Sealing part for penetrating device, preparation method of sealing part and penetrating device

Abstract

The invention relates to the technical field of electrics, in particular to a sealing part for a penetration device, a preparation method of the sealing part and the penetration device, and the sealing part comprises a shell, a conductor and a glass prefabricated part; a plurality of positioning grooves for the conductors to penetrate and insert are formed in the center of the shell in the longitudinal direction, a glass prefabricated part is arranged in one positioning groove, and one conductor penetrates through one glass prefabricated part and extends to the outer side of the bottom of the shell; the preparation method comprises the following steps: respectively pre-treating a mold, a shell and a conductor, then assembling the pre-treated mold, shell and conductor with a glass prefabricated part, sintering after assembling, taking out and demolding after sintering, then removing an oxide layer, and carrying out surface treatment to obtain the sealing part. The penetrating device comprises the sealing component. The sealing component for the penetration device obtained through the preparation method is excellent in adaptability in the extremely low temperature environment, high in reliability and long in service life, and meanwhile the use requirement for high-density conductor loading of the penetration device for the low temperature environment in different scenes is met.

Description

Technical Field

[0001] The present invention relates to the field of electrical technologies, and more particularly, to a sealing component for a penetration device, a preparation method thereof, and a penetration device. Background Art

[0002] In the processes of storing and transporting cryogenic media such as LNG, liquid hydrogen, and liquid nitrogen, cryogenic submersible pumps, LNG / hydrogen transport ships, LNG / hydrogen receiving stations, and related storage devices are widely used, and electrical paths are provided through penetration devices installed thereon. One end is connected to the internal equipment in the shell or the lead wire of the sensor, and the other end is connected to the external power source or the signal recorder outside the shell to provide power for the internal equipment in the shell or collect various technical parameters in the device at any time, so as to support the operation or safety monitoring of the entire subsystem. Due to the characteristics of cryogenic media such as LNG and liquid hydrogen being flammable, explosive, easy to vaporize, and extremely low temperature, the penetration device for low-temperature environments needs to ensure the electrical continuity, the integrity of the pressure boundary, the reliability of the seal, and the inherent safety (explosion-proof characteristics) under various harsh environmental conditions, and prevent the leakage of extremely low temperature media, especially explosive cryogenic media. For a long time, due to its large design difficulty, complex manufacturing process, and poor technical economy, such as large current-carrying capacity, large volume and weight, deep cold environment adaptability, high pressure resistance, and high seal reliability, it currently largely relies on imports, and the penetration device for low-temperature environments has become a major technical bottleneck in the current sealing field.

[0003] The general manufacturing methods of the penetration device for low-temperature environments mainly include potting / extrusion molding components or using a metal-glass high-temperature sintering process. Among them, the component parts are numerous, the assembly is complex, the core sealing component has poor reinstallation repeatability, and the pressure-bearing capacity is limited, and there are multiple factors causing unstable product performance. The metal-glass sealing technology is generally widely used in the manufacturing process of small-sized electrical connectors, such as the wiring terminals of household air-conditioning compressors and automotive signal connection terminals, and adopts an overall sealing form of a housing-glass-pin. Its basic principle is to utilize the different thermal expansion coefficients of each material, and after sintering and cooling, compressive stress is formed on the contact surface of adjacent materials from the outside to the inside. Specifically, the thermal expansion coefficient: the housing is greater than the glass is greater than the pin, and it is mainly completed through a large-scale mass transfer at the atomic scale between solid structures. The whole process satisfies the sintering theory, and finally the sealing glass is in a stable compression state, so as to achieve a good sealing effect.

[0004] The main problems still existing in the above methods are: the sealing performance and pressure resistance of the product (especially large-sized products) after high-temperature sintering are poor, the surface quality is not good or there are obvious visible cracks, the insulation resistance is low, the dielectric strength fails to pass or the leakage current is high, especially for the limit electrical performance of power conductors, such as short-time overload current, and it cannot meet the urgent needs of the current rapid development of the industry. Summary of the Invention

[0005] In view of this, to solve the above technical problems, the present invention provides a sealing component for a penetration device, its preparation method, and a penetration device. Specifically, it is achieved through the following technical solutions:

[0006] A sealing component for a penetration device includes a housing, a conductor, and a glass preform; a plurality of positioning grooves for the conductor to penetrate and insert are longitudinally formed in the center of the housing, a glass preform is arranged in one of the positioning grooves, and one conductor penetrates through one glass preform and extends to the outside of the bottom of the housing.

