Heat dissipation electrical cabinet, control method of heat dissipation electrical cabinet and energy storage converter

Abstract

This application provides a heat dissipation electrical cabinet, a control method for the heat dissipation electrical cabinet, and an energy storage converter, relating to the field of power electronics technology. A heat dissipation electrical cabinet includes: an electrical cabinet body; a first heat dissipation subsystem including an external air duct baffle located outside the electrical cabinet body, used to form a sealed, continuous external air duct together with the outer wall of the electrical cabinet body; and a second heat dissipation subsystem including an internal air duct baffle located inside the electrical cabinet body, used to divide the internal space of the electrical cabinet body into an open internal air duct and a sealed internal air duct. According to the technical solution of the embodiments of this application, two sets of heat dissipation subsystems are set up, and the heat dissipation airflow of the two sets of subsystems is completely isolated, preventing dirt and rain / snow from entering the cabinet interior, achieving high protection performance of the cabinet. At the same time, the two sets of heat dissipation subsystems provide separate heat dissipation for different components, resulting in high heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to the field of power electronics technology, specifically to a heat dissipation electrical cabinet, a control method for the heat dissipation electrical cabinet, and an energy storage converter. Background Technology

[0002] Currently, the installed capacity of wind and solar power is growing rapidly, but there are some challenges in its widespread application, especially the time difference between power generation and consumption, and the impact of direct grid connection of intermittent renewable energy generation on the power grid. Energy storage systems are a key component in realizing the widespread application of renewable energy sources such as solar and wind power, and are an important means to improve the safety, stability, reliability, and power quality of the power system, thus attracting widespread attention.

[0003] The energy storage converter is the core of an energy storage system, and the outdoor energy storage cabinet is currently the main form of energy storage converter application. The cabinet contains IGBT power module units, capacitor banks, control devices, DC disconnect switches, AC circuit breakers, and low-protection components such as fuses. During operation, the internal power electronic components generate a large amount of heat during high-power conversion, requiring highly reliable heat dissipation equipment. Furthermore, the outdoor energy storage cabinet operates in a complex and diverse external environment, including rain, dust, salt spray, and condensation, placing high demands on the protection of its heat dissipation equipment.

[0004] Currently, outdoor energy storage converters primarily rely on air cooling for heat dissipation. However, the air cooling commonly used in high-power electrical equipment typically involves a combination of internal and external heat dissipation, which cannot meet the requirements of high-protection applications. Furthermore, air cooling has relatively low efficiency, and as the capacity of energy storage converters continues to increase, its heat dissipation capacity is no longer sufficient to meet the demands of high-power applications.

[0005] In summary, existing technologies suffer from low protection and low efficiency in air-cooled heat dissipation systems. Summary of the Invention

[0006] Based on this, this application provides a heat dissipation electrical cabinet, a control method for the heat dissipation electrical cabinet, and an energy storage converter to achieve heat dissipation of the electrical cabinet with high protection and high efficiency.

[0007] According to one aspect of this application, a heat dissipation electrical cabinet is provided, comprising: an electrical cabinet body; a first heat dissipation subsystem, including an external air duct baffle located outside the electrical cabinet body, which together with the outer wall of the electrical cabinet body forms an external sealed and continuous air duct; and a second heat dissipation subsystem, including an internal air duct baffle located inside the electrical cabinet body, which divides the internal space of the electrical cabinet body into an internal open air duct and an internal sealed air duct.

[0008] According to some embodiments, the first heat dissipation subsystem further includes a first set of fans, which are disposed in a closed continuous air duct outside the cabinet.

[0009] According to some embodiments, the first heat dissipation subsystem further includes: a power module liquefaction unit disposed in a closed continuous air duct outside the cabinet; and a power module vaporization unit disposed in an open air duct inside the cabinet; wherein, the heat dissipation electrical cabinet further includes: a first vaporization pipe and a first return pipe, both connected between the power module vaporization unit and the power module liquefaction unit, and both the first vaporization pipe and the first return pipe are filled with a preset organic working fluid.

[0010] According to some embodiments, the first heat dissipation subsystem also includes a reactor compartment, which is located at one end of a sealed continuous air duct outside the cabinet and is completely isolated from the interior of the electrical cabinet body.

[0011] According to some embodiments, the first heat dissipation subsystem further includes an air outlet, which is disposed on the side wall and / or bottom of the reactor chamber.

[0012] According to some embodiments, the first heat dissipation subsystem further includes a third set of fans, which are disposed inside the reactor room, and the reactor room is also provided with a reactor.

[0013] According to some embodiments, the first heat dissipation subsystem further includes an air inlet, which is provided with an elbow shroud, a filter and / or a noise reduction device.

