Power module, power converter and radiator

Abstract

The invention provides a power module, a power converter and a radiator, relates to the technical field of energy, and aims to solve the technical problem of poor heat dissipation performance of the power module. The power module provided by the invention comprises a power device and a first heat dissipation substrate, the first heat dissipation substrate comprises a first conductive plate, a first metal plate and a first insulating layer, and the first insulating layer is located between the first metal plate and the first conductive plate; in addition, the power module further comprises a first pipe body, the first pipe body is internally provided with a flow channel for a cooling medium to circulate, and the first heat dissipation substrate forms at least part of the pipe wall of the first pipe body. In the power module provided by the invention, the conductive circuit in the first conductive plate is connected with the power device, so that the power supply and communication requirements of the power device can be met, and the first insulating layer can improve the breakdown resistance of the first heat dissipation substrate, so that the power module can work under the conditions of relatively high voltage and relatively high current.

Description

Technical Field

[0001] This application relates to the field of energy technologies, and in particular, to a power module, a power converter, and a radiator. Background Art

[0002] With the continuous development and wide popularization of green energy, the importance of electric energy in people's daily lives has become increasingly prominent. During the transmission and use of electric energy, parameters such as the voltage or current of the electric energy need to be converted or regulated. For example, an inverter may include power devices such as insulated gate bipolar transistors or metal-oxide-semiconductor field effect transistors. The inverter mainly converts or regulates parameters such as the voltage or current of the electric energy through the above-mentioned power devices. During the operation of the inverter, the power devices generate a large amount of heat. Therefore, in order to ensure the operating performance of the inverter, it is necessary to dissipate heat from the power devices. In the current heat dissipation methods, the heat transfer path between the power devices and the heat dissipation structure is relatively long, with a large thermal resistance, which is not conducive to the heat dissipation of the power devices. In addition, with the continuous improvement of industry requirements, the voltage and current borne by the power devices have also increased significantly, and the electrical insulation performance of the heat dissipation structure also needs to be considered. Therefore, how to effectively improve the heat dissipation performance of the power devices and effectively take into account the electrical insulation performance has become an urgent technical problem to be solved. Summary of the Invention

[0003] This application provides a power module, a power converter, and a radiator with good heat dissipation performance.

[0004] In a first aspect, the present application provides a power module, which includes a power device and a first heat dissipation substrate. The first heat dissipation substrate includes a first conductive plate, a first metal plate, and a first insulating layer. The first insulating layer is located between the first metal plate and the first conductive plate, and the first conductive plate, the first metal plate, and the first insulating layer are an integral structure. The power device is attached to the first conductive plate. In the power module provided by the present application, the first heat dissipation substrate includes the first conductive plate, the first metal plate, and the first insulating layer that are an integral structure, so that the first heat dissipation substrate has a lower thermal resistance. The first metal plate made of a metal material has good thermal conductivity and also has advantages such as low material cost and manufacturing cost. Therefore, by configuring the first metal plate, the heat dissipation capacity and application range of the first heat dissipation substrate can be effectively improved. In addition, the first insulating layer located between the first conductive plate and the first metal plate can achieve an insulating connection between the first conductive plate and the first metal plate. The first insulating layer can improve the breakdown resistance performance of the first heat dissipation substrate, thereby improving the breakdown resistance of the entire power module, enabling the power module to operate under higher voltage and higher current conditions. In addition, the power module further includes a first tube body, and a flow channel for a cooling medium to flow through is provided in the first tube body. Among them, the first heat dissipation substrate forms at least part of the tube wall of the first tube body. The power module can be cooled by a liquid cooling method, thereby having good heat dissipation performance. In addition, the first heat dissipation substrate forming at least part of the tube wall of the first tube body can effectively reduce the heat transfer path between the power device and the cooling medium, which is beneficial to ensuring the heat dissipation performance of the power module.

[0005] In specific settings, the first conductive plate includes a first conductive circuit, and the power device is connected to the first conductive circuit, which can meet the power supply or communication requirements of the power device.

[0006] Among them, the cooling medium in the first tube body can specifically be a fluid such as water or oil liquid, or a medium that can generate gas-liquid phase transformation.

[0007] In specific settings, the first metal plate forms at least part of the inner wall of the first tube body, or the first insulating layer forms at least part of the inner wall of the first tube body. Or, both the first metal plate and the first insulating layer form at least part of the inner wall of the first tube body.

[0008] In an example, the first metal plate may have a groove, and both the first conductive plate and the first insulating layer are located in the groove, which is beneficial to reducing the thickness dimension of the first heat dissipation substrate.

[0009] In an example, the first heat dissipation substrate may further include heat dissipation fins, and the heat dissipation fins are connected to the first tube body. The heat dissipation fins can have a large heat dissipation area, which is beneficial to improving the cooling performance of the first tube body.