[0007] A preparation method for a sealing component for a penetration device includes the following steps:

[0008] (1) Mold pre-sintering: After the clamping and positioning mold is ultrasonically cleaned, it is placed in a sintering furnace for pre-sintering. Specifically, nitrogen is introduced into the sintering furnace, and the temperature is gradually raised to 950 - 1100 °C, held for 2 - 5 h, and then taken out after cooling; thereby evaporating the residual moisture in the mold, discharging impurity gases, and adhering dust, etc.;

[0009] (2) Housing pre-oxidation: Take the housing, remove the surface oil stains and impurities, clean and dry it, and then place it in a sintering furnace for surface pre-oxidation treatment to ensure the affinity between the glass preform and the metal housing; among them, the process parameters for surface pre-oxidation are: oxidation temperature is 940 - 980 °C, oxidation time is 30 - 90 min; the housing is made of 304, 316, and 321 with good thermal conductivity, and stainless steel materials suitable for metal-glass sealing and long-term durability in low-temperature environments;

[0010] (3) Conductor pre-oxidation: Take the conductor, remove the surface oil stains and impurities, clean and dry it, and then place it in a sintering furnace for surface pre-oxidation treatment to form a dense oxide layer on the surface of the conductor, thereby promoting good wettability between the conductor and the glass preform; among them, the process parameters for surface pre-oxidation are: oxidation temperature 940 - 980 °C, oxidation time is 30 - 40 min; there can be multiple conductors and they can be set to the same or different diameters according to needs. The material is an expansion alloy matrix material with an average linear expansion coefficient not higher than 95×10 -7 / °C (preferably, the expansion alloy matrix material is 4J28), a steel-clad copper composite material (wherein, the steel is preferably stainless steel SUH446, and the copper is preferably oxygen-free copper TU2 / TU1 / TU0), and an expansion alloy system or a steel-clad copper composite material system suitable for metal-glass sealing, good electrical and thermal conductivity, and long-term durability in low-temperature environments;

[0011] (4) Assemble the mold, housing, and conductor obtained in steps (1) to (3) with the glass preform to obtain a sintered part. Place the sintered part in a sintering furnace for sintering. After sintering is completed, take it out and demold it to obtain a semi-finished sintered assembly;

[0012] Among them, during sintering, the vacuum in the sintering furnace is pumped to 8 Pa or less, and at the same time, high-purity inert gas (preferably high-purity nitrogen with a purity or volume fraction greater than or equal to 99.999% and ultra-high-purity nitrogen with a purity or volume fraction greater than or equal to 99.9999%) is filled to a slightly positive pressure atmosphere of greater than or equal to 60 kPa. Then, gradually heat from room temperature to 650 - 700 °C at a heating rate of 5 - 10 °C / min and hold for 30 - 60 min; then slowly heat to 950 - 1000 °C at a heating rate of 1 - 5 °C / min and hold for 30 - 60 min to fully infiltrate and bond the molten glass preform with the conductor and housing, thereby achieving excellent sintering effect; finally, cool the sintered part to a higher temperature of greater than or equal to 100 °C, take it out and demold it to obtain a sealing component for the through device; during demolding, that is, remove the base support mold, upper sintering mold, lower sintering mold, and limit plate, and only retain the glass preform, conductor, and housing, which is the sealing component for the through device;

