Dual-channel radio frequency strong electromagnetic pulse protector

Abstract

The invention discloses a double-channel radio frequency strong electromagnetic pulse protector, and particularly relates to the technical field of electromagnetic pulse protection, the double-channel radio frequency strong electromagnetic pulse protector comprises a shell, a PCB, an SMP type connector and a PIN diode, the SMP type connector is internally provided with a fixing mechanism for preventing a connecting wire on electronic equipment from falling off, and through the PIN diode, the front side and the back side of the circuit board are designed in a double-channel mode, so that the safety of the electronic equipment is improved. Two paths of protection are integrated on one protector, and the PIN diode and the LC filter are used for protection, so that the size and the weight of the protector can be greatly reduced, low residual voltage and high radio frequency electrical characteristics are ensured by using the combination of the PIN diode and the LC filter, comprehensive protection of a clock and a local oscillator can be realized, a stronger electromagnetic protection effect is provided for the clock and the local oscillator, and the reliability of the protector is improved. Through the fixing mechanism, the fixing head is inserted into the fixing groove, and the second spring resets and drives one end of the sliding rod to be inserted into the clamping groove, so that the connecting line cannot be separated when being used through the fixing head, and strong electromagnetic pulse protection on the electronic equipment is prevented from being influenced.

Description

Technical Field

[0001] This application relates to the technical field of electromagnetic pulse protection. More specifically, this application relates to a dual-channel RF high-intensity electromagnetic pulse protector. Background Art

[0002] A high-intensity electromagnetic pulse protector is a device used to prevent LEMP and HEMP from damaging electronic devices and systems. In modern electronic devices, the importance of high-intensity electromagnetic pulse protection devices has been increasingly emphasized, especially in the fields of RF devices and miniaturized electronic devices. An RF device refers to an electronic component that can generate, receive, and process RF signals and is widely used in fields such as communication, broadcasting, and radar. Miniaturized electronic devices require electronic components to have a smaller volume and higher integration to meet the requirements of portability and space limitations. However, the existing coaxial protection devices use 1 / 4 wavelength type and gas discharge tube type for protection, usually requiring a large volume and weight, which is a great limitation for miniaturized electronic devices. Secondly, the existing electromagnetic protection solutions often can only protect against LEMP / HEMP separately and cannot provide comprehensive protection. In addition, the protection effects of the existing high-intensity electromagnetic pulse solutions are often not ideal, with a relatively high residual voltage. At the same time, it is not convenient to install the circuit board during use, and when the SMP type connector is connected to the connecting wire on the device to be protected, the connecting wire is likely to fall off from the SMP type connector, resulting in the SMP type connector being unable to be used normally, thereby affecting the high-intensity electromagnetic pulse protection of the electronic device. Therefore, a dual-channel RF high-intensity electromagnetic pulse protector is proposed to solve the above problems. Summary of the Invention

[0003] The purpose of this application is to provide a dual-channel RF high-intensity electromagnetic pulse protector.

[0004] The dual-channel RF high-intensity electromagnetic pulse protector provided by this application adopts the following technical solutions: A dual-channel RF high-intensity electromagnetic pulse protector includes a housing, a PCB board, an SMP type connector, and PIN diodes. The PCB board is slidably connected inside the housing. Multiple groups of SMP type connectors are fixedly connected to the surface of the housing. A connecting mechanism for fixing the PCB board is provided inside the housing. A fixing mechanism for preventing the connecting wire on the electronic device from falling off is provided inside the SMP type connector. PIN diodes for ensuring stable transmission of RF signals are provided on the surface of the PCB board.

