Predictive immersion cooling system and method based on real-time power consumption of data centers

Abstract

The present invention relates to the field of immersion cooling technology, specifically a predictive immersion cooling system and method based on the real-time power consumption of a data center. By adding a data acquisition unit to the structure of an existing immersion cooling system, the power consumption data of the data center server and the temperature distribution of multiple regions can be obtained, so as to realize judgment from two dimensions and select the optimal cooling strategy. Compared with fixed cooling logic or manual temperature adjustment, the degree of automation is greater and the temperature adjustment is more accurate. By setting up a cooling system including a reflux heat exchange unit and an evaporative heat exchange unit, the two can greatly improve the cooling efficiency. On the one hand, the reflux heat exchange unit takes away the heat in the coolant and exchanges it with the cooling unit, and returns it to the box again after the cooling is completed. On the other hand, the evaporative heat exchange unit cools the data center server, shortens the heat transfer path, accelerates heat dissipation, and ensures stable operation of the server.

Description

Technical Field

[0001] The present invention relates to the technical field of immersion heat dissipation, and in particular to a predictive immersion heat dissipation system and method based on real-time power consumption of a data center. Background Art

[0002] In today's digital age, especially with the development of AI technology, the scale of data centers has exploded, and server computing power has continued to increase. However, the resulting heat dissipation problem has become increasingly prominent, becoming a key bottleneck restricting data center development.

[0003] Traditional air cooling methods, due to their low heat dissipation efficiency, can no longer meet the heat dissipation requirements of high-density servers. Liquid cooling technology, with its higher efficiency and lower energy consumption, has become the mainstream choice in the market.

[0004] There are two main types of liquid cooling: indirect contact liquid cooling, such as cold plate liquid cooling, and direct contact liquid cooling, such as immersion liquid cooling. Cold plate liquid cooling appeared earlier and has significant advantages in heat transfer efficiency and cost compared to air cooling. However, its disadvantages are also obvious, mainly in the following aspects:

[0005] 1. The installation is complex, requiring hardware modification or even disassembly of the entire system for installation;

[0006] 2. There is a risk of coolant leakage, which will damage electronic components once it leaks. The manufacturing process requirements are high and the yield rate fluctuates greatly.

[0007] Immersion liquid cooling mainly relies on a unique fluid medium coolant, which can directly contact the hardware of the data center server, such as the CPU, GPU and other areas where heat is easily accumulated, and quickly take away the heat to achieve heat dissipation and cooling.

[0008] Common coolants can be pure water, deionized water, fluorinated liquid, synthetic oil or two-phase coolant. These coolants can quickly take away heat for cooling and also avoid circuit short circuits based on their own characteristics.

[0009] Chinese patent publication number CN217957563U discloses a server immersion cooling oil tank, cooling system, and heating system. This system cools the server through a single oil immersion method. This cooling method relies primarily on an oil pump to control the rapid flow of oil to remove heat. The overall heat dissipation efficiency is limited, making it unsuitable for heat dissipation in data center servers used for AI technology research and development. Summary of the Invention

[0010] The purpose of the present invention is to provide a predictive immersion cooling system and method based on real-time power consumption of a data center to address the above-mentioned problems.

[0011] The present invention adopts the following technical solution: a predictive immersion cooling system based on real-time power consumption of a data center, comprising a housing and a data center server. The housing is provided with a cavity filled with coolant, and the data center server is placed in the cavity and immersed in the coolant. The system also includes a reflux heat exchange unit, an evaporative heat exchange unit, a controller, a heat dissipation unit, and a data acquisition unit.

[0012] The reflux heat exchange unit and the evaporative heat exchange unit can both perform heat exchange on the data center server, and the reflux heat exchange unit and the evaporative heat exchange unit are connected to the heat dissipation unit;

[0013] The heat dissipation unit is arranged outside the box;

[0014] The data acquisition unit is capable of collecting power consumption data of the data center server and temperature data of multiple areas of the data center server, and can transmit the power consumption data and temperature data to the controller;

[0015] The controller can control the heat dissipation unit, the reflux heat exchange unit and the evaporative heat exchange unit.

[0016] Optionally, the data acquisition unit includes a power consumption acquisition component and a plurality of temperature sensors;

[0017] The power consumption collection component is connected to the data center server signal and can collect the real-time power consumption of the GPU and / or CPU in the data center server;

[0018] The multiple temperature sensors are distributed in the cavity and can collect temperature data of multiple areas of the data center server.

[0019] Optionally, the reflux heat exchange unit includes multiple groups of submersible pumps and plate heat exchangers;

[0020] The number of the submersible pumps matches the number of the temperature sensors. The submersible pumps are arranged in the cavity and submerged in the coolant, and can pump the coolant in the cavity into the plate heat exchanger.