[0014] According to some embodiments, the second heat dissipation subsystem further includes a second set of fans, which are located at the junction of the open air duct and the closed air duct inside the cabinet.

[0015] According to some embodiments, the second heat dissipation subsystem further includes: a capacitor bank liquefaction unit disposed in a sealed continuous air duct outside the cabinet; and a capacitor bank vaporization unit disposed in a sealed air duct inside the cabinet; wherein, the heat dissipation electrical cabinet further includes: a second vaporization pipe and a second return pipe, both connected between the capacitor bank vaporization unit and the capacitor bank liquefaction unit, and both the second vaporization pipe and the second return pipe are filled with a preset organic working fluid.

[0016] According to some embodiments, the electrical cabinet body includes: a capacitor bank disposed in a closed air duct inside the cabinet; and a control device and cabinet components disposed in an open air duct inside the cabinet.

[0017] According to one aspect of this application, a control method for a heat dissipation electrical cabinet includes: responding to an electrical cabinet start command, starting a power module vaporizer and a power module liquefier, and starting a first set of fans and a second set of fans at an initial speed; acquiring a first temperature of the power module vaporizer, and adjusting a first speed of the first set of fans according to the first temperature and a first mapping relationship, wherein the first mapping relationship is the relationship between the first temperature and the first speed of the first set of fans; acquiring a second temperature inside the electrical cabinet body, and adjusting a second speed of the second set of fans according to the second temperature and a second mapping relationship, wherein the second mapping relationship is the relationship between the second temperature and the second speed of the second set of fans; increasing the first speed of the first set of fans by a preset amount when the second speed reaches a preset second upper limit; if the first temperature is greater than a preset first temperature threshold when the first speed reaches a preset first upper limit, controlling the heat dissipation electrical cabinet to operate according to a preset power temperature derating curve; and controlling the heat dissipation electrical cabinet to stop if the first temperature is greater than a preset second temperature threshold or the second temperature is greater than a preset third temperature threshold when the first set of fans and / or the second set of fans malfunction.

[0018] According to some embodiments, after starting the power module vaporizer and power module liquefaction unit in response to the electrical cabinet start command, and starting the first and second sets of fans at the initial speed, the method further includes starting the capacitor bank vaporizer and capacitor bank liquefaction unit.

[0019] According to one aspect of this application, an electronic device is provided, comprising: one or more processors; a storage device for storing one or more programs; and, when the one or more programs are executed by the one or more processors, causing the one or more processors to implement the method as described above.

[0020] According to one aspect of this application, a computer-readable medium is provided having a computer program stored thereon that, when executed by a processor, implements the method described above.

[0021] According to one aspect of this application, an energy storage converter is proposed, including the heat dissipation electrical cabinet as described above.

[0022] Through the above embodiments provided in this application, two sets of heat dissipation subsystems are set up. The external air duct baffle and the electrical cabinet body form an external sealed and continuous air duct to accommodate the heat dissipation airflow of the first heat dissipation subsystem. The internal air duct baffle divides the space inside the electrical cabinet body into an internal open air duct and an internal sealed air duct to accommodate the heat dissipation airflow of the second heat dissipation subsystem. The heat dissipation airflow of the two sets of heat dissipation subsystems is completely isolated, preventing dirt and rain and snow from entering the cabinet body, thus achieving high protection performance of the cabinet. At the same time, the two sets of heat dissipation subsystems dissipate heat separately for different components, resulting in high heat dissipation efficiency. Attached Figure Description

[0023] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application.

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings, without exceeding the scope of protection claimed by this application.

[0025] Figure 1 One of the block diagrams of the heat dissipation electrical cabinet provided in the embodiments of this application;

[0026] Figure 2 A second block diagram of the heat dissipation electrical cabinet provided in the embodiments of this application;

[0027] Figure 3 A flowchart illustrating the control method for a heat dissipation electrical cabinet provided in an embodiment of this application;

[0028] Figure 4 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0029] Figure 5 A block diagram of an energy storage converter provided in an embodiment of this application.

[0030] Figure label:

[0031] 100: Heat dissipation electrical cabinet; 110: Electrical cabinet body; 111: Capacitor bank; 112: Control device; 113: Components inside the cabinet; 120: First heat dissipation subsystem; 121: External air duct baffle; 122: External sealed continuous air duct; 123: First set of fans; 124: Power module liquefier; 125: Power module vaporizer; 126: Reactor compartment; 127: Air outlet; 128: Third set of fans; 129: Air inlet; 130: Second heat dissipation subsystem; 131: Internal air duct baffle; 132: Internal open air duct; 133: Internal sealed air duct; 134: Second set of fans; 135: Capacitor bank liquefier; 136: Capacitor bank vaporizer; 140: First vaporization pipe; 150: First return pipe; 160: Second vaporization pipe; 170: Second return pipe. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0034] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0035] The flowcharts shown in the accompanying drawings are merely illustrative and do not necessarily include all content and operations / steps, nor do they necessarily have to be performed in the described order. For example, some operations / steps can be broken down, while others can be combined or partially combined; therefore, the actual execution order may change depending on the specific circumstances.