[0010] In one example, the power module may further include a second heat dissipation substrate. The second heat dissipation substrate is disposed opposite to the first heat dissipation substrate, and the power device is located between the first heat dissipation substrate and the second heat dissipation substrate. The second heat dissipation substrate includes a second metal plate and a second insulating layer, and the second metal plate and the second insulating layer are an integral structure. The power device is attached to the second insulating layer. By providing the first heat dissipation substrate and the second heat dissipation substrate, bilateral cooling of the power device can be achieved, and it has good heat dissipation performance.

[0011] In one example, the second heat dissipation substrate can also meet the electrical connection requirements of the power device. That is, the second heat dissipation substrate may include a second conductive plate. The second insulating layer is located between the second metal plate and the second conductive plate, and the second conductive plate, the second metal plate, and the second insulating layer are an integral structure. Among them, the second conductive plate includes a second conductive circuit, and the power device is connected to the second conductive circuit.

[0012] In one example, the power module further includes a second tube body, and a flow channel for the cooling medium to flow through is provided in the second tube body. Among them, the second heat dissipation substrate constitutes at least part of the tube wall of the second tube body, and the second insulating layer constitutes at least part of the inner wall of the second tube body. The power module can be cooled by a liquid cooling method, thereby having good heat dissipation performance. In addition, the second heat dissipation substrate constitutes at least part of the tube wall of the second tube body, which can effectively reduce the heat transfer path between the power device and the cooling medium, and is beneficial to ensuring the heat dissipation performance of the power module.

[0013] In specific settings, the second metal plate constitutes at least part of the inner wall of the second tube body, or the second insulating layer constitutes at least part of the inner wall of the second tube body. Or, both the second metal plate and the second insulating layer constitute at least part of the inner wall of the second tube body.

[0014] In one example, the first heat dissipation substrate has a protrusion facing the power device, and the power device is attached to the first conductive plate at the top of the protrusion. Or, the second heat dissipation substrate has a protrusion facing the power device, and the power device is attached to the second conductive plate at the top of the protrusion. Or, both the first heat dissipation substrate and the second heat dissipation substrate can be provided with the above-mentioned protrusions. By providing the protrusions, the distance between the first heat dissipation substrate and the second heat dissipation substrate can be increased, which is beneficial to arranging more devices between the first heat dissipation substrate and the second heat dissipation substrate.

[0015] In one example, the second heat dissipation substrate further includes heat dissipation fins, and the heat dissipation fins are connected to the second tube body. The heat dissipation fins provide a large heat exchange area, which helps to improve the heat dissipation performance of the power module.

[0016] In specific settings, the material of the first insulating layer or the second insulating layer includes at least one of alumina, aluminum nitride, boron oxide, magnesium oxide, silicon oxide, and resin.

[0017] In a second aspect, the present application also provides a power converter, which includes a housing and the above-mentioned power module, and the power devices in the power module are located inside the housing. By configuring the above-mentioned power module, the power converter has good heat dissipation performance, so that the operating power of the power converter can be significantly improved.

[0018] In a third aspect, the present application also provides a heat sink, which includes a heat dissipation substrate. The heat dissipation substrate includes a conductive plate, a metal plate and an insulating layer. The insulating layer is located between the metal plate and the conductive plate, and the conductive plate, the metal plate and the insulating layer are an integral structure. The conductive plate is used to fit with the device to be cooled. The heat dissipation substrate includes an integral structure of a conductive plate, a metal plate and an insulating layer, so that the heat dissipation substrate has a low thermal resistance. The metal plate made of a metal material has good thermal conductivity, and also has advantages such as low material cost and manufacturing cost. Therefore, by configuring the metal plate, the heat dissipation ability and application range of the heat dissipation substrate can be effectively improved. In addition, the insulating layer located between the conductive plate and the metal plate can realize the insulating connection between the conductive plate and the metal plate. The insulating layer can improve the breakdown resistance performance of the heat dissipation substrate, thereby improving the breakdown resistance of the entire power module, so that the power module can operate under higher voltage and higher current conditions.

[0019] In specific settings, the conductive plate includes conductive lines. The device to be cooled is connected to the conductive lines, and the conductive lines in the conductive plate are connected to the power devices, which can meet the power supply or communication requirements of the power devices.

[0020] In an example, the heat sink further includes a tube body, and the tube body has a flow channel for the cooling medium to flow through. Among them, the heat dissipation substrate constitutes at least part of the tube wall of the tube body. The heat sink can be cooled by a liquid cooling method, so as to have good heat dissipation performance. In addition, the heat dissipation substrate constitutes at least part of the tube wall of the tube body, which can effectively reduce the heat transfer path between the power device and the cooling medium, and is beneficial to ensuring the heat dissipation performance of the heat sink.

[0021] In specific settings, the material of the insulating layer includes at least one of alumina, aluminum nitride, boron oxide, magnesium oxide, silicon oxide and resin.

