Bionic liquid cooling heat dissipation structure for heat dissipation of IGBT of motor controller

Abstract

The invention discloses a bionic liquid cooling heat dissipation structure for heat dissipation of an IGBT (Insulated Gate Bipolar Translator) of a motor controller, which comprises a liquid cooling seat with a liquid cooling channel, a liquid cooling plate, a liquid inlet and a liquid outlet, the liquid cooling channel is provided with branch liquid paths in three-stage distribution; the plurality of IGBTs are arranged in multiple rows and are in contact with the liquid cooling plate; the three-stage liquid paths are pairwise arranged, and a plurality of communicating runners are connected between the three-stage liquid paths in the same pair to form a combined liquid path; for the IGBTs in each row, the head IGBT and the tail IGBT are located at the bifurcation position where the second-stage liquid path is transited to the third-stage liquid path and the convergence position where the third-stage liquid path is transited to the second-stage liquid path respectively. Each IGBT in the middle of each row crosses multiple groups of combined liquid paths; and in the combined liquid path on the side of the IGBT, only the cooling liquid in one three-stage liquid path directly participates in heat absorption. According to the liquid cooling heat dissipation structure, effective heat dissipation can be carried out on the multiple IGBTs which are distributed in a scattered mode, and the situation that the front IGBT has a large influence on heat dissipation of the rear IGBT is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of IGBT liquid cooling heat dissipation, and particularly to a bionic liquid cooling heat dissipation structure for dissipating heat from IGBTs of a motor controller. Background Art

[0002] As the core power source of new energy vehicles, the performance of the electric drive system directly determines the overall performance of new energy vehicles. Specifically, it covers multiple key aspects such as power performance, economic performance, comfort performance, and safety performance. The electric drive system mainly consists of components such as a motor, a controller, a power supply, a transmission system, and a charging system. In this complex system, the motor controller plays a crucial role. And in the drive motor controller, the most core component is the IGBT (Insulated Gate Bipolar Transistor).

[0003] The IGBT is a composite fully controlled voltage-driven power semiconductor device composed of a BJT (bipolar junction transistor) and a MOS (insulated gate field effect transistor). When the battery discharges to drive the motor, through the circuit composed of IGBTs, the direct current is converted into alternating current used by the AC motor, and at the same time, the frequency conversion and voltage conversion of the AC motor are controlled. A large amount of heat is generated during the operation of the IGBT module, which is the main heat source in the motor controller. Along with the increase in temperature, the failure probability of the IGBT power module will also increase significantly. When the working temperature is too high, it will cause changes in the internal parameters and semiconductor physical constants of the device, deteriorating the performance such as the switching off speed, on-state voltage drop, current tail time, and loss. The IGBT module cannot work properly, and even its working life is reduced. Therefore, in order to maintain the stable operation of the IGBT power module, a reliable heat dissipation design and a smooth heat dissipation channel are required to quickly and effectively reduce the internal heat of the module to meet the requirements of the module reliability index.

[0004] For the IGBT module, a pin-type heat dissipation substrate as shown in Figure 1 is mainly adopted. The heat dissipation substrate located at the bottom of the power module is provided with a pin-fin heat dissipation structure, and a sealing ring can be directly added to dissipate heat through the coolant. Although the current pin-type liquid cooling channel structure in the IGBT module can control the temperature rise of the IGBT to a certain extent under normal working conditions, due to the distribution characteristics of its turbulator columns, the coolant does not completely cover the entire flow channel, and it requires more coolant, which will increase the volume of the liquid cooling system.