[0005] Preferably, the connecting mechanism includes a fixing block, a spring groove, a first spring, a clamping block, a fixing frame, a limiting block, a screw groove, a screw and a limiting groove. Two groups of fixing blocks are fixedly connected inside the housing. A spring groove is formed on the surface of the fixing block. A first spring is arranged inside the spring groove. One end of the first spring is fixedly connected to the fixing block, and the other end is fixedly connected to the clamping block. The clamping block is slidably connected to the inner wall of the spring groove. Multiple groups of fixing frames are fixedly connected inside the housing. A limiting block is fixedly connected to the surface of the fixing frame. A screw groove is formed on the surface of the limiting block. A screw is threadedly connected to the inner wall of the screw groove. Multiple groups of limiting grooves are formed and connected on the surface of the PCB board. The limiting block is slidably connected to the inner wall of the limiting groove.

[0006] By adopting the above technical solution, the PCB board is placed in the housing, the limiting block is inserted into the limiting groove, and the PCB board can be limited by the clamping block. At the same time, the screw is screwed, and the screw passes through the screw groove and is threadedly connected to the fixing frame, so that the screw is fixed on the limiting block, and the top of the screw blocks the surface of the PCB board, so that the PCB board will not slide during use.

[0007] Preferably, the diameter dimension of the spring groove matches the diameter dimension of the first spring.

[0008] Preferably, the inner wall dimension of the limiting groove matches the outer wall dimension of the limiting block.

[0009] Preferably, the fixing mechanism includes a fixing groove, a sliding rod, a second spring, a top block, a fixing head, a clamping groove and a connecting wire. A fixing groove is formed at one end of the SMP type connector. A sliding rod is slidably connected to the surface of the SMP type connector. A second spring is sleeved on the surface of the sliding rod. A top block is fixedly connected to the top of the sliding rod. One end of the second spring is fixedly connected to the SMP type connector, and the other end is fixedly connected to the top block. The fixing head is slidably connected to the inner wall of the fixing groove. A clamping groove is formed on the surface of the fixing head. One end of the sliding rod is matched with the clamping groove. A connecting wire is fixedly connected to the surface of the fixing head.

[0010] By adopting the above technical solution, the fixing head at one end of the connecting wire on the electronic device is inserted into the fixing groove. The sliding rod is pulled by the top block, so that the second spring is stretched. Then the fixing head is inserted into the fixing groove, and the top block is released, so that the second spring resets and drives one end of the sliding rod to be inserted into the clamping groove, so that the connecting wire will not come off during use through the fixing head, avoiding affecting the strong electromagnetic pulse protection of the electronic device.

[0011] Preferably, connecting grooves are formed at both ends of the PCB board. A connecting block is fixedly connected to one end of the SMP type connector. The connecting block is slidably connected to the inner wall of the connecting groove.

[0012] Preferably, a cover plate is slidably connected to the top of the housing, and the housing, the cover plate and the SMP type connector are integrally welded.

[0013] By adopting the above technical solution, the housing, the cover plate and the SMP type connector are integrally designed with a closed structure, ensuring their environmental adaptability; an electromagnetic shield is formed, reducing the interference of the external environment on the circuit and ensuring the stability of the radio frequency performance. Preferably, the housing and the cover plate are made of metal materials.

[0014] By adopting the above technical solution, the housing and the cover plate can form a closed "Faraday cage", making the internal space an electromagnetic silent area.

[0015] Preferably, capacitors and air-core inductors are provided on the surface of the PCB board.

[0016] Technical effects and advantages of this application: Compared with the prior art, this dual-channel radio frequency high-intensity electromagnetic pulse protector, through PIN diodes and a dual-channel design on the front and back sides of the circuit board, integrates two-way protection on one protector and uses PIN diodes and LC filtering for protection, enabling it to significantly reduce volume and weight. By using a combination of PIN diodes and LC filters, it ensures low residual voltage and high radio frequency electrical characteristics, can achieve comprehensive protection for the clock and local oscillator, and provides a stronger electromagnetic protection effect.