[0022] In an example, the metal plate has a groove, and both the conductive plate and the insulating layer are located in the groove. By setting the groove, it is beneficial to reduce the thickness dimension of the heat dissipation substrate and can improve the flexibility of the heat dissipation substrate in application. Description of the Drawings

[0023] Figure 1 It is a schematic structural diagram of a conventional inverter provided by an embodiment of the present application;

[0024] Figure 2 It is a schematic cross-sectional structure diagram of another power module provided by an embodiment of the present application;

[0025] Figure 3 Another cross-sectional structure diagram of a power module provided by an embodiment of the present application;

[0026] Figure 4 Another cross-sectional structure diagram of a power module provided by an embodiment of the present application;

[0027] Figure 5 Another cross-sectional structure diagram of a power module provided by an embodiment of the present application;

[0028] Figure 6 Another cross-sectional structure diagram of a power module provided by an embodiment of the present application;

[0029] Figure 7 Another cross-sectional structure diagram of a power module provided by an embodiment of the present application;

[0030] Figure 8 Another cross-sectional structure diagram of a power module provided by an embodiment of the present application;

[0031] Figure 9 Another cross-sectional structure diagram of a power module provided by an embodiment of the present application;

[0032] Figure 10 A structural block diagram of a photovoltaic system provided by an embodiment of the present application. Detailed implementation manners

[0033] In order to make the objectives, technical solutions, and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

[0034] To facilitate the understanding of the radiator provided by the embodiment of the present application, its application scenario will be introduced first below.

[0035] The radiator provided by the embodiment of the present application can be applied in a variety of scenarios with heat dissipation requirements to cool the device to be cooled so that the device to be cooled is within a normal temperature range to ensure the working performance and safety of the device to be cooled.

[0036] For example, as Figure 1As shown, an inverter 01 can be included in a photovoltaic power generation device. The inverter 01 can convert the direct current generated by a solar panel into alternating current and output it externally. In actual use, the inverter 01 can include a circuit board 010 and a power module 011. The power module 011 is disposed on the circuit board 010 and electrically connected to the conductive lines in the circuit board 010. The power module 011 can include power devices such as power transistors 012. In actual application, the power module 011 generates a large amount of heat. Therefore, in order to ensure the working performance and reliability of the inverter 01, it is necessary to dissipate the heat of the power module 011 in the inverter 01. Currently, the air-cooling method is mainly used to dissipate the heat of the power module 011. Briefly speaking, a radiator 02 can be provided at the position of the power transistor 012 corresponding to the power module 011. The radiator 02 can include heat dissipation fins 021. When the air flow passes through the gaps between the heat dissipation fins 021, it can quickly take away the heat of the heat dissipation fins 021, thereby cooling the power module 011. Generally speaking, the heat generated by the power module 011 can be transferred to the heat dissipation fins 021 of the radiator 02 through heat conduction, and the air flow passing through the heat dissipation fins 021 can quickly take away the heat of the radiator 02, thereby realizing the cooling of the power module 011.

[0037] However, with the continuous increase of the working power of the inverter 01, the heat dissipation requirement of the power module 011 has also increased significantly. Therefore, simply using the air-cooled radiator 02 to dissipate the heat of the power module 011 can no longer meet the heat dissipation requirement of the power module 011. Moreover, in the current inverter 01, the heat dissipation path between the power device and the radiator is relatively long, which is not conducive to improving the heat dissipation effect of the power device.

[0038] In addition, with the continuous increase of the industry demand, the voltage and current borne by the power device have also increased significantly. Therefore, in actual application, the electrical insulation performance of the heat dissipation structure also needs to be considered. Therefore, how to effectively improve the heat dissipation performance of the power device and effectively take into account the electrical insulation performance has become an urgent technical problem to be solved.

[0039] For this reason, the embodiments of the present application provide a radiator with good heat dissipation performance and a power module equipped with the radiator.

[0040] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0041] As Figure 2As shown, in an example provided by the present application, the power module 10 includes a power device 11 and a heat dissipation substrate 12. The heat dissipation substrate 12 includes a conductive plate 121, a metal plate 122, and an insulating layer 123, and the insulating layer 123 is located between the metal plate 122 and the conductive plate 121. The conductive plate 121, the metal plate 122, and the insulating layer 123 are of an integrated structure, thus having a lower thermal resistance. That is, no additional thermal conductive materials or connection materials such as thermal conductive grease are provided between the insulating layer 123 and the conductive plate 121 and the metal plate 122, so that the heat transfer path formed by the conductive plate 121 - insulating layer 123 - metal plate 122 has a smaller thermal resistance, which is beneficial to improving the heat dissipation performance of the power module 10. The power device 11 is attached to the conductive plate 121, so that the heat of the power device 11 can be effectively conducted into the heat dissipation substrate 12 for dissipation. The conductive plate 121 includes conductive lines (not shown in the figure), and the power device 11 is connected to the conductive lines.

[0042] In addition, in the example provided by the present application, the power module 10 further includes a tube body 13, and the tube body 13 has a flow channel for the cooling medium to flow through. Among them, the heat dissipation substrate 12 constitutes at least part of the tube wall of the tube body 13. In specific applications, the cooling medium can be water or oil, etc., and the specific type of the cooling medium can be reasonably selected according to actual needs, which will not be elaborated here.