[0005] In the prior art, patents such as Patent CN 219892241U, CN 221978051U, and CN116171023A disclose liquid cooling heat dissipation structures with bionic tree-like fractal flow channel structures. The liquid flow channels in these patents have a multi-level distributed flow channel design. However, the solutions in these patents are mainly for heat dissipation of large-area power batteries and are directly applied to liquid cooling heat dissipation of IGBTs with a dispersed layout, resulting in poor heat dissipation effects. It is easy to have a situation where the IGBTs in the front cause the coolant to carry heat and affect the heat dissipation of the IGBTs in the back. Moreover, when performing liquid cooling heat dissipation for IGBTs, situations such as the volume of the liquid cooling module and reducing the coolant flow rate need to be considered. The above liquid cooling heat dissipation structures applied to lithium battery heat dissipation cannot be directly applied. Summary of the Invention

[0006] Object of the Invention: In order to overcome the deficiencies in the prior art, the present invention provides a bionic liquid cooling heat dissipation structure for cooling IGBTs of a motor controller, which can effectively dissipate heat from multiple IGBTs and avoid the IGBTs in the front having a great impact on the heat dissipation of the IGBTs in the back.

[0007] Technical Solution: To achieve the above object, the bionic liquid cooling heat dissipation structure for cooling IGBTs of a motor controller of the present invention includes a liquid cooling seat containing a liquid cooling channel and a liquid cooling plate covering the liquid cooling channel, and further includes an inlet and an outlet connecting the liquid cooling channel; the IGBTs to be cooled are in contact with the liquid cooling plate;

[0008] The liquid cooling channel has three levels of distributed branch liquid paths, namely a first-level liquid path, a second-level liquid path, and a third-level liquid path. The three-level branch liquid paths first start from the inlet and bifurcate and extend step by step, and then converge to the outlet step by step; that is, the second-level liquid path bifurcates and extends from the first-level liquid path, the third-level liquid path bifurcates and extends from the second-level liquid path, and then the third-level liquid path converges to the second-level liquid path, and the second-level liquid path converges to the first-level liquid path;

[0009] The multiple IGBTs are arranged in multiple rows, and there is a spacing not less than the width of the IGBT itself between adjacent IGBTs in each row;

[0010] The third-level liquid paths are in pairs, and there are multiple connecting flow channels connected between the third-level liquid paths in the same pair; the third-level liquid paths in the same pair and all the connecting flow channels therebetween are collectively referred to as a combined liquid path;

[0011] For each row of the IGBTs, the first and last IGBTs in each row are respectively located at the bifurcation position where the second-level liquid path transitions to the third-level liquid path and the convergence position where the third-level liquid path transitions to the second-level liquid path;

[0012] Each IGBT in the middle of each row spans across multiple groups of the combined liquid circuits; in the combined liquid circuits located on the side of the IGBT, only the coolant in one of the three-level liquid circuits directly participates in heat absorption, and the coolant in the other three-level liquid circuit does not directly participate in heat absorption. Direct participation in heat absorption means that the coolant in the three-level liquid circuit passes through the coverage area of ​​the IGBT, and the coolant and the IGBT are separated only by a heat sink.

[0013] Furthermore, the IGBT located in the middle of the row spans across at least three pairs of the combined liquid circuits, wherein two of the three-level liquid circuits in the middle combined liquid circuit are arranged at intervals in a direction perpendicular to the liquid cooling plate, that is, one of the three-level liquid circuits.

[0014] Furthermore, in one embodiment, the combined liquid circuits located on the sides of the IGBT are all formed on the front side of the liquid cooling seat; for the combined liquid circuit located in the middle of the IGBT, its two tertiary liquid circuits are respectively formed on the front and back sides of the liquid cooling seat, the connecting flow channel penetrates the liquid cooling seat to connect the two tertiary liquid circuits, and the back side of the liquid cooling seat has a cover body for covering the tertiary liquid circuit on the back side.

[0015] In actual use, the coolant is introduced from the liquid inlet, and the introduced coolant is dispersed to the secondary liquid circuit and then to the tertiary liquid circuit through the primary liquid circuit in turn, and then converges from the tertiary liquid circuit to the secondary liquid circuit on the other side, and finally converges to the primary liquid circuit and is discharged from the primary liquid circuit.

