Surface cleaning system and surface cleaning method for electronic component

Abstract

The invention provides a surface cleaning system and a surface cleaning method for an electronic component, and relates to the technical field of electronic component processing. The surface cleaning system comprises a transmission unit, a cleaning unit, a dust treatment unit, a detection unit and a control device, the cleaning unit comprises a first laser cleaning device, a turnover mechanism and a second laser cleaning device, and the first laser cleaning device and the second laser cleaning device are used for cleaning the first surface and the second surface of a workpiece respectively; the dust treatment unit is used for sucking dust, and the detection units are arranged on the upstream side and the downstream side of the cleaning unit so as to detect the surface of the workpiece; the control device is suitable for controlling the component to operate or close through a preset program and adjusting the preset program according to the detection result of the detection unit. According to the surface cleaning system and method for the electronic element, laser cleaning and secondary cleaning of the workpiece are achieved by combining the cleaning module, the detection module, the intelligent control module and the like.

Description

Technical Field

[0001] This application relates to the technical field of electronic component processing, and particularly relates to a surface cleaning system and a surface cleaning method for electronic components. Background Art

[0002] Electronic components, such as zinc oxide varistor discs, are the core components in zinc oxide lightning arresters to protect the power system from transient overvoltages such as lightning overvoltages and switching overvoltages.

[0003] During the processing of zinc oxide varistor discs, a cleaning process is included. The conventional cleaning process usually adopts the ultrasonic cleaning method. However, the ultrasonic cleaning method cannot peel off the powder in the pits or gaps on the surface of the zinc oxide varistor discs, and has the disadvantage of insufficient cleaning degree. Summary of the Invention

[0004] In view of the above problems, this application provides a surface cleaning system and a surface cleaning method for electronic components, which combine modules such as cleaning, detection, and intelligent control to realize laser cleaning and secondary cleaning of workpieces, improve the cleaning effect, achieve deep cleaning of varistor discs, reduce the unqualified rate, and ensure the cleaning quality of varistor discs.

[0005] On the one hand, this application provides a surface cleaning system for electronic components, including:

[0006] A transmission unit for transmitting workpieces;

[0007] A cleaning unit is arranged in the vicinity of the transmission unit. The cleaning unit includes a first laser cleaning device, a flipping mechanism, and a second laser cleaning device arranged in sequence along the transmission direction of the workpiece. The first laser cleaning device is adapted to clean the first surface of the workpiece, the flipping mechanism is used to flip the workpiece, and the second laser cleaning device is used to clean the second surface of the workpiece;

[0008] A dust treatment unit has a dust suction chamber. The cleaning unit is located in the dust suction chamber, and the transmission unit passes through the dust suction chamber. The dust treatment unit is used to suck the dust generated during the cleaning process;

[0009] A detection unit is arranged on the upstream side and the downstream side of the cleaning unit to detect the surface of the workpiece;

[0010] A control device is communicatively connected to the transmission unit, the cleaning unit, the dust treatment unit, and the detection unit, and is adapted to control the operation or shutdown of components through a preset program, and adjust the preset program according to the detection results of the detection unit.

[0011] In a possible implementation manner, the detection unit includes:

[0012] The first detection device is arranged on the upstream side and the downstream side of the first laser cleaning device to detect the first surface of the workpiece before and after being cleaned by the first laser cleaning device;

[0013] The second detection device is arranged on the upstream side and the downstream side of the second laser cleaning device to detect the second surface of the workpiece before and after being cleaned by the second laser cleaning device;

[0014] The first detection device and the second detection device are configured to detect the dirt distribution on the surface of the workpiece and transmit the dirt distribution information to the control device.

[0015] In a possible implementation manner, the first detection device is a vision detection device; and / or, the second detection device is a vision detection device.

[0016] In a possible implementation manner, both the first laser cleaning device and the second laser cleaning device include:

[0017] The first incoming material detection device is used to detect whether the workpiece reaches the preset cleaning position;

[0018] The laser generator is used to generate laser;

[0019] The scanning reciprocating device is used to reciprocally scan the surface of the workpiece;

[0020] The control device is configured to be communicatively connected to the first incoming material detection device, the laser generator, and the scanning reciprocating device respectively, so as to control the working states of the laser generator and the scanning reciprocating device according to the detection result of the first incoming material detection device.

[0021] In a possible implementation manner, the control device includes:

[0022] The scanning trajectory planning module is communicatively connected to the detection unit and is used to analyze the dirt distribution of the workpiece according to the detection feedback of the detection unit and generate a cleaning trajectory;

[0023] The secondary cleaning trigger module is communicatively connected to the detection unit, and the secondary cleaning trigger module is configured to trigger a secondary cleaning program when the detection unit detects that the workpiece after primary cleaning on the transmission unit has been cleaned.

[0024] In a possible implementation, the control device is configured to: when the detection unit detects that the cleaning is unqualified, memorize instructions according to the dirt distribution of the workpiece, including adjusting the laser power, pulse frequency, and scanning speed of the cleaning unit, adjusting the suction parameter of the dust treatment unit, and controlling the transmission speed of the transmission unit; after the workpiece to be initially cleaned is cleaned, trigger instructions to the cleaning unit, the dust treatment unit, and the transmission unit.

[0025] In a possible implementation, it further includes a picking unit, and the picking unit includes:

[0026] The first picking device, which is communicatively connected to the first detection device, and the first picking device is used to pick out the workpieces detected as unqualified by the first detection device from the transmission unit;

[0027] The second picking device, which is communicatively connected to the second detection device, and the second picking device is used to pick out the workpieces detected as unqualified by the second detection device from the transmission unit.

[0028] In a possible implementation, the transmission unit includes a conveyor belt,

[0029] Both the first picking device and the second picking device include:

[0030] A receiving platform, which is arranged on one side of the conveyor belt, and the receiving platform is used to receive unqualified workpieces;

[0031] A push rod, which is arranged on the side of the conveyor belt opposite to the receiving platform, and the piston rod of the push rod is telescopic to transfer the unqualified workpiece from the transmission unit to the receiving platform.

[0032] In a possible implementation, the control device further includes:

[0033] A classification labeling module, which is communicatively connected to the detection unit and is used to batch-label unqualified workpieces according to the stain depth or area.

[0034] In a possible implementation, it further includes a sorting hand, and the sorting hand is communicatively connected to the control device and is used to sort the workpieces from the receiving platform to different preset storage areas according to the batches of the labeled workpieces.

[0035] In a possible implementation, the flipping mechanism includes:

[0036] A second incoming material detection device, which is used to detect whether the workpiece reaches the preset flipping position;

[0037] A flipping piece, which is communicatively connected to the detection unit, and the flipping piece is used to grab and flip the workpiece.

[0038] In a possible implementation, the dust treatment unit includes:

[0039] A dust collection hood, which is arranged outside the cleaning unit, and the dust collection hood defines the dust suction cavity;

[0040] A dust suction device, which includes an induced draft fan and a suction pipe. The suction pipe is communicated with the dust collection hood, and the suction pipe extends to the positions corresponding to the first laser cleaning device and the second laser cleaning device of the transmission unit.

[0041] In a possible implementation, the dust suction device further includes:

[0042] A concentration sensor, which is arranged in the dust suction cavity and is communicatively connected to the control device. The concentration sensor is used to detect the concentration of dust;

[0043] A plurality of air induction pipes, which are respectively communicated with the dust collection hood and the suction pipe. The plurality of air induction pipes are sequentially arranged at intervals along the conveying direction of the transmission unit;

[0044] A plurality of adjusting plates, which correspond to the air induction pipes one by one. The adjusting plates are slidably arranged at the air inlets of the air induction pipes and are adapted to adjust the sizes of the air inlets of the air induction pipes;

[0045] A plurality of adjusting driving members, which are communicatively connected to the control device. The driving members are fixedly arranged in the dust collection hood. The adjusting driving members correspond to the adjusting plates one by one, and the adjusting driving members are drivingly connected to the adjusting plates.

[0046] In a possible implementation, at least one dust outlet is provided on the suction pipe. A sealing plate is slidably arranged at the dust outlet. A sealing driving member is further provided on the suction pipe. The sealing driving member is drivingly connected to the sealing plate, and the sealing driving member is communicatively connected to the control device;

[0047] The dust treatment unit further includes a dust collection device, and the dust collection device includes:

[0048] A filtering member, which is arranged in the suction pipe and is arranged at the dust outlet;

[0049] A dust collection member, which is arranged below the dust outlet.

[0050] In a possible implementation, the dust collection device further includes:

[0051] An air hammer, which is connected to the filtering member, and the air hammer is communicatively connected to the control device.

[0052] In a possible implementation, the filtering member includes a first filter screen and a second filter screen. The first filter screen and the second filter screen are arranged at intervals along the air extraction duct. The second filter screen is arranged on the downstream side of the first filter screen.

[0053] The mesh size of the first filter screen is larger than that of the second filter screen.

[0054] There are two dust collection members, and the two dust collection members respectively correspond to the first filter screen and the second filter screen.

[0055] In a possible implementation, it further includes: a feeding unit. The feeding unit is used to feed materials to the transmission unit. The feeding unit includes:

[0056] A feeding trolley, and a material platform for carrying workpieces is arranged on the feeding trolley;

[0057] A loading device, which is used to transfer the workpieces on the material platform to the transmission unit.

[0058] In a possible implementation, it further includes:

[0059] A collection unit, which is arranged on the downstream side of the cleaning unit. The collection unit is used to receive the workpieces that have passed through the cleaning of the cleaning unit and the inspection of the inspection unit from the transmission unit.

