Rubber socket with assembly structure

Abstract

The present invention relates to a rubber socket having an assembly structure in which conductive blocks manufactured separately are assembled on a support member. According to the present invention, a plurality of conductive blocks each having an elastic conductive portion and an insulating portion are individually prepared, and as a lower protruding portion of the conductive portion having a thickness larger than that of the support member is inserted into a through-hole of the support member, the lower surface of the insulating portion is bonded to the upper surface of the support member to bond the conductive blocks to the support member, thereby making it possible to prepare a rubber socket having a large area.

Description

Technical Field

[0001] The present invention relates to a rubber socket, and more particularly, to a rubber socket having an assembly structure capable of transmitting an electrical signal between a device under test and a tester. Background Art

[0002] After the manufacturing process of a semiconductor device is completed, it is necessary to test the semiconductor device. When performing the test of the semiconductor device, a test socket for achieving electrical connection between a tester as a test device and a semiconductor device as a device under test is required. In the test process, the test socket is a medium component that enables the signal emitted by the tester to be transmitted to the semiconductor device.

[0003] As a representative test socket, there are a pogo socket and a rubber socket. The pogo socket is configured such that spring pins elastically supported by springs are assembled in a housing. On the contrary, the rubber socket is configured such that conductive portions are disposed inside an insulating portion in an insulated manner from each other. The conductive portions include a plurality of conductive particles inside an elastic material such as silicon, and the insulating portion is made of an elastic material such as silicon. Therefore, even without using mechanical units such as welding or springs, the rubber socket can absorb mechanical shock or deformation and has characteristics such as being able to flexibly connect devices.

[0004] Recently, semiconductor devices using 5G or higher frequencies (usually 2 GHz or higher) have been gradually increasing. When testing such high-frequency semiconductor devices, it is difficult for the pogo socket to reduce the length of the spring pins due to limitations in the manufacturing level of the spring pins. As a result, not only does the length of the conduction path become too long, but also, since the spring pins and the springs for elastically supporting the spring pins act as inductors, it will be difficult to use the pogo socket in tests requiring a communication speed of 1 GHz or higher.

[0005] To improve such limitations of the pogo socket, a rubber socket having anisotropic conductivity is being used. Since the conduction path length of the rubber socket is relatively short, it has a structure suitable for high-speed signal transmission.

[0006] Figure 1 An existing test apparatus for testing a semiconductor device using a rubber socket is shown.

[0007] The rubber socket 30 includes: a plurality of conductive portions 31, in which a plurality of conductive particles 32 are arranged along the thickness direction of the rubber socket at positions corresponding to the terminals 11 of the device under test 10 inside an elastic insulating material; and an insulating portion 33, disposed around the conductive portions, for insulating between the conductive portions and supporting the conductive portions. The edge of the rubber socket 30 is fixed by a frame 35.

[0008] The rubber socket 30 is aligned and loaded onto the tester 20 via the frame 35 and alignment pins 25, asFigure 2 As shown, the terminal 11 of the device under test 10 applies pressure to the conductive portion 31 of the rubber socket 30. As the conductive particles 32 within the conductive portion come into contact, since the conductive portion is in an energized state, the test signal of the tester is transmitted through the conductive portion 31 of the rubber socket within the pad 21 of the tester to the terminal 11 of the device under test, thereby performing the test of the device under test.

[0009] Figure 3 and Figure 4 The preparation method of an existing rubber socket is shown. As shown in the figure, preparation is made: an upper magnetic mold 40 and a lower magnetic mold 50, with ferromagnetic bodies 41, 51 formed at respective positions where the conductive portion is to be formed, and non-magnetic bodies 42, 52 formed in other portions; and a conductive particle mixture, in which a plurality of conductive particles 32 are dispersed in a liquid elastic insulating substance 33A. Next, the frame 35 is positioned between the upper magnetic mold and the lower magnetic mold by a spacer 38, and after filling the conductive particle mixture into the interiors of the upper magnetic mold and the lower magnetic mold, if a magnetic field is applied along the thickness direction (i.e., the up-down direction in the drawing), the conductive particles dispersed in the liquid elastic insulating substance gather at the positions where the ferromagnetic bodies 41, 51 are formed and are arranged along the thickness direction. In this state, if the conductive particle mixture is cured and the upper magnetic mold and the lower magnetic mold are separated from the spacer, a rubber socket 30 is completed in which the conductive portions 31 formed by arranging a plurality of conductive particles within the elastic insulating substance and the insulating portion 33 made of the elastic insulating substance are fixed to the frame 35.