[0021] The plate heat exchanger is connected to the heat dissipation unit and can return the cooling liquid input by the submersible pump to the cavity.

[0022] Optionally, the multi-region temperature data includes GPU high-temperature zone temperature data, CPU medium-temperature zone temperature data, and storage low-temperature zone temperature data of the data center server;

[0023] The temperature sensors include a first temperature sensor, a second temperature sensor and a third temperature sensor;

[0024] The submersible pumps include a first submersible pump, a second submersible pump and a third submersible pump;

[0025] The first temperature sensor is paired with a first submersible pump. The first temperature sensor is used to collect and store temperature data of the low-temperature zone and transmit the temperature data to the controller. The first submersible pump is used to pump the coolant stored in the low-temperature zone into the plate heat exchanger under the control of the controller.

[0026] The second temperature sensor is paired with a second submersible pump. The second temperature sensor is used to collect temperature data of the CPU medium temperature zone and transmit the temperature data to the controller. The second submersible pump is used to pump coolant in the CPU medium temperature zone into the plate heat exchanger under the control of the controller.

[0027] The third temperature sensor is paired with a third submersible pump. The third temperature sensor is used to collect temperature data of the GPU high-heat zone and transmit the temperature data to the controller. Under the control of the controller, the third submersible pump is used to pump coolant in the GPU high-heat zone into the plate heat exchanger.

[0028] Optionally, the liquid output end of the first submersible pump is connected to the first coolant input branch pipe;

[0029] The liquid output end of the second submersible pump is connected to the second coolant input branch pipe;

[0030] The liquid output end of the third submersible pump is connected to the third coolant input branch pipe;

[0031] The first coolant input branch pipe, the second coolant input branch pipe and the third coolant input branch pipe are all communicated with the coolant input pipe.

[0032] Optionally, the plate heat exchanger is provided with a reflux inlet, a reflux outlet, a cooling inlet and a cooling outlet;

[0033] The coolant input pipe is connected to the reflux inlet on the plate heat exchanger;

[0034] The heat dissipation unit is connected to the cooling inlet of the plate heat exchanger through a cooling input pipe, and the heat dissipation unit is connected to the cooling outlet of the plate heat exchanger through a cooling output pipe;

[0035] The reflux outlet on the plate heat exchanger is connected to a coolant reflux pipe, and the coolant is returned to the bottom of the cavity;

[0036] The plate heat exchanger is provided with a heat exchange tube, a plate heat exchange fin group and a heat exchange connecting pipe;

[0037] The two ends of the heat exchange tube are respectively connected to the coolant input pipe and the coolant return pipe, and the heat exchange tube can pass through the plate heat exchange fin group;

[0038] The plate heat exchanger group is provided with plate heat exchangers arranged in layers;

[0039] The heat exchange connecting pipe is provided between adjacent plate-type heat exchange fins and connects the adjacent plate-type heat exchange fins;

[0040] The refrigeration output pipe is connected to one end of the plate heat exchanger group, and a second one-way valve is provided on the refrigeration output pipe;

[0041] The refrigeration input pipe is connected to the other end of the plate heat exchanger group, and a first one-way valve is provided on the refrigeration input pipe;

[0042] The heat exchange tube has a U-shaped structure.

[0043] Optionally, the evaporative heat exchange unit includes an evaporator;

[0044] The evaporator is arranged in the cavity and is arranged parallel to the data center server. The evaporator is detachably connected to the inner wall of the cavity through a connecting block, and the evaporator is connected to the heat dissipation unit.

[0045] Optionally, a curved coil is provided in the evaporator, and the curved coil is filled with a heat exchange agent;

[0046] The evaporator is connected to the refrigeration output pipe through the heat exchanger output pipe, and the refrigeration output pipe is connected to the heat dissipation unit;

[0047] The evaporator is connected to the refrigeration input pipe through the heat exchanger input pipe, and the refrigeration input pipe is connected to the heat dissipation unit;

[0048] The heat exchanger input pipe is provided with a third one-way valve.

[0049] The present application provides a predictive immersion cooling system based on real-time power consumption of a data center, and also provides a predictive immersion cooling method based on real-time power consumption of a data center, comprising the following steps:

[0050] The controller obtains the power consumption data of the data center server transmitted by the power consumption collection component and the temperature data of the data center server transmitted by the temperature sensor;

[0051] The controller compares the GPU high temperature zone temperature data, the CPU medium temperature zone temperature data and the stored low temperature zone temperature data to adjust the flow rate of the first submersible pump, the second submersible pump and the third submersible pump, the power of the evaporator and the power of the heat dissipation unit;

[0052] The controller predicts the real-time power consumption of the GPU and / or CPU in the next power consumption collection component collection cycle based on the trained model, and pre-adjusts the flow rate of the first submersible pump, the second submersible pump and the third submersible pump, the power of the evaporator and the power of the heat dissipation unit.