[0016] The heat carried by the coolant passing through the IGBT at the head end of each row can be dissipated to multiple tertiary liquid circuits for heat dissipation before passing through the IGBT in the middle of the row; for the IGBT in the middle of the row, since at least part of the tertiary liquid circuits involved in the IGBT are connected to the tertiary liquid circuit that is not directly involved in heat absorption through the connecting flow channel, the heat can be dispersed in time. Since the spacing between the IGBTs is large, when the coolant passing through one IGBT reaches the position of the next IGBT, it carries less heat and will not affect the heat dissipation of the subsequent IGBTs; for the IGBT at the end of the row, since it is located at the convergence position of multiple tertiary liquid circuits, the coolant in each circuit can be fully neutralized, and the neutralized coolant passes through the IGBT at a lower temperature to take away the heat generated by it.

[0017] It can be seen that by adopting the above structure, through the reasonable optimization of the placement position of the IGBT and the liquid cooling channel, when the coolant performs liquid cooling on the IGBTs in a row, the IGBT in front has little effect on the IGBT in the back, thereby achieving sufficient heat dissipation of all IGBTs and effectively preventing the problem of diminishing heat dissipation effect when cooling the IGBTs in the same row.

[0018] Moreover, compared with the traditional solution, the solution of the present invention requires less coolant to be introduced into the entire liquid cooling channel and achieves better heat dissipation effect.

[0019] Further, the IGBT located in the middle of the row straddles at least three pairs of the combined liquid paths, and two of the three-level liquid paths in the middle combined liquid path are arranged at intervals in a direction perpendicular to the liquid cooling plate, that is, one of the three-level liquid paths.

[0020] Further, in another solution, for the combined liquid path in the middle of the IGBT, its two three-level liquid paths are respectively formed on the front and back sides of the liquid cooling seat, the communication flow channel penetrates the liquid cooling seat to connect the two three-level liquid paths, and the back side of the liquid cooling seat has a cover body that covers the three-level liquid path on the back side.

[0021] Further, the liquid cooling channel further includes a peripheral liquid path along the edge of the liquid cooling seat and not passing through any IGBT.

[0022] By setting the peripheral liquid path, the coolant passing through the peripheral liquid path and the coolant passing through each level of branch liquid path are aggregated at the liquid outlet, and the heat can be neutralized, so that the temperature of the coolant discharged from the liquid outlet is relatively low. If necessary, it can also be introduced into the liquid inlet of another group of bionic liquid cooling heat dissipation structures to realize the heat dissipation operation of multiple series-connected bionic liquid cooling heat dissipation structures.

[0023] Further, the back side of the liquid cooling seat has a hollow groove, so that the wall thickness of the bottom and the side wall of each grading liquid path of the liquid cooling channel is equal. With this structure, it is more conducive to the coolant to dissipate part of the heat in time through the heat conduction of the liquid cooling seat during the process of walking along each level of liquid path.

[0024] Further, the first ends and / or the last ends of the second-level liquid path and the third-level liquid path have inclined liquid sections; the communication flow channel is inclinedly arranged. In this solution, the first end of the second-level liquid path close to the liquid inlet has an inclined liquid section, and the last end of the second-level liquid path close to the liquid outlet has an inclined liquid section; both the first end and the last end of the third-level liquid path have inclined liquid sections. By setting the inclined liquid sections and making the communication flow channel inclinedly arranged, it is more convenient for the coolant to walk smoothly in the liquid cooling channel and reduce the driving resistance.

[0025] Further, the IGBT is connected to the liquid cooling plate through a heat conduction medium. The heat conduction medium can be silicone grease, liquid metal, etc.

[0026] Further, both the liquid cooling seat and the liquid cooling plate are made of high thermal conductivity materials.

[0027] Beneficial effects: The bionic liquid cooling heat dissipation structure for dissipating heat from the IGBT of the motor controller of the present invention has the following beneficial effects:

[0028] (1) By reasonably optimizing the placement position of the IGBTs and the liquid cooling channels, when the coolant performs liquid cooling on the row of IGBTs, the IGBTs in the front have little influence on the IGBTs in the back, achieving sufficient heat dissipation for all IGBTs and effectively preventing the problem of decreasing heat dissipation effect when cooling the IGBTs in the same row.