[0017] Compared with the prior art, this dual-channel radio frequency high-intensity electromagnetic pulse protector, through the connecting mechanism, enables the PCB board to be stuck in the opening at the bottom of the clamping block. By screwing the screw, the screw can be fixed on the limiting block, and the top of the screw blocks the surface of the PCB board, preventing the PCB board from sliding during use.

[0018] Compared with the prior art, this dual-channel radio frequency high-intensity electromagnetic pulse protector, through the fixing mechanism, when the device is connected to an electronic device through an SMP type connector, it is necessary to insert the fixing head at one end of the connecting wire on the electronic device into the fixing slot. By pulling the sliding rod with the top block, the second spring is stretched, and then the fixing head is inserted into the fixing slot. After releasing the top block, the second spring resets and drives one end of the sliding rod to be inserted into the card slot, thereby preventing the connecting wire from detaching during use through the fixing head and avoiding affecting the high-intensity electromagnetic pulse protection of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of this application; Figure 2 It is a schematic diagram of the structure of the housing and the cover plate of this application in cooperation; Figure 3 It is a schematic diagram of the structure of the housing and the PCB board of this application in cooperation; Figure 4 Structural schematic diagram of the connection mechanism of the present application; Figure 5 Structural schematic diagram of the cooperation between the connection groove and the connection block of the present application; Figure 6 Structural schematic diagram of the fixing mechanism of the present application; Figure 7 Structural schematic diagram of the cooperation between the outer shell and the SMP type connector of the present application; Figure 8 For the present application Figure 3 Enlarged schematic diagram of A in Figure 9 Circuit principle block diagram of the present application.

[0020] Reference numerals in the drawings are: 1, outer shell; 2, cover plate; 3, PCB board; 4, SMP type connector; 5, connection mechanism; 501, fixing block; 502, spring groove; 503, first spring; 504, clamping block; 505, fixing frame; 506, limiting block; 507, screw groove; 508, screw; 509, limiting groove; 6, connection groove; 7, connection block; 8, fixing mechanism; 801, fixing groove; 802, sliding rod; 803, second spring; 804, top block; 805, fixing head; 806, card slot; 807, connecting wire; 9, PIN diode; 10, capacitor; 11, hollow inductor. Detailed implementation manners

[0021] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0022] Embodiment: As Figures 1 to 9A dual-channel radio frequency high-intensity electromagnetic pulse protector as shown includes a housing 1, a PCB board 3, SMP connectors 4, and PIN diodes 9. The PCB board 3 is slidably connected inside the housing 1. Multiple groups of SMP connectors 4 are fixedly connected to the surface of the housing 1 for connecting the device to the electronic equipment that needs to be protected. A connection mechanism 5 for fixing the PCB board 3 is provided inside the housing 1 to facilitate the installation of the PCB board 3 in the housing 1. A fixing mechanism 8 that prevents the connecting wire 807 on the electronic equipment from falling off is provided inside the SMP connector 4, so that the connecting wire 807 on the electronic equipment will not fall off during use, avoiding affecting the high-intensity electromagnetic pulse protection of the electronic equipment. PIN diodes 9 that ensure stable radio frequency signal transmission are provided on the surface of the PCB board 3. Since the frequencies and powers of lightning, nuclear electromagnetic pulses, and microwaves are different, the circuit utilizes the power characteristics and LC filtering characteristics of the PIN diodes 9. The following describes the circuit working process. The high voltages of lightning and nuclear electromagnetic pulses enter the circuit through the input interface. Since their power levels exceed the threshold level of the PIN diodes 9, the PIN diodes 9 work to limit them to a certain level. At the same time, due to the startup characteristics of the PIN diodes 9, a part of the peak leakage can still pass through the PIN diodes 9. The subsequent LC circuit further limits the residual voltage to a lower level by exerting its reflection filtering characteristics. At the same time, due to the good matching design between the LC circuit and the PIN diodes 9, it has high radio frequency electrical characteristics performance within the band, ensuring high-quality transmission of radio frequency signals.