[0053] Optionally, the power consumption collection component has a collection period of 10 ms, the temperature sensor has a collection period of 1 s, and the first submersible pump, the second submersible pump, and the third submersible pump have a recording period of 5 s.

[0054] The beneficial effects of the present invention include at least one of the following:

[0055] 1. By adding a data acquisition unit to the existing immersion cooling system structure, it is possible to obtain power consumption data of data center servers and temperature distribution in multiple areas, making judgments from two dimensions and selecting the optimal cooling strategy. Compared with fixed cooling logic or manual temperature adjustment, it has a higher degree of automation and more precise temperature adjustment.

[0056] 2. A heat dissipation system that includes a reflux heat exchange unit and an evaporative heat exchange unit is used. The combination of the two can greatly improve the heat dissipation efficiency.

[0057] 3. On the one hand, the reflux heat exchange unit takes away the heat in the coolant and exchanges it with the heat dissipation unit. After the cooling is completed, it returns to the box again, realizing the cooling of the coolant while dynamically balancing the coolant capacity. On the other hand, the evaporative heat exchange unit cools the data center server, shortens the heat transfer path, speeds up heat dissipation, ensures the stable operation of the server, and can reduce the temperature of the key components of the server by 10℃-15℃.

[0058] 4. The evaporator is matched with the data center server, which can be arranged closely, saving data center space and improving space utilization.

[0059] 5. Use a mode that matches multiple submersible pumps with multiple temperature sensors. The temperature sensors can collect the temperature of the area in detail. The controller can adjust the power of the submersible pump based on the collected results, so that the heat absorption in the coolant tends to be uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Figure 1 The following is a connection diagram of a predictive immersion cooling system based on real-time power consumption of a data center;

[0061] Figure 2 A schematic diagram of a predictive immersion cooling system based on real-time power consumption of a data center;

[0062] Figure 3 It is a schematic diagram of the connection structure of the reflux heat exchange unit and the evaporative heat exchange unit;

[0063] Figure 4 This is a schematic diagram of the connection structure of the evaporative heat exchange unit;

[0064] Figure 5 Schematic diagram of the plate heat exchanger structure.

[0065] In the picture:

[0066] 1 is the box, 2 is the cavity, 3 is the data center server, 4 is the coolant, 5 is the controller, 6 is the heat dissipation unit, 7 is the plate heat exchanger, 8 is the evaporator, 9 is the first submersible pump, 10 is the second submersible pump, 11 is the third submersible pump, 12 is the first temperature sensor, 13 is the second temperature sensor, 14 is the third temperature sensor, 15 is the third one-way valve, 16 is the coolant input pipe, 17 is the coolant return pipe, 18 is the heat exchanger output pipe, 19 is the heat exchanger input pipe, 20 is the refrigeration output pipe, 21 is the refrigeration input pipe, 22 is the first one-way valve, 23 is the second one-way valve, 24 is the first coolant input branch pipe, 25 is the second coolant input branch pipe, 26 is the third coolant input branch pipe, 28 is the heat exchange pipe, 29 is the plate heat exchanger, and 30 is the heat exchange connecting pipe. DETAILED DESCRIPTION

[0067] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0068] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0069] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other.

[0070] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0071] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is typically placed when in use, or are the orientations or positional relationships commonly understood by those skilled in the art. These terms are intended only to facilitate the description of the present invention and to simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present invention. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0072] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0073] like Figure 1 and Figure 2 As shown, a predictive immersion cooling system based on real-time power consumption of a data center includes a housing 1 and a data center server 3. A cavity 2 is provided in the housing 1, and a coolant 4 is injected into the cavity 2. The data center server 3 is placed in the cavity 2 and immersed in the coolant 4. The system also includes a reflux heat exchange unit, an evaporative heat exchange unit, a controller 5, a heat dissipation unit 6, and a data acquisition unit.

[0074] The reflux heat exchange unit and the evaporative heat exchange unit can both perform heat exchange on the data center server 3, and the reflux heat exchange unit and the evaporative heat exchange unit are connected to the heat dissipation unit 6;

[0075] The heat dissipation unit 6 is arranged outside the box 2;

[0076] The data acquisition unit can collect power consumption data of the data center server 3 and temperature data of multiple areas of the data center server 3, and can transmit the power consumption data and temperature data to the controller 5;

[0077] The controller 5 can control the heat dissipation unit 6, the reflux heat exchange unit and the evaporative heat exchange unit.