[0029] (2) And compared with the traditional scheme, the scheme of the present invention requires less coolant flowing through the entire liquid cooling channel and achieves better heat dissipation effect.

[0030] (3) In the preferred scheme, by making the liquid cooling channel in a three-dimensional layout, it can be achieved that for each of no less than three combined liquid paths, the coolant in one three-level liquid path does not directly absorb heat, and all combined liquid paths have the same effect of timely dissipating heat. Description of the Drawings

[0031] Figure 1 is the structural diagram of a traditional pin-type heat dissipation substrate;

[0032] Figure 2 is the first perspective structural diagram of the bionic liquid cooling heat dissipation structure for cooling the IGBTs of the motor controller in the first embodiment;

[0033] Figure 3 is the exploded structural diagram of the bionic liquid cooling heat dissipation structure for cooling the IGBTs of the motor controller in the first embodiment;

[0034] Figure 4 is the second perspective structural diagram of the bionic liquid cooling heat dissipation structure for cooling the IGBTs of the motor controller in the first embodiment;

[0035] Figure 5 is the structural diagram of the liquid cooling channel in the first embodiment;

[0036] Figure 6 is the sectional structural diagram of the bionic liquid cooling heat dissipation structure in the first embodiment;

[0037] Figure 7 is the structural diagram of the cover body;

[0038] Figure 8 is the structural diagram of the liquid cooling channel in the bionic liquid cooling heat dissipation structure in the second embodiment;

[0039] Figure 9 is the three-dimensional structural diagram of the bionic liquid cooling heat dissipation structure in the second embodiment;

[0040] Figure 10 is the structural diagram of the liquid cooling channel in the bionic liquid cooling heat dissipation structure in the third embodiment;

[0041] Figure 11 It is the internal flow field simulation diagram of the traditional pin-type heat dissipation structure;

[0042] Figure 12 It is the internal flow field simulation diagram of the bionic liquid cooling heat dissipation structure of the first embodiment;

[0043] Figure 13 It is the temperature field simulation diagram of the traditional pin-type heat dissipation structure;

[0044] Figure 14 It is the temperature field simulation diagram of the bionic liquid cooling heat dissipation structure of the first embodiment.

[0045] In the figure: 1 - liquid cooling seat; 1a - primary liquid path; 1b - secondary liquid path; 1c - tertiary liquid path; 1d - connecting flow channel; 1e - peripheral liquid path; 1f - hollowed-out groove; 1g - screw hole; 2 - liquid cooling plate; 3 - liquid inlet; 4 - liquid outlet; 5 - cover body; 51 - groove part; 52 - fixing edge; 53 - fixing ear; 6 - screw. Specific embodiments

[0046] The present invention will be further described below in conjunction with the accompanying drawings.

[0047] Embodiment 1

[0048] As Figure 2 Shown Figure 3 The bionic liquid cooling heat dissipation structure for dissipating heat from the IGBT of the motor controller shown, which includes a liquid cooling seat 1 containing a liquid cooling channel and a liquid cooling plate 2 covering the liquid cooling channel, and also includes connecting the liquid inlet 3 and the liquid outlet 4 of the liquid cooling channel; the IGBT to be cooled is in contact with the liquid cooling plate 2;

[0049] As Figure 5 Shown, the liquid cooling channel has a three-level distributed branch liquid path, namely a primary liquid path 1a, a secondary liquid path 1b, and a tertiary liquid path 1c. The three-level branch liquid path first branches and extends step by step from the liquid inlet, and then converges step by step to the liquid outlet; that is, the secondary liquid path 1b branches and extends from the primary liquid path 1a, the tertiary liquid path 1c branches and extends from the secondary liquid path 1b, and then the tertiary liquid path 1c converges to the secondary liquid path 1b, and the secondary liquid path 1b converges to the primary liquid path 1a;

[0050] Multiple said IGBTs are arranged in multiple rows, and there is a spacing not less than the width of the IGBT itself between adjacent IGBTs in each row;