[0043] Generally speaking, in the example provided by the present application, the heat dissipation substrate 12 includes an integrated conductive plate 121, a metal plate 122, and an insulating layer 123, so that the heat dissipation substrate 12 has a lower thermal resistance. In addition, the conductive plate 121 includes conductive lines, and the conductive lines are connected to the power device 11, which can meet the power supply and communication requirements of the power device 11. The metal plate 122 made of a metal material has good thermal conductivity, and also has advantages such as low material cost and manufacturing cost. Therefore, by configuring the metal plate 122, the heat dissipation capacity and application range of the heat dissipation substrate 12 can be effectively improved. In addition, the insulating layer 123 located between the conductive plate 121 and the metal plate 122 can realize the insulating connection between the conductive plate 121 and the metal plate 122. The insulating layer 123 can improve the breakdown resistance performance of the heat dissipation substrate 12, thereby improving the breakdown resistance of the entire power module 10, so that the power module 10 can work under higher voltage and higher current conditions. In addition, when the cooling medium flows in the tube body 13, the cooling medium will be in direct contact with the heat dissipation substrate 12, thereby quickly taking away the heat in the heat dissipation substrate 12, which can effectively improve the heat dissipation performance of the power module 10. In the heat conduction path between the power device 11 and the cooling medium, only the heat dissipation substrate 12 and the connection layer 110 are included, the heat transfer path is short, and it has a small thermal resistance, which can effectively improve the heat transfer efficiency. In addition, the conductive plate 121 and the cooling medium are effectively isolated by the insulating layer 123, which can ensure the safety and reliability of the power module 10.

[0044] It should be noted that in the examples provided in this application, the power device 11 is connected to the conductive plate 121 through the connection layer 110, so as to achieve a reliable electrical connection between the conductive lines in the power device 11 and the conductive plate 121. In addition, the connection layer 110 can also avoid or reduce the generation of voids between the contact surfaces of the power device 11 and the conductive plate 121, thereby increasing the thermal resistance, and thus can effectively improve the thermal conductivity between the power device 11 and the conductive plate 121. Among them, the connection layer 110 can specifically be a soldering material such as soft soldering. Or, the connection layer 110 can also be formed by sintering materials such as silver or copper. Or, it can be understood that in some examples, the connection layer 110 can also play a role in fixedly connecting the power device 11 and the metal plate 122. In actual applications, the specific material and preparation process of the connection layer 110 can be flexibly selected and set according to actual needs, which will not be elaborated here.

[0045] Among them, the power device 11 can specifically be an insulated gate bipolar transistor (IGBT) chip, a metal oxide semiconductor field effect transistor (MOSFET) chip, a fast recovery diode (FRD) chip, etc. In actual applications, the specific type of the power device 11 can be reasonably selected according to actual needs.

[0046] In specific applications, the specific materials of the conductive plate 121, the metal plate 122, and the insulating layer 123 can be diverse.

[0047] For the conductive plate 121, in the power module 10, the conductive plate 121 can achieve two functions of electrical connection and heat conduction. That is, the conductive plate 121 has conductive lines, and the conductive lines are used for electrically connecting with the power device 11, so as to meet the power supply and communication requirements of the power device 11. In addition, the conductive plate 121 is in contact with the power device 11, so that the heat generated by the power device 11 can be effectively dissipated through the conductive plate 121.

[0048] In practical applications, the conductive plate 121 can be composed of one or more than two materials. Specifically, the conductive plate 121 may only include conductive traces, and the conductive traces in the conductive plate 121 can be made of materials with good electrical conductivity such as copper or aluminum. In addition, in addition to the conductive traces, the conductive plate 121 can also include a substrate structure for carrying the conductive traces, and the substrate in the conductive plate 121 can be made of a non-conductive material with good thermal conductivity. In practical applications, the specific material and structure type of the conductive plate 121 can be reasonably selected and set according to actual needs, which will not be elaborated here.

[0049] For the metal plate 122, in the power module 10, the metal plate 122 mainly functions as heat conduction or heat dissipation. In practical applications, the metal plate 122 can be made of materials with good thermal conductivity such as copper or aluminum. In addition, in some cases, the metal plate 122 also has good electromagnetic shielding properties, which can prevent external electromagnetic waves from interfering with the power device 11 and effectively improve the working stability of the power device 11.

[0050] For the insulating layer 123, in the power module 10, the insulating layer 123 can achieve a fixed connection between the conductive plate 121 and the metal plate 122 to ensure the integrity of the heat dissipation substrate 12. In addition, the insulating layer 123 can achieve electrical isolation between the conductive plate 121 and the metal plate 122. Among them, the specific material of the insulating layer 123 can be any one or a combination of at least two of alumina, aluminum nitride, boron oxide, magnesium oxide, silicon oxide and resin. In specific settings, the material and thickness of the insulating layer 123 can be reasonably set according to the requirements of insulation performance.