[0060] On the other hand, the present application provides a method for surface cleaning of electronic components, which is applied to the surface cleaning system of electronic components in any of the above possible implementations, and includes the following steps:

[0061] Control the dust treatment unit to start;

[0062] Load the workpiece onto the transmission unit, and the transmission unit transports the workpiece to the cleaning unit;

[0063] Control the cleaning unit to perform laser cleaning on the workpiece;

[0064] Control the inspection unit to inspect the surface of the workpiece to determine whether the cleaning is qualified;

[0065] If it is qualified, transfer the inspected qualified workpiece to the collection unit;

[0066] If it is unqualified, pick out the inspected unqualified workpiece;

[0067] After the initial cleaning of the workpiece on the transmission unit is completed, trigger the secondary cleaning program;

[0068] Control the inspection unit to detect again.

[0069] In a possible implementation, controlling the cleaning unit to perform laser cleaning on the workpiece includes:

[0070] Controlling the first laser cleaning device to clean the first surface of the workpiece;

[0071] Controlling the flipping mechanism to flip the workpiece;

[0072] Controlling the second laser cleaning device to clean the second surface of the workpiece.

[0073] In a possible implementation, controlling the detection unit to detect the surface of the workpiece and controlling the detection unit to detect again includes:

[0074] Performing image detection on the first surface of the workpiece after being cleaned by the first laser cleaning device;

[0075] Picking out the workpieces with unqualified first surface detection from the transfer unit;

[0076] Performing image detection on the second surface of the workpiece after being cleaned by the second laser cleaning device;

[0077] Picking out the workpieces with unqualified second surface detection from the transfer unit.

[0078] In a possible implementation, picking out the workpieces with unqualified detection includes:

[0079] Generating a secondary scanning trajectory according to the dirt distribution of the unqualified workpieces.

[0080] In a possible implementation, picking out the workpieces with unqualified detection includes:

[0081] Classifying and labeling the unqualified workpieces according to the stain depth or area, and sorting them into different batches;

[0082] Obtaining corresponding laser parameters and dust suction parameters for different batches of workpieces.

[0083] In a possible implementation, the laser parameters include laser power, pulse frequency, and scanning speed;

[0084] The dust suction parameters include the size of the air inlet of the air duct and the suction force of the air blower.

[0085] In a possible implementation, controlling the detection unit to detect again includes:

[0086] If qualified, transferring the workpieces with qualified detection to the collection unit;

[0087] If unqualified, picking out the workpieces with unqualified detection.

[0088] The surface cleaning system and method for electronic components of the present application achieve laser cleaning of the first surface and the second surface of the resistor chip through the first laser cleaning device and the second laser cleaning device. Laser cleaning controls the beam energy to penetrate and strip the fine powder in the pits and gaps at the end faces of the resistor chip, solving the problem of deep cleaning that is difficult to achieve in conventional ultrasonic cleaning. In addition, laser cleaning does not require direct contact with the workpiece, avoiding physical damage or secondary contamination that may be caused by traditional cleaning methods. Compared with conventional ultrasonic cleaning that requires a large amount of water resources and cleaning agents, laser cleaning does not produce waste water and has low energy consumption, meeting the requirements of green production. In addition, the secondary cleaning of unqualified workpieces can be achieved through the coordinated cooperation of the detection unit and the control device, further improving the cleaning effect and achieving deep cleaning of the resistor chip.

[0089] In addition, the surface cleaning system of the electronic component can adjust the cleaning parameters according to the feedback of the detection unit, perform laser cleaning on the resistor chip, and selectively select unqualified products for secondary cleaning, ensuring the cleaning quality of the resistor chip, trying to ensure that each resistor chip can meet the preset cleaning requirements, and reducing the unqualified rate. By optimizing the cleaning parameters, it is ensured that there is no residual powder on the cleaned end face of the resistor chip, improving the surface cleanliness of the resistor chip, ensuring the qualified rate and current-carrying capacity of the resistor chip, and ensuring the stable and reliable cleaning quality of the resistor chip.

[0090] In addition, by setting up the dust treatment unit, the dust emission during the cleaning process is effectively controlled, the cleanliness of the working environment is ensured, and the work comfort of the operators is improved. In addition, the equipment maintenance frequency is reduced, the downtime is reduced, the overall operation efficiency of the production line is further improved, the production process is optimized, and the continuous cleanliness of the production environment is ensured. Description of the Drawings

[0091] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0092] Figure 1 It is a schematic structural diagram of the surface cleaning system for electronic components according to an embodiment of the present application;

[0093] Figure 2 It is a schematic structural diagram of the surface cleaning system for electronic components according to an embodiment of the present application from another angle;

[0094] Figure 3 It is Figure 2 a schematic structural diagram of the dust treatment unit in

[0095] Figure 4 is Figure 3 a schematic structural diagram of the dust collection device in

[0096] Figure 5 is a flowchart of the surface cleaning method of the electronic component according to the embodiment of the present application.

[0097] Explanation of reference numerals:

[0098] 100 - transmission unit; 110 - conveyor belt;

[0099] 200 - cleaning unit; 210 - laser cleaning module; 211 - first laser cleaning device; 212 - second laser cleaning device; 210a - first incoming material detection device; 210b - laser generator; 220 - flipping mechanism; 221 - second incoming material detection device; 222 - flipping member;

[0100] 300 - dust treatment unit; 310 - suction cavity; 320 - dust collection hood; 330 - suction device; 331 - exhaust duct; 332 - induced draft fan; 333 - concentration sensor; 334 - air duct; 335 - adjusting plate; 336 - adjusting driving member; 340 - dust collection device; 341 - filtering member; 341a - first filter screen; 341b - second filter screen; 342 - dust collection member; 343 - pneumatic hammer;

[0101] 400 - detection unit; 410 - first detection device; 420 - second detection device; 430 - sorting unit; 431 - first sorting device; 432 - second sorting device; 430a - receiving platform; 430b - push rod;

[0102] 500 - feeding unit; 510 - feeding trolley; 511 - first fence; 520 - loading device;

[0103] 600 - collection unit; 610 - collection trolley; 611 - second fence; 620 - unloading device;

[0104] 700 - control device. Detailed implementation manners

[0105] In order to make the above - mentioned objects, features, and advantages of the embodiments of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0106] Electronic component. Taking the zinc oxide varistor disc as an example, the zinc oxide varistor disc is the core component in a zinc oxide lightning arrester, which is used to protect the power system from transient overvoltages such as lightning overvoltage and switching overvoltage.

[0107] The processing process of the zinc oxide varistor disc includes: slurry preparation - granulation - moisture-containing - forming - debinding - firing - side insulation treatment - heat treatment - grinding - cleaning - aluminizing. Among them, for the cleaning process, the main purpose of this process is to remove the powder generated in the previous grinding process, so as to provide a clean and tidy end face for the next aluminizing process.

[0108] The conventional cleaning process usually adopts the ultrasonic cleaning method. It mainly uses the cavitation bubbles generated by the ultrasonic generator in the water tank to impact the end face of the varistor disc, and mechanically peel off the adhered powder left on the end face in the grinding process to achieve the purpose of cleanliness. Specifically, when strong ultrasonic waves propagate in a liquid, due to non-linear effects, acoustic cavitation will occur. When the cavitation bubbles suddenly collapse, the shock waves generated can produce thousands of atmospheric pressures around them, directly and repeatedly impacting the dirt layer. On the one hand, it destroys the adsorption between the dirt and the surface of the cleaned part, and on the other hand, it also causes the destruction of the dirt layer and detaches it from the surface of the cleaned part and disperses them into the cleaning liquid.

[0109] However, the ultrasonic cleaning method has the disadvantage of insufficient cleaning degree. Among them, the powder in the pits and gaps formed on the end face of the varistor disc in the grinding process cannot be completely peeled off. In addition, the powder dispersed in the water will adhere to the end face again. After testing, although the cleaning is carried out in 4 steps, when samples are taken from the final product for microscopic observation and wiping, un-cleaned powder can still be observed.

[0110] In addition, the waste water generated by the ultrasonic cleaning device for varistor discs is relatively large and its environmental protection performance is poor. Specifically, the medium used for ultrasonic cleaning is tap water, and the total volume of its main cleaning tank and overflow circulation secondary tank is about 2m 3 , and the water needs to be changed once every 2 days, with a water consumption of 30T per month. In addition, cleaning agents are required in the front-end rough cleaning and fine cleaning processes, and the waste water generated needs to be treated before it can be discharged, which causes great pressure on water resources and environmental protection.

[0111] Based on this, those skilled in the art have taken certain solutions to improve the cleaning quality. For example, by increasing the power of the ultrasonic generator, the cavitation bubbles with stronger pressure impact the end face of the resistor chip, causing the abrasive powder attached to the end face and the powder in the gaps to detach from the substrate of the resistor chip end face. Another example is to increase the number of cleaning times to minimize the reattachment of the detached powder to the end face as much as possible. Still another example is to add a cleaning agent, mainly composed of a water-based surfactant and some chemical additives, to adsorb and turbidity the abrasive powder, accelerate the suspension speed of the powder, and achieve the purpose of rapid peeling. However, despite taking corresponding measures, the powder in the pits and gaps formed in the resistor chip end face during the grinding process cannot be completely peeled off, and there are still some residues under microscopic observation.

