substrate 44 can be formed into a thin plate shape. The first protective layer 42 and the second protective layer 46 formed on the upper and lower surfaces of the third substrate 44 can be formed in the same manner as the first protective layer 32 and the second protective layer 36 formed on the first substrate 24 and the second substrate 34.

[0085] In an embodiment of the present invention, the feeding hole 41 is formed to penetrate the base layer 40 in the up and down directions. The feeding hole 41 is a hole through which an RF signal directly fed from an unillustrated RF signal generating unit passes.

[0086] In an embodiment of the present invention, referring to Figure 5 , the upper side of the feeding hole 41 may be connected to one end side of the waveguide 31. Thus, the RF signal can pass through the feeding hole 41, and through the inside of the waveguide 31, and be emitted to the outside through the antenna layer 20.

[0087] The width of the region of the feeding hole 41 connected to the waveguide 31 may vary according to the antenna design. However, according to an embodiment of the present invention, if the upper side of the feeding hole 41 is not connected to the waveguide 31 in a fluid communication manner, the RF signal transmitted through the feeding hole 41 cannot pass through the inside of the waveguide 31. Therefore, the upper side of the feeding hole 41 needs to be connected to the waveguide 31.

[0088] Figure 6 It is a top view showing a modification example of a via hole of a PCB stacked waveguide antenna structure in a direct feeding method according to an embodiment of the present invention. Figure 6 The (a) part of Figure 6 shows a circular via hole 60, and

[0089] referring to Figure 1 , Figure 4 , Figure 6 In an embodiment of the present invention, referring to the (a) part of

[0090] At this time, in an embodiment of the present invention, referring to Figure 3 , when observed from the z-axis direction, the plurality of via holes 60 are arranged to surround the feeding hole 41, the waveguide 31, and the antenna hole 21.

[0091] At this time, referring to Figure 1 and Figure 2 , in an embodiment of the present invention, the plurality of via holes 60 are arranged in a rectangular shape extending along the extending direction of the waveguide 31, that is, along the y-axis direction.

[0092] At this time, as shown in the (a) part of Figure 6 , the plurality of via holes 60 may be circular, or as shown in the (b) part of Figure 6 , may be elliptical, or, although not illustrated, may be quadrilateral, square, or rectangular shape, etc. At this time, the extended length of the elliptical or rectangular via hole may be changed according to the design.

[0093] In the case where three layers formed by an antenna layer 20, a waveguide layer 30, and a base layer 40 are bonded by a bonding layer 50, a plurality of vias 60 are used to prevent radio wave leakage caused by the gap between the layers formed by the bonding layer.

[0094] Figure 7 A cross-sectional view showing the distance relationship between the waveguide 31 and the via 60 of the PCB stacked waveguide antenna structure 10 of the direct feeding method according to an embodiment of the present invention.

[0095] According to an embodiment of the present invention, the via 60 is a structure for preventing radio wave leakage in a portion where no plating layer is formed. Preferably, an interval through which the operating frequency of the RF signal does not pass should be maintained.

[0096] For this purpose, preferably, the interval L2 between adjacent vias 60 is designed to be 1 / 2λ or less of the RF signal frequency passing through the waveguide 31. Such an interval between the vias 60 can be designed by the diameter, shape, and position of the via 60.

[0097] On the other hand, referring to Figure 7 , the distance L3 between the waveguide 31 and the via 60 can be formed to be at least 0.05 mm. When designing, the operating frequency can be considered for the design. If the distance L3 between the waveguide 31 and the via 60 is too close, it is difficult to fabricate the via 60.

[0098] Moreover, the width of the waveguide 31 can be designed according to the diameter L1, shape, size, and position of the via 60. Therefore, the width L4 of the waveguide 31 can be designed to match the operating frequency.

[0099] At this time, the width L4 of the waveguide 31 can be designed to have a small value as the operating frequency of the RF signal increases.

[0100] Figure 8 A beam pattern chart of the PCB stacked waveguide antenna structure of the direct feeding method according to an embodiment of the present invention.

[0101] Referring to Figure 8 It can be seen that the PCB stacked waveguide antenna structure of the direct feeding method according to an embodiment of the present invention can be used to obtain a beam pattern chart having a gain curve with a specified frequency at a specified angle. At this time, the frequency value at the specified angle can be variously changed according to the design of the waveguide antenna.

[0102] Figure 9 A cross-sectional view showing various modified examples of the waveguide of the PCB stacked waveguide antenna structure of the direct feeding method according to an embodiment of the present invention. Figure 9 Part (a) thereof is an example in which a straight waveguide is formed.Figure 9 Part (b) to Figure 9 Part (d) is an example in which two or more distribution waveguides are connected to a waveguide.