[0051] In specific settings, the shape and position of the insulating layer 123 in the heat dissipation substrate 12 can be diverse.

[0052] For example, as Figure 2 shown, in an example provided in the present application, the cross-sectional shape of the insulating layer 123 is generally U-shaped, and the insulating layer 123 does not penetrate the thickness of the metal plate 122. That is, the insulating layer 123 does not penetrate the thickness of the metal plate 122. Therefore, the metal plate 122 constitutes a part of the inner wall of the tube body 13. Or it can be understood that the metal plate 122 has a groove ( Figure 2 not shown in the figure), and both the insulating layer 123 and the conductive plate 121 are located in the groove. Specifically, the insulating layer 123 covers the inner wall of the groove, so that the insulating layer 123 can effectively insulate and isolate the metal plate 122 and the conductive plate 121. In addition, by setting the groove, the thickness dimension of the entire heat dissipation substrate 12 can be effectively reduced, and the convenience of the heat dissipation substrate 12 in application can be improved.

[0053] Or, as Figure 3As shown, in another example provided by the present application, the cross-sectional shape of the insulating layer 123 is approximately U-shaped, and the insulating layer 123 penetrates the thickness of the metal plate 122. Alternatively, it can be understood that the part of the insulating layer 123 that penetrates the thickness of the metal plate 122 constitutes part of the inner wall of the tube body 13.

[0054] It can be understood that in Figure 3 and Figure 3 in the example provided, the power module 10 dissipates heat by means of single-sided cooling. However, in other examples, the power module 10 can also adopt a double-sided heat dissipation structure.

[0055] For example, as Figure 4 shown, in an example provided by the present application, the power module 10 includes two heat dissipation substrates, and the two heat dissipation substrates are respectively located on both sides of the power device 11 to effectively improve the heat dissipation performance of the power module 10.

[0056] For the convenience of distinguishing and describing, in the following examples, the two heat dissipation substrates are respectively defined as the first heat dissipation substrate 12 and the second heat dissipation substrate 14.

[0057] Briefly speaking, the power device 11 has a first heat conduction surface (such as Figure 4 the lower surface in Figure 4 ) and a second heat conduction surface (such as

[0058] the upper surface in Figure 2 ). The second heat dissipation substrate 14 and the first heat dissipation substrate 12 are arranged oppositely, and the power device 11 is located between the first heat dissipation substrate 12 and the second heat dissipation substrate 14. The first heat conduction surface is attached to the first heat dissipation substrate 12 through the connection layer 110, and the second heat conduction surface is attached to the second heat dissipation substrate 14 through the connection layer 110, so that the first heat dissipation substrate 12 and the second heat dissipation substrate 14 can effectively dissipate heat from the first heat conduction surface and the second heat conduction surface of the power device 11, and have good heat dissipation performance.

[0059] The second heat dissipation substrate 14 will be specifically described below.

[0060] As Figure 5 shown, in an example provided by the present application, the second heat dissipation substrate 14 includes a second metal plate 142 and a second insulating layer 143, and the second metal plate 142 and the second insulating layer 143 are an integral structure.

[0061] Generally speaking, in the examples provided in this application, the second heat dissipation substrate 14 includes a second metal plate 142 and a second insulating layer 143 with an integral structure, so that the second heat dissipation substrate 14 has a lower thermal resistance. The second metal plate 142 made of a metal material has good thermal conductivity, and also has advantages such as low material cost and manufacturing cost. Therefore, by configuring the second metal plate 142, the heat dissipation capacity and applicable range of the second heat dissipation substrate 14 can be effectively improved. In addition, the second insulating layer 143 is attached to the power device 11, which can effectively improve the insulation between the power device 11 and the second metal plate 142, thereby improving the breakdown resistance of the entire power module 10, enabling the power module 10 to operate under higher voltages and higher currents.

[0062] It should be noted that, in the examples provided in this application, the power device 11 is attached to the second insulating layer 143 through a connection layer 110 to avoid or reduce the generation of voids between the contact surfaces of the power device 11 and the second insulating layer 143, thereby increasing the thermal resistance, and thus effectively improving the thermal conductivity between the power device 11 and the second insulating layer 143. Among them, the connection layer 110 can specifically be a soldering material such as soft soldering. Or, it can also be formed by sintering materials such as silver or copper. Or, it can be understood that in some examples, in addition to playing an effective heat transfer role between the power device 11 and the second insulating layer 143, the connection layer 110 can also play a role in fixedly connecting the power device 11 and the second insulating layer 143. In actual applications, the specific material and preparation process of the connection layer 110 can be flexibly selected and set according to actual needs, which will not be elaborated here.