[0112] In view of this, the present application provides a surface cleaning system and a surface cleaning method for electronic components. The laser cleaning of the first surface and the second surface of the resistor chip is realized through the first laser cleaning device and the second laser cleaning device. By controlling the beam energy, the laser cleaning penetrates and peels off the tiny powder in the pits and gaps of the resistor chip end face, solving the problem of deep cleaning that is difficult to achieve in the conventional ultrasonic cleaning technology. In addition, the laser cleaning does not need to directly contact the workpiece, avoiding physical damage or secondary pollution that may be brought by the traditional cleaning method. Compared with the conventional ultrasonic cleaning that requires more water resources and cleaning agents, the laser cleaning does not produce waste water and has lower energy consumption, meeting the requirements of green production. In addition, the secondary cleaning of unqualified workpieces can be realized through the coordinated cooperation of the detection unit and the control device, further improving the cleaning effect and achieving the deep cleaning of the resistor chip.

[0113] In addition, the surface cleaning system of the electronic component can adjust the cleaning parameters according to the feedback of the detection unit, perform laser cleaning on the resistor chip, and selectively select unqualified products for secondary cleaning, ensuring the cleaning quality of the resistor chip, trying to ensure that each resistor chip can meet the preset cleaning requirements, and reducing the unqualified rate. By optimizing the cleaning parameters, it is ensured that there is no residual powder on the cleaned end face of the resistor chip, improving the surface cleanliness of the resistor chip, ensuring the qualified rate and current-carrying capacity of the resistor chip, and ensuring the stable and reliable cleaning quality of the resistor chip.

[0114] In addition, by setting up a dust treatment unit, the dust emission during the cleaning process is effectively controlled, the working environment is ensured to be clean, and the working comfort of the operators is improved. In addition, the equipment maintenance frequency is reduced, the downtime is reduced, the overall operation efficiency of the production line is further improved, the production process is optimized, and the continuous cleanliness of the production environment is ensured.

[0115] The following combines Figures 1 to 5 to describe a surface cleaning system for an electronic component according to an embodiment of the first aspect of the present application.

[0116] The surface cleaning system of the electronic components of this embodiment takes the cleaning of zinc oxide resistors (hereinafter referred to as resistors) as an example, and is mainly used to improve the cleanliness of the resistor cleaning process. Fundamentally speaking, the purpose of improving the cleanliness of the resistor cleaning process is to increase the adhesion between the aluminum electrode and the resistor end surface substrate in the post-aluminum spraying process, reduce the contact resistance between the two, and improve the current distribution uniformity in the electrical testing process, so as to achieve the goal of improving the quality of the resistor (including the qualified rate and current carrying capacity). From the process link, the increase in adhesion depends on the grinding process, and the main performance feature is the roughness of the resistor end surface substrate after grinding, while reducing the contact resistance and improving the current distribution uniformity depend on the cleanliness of the cleaning process.

[0117] Among them, the grinding process grinds the upper and lower end faces (i.e., the first surface and the second surface) of the circular resistor. On the one hand, it is to trim the end faces of the sintered resistor to meet the requirements of parallelism and flatness, so that it is easy to stack during assembly to form a coaxial cylinder; on the other hand, it is to make the roughness of the two end faces reach a suitable range value, so that it is easy to spray aluminum electrodes in the subsequent aluminum spraying process, so that the upper and lower end faces of the resistor can obtain good current carrying capacity. The reason why the roughness must reach a suitable range value is that if the roughness is too large (for example, the mesh number of the diamond grinding disc is 80), the edge of the end face of the cylindrical resistor will be knocked during grinding, forming a jagged shape. These defects will cause flashover on the side when carrying current, resulting in the scrapping of the resistor; if the roughness is too small (for example, the mesh number of the diamond grinding disc is 200), the end face is too smooth, and the ionized aluminum powder is not easy to adhere to the end face matrix during aluminum spraying, and the aluminum electrode will be heated and ablated or cause local breakdown when carrying current.

[0118] In the ultrasonic cleaning process, the powder state attached to the end face after grinding is covered with the uneven "curved surface" of the end face from the microscopic observation. Unclear cleaning mainly means that the powder in the depression is not completely separated from the pit during the cavitation crushing pressure impact. In this way, when spraying aluminum, in addition to the convex surface that will fully adhere to the ionized aluminum powder under the high pressure impact, the powder in the pit position forms a layer between the aluminum powder and the bottom of the pit. This layer not only reduces the effective contact area between the aluminum powder and the "curved surface" of the substrate, causing the adhesion to decrease, but also the existence of the layer increases the contact resistance between the aluminum electrode and the substrate, resulting in uneven current distribution on the end face when carrying current, which can easily cause excessive local current and heat, causing the resistor to break down and fail.

[0119] It can be seen that the roughness of the grinding process and the cleanliness of the ultrasonic cleaning process will have an important impact on the current-carrying capacity of the resistor, which will in turn reduce the product qualification rate and long-term operating reliability.

[0120] refer to Figures 1 - 4, the surface cleaning system of the electronic component in this embodiment includes a transmission unit 100, a cleaning unit 200, a dust treatment unit 300, a detection unit 400, and a control device 700.

[0121] Among them, the transmission unit 100 is used to transmit workpieces. In this embodiment, the workpiece is taken as a zinc oxide resistor chip (hereinafter referred to as a resistor chip for short). Optionally, the transmission unit 100 may include a main frame, a stepper motor, a transmission belt 110, and a transmission roller. The main frame can be made of ordinary aluminum alloy material, or can be replaced with 2-series stainless steel profiles. The stepper motor is of PID control type. The transmission belt 110 is made of polyester belt core material, and materials with durability and mildew resistance characteristics such as nylon belt core material can also be used. The transmission support roller is an ordinary electro-galvanized steel pipe and an ordinary bearing, and can also be replaced with a thin-walled stainless steel pipe.

[0122] In addition, the cleaning unit 200 is arranged in the vicinity of the transmission unit 100. The cleaning unit 200 includes a laser cleaning module 210 and a flipping mechanism 220. Specifically, the cleaning unit 200 includes a first laser cleaning device 211, a flipping mechanism 220, and a second laser cleaning device 212 arranged in sequence along the transmission direction of the workpiece. The first laser cleaning device 211 is adapted to clean the first surface of the workpiece, the flipping mechanism 220 is used to flip the workpiece, and the second laser cleaning device 212 is used to clean the second surface of the workpiece. Optionally, both the first laser cleaning device 211 and the second laser cleaning device 212 can be nanosecond pulsed laser cleaning machines.

[0123] The dust treatment unit 300 has a dust suction cavity 310. The cleaning unit 200 is located inside the dust suction cavity 310, and the transmission unit 100 passes through the dust suction cavity 310. The dust treatment unit 300 is used to suck the dust generated during the cleaning process. Optionally, the dust treatment unit 300 can be turned on before the cleaning unit 200 operates, and turned off after the workpiece on the transmission unit 100 is transmitted, so as to purify the air in the dust suction cavity 310 in advance, avoid the diffusion of dust in the environment, and reduce the potential pollution of dust.

[0124] In this way, the present application can achieve laser cleaning of the first surface and the second surface of the resistor chip through the first laser cleaning device 211 and the second laser cleaning device 212. Specifically, the laser beam generated by the laser generator 210b is focused on the end face of the resistor chip for scanning, and the adhered powder on the end face is separated from the substrate end face through the thermal effect. Subsequently, through the dust treatment unit 300, the powder is taken away by means of negative pressure air extraction to achieve the purpose of cleaning the surface.

[0125] The detection unit 400 is arranged on the upstream side and the downstream side of the cleaning unit 200 to detect the surfaces of the workpieces before and after being cleaned by the cleaning unit 200. Optionally, the detection means may include visual detection, laser scanning, infrared thermal imaging, etc. to detect the cleanliness, flatness, defects, etc. of the workpiece surface.

[0126] It can be understood that the detection unit 400 arranged on the upstream side of the cleaning unit 200 can be used to observe the stain distribution on the workpiece surface and match the instructions of the control device 700, and is suitable for adjusting the parameters of each component during secondary cleaning; while the detection unit 400 arranged on the downstream side of the cleaning unit 200 can be used to scan the stain distribution of the workpiece after cleaning and transmit it to the control device 700.

[0127] The control device 700 is communicatively connected to the transmission unit 100, the cleaning unit 200, the dust treatment unit 300 and the detection unit 400, and is suitable for controlling the operation or shutdown of the components through a preset program, and adjusting the preset program according to the detection results of the detection unit 400.

[0128] In addition, the control device is further configured to generate corresponding secondary cleaning parameter instructions according to the dirt distribution data provided by the detection unit 400, and when the detection unit 400 detects the data again on the transmission unit 100, transmit the instructions to the cleaning unit 200, the dust treatment unit 300 and the transmission unit 100.

[0129] In this way, the present application can judge whether the workpiece is cleaned qualified through the detection results of the detection unit 400. If not, the dirt distribution data of the detection results will be transmitted to the control device 700. Subsequently, the control device 700 will obtain the secondary cleaning trajectory according to the dirt distribution data, and obtain the corresponding secondary cleaning parameters for the secondary cleaning, such as the laser power, pulse frequency, scanning speed of the cleaning unit, the suction parameter of the dust treatment unit, and the transmission speed of the control transmission unit, etc., and then prepare the secondary cleaning process for the unqualified workpieces.