[0013] (5) After removing the oxide layer from the semi-finished sintered assembly obtained in step (4), a sealing component for the through device is obtained; when removing the oxide layer, it includes chemical method treatment and / or mechanical method treatment. Among them, for chemical method treatment: first perform chemical degreasing (such as using alkaline or acidic solution to remove the oil on the surface of the workpiece for subsequent treatment) and electro-chemical degreasing (utilize the electrolysis principle to generate bubbles on the surface of the workpiece to further remove oil and impurities), then clean with a sulfuric acid solution containing fluoride ions, such as fluorosulfuric acid (the sulfuric acid solution reacts with the oxide layer, and fluoride ions can accelerate the dissolution of the oxide layer and play an auxiliary dissolution role), then flash nickel with hydrochloric acid and nickel chloride (hydrochloric acid may be used for neutralization or cleaning, and nickel chloride is used to deposit a nickel layer on the surface of the workpiece to play a role in protection and decoration), and finally clean and dry; the mechanical method treatment can be sandblasting treatment, grinding and polishing, or laser processing, etc., which can be specifically selected according to the usage requirements. The specific operation is a conventional operation in the art and will not be elaborated here.

[0014] (6) Perform surface treatment on the housing and conductor of the sealing component for the through device obtained in step (5) to enhance the conductivity, wear resistance of the conductor, corrosion resistance of the housing, and overall surface finish; among them, during surface treatment, nickel is plated on the housing, and the coating thickness is not less than 5 μm; for the conductor, nickel is plated first and then gold is plated. Among them, when plating nickel, the nickel coating thickness is not less than 5 μm, and when plating gold, the gold coating thickness is not less than 1.27 μm;

[0015] (7) After the surface treatment described in step (6), the two through devices are assembled and insulated with a sealing component, including sintering heat-shrinkable low-temperature-resistant insulating sleeves at the roots of the conductors after fluidization at both ends of the sealing component for the through device, and potting low-temperature-resistant insulating glue in the grooves formed by the glass and the end face of the sintering hole of the housing, and curing it. On the one hand, an isolation layer is formed to prevent the glass from being polluted by external humid gas, impurities, etc. On the other hand, the space between the exposed conductor and the housing channel is filled to increase the dielectric constant and improve the electrical performance. Preferably, the material of the low-temperature-resistant heat-shrinkable insulating sleeve is PFA, FEP, PTFE, TFE or MFA. The specific assembly method is a conventional operation in the art and will not be elaborated here.

[0016] Further, in step (1), the mold is of a split structure, specifically including a base support mold, a limit plate, an upper sintering mold and a lower sintering mold, and they are connected and assembled in a detachable manner. A cavity is provided in the center of the base support mold. A plurality of lower sintering molds are provided, and the plurality of lower sintering molds are arranged longitudinally in the cavity, and the bottom end of the lower sintering mold abuts against the upper surface of the limit plate. A glass preform is provided at the top end of one of the lower sintering molds.

[0017] A plurality of upper sintering molds are provided, and one upper sintering mold is respectively arranged in one positioning groove.

[0018] The conductor sequentially penetrates through the upper sintering mold, the glass preform and the lower sintering mold from the top end of the housing and abuts against the upper surface of the limit plate.

[0019] A limit plate is movably arranged horizontally in the cavity, and the bottom of the lower sintering mold is arranged on the limit plate.

[0020] A plurality of channels for inserting the conductor are respectively arranged longitudinally in the centers of the upper sintering mold and the lower sintering mold, and the plurality of channels in the upper sintering mold and the lower sintering mold correspond to the plurality of positioning grooves in the housing one by one and are coaxially arranged.

[0021] Among them, the mold is made of isostatic pressing graphite material, with a compressive strength not lower than 42 MPa and a flexural strength not lower than 23 MPa. The limit plate is made of graphite or stainless steel.

[0022] In addition, the present invention also provides a through device, including the above-mentioned sealing component or the sealing component prepared by the above-mentioned preparation method.

[0023] The technical solutions of the embodiments of the present invention have at least the following advantages and beneficial effects:

[0024] 1. Based on the principle of metal - glass sealing, the present invention pre - oxidizes the conductor in an inert gas atmosphere furnace, and conducts high - temperature sintering on the housing, conductor and glass pre - form to obtain a metal - glass high - temperature sintering preparation method for a through - device applicable to low - temperature environments, realizing a through - device for low - temperature environments with excellent and stable comprehensive performance and having technical advantages such as remarkable comprehensive effects.