[0036] It should be understood that although the terms first, second, third, etc., may be used herein to describe various components, these components should not be limited by these terms. These terms are used to distinguish one component from another. Therefore, the first component discussed below may be referred to as the second component without departing from the teachings of this application. As used herein, the term "and / or" includes all combinations of any one and more of the associated listed items.

[0037] For specific implementation details, please refer to the following examples.

[0038] Figure 1 This is a block diagram of a heat dissipation electrical cabinet 100 provided in an embodiment of this application. Figure 1 As shown, the heat dissipation electrical cabinet 100 includes: an electrical cabinet body 110; a first heat dissipation subsystem 120; and a second heat dissipation subsystem 130.

[0039] The first heat dissipation subsystem 120 includes an external air duct baffle 121, which is located outside the electrical cabinet body 110 and is used to form an external sealed and continuous air duct 122 together with the outer wall of the electrical cabinet body 110.

[0040] The second heat dissipation subsystem 130 includes an internal air duct baffle 131, which is located inside the electrical cabinet body 110 and is used to divide the space inside the electrical cabinet body 110 into an open internal air duct 132 and a closed internal air duct 133.

[0041] This application considers the differences in heat generation and protection levels of different components such as power modules, capacitor banks 111, and reactors within the heat dissipation electrical cabinet 100. The requirements for heat dissipation capacity and protection also vary among components. Therefore, two heat dissipation subsystems are set up: a first and a second. An external air duct baffle 121 and the electrical cabinet body 110 form an external sealed continuous air duct 122 to accommodate the heat dissipation airflow of the first heat dissipation subsystem 120. An internal air duct baffle 131 divides the internal space of the electrical cabinet body 110 into an internal open air duct 132 and an internal sealed air duct 133, both used to accommodate the heat dissipation airflow of the second heat dissipation subsystem 130. The heat dissipation airflow of the two subsystems is completely isolated, preventing dirt and rain / snow from entering the cabinet, thus achieving high protection performance. Simultaneously, the two heat dissipation subsystems provide separate heat dissipation for different components, resulting in high heat dissipation efficiency.

[0042] According to some embodiments, the first heat dissipation subsystem 120 further includes a first set of fans 123, which are disposed in a sealed continuous air duct 122 outside the cabinet.

[0043] According to the example embodiment, the first group of fans 123 is a centrifugal fan or an axial fan, and there is at least one fan or at least one group of fans.

[0044] A first set of fans 123 is installed in the sealed continuous air duct 122 outside the cabinet to accelerate the flow of heat dissipation air in the first heat dissipation subsystem 120 and improve heat dissipation efficiency based on air cooling technology.

[0045] According to some embodiments, the first heat dissipation subsystem 120 further includes: a power module liquefaction unit 124, disposed in a closed continuous air duct 122 outside the cabinet; and a power module vaporization unit 125, disposed in an open air duct 132 inside the cabinet; wherein, the heat dissipation electrical cabinet 100 further includes: a first vaporization pipe 140 and a first return pipe 150, both connected between the power module vaporization unit 125 and the power module liquefaction unit 124, and both the first vaporization pipe 140 and the first return pipe 150 are filled with a preset organic working fluid.

[0046] First, it should be noted that phase change cooling is a comprehensive and balanced heat dissipation method between air cooling and liquid cooling. It takes into account both heat dissipation efficiency and heat dissipation cost. Its working method is as follows: heat is used to heat the low-boiling-point organic working fluid in the vaporizer. After the working fluid undergoes phase change and vaporization, it enters the liquefaction unit through the vaporization pipe. Cool air blows through the liquefaction unit and removes the heat of the working fluid through the heat exchanger. After the working fluid is cooled and liquefied, it flows back to the vaporizer through the return pipe. The above vaporization and liquefaction phase change process is repeated to achieve heat dissipation.

[0047] This embodiment adds phase change cooling technology to the first heat dissipation subsystem 120. The power module vaporizer 125 and the power module liquefaction unit 124 work together and are connected by the first vaporization pipe 140 and the first return pipe 150. The internal components are filled with a highly insulating, low-boiling-point organic working fluid. The cooling of the power semiconductor devices installed on the power module vaporizer 125 is achieved through a cyclic phase change heat dissipation method.