[0130] It can be seen that for the surface cleaning system of the electronic components in the present application, laser cleaning controls the beam energy, penetrates and peels off the fine powder in the pits and gaps on the end face of the resistor chip, solving the problem of deep cleaning that is difficult to achieve in the conventional ultrasonic cleaning. In addition, laser cleaning does not need to directly contact the workpiece, avoiding physical damage or secondary pollution that may be brought by the traditional cleaning method. Compared with the conventional ultrasonic cleaning that requires more water resources and cleaning agents, laser cleaning does not produce waste water and has lower energy consumption, meeting the requirements of green production. In addition, the secondary cleaning of unqualified workpieces can be realized through the coordinated cooperation of the detection unit 400 and the control device 700, further improving the cleaning effect and realizing the deep cleaning of the resistor chip.

[0131] In addition, the surface cleaning system of the electronic component can adjust the cleaning parameters according to the feedback of the detection unit 400, perform laser cleaning on the resistor chips, and selectively select unqualified products for secondary cleaning, ensuring the cleaning quality of the resistor chips, and trying to ensure that each resistor chip can meet the preset cleaning requirements, reducing the unqualified rate. By optimizing the cleaning parameters, it is ensured that there is no residual powder on the cleaned end face of the resistor chip, improving the surface cleanliness of the resistor chip, ensuring the qualified rate and current-carrying capacity of the resistor chip, and ensuring the stable and reliable cleaning quality of the resistor chip.

[0132] In addition, by setting up the dust treatment unit 300, the dust emission during the cleaning process is effectively controlled, the cleanliness of the working environment is ensured, and the working comfort of the operators is improved. In addition, the equipment maintenance frequency is reduced, the downtime is reduced, the overall operation efficiency of the production line is further improved, the production process is optimized, and the continuous cleanliness of the production environment is ensured.

[0133] Optionally, the dust treatment unit 300 can also be designed with a concentration detection module to automatically adjust the suction according to the dust concentration to ensure efficient dust collection. Optionally, the dust treatment unit 300 can also be designed with an intercepted dust module and a collected dust module to realize the regular cleaning after dust interception, maintain the high-efficiency filtering performance, further improve the dust treatment efficiency, and ensure the long-term stable operation of the system.

[0134] In some embodiments, an interlock control device or a logic control system can be provided between the dust treatment unit 300 and the cleaning unit 200 to enable the main switch of the cleaning unit 200 to be opened only when the dust treatment unit 300 is turned on and operating normally.

[0135] In one embodiment, combined with Figure 1 and Figure 2 , both the first laser cleaning device 211 and the second laser cleaning device 212 include a first incoming material detection device 210a, a laser generator 210b, and a scanning reciprocating device. Among them, the first incoming material detection device 210a is used to detect whether the workpiece reaches the preset cleaning position. Optionally, the first incoming material detection device 210a can be provided with sensors such as photoelectric sensors and proximity sensors. When the workpiece reaches the preset position, the sensor will send out a signal to trigger subsequent operations.

[0136] The laser generator 210b is the core component of the laser cleaning device and is used to generate laser. The laser has characteristics such as high energy density, controllable direction, and strong focusing ability, and can destroy the bonding force between the pollutants and the substrate, making the pollutants gasify or fall off, so as to achieve the purpose of cleaning. Exemplarily, the laser generator 210b can be a pulse generator, a continuous laser generator 210b, etc.

[0137] The scanning reciprocating device is used to reciprocally scan the surface of the workpiece to ensure the uniformity of the laser; the control device 700 is configured to be communicatively connected to the first incoming material detection device 210a, the laser generator 210b, and the scanning reciprocating device respectively, so as to control the working states of the laser generator 210b and the scanning reciprocating device according to the detection results of the first incoming material detection device 210a.

[0138] Optionally, the control device 700 may include a touch control screen, a software system, a composite material housing, an aluminum alloy bracket, etc.

[0139] Specifically, the control device 700 determines whether the workpiece reaches the preset position by receiving signals from the first incoming material detection device 210a. According to the judgment result, it controls the turning on and off of the laser generator 210b, including parameters such as the output power and pulse frequency of the laser. It controls the movement trajectory, speed, direction, etc. of the scanning reciprocating device to ensure that the laser can clean the workpiece along the preset path to complete the laser cleaning operation.

[0140] Optionally, the control device 700 may also be communicatively connected to the transmission unit 100, the cleaning device, the dust treatment unit 300, the feeding unit 500, the collection unit 600, etc., so as to control the operation units in the surface cleaning system according to the program input by the operator to realize automatic cleaning.

[0141] Optionally, the control device 700 may also have a fault alarm and safety protection function to timely send out an alarm signal and take corresponding protection measures when the equipment fails or an abnormal situation occurs.

[0142] The principle of laser cleaning is elaborated in detail below. The main processes can be summarized into three categories, including the vaporization process, the impact process, and the oscillation process. Specifically, when the laser beam of an ultra-short pulse width (ns) and ultra-high peak power (107–1010 W / cm2) laser reaches the substrate surface, the surface temperature will rise sharply, and the surrounding air will be ionized to form a plasma. The plasma will block the laser from reaching the material surface. The plasma will continue to absorb the laser energy, and the temperature will continue to rise, forming a local state of ultra-high temperature and ultra-high pressure, generating an instantaneous impact of 1-100 kbar on the material surface and gradually transmitting it into the material interior. Under the action of the shock wave, the surface contaminants will break into tiny dust, particles, or fragments. When the laser beam moves away from the irradiation position, the plasma will disappear immediately, creating a negative pressure locally, and the particulate matter or fragments of the contaminants will be removed from the surface. In addition to impacting the contaminants, the unevenness of the substrate will also be impacted by the laser beam and break. From a macroscopic working mode perspective, the laser beam performs dot matrix scanning in the left-right direction of the plane, and the movement in the front-back direction can control the dot matrix scanning pitch, which appears as wavy stripes on the appearance, and the roughness increases compared to before cleaning. The fragments broken by the shock wave (including abrasive powder and the substrate) are carried away under the action of negative pressure exhaust to achieve the purpose of cleaning.

[0143] In addition, when comparing the plasma shock wave generated by laser cleaning with the impact force of cavitation bubbles in ultrasonic cleaning, the former can reach up to 100 times that of the latter, which is also the main reason for the different cleaning degrees of the two cleaning methods. Moreover, the former can change the roughness of the substrate at the end face of the resistor chip, while the latter cannot, which also affects the grinding process and the aluminum spraying process, and thus affects the product quality.

[0144] Analyzed from the principle, the advantages of laser cleaning for ceramic-based resistor chips are as follows: on the one hand, the extended area of the end face is enlarged by increasing the roughness. When the aluminum electrode is sprayed and covered under the same conditions, the electrode area increases accordingly; on the other hand, the cleaning degree increases, the concave pit interlayers are eliminated, the bonding force increases significantly, and the contact resistance further decreases. The effects brought about by these two changes are that the adhesion after aluminum spraying increases, the heat generation at the end face during current-carrying decreases, thereby reducing the electrode ablation and local breakdown caused by uneven current-carrying, and improving the product qualification rate.

[0145] Although the above analyzes many differences between the present application and the original ultrasonic cleaning process from the principle, there are still many problems to be solved in the application practice. The following will discuss in detail the design of the automation device and the determination of the optimal process parameters for laser cleaning of resistor chips in the form of embodiments, as shown in the following Embodiment 1 to Embodiment 10. Optionally, a nanosecond pulse laser cleaning machine can be selected as the cleaning basis in the following Embodiment 1-10.

[0146] The mutual relationships among the power, frequency, and pulse width of the laser generator 210b and the scanning method were compared through experimental verification in the embodiments to determine the optimal process parameters suitable for laser cleaning of resistor chips.

[0147] Example 1

[0148] Step 1: Preparation of resistor chips in the wafer grinding process before cleaning

[0149] ① Extract 200 resistor chips of the D42 specification from the same batch and grind them with a diamond grinding wheel of 170 mesh to a height of 24 mm. ② Extract 100 chips for ultrasonic cleaning with the same process parameters as in the existing mass production. After cleaning, extract 5 chips to test the surface finish (roughness) and record the average value. See Table 1 - Surface roughness of resistor chips with different cleaning methods (hereinafter simply referred to as Table 1). ③ Clean the surfaces of the remaining 100 chips with water and let them dry naturally for later use.

[0150] Step 2: Laser cleaning

[0151] ① Preparation work and startup of the cleaning device.

[0152] Start the laser cleaning module 210, place the 100 resistor chips that have not been ultrasonically cleaned on the material stage. After self-checking is completed, the system enters the standby state.

[0153] ② Parameter setting.

[0154] Set the power of the laser generator 210b in the control program to 150 W, the frequency to 550 kHz, the pulse width to 60 ns, the scanning method to single-row single-pass (linear), and the scanning speed to 6500 mm / s. Then perform simulated focusing, and after completion, start the automatic operation button.

[0155] ③ Laser cleaning and blanking.

[0156] In the automatic operation mode, perform material stage grasping - conveyor belt transmission - infrared alignment unit detection - laser scanning - image detection - flipping - infrared alignment unit detection - laser scanning - image detection - blanking disposal on the resistor chips to complete the entire cleaning process. After cleaning, extract 5 chips to test the end face finish (roughness) of the resistor chips and record the average value. See Table 1.

[0157] Step 3: Aluminum spraying and adhesion and electrical performance testing

[0158] ① Aluminum spraying operation is carried out on the end face of the resistor chip cleaned by ultrasonic wave. The parameter settings are the same as the requirements of conventional production. After spraying, 3 pieces are extracted for adhesion test, and the test values are shown in Table 2 - Adhesion and Electrical Performance Results of Resistor Chips with Different Cleaning Methods (hereinafter referred to as Table 2 for short). Subsequently, 97 remaining pieces are subjected to a 2ms square wave 400A current impulse screening test. After the screening is completed, 3 pieces are extracted for a 65kA high current impulse test under a 4 / 10 waveform, and the results are recorded in Table 2.