[0023] Based on the embodiment, the solution in the embodiment is further refined and introduced in combination with the following specific working methods, as Figures 1 to 9 shown, and the details are described below: As a preferred embodiment, the connecting mechanism 5 includes a fixing block 501, a spring groove 502, a first spring 503, a clamping block 504, a fixing frame 505, a limiting block 506, a screw groove 507, a screw 508 and a limiting groove 509. Two groups of fixing blocks 501 are fixedly connected inside the housing 1. A spring groove 502 is formed on the surface of the fixing block 501. A first spring 503 is arranged inside the spring groove 502. One end of the first spring 503 is fixedly connected to the fixing block 501, and the other end is fixedly connected to the clamping block 504. The clamping block 504 is slidably connected to the inner wall of the spring groove 502. Multiple groups of fixing frames 505 are fixedly connected inside the housing 1. A limiting block 506 is fixedly connected to the surface of the fixing frame 505. A screw groove 507 is formed on the surface of the limiting block 506. A screw 508 is threadedly connected to the inner wall of the screw groove 507. Multiple groups of limiting grooves 509 are formed and connected on the surface of the PCB board 3. The limiting block 506 is slidably connected to the inner wall of the limiting groove 509. When installing the PCB board 3, place the PCB board 3 in the housing 1 so that the limiting block 506 can be inserted into the limiting groove 509. At the same time, the surface of the PCB board 3 will squeeze the clamping block 504 and the first spring 503. When the PCB board 3 passes through the clamping block 504, the first spring 503 and the clamping block 504 are reset, so that the PCB board 3 can be stuck in the opening at the bottom of the clamping block 504, thereby preventing the PCB board 3 from being randomly pulled out of the housing 1. At the same time, turn the screw 508, and the screw 508 passes through the screw groove 507 and is threadedly connected to the fixing frame 505, so that the screw 508 can be fixed on the limiting block 506, and the top of the screw 508 blocks the surface of the PCB board 3, so that the PCB board 3 will not slide during use.

[0024] As a preferred embodiment, the diameter dimension of the spring groove 502 matches the diameter dimension of the first spring 503. When the first spring 503 expands and contracts, the spring groove 502 will limit the first spring 503 to prevent the first spring 503 from shaking.

[0025] As a preferred embodiment, the inner wall dimension of the limiting groove 509 matches the outer wall dimension of the limiting block 506. When the limiting block 506 slides inside the limiting groove 509, the limiting groove 509 can limit the sliding of the limiting block 506 to prevent the limiting block 506 from shaking inside the limiting groove 509.

[0026] As a preferred embodiment, the fixing mechanism 8 includes a fixing groove 801, a sliding rod 802, a second spring 803, a top block 804, a fixing head 805, a clamping groove 806 and a connecting wire 807. A fixing groove 801 is formed at one end of the SMP connector 4. A sliding rod 802 is slidably connected to the surface of the SMP connector 4. A second spring 803 is sleeved on the surface of the sliding rod 802. A top block 804 is fixedly connected to the top of the sliding rod 802. One end of the second spring 803 is fixedly connected to the SMP connector 4, and the other end is fixedly connected to the top block 804. A fixing head 805 is slidably connected to the inner wall of the fixing groove 801. A clamping groove 806 is formed on the surface of the fixing head 805. One end of the sliding rod 802 is matched with the clamping groove 806. A connecting wire 807 is fixedly connected to the surface of the fixing head 805. When the device is connected to an electronic device through the SMP connector 4, it is necessary to insert the fixing head 805 at one end of the connecting wire 807 on the electronic device into the fixing groove 801, pull the sliding rod 802 through the top block 804 to stretch the second spring 803, then insert the fixing head 805 into the fixing groove 801, release the top block 804, so that the second spring 803 resets and drives one end of the sliding rod 802 to be inserted into the clamping groove 806, so that the connecting wire 807 will not come off during use through the fixing head 805, avoiding affecting the protection of the electronic device against strong electromagnetic pulses.