[0103] Refer to Figure 9 Part (b) to Figure 9 Part (d), as a modified example of an embodiment of the present invention, the waveguide 31 may include two or more distribution waveguides on the other end side separated from the end where the feed hole 41 is connected ( Figure 9 33a and 33b in part (b) of Figure 9 35a and 35b in part (c) of Figure 9 37a, 37b, and 37c in part (d) of

[0104] At this time, as shown in Figure 9 Part (b), the first distribution waveguide 33a and the second distribution waveguide 33b can be arranged at an interval of 180 degrees, or, as shown in Figure 9 Part (c), the first distribution waveguide 35a and the second distribution waveguide 35b can be arranged side by side in a manner extending in the y-axis direction, or, as shown in Figure 9 Part (d), the three distribution waveguides 37a, 37b, and 37c can be arranged side by side in a manner extending in the y-axis direction.

[0105] In this way, as two or more distribution waveguides are formed, the gain pattern of the RF signal can be made different.

[0106] The shape and number of such waveguides and distribution waveguides can vary in many ways according to the size of the entire antenna module, the antenna configuration, and requirements.

[0107] At this time, when the number of distribution waveguides is multiple, the interval in the width direction between the multiple distribution waveguides, that is, the interval in the x-axis direction, can be set to 1λ or less. This interval, as an interval determined by the array factor, can generally be configured as an interval of 0.5λ, but can also be configured to 1λ according to the design.

[0108] The waveguide antenna structure of an embodiment of the present invention fabricates the waveguide antenna structure by laminating substrates, so it is easy to fabricate and can save costs.

[0109] Moreover, the waveguide antenna structure of an embodiment of the present invention can form a substrate using a material such as FR-4 and penetrate the waveguide in the substrate, so the waveguide can be simply fabricated.

[0110] In addition, the waveguide antenna structure according to an embodiment of the present invention combines a base layer having a feeding hole directly connected to a waveguide with a waveguide layer to fabricate a waveguide antenna with a structure for directly feeding power to the waveguide. Therefore, compared with a structure that indirectly transfers radio waves to the waveguide using a microstrip, it has the advantage of less signal loss.

[0111] Multiple modified embodiments of the waveguide antenna structure that can have a structure different from the above-described embodiments are illustrated with different drawings. Hereinafter, in the process of describing the modified embodiments of the waveguide antenna structure of various embodiments of the present invention, the same reference numerals are used for the same structures as those in the foregoing embodiments, and the modified embodiments are described centering on structures different from the foregoing embodiments.

[0112] Figure 10 A cross-sectional view of a PCB stacked waveguide antenna structure of a direct feeding method according to a second embodiment of the present invention. Figure 11 A cross-sectional view of a PCB stacked waveguide antenna structure of a direct feeding method according to a third embodiment of the present invention. Figure 12 A cross-sectional view of a PCB stacked waveguide antenna structure of a direct feeding method according to a fourth embodiment of the present invention.

[0113] According to other various embodiments of the present invention, the antenna layer 20, the waveguide layer 30, and the base layer 40 can be fastened by fastening members such as bolt members 70 without using an adhesive layer.

[0114] In the second embodiment of the present invention, an adhesive layer 50 is formed between the antenna layer 20 and the waveguide layer 30, and no adhesive layer is formed between the waveguide layer 30 and the base layer 40.

[0115] Thus, in a state where the antenna layer 20 and the waveguide layer 30 are bonded by the adhesive layer 50, the base layer 40 is combined with the waveguide layer 30 by a fastening member such as a bolt member 70.

[0116] At this time, the end of the bolt member can be combined with an RF substrate (not shown) so that the waveguide antenna structure can be combined with the RF substrate.

[0117] At this time, different from the first embodiment, the waveguide antenna structure 10' of the second embodiment of the present invention does not have a via hole 60.

[0118] At this time, referring to Figure 10, in order to prevent radio wave leakage through the adhesive layer 50 formed between the antenna layer 20 and the waveguide layer 30, the waveguide antenna structure 10' of the second embodiment forms a plating layer 80 on the inner sidewall of the antenna hole 21, the inner sidewall of the waveguide 31, and the horizontal plane between the lower end of the inner sidewall of the antenna hole and the upper end of the inner sidewall of the waveguide. With the help of this plating layer 80, radio wave leakage is prevented. In Figure 10 The illustration of the feed hole formed in the base layer 40 is omitted.