[0025] 2. Using the preparation method of the present invention can enable the glass pre - form to achieve a good wetting effect with the oxide layers on the surfaces of the housing and conductor, greatly reducing the generation of air bubbles and striated leakage channels at each sealing interface, and solving the problems that the sealing performance or electrical performance of the existing high - temperature packaging process for large - size low - temperature through - devices cannot reach the requirements and the surface oxidation of metal parts is serious. Moreover, the high - temperature sintering process of the preparation method of the present invention can meet the mechanical strength of high - pressure bearing at the sealing boundary formed between the housing, conductor and glass, the large - current carrying capacity and the electrical performance during short - time overload current impact, has excellent adaptability to extremely low - temperature environments, high reliability and long service life, and at the same time meets the use requirements of high - density conductor loading of the through - device for low - temperature environments in different scenarios.

[0026] 3. The high - temperature sintering preparation method of the present invention significantly improves the sintering yield, and the used molds are simple, easy to process and detachable, and can be flexibly processed or combined and adjusted according to the requirements of different conductor exposed lengths, facilitating the production and preparation of different through - devices for low - temperature environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0028] Figure 1 It is a schematic structural diagram of the sintered part provided in Embodiment 1 of the present invention;

[0029] Figure 2 It is a schematic structural diagram of the sealing component for the through - device provided in Embodiment 1 of the present invention;

[0030] Reference numerals: 1 - housing, 2 - conductor, 3 - upper sintering die, 4 - glass pre - form, 5 - base support die, 6 - lower sintering die, 7 - limiting plate, 8 - cavity, 9 - positioning groove. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. For those not specified in the embodiments, they are carried out according to conventional conditions or the conditions recommended by the manufacturer. For reagents or instruments not specified by the manufacturer, they are all conventional products that can be obtained through commercial purchase.

[0032] Example 1

[0033] A sealing component for a penetration device, comprising a housing 1, a conductor 2, and a glass preform 4; a plurality of positioning grooves 9 for the conductor 2 to penetrate and insert are longitudinally formed in the center of the housing 1, a glass preform 4 is disposed in one of the positioning grooves 9, and a conductor 2 penetrates through one of the glass preforms 4 and extends to the outside of the bottom of the housing 1.

[0034] Among them, the material of the housing 1 is 304 stainless steel, and the diameter of the conductor 2 is designed to be 2.5 mm according to current-carrying calculation. Preferably, the material of the conductor 2 is Fe-Cr alloy 4J28 suitable for sealing with soft glass on electrical components;

[0035] A preparation method for a sealing component for a penetration device, comprising the following steps:

[0036] (1) Mold pre-sintering: After the clamping and positioning mold is ultrasonically cleaned, it is placed in a sintering furnace for pre-sintering. Specifically, nitrogen is introduced into the sintering furnace, and the temperature is gradually raised to 980 °C, held for 3 h, and then taken out after cooling; thereby evaporating the residual moisture in the mold, discharging impurity gases, and adhering dust, etc.;

[0037] It should be noted that the mold is of a split structure, specifically including a base support mold 5, an upper sintering mold 3, and a lower sintering mold 6, and they are connected and assembled in a detachable manner; a cavity 8 is formed in the center of the base support mold 5, a plurality of lower sintering molds 6 are provided, and the plurality of lower sintering molds 6 are longitudinally arranged in the cavity 8, and the bottom end of the lower sintering mold 6 abuts against the upper surface of the limiting plate 7; a glass preform 4 is provided at the top end of one of the lower sintering molds 6; a plurality of upper sintering molds 3 are provided, and one of the upper sintering molds 3 is respectively disposed in one of the positioning grooves 9; the conductor 2 sequentially penetrates through the upper sintering mold 3, the glass preform 4, and the lower sintering mold 6 from the top end of the housing 1 and abuts against the upper surface of the limiting plate 7; a limiting plate 7 is movably arranged horizontally in the cavity 8, and the bottom of the lower sintering mold 6 is disposed on the limiting plate 7; a plurality of channels for the conductor 2 to be inserted are longitudinally provided in the centers of the upper sintering mold 3 and the lower sintering mold 6, and the plurality of channels in the upper sintering mold 3 and the lower sintering mold 6 correspond to and are coaxially arranged with the plurality of positioning grooves 9 in the housing 1;