[0027] As a preferred embodiment, connection grooves 6 are formed at both ends of the PCB board 3. A connection block 7 is fixedly connected to one end of the SMP connector 4. The connection block 7 is slidably connected to the inner wall of the connection groove 6, so that the connection block 7 can be inserted into the connection groove 6, and the PCB board 3 and the SMP connector 4 can be connected together.

[0028] As a preferred embodiment, a cover plate 2 is slidably connected to the top of the housing 1, so that the cover plate 2 can cover the housing 1. The housing 1, the cover plate 2 and the SMP connector 4 are integrally welded. Through the closed design of the overall structure, its environmental adaptability is ensured; electromagnetic shielding is formed, reducing the interference of the external environment on the circuit, ensuring the stability of the radio frequency performance, and at the same time reducing the grounding impedance, ensuring the lightning discharge loop, which is beneficial to reducing the residual voltage.

[0029] As a preferred embodiment, the housing 1 and the cover plate 2 are made of metal materials, and a closed "Faraday cage" is formed through the metal housing, making the internal space an electromagnetic silent area.

[0030] As a preferred embodiment, capacitors 10 and air-core inductors 11 are provided on the surface of the PCB board 3. The capacitors 10 are used to store and release electrical energy. The air-core inductor 11 is an inductor component made of non-magnetic material. With characteristics such as no magnetic saturation, low high-frequency loss, and high Q value, it is used in cooperation with the PIN diode 9. The working process of this application is as follows: First, when installing the PCB board 3, place the PCB board 3 in the housing 1 so that the limit block 506 can be inserted into the limit slot 509. At the same time, the surface of the PCB board 3 will squeeze the clamping block 504 and the first spring 503. After the PCB board 3 passes through the clamping block 504, the first spring 503 and the clamping block 504 reset, so that the PCB board 3 can be stuck in the opening at the bottom of the clamping block 504, thereby preventing the PCB board 3 from being pulled out of the housing 1 randomly. At the same time, turn the screw 508. The screw 508 passes through the screw slot 507 and is threadedly connected to the fixing bracket 505, so that the screw 508 can be fixed on the limit block 506, and the top of the screw 508 blocks the surface of the PCB board 3, so that the PCB board 3 will not slide during use. Then cover the cover plate 2 on the housing 1 and use a welding tool to weld the housing 1, the cover plate 2 and the SMP-type connector 4 into one body. Through the sealed design of the overall structure, its environmental adaptability is ensured; electromagnetic shielding is formed, reducing the interference of the external environment on the circuit, ensuring the stability of the radio frequency performance, and at the same time reducing the grounding impedance, ensuring the lightning discharge loop, which is beneficial to reducing the residual voltage. When the device is connected to an electronic device through the SMP-type connector 4, it is necessary to insert the fixing head 805 at one end of the connecting wire 807 on the electronic device into the fixing slot 801, pull the sliding rod 802 by the top block 804, so that the second spring 803 is stretched, and then insert the fixing head 805 into the fixing slot 801. Release the top block 804, so that the second spring 803 resets and drives one end of the sliding rod 802 to be inserted into the card slot 806, thereby preventing the connecting wire 807 from detaching during use through the fixing head 805, avoiding affecting the protection against strong electromagnetic pulses of the electronic device. Use PIN diodes for the first-level protection, effectively reducing the size. The two-way radio frequency signals are respectively on the front and back of the PCB board 3, greatly reducing the overall volume, and at the same time separating the two-way radio frequency signals to reduce crosstalk, thereby ensuring the high-quality transmission of the radio frequency signals. The above is the working principle of this dual-channel radio frequency strong electromagnetic pulse protector.