[0159] ② Aluminum spraying operation is carried out on the end face of the resistor chip cleaned by laser. The parameter settings are the same as the requirements of conventional production. After spraying, 3 pieces are extracted for adhesion test, and the test values are shown in Table 2. Subsequently, 97 remaining pieces are subjected to a 2ms square wave 400A current impulse screening test. After the screening is completed, 3 pieces are extracted for a 65kA high current impulse test under a 4 / 10 waveform, and the results are recorded in Table 2.

[0160] Since there is no parameter adjustment change in ultrasonic cleaning, in the following Examples 2 - 10, the production of ultrasonic cleaning sample pieces will no longer be carried out. Example 1 is used as a comparison reference, and the number of samples is 100 pieces each.

[0161] Example 2:

[0162] Except for the following changes, the rest is the same as Example 1. The change point is that the scanning mode of the laser generator 210b is single row double times (cross-shaped).

[0163] Example 3:

[0164] Except for the following changes, the rest is the same as Example 1. The change point is that the power of the laser generator 210b is 200W, the frequency is 550kHz, the pulse width is 60ns, the scanning mode is single row single time, and the scanning speed is 6500mm / s.

[0165] Example 4:

[0166] Except for the following changes, the rest is the same as Example 1. The change point is that the power of the laser generator 210b is 100W, the frequency is 550kHz, the pulse width is 60ns, the scanning mode is single row single time (linear), and the scanning speed is 6500mm / s.

[0167] Example 5:

[0168] Except for the following changes, the rest is the same as Example 1. The change point is that the power of the laser generator 210b is 100W, the frequency is 700kHz, the pulse width is 60ns, the scanning mode is single row single time, and the scanning speed is 6500mm / s.

[0169] Example 6:

[0170] Except for the following changes, the rest is the same as in Example 1. The changes are as follows: the power of the laser generator 210b is 100W, the frequency is 500kHz, the pulse width is 60ns, the scanning mode is single row and single pass, and the scanning speed is 6500mm / s.

[0171] Example 7:

[0172] Except for the following changes, the rest is the same as in Example 1. The changes are as follows: the power of the laser generator 210b is 100W, the frequency is 550kHz, the pulse width is 70ns, the scanning mode is single row and single pass, and the scanning speed is 6500mm / s.

[0173] Example 8:

[0174] Except for the following changes, the rest is the same as in Example 1. The changes are as follows: the power of the laser generator 210b is 100W, the frequency is 550kHz, the pulse width is 50ns, the scanning mode is single row and single pass, and the scanning speed is 6500mm / s.

[0175] Example 9:

[0176] Except for the following changes, the rest is the same as in Example 1. The changes are as follows: the power of the laser generator 210b is 100W, the frequency is 550kHz, the pulse width is 60ns, the scanning mode is single row and single pass, and the scanning speed is 5500mm / s.

[0177] Example 10:

[0178] Except for the following changes, the rest is the same as in Example 1. The changes are as follows: the power of the laser generator 210b is 100W, the frequency is 550kHz, the pulse width is 70ns, the scanning mode is single row and single pass, and the scanning speed is 7000mm / s.

[0179] Table 1 - Surface roughness of the resistor chip with different cleaning methods

[0180]

[0181] Table 2 - Adhesion and electrical performance results of the resistor chip with different cleaning methods

[0182]

[0183] As can be observed from Table 1, compared with ultrasonic cleaning, the roughness of the end face of the resistor chip has increased significantly. From the adhesion force between the two in Table 2, it can be clearly seen that the adhesion force of the former is about twice that of the latter. From the perspective of electrical performance, it does not completely follow that the greater the roughness, the greater the adhesion force. This is illustrated by Example 2. From the observation of the adhesion force samples, not all the aluminum layers on the bonding and pulling surface of Example 2 were separated, and there was still a part remaining on the surface of the resistor chip. At the peripheral edge of the sample, excessive roughness has formed micro notches visible to the naked eye, which has caused damage to the side insulation and is likely to cause side flashover or edge chipping, resulting in product scrapping.

[0184] The square wave screening pass rate and high current impact results in Table 2 show that too small or too large roughness cannot improve the electrical performance of the resistor chip (such as in Examples 2 and 3). At the same time, the selection of the scanning method is also crucial. Choosing the one - character type is significantly better than the well - character type. Determine the preferred process parameters of laser cleaning from the process parameters of Examples 4, 9, and 10 with better performance results.

[0185] It can be seen that Examples 1 to 10 adjusted the parameters suitable for cleaning after resistor chip grinding, optimized the parameter range, and designed an automatic cleaning system, improving the cleaning cleanliness, increasing the adhesion of sprayed aluminum, and thus contributing 2 to 3 percentage points to the product pass rate. By studying the mutual relationship among the power, frequency, and pulse width of the laser generator 210b and the scanning method, a comparative study of examples was carried out through experimental verification, verifying the single - piece single - time, single - piece double - time, side - by - side single - time, and side - by - side multiple - time schemes applicable to resistor chip cleaning, determining the preferred process parameters suitable for resistor chip laser cleaning, achieving the purpose of clean, efficient, and good - adhesion cleaning of products, and being environmentally friendly and energy - saving.

[0186] In addition, in Examples 1 to 10, the first laser cleaning device 211 and the second laser cleaning device 212 are selected as nanosecond pulse laser cleaning machines, which have the advantages of high efficiency, small floor area, low energy consumption, no generation of waste water, and no use of cleaning agents compared with traditional ultrasonic cleaning.

[0187] In one embodiment, in combination with Figure 1 and Figure 2 , two first detection devices 410 and two second detection devices 420 are respectively provided. The two first detection devices 410 are respectively arranged on the upstream side and the downstream side of the first laser cleaning device 211 to detect the first surface of the workpiece before and after being cleaned by the first laser cleaning device 211, so as to observe the dirt distribution on the first surface of the workpiece and distinguish whether the cleaning quality of the first surface meets the requirements.

[0188] Two second detection devices 420 are respectively arranged on the upstream side and the downstream side of the second laser cleaning device 212 to detect the second surface of the workpiece before and after being cleaned by the second laser cleaning device 212, so as to observe the dirt distribution on the second surface of the workpiece and identify whether the cleaning quality of the second surface meets the requirements.

[0189] Optionally, the first detection device 410 and the second detection device 420 can adopt technologies such as optical detection and image recognition to monitor the cleanliness, residues, etc. on the surface of the workpiece.

[0190] The first detection device 410 and the second detection device 420 can be configured to detect the dirt distribution on the surface of the workpiece and transmit the dirt distribution information to the control device 700. Further, the cleaning unit 200 can, under the control of the control device 700, after the normal first cleaning is completed, cooperate with other components to perform a second cleaning on the unqualified workpieces.

[0191] In one embodiment, combined Figure 1 and Figure 2 , the first detection device 410 is a visual detection device; and / or, the second detection device 420 is a visual detection device.

[0192] Specifically, the visual detection device uses a camera and an image processing algorithm to be able to accurately detect the minute defects, residues, and cleanliness on the surface of the workpiece. In addition, the visual detection device does not need to directly contact the surface of the workpiece, avoiding problems such as scratches, contamination, or damage caused by contact.

[0193] In some embodiments, the control device 700 includes a scanning trajectory planning module and a secondary cleaning trigger module. Among them, the scanning trajectory planning module is communicatively connected to the detection unit 400 and is used to analyze the dirt distribution of the workpiece according to the detection feedback of the detection unit 400 and generate a cleaning trajectory.

[0194] Specifically, according to the detection feedback provided by the detection unit 400, the scanning trajectory planning module will deeply analyze the dirt distribution on the surface of the workpiece, and this distribution situation can include information such as the type, density, and distribution area of the dirt.

[0195] Based on these analysis results, the scanning trajectory planning module can intelligently generate a cleaning trajectory, and this trajectory can ensure that the cleaning unit can comprehensively cover the dirt area on the workpiece, so as to achieve the best cleaning effect.

[0196] The secondary cleaning trigger module is communicatively connected to the detection unit 400, and the secondary cleaning trigger module is configured to trigger the secondary cleaning program when the detection unit 400 detects that the workpiece on the transmission unit 100 has completed the initial cleaning.

[0197] It can be understood that once the trigger condition is satisfied, the secondary cleaning trigger module will initiate the secondary cleaning process. This secondary cleaning process may include adjusting the cleaning parameters, re-planning the cleaning trajectory, picking up the unqualified workpieces temporarily stored onto the transfer unit 100, etc., to achieve the secondary cleaning of the workpieces. In this way, the unqualified workpieces can reach the expected cleanliness through secondary cleaning.

[0198] It can be seen that the scanning trajectory planning module and the secondary cleaning trigger module improve the intelligence and automation of the cleaning process. The scanning trajectory planning module ensures the pertinence and efficiency of the cleaning, while the secondary cleaning trigger module provides additional guarantee and improves the cleaning standard for unqualified workpieces.

[0199] In some embodiments, the control device 700 is configured to: when the detection unit 400 detects unqualified cleaning, memorize instructions according to the dirt distribution of the workpiece, including adjusting the laser power, pulse frequency, and scanning speed of the cleaning unit 200, adjusting the suction parameters of the dust treatment unit 300, and controlling the transfer speed of the transfer unit 100, etc.

[0200] After the cleaning of the workpiece to be initially cleaned is completed, trigger instructions to the cleaning unit 200, the dust treatment unit 300, and the transfer unit 100.