[0063] In addition, in the examples provided in this application, the second heat dissipation substrate 14 has a protrusion 144 facing the power device 11, and the second insulating layer 143 on the top of the protrusion 144 is attached to the power device 11. By providing the protrusion 144, a larger accommodation space can be formed between the second heat dissipation substrate 14 and the first heat dissipation substrate 12, and more devices can be arranged between the first heat dissipation substrate 12 and the second heat dissipation substrate 14, which can effectively improve the functionality of the power module 10. Or, when a larger accommodation space is formed between the second heat dissipation substrate 14 and the first heat dissipation substrate 12, it is also beneficial to implement processes such as encapsulation of the power module 10.

[0064] It can be understood that in the above examples, the second heat dissipation substrate 14 having the protrusion 144 is taken as an example for illustrative description. In other examples, the first heat dissipation substrate 12 can also have a protrusion structure similar to the protrusion 144, which will not be described in detail here.

[0065] In addition, in the above example, the second heat dissipation substrate 14 only includes the second insulating layer 143 and the second metal plate 142. However, in other examples, the second heat dissipation substrate 14 may also include a second conductive plate 141 to meet the electrical connection requirements of the power device 11.

[0066] Specifically, as Figure 5 shown, in another example provided by the present application, the second heat dissipation substrate 14 includes a second conductive plate 141, a second metal plate 142, and a second insulating layer 143. The second insulating layer 143 is located between the second metal plate 142 and the second conductive plate 141. The second conductive plate 141, the second metal plate 142, and the second insulating layer 143 are an integral structure, thus having a lower thermal resistance. That is, no additional thermal conductive materials or connection materials such as thermal conductive silicone grease are provided between the second insulating layer 143 and the second conductive plate 141 and the second metal plate 142, so that the heat transfer path formed by the second conductive plate 141 - the second insulating layer 143 - the second metal plate 142 has a smaller thermal resistance, which is beneficial to improving the heat dissipation performance of the power module 10. The second insulating layer 143 located between the second conductive plate 141 and the second metal plate 142 can achieve an insulating connection between the second conductive plate 141 and the second metal plate 142. The second insulating layer 143 can improve the breakdown resistance performance of the second heat dissipation substrate 14, thereby improving the breakdown resistance of the entire power module 10, enabling the power module 10 to operate under higher voltages and higher currents. It should be noted that when the second heat dissipation substrate 14 includes the second conductive plate 141, the connection layer 110 located between the second conductive plate 141 and the power device 11 can also achieve a conductive connection between the power device 11 and the second conductive plate 141, that is, the conductive circuit in the second conductive plate 141 can be conductively connected to the power device 11 through the connection layer 110.

[0067] In actual application, the materials and structural types of the second conductive plate 141, the second metal plate 142, and the second insulating layer 143 can be set the same or similarly according to the above-mentioned conductive plate 121, metal plate 122, and insulating layer 123, and will not be elaborated here.

[0068] In addition, in actual application, the second heat dissipation substrate 14 can also be applied in a liquid cooling structure.

[0069] For example, as Figure 6 shown, in an example provided by the present application, the power module 10 further includes a second tube body 15, and the second tube body 15 has a flow channel for the cooling medium to flow through. Among them, the second heat dissipation substrate 14 constitutes at least part of the tube wall of the second tube body 15. In specific application, the cooling medium can be water or oil liquid, etc., and the specific type of the cooling medium can be reasonably selected according to actual needs and will not be elaborated here.

[0070] When the cooling medium flows in the second tube body 15, the cooling medium will be in direct contact with the second heat dissipation substrate 14, so as to quickly remove the heat in the second heat dissipation substrate 14, effectively improving the heat dissipation performance of the power module 10. The second conductive plate 141 and the cooling medium are effectively isolated by the second insulating layer 143, which can ensure the safety and reliability of the power module 10.

[0071] When specifically setting, the shape and position of the second insulating layer 143 in the second heat dissipation substrate 14 can be diverse.

[0072] For example, as Figure 6 shown, in an example provided by the present application, the second insulating layer 143 does not penetrate the thickness of the metal plate, that is, the second metal plate 142 forms a part of the inner wall of the tube body. Or it can be understood that the second metal plate 142 has a groove (not shown in the figure), and both the second insulating layer 143 and the second conductive plate 141 are located in the groove. Specifically, the second insulating layer 143 covers the inner wall of the groove, so that the second insulating layer 143 can effectively insulate and isolate the second metal plate 142 and the second conductive plate 141. In addition, by setting the groove, the thickness dimension of the entire second heat dissipation substrate 14 can be effectively reduced, improving the convenience of the second heat dissipation substrate 14 during application.

[0073] When specifically setting the specific structure of the second heat dissipation substrate 14, the second heat dissipation substrate 14 can be reasonably set according to the above-mentioned heat dissipation substrate 12, which will not be elaborated here.

[0074] In addition, the above-mentioned first heat dissipation substrate 12 and second heat dissipation substrate 14 can be applied not only in the liquid cooling pipeline, but also in other heat dissipation structures.