[0051] The tertiary liquid paths 1c are paired in pairs, and a plurality of connecting flow channels 1d are connected between the paired tertiary liquid paths 1c; the paired tertiary liquid paths 1c and all the connecting flow channels 1d therebetween are collectively called a combined liquid path;

[0052] As Figure 5 shown, for each row of the IGBTs, the first and last IGBTs in each row are respectively located at the bifurcation position where the secondary liquid path 1b transitions to the tertiary liquid path 1c and the convergence position where the tertiary liquid path 1c transitions to the secondary liquid path 1b;

[0053] The IGBTs located in the middle of the row span at least three pairs of the combined liquid paths. Among them, in the combined liquid paths located on the side of the IGBT, only the coolant in one of the tertiary liquid paths directly participates in heat absorption, and the coolant in the other tertiary liquid path does not directly participate in heat absorption. And the two tertiary liquid paths 1c in the combined liquid paths located in the middle of the IGBT are arranged at intervals in the direction perpendicular to the liquid cooling plate 2.

[0054] Each IGBT in the middle of each row spans multiple groups of the combined liquid paths; among the multiple groups of the combined liquid paths spanned by each IGBT; in the combined liquid paths located on the side of the IGBT, only the coolant in one of the tertiary liquid paths directly participates in heat absorption, and the coolant in the other tertiary liquid path does not directly participate in heat absorption. Directly participating in heat absorption means that the coolant in the tertiary liquid path passes through the coverage range of the IGBT, and the coolant is only separated from the IGBT by the liquid cooling plate 2.

[0055] As Figure 6 shown, the combined liquid paths located on the side of the IGBT are all formed on the front side of the liquid cooling seat 1. For the combined liquid paths located in the middle of the IGBT, its two tertiary liquid paths 1c are respectively formed on the front and back sides of the liquid cooling seat 1. The communication flow channel 1d penetrates the liquid cooling seat 1 to connect the two tertiary liquid paths 1c, and the back side of the liquid cooling seat 1 has a cover body 5 that covers the tertiary liquid path 1c on the back side. The cover body 5 is fixed to the liquid cooling seat 1 by fasteners.

[0056] Specifically, as Figure 7 shown, the cover body 5 has a groove body portion 51 and a fixing edge 52 arranged around the groove body portion 51. Multiple groups of fixing ears 53 are formed on both sides of the fixing edge 52; screw holes 1g corresponding to the fixing ears 53 are provided on the liquid cooling seat 1, and the fixing ears 53 are fixed to the liquid cooling seat 1 by screws 6 screwed into the screw holes 1g.

[0057] In this way, by making the liquid cooling channels be in a three-dimensional layout, it can be achieved that for each of not less than three groups of combined liquid paths, the coolant in one of the tertiary liquid paths 1c does not directly absorb heat, and all the combined liquid paths have the same effect of timely dissipating heat, and a better heat dissipation effect can be obtained compared with the embodiment.

[0058] In actual use, the coolant is introduced from the liquid inlet 3, and the introduced coolant is dispersed to the secondary liquid path 1b and then to the tertiary liquid path 1c through the primary liquid path 1a in turn, and then converges from the tertiary liquid path 1c to the secondary liquid path 1b on the other side, and finally converges to the primary liquid path 1a and is discharged from the primary liquid path 1a.

[0059] The heat carried by the coolant passing through the IGBT at the head end of each row can be dissipated to multiple tertiary liquid circuits 1c for heat dissipation and then pass through the IGBT in the middle of the row; for the IGBT in the middle of the row, since part of the tertiary liquid circuit 1c involved in the IGBT is connected to the tertiary liquid circuit 1c that is not directly involved in heat absorption through the connecting channel 1d, the heat can be dispersed in time. Since the spacing between the IGBTs is large, when the coolant passing through one IGBT reaches the position of the next IGBT, it carries less heat and will not affect the heat dissipation of the subsequent IGBTs; for the IGBT at the end of the row, since it is located at the convergence position of multiple tertiary liquid circuits 1c, the coolant in each circuit can be fully neutralized, and the neutralized coolant passes through the IGBT at a lower temperature to take away the heat generated by it.