[0010] During the preparation process, due to bubbles or foreign matter generated within the liquid silicone or other reasons such that the magnetic field cannot be uniformly formed at the formation positions of the conductive portions, in the rubber socket using the above magnetic field, conductive portions with electrical property defects such as insulation breakdown due to the connection of conductive particles between the conductive portions may be partially generated. Such defects become more serious as the distance between the conductive portions becomes narrower and the number of conductive portions increases.

[0011] The number of electrodes of recently developed large semiconductor devices such as wireless access points (APs) and central processing units (CPUs) has increased from 1,000 to 220,000. In order to test such semiconductor devices, not only the area of the rubber socket needs to be increased, but also the number of conductive portions of the rubber socket needs to be increased from 1,000 to 220,000. During the preparation process, as the number of conductive portions of the rubber socket increases, the number of defective conductive portions also increases proportionally. However, since the existing rubber socket is prepared as a single unit, even if only one conductive portion is defective, the rubber socket cannot be used, so there is a problem that the entire rubber socket needs to be replaced. In particular, in a large-area rubber socket, such defects can lead to a significant increase in the preparation cost.

[0012] In addition, when preparing a conductive part with a large area and a narrow pitch using a magnetic field, since it is difficult to uniformly form the conductive part through the interference of the magnetic field, if the shape and thickness of the conductive part are different between the central part and the outer part of the rubber socket, there will be a problem of unstable signal characteristics of the rubber socket.

[0013] In addition, in order to have a rubber socket for preparing a conductive part with a large area and a narrow pitch, a magnetic force mold with corresponding dimensions and pitch is required. It is not only difficult to prepare a magnetic force mold with a large size and a narrow pitch for a ferromagnetic body, but also there is a problem of consuming a large amount of mold preparation costs.

[0014] Prior art documents

[0015] Patent documents

[0016] Patent Document 1: Korean Patent Publication No. 10-0588029 (June 12, 2006) Summary of the invention

[0017] In order to solve the above problems, an object of the present invention is to provide a rubber socket having an assembly structure in which separately prepared conductive blocks are assembled to a support member.

[0018] In order to achieve the above object, the rubber socket of the present invention is provided between a device under test and a tester so that the terminals of the device under test are electrically connected to the pads of the tester. The rubber socket includes: a support member, which is plate-shaped, through holes are respectively formed at positions corresponding to the terminals of the device under test, and an intermediate region part and a peripheral region part are provided. The intermediate region part has a plurality of divided regions, and the peripheral region part is located outside the intermediate region part; and conductive blocks, which are respectively provided in the plurality of divided regions, and are provided with a conductive part and an insulating part. The conductive part has a plurality of conductive particles arranged along the thickness direction in an elastic insulating substance, and the insulating part is provided around the conductive part for insulating between the conductive parts and supporting the conductive parts. The conductive parts are respectively formed at positions corresponding to the through holes of the divided regions, and are provided with lower protruding parts protruding downward along the lower side of the insulating part. The thickness of the lower protruding parts is greater than the thickness of the support member. As the lower protruding parts are inserted into the through holes, the lower surface of the insulating part is bonded to the upper surface of the support member by the applied adhesive to combine the conductive blocks with the support member.

[0019] The plurality of divided regions may have the same size.

[0020] A partial region including a damaged conductive part in the conductive block can be replaced with a repair conductive block.

[0021] The conductive part may be provided with an upper protruding part protruding upward along the upper side of the insulating part.

[0022] A support film may be attached to the upper surface of the above-mentioned insulating portion.

[0023] The above-mentioned binder may be a silicon binder.

[0024] The above-mentioned support member may be made of engineering plastic or printed circuit board material.

[0025] In the peripheral region portion of the above-mentioned support member, a plurality of position alignment holes for aligning positions may be formed.

[0026] The above-mentioned rubber socket further includes a frame for attaching the peripheral region portion of the above-mentioned support member, and a plurality of position alignment holes for aligning positions may be formed in the above-mentioned frame.

[0027] The rubber socket of the assembly structure of the present invention has the following effects. That is, by pre-detecting whether there are defects in the conductive blocks, replacing the damaged conductive blocks with defect-free conductive blocks, and then assembling them on the support member, defects in the rubber socket can be prevented.