[0078] The purpose of this design is to acquire the power consumption data and temperature distribution of multiple areas of the data center servers by adding a data acquisition unit based on the structure of the existing immersion cooling system, so as to make judgments from two dimensions and select the optimal cooling strategy. Compared with fixed cooling logic or manual temperature adjustment, the system has a higher degree of automation and more precise temperature adjustment. A cooling system including a reflux heat exchange unit and an evaporative heat exchange unit is used. The combination of the two can greatly improve the cooling efficiency. On the one hand, the reflux heat exchange unit takes away the heat from the coolant and exchanges it with the cooling unit. After the cooling is completed, it returns to the box again, realizing the cooling of the coolant while dynamically balancing the coolant capacity. On the other hand, the evaporative heat exchange unit cools the data center servers, shortens the heat transfer path, accelerates heat dissipation, ensures stable operation of the server, and can reduce the temperature of key server components by 10℃-15℃.

[0079] In this embodiment, Figure 3 and Figure 4 As shown, the data acquisition unit includes a power consumption acquisition component and a plurality of temperature sensors;

[0080] The power consumption collection component is connected to the data center server 3 signal, and can collect the real-time power consumption of the GPU and / or CPU in the data center server 3;

[0081] The plurality of temperature sensors are distributed in the cavity 2 and can collect temperature data of multiple areas of the data center server 3 .

[0082] The reflux heat exchange unit includes multiple groups of submersible pumps and plate heat exchangers 7;

[0083] The number of the submersible pumps matches the number of the temperature sensors. The submersible pumps are arranged in the cavity 2 and submerged in the coolant 4, and can pump the coolant 4 in the cavity 2 to the plate heat exchanger 7.

[0084] The plate heat exchanger 7 is connected to the heat dissipation unit 6 and can return the coolant 4 input by the submersible pump to the cavity 2 .

[0085] The multi-region temperature data includes the GPU high-temperature zone temperature data, the CPU medium-temperature zone temperature data and the storage low-temperature zone temperature data of the data center server 3;

[0086] The temperature sensors include a first temperature sensor 12, a second temperature sensor 13 and a third temperature sensor 14;

[0087] The submersible pumps include a first submersible pump 9, a second submersible pump 10 and a third submersible pump 11;

[0088] The first temperature sensor 12 is matched with the first submersible pump 9. The first temperature sensor 12 is used to collect and store temperature data of the low-temperature zone and transmit the temperature data to the controller 5. The first submersible pump 9 is used to pump the coolant 4 stored in the low-temperature zone into the plate heat exchanger 7 under the control of the controller 5.

[0089] The second temperature sensor 13 is matched with the second submersible pump 10. The second temperature sensor 13 is used to collect temperature data of the CPU medium temperature zone and transmit the temperature data to the controller 5. The second submersible pump 10 is used to pump the coolant 4 in the CPU medium temperature zone into the plate heat exchanger 7 under the control of the controller 5.

[0090] The third temperature sensor 14 is paired with the third submersible pump 11. The third temperature sensor 14 is used to collect temperature data of the GPU high-heat zone and transmit the temperature data to the controller 5. The third submersible pump 11 is used to pump the coolant 4 in the GPU high-heat zone into the plate heat exchanger 7 under the control of the controller 5.

[0091] At the same time, the liquid output end of the first submersible pump 9 is connected to the first coolant input branch pipe 24;

[0092] The liquid output end of the second submersible pump 10 is connected to the second coolant input branch pipe 25;

[0093] The liquid output end of the third submersible pump 11 is connected to the third coolant input branch pipe 26;

[0094] The first coolant input branch pipe 24 , the second coolant input branch pipe 25 and the third coolant input branch pipe 26 are all in communication with the coolant input pipe 16 .

[0095] The purpose of this design is that the submersible pump can be set up according to the structure of the specific data center server. It can usually be a three-layer setting of upper, middle and lower or a three-layer setting of inner, middle and outer. Here, the three-layer setting of upper, middle and lower is conveniently described. Of course, technical personnel in this field can also make their own settings according to actual conditions when implementing the specific solution.

[0096] In this embodiment, it is assumed that the GPU of the data center server 3 is located at the bottom, the CPU is located in the middle, and the storage structure is located at the top. Therefore, from top to bottom, the temperature data of the GPU high temperature zone, the temperature data of the CPU medium temperature zone, and the temperature data of the storage low temperature zone are set respectively. The sets consisting of the submersible pumps and temperature sensors in the three divided areas are represented as T1, T2 and T3 respectively, among which the role of T1 is to serve as a turbulence generator in the high heat flux density area, breaking through the laminar flow limit and suppressing vertical heat accumulation. The role of T2 is to serve as a vertical heat conduction dynamic balancing valve, blocking heat rise and maintaining horizontal heat balance. The role of T3 is to serve as a low heat zone oscillation absorber, suppressing temperature oscillation and achieving precise temperature control. In this way, the power of the three submersible pumps is adjusted under the action of the controller, so that the flow rate of the coolant pumping in different layers changes, so that heat cannot accumulate in the coolant. When the coolant of each layer is pumped into the plate heat exchanger, and then cooled through heat exchange and then flows back from the top to the bottom of the box, the entire coolant forms a large cycle, and heat is continuously extracted from the cavity.