[0060] It can be seen that by adopting the above structure, through the reasonable optimization of the placement position of the IGBT and the liquid cooling channel, when the coolant performs liquid cooling on the IGBTs in a row, the IGBT in front has little effect on the IGBT in the back, thereby achieving sufficient heat dissipation of all IGBTs and effectively preventing the problem of diminishing heat dissipation effect when cooling the IGBTs in the same row.

[0061] Compared with the traditional solution, the solution of the present invention requires less cooling liquid to pass through the entire liquid cooling channel and achieves better heat dissipation effect.

[0062] Preferably, the liquid cooling channel also includes a peripheral liquid path 1e along the edge of the liquid cooling seat 1 and not passing through any IGBT.

[0063] By setting up the peripheral liquid circuit 1e, the coolant passing through the peripheral liquid circuit 1e and the coolant passing through the various levels of branch liquid circuits are collected at the liquid outlet 4, which can neutralize the heat, so that the temperature of the coolant discharged from the liquid outlet 4 is lower. If necessary, it can also be introduced into the liquid inlet of another group of bionic liquid-cooled heat dissipation structures to realize the heat dissipation operation of multiple series-connected bionic liquid-cooled heat dissipation structures.

[0064] Preferably, if Figure 4 As shown, the back side of the liquid cooling seat 1 has a hollow groove 1f, so that each of the graded liquid paths of the liquid cooling channel has the same wall thickness as the bottom and the side wall. With this structure, it is more conducive to the cooling liquid to dissipate part of the heat in time through the liquid cooling seat 1 during the process of running along the various levels of liquid paths.

[0065] Preferably, the first end and / or the last end of the secondary liquid path 1b and the tertiary liquid path 1c have inclined liquid sections; the connecting flow channel 1d is inclinedly arranged. In this embodiment, the first end of the secondary liquid path 1b near the liquid inlet 3 has an inclined liquid section, and the last end of the secondary liquid path 1b near the liquid outlet 4 has an inclined liquid section; both the first end and the last end of the tertiary liquid path 1c have inclined liquid sections. By providing the inclined liquid sections and making the connecting flow channel 1d inclinedly arranged, it is more convenient for the coolant to flow smoothly in the liquid cooling channel and reduce the flow resistance.

[0066] Preferably, the IGBT is connected to the liquid cooling plate 2 through a heat-conducting medium. The heat-conducting medium can be silicone grease, liquid metal, etc.

[0067] Preferably, both the liquid cooling base 1 and the liquid cooling plate 2 are made of high heat-conducting materials.

[0068] Embodiment 2

[0069] The bionic liquid cooling structure for dissipating heat from the IGBT of the motor controller in this embodiment has the same composition as that in Embodiment 1, and reference can be made to Figure 1 , which includes a liquid cooling base 1 containing a liquid cooling channel and a liquid cooling plate 2 covering the liquid cooling channel, and also includes a liquid inlet 3 and a liquid outlet 4 connecting the liquid cooling channel; the IGBT to be cooled is in contact with the liquid cooling plate 2;

[0070] As Figure 8 shown, the liquid cooling channel has three-level distributed branch liquid paths, namely a primary liquid path 1a, a secondary liquid path 1b, and a tertiary liquid path 1c. The three-level branch liquid paths first diverge and extend step by step from the liquid inlet, and then converge step by step to the liquid outlet; that is, the secondary liquid path 1b diverges and extends from the primary liquid path 1a, the tertiary liquid path 1c diverges and extends from the secondary liquid path 1b, and then the tertiary liquid path 1c converges to the secondary liquid path 1b, and the secondary liquid path 1b converges to the primary liquid path 1a;

[0071] The multiple IGBTs are arranged in multiple rows, and there is a spacing of not less than the width of the IGBT itself between adjacent IGBTs in each row;

[0072] The tertiary liquid paths 1c are paired in pairs, and a plurality of connecting flow channels 1d are connected between the paired tertiary liquid paths 1c; the paired tertiary liquid paths 1c and all the connecting flow channels 1d therebetween are collectively called a combined liquid path;