[0048] Based on the above embodiments, the first heat dissipation subsystem 120 uses a combination of air cooling and phase change cooling technology, which balances heat dissipation efficiency and heat dissipation cost.

[0049] According to some embodiments, the first heat dissipation subsystem 120 also includes a reactor chamber 126, which is located at one end of the sealed continuous air duct 122 outside the cabinet and is completely isolated from the interior of the electrical cabinet body 110.

[0050] In this embodiment, a reactor chamber 126 is provided in the first heat dissipation subsystem 120. The reactor chamber 126 is an independent sealed chamber that is completely isolated from the internal chamber of the electrical cabinet body 110. This reduces the impact of high heat generation reactor components on the heat radiation temperature rise of the components in the internal chamber of the electrical cabinet body 110. The heat dissipation airflow of the sealed continuous air duct 122 outside the cabinet provides heat dissipation for the reactor chamber 126.

[0051] The reactor compartment 126 not only ensures the lifespan of the equipment through environmental control and safety isolation, but also optimizes the stability, efficiency and safety of the power system through functional integration.

[0052] According to some embodiments, the first heat dissipation subsystem 120 further includes an air outlet 127, which is disposed on the side wall and / or bottom of the reactor chamber 126.

[0053] The air outlet 127 is actually the outlet for hot air from the sealed continuous air duct 122 outside the cabinet. The air outlet 127 is located on the side wall and / or bottom of the reactor chamber 126, which can concentrate the hot air to the side or downward and avoid the vertically rising hot air from affecting adjacent cabinets.

[0054] According to some embodiments, the first heat dissipation subsystem 120 also includes a third set of fans 128, which are disposed inside the reactor chamber 126, and a reactor is also disposed inside the reactor chamber.

[0055] The reactor compartment 126 serves as the physical carrier for the operation of the reactor, and the reactor is installed inside. A separate fan, designated as the third fan group 128, is configured for the reactor compartment 126 to improve heat dissipation efficiency and ensure the safe operation of the reactor.

[0056] The model selection for the third group of fans 128 is similar to that for the first group of fans 123, and will not be elaborated upon here.

[0057] According to some embodiments, the first heat dissipation subsystem 120 further includes an air inlet 129, which is provided with an elbow shroud, a filter and / or a noise reduction device.

[0058] The air inlet 129 is actually the inlet for cold air from the sealed, continuous air duct 122 outside the cabinet.

[0059] Furthermore, in order to optimize airflow direction and reduce heat and cold interference, the air inlet 129 is located at the front of the electrical cabinet body 110, and the air outlet 127 is located at the rear of the electrical cabinet body 110.

[0060] Add at least one of the following at the air inlet 129: an elbow hood, a filter, and a noise reduction device.

[0061] Elbow-shaped hoods can prevent rain, snow, and dust from entering, maintaining the cleanliness and protective performance of the air duct. At the same time, airflow control and noise suppression are achieved through airflow guidance and structural optimization.

[0062] The filtration device can purify the airflow entering the sealed continuous air duct 122 outside the cabinet, filter dust and particulate matter, prevent pollutants from entering the air duct and affecting performance, and improve the cabinet's protection level; at the same time, it can also block corrosive substances from entering the sealed continuous air duct 122 outside the cabinet, reducing the risk of insulation aging and short circuit.

[0063] Noise reduction devices can reduce noise pollution and increase their applicability to various scenarios through their own materials and / or structure.

[0064] Furthermore, noise reduction devices can be installed on the inner wall of the elbow shroud.

[0065] According to some embodiments, the second heat dissipation subsystem 130 further includes a second set of fans 134, which are located at the junction of the open air duct 132 and the closed air duct 133 inside the cabinet.

[0066] The model selection for the second group of fans 134 is similar to that for the first group of fans 123, and will not be elaborated upon here.

[0067] A second set of fans 134 is installed at the junction of the open air duct 132 and the closed air duct 133 inside the cabinet to accelerate the flow of heat dissipation air in the second heat dissipation subsystem 130 and improve heat dissipation efficiency based on air cooling technology.

[0068] According to the example embodiment, the air outlet of the second set of fans 134 is aligned with the sealed air duct 133 inside the cabinet to provide directional heat dissipation and airflow for the sealed air duct 133 inside the cabinet.

[0069] According to some embodiments, the second heat dissipation subsystem 130 also includes a capacitor bank liquefaction unit 135 and a capacitor bank vaporization unit 136.