[0201] Optionally, after the cleaning of the workpiece to be initially cleaned is completed, when the detection unit 400 detects the target workpiece again, the control device 700 triggers instructions to the cleaning unit 200, the dust treatment unit 300, and the transfer unit 100 according to the memorized instructions.

[0202] In this way, by memorizing instructions according to the dirt distribution of the workpiece and triggering these instructions after the initial cleaning is completed, the control device 700 can achieve the control and optimization of the entire cleaning operation process. This design improves the cleaning efficiency and quality, reduces the rework rate and cost that may be caused by improper operation, etc., and improves the product quality of the secondary cleaning.

[0203] In one embodiment, in combination with Figure 1 and Figure 2 , the surface cleaning system of the electronic component further includes a picking unit 430. The picking unit 430 includes a first picking device 431 and a second picking device 432. Among them, the first picking device 431 is communicatively connected to the first detection device 410, and the first picking device 431 is used to pick out the workpieces detected as unqualified by the first detection device 410 from the transfer unit 100; the second picking device 432 is communicatively connected to the second detection device 420, and the second picking device 432 is used to pick out the workpieces detected as unqualified by the second detection device 420 from the transfer unit 100.

[0204] Specifically, when the first detection device 410 detects that there are problems such as incomplete cleaning, excessive residues, or other quality issues on the first surface of the workpiece, it will send a signal to the first picking device 431. After receiving the signal, the first picking device 431 will start and perform a picking action to remove the unqualified workpiece from the transfer unit 100. Correspondingly, when the workpiece is cleaned by the second laser cleaning device 212 and the second detection device 420 performs a quality inspection on its second surface, if quality problems are found, the second picking device 432 will be responsible for picking out the unqualified workpiece from the transfer unit 100.

[0205] Exemplarily, the first picking device 431 and the second picking device 432 can be implemented using a robotic arm, a pneumatic gripper, or other automated picking mechanisms.

[0206] By setting the first picking device 431 and the second picking device 432, the unqualified workpieces are picked out from the transfer unit 100 according to the signals of the first detection device 410 or the second detection device 420, ensuring that only qualified workpieces can enter the next process, which improves the automation level of the surface cleaning system and the product quality control ability.

[0207] In one embodiment, in combination with Figure 1 and Figure 2 , the transfer unit 100 includes a conveyor belt 110, and both the first picking device 431 and the second picking device 432 include a receiving platform 430a and a push rod 430b.

[0208] Among them, the receiving platform 430a is arranged on one side of the conveyor belt 110, and the receiving platform 430a is used to receive unqualified workpieces. Optionally, the receiving platform 430a can be designed in a movable or liftable form to facilitate removing unqualified workpieces from the system or for subsequent processing. Optionally, the receiving platform 430a can also be equipped with devices such as sensors or indicator lights to record the position and quantity of unqualified workpieces.

[0209] The push rod 430b is arranged on the side of the conveyor belt 110 opposite to the receiving platform 430a. The piston rod of the push rod 430b is telescopic to transfer the unqualified workpiece from the transfer unit 100 to the receiving platform 430a. Optionally, the push rod 430b can adopt driving methods such as pneumatic, hydraulic, or electric. When the detection device detects an unqualified workpiece, the control device 700 will send a signal to the push rod 430b to extend its piston rod and push the unqualified workpiece onto the receiving platform 430a.

[0210] Through the settings of the receiving platform 430a and the push rod 430b, automation and flexibility are achieved, and the operating efficiency of the cleaning system and the product quality control ability are also improved.

[0211] In some embodiments, the control device 700 further includes a classification labeling module, which is communicatively connected to the detection unit 400 and is used to batch-label unqualified workpieces according to the stain depth or area.

[0212] In this way, the classification labeling module classifies unqualified workpieces according to indicators such as the depth or area of the stains, so as to group workpieces with similar stain characteristics into one category. For each category of unqualified workpieces, the module generates a preset label or code for subsequent processing and identification.

[0213] In some embodiments, the surface cleaning system of the electronic component further includes a sorting hand, which is communicatively connected to the control device 700 and is used to sort workpieces from the receiving platform 430a to different preset storage areas according to the batches of the labeled workpieces.

[0214] Specifically, the sorting hand can sort workpieces from the receiving platform 430a to the preset storage area according to the instructions of the control device 700. There can be multiple storage areas, and the multiple storage areas can be divided according to factors such as the stain type and cleaning requirements of the workpieces.

[0215] By designing the sorting hand, the control device 700 can achieve the sorting and storage management of unqualified workpieces, improve production efficiency and quality, and also reduce manual intervention and error rate.

[0216] Optionally, when triggering the secondary cleaning program, the sorting hand can also pick unqualified workpieces to the transmission unit 100.

[0217] In one embodiment, in combination with Figure 1 and Figure 2 , the flipping mechanism 220 includes a second incoming material detection device 221 and a flipping member 222. Among them, the second incoming material detection device 221 is used to detect whether the workpiece reaches the preset flipping position. Exemplarily, the second incoming material detection device 221 can be implemented by means such as a photoelectric sensor, a proximity sensor, or image recognition technology.

[0218] The flipping member 222 is communicatively connected to the detection unit 400, and the flipping member 222 is used to grasp and flip the workpiece. Exemplarily, the flipping member 222 can be implemented by a robotic arm, a pneumatic gripper, an electromagnet, etc. to achieve automatic grasping or suction. For example, the flipping member 222 can be a four-axis robotic arm. When the second incoming material detection device 221 detects that the workpiece reaches the preset position, the control device 700 sends a signal to the flipping member 222 to instruct it to perform the grasping and flipping actions.

[0219] Specifically, the workpiece is conveyed to the entrance of the flipping mechanism 220 through the conveying unit 100. The second incoming material detection device 221 monitors the position of the workpiece in real time. When the workpiece reaches the preset flipping position, it sends a signal to the control device 700. After receiving the signal, the control device 700 instructs the flipping member 222 to perform a grasping action to hold the workpiece, and then the flipping member 222 flips according to the preset angle and direction. After the flipping is completed, the workpiece continues to be conveyed along with the conveyor belt 110.

[0220] In one embodiment, in combination with Figure 2 and Figure 3 , the dust treatment unit 300 includes a dust collection hood 320 and a dust suction device 330. Among them, the dust collection hood 320 is disposed outside the cleaning unit 200, and the dust collection hood 320 defines a dust suction chamber 310; the dust suction device 330 includes a draft fan 332 and a suction pipe 331, and the suction pipe 331 communicates with the dust collection hood 320, and the suction pipe 331 extends to the positions of the conveying unit 100 corresponding to the first laser cleaning device 211 and the second laser cleaning device 212.

[0221] The draft fan 332 is the core component of the dust treatment unit 300, which is responsible for sucking the dust and particulate matter sucked into the dust collection hood 320 through the suction pipe 331 and performing subsequent treatment or discharge.

[0222] By extending the suction pipe 331 of the dust suction device 330 to the positions of the conveying unit 100 corresponding to the first laser cleaning device 211 and the second laser cleaning device 212, it is ensured that the dust and particulate matter generated during the cleaning process can be quickly sucked into the dust suction device 330, reducing the possibility of their accumulation on the conveying unit 100 or spreading to the working environment, and reducing the health risks of workers and the degree of pollution of the working environment.

[0223] In some embodiments, in combination with Figure 2 and Figure 3 , the dust suction device 330 further includes a concentration sensor 333, an air duct 334, an adjusting plate 335 and an adjusting driving member 336. Among them, the concentration sensor 333 is disposed in the dust suction chamber 310 and is communicatively connected to the control device 700, and the concentration sensor 333 is used to detect the concentration of dust.

[0224] The main function of the concentration sensor 333 is to monitor the dust concentration in the dust suction chamber 310 in real time. When the concentration exceeds the preset value, it sends a signal to the control device 700, and the control device 700 will adjust the power of the draft fan 332 or open more dust suction channels.

[0225] A plurality of air guiding pipes 334 are respectively communicated with the dust hood 320 and the air extraction pipe 331, and the plurality of air guiding pipes 334 are arranged at intervals in sequence along the conveying direction of the conveying unit 100; the adjusting plates 335 correspond to the air guiding pipes 334 one by one, and the adjusting plates 335 are slidably arranged at the air inlets of the air guiding pipes 334 and are adapted to adjust the sizes of the air inlets of the air guiding pipes 334; a plurality of adjusting driving members 336 are communicatively connected to the control device 700, the adjusting driving members 336 are fixedly arranged in the dust hood 320, the adjusting driving members 336 correspond to the adjusting plates 335 one by one, and the adjusting driving members 336 are drivingly connected to the adjusting plates 335.

[0226] In this way, the adjusting driving member 336 can drive the movement of the adjusting plate 335 according to the dust concentration data fed back by the concentration sensor 333, so as to open or close the air inlet, or adjust the size of the air inlet of the air guiding pipe 334, realizing more efficient dust collection and further improving the efficiency and effect of dust treatment.

[0227] In some embodiments, combined with Figure 4 , at least one dust outlet is provided on the air extraction pipe 331, and the dust outlet is used for discharging dust from the air extraction pipe 331. A sealing plate is slidably arranged at the dust outlet, and the sealing plate is used for closing the dust outlet when the air extraction fan 332 works to prevent dust leakage.

[0228] A sealing driving member is further provided on the air extraction pipe 331, the sealing driving member is drivingly connected to the sealing plate, and the sealing driving member is communicatively connected to the control device 700. In this way, by remotely controlling the operation of the sealing driving member through the control device 700, the opening and closing of the sealing plate can be controlled, increasing the flexibility and convenience of operation.