[0119] On the other hand, referring to Figure 11 , different from the second embodiment, in the waveguide antenna structure 10” of the third embodiment of the present invention, an adhesive layer 50 is interposed between the waveguide layer 30 and the base layer 40, and no adhesive layer is interposed between the antenna layer 20 and the waveguide layer 30.

[0120] At this time, the waveguide antenna structure 10” of the third embodiment of the present invention can combine the antenna layer 20, the waveguide layer 30, and the base layer 40 with an RF substrate (not shown) by means of fastening members such as bolt members 70.

[0121] At this time, referring to Figure 11 , in the waveguide antenna structure 10” of the third embodiment, a plating layer 80 is formed on the inner sidewall of the antenna hole 21, the inner sidewall of the waveguide 31, and the lower surface of the waveguide 31. Thus, radio wave leakage can be prevented through the adhesive layer interposed between the waveguide layer 30 and the base layer 40. In Figure 11 The illustration of the feed hole formed in the base layer 40 is omitted.

[0122] On the other hand, referring to Figure 12 , different from the foregoing embodiments, in the waveguide antenna structure 10”' of the fourth embodiment of the present invention, no adhesive layer is interposed between the adjacent layers of the antenna layer 20, the waveguide layer 30, and the base layer 40, but it is combined with the upper part of a substrate such as an RF substrate by means of fastening members such as bolt members 70.

[0123] In this way, when no adhesive layer is interposed between adjacent layers, the plating layers of each layer are formed in contact with each other. Therefore, as Figure 12 shows, as long as a plating layer 80 is formed on the inner surface of the antenna hole 21 and the inner surface of the waveguide 31, radio wave leakage can be prevented.

[0124] In referring to Figures 10 to 12In the second to fourth embodiments of the present invention to be described, after forming the antenna layer 20, the waveguide layer 30, and the base layer 40 without using the via 60, in a state where two adjacent layers among the three layers are joined, the remaining one layer is combined with the RF substrate using a fastening member such as the bolt member 70, or the three layers are respectively combined with the RF substrate using a fastening member such as the bolt member 70. In this case, the process of forming the via 60 can be omitted in the process of forming the waveguide antenna structure.

[0125] The waveguide antenna structure of another embodiment of the present invention is different from the waveguide antenna structure of the foregoing structure, and the waveguide layer can be laminated on the RF substrate. Hereinafter, the waveguide antenna structure of another plurality of embodiments of the present invention will be described with different drawings. Hereinafter, in the process of describing the modified embodiments of the waveguide antenna structure of another plurality of embodiments of the present invention, the same structural components as those of the foregoing embodiments are denoted by the same reference numerals, and the modified embodiments are described centering on the structures different from those of the foregoing embodiments.

[0126] Figure 13 It is a cross-sectional view of the PCB stacked waveguide antenna structure of the fifth embodiment of the present invention in a direct feeding manner. Figure 14 It is a cross-sectional view of the PCB stacked waveguide antenna structure of the sixth embodiment of the present invention in a direct feeding manner. Figure 15 It is a cross-sectional view of the PCB stacked waveguide antenna structure of the seventh embodiment of the present invention in a direct feeding manner.

[0127] Refer to Figures 13 to 15 Unlike the foregoing embodiments, the waveguide antenna structures 100, 100', 100'' of another embodiment of the present invention do not include the base layer 40, but include the antenna layer 20, the waveguide layer 30, the RF substrate 90, and the MMIC chip 92.

[0128] Similar to Figure 10 the waveguide antenna structure of the second embodiment shown, in Figure 13 the waveguide antenna structure 100 of the fifth embodiment shown, the antenna layer 20 and the waveguide layer 30 can be combined with each other by means of the adhesive layer 50.

[0129] At this time, the antenna layer 20 and the waveguide layer 30 can be combined with the RF substrate 90 by means of the bolt member 70.

[0130] From Figure 13At the time of observation, an MMIC chip 92 is mounted below the RF substrate 90. The MMIC chip 92 can be a chip that directly emits an RF feeding signal. The RF feeding signal generated from the MMIC chip 92 can pass through the feeding hole 91 formed in the RF substrate 90 and be transmitted to the antenna hole 21 through the waveguide 31 formed in the waveguide layer 30.

[0131] At this time, the waveguide antenna structure 100 of the fifth embodiment can penetrate the antenna layer 20 and the waveguide layer 30, and similar to the first embodiment, a plurality of vias 60 can be formed to prevent radio wave leakage.