[0070] The capacitor bank liquefaction unit 135 is installed in the sealed continuous air duct 122 outside the cabinet, and the capacitor bank vaporization unit 136 is installed in the sealed air duct 133 inside the cabinet.

[0071] The heat dissipation electrical cabinet 100 also includes a second vaporization pipe 160 and a second return pipe 170, both of which are connected between the capacitor bank vaporizer 136 and the capacitor bank liquefaction unit 135, and both the second vaporization pipe 160 and the second return pipe 170 are filled with a preset organic working fluid.

[0072] This embodiment adds phase change cooling technology to the second heat dissipation subsystem 130. The capacitor bank liquefaction unit 135 and capacitor bank vaporization unit 136 work together and are connected by the second vaporization pipe 160 and the second return pipe 170. The internal components are filled with a highly insulating, low-boiling-point organic working fluid. The heat generated by the operation of the internal components of the electrical cabinet body 110 is cooled by circulating phase change heat dissipation.

[0073] According to some embodiments, the electrical cabinet body 110 includes: a capacitor bank 111 disposed in a closed air duct 133 inside the cabinet; and a control device 112 and cabinet components 113 disposed in an open air duct 132 inside the cabinet.

[0074] In other words, the open air duct 132 and the closed air duct 133 inside the cabinet together constitute the heat dissipation airflow duct of the second heat dissipation subsystem 130. The closed air duct 133 inside the cabinet provides directional heat dissipation flow for the capacitor bank 111, and the open air duct 132 inside the cabinet provides heat dissipation airflow for the control device 112 and the components 113 inside the cabinet.

[0075] According to the example embodiment, the control device 112 has start-stop control and speed regulation control functions for the first group of fans 123, the second group of fans 134 and the third group of fans 128.

[0076] According to the example embodiment, the components 113 inside the cabinet include, but are not limited to, fuses, AC / DC switches, charging / discharging resistors, charging / discharging contactors, auxiliary power supply transformers, AC filter capacitor banks, sampling elements, fan contactors, and connecting copper busbars that constitute the energy storage converter.

[0077] Based on the above embodiments, in one specific embodiment, such as Figure 2As shown, the first heat dissipation system 120 includes a first set of fans 123, an external air duct baffle 121, a power module liquefier 124, a power module vaporizer 125, a reactor chamber 126, an air outlet 127, and an air inlet 129. The external air duct baffle 121 and the outer wall of the electrical cabinet body 110 together form an external sealed continuous air duct 122. The first heat dissipation airflow flows through the internal part of the external sealed continuous air duct 122. The air inlet 129 for cold air and the outlet 127 for hot air are connected to the external environment. The first heat dissipation airflow is driven by the first set of fans 123 and flows through the capacitor liquefier 135, the power module liquefier 124, and the reactor chamber 126. The first heat dissipation airflow is isolated by the outer wall of the electrical cabinet body 110 and thus does not enter the interior of the cabinet.

[0078] The second heat dissipation system 130 includes a second set of fans 134, an internal air duct baffle 131, a capacitor bank liquefaction device 135, and a capacitor bank vaporizer 136. The internal air duct baffle 131 is located inside the electrical cabinet body 110 and divides the internal space of the electrical cabinet body 110 into an open internal air duct 132 and a closed internal air duct 133. A second heat dissipation airflow flows through the open internal air duct 132 and the closed internal air duct 133. The second heat dissipation airflow is driven by the second set of fans 134 and flows through the capacitor bank vaporizer 136, the capacitor bank 111, the power module vaporizer 125, the control device 112, and the internal components 113. The second heat dissipation airflow flows inside the cabinet and is isolated by the outer wall of the cabinet, so it is not connected to the external environment.

[0079] This embodiment utilizes a combined air-cooling and phase-change cooling technology. The external sealed continuous air duct 122 adopts an integrated through-ventilation duct. Targeting the different heat generation and protection levels of various components, the first heat dissipation airflow not only provides cooling for the capacitor bank liquefier 135 and the power module liquefier 124, but also accommodates air-cooling of the reactor compartment 126, saving on fan requirements and reducing the cost and energy consumption of the cooling system. Furthermore, the reactor compartment 126 is an independent sealed chamber, completely isolated from the internal circulation compartment of the electrical cabinet body 110, reducing the impact of high-heat-generating reactor components on the thermal radiation temperature rise of components inside the electrical cabinet body 110.

[0080] The enclosed air duct 133 inside the cabinet forces airflow through the second set of fans 134 to ensure that cold air flows concentratedly through the high-temperature area of ​​the capacitor bank 111 (such as the capacitor core or electrode connection), thereby improving heat dissipation efficiency. The open air duct 132 inside the cabinet covers the dispersed heat sources (i.e., the control device 112 and the components 113 inside the cabinet) through natural convection or low-speed airflow, meeting the heat dissipation requirements of low to medium power equipment, saving on the number of fans while ensuring heat dissipation efficiency.