[0097] On this basis, if Figure 5 As shown, this embodiment provides a specific structure of a plate heat exchanger, wherein

[0098] The plate heat exchanger 7 is provided with a reflux inlet, a reflux outlet, a cooling inlet and a cooling outlet;

[0099] The coolant inlet pipe 16 is connected to the reflux inlet of the plate heat exchanger 7;

[0100] The heat dissipation unit 6 is connected to the cooling inlet of the plate heat exchanger 7 via the cooling input pipe 21, and the heat dissipation unit 6 is connected to the cooling outlet of the plate heat exchanger 7 via the cooling output pipe 20;

[0101] The reflux outlet on the plate heat exchanger 7 is connected to a coolant reflux pipe 17, and the coolant 4 is refluxed to the bottom of the cavity 2;

[0102] The plate heat exchanger 7 is provided with a heat exchange tube 28, a plate heat exchange fin group and a heat exchange connecting pipe 30;

[0103] The two ends of the heat exchange tube 28 are connected to the coolant inlet pipe 16 and the coolant return pipe 17 respectively, and the heat exchange tube 28 can pass through the plate heat exchange fin group;

[0104] The plate heat exchanger group is provided with plate heat exchanger fins 29 arranged in layers;

[0105] The heat exchange connecting pipe 30 is provided between adjacent plate-type heat exchange fins 29 and connects the adjacent plate-type heat exchange fins 29;

[0106] The refrigeration output pipe 20 is connected to one end of the plate heat exchanger group, and a second one-way valve 23 is provided on the refrigeration output pipe 20;

[0107] The refrigeration input pipe 21 is connected to the other end of the plate heat exchanger group, and a first one-way valve 22 is provided on the refrigeration input pipe 21;

[0108] The heat exchange tube 28 has a U-shaped structure.

[0109] The purpose of this design is that the entire heat exchange process is a heat conduction process, where heat is transferred from the high-temperature coolant to the low-temperature heat exchanger, and these heat exchangers are introduced into the plate heat exchanger through the heat dissipation unit.

[0110] In the specific heat exchange process, the heat exchanger enters the plate heat exchanger through the refrigeration input pipe, fills the plate heat exchanger group through the heat exchange connecting pipe, and then returns to the heat exchange unit through the refrigeration output pipe. The coolant then enters the heat exchange tube. Since the heat exchange tube passes through the plate heat exchanger, it is also U-shaped, which greatly increases the contact area between the heat exchange tube and the plate heat exchanger, and provides sufficient heat exchange space.

[0111] In this embodiment, in order to avoid backflow in the pipeline during transportation, one-way valves are added to several relatively important pipelines, such as a second one-way valve 23 is provided on the refrigeration output pipe 20, and a first one-way valve 22 is provided on the refrigeration input pipe 21.

[0112] In this embodiment, a specific structure of an evaporative heat exchange unit is provided, wherein the evaporative heat exchange unit includes an evaporator 8;

[0113] The evaporator 8 is arranged in the cavity 2 and is arranged parallel to the data center server 3. The evaporator 8 is detachably connected to the inner wall of the cavity 2 through a connecting block, and the evaporator 8 is connected to the heat dissipation unit 6.

[0114] The evaporator 8 is provided with a curved coil, and the curved coil is filled with a heat exchange agent;

[0115] The evaporator 8 is connected to the refrigeration output pipe 20 through the heat exchanger output pipe 18, and the refrigeration output pipe 20 is connected to the heat dissipation unit 6;

[0116] The evaporator 8 is connected to the refrigeration input pipe 21 through the heat exchanger input pipe 19, and the refrigeration input pipe 21 is connected to the heat dissipation unit 6;

[0117] The heat exchanger input pipe 19 is provided with a third one-way valve 15 .

[0118] The purpose of this design is that the evaporator, with its large contact surface and efficient thermal conductivity, can quickly transfer heat from the coolant near the data center server to the external cooling unit to cool the area. The cooled coolant circulates around the server and continues to absorb heat, thus forming a continuous and stable heat dissipation cycle.

[0119] It should also be pointed out that in the technical solution provided in this embodiment, a refrigeration output pipe and a refrigeration input pipe are used to perform heat exchange on the evaporator and the plate heat exchanger respectively. Therefore, Freon is selected as the heat exchange agent. Considering factors such as environmental protection, those skilled in the art can choose more environmentally friendly materials for corresponding replacement. This embodiment is only used to illustrate the principle and does not limit its materials.