[0038] Among them, the mold is made of isostatic graphite with the grade of DJY-1, the compressive strength is not less than 42 MPa, and the flexural strength is not less than 23 MPa. The limiting plate 7 is made of graphite or stainless steel; the material of the housing 1 is 304 stainless steel. According to the current-carrying calculation, the diameter of the conductor 2 is designed to be 2.5 mm, and the material of the conductor 2 is selected as the iron-chromium alloy 4J28 suitable for sealing and matching with the glass preform 4 on the electrical component; the aperture of the uniformly distributed pore channels is 0.05 mm larger than the outer diameter of the conductor 2. According to the principle of matching the thermal expansion coefficient, the glass preform 4 is preferably made of the ELAN No. 48 glass powder with an average linear expansion coefficient of 90×10 -7 / °C, and the thickness of the glass preform 4 is calculated to be 4 mm according to the withstand voltage and insulation.

[0039] (2) Pre-oxidation of the housing 1: Take the housing 1, remove the surface oil stains and impurities, clean and dry it, and then place it in a sintering furnace for surface pre-oxidation treatment to ensure the affinity between the glass preform 4 and the metal housing 1; among them, the process parameters for surface pre-oxidation are: the oxidation temperature is 960 °C and the oxidation time is 50 min;

[0040] (3) Pre-oxidation of the conductor 2: Take the conductor 2, remove the surface oil stains and impurities, clean and dry it, and then place it in a sintering furnace for surface pre-oxidation treatment to form a dense oxide layer on the surface of the conductor 2, so as to promote good wettability between the conductor 2 and the glass preform 4; among them, the process parameters for surface pre-oxidation are: the oxidation temperature is 950 °C and the oxidation time is 35 min;

[0041] (4) Assemble the mold, the housing 1, and the conductor 2 obtained in steps (1) to (3) with the glass preform 4 that has been ultrasonically cleaned and then dehydrated with absolute ethanol. After assembly, a sintered part is obtained. Place the sintered part in a sintering furnace for sintering. After sintering is completed, take it out and demold it to obtain a semi-finished sintered composite body;

[0042] During assembly, the limiting plate 7 is placed in the cavity 8 of the base support mold 5, and then the shell 1 is placed above the base support mold 5, and then the multiple lower sintering molds 6 are inserted through the multiple positioning grooves 9 in sequence until they are inserted into the limiting plate 7. Preferably, multiple grooves can be provided on the upper surface of the limiting plate 7, so that the lower sintering mold 6 can be placed on the limiting plate 7 more stably; then the multiple conductors 2 are inserted through the multiple positioning grooves 9 in sequence and penetrate the lower sintering mold 6 until they abut against the limiting plate 7; then the glass preform 4 is inserted through the multiple positioning grooves 9 in sequence and abuts against the top of the lower sintering mold 6, and then the multiple upper sintering molds 3 can be placed. The conductor 2 is inserted into each positioning groove 9 provided on the housing 1 in sequence, so that the upper part of the conductor 2 is positioned, and the lower part of the conductor 2 is positioned by the lower sintering mold 6, so that the fixing stability of the conductor 2 in the mold and the housing 1 can be maintained, so as to facilitate the subsequent sintering stability and sintering quality; in addition, when the lower sintering mold 6 is used, according to the needs of different exposed lengths of the conductor 2, different heights of the lower sintering mold 6 or the limiting plate 7 can be flexibly selected to use, so that the positioning height of the glass preform 4 on the conductor 2 can be adjusted by the lower sintering mold 6, and the exposed length of the conductor 2 can be adjusted to better meet the use requirements;