[0075] For example, as Figure 7 shown, in an example provided by the present application, the first tube body is specifically the tube body of a heat pipe. Specifically, the power module 10 further includes a first heat pipe 16. The first metal plate 122 can form a sealed cavity 160 as a part of the first heat pipe 16, and the cavity 160 includes a cooling working medium. Among them, one end of the first heat pipe 16 in contact with the first metal plate 122 can be used as the evaporation end, and the end of the first heat pipe 16 far from the first metal plate 122 can be used as the condensation end. The cooling working medium in the cavity 160 vaporizes after absorbing the heat in the first metal plate 122 at the evaporation end, and liquefies and releases heat at the condensation end and then flows back to the evaporation end, thereby realizing the cyclic transfer of heat and effectively improving the heat dissipation performance of the power module 10.

[0076] Correspondingly, the power module 10 further includes a second heat pipe 17. The second metal plate 142 can form a sealed cavity 170 as part of the second heat pipe 17, and the cavity 170 contains a cooling working fluid. One end of the second heat pipe 17 in contact with the second metal plate 142 can be used as the evaporation end, and the end of the second heat pipe 17 away from the second metal plate 142 can be used as the condensation end. The cooling working fluid in the cavity 170 vaporizes after absorbing the heat in the second metal plate 142 at the evaporation end, and liquefies and releases heat at the condensation end and then flows back to the evaporation end, thus realizing the cyclic transfer of heat and effectively improving the heat dissipation performance of the power module 10.

[0077] In addition, as Figure 8 shown, in an example provided in the present application, there is also a first heat dissipation fin 18 between two adjacent first heat pipes 16, and the first heat dissipation fin 18 is connected to both of the adjacent first heat pipes 16. By arranging the first heat dissipation fin 18, the heat dissipation performance of the power module 10 can be effectively improved. Specifically, the heat in the first heat pipe 16 can be effectively transferred to the first heat dissipation fin 18 for dissipation. The first heat dissipation fin 18 can provide a large heat dissipation area, so the heat dissipation performance of the power module 10 can be effectively improved.

[0078] Correspondingly, there is also a second heat dissipation fin 19 between two adjacent second heat pipes 17, and the second heat dissipation fin 19 is connected to both of the adjacent second heat pipes 17. By arranging the second heat dissipation fin 19, the heat dissipation performance of the power module 10 can be effectively improved.

[0079] When specifically arranged, the first heat dissipation fin 18 and the second heat dissipation fin 19 can be in a flat plate shape or a sheet-like structure with a V-shaped or W-shaped cross-section. In specific applications, the structural shape, quantity, position layout, etc. of the first heat dissipation fin 18 and the second heat dissipation fin 19 can be reasonably set according to actual needs, which will not be elaborated here.

[0080] In addition, in the above example, an exemplary description is made taking the power module 10 including one power device 11 as an example. In other examples, the power module 10 can also include two or more power devices 11.

[0081] For example, as Figure 9As shown, in an example provided by this application, the power module 10 includes two power devices 11. Among them, the two power devices 11 can both be connected to the conductive lines in the first conductive plate 121, and the two power devices 11 are also electrically connected through the conductive lines in the first conductive plate 121. It can be understood that in other examples, when there is a need for electrical connection between the two power devices 11, conductive structures such as jumper wires can also be arranged in the space between the first heat dissipation substrate 12 and the second heat dissipation substrate 14 to achieve the conductive connection between the two power devices 11.

[0082] In actual application, the number, type, and position layout of the power devices 11 included in the power module 10 can be reasonably set according to the actual situation, which will not be elaborated here.

[0083] In actual application, the power module 10 can be applied to various devices that need to convert electrical energy.

[0084] For example, the power module 10 can be applied to a power converter. The power converter can include a housing and the above-mentioned power module 10. The power devices 11 in the power module 10 can be located inside the housing, so that the housing can effectively protect the power devices 11.

[0085] Among them, some components or structures in the power module 10 can be used as the housing, or they can also be located outside the housing.

[0086] Please refer to Figure 8 . In actual application, both the first heat dissipation substrate 12 and the second heat dissipation substrate 14 can be used as the housing of the power converter.

[0087] Or, please refer to Figure 6 . In actual application, the tube body and the tube body can be used as the housing of the power module 10.

[0088] In actual application, the power converter can specifically be an inverter or a rectifier, etc. This application does not limit the specific application scenarios of the power module 10.

[0089] In addition, in actual application, the power converter can be applied to various scenarios that need to regulate electrical energy.

[0090] For example, as Figure 10 shown, this application embodiment also provides a photovoltaic system. It can include a photovoltaic power generation device and a power converter. The power converter can be connected to the photovoltaic power generation device and is used to effectively process the electrical energy generated by the photovoltaic power generation device and then output it.

[0091] In practical applications, the photovoltaic power generation device can specifically be a solar panel, which can generate direct current, and the power converter can convert the direct current generated by the solar panel into alternating current and output it externally.