[0028] Moreover, in the rubber socket of the assembly structure of the present invention, there is no need to replace the entire defective conductive block. Only the partial area including the damaged conductive portion in the conductive block needs to be replaced with a repair conductive block, and then the corresponding conductive block can be reused. Therefore, the manufacturing cost of the rubber socket can be greatly reduced.

[0029] Moreover, the conductive portions with uniform electrical characteristics for manufacturing small-area conductive blocks can be separately prepared and assembled. Therefore, the rubber socket of the assembly structure of the present invention not only reduces the manufacturing cost of the magnetic die, but also can transmit uniform electrical signals to large-scale semiconductors to perform stable tests.

[0030] Moreover, in the rubber socket of the assembly structure of the present invention, the conductive blocks can be independently separated from each other. Without being affected by other conductive blocks, since they can work independently, damage to the conductive blocks caused by unnecessary deformation transmission between adjacent conductive blocks can be prevented.

[0031] Moreover, in the rubber socket of the assembly structure of the present invention, position alignment holes for aligning positions are provided in the support member, and there is no need for the manufacturing process of attaching an additional frame. Therefore, the manufacturing efficiency can be improved. Description of the Drawings

[0032] Figure 1 A diagram showing a test device using an existing rubber socket.

[0033] Figure 2 A diagram of a test process using an existing rubber socket.

[0034] Figure 3 And Figure 4A figure briefly showing the preparation process of a conventional rubber socket.

[0035] Figure 5 A figure showing a rubber socket according to an embodiment of the present invention.

[0036] Figure 6 A figure showing a support member of a rubber socket according to an embodiment of the present invention.

[0037] Figure 7 A figure showing a conductive block of a rubber socket according to an embodiment of the present invention.

[0038] Figures 8 to 10 A figure briefly showing the preparation process of a conductive block of a rubber socket according to an embodiment of the present invention.

[0039] Figure 11 And Figure 12 A figure showing the combination of a conductive block and a support member according to an embodiment of the present invention.

[0040] Figure 13 A figure showing the replacement of an area to be repaired with a repair conductive block in the conductive block of a rubber socket according to an embodiment of the present invention.

[0041] Figure 14 A figure showing a support film attached to a rubber socket according to an embodiment of the present invention.

[0042] Figure 15 A figure showing a frame attached to a rubber socket according to an embodiment of the present invention. Detailed Description of the Invention

[0043] Hereinafter, a test device of the present invention will be described in detail with reference to the accompanying drawings.

[0044] Figure 5 A figure showing a rubber socket according to an embodiment of the present invention, Figure 6 A figure showing a support member of a rubber socket according to an embodiment of the present invention, Figure 7 A figure showing a conductive block of a rubber socket according to an embodiment of the present invention, Figures 8 to 10 A figure briefly showing the preparation process of a conductive block of a rubber socket according to an embodiment of the present invention, Figure 11 And Figure 12 A figure showing the combination of a conductive block and a support member according to an embodiment of the present invention.

[0045] In the present invention, when describing each structural element of the rubber socket, since the rubber socket is disposed between the device under test and the tester, a portion close to the device under test is referred to as the upper surface, upper end, or upper side for description, and a portion close to the tester is referred to as the lower surface, lower end, or lower side for description. Also, the same reference numerals are used for the same structural elements and their description is omitted.

[0046] As shown in the figure, a rubber socket 100 according to an embodiment of the present invention is disposed between a device under test 10 and a tester 20, such that a terminal 11 of the device under test is electrically connected to a pad 21 of the tester. The rubber socket of the assembly structure is characterized in that it includes: a support member 110, which is plate-shaped, through holes 111 are respectively formed at positions corresponding to the terminals of the device under test, an intermediate region portion 112 and a peripheral region portion 113 are provided, the intermediate region portion 112 has a plurality of divided regions, and the peripheral region portion 113 is located outside the intermediate region portion; and conductive blocks 140, which are respectively disposed in the plurality of divided regions, a conductive portion 120 and an insulating portion 130 are provided. In the elastic insulating material of the conductive portion 120, a plurality of conductive particles 32 are arranged along the thickness direction. The insulating portion 130 is disposed around the conductive portion for insulating between the conductive portions and supporting the conductive portion. Conductive portions are respectively formed at positions corresponding to the through holes of the divided regions, and lower protrusion portions 122 protruding downward along the lower side of the insulating portion are provided. The thickness of the lower protrusion portions 122 is greater than the thickness of the support member. As the lower protrusion portions are inserted into the through holes, the lower surface 132 of the insulating portion is bonded to the upper surface 116 of the support member by the applied adhesive to combine the conductive blocks with the support member.