[0229] Optionally, the sealing driving member can be a motor, the sealing driving member is fixed on the air extraction pipe 331, and the driving end of the sealing driving member is in threaded fit with the sealing plate, and the dust removal port is driven to open or close by controlling the driving end to rotate forward or reversely. Optionally, the sealing driving member can also be an oil cylinder, a cylinder, etc.

[0230] In this way, when dust needs to be collected, the control device 700 turns off the air extraction fan 332 or reduces the power of the air extraction fan 332, and controls the air outlet driving member to drive the sealing plate to open the dust outlet, and the dust comes out from the dust outlet, realizing the collection of dust.

[0231] The dust treatment unit 300 further includes a dust collection device 340, and the dust collection device 340 includes a filtering member 341 and a dust collection member 342. Among them, the filtering member 341 is arranged in the air extraction pipe 331, and the filtering member 341 is arranged at the dust outlet; the dust collection member 342 is arranged below the dust outlet. Optionally, the filtering member 341 can be a filter screen.

[0232] It can be understood that after the dust is blocked by the filter element 341, it will accumulate on the attachment surface of the filter element 341. When the sealing plate opens the dust outlet, the dust attached to the filter element 341 will fall into the dust collection member 342 under the action of its own gravity, realizing the collection of dust.

[0233] In some embodiments, in combination with Figure 4 , the dust collection device 340 further includes a pneumatic hammer 343. The pneumatic hammer 343 is connected to the filter element 341, and the pneumatic hammer 343 is communicatively connected to the control device 700.

[0234] It can be understood that the pneumatic hammer 343 can be used to strike the filter element 341 to assist the falling of dust. The pneumatic hammer 343 is communicatively connected to the control device 700. In this way, the control device 700 can remotely control the operation of the pneumatic hammer 343, increasing the flexibility and automation degree of the system.

[0235] Optionally, the control device 700 can determine when to start the pneumatic hammer 343 for cleaning according to preset logic or conditions, such as the system operation time, etc.

[0236] In some embodiments, in combination with Figure 4 , the filter element 341 includes a first filter screen 341a and a second filter screen 341b. The first filter screen 341a and the second filter screen 341b are arranged at intervals along the air extraction pipe. The second filter screen 341b is arranged on the downstream side of the first filter screen 341a, and the mesh size of the first filter screen 341a is larger than the mesh size of the second filter screen 341b. In this way, the first filter screen 341a can initially filter out larger dust particles, and the second filter screen 341b can further filter out smaller dust particles, which helps to improve the efficiency and quality of dust collection.

[0237] There are two dust collection members. The two dust collection members 342 correspond to the first filter screen 341a and the second filter screen 341b respectively to collect the dust filtered by their respective filter screens. Since the first filter screen 341a and the second filter screen 341b filter dust particles of different sizes respectively, the two dust collection members 342 can also collect dust of different sizes respectively. This design helps to improve the pertinence and efficiency of dust collection.

[0238] In one embodiment, in combination with Figure 1 and Figure 2 , the surface cleaning system further includes: a feeding unit 500. The feeding unit 500 is used to feed the transmission unit 100. The feeding unit 500 includes a feeding trolley 510 and a feeding device 520.

[0239] Among them, a material platform for carrying workpieces is provided on the feeding trolley 510. Specifically, the resistor chips processed in the previous grinding sheet process will be stacked on the material platform. After the resistor chips are loaded, the feeding trolley 510 moves and transports the resistor chips to the vicinity of the feeding device 520. Optionally, the material of the feeding trolley 510 is stainless steel or aluminum alloy, and the load-bearing capacity reaches the corresponding strength. The material platform can be made of wear-resistant materials such as stainless steel. Optionally, the material platform can be provided with a first fence 511 that can be closed or opened to prevent the resistor chips on the material platform from accidentally falling.

[0240] The feeding device 520 is used to transfer the workpieces on the material platform to the transmission unit 100. Optionally, the feeding device 520 can be implemented by using automated grasping or pushing mechanisms such as robotic arms, pneumatic grippers, and pushing mechanisms. For example, the feeding device 520 can be a four-axis robotic arm.

[0241] Optionally, the feeding device 520 and the feeding trolley 510 can be communicatively connected. When the feeding trolley 510 transports the workpieces to the designated position, the control device 700 will send a signal to the feeding device 520, instructing it to perform grasping or pushing actions.

[0242] In this way, by setting the feeding trolley 510 and the feeding device 520, the continuous supply and smooth flow of the workpieces are ensured, the labor intensity and safety risks of the operators are reduced, and the automation degree and operation efficiency of the surface cleaning system are improved.

[0243] In one embodiment, in combination with Figure 1 and Figure 2 , the surface cleaning system further includes a collection unit 600. The collection unit 600 is arranged on the downstream side of the cleaning unit 200. The collection unit 600 is used to receive the workpieces that have passed through the cleaning of the cleaning unit 200 and the inspection of the inspection unit 400 from the transmission unit 100.

[0244] Optionally, the collection unit 600 can include a collection trolley 610. In addition, the oil collection unit can also be provided with a blanking device 620. The blanking device 620 can be implemented by using automated grasping or pushing mechanisms such as robotic arms, pneumatic grippers, and pushing mechanisms.

[0245] In this way, the qualified workpieces can be stored in the collection trolley 610 through the blanking device 620, ensuring the collection and storage of the qualified workpieces, reducing the labor intensity and safety risks of the operators, and improving the automation degree and operation efficiency of the surface cleaning system.

[0246] Optionally, a second fence 611 can be provided on the collection trolley 610 to protect the qualified workpieces.

[0247] On the other hand, in combination with Figures 1 to 4 , and Figure 5, the present application also provides a surface cleaning method for electronic components, which is applied to the surface cleaning system of electronic components in any of the above embodiments, and includes the following steps:

[0248] S10 Control the dust treatment unit 300 to start. Before the cleaning work starts, it is first necessary to start the dust treatment unit 300. The dust treatment unit 300 includes a dust collection hood 320 and a dust suction device 330. The dust collection hood 320 is disposed outside the cleaning unit 200, and the dust suction device 330 is connected to the dust collection hood 320 through a suction pipe 331. After the dust treatment unit 300 is started, the dust suction device 330 starts to work, sucks the dust generated during the cleaning process into the dust collection hood 320 through the suction pipe 331, and processes it to keep the working environment clean.

[0249] S20 Load the workpiece onto the transfer unit 100, and the transfer unit 100 transfers the workpiece to the cleaning unit 200. It is necessary to load the workpiece to be cleaned (such as a resistor chip) onto the transfer unit 100. The transfer unit 100 usually includes a conveyor belt 110, which can transfer the workpiece from the feeding unit 500 to the cleaning unit 200. The transfer unit 100 transfers the workpiece forward along a preset transfer path. When the workpiece reaches the preset position of the cleaning unit 200, the first laser cleaning device 211 and the second laser cleaning device 212 will respectively clean the first surface and the second surface of the workpiece. During the cleaning process, the laser generator 210b generates a high-energy laser beam, and the scanning reciprocating device guides the laser beam to reciprocally scan the surface of the workpiece, thereby removing the dirt and oxides on the surface.

[0250] S30 Control the cleaning unit 200 to perform laser cleaning on the workpiece.

[0251] S40 Control the detection unit 400 to detect the surface of the workpiece to determine whether the cleaning is qualified. After the cleaning is completed, it is necessary to control the detection unit 400 to detect the surface of the workpiece. The detection unit 400 usually includes a first detection device 410 and a second detection device 420, which are respectively located on the downstream side of the first laser cleaning device 211 and the second laser cleaning device 212. The detection device can adopt visual detection technology or other high-precision detection technologies to detect the cleanliness, flatness, damage condition, etc. of the workpiece surface.

[0252] S50 If it is qualified, transfer the workpiece with qualified detection to the collection unit 600. Transfer the workpiece with qualified detection from the transfer unit 100 to the collection unit 600.

[0253] S60 If it is unqualified, pick out the workpiece with unqualified detection. Pick out the unqualified workpiece and store it in a preset unqualified product storage area. The control device 700 records the information of the unqualified workpiece, batches and labels the unqualified workpiece, and memorizes the instructions according to the dirt distribution of the workpiece.

[0254] After the cleaning of the workpieces undergoing the initial cleaning on the transfer unit 100 is completed, a secondary cleaning program is triggered. That is, after the cleaning of the workpieces undergoing the initial cleaning on the transfer unit 100 is completed, the sorting robot picks the unqualified workpieces in batches from the unqualified product storage area to the transfer unit 100. The detection unit 400 detects the surface dirt distribution information of the workpieces and transmits the dirt distribution data to the control device 700; the control device 700 matches the memorized instructions according to the dirt distribution data, including adjusting the laser power, pulse frequency, and scanning speed of the cleaning unit 200, regulating the suction parameters of the dust treatment unit 300, and controlling the transfer speed of the transfer unit 100. Secondary cleaning is performed.

[0255] Correspondingly, each batch of workpieces will correspond to different instructions. When the detection unit 400 detects the workpieces of the corresponding batch, the control device 700 correspondingly matches the corresponding instructions until all the workpieces are cleaned.

[0256] S80 Control the detection unit 400 to detect again. That is, during secondary cleaning, after the first laser cleaning device 211 or the second laser cleaning device 212 cleans the workpieces, the detection unit 400 located on the downstream side of the first laser cleaning device 211 or the second laser cleaning device 212 detects the workpieces again. If they are qualified, the qualified workpieces are transferred to the collection unit 600. If they are unqualified, they can be picked out.