[0081] The airflow of the two heat dissipation subsystems is completely isolated, preventing dirt and rain from entering the cabinet and achieving high protection performance of the cabinet. This fully leverages the combined advantages of high phase change cooling efficiency and low cost of reactor air cooling.

[0082] The following describes method embodiments of this application, which can be used to control device embodiments of this application. For details not disclosed in the device embodiments of this application, please refer to the device embodiments of this application.

[0083] Figure 3 A flowchart illustrating the control method for a heat dissipation electrical cabinet provided in an embodiment of this application. Figure 3 As shown, the method includes steps S310-S350.

[0084] In step S310, in response to the electrical cabinet start command, the power module vaporizer and power module liquefaction unit are started, and the first and second sets of fans are started according to the initial speed.

[0085] The electrical cabinet start command is issued by the user or automatically based on preset conditions.

[0086] Upon receiving the electrical cabinet start command, unlock the power module and start the first and second sets of fans, operating at the initial minimum speed.

[0087] In step S320, the first temperature of the power module vaporizer is obtained, and the first speed of the first group of fans is adjusted according to the first temperature and the first mapping relationship, wherein the first mapping relationship is the relationship between the first temperature and the first speed of the first group of fans.

[0088] The temperature of the power module vaporizer is monitored in real time and recorded as the first temperature.

[0089] The speed of the first set of fans (i.e., the first speed) is dynamically adjusted according to the temperature of the power module vaporizer. The rule followed by adjusting the first speed is denoted as the first mapping relationship. The higher the temperature of the power module vaporizer, the greater the first speed.

[0090] In step S330, the second temperature inside the electrical cabinet is obtained, and the second rotation speed of the second set of fans is adjusted according to the second temperature and the second mapping relationship, wherein the second mapping relationship is the relationship between the second temperature and the second rotation speed of the second set of fans.

[0091] The ambient temperature inside the electrical cabinet is monitored in real time and recorded as the second temperature.

[0092] The second set of fan speeds (i.e., the second speed) is dynamically adjusted according to the ambient temperature inside the electrical cabinet. The rule followed in adjusting the second speed is denoted as the second mapping relationship, where the higher the temperature inside the cabinet, the greater the second speed.

[0093] In step S340, when the second rotational speed reaches the preset second upper limit, the first rotational speed of the first group of fans is increased by a preset amount.

[0094] The heat dissipation electrical cabinet continues to work, and as the second temperature rises, the speed of the second set of fans (i.e., the second speed) is increased in real time. When the second speed reaches the preset second upper limit, the speed of the first set of fans (i.e., the first speed) is further increased.

[0095] The preset second upper limit is the maximum speed that the second set of fans can reach.

[0096] In step S350, if the first temperature is greater than the preset first temperature threshold when the first rotation speed reaches the preset first upper limit, the heat dissipation electrical cabinet is controlled to operate according to the preset power temperature derating curve.

[0097] The heat dissipation electrical cabinet continues to work. When the speed of the first set of fans (i.e., the first speed) reaches the preset first upper limit, if the temperature of the power module vaporizer (i.e., the first temperature) continues to rise and reaches the first temperature threshold, the heat dissipation electrical cabinet is controlled to start executing the power derating operation command and work according to the preset power temperature derating curve.

[0098] The preset first upper limit is the maximum speed that the first group of fans can reach.

[0099] It needs to be explained that the power derating operation command

[0100] The preset first temperature threshold can be set according to the actual situation.

[0101] In step S360, if the first group of fans and / or the second group of fans malfunction, and if the first temperature is greater than a preset second temperature threshold or the second temperature is greater than a preset third temperature threshold, the heat dissipation electrical cabinet is controlled to shut down.

[0102] The heat dissipation electrical cabinet operates continuously. When the first or second set of fans fails due to an occasional malfunction, or when the temperature of the power module vaporizer reaches the preset second temperature threshold or the temperature inside the cabinet reaches the preset third temperature threshold, a protection shutdown command is issued to control the heat dissipation electrical cabinet to shut down.

[0103] According to some embodiments, after step S310, the method further includes:

[0104] Step S311: Start the capacitor bank vaporizer and capacitor bank liquefaction unit.

[0105] Furthermore, according to the example embodiment, the method provided in this method embodiment can be executed by the control device described above.

[0106] The method controls the device provided above. Other functions can be found in the previous description and will not be repeated here.