[0047] As Figure 5 and Figure 6 shown, the support member 110, as a member for supporting the conductive blocks 140, is plate-shaped with a predetermined thickness and can be made of engineering plastics such as FR4, polyimide film, or printed circuit board (PCB) materials. Preferably, the shape of the support member is quadrilateral, but it is not limited thereto.

[0048] The support member 110 can be divided into an intermediate region portion 112 and a peripheral region portion 113 located outside the intermediate region portion.

[0049] The intermediate region portion 112 refers to the region corresponding to the region where the terminals are provided in the device under test. Through holes 111 are formed in the intermediate region portion, which are respectively formed at positions corresponding to the terminals of the device under test and penetrate along the thickness direction from the upper surface 116 to the lower surface 117 of the support member. The intermediate region portion 112 can be divided into a plurality of regions. The divided regions refer to the portions for respectively disposing the conductive blocks, and their sizes and numbers can be determined in consideration of the ease of preparation of the conductive blocks and the product reliability, etc. In Figure 6 this, although it is exemplified that the divided regions are 4 regions with the same size, it is not limited thereto. The divided regions can also have different sizes and can be divided into two or more regions. Among them, it should be noted that the divided regions are not the actual regions that divide the intermediate region portion, but refer to the virtual regions divided according to the sizes of the separately prepared conductive blocks.

[0050] The peripheral region portion 113 forms the edge of the rubber socket. A tester 20 or a device under test 10 and a plurality of position alignment holes 115 for alignment positions may be formed in the peripheral region portion.

[0051] As Figure 7 and Figure 12 As shown, the conductive block 140 includes: a conductive portion 120 respectively disposed in a plurality of divided regions of the support member 110, and a plurality of conductive particles 32 arranged along the thickness direction are formed in the elastic insulating material; and an insulating portion 130 disposed around the conductive portion for insulating between the conductive portions and supporting the conductive portion. The conductive block 140 has the characteristic of anisotropic conductivity, that is, in the thickness direction of the conductive block, conductivity is only represented along the up and down directions of the conductive block, or when pressure is applied along the thickness direction, conductivity is only represented along the thickness direction, and insulation is represented along the surface direction of the conductive block.

[0052] The size of the conductive block 140 corresponds to the divided regions of the support member, and conductive blocks 140 of corresponding sizes are respectively disposed in the divided regions. Therefore, if all the conductive blocks 140 are provided, all the intermediate region portions 112 of the support member are filled with the conductive blocks.

[0053] The conductive portion 120 includes an elastic insulating material and a plurality of conductive particles 32 contained in the elastic insulating material. The plurality of conductive particles are arranged along the thickness direction of the conductive block, that is, they can be arranged in an array along the up and down directions. The upper end of the conductive portion 120 can be in contact with the terminal 11 of the device under test 10, and the lower end can be in contact with the pad 21 of the tester 20, serving as a conductive path for electrically connecting the terminal of the device under test to the pad of the tester, and can transmit electrical signals between the device under test 10 and the tester substrate 20.

[0054] A lower protruding portion 122 protruding downward along the lower surface 132 of the insulating portion 130 is provided in the conductive portion 120. The lower protruding portion 122 should have a width and a thickness capable of passing through the through hole 111 of the support member and contacting the pad of the tester. Therefore, the thickness t1 of the lower protruding portion 122 of the conductive portion protruding along the lower side of the insulating portion is greater than the thickness t2 of the support member 110, and the width of the lower protruding portion 122 is equal to or less than the width of the through hole 111.

[0055] Moreover, an upper protruding portion 121 protruding upward along the upper surface 131 of the insulating portion 130 may also be formed in the conductive portion 120. In the case where the device under test is a land grid array (LGA) terminal, the conductive portion provided with the upper protruding portion 121 can easily contact the flat land grid array terminal through the upper protruding portion.

[0056] As the elastic insulating material constituting the conductive portion 120, a heat-resistant polymer material having a crosslinked structure can be used. For example, silicone rubber, soft liquid epoxy rubber, etc.