[0073] In this embodiment, as Figure 8As shown, the structures of all the combined liquid paths are the same. That is, the two tertiary liquid paths 1c included in each combined liquid path are respectively formed on the front and back sides of the liquid cooling base 1. The communication flow channel 1d penetrates the liquid cooling base 1 to connect the two tertiary liquid paths 1c. And a cover 5 is provided on the back side of the liquid cooling base 1 to cover the tertiary liquid path 1c on the back side, as Figure 9 shown. The cover 5 is fixed to the liquid cooling base 1 by screws 6.

[0074] By arranging all the combined liquid paths vertically in a direction perpendicular to the end face of the liquid cooling base 1, the structural compactness can be improved, and the layout density of the liquid paths in the liquid cooling base 1 can be reduced. In this way, the end face area of the liquid cooling base 1 can be decreased.

[0075] Embodiment III

[0076] The bionic liquid cooling heat dissipation structure for dissipating heat from the IGBT of the motor controller in this embodiment has the same composition as that in Embodiment I, and reference can be made to Figure 1 , which includes a liquid cooling base 1 containing a liquid cooling channel and a liquid cooling plate 2 covering the liquid cooling channel, and also includes an inlet 3 and an outlet 4 connecting the liquid cooling channel; the IGBT to be cooled contacts the liquid cooling plate 2.

[0077] As Figure 10 shown, the liquid cooling channel has a three - level distributed branch liquid path, namely a primary liquid path 1a, a secondary liquid path 1b, and a tertiary liquid path 1c. The tertiary liquid paths 1c are paired in pairs, and a plurality of communication flow channels 1d are connected between the paired tertiary liquid paths 1c; the paired tertiary liquid paths 1c and all the communication flow channels 1d therebetween are collectively called a combined liquid path;

[0078] In this embodiment, for each row of the IGBTs, each of the middle IGBTs straddles multiple groups (three groups in this embodiment) of the combined liquid paths; among the multiple groups of combined liquid paths straddled by each IGBT, in the combined liquid paths on the side of the IGBT, only the coolant in one of the tertiary liquid paths directly participates in heat absorption, and the coolant in the other tertiary liquid path does not directly participate in heat absorption. While in the combined liquid paths in the middle of the IGBT, the coolants in both of the tertiary liquid paths directly participate in heat absorption.

[0079] In the present invention, through simulation software, Figure 1 the flow field analysis and temperature field analysis are respectively carried out on the traditional liquid cooling heat dissipation structure and the liquid cooling heat dissipation structure of this embodiment. Among them Figure 11 is the internal flow field of the traditional liquid cooling heat dissipation structure, Figure 12 is the internal flow field of the liquid cooling heat dissipation structure of the present invention. It can be seen that the fluid flow and distribution of the heat dissipation structure of the present invention are more uniform, reducing the non - uniformity of the temperature distribution at the inlet and outlet of the traditional IGBT heat dissipation structure.Figure 13 is the temperature field of the traditional liquid cooling heat dissipation structure, Figure 14 is the temperature field of the heat dissipation structure of the present invention. It can be seen from the figure that the heat dissipation structure of the present invention has better temperature control for IGBT. Compared with the traditional IGBT heat dissipation structure, the IGBT heat dissipation structure of the present invention can reduce the IGBT temperature by up to 12.7 °C at most, and the heat dissipation performance of the IGBT heat dissipation structure of the present invention is better than that of the traditional IGBT heat dissipation structure.