[0120] Furthermore, in actual operation, the heat dissipation unit is similar in function to the outdoor unit of the air conditioner, so this embodiment uses this as the heat dissipation unit. Those skilled in the art may also use other suitable structures.

[0121] In this embodiment, a predictive immersion cooling system based on real-time power consumption of a data center provides a predictive immersion cooling method based on real-time power consumption of the data center, including the following steps:

[0122] The controller 5 obtains the power consumption data of the data center server 3 transmitted by the power consumption collection component and the temperature data of the data center server 3 transmitted by the temperature sensor;

[0123] The controller 5 compares the GPU high temperature zone temperature data, the CPU medium temperature zone temperature data and the stored low temperature zone temperature data to adjust the flow rates of the first submersible pump 9, the second submersible pump 10 and the third submersible pump 11, the power of the evaporator 8 and the power of the heat dissipation unit 6;

[0124] The controller 5 predicts the real-time power consumption of the GPU and / or CPU during the next power consumption collection component collection cycle based on the trained model, and pre-adjusts the flow rate of the first submersible pump 9, the second submersible pump 10 and the third submersible pump 11, the power of the evaporator 8 and the power of the heat dissipation unit 6.

[0125] At the same time, the power consumption collection component has a collection period of 10ms, the temperature sensor has a collection period of 1s, and the first submersible pump 9, the second submersible pump 10 and the third submersible pump 11 have a recording period of 5s.

[0126] In the specific implementation scenario, the method provided in this application makes judgments based on two dimensions: the real-time power consumption of the data center and the temperature distribution of key areas, and selects the optimal cooling strategy. When the cooling prediction is based on the real-time power consumption of the data center, its purpose is to deal with the upcoming GPU and / or CPU temperature increase due to the increase in power consumption. The approach taken is to increase the temperature of the heat dissipation components in the corresponding area in advance so that the overall temperature will not fluctuate greatly.

[0127] For specific predictions, you can use an existing large model or train your own large model for temperature prediction. Taking the LSTM-TCN hybrid model as an example, first build a sample group. Each sample group contains 9,000 power consumption data, of which T1, T2, and T3 have 3,000 data respectively. The sampling period is 10ms and the sampling time is 30s.

[0128] At the same time, the flow data of the first submersible pump, the second submersible pump, and the third submersible pump are added to associate the flow with the power consumption.

[0129] Secondly, set the T1 temperature zone to be triggered when the temperature is greater than 40°C or the temperature rise is predicted to be greater than 2°C based on the power consumption data model;

[0130] - High speed stage: 12L / min (lasting 3 seconds);

[0131] - Low speed stage: 8L / min (lasting 1 second);

[0132] -Basic flow rate adjustment: For every 1°C increase in temperature (25°C → 45°C), the flow rate increases linearly by 0.25L / min (25°C → 5L / min, 45°C → 10L / min).

[0133] Set the T2 temperature zone. Based on the power consumption data model, it is predicted that when the temperature difference between T1 and T2 is ≤ 4°C, the flow rate will be reduced by 20%;

[0134] Based on the power consumption data model, the flow rate decreases linearly by 0.3L / min for every 1°C decrease in the T2-T3 temperature difference;

[0135] Basic flow rate adjustment: For every 1°C increase in temperature (25°C → 45°C), the flow rate increases linearly by 0.2 L / min (25°C → 4 L / min, 45°C → 8 L / min).

[0136] For the T3 temperature zone, when the temperature collected by the temperature sensor is less than 25℃, the submersible pump will be shut down or suspended.

[0137] Basic flow rate adjustment: For every 1°C increase in temperature (25°C → 45°C), the flow rate increases linearly by 0.125 L / min (25°C → 1 L / min, 45°C → 3.5 L / min).

[0138] Based on this scenario, the temperature data controller controls the three submersible pumps and evaporator as follows: when the temperature in area T1 collected by the temperature sensor rises by 2°C or more, the flow rate of the submersible pump in this area is increased by 10% to 15%. At the same time, the power of the evaporator is coordinated to increase. That is, the power of the heat dissipation unit is adjusted to actively regulate the flow rate of the heat exchanger in the evaporator.

[0139] When all three temperature zones are within the set threshold range and the temperature difference between T1 and T2 is greater than 4°C, it indicates that the temperature difference between the two zones is too large. To ensure heat dissipation in zone T1, the flow rate of the submersible pump in zone T2 is proactively reduced. In this scenario, it is reduced by 20% to prevent reverse heat absorption. The evaporator power is locked to avoid interference with temperature control.