[0057] Moreover, as the conductive particles constituting the conductive portion 120, magnetic conductive particles can be used to react through a magnetic field. For example, as the conductive particles, magnetic metal particles such as iron, nickel, and cobalt, or alloy particles thereof, or metal particles containing them, or the above particles as core particles and electroconductive excellent metals such as gold, silver, palladium, and radium are plated on the surface of the core particles can be used.

[0058] The insulating portion 130 surrounds the periphery of the plurality of conductive portions 120 and supports the plurality of conductive portions 120 in a spaced-apart manner from each other for insulation between adjacent conductive portions 120. The insulating portion 130 can be made of an elastic insulating material, and the elastic insulating material can be made of the same material as the elastic insulating material of the conductive portion 120. Moreover, the insulating portion 130 can also use a non-elastic material that does not cause positional deformation with engineering plastics such as polyimide films or printed circuit materials. Such a non-elastic material insulating portion does not shrink or expand, etc., and thus can be more easily bonded to the support member.

[0059] Figures 8 to 10 The process of preparing a conductive block is briefly shown by an example in which the insulating portion in the rubber socket of an embodiment of the present invention is made of an elastic insulating material.

[0060] As Figure 8 shown, prepare: an upper magnetic mold 60, in which a ferromagnetic body 61 is formed at the position where the conductive portion is to be formed, and an upper non-magnetic body 62 is formed in the other parts; a lower magnetic mold 70, which is arranged opposite to the above upper magnetic mold, a lower ferromagnetic body 71 is formed at the position where the conductive portion is to be formed, and a lower non-magnetic body 72 is formed in the other parts. A chamber 80 is provided between the upper magnetic mold 60 and the lower magnetic mold 70 as a space for forming the conductive block 140.

[0061] The thickness of the upper ferromagnetic body 61 is smaller than that of the upper non-magnetic body 62. Therefore, an upper groove portion 63 corresponding to the upper ferromagnetic body 61 in shape is provided inside the upper non-magnetic body 62. In this way, as the upper groove portion 63 is provided inside the upper non-magnetic body 62, an upper protrusion 121 protruding along the upper side of the insulating portion 130 can be formed in the conductive portion 120 of the prepared rubber socket 100. Similarly, the thickness of the lower ferromagnetic body 71 is smaller than that of the lower non-magnetic body 72. Therefore, a lower groove portion 73 corresponding to the lower ferromagnetic body 71 in shape is provided inside the lower non-magnetic body 72. In this way, as the lower groove portion 73 is provided inside the lower non-magnetic body 72, a lower protrusion 122 protruding along the lower side of the insulating portion 130 can be formed in the conductive portion 120 of the prepared rubber socket 100.

[0062] Next, as Figure 9 and Figure 10 shown, a conductive particle mixture in which a plurality of conductive particles 32 are dispersed in a liquid elastic insulating material 33A is injected into the chamber 80. After the chamber 80 is filled with the conductive particle mixture, a magnetic field is applied to the conductive particle mixture. For example, a vertical magnetic field can be applied to the conductive particle mixture filled in the chamber 80 in the vertical direction by providing magnets on the upper surface of the upper magnetic force mold 60 and the lower surface of the lower magnetic force mold 70 and activating them. If a vertical magnetic field is applied, the conductive particles dispersed in the liquid elastic insulating material are concentrated between the upper ferromagnetic body 61 and the lower ferromagnetic body 71 and arranged in the thickness direction. In this state, if the conductive particle mixture is cured and the upper magnetic force mold and the lower magnetic force mold are separated, a conductive block 140 in which a plurality of conductive particles are arranged to form a conductive portion 120 in the elastic insulating material and an insulating portion 130 made of the elastic insulating material can be completed.

[0063] In the conductive block prepared in the above manner, the shape of the conductive portion can be cylindrical. However, when the upper groove portion 63 and the lower groove portion 73 are processed by laser or the like, the upper groove portion and the lower groove portion can be roughly processed into a conical shape due to the laser characteristics. Therefore, in the present invention, when showing a cross-sectional view of the conductive portion, the upper protrusion and the lower protrusion are conical shapes to show the cross-sectional view. And in the conductive portion, although the conductive particles are arranged in the thickness direction of the conductive portion, for convenience, it can also be simply shown, for example, Figure 11 the reference numeral 120 of

[0064] Similarly, when the insulating portion 120 is made of an engineering plastic such as a polyimide film or a non-elastic material such as a printed circuit board material, a through hole (not shown) is formed at a position for forming the conductive portion within the insulating portion. After filling the through hole, the upper groove portion 63, and the lower groove portion 73 with a conductive particle mixture, a conductive block having an insulating portion made of a non-elastic material can also be formed by applying a magnetic field and performing a curing process.