[0132] As another example, as Figure 14 shown, different from Figure 13 the waveguide antenna structure of the fifth embodiment, in the waveguide antenna structure 100' of the sixth embodiment, a plurality of vias 60 are not formed, but a plating layer 80 for preventing radio wave leakage can be formed on the inner side surface of the antenna hole 21 and the inner side surface of the waveguide 31.

[0133] In the waveguide antenna structures 100 and 100' of the fifth and sixth embodiments of the present invention, instead of the base layer 40 in which the feeding hole 91 through which the directly fed RF signal passes is formed, the feeding hole 91 can be formed in the RF substrate to form a waveguide antenna structure with a simpler structure.

[0134] On the other hand, the waveguide antenna structure 100” of the seventh embodiment of the present invention is similar to the fifth and sixth embodiments and does not include the base layer 40. Moreover, in the waveguide antenna structure 100” of the seventh embodiment of the present invention, the antenna layer 20 and the waveguide layer 30 are not combined by means of the adhesive layer 50, but are directly combined with the RF substrate 90 by means of fastening members such as bolt members 70.

[0135] At this time, the waveguide antenna structure 100” of the seventh embodiment of the present invention forms a plating layer 80 on the inner side surface of the antenna hole 21 and the inner side surface of the waveguide 31.

[0136] Thus, the waveguide antenna structure 100” of the seventh embodiment of the present invention can directly fasten the antenna layer 20 and the waveguide layer 30 to the RF substrate 90 by means of fastening members such as bolt members 70 without having additional vias 60, thereby forming a waveguide antenna structure.

[0137] According to the fifth to seventh embodiments of the present invention, the antenna layer and the waveguide layer can be directly combined with the RF substrate by bolts in a bonded state, or the antenna layer and the waveguide layer can be fastened to the RF substrate by bolts in a separated state, thereby simply manufacturing a waveguide antenna structure.

[0138] Also, in the waveguide antenna structures 100, 100', 100'' of the fifth to seventh embodiments of the present invention, since the base layer is not used, there is an effect that the manufacturing cost of the waveguide antenna can be saved compared to the waveguide antenna structures 10, 10', 10'', 10''' of the first to fourth embodiments.

[0139] According to the above structure, the waveguide antenna structure and device of an embodiment of the present invention can directly receive an RF signal from an MMIC chip that generates an RF signal and send it to the waveguide antenna or cause the waveguide antenna to receive it.

[0140] The waveguide antenna structure of an embodiment of the present invention can form a waveguide by laminating a PCB substrate, and thus, the antenna can be manufactured at a low cost.

[0141] Also, the waveguide antenna structure of an embodiment of the present invention uses a PCB substrate to manufacture the antenna, and thus, it is easy to fasten to an RF substrate.

[0142] Also, the waveguide antenna structure of an embodiment of the present invention uses a direct feeding method, and thus, signal loss generated during the transfer of a signal from a microstrip to a waveguide in the past can be reduced.

[0143] It should be understood that the effects of the present invention are not limited to the effects mentioned above, but include all effects that can be inferred from the invention structure described in the detailed description or claims of the present invention.

[0144] Although an embodiment of the present invention has been described above, the idea of the present invention is not limited to the embodiment presented in this specification. Those skilled in the art who understand the idea of the present invention can easily propose other embodiments by adding, changing, deleting, adding, etc. of structural elements within the scope of the same idea, and these also fall within the scope of the idea of the present invention.

Claims

1. A waveguide antenna structure, characterized in that, Comprising: A base layer, formed with a feeding hole through which a directly-fed RF signal passes; A waveguide layer, laminated on the upper part of the base layer and having a waveguide communicating with the feeding hole; An antenna layer, laminated on the upper part of the waveguide layer and having an antenna for transmitting RF signals to the outside or receiving RF signals from the outside through the feeding hole and the waveguide.

2. The waveguide antenna structure according to claim 1, wherein: The antenna layer, the waveguide layer and the base layer respectively comprise: A substrate layer; A first protective layer and a second protective layer, laminated on the upper surface and the lower surface of the substrate layer respectively.

3. The waveguide antenna structure according to claim 1, wherein: An adhesive layer is interposed between the base layer and the waveguide layer and between the waveguide layer and the antenna layer, A plurality of vias penetrating through the mutually laminated base layer, waveguide layer and antenna layer are formed in the base layer, waveguide layer and antenna layer, When observed from the first direction after the layers are laminated, the plurality of vias are arranged in a manner of surrounding the feeding hole, the waveguide and the antenna.

4. The waveguide antenna structure according to claim 3, wherein: The antenna is a slot antenna including a plurality of antenna holes.