[0107] Figure 4 An electronic device according to an exemplary embodiment of this application is shown. Reference is made below. Figure 4 To describe an electronic device 400 according to this embodiment of the present application. Figure 4 The electronic device 400 shown is merely an example and should not impose any limitations on the functionality and scope of use of the embodiments of this application.

[0108] like Figure 4 As shown, the electronic device 400 is presented in the form of a general-purpose computing device. The components of the electronic device 400 may include, but are not limited to: at least one processing unit 410, at least one storage unit 420, a bus 430 connecting different system components (including storage unit 420 and processing unit 410), a display unit 440, etc.

[0109] The storage unit stores program code that can be executed by the processing unit 410, causing the processing unit 410 to perform the methods described in the various exemplary embodiments of this application. For example, the processing unit 410 can perform the methods described above.

[0110] Storage unit 420 may include a readable medium in the form of a volatile storage unit, such as a random access memory unit (RAM) 4201 and / or a cache memory unit 4202, and may further include a read-only memory unit (ROM) 4203.

[0111] Storage unit 420 may also include a program / utility 4204 having a set (at least one) program module 4205, such program module 4205 including but not limited to: operating system, one or more application programs, other program modules and program data, each or some combination of these examples may include an implementation of a network environment.

[0112] Bus 430 can represent one or more of several types of bus structures, including a memory cell bus or memory cell controller, a peripheral bus, a graphics acceleration port, a processing unit, or a local bus using any of the various bus structures.

[0113] Electronic device 400 can also communicate with one or more external devices 300 (e.g., keyboard, pointing device, Bluetooth device, etc.), and with one or more devices that enable a user to interact with electronic device 400, and / or with any device that enables electronic device 400 to communicate with one or more other computing devices (e.g., router, modem, etc.). This communication can be performed via input / output (I / O) interface 450. Furthermore, electronic device 400 can also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN), and / or public networks, such as the Internet) via network adapter 460. Network adapter 460 can communicate with other modules of electronic device 400 via bus 430. It should be understood that, although not shown in the figures, other hardware and / or software modules can be used in conjunction with electronic device 400, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0114] Through the above description of the embodiments, those skilled in the art will readily understand that the exemplary embodiments described herein can be implemented by software or by combining software with necessary hardware. The technical solutions according to the embodiments of this application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (such as a CD-ROM, USB flash drive, external hard drive, etc.) or on a network, including several instructions to cause a computing device (such as a personal computer, server, or network device, etc.) to execute the methods described above according to the embodiments of this application.

[0115] Software products may employ any combination of one or more readable media. A readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may be, for example,, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of readable storage media (a non-exhaustive list) include: electrical connections with one or more wires, portable disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0116] Computer-readable storage media may include data signals propagated in baseband or as part of a carrier wave, carrying readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A readable storage medium may also be any readable medium other than a readable storage medium that can transmit, propagate, or transfer a program for use by or in connection with an instruction execution system, apparatus, or device. The program code contained on the readable storage medium may be transmitted using any suitable medium, including but not limited to wireless, wired, optical fiber, RF, etc., or any suitable combination thereof.

[0117] Program code for performing the operations of this application can be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Java and C++, and conventional procedural programming languages ​​such as C or similar languages. The program code can execute entirely on the user's computing device, partially on the user's computing device, as a standalone software package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server. In cases involving remote computing devices, the remote computing device can be connected to the user's computing device via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computing device (e.g., via the Internet using an Internet service provider).

[0118] The aforementioned computer-readable medium carries one or more programs, which, when executed by a device, cause the computer-readable medium to perform the aforementioned functions.

[0119] Those skilled in the art will understand that the above modules can be distributed in the device as described in the embodiments, or they can be modified accordingly and located in one or more devices that are unique to this embodiment. The modules in the above embodiments can be combined into one module, or they can be further divided into multiple sub-modules.

[0120] Figure 5 An energy storage converter according to an exemplary embodiment of this application is shown to include a heat dissipation electrical cabinet 100 as described above.

[0121] Through the description of the above embodiments, those skilled in the art will readily understand that the exemplary embodiments described herein can be implemented by software or by combining software with necessary hardware. Therefore, the technical solutions according to the embodiments of this application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (such as a CD-ROM, USB flash drive, external hard drive, etc.) or on a network, including several instructions to cause a computing device (such as a personal computer, server, mobile terminal, or network device, etc.) to execute the methods according to the embodiments of this application.

[0122] Exemplary embodiments of this application have been specifically shown and described above. It should be understood that this application is not limited to the detailed structures, arrangements, or implementation methods described herein; rather, this application is intended to cover various modifications and equivalent arrangements contained within the spirit and scope of the appended claims.