[0140] When all three temperature zones are within the set threshold range and the temperature difference between T2 and T3 is greater than 5°C, it indicates that the temperature difference between the two zones is too large. Since zone T2 is between zones T1 and T3, the flow rate of the submersible pump in zone T2 is slowly increased in steps. In this scenario, the flow rate is increased by 0.5 L / min per second until the temperature difference returns to within the range. At the same time, the power of the evaporator is increased.

[0141] In this scenario, the controller controls the three submersible pumps and the evaporator based on power consumption data as follows: When the GPU and / or CPU is detected to be fully loaded, the controller increases the flow rate of the submersible pumps in areas T1 and T2 in advance and increases the power of the evaporator.

[0142] When the large model predicts that the GPU load will increase within 60 seconds, active cooling is performed in two stages:

[0143] Pre-cooling startup phase (0 to 30 seconds):

[0144] Submersible pump basic flow rate in T1 area: 28℃→7L / min (0.25L / min / ℃);

[0145] Thermal backflow prevention for submersible pumps in zone T2: T1-T2 temperature difference = 3.8°C (<4°C threshold), flow rate from 5L / min to 4L / min (reduced by 20%);

[0146] Evaporator: power 1.5kW;

[0147] Load ramp-up phase (30-60 seconds):

[0148] Emergency response in zone T1: Forecast temperature rise > 2°C → submersible pump uses pulse mode (12 L / min × 3 seconds → 8 L / min × 1 second);

[0149] Flow control in T2 zone: T2-T3 temperature difference 7°C → submersible pump flow rate from 4L / min to 6.5L / min (+0.5L per second);

[0150] Evaporator: Power 2.8kW

[0151] Steady-state recovery (after 60 seconds)

[0152] Flow normalization: T1 area submersible pump = 10L / min (45℃), T2 area submersible pump = 5L / min (40℃), T3 area submersible pump = 2L / min (30℃).

[0153] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A predictive immersion cooling system based on real-time power consumption of a data center, comprising a box (1) and a data center server (3), wherein a cavity (2) is provided in the box (1), and a cooling liquid (4) is injected into the cavity (2), and the data center server (3) is placed in the cavity (2) and immersed in the cooling liquid (4), characterized in that: It also includes a reflux heat exchange unit, an evaporative heat exchange unit, a controller (5), a heat dissipation unit (6) and a data acquisition unit; The reflux heat exchange unit and the evaporative heat exchange unit are both capable of heat exchange with the data center server (3), and the reflux heat exchange unit and the evaporative heat exchange unit are connected to the heat dissipation unit (6); The heat dissipation unit (6) is arranged outside the box (1); The data acquisition unit is capable of acquiring power consumption data of the data center server (3) and temperature data of multiple regions of the data center server (3), and is capable of transmitting the power consumption data and temperature data to the controller (5); The controller (5) can control the heat dissipation unit (6), the reflux heat exchange unit and the evaporative heat exchange unit; The data acquisition unit includes a power consumption acquisition component and a plurality of temperature sensors; The power consumption collection component is connected to the data center server (3) by signal, and can collect the real-time power consumption of the GPU and / or CPU in the data center server (3); A plurality of the temperature sensors are distributed in the cavity (2) and can collect temperature data of multiple areas of the data center server (3); The reflux heat exchange unit includes multiple groups of submersible pumps and plate heat exchangers (7); The number of the submersible pumps matches the number of the temperature sensors, the submersible pumps are arranged in the cavity (2) and submerged in the coolant (4), and are capable of pumping the coolant (4) in the cavity (2) into the plate heat exchanger (7); The plate heat exchanger (7) is connected to the heat dissipation unit (6) and can return the cooling liquid (4) input by the submersible pump to the cavity (2); The multi-region temperature data includes GPU high-temperature zone temperature data, CPU medium-temperature zone temperature data and storage low-temperature zone temperature data of the data center server (3); The temperature sensor comprises a first temperature sensor (12), a second temperature sensor (13) and a third temperature sensor (14); The submersible pump comprises a first submersible pump (9), a second submersible pump (10) and a third submersible pump (11); The first temperature sensor (12) is matched with the first submersible pump (9), and the first temperature sensor (12) is used to collect and store temperature data of the low-temperature zone and transmit the temperature data to the controller (5). The first submersible pump (9) is used to pump the coolant (4) stored in the low-temperature zone into the plate heat exchanger (7) under the control of the controller (5); The second temperature sensor (13) is matched with the second submersible pump (10), and the second temperature sensor (13) is used to collect temperature data of the CPU medium temperature zone and transmit the temperature data to the controller (5). The second submersible pump (10) is used to pump the coolant (4) in the CPU medium temperature zone into the plate heat exchanger (7) under the control of the controller (5); The third temperature sensor (14) is matched with the third submersible pump (11). The third temperature sensor (14) is used to collect temperature data of the GPU high-heat zone and transmit the temperature data to the controller (5). The third submersible pump (11) is used to pump the coolant (4) in the GPU high-heat zone into the plate heat exchanger (7) under the control of the controller (5).