5. The waveguide antenna structure according to claim 4, wherein: The waveguide extends in a second direction perpendicular to the first direction, The feeding hole is formed on one end side of the waveguide toward the second direction, One or more of the antenna holes are spaced from the feeding hole toward the second direction and are arranged at a predetermined interval along the extending direction of the waveguide.

6. The waveguide antenna structure according to claim 4, wherein: When observed from the first direction, the interval between adjacent vias among the plurality of vias is an interval of 1 / 2λ or less for the frequency of the RF signal passing through the waveguide.

7. The waveguide antenna structure according to claim 5, wherein: Two or more distribution waveguides connected to the other end of the waveguide are further included at the other end of the waveguide, The two or more distribution waveguides include portions extending in the second direction or in a direction perpendicular to the second direction, and the interval between the second directions of the distribution waveguides is an interval of 1λ or less.

8. The waveguide antenna structure according to claim 1, wherein: Two or more fastening members for combining the base layer, the waveguide layer and the antenna layer are included, The two or more fastening members are arranged on both sides of the base layer, waveguide layer and antenna layer so that the layers are combined.

9. The waveguide antenna structure according to claim 8, wherein: The two or more fastening members include bolt members, The head of the bolt member is arranged on the antenna layer, and the other end of the head penetrates through the base layer to protrude and is combined with an RF substrate on which an MMIC chip generating an RF signal toward the feeding hole is mounted.

10. The waveguide antenna structure according to claim 8, wherein further comprises an adhesive layer interposed between the base layer and the waveguide layer or between the antenna layer and the waveguide layer, and a second plating layer is formed between the base layer and the waveguide layer or between the antenna layer and the waveguide layer where the adhesive layer is interposed.

11. A waveguide antenna structure, characterized in that, Comprising: an MMIC chip for generating an RF signal; an RF substrate, on one side of which the MMIC chip is mounted, having a feed hole for transmitting the RF signal generated by the MMIC chip; a waveguide layer laminated on the other side of the RF substrate and having a waveguide communicating with the feed hole; an antenna layer laminated on the upper portion of the waveguide layer and having one or more antenna holes for transmitting RF signals to the outside or receiving RF signals from the outside through the feed hole and the waveguide.

12. The waveguide antenna structure according to claim 11, wherein it includes two or more fastening members for bonding the RF substrate, the waveguide layer and the antenna layer, the two or more fastening members are arranged on both sides of the RF substrate, the waveguide layer and the antenna layer so that the layers are combined.

13. The waveguide antenna structure according to claim 11, wherein it further comprises a first plating layer formed on the inner side surface of the waveguide and the inner side surface of the antenna hole.

14. The waveguide antenna structure according to claim 12, wherein the two or more fastening members include bolt members, the head of the bolt member is arranged on the antenna layer, the other end of the head penetrates through the antenna layer and protrudes, and is combined with the RF substrate.

15. The waveguide antenna structure according to claim 11, wherein it further comprises an adhesive layer interposed between the antenna layer and the waveguide layer, and a plating layer is formed between the antenna layer and the waveguide layer where the adhesive layer is interposed.

16. The waveguide antenna structure according to claim 11, wherein the antenna layer and the waveguide layer respectively include: a substrate layer; a first protective layer and a second protective layer respectively laminated on the upper surface and the lower surface of the substrate layer.

17. The waveguide antenna structure according to claim 11, wherein an adhesive layer is interposed between the waveguide layer and the antenna layer, a plurality of vias penetrating the mutually laminated waveguide layer and antenna layer are formed in the waveguide layer and the antenna layer, when observed from a first direction after the layers are laminated, the plurality of vias are arranged so as to surround the feed hole, the waveguide and one or more of the antenna holes.

18. The waveguide antenna structure according to claim 17, wherein the waveguide extends in a second direction perpendicular to the first direction, the feed hole is formed on one end side of the waveguide toward the second direction, One or more of the antenna holes are spaced apart from the feed hole in the second direction and are arranged at a prescribed interval along the extending direction of the waveguide.

19. The waveguide antenna structure according to claim 17, wherein: When viewed from the first direction, the interval between adjacent via holes among the plurality of via holes is an interval of 1 / 2λ or less for the frequency of the RF signal passing through the waveguide.

20. The waveguide antenna structure according to claim 18, wherein: At the other end of the waveguide, there are further provided two or more distribution waveguides connected to the other end, The two or more distribution waveguides include portions extending in the second direction or extending in a direction perpendicular to the second direction, and the interval between the second directions of the distribution waveguides is an interval of 1λ or less.

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