[0043] During sintering, the vacuum degree in the sintering furnace is evacuated to 8Pa, and 99.9999% high-purity nitrogen is filled to a slightly positive pressure atmosphere of 60kPa, and then the temperature is gradually increased from room temperature to 680°C at a heating rate of 8°C / min, and kept warm for 40 minutes; then the temperature is slowly increased to 1000°C at a heating rate of 3°C / min, and kept warm for 40 minutes, so that the glass preform 4 in the molten state is fully infiltrated and combined with the conductor 2 and the shell 1, thereby achieving an excellent sintering effect; finally, it is cooled to 100°C, the sintered part is taken out and demolded to obtain a sealing component for the penetration device; when demolding, the base support mold 5, the upper sintering mold 3, the lower sintering mold 6 and the limit plate 7 are removed, and only the glass preform 4, the conductor 2 and the shell 1 are retained;

[0044] (5) removing the oxide layer from the semi-finished sintered assembly obtained in step (4), and then washing and drying the semi-finished sintered assembly to obtain a sealing component for a penetration device; when removing the oxide layer, pickling and shot peening are used, and then the surface of the housing 1 and the conductor 2 is nickel-plated by an electroplating process, and the nickel layer thickness is 6 μm. On this basis, the exposed portion of the conductor 2 is further gold-plated, and the gold layer thickness is 1.27 μm;

[0045] (6) Assembling and insulating the two treated penetration devices with sealing components, specifically, heat shrinking the root of the conductor 2 after sintering and fluidizing at both ends of the penetration device sealing component with an anti-low-temperature heat-shrinkable insulating sleeve made of PFA, and filling the groove formed by the glass and the end surface of the sintered hole of the shell 1 with anti-low-temperature insulating glue, and curing it, finally obtaining a penetration device for low-temperature environment.

[0046] Under normal atmospheric conditions, the through-device for low-temperature environment obtained in this embodiment is tested: it can withstand a water pressure of 12.5 MPa on one side for 30 minutes without deformation, and the gas leakage rate for dry helium is less than 1×10 -9 Pa·m 3 / s, the insulation resistance is higher than 1×10 9 Ω (DC1000V), and there are no phenomena such as breakdown and voltage drop during a dielectric strength of 2 kV.

[0047] Embodiment 2

[0048] The difference between this embodiment and Embodiment 1 is that:

[0049] The material of the housing 1 is 316 stainless steel; the diameter of the conductor 2 is 16 mm, and the material of the conductor 2 is selected as a copper-clad steel composite material with an inner layer of oxygen-free copper of TU0 and an outer layer of SUH446 stainless steel; the glass preform 4 is selected as a glass blank made of ELAN No. 48 glass powder with an average linear expansion coefficient of 90×10 -7 / ℃, and the thickness of the glass preform 4 is 12 mm;

[0050] The material of the mold is isostatic graphite of grade DJY-2. It is gradually heated to 980 °C under the condition of introducing slightly positive pressure high-purity nitrogen in the sintering furnace, held for 4 hours, and then taken out after cooling;

[0051] Under normal atmospheric conditions, the through-device for low-temperature environment obtained in this embodiment is tested: it can withstand a water pressure of 12.5 MPa on one side for 30 minutes without deformation, and the gas leakage rate for dry helium is less than 1×10 -9 Pa·m 3 / s, the insulation resistance is higher than 1×10 9 Ω (DC1000V), and there are no phenomena such as breakdown and voltage drop during a dielectric strength of 2.5 kV.

[0052] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A sealing member for a penetration device, characterized in that: It includes a housing, a conductor, and a glass preform; A plurality of positioning grooves for the conductor to penetrate and insert are longitudinally provided along the center of the housing. One of the positioning grooves is provided with one of the glass preforms, and one of the conductors penetrates one of the glass preforms and extends to the outside of the bottom of the housing.

2. A preparation method of a sealing component for a penetrating device, characterized in that, It includes the following steps: S1. After preprocessing the mold, housing, and conductor respectively, reserve them for use; S2. Assemble the processed mold, housing, conductor, and glass preform. After assembly, a sintered part is obtained. Sinter the sintered part, and after sintering is completed, take it out for demolding to obtain a semi-finished sintered composite; S3. After removing the oxide layer and surface treatment of the semi-finished sintered composite, a sealing component for the through device is obtained.