2. The predictive immersion cooling system based on real-time power consumption of a data center according to claim 1 is characterized in that: The liquid output end of the first submersible pump (9) is connected to the first coolant input branch pipe (24); The liquid output end of the second submersible pump (10) is connected to the second coolant input branch pipe (25); The liquid output end of the third submersible pump (11) is connected to the third coolant input branch pipe (26); The first coolant input branch pipe (24), the second coolant input branch pipe (25), and the third coolant input branch pipe (26) are all in communication with the coolant input pipe (16).

3. The predictive immersion cooling system based on real-time power consumption of a data center according to claim 2 is characterized in that: The plate heat exchanger (7) is provided with a reflux inlet, a reflux outlet, a cooling inlet and a cooling outlet; The coolant inlet pipe (16) is connected to the reflux inlet on the plate heat exchanger (7); The heat dissipation unit (6) is connected to the cooling inlet of the plate heat exchanger (7) via a cooling input pipe (21), and the heat dissipation unit (6) is connected to the cooling outlet of the plate heat exchanger (7) via a cooling output pipe (20); The reflux outlet on the plate heat exchanger (7) is connected to a coolant reflux pipe (17), and the coolant (4) is refluxed to the bottom of the cavity (2); The plate heat exchanger (7) is provided with a heat exchange tube (28), a plate heat exchange fin group and a heat exchange connecting pipe (30); The two ends of the heat exchange tube (28) are respectively connected to the coolant input tube (16) and the coolant return tube (17), and the heat exchange tube (28) can pass through the plate heat exchange fin group; The plate heat exchanger group is provided with plate heat exchangers (29) arranged in layers; The heat exchange connecting pipe (30) is provided between adjacent plate-type heat exchange fins (29) and connects the adjacent plate-type heat exchange fins (29); The refrigeration output pipe (20) is connected to one end of the plate heat exchanger assembly, and a second one-way valve (23) is provided on the refrigeration output pipe (20); The refrigeration input pipe (21) is connected to the other end of the plate heat exchanger group, and a first one-way valve (22) is provided on the refrigeration input pipe (21); The heat exchange tube (28) has a U-shaped structure.

4. The predictive immersion cooling system based on real-time power consumption of a data center according to claim 1 is characterized in that: The evaporative heat exchange unit comprises an evaporator (8); The evaporator (8) is arranged in the cavity (2) and is arranged parallel to the data center server (3). The evaporator (8) is detachably connected to the inner wall of the cavity (2) via a connecting block, and the evaporator (8) is connected to the heat dissipation unit (6).

5. The predictive immersion cooling system based on real-time power consumption of a data center according to claim 4 is characterized in that: The evaporator (8) is provided with a curved coil, and the curved coil is filled with a heat exchange agent; The evaporator (8) is connected to the refrigeration output pipe (20) via the heat exchanger output pipe (18), and the refrigeration output pipe (20) is connected to the heat dissipation unit (6); The evaporator (8) is connected to the refrigeration input pipe (21) through the heat exchanger input pipe (19), and the refrigeration input pipe (21) is connected to the heat dissipation unit (6); A third one-way valve (15) is provided on the heat exchanger input pipe (19).

6. A predictive immersion cooling method based on real-time power consumption of a data center, implemented based on the predictive immersion cooling system based on real-time power consumption of a data center according to any one of claims 1 to 3, characterized in that: The following steps are involved: The controller (5) acquires the power consumption data of the data center server (3) transmitted by the power consumption acquisition component and the temperature data of the data center server (3) transmitted by the temperature sensor; The controller (5) compares the GPU high-temperature zone temperature data, the CPU medium-temperature zone temperature data and the storage low-temperature zone temperature data to adjust the flow rates of the first submersible pump (9), the second submersible pump (10) and the third submersible pump (11), the power of the evaporator (8) and the power of the heat dissipation unit (6); The controller (5) predicts the real-time power consumption of the GPU and / or CPU within the next power consumption acquisition component acquisition cycle based on the trained model, and pre-adjusts the flow rates of the first submersible pump (9), the second submersible pump (10), and the third submersible pump (11), the power of the evaporator (8), and the power of the heat dissipation unit (6).

7. The predictive immersion cooling method based on real-time power consumption of a data center according to claim 6, characterized in that: The power consumption acquisition component has an acquisition period of 10 ms, the temperature sensor has an acquisition period of 1 s, and the first submersible pump (9), the second submersible pump (10), and the third submersible pump (11) have a recording period of 5 s.

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