[0065] Figure 11 and Figure 12 FIG. is a view showing a conductive block according to an embodiment of the present invention combined with a support member. As Figure 11 shown, the rubber socket 100 is assembled by respectively disposing conductive blocks 140 in a plurality of divided regions of the support member 110. In Figure 11 FIG., a cross-sectional view shows a state before assembling the conductive block and the support member.

[0066] Figure 12 FIG. is an exemplary view showing that three conductive blocks 140A, 140B, and 140C that are independently divided from each other are respectively assembled into the divided regions of the support member 110 to form the rubber socket 100. The conductive block 140A and the conductive block 140B may have the same size, and the conductive block 140C may have a size different from that of the conductive block 140A and the conductive block 140B. That is, the conductive blocks can have various shapes and sizes according to the shape of the rubber socket 100. Before assembling the conductive blocks 140A, 140B, and 140C into the support member 110, defective-free conductive blocks can be used by pre-detecting whether there are defects.

[0067] The conductive block 140 can be assembled to the support member 110 in the following manner. An adhesive (not shown) is applied to the upper surfaces of the plurality of divided regions of the support member 110. As the adhesive, a silicone adhesive or a glue capable of bonding silicon can be used. After the conductive block 140A is located above the corresponding divided region of the support member 110, as the lower protruding portion 122 of the conductive portion 120 protruding from the conductive block 140A is inserted into the through hole 111 of the support member 110, the lower surface 132 of the insulating portion 130 comes into contact with the upper surface 116 of the support member 110. Subsequently, if a curing process is performed, as the lower surface adhesive is cured, the conductive block 140A can be firmly attached to one divided region of the support member. The conductive block 140B and the conductive block 140C can also be attached to the corresponding divided regions of the support member in the same manner, thereby completing the assembled rubber socket 100.

[0068] Figure 13 FIG. is an exemplary view showing a part of a conductive block in a rubber socket according to an embodiment of the present invention being replaced with a repair conductive block, including a damaged conductive portion.

[0069] As shown in the figure, when a damaged conductive part is found in the conductive block 140A, the area of the conductive block including the damaged conductive part can be removed by cutting with a laser or the like. Corresponding to the size of the area removed by cutting, after inserting a separately prepared repair conductive block 140D into the removed area, the conductive block 140A with the replaced repair conductive block 140D can also be attached to the support member 110 to prepare a rubber socket. In this case, the insulating part 130A of the conductive block 140A and the insulating part 130D of the repair conductive block 140D can be separated from each other.

[0070] When one conductive part is damaged, although it is possible to replace only the area of the conductive block including the damaged conductive part with a repair conductive block, in terms of the convenience of cutting and assembly, more preferably, a partial area including the damaged conductive block and the conductive parts around it should be replaced with a repair conductive block.

[0071] Therefore, for the rubber socket with the assembly structure according to an embodiment of the present invention, by pre-detecting whether there are defects in the conductive block and replacing the damaged conductive block with a defect-free conductive block, and then assembling it on the support member, defects in the rubber socket can be prevented.

[0072] Moreover, for the rubber socket with the assembly structure according to an embodiment of the present invention, there is no need to replace the entire defective conductive block. Only the partial area of the conductive block including the damaged conductive part needs to be replaced with a repair conductive block to reuse the corresponding conductive block. Therefore, the manufacturing cost of the rubber socket can be significantly reduced.

[0073] Furthermore, for the rubber socket with the assembly structure according to an embodiment of the present invention, the conductive parts with uniform electrical characteristics for preparing small-area conductive blocks can be separately prepared and assembled. Therefore, not only the manufacturing cost of the magnetic die is reduced, but also uniform electrical signals can be transmitted to a large semiconductor to perform stable tests.

[0074] In addition, for the rubber socket with the assembly structure according to an embodiment of the present invention, the conductive blocks can be independently separated from each other. Since they can work independently without being affected by other conductive blocks, damage to the conductive blocks caused by unnecessary deformation transmission of adjacent conductive blocks can be prevented.