Claims

1. A dual-channel radio frequency high-intensity electromagnetic pulse protector, comprising a housing (1), a PCB board (3), an SMP type connector (4), and PIN diodes (9). The PCB board (3) is slidably connected inside the housing (1), and multiple groups of SMP type connectors (4) are fixedly connected to the surface of the housing (1). It is characterized in that: Inside the housing (1), there is a connection mechanism (5) for fixing the PCB board (3). Inside the SMP connector (4), there is a fixing mechanism (8) to prevent the connecting wire (807) on the electronic device from falling off. On the surface of the PCB board (3), there are PIN diodes (9) to ensure stable radio frequency signal transmission.

2. The dual-channel radio frequency high-intensity electromagnetic pulse protector according to claim 1, characterized in that: The connection mechanism (5) includes fixing blocks (501), spring grooves (502), first springs (503), clamping blocks (504), fixing frames (505), limiting blocks (506), screw grooves (507), screws (508) and limiting grooves (509). Two groups of fixing blocks (501) are fixedly connected inside the housing (1). Spring grooves (502) are formed on the surfaces of the fixing blocks (501). First springs (503) are arranged inside the spring grooves (502). One end of each first spring (503) is fixedly connected to a fixing block (501), and the other end is fixedly connected to a clamping block (504). The clamping blocks (504) are slidably connected to the inner walls of the spring grooves (502). Multiple groups of fixing frames (505) are fixedly connected inside the housing (1). Limiting blocks (506) are fixedly connected to the surfaces of the fixing frames (505). Screw grooves (507) are formed on the surfaces of the limiting blocks (506). Screws (508) are threadedly connected to the inner walls of the screw grooves (507). Multiple groups of limiting grooves (509) are formed and connected on the surface of the PCB board (3). The limiting blocks (506) are slidably connected to the inner walls of the limiting grooves (509).

3. The dual-channel radio frequency high-intensity electromagnetic pulse protector according to claim 2, characterized in that: The diameter dimension of the spring groove (502) matches the diameter dimension of the first spring (503).

4. A dual-channel radio frequency high-intensity electromagnetic pulse protector according to claim 2, characterized in that: The inner wall dimension of the limiting groove (509) matches the outer wall dimension of the limiting block (506).

5. A dual-channel radio frequency high-intensity electromagnetic pulse protector according to claim 1, characterized in that: The fixing mechanism (8) includes a fixing groove (801), a sliding rod (802), a second spring (803), a top block (804), a fixing head (805), a clamping groove (806) and a connecting wire (807). A fixing groove (801) is formed at one end of the SMP connector (4). A sliding rod (802) is slidably connected to the surface of the SMP connector (4). A second spring (803) is sleeved on the surface of the sliding rod (802). The top of the sliding rod (802) is fixedly connected to a top block (804). One end of the second spring (803) is fixedly connected to the SMP connector (4), and the other end is fixedly connected to the top block (804). A fixing head (805) is slidably connected to the inner wall of the fixing groove (801). A clamping groove (806) is formed on the surface of the fixing head (805). One end of the sliding rod (802) is matched with the clamping groove (806). A connecting wire (807) is fixedly connected to the surface of the fixing head (805).

6. The dual-channel radio frequency high-intensity electromagnetic pulse protector according to claim 1, wherein: Connection grooves (6) are formed at both ends of the PCB board (3). A connection block (7) is fixedly connected to one end of the SMP connector (4). The connection block (7) is slidably connected to the inner wall of the connection groove (6).

7. The dual-channel RF high-intensity electromagnetic pulse protector according to claim 1, characterized in that: A cover plate (2) is slidably connected to the top of the housing (1), and the housing (1), the cover plate (2) and the SMP type connector (4) are integrally welded.

8. A dual-channel radio frequency high-intensity electromagnetic pulse protector according to claim 1, characterized in that: The housing (1) and the cover plate (2) are made of metal materials.

9. The dual-channel RF high-intensity electromagnetic pulse protector according to claim 1, characterized in that: Capacitors (10) and air-core inductors (11) are provided on the surface of the PCB board (3).

Images