Claims

1. A control method for a heat dissipation electrical cabinet, the heat dissipation electrical cabinet comprising: Electrical cabinet body; The first heat dissipation subsystem includes an external air duct baffle, which is located outside the electrical cabinet body and is used to form a closed and continuous external air duct together with the outer wall of the electrical cabinet body. The second heat dissipation subsystem includes an internal air duct baffle, which is located inside the electrical cabinet body and is used to divide the space inside the electrical cabinet body into an open internal air duct and a closed internal air duct. The first heat dissipation subsystem further includes a first set of fans, which are installed in the sealed and continuous air duct outside the cabinet. The first heat dissipation subsystem further includes: The power module liquefier is located in a sealed, continuous air duct outside the cabinet; and The power module vaporizer is installed inside the open air duct of the cabinet; The heat dissipation electrical cabinet also includes: The first vaporization pipe and the first return pipe are both connected between the power module vaporizer and the power module liquefaction unit, and the first vaporization pipe and the first return pipe are both filled with a preset organic working fluid. The second heat dissipation subsystem further includes a second set of fans, which are located at the junction of the open air duct and the closed air duct inside the cabinet. The second heat dissipation subsystem further includes: The capacitor bank liquefaction unit is located within a sealed, continuous air duct outside the cabinet; and The capacitor bank vaporizer is installed inside the sealed air duct of the cabinet; The heat dissipation electrical cabinet also includes: The second vaporization pipe and the second return pipe are both connected between the capacitor bank vaporizer and the capacitor bank liquefaction unit, and the interior of the second vaporization pipe and the second return pipe are both filled with a preset organic working fluid. The method is characterized by comprising: In response to the electrical cabinet start command, the power module vaporizer and the power module liquefaction unit are started, and the first set of fans and the second set of fans are started according to the initial speed. The first temperature of the power module vaporizer is obtained, and the first speed of the first group of fans is adjusted according to the first temperature and a first mapping relationship, wherein the first mapping relationship is the relationship between the first temperature and the first speed of the first group of fans. The second temperature inside the electrical cabinet is obtained, and the second rotation speed of the second set of fans is adjusted according to the second temperature and a second mapping relationship, wherein the second mapping relationship is the relationship between the second temperature and the second rotation speed of the second set of fans; When the second rotational speed reaches the preset second upper limit, the first rotational speed of the first group of fans is increased by a preset amount; If the first temperature is greater than the first temperature threshold when the first rotation speed reaches the preset first upper limit, the heat dissipation electrical cabinet is controlled to operate according to the preset power temperature derating curve. In the event of a malfunction in the first group of fans and / or the second group of fans, if the first temperature exceeds a preset second temperature threshold or the second temperature exceeds a preset third temperature threshold, the heat dissipation electrical cabinet shall be shut down.

2. The control method of the heat dissipating electrical cabinet according to claim 1, characterized in that, The first heat dissipation subsystem also includes a reactor compartment, which is located at one end of the sealed continuous air duct outside the cabinet and is completely isolated from the interior of the electrical cabinet body.

3. The control method for the heat dissipation electrical cabinet according to claim 2, characterized in that, The first heat dissipation subsystem also includes an air outlet, which is located on the side wall and / or bottom of the reactor chamber.

4. The control method for the heat dissipation electrical cabinet according to claim 2, characterized in that, The first heat dissipation subsystem also includes a third set of fans, which are located inside the reactor room, and the reactor room is also equipped with a reactor.

5. The control method for the heat dissipation electrical cabinet according to claim 1, characterized in that, The first heat dissipation subsystem also includes an air inlet, which is equipped with an elbow shroud, a filter and / or a noise reduction device.

6. The control method for the heat dissipation electrical cabinet according to claim 1, characterized in that, The electrical cabinet body includes: The capacitor bank is located within the sealed air duct inside the cabinet; and The control device and internal components are located in the open air duct inside the cabinet.

7. The control method for the heat dissipation electrical cabinet according to claim 1, characterized in that, After responding to the electrical cabinet start command, starting the power module vaporizer and the power module liquefaction unit, and starting the first set of fans and the second set of fans at the initial speed, the method further includes: Start the capacitor bank vaporizer and the capacitor bank liquefaction unit.

8. An electronic device, characterized in that, include: One or more processors; Storage device for storing one or more programs; When the one or more programs are executed by the one or more processors, the one or more processors implement the method as described in any one of claims 1-7.

9. A computer-readable storage medium having a computer program or instructions stored thereon, characterized in that, When the computer program or instructions are executed by a processor, they implement the method as described in any one of claims 1-7.

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