[0092] Of course, in other examples, the photovoltaic system can also include a battery, a battery management system, etc. Additionally, in practical applications, the power converter can be applied in the controller of a new energy vehicle, where the controller can be a controller for regulating the electrical energy in the new energy vehicle. It can be understood that the power converter can also be applied in many other scenarios that require electrical energy regulation, and the specific application scenarios of the power converter in this application are not limited.

[0093] In various embodiments of this application, if there is no special explanation and logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced to each other, and the technical features in different embodiments can be combined to form new embodiments according to their internal logical relationships.

[0094] In this application, "a plurality of" means two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone, where A and B can be singular or plural.

[0095] It can be understood that the various numerical numbers involved in the embodiments of this application are only for the convenience of description and are not used to limit the scope of the embodiments of this application. The magnitude of the sequence numbers of the above processes does not mean the order of execution, and the execution order of each process should be determined according to its function and internal logic.

Claims

1. A power module, characterized in that, including a power device and a first heat dissipation substrate; The first heat dissipation substrate includes a first conductive plate, a first metal plate and a first insulating layer. The first insulating layer is located between the first metal plate and the first conductive plate, and the first conductive plate, the first metal plate and the first insulating layer are an integral structure; The power device is attached to the first conductive plate; Wherein, the power module further includes a first tube body, and a flow channel for a cooling medium to flow is provided in the first tube body. At least part of the tube wall of the first tube body is constituted by the first insulating layer and / or the first metal plate.

2. The power module according to claim 1, wherein, The first metal plate has a groove, and both the first conductive plate and the first insulating layer are located in the groove.

3. The power module according to claim 1 or 2, characterized in that The first heat dissipation substrate further includes heat dissipation fins, and the heat dissipation fins are connected to the first tube body.

4. The power module according to any one of claims 1 to 3, characterized in that, The power module further includes a second heat dissipation substrate; The second heat dissipation substrate and the first heat dissipation substrate are arranged oppositely, and the power device is located between the first heat dissipation substrate and the second heat dissipation substrate; The second heat dissipation substrate includes a second metal plate and a second insulating layer, and the second metal plate and the second insulating layer are an integral structure; The power device is arranged between the first conductive plate and the second insulating layer.

5. The power module according to any one of claims 1 to 3, characterized in that The power module further includes a second heat dissipation substrate; The second heat dissipation substrate and the first heat dissipation substrate are arranged oppositely, and the power device is located between the first heat dissipation substrate and the second heat dissipation substrate; The second heat dissipation substrate includes a second conductive plate, a second metal plate and a second insulating layer. The second insulating layer is located between the second metal plate and the second conductive plate, and the second conductive plate, the second metal plate and the second insulating layer are an integral structure; The power device is arranged between the first conductive plate and the second conductive plate.

6. The power module according to claim 4 or 5, characterized in that, The power module further includes a second tube body, and a flow channel for a cooling medium to flow is provided in the second tube body; Wherein, at least part of the tube wall of the second tube body is constituted by the second heat dissipation substrate, and at least part of the inner wall of the second tube body is constituted by the second insulating layer.

7. The power module according to claim 5, wherein The power module further includes a second tube body, and a flow channel for a cooling medium to flow is provided in the second tube body; Wherein, at least part of the tube wall of the second tube body is constituted by the second heat dissipation substrate, and at least part of the inner wall of the second tube body is constituted by the second metal plate; and / or, at least part of the inner wall of the second tube body is constituted by the second insulating layer.

8. The power module according to any one of claims 1 to 7, characterized in that, The first heat dissipation substrate has a protrusion facing the power device, and the first heat conducting surface is attached to the first conductive plate at the top of the protrusion; and / or, the second heat dissipation substrate has a protrusion facing the power device, and the second heat conducting surface is attached to the second conductive plate at the top of the protrusion.

9. The power module according to any one of claims 4 to 8, characterized in that The second heat dissipation substrate further includes heat dissipation fins, and the heat dissipation fins are connected to the second tube body.

10. The power module according to any one of claims 1 to 9, characterized in that, The material of the first insulating layer includes at least one of alumina, aluminum nitride, boron oxide, magnesium oxide, silicon oxide and resin.

11. The power module according to any one of claims 4 to 10, characterized in that The material of the second insulating layer includes at least one of alumina, aluminum nitride, boron oxide, magnesium oxide, silicon oxide and resin.

12. A power converter, characterized in that, It includes a housing and the power module as described in any one of claims 1 to 11, and the power devices in the power module are located within the housing.

13. A radiator, characterized in that, It includes a heat dissipation substrate, the heat dissipation substrate includes a conductive plate, a metal plate and an insulating layer, the insulating layer is located between the metal plate and the conductive plate, and the conductive plate, the metal plate and the insulating layer are an integral structure, and the conductive plate is used to be attached to the device to be cooled; Wherein, the power module further includes a tube body, and a flow channel for the cooling medium to flow through is provided in the tube body, and the insulating layer and / or the metal plate form at least part of the tube wall of the tube body.

14. The radiator according to claim 13, wherein, The metal plate has a groove, and both the conductive plate and the insulating layer are located in the groove.

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