[0075] Also, for the rubber socket with the assembly structure according to an embodiment of the present invention, position alignment holes for aligning positions are provided on the support member, and there is no need for the manufacturing process of attaching an additional frame. Therefore, the manufacturing efficiency can be improved.

[0076] Figure 14A diagram showing a support film attached to a rubber socket according to an embodiment of the present invention. As shown in the figure, in a rubber socket 100 according to an embodiment of the present invention, a support film 160 is attached to the upper side of a conductive block 140. Therefore, the shape and position of the rubber socket can be made more firm. The support film 160 has a shape corresponding to the middle region portion 112 of the support member 110, and a gasket member that penetrates through film holes 161 at respective positions corresponding to the conductive portion 120 can be made of a material such as a polyimide film. The support film 160 can be bonded to the upper surface 131 of the insulating portion 130 of each conductive block 140 by a silicone adhesive or the like. Preferably, the rubber socket to which the support film 160 is attached is applied to a conductive block in which the conductive portion 120 has an upper protrusion 121. This is because the conductive portion protruding from the upper side of the support film can make the electrical contact with the terminals of the device under test more stable.

[0077] Figure 15 A diagram showing a frame attached to a rubber socket according to an embodiment of the present invention. As shown in the figure, the edge of the peripheral region portion 113 of the support member 110 is attached to the frame 170, and the support member can be supported by the frame. In this case, a plurality of position alignment holes 175 for aligning positions can be formed at the edge of the frame 170.

[0078] As described above, although the preferred embodiments of the present invention have been described, the scope of the present invention is not limited to the above description and illustrated forms.

[0079] For example, although the drawings show that the conductive portions of the conductive blocks have the same height, it is also possible to prepare a rubber socket assembled with conductive blocks having different heights of conductive portions. In a device under test with a large amount of warpage, if conductive blocks with different heights of conductive portions are provided according to the amount of warpage, the contact characteristics with the terminals of the device under test can be improved.

[0080] As described above, although the preferred embodiments for illustrating the principle of the present invention have been described, the present invention is not limited to the structures and functions illustrated above. Those of ordinary skill in the art to which the present invention pertains should understand that various changes and modifications can be made to the present invention without departing from the spirit and scope of the appended claims.

Claims

1. A rubber socket of an assembly structure is disposed between a device under test and a tester, enabling electrical connection between the terminals of the device under test and the pads of the tester. It is characterized in that it includes: a support member, in the shape of a plate, through holes are respectively formed at positions corresponding to the terminals of the device under test, an intermediate region part and a peripheral region part are provided, the intermediate region part has a plurality of divided regions, and the peripheral region part is located outside the intermediate region part; and conductive blocks, which are respectively disposed in the plurality of divided regions, are provided with a conductive part and an insulating part. The conductive part is formed with a plurality of conductive particles arranged along the thickness direction in an elastic insulating material, and the insulating part is disposed around the conductive part for insulation between the conductive parts and supporting the conductive parts. The conductive parts are respectively formed at positions corresponding to the through holes of the divided regions, and are provided with lower protruding parts protruding along the lower side of the insulating part. The thickness of the lower protruding parts is greater than the thickness of the support member. As the lower protruding parts are inserted into the through holes, the lower surface of the insulating part is bonded to the upper surface of the support member by the applied adhesive to combine the conductive blocks with the support member.

2. The rubber socket of the assembly structure according to claim 1, characterized in that, The plurality of divided regions have the same size.

3. The rubber socket of the assembly structure according to claim 1, characterized in that, It is possible to replace a partial area including a damaged conductive part in the conductive block with a repair conductive block.

4. The rubber socket of the assembly structure according to claim 1, characterized in that The conductive part is provided with upper protruding parts protruding along the upper side of the insulating part.

5. The rubber socket of the assembly structure according to claim 4, characterized in that, A support film is attached to the upper surface of the insulating part.

6. The rubber socket of the assembly structure according to claim 1, characterized in that, The adhesive is a silicone adhesive.

7. The rubber socket of the assembly structure according to claim 1, characterized in that, The support member is made of engineering plastic or printed circuit board material.

8. The rubber socket of the assembly structure according to claim 1, characterized in that, A plurality of position alignment holes for position alignment are formed in the peripheral region part of the support member.

9. The rubber socket of the assembly structure according to claim 1, characterized in that it further includes a frame for attaching the peripheral region part of the support member, and a plurality of position alignment holes for position alignment are formed in the frame.

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