[0080] The above are only the preferred embodiments of the present invention. It should be noted that: for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A bionic liquid cooling structure for dissipating heat from the IGBT of a motor controller, which comprises a liquid cooling seat (1) containing a liquid cooling channel and a liquid cooling plate (2) covering the liquid cooling channel, and further comprises a liquid inlet (3) and a liquid outlet (4) connecting the liquid cooling channel; the IGBT to be cooled is in contact with the liquid cooling plate (2); The liquid cooling channel has a three - level distributed branch liquid path, namely a primary liquid path (1a), a secondary liquid path (1b) and a tertiary liquid path (1c); A plurality of the IGBTs are arranged in multiple rows, and it is characterized in that: The tertiary liquid paths (1c) are paired in twos, and a plurality of connecting flow channels (1d) are connected between the paired tertiary liquid paths (1c); the paired tertiary liquid paths (1c) and all the connecting flow channels (1d) therebetween are collectively called a combined liquid path; For each row of the IGBTs, the first and the last IGBTs in each row are respectively located at the bifurcation position where the secondary liquid path (1b) transitions to the tertiary liquid path (1c) and the converging position where the tertiary liquid path (1c) transitions to the secondary liquid path (1b); Each of the IGBTs in the middle of each row straddles multiple groups of the combined liquid paths; among the combined liquid paths on the side of the IGBT, only the coolant in one of the tertiary liquid paths (1c) directly participates in heat absorption.

2. The bionic liquid cooling heat dissipation structure for IGBT of the motor controller according to claim 4, characterized in that The combined liquid paths on the side of the IGBT are all formed on the front side of the liquid cooling seat (1); for the combined liquid path in the middle of the IGBT, its two tertiary liquid paths (1c) are respectively formed on the front and back sides of the liquid cooling seat (1), the connecting flow channel (1d) penetrates through the liquid cooling seat (1) to connect the two tertiary liquid paths (1c), and a cover body (5) for covering the tertiary liquid path (1c) on the back side is provided on the back side of the liquid cooling seat (1).

3. The bionic liquid cooling heat dissipation structure for the IGBT of the motor controller according to claim 1, wherein The primary ends and / or the terminal ends of the secondary liquid path (1b) and the tertiary liquid path (1c) have inclined liquid sections; the connecting flow channels (1d) are inclinedly arranged.

4. The bionic liquid cooling heat dissipation structure for IGBT of the motor controller according to claim 2, characterized in that, The cover body (5) has a groove part (51) and a fixing edge (52) arranged around the groove part (51), and multiple groups of fixing ears (53) are formed on both sides of the fixing edge (52); screw holes (1g) corresponding to the fixing ears (53) are provided on the liquid cooling seat (1), and the fixing ears (53) are fixed on the liquid cooling seat (1) by screws (6) screwed into the screw holes (1g).

5. The bionic liquid cooling heat dissipation structure for IGBT of the motor controller according to claim 1, characterized in that, The layouts of all the combined liquid paths are the same; for each group of the combined liquid paths, its two included tertiary liquid paths (1c) are respectively located on the front and back sides of the liquid cooling seat (1), and the connecting flow channel (1d) penetrates through the liquid cooling seat (1) to connect the two tertiary liquid paths (1c).

6. The bionic liquid cooling structure for dissipating heat from the IGBT of the motor controller according to claim 1, wherein The liquid cooling channel further includes a peripheral liquid path (1e) along the edge of the liquid cooling seat (1) and not passing through any IGBTs.

7. The bionic liquid-cooling heat dissipation structure for IGBT of a motor controller according to claim 1, characterized in that, The back side of the liquid cooling seat (1) has a hollow groove (1f), so that the wall thicknesses of the bottom and the side walls of each hierarchical liquid path of the liquid cooling channel are equal.

8. The bionic liquid cooling heat dissipation structure for IGBT of the motor controller according to claim 1, characterized in that The IGBT located in the middle row straddles at least three pairs of the combined liquid channels, and two of the three-stage liquid channels (1c) in the middle combined liquid channels are arranged at intervals in a direction perpendicular to the liquid cooling plate (2).

9. The bionic liquid cooling heat dissipation structure for IGBT of the motor controller according to claim 1, characterized in that The IGBT is connected to the liquid cooling plate (2) through a heat-conducting medium.

10. The bionic liquid cooling heat dissipation structure for IGBT of a motor controller according to claim 1, characterized in that, Both the liquid cooling seat (1) and the liquid cooling plate (2) are made of high thermal conductivity materials.

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