3. The preparation method of the sealing member for the penetration device according to claim 2, characterized in that, In S1, the mold is of a split structure and is connected and assembled in a detachable manner; The mold includes a base support mold, a limiting plate, an upper sintering mold, and a lower sintering mold; a cavity is provided at the center of the base support mold, and the limiting plate is horizontally arranged at the lower part of the cavity; A plurality of the lower sintering molds are provided, and the plurality of lower sintering molds are longitudinally arranged in the cavity. The bottom end of the lower sintering mold abuts against the upper surface of the limiting plate; one of the glass preforms is provided at the top end of one of the lower sintering molds; A plurality of the upper sintering molds are provided, and one of the upper sintering molds is respectively arranged in one of the positioning grooves; The conductor sequentially penetrates the upper sintering mold, the glass preform, and the lower sintering mold from the top end of the housing and abuts against the upper surface of the limiting plate.

4. The manufacturing method of the sealing member for the penetration device according to claim 3, characterized in that, A plurality of channels for the conductor to insert are longitudinally provided at the centers of the upper sintering mold and the lower sintering mold respectively, and the plurality of channels in the upper sintering mold and the lower sintering mold correspond to the plurality of positioning grooves in the housing one by one and are coaxially arranged.

5. The preparation method of the sealing member for the penetration device according to claim 2, characterized in that, In S1, when preprocessing the mold, it includes the following steps: ultrasonically clean the mold and then dry it. Introduce nitrogen into the sintering furnace and gradually heat it up to 950 - 1100 °C, keep it warm for 2 - 5 h, and take it out after cooling.

6. The preparation method of the sealing member for the penetration device according to claim 2, characterized in that, In S1, when preprocessing the housing and the conductor, it includes the following steps: remove the oil stains and impurities on the surfaces of the housing and the conductor, clean and dry them, and then respectively pre-oxidize the housing or the conductor by introducing nitrogen into the sintering furnace; among them, the process parameters for pre-oxidizing the housing are: oxidation temperature is 940 - 980 °C, oxidation time is 30 - 90 min; the process parameters for pre-oxidizing the conductor are: oxidation temperature 940 - 980 °C, oxidation time is 30 - 40 min.

7. The preparation method of the sealing member for the penetration device according to claim 2, characterized in that, In S2, when sintering, it includes the following steps: place the sintered composite in the sintering furnace, evacuate to a vacuum degree below 8 Pa, and at the same time fill in an inert gas with a pressure of 60 - 80 kPa, and then gradually heat it up from room temperature to 650 - 700 °C at a heating rate of 5 - 10 °C / min, keep it warm for 30 - 60 min, and then slowly heat it up to 950 - 1000 °C at a heating rate of 1 - 5 °C / min, and keep it warm for 30 - 60 min.

8. The method for preparing the sealing member for the penetration device according to claim 2, characterized in that, In S3, when removing the oxide layer: first perform chemical degreasing and electro-chemical degreasing, then clean it with a sulfuric acid solution containing fluoride ions, then flash nickel with hydrochloric acid and nickel chloride, and finally clean and dry it; During surface treatment, nickel plating is performed on the housing, and the thickness of the plating layer is not less than 5 μm; Nickel plating is first performed on the conductor and then gold plating is performed. Among them, when nickel plating is performed, the thickness of the nickel plating layer is not less than 5 μm, and when gold plating is performed, the thickness of the gold plating layer is not less than 1.27 μm.

9. The preparation method of the sealing member for the penetration device according to claim 2, characterized in that, The conductor material is an expansion alloy matrix material or a steel-clad copper composite material with an average coefficient of linear expansion not higher than 95×10 -7 / °C; the glass preform is made of glass powder with an average coefficient of linear expansion of 80×10 -7 / °C to 160×10 -7 / °C.

10. A penetration device, characterized in that, It includes the sealing member described in claim 1 or includes the sealing member prepared by the preparation method according to any one of claims 2-9.

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