[0257] Optionally, the workpieces that have undergone secondary cleaning can be stored separately from the workpieces that have passed the initial cleaning. The control device 700 can further detect the workpieces that have undergone secondary cleaning, such as dimensions and other information.

[0258] In one embodiment, controlling the cleaning unit 200 to perform laser cleaning on the workpieces includes:

[0259] Control the first laser cleaning device 211 to clean the first surface of the workpiece. When the workpiece is transferred to the preset position of the first laser cleaning device 211, the control device 700 will receive a corresponding signal, and then the control device 700 will start the first laser cleaning device 211, including components such as the laser generator 210b and the scanning reciprocating device. The laser generator 210b generates a high-energy laser beam, and the scanning reciprocating device is responsible for guiding the laser beam to reciprocally scan on the first surface of the workpiece.

[0260] Control the flipping mechanism 220 to flip the workpiece. When the cleaning of the first surface is completed, the workpiece will be continuously transferred to the preset position of the flipping mechanism 220. Subsequently, the control device 700 will start the flipping mechanism 220 to flip the workpiece so as to clean the second surface. Specifically, the flipping mechanism 220 generally includes components such as a flipping part 222 and a power part. The flipping part 222 is responsible for grasping and fixing the workpiece, and the power part provides the power required for flipping.

[0261] Control the second laser cleaning device 212 to clean the second surface of the workpiece. When the workpiece is flipped to the preset position of the second laser cleaning device 212, the control device 700 will start the laser cleaning device again to clean the second surface of the workpiece. This cleaning step is similar to the cleaning step of the first surface. The laser generator 210b generates a high-energy laser beam, and the scanning reciprocating device is responsible for guiding the laser beam to reciprocally scan on the first surface of the workpiece.

[0262] In one embodiment, controlling the detection unit 400 to detect the surface of the workpiece and controlling the detection unit 400 to detect again includes:

[0263] Perform image detection on the first surface of the workpiece after being cleaned by the first laser cleaning device 211. When the workpiece passes through the first laser cleaning device 211 for cleaning and leaves the cleaning area, the control device 700 will trigger the first detection device 410 to perform image detection on the first surface of the workpiece. The first detection device 410 generally includes a high-resolution camera and an image processing algorithm. The camera captures the image of the first surface of the workpiece and transmits the image data to the image processing algorithm for analysis. The image processing algorithm identifies defects such as dirt, scratches, and oxide layers in the image and determines whether the first surface of the workpiece is qualified according to the preset qualified standard.

[0264] Pick out the workpiece with unqualified first surface from the transfer unit 100. If the image detection result of the first surface shows that the workpiece is unqualified, the picking device will move above or beside the unqualified workpiece according to the instruction issued by the control device 700, and then grab or push the workpiece to move it out of the transfer unit 100. The system records the non-conforming product number and triggers a non-conformance reminder signal (the non-conformance reminder signal can be text, sound, light beam, etc.). The operator picks up and inspects the non-conforming product and determines whether to clean it again or scrap it.

[0265] Perform image detection on the second surface of the workpiece after being cleaned by the second laser cleaning device 212. When the workpiece passes through the flipping mechanism 220 for flipping and is cleaned by the second laser cleaning device 212, the control device 700 will trigger the second detection device 420 to perform image detection on the second surface of the workpiece. This detection step is similar to the detection of the first surface. The second detection device 420 captures the image of the second surface of the workpiece and performs image processing and analysis.

[0266] Pick out the workpieces with unqualified second surfaces from the transfer unit 100. Similar to the above-mentioned picking-out step of the first surface, if the image detection result of the second surface shows that the workpiece is unqualified, the picking device will, according to the instruction of the control device 700, remove the workpiece with an unqualified second surface from the transfer unit 100 and place it in the unqualified product collection area. The system records the unqualified product number and triggers an unqualified reminder signal (the unqualified reminder signal can be text, sound, light beam, etc.). The operator picks up and inspects the unqualified product and determines whether to clean it again or scrap it.

[0267] In this way, the present application realizes the cleaning of the first surface and the second surface of the resistor chip through the first laser cleaning device 211 and the second laser cleaning device 212. Specifically, the laser beam generated by the laser generator 210b is focused on the end face of the resistor chip for scanning. Through the thermal effect, the adhered powder on the end face is separated from the matrix end face. Subsequently, through the dust treatment unit 300, the powder is taken away by means of negative pressure extraction to achieve the purpose of cleaning the surface.

[0268] It can be seen that laser cleaning solves the problem of deep cleaning that is difficult to achieve in the conventional technology by controlling the beam energy to penetrate and peel off the tiny powder in the pits and gaps on the end face of the resistor chip. In addition, laser cleaning does not need to directly contact the workpiece, avoiding physical damage or secondary pollution that may be caused by traditional cleaning methods. Compared with the conventional ultrasonic cleaning that requires a large amount of water resources and cleaning agents, laser cleaning does not produce waste water and has low energy consumption, meeting the requirements of green production.

[0269] In some embodiments, picking out the detected unqualified workpieces includes generating a secondary scanning trajectory according to the dirt distribution of the unqualified workpieces.

[0270] When the detection unit 400 identifies an unqualified workpiece, it will conduct a detailed analysis of the dirt distribution on the workpiece surface and transmit the analysis data to the control device 700. In this way, the control device 700 can identify information such as the specific position, size, and shape of the dirt. According to the analysis result of the dirt distribution, the control device 700 can generate a secondary scanning trajectory for the unqualified workpiece. This trajectory should be able to cover all dirt areas to ensure that these dirt can be removed during the secondary cleaning process.

[0271] Optionally, the generation of the trajectory can consider parameters such as the scanning speed, power, and wavelength of the laser beam, as well as factors such as the material and shape of the workpiece surface.

[0272] In some embodiments, picking out the detected unqualified workpieces includes: classifying and labeling the unqualified workpieces according to the stain depth or area and sorting them into different batches; obtaining corresponding laser parameters and dust suction parameters for different batches of workpieces, and the parameters are aimed at ensuring that the dirt on the workpiece surface can be removed during the cleaning process and protecting the workpiece from damage.

[0273] In some embodiments, corresponding laser parameters and dust suction parameters are obtained for workpieces of different batches. The laser parameters include laser power, pulse frequency, and scanning speed; the dust suction parameters include the size of the air inlet of the air duct 334 and the suction force of the air blower 332.

[0274] In some embodiments, during secondary cleaning, the control detection unit 400 is controlled to detect again, including: if qualified, the qualified workpieces are transferred to the collection unit 600; if unqualified, the unqualified workpieces are picked out.

[0275] As can be seen from the above, in combination with Figures 1 to 3 , the surface cleaning system and surface cleaning method for electronic components provided by the present application sequentially include a feeding preparation stage, a transmission stage, a first surface cleaning stage, a first surface detection and sorting stage, a flipping stage, a second surface cleaning stage, a second surface detection and sorting stage, a collection stage, a secondary cleaning stage, and a final dust closing stage.

[0276] Specifically, in the feeding preparation stage, the feeding trolley 510 transports the resistive chips to be cleaned carried thereon to a specified position, the dust treatment unit 300 is turned on, the conveyor belt is turned on, and then the control device 700 starts self-checking. The self-checking includes whether the feeding trolley 510 is in place, whether the conveyor belt is normal, whether the loading and unloading positions and the equipment are normal, whether the cleaning device has reached the standby state, whether the stacking vehicle is in place, etc. After the self-checking is completed, the control device 700 will judge whether to proceed to the next step according to whether it meets the system configuration requirements. After the system self-checking is completed, the operator selects the resistive chip specifications and height according to the stored program. Correspondingly, the power, frequency, and pulse width of the laser generator 210b will also be associated and changed automatically. After the setting is completed, click the start button, and the system will enter the automatic operation mode.

[0277] In the transmission stage, the feeding device 520 is started to transfer the electronic components on the material platform to the transmission unit 100 one by one, and the conveyor belt 110 transports the electronic components along a preset path.

[0278] In the first surface cleaning stage, when the electronic component reaches the preset cleaning position of the first laser cleaning device 211, the first incoming material detection device 210a detects the workpiece and sends a signal to the control device 700. Correspondingly, after receiving the signal, the control device 700 starts the laser generator 210b and the scanning reciprocating device. The laser generator 210b generates laser, and the scanning reciprocating device drives the laser generator 210b to perform reciprocating scanning cleaning on the first surface of the electronic component.

[0279] The first surface detection and sorting stage includes the first surface detection stage and the first sorting stage. In the first surface detection stage, the washed electronic components continue to be transported to the first detection device 410, where the first detection device 410 detects the first surface of the electronic components to determine whether they are clean and undamaged. In the first sorting stage, if the first detection device 410 detects a defective product, the first detection device 410 labels the defective product with the surface dirt information (stain depth or area) of the defective workpiece and feeds the information back to the control device 700. The control device 700 generates corresponding cleaning parameters based on the surface information of the workpiece and classifies the defective products according to their data information. The first detection device 410 sends a signal to the first sorting device 431, and the push rod 430b of the first sorting device 431 is activated to transfer the defective electronic components from the transport unit 100 to the receiving platform 430a. The system records the defective product number and triggers a defective reminder signal (the defective reminder signal can be text, sound, light beam, etc.). The sorting hand sorts the defective products into the corresponding temporary storage areas according to the batches of the defective products.

[0280] In the flipping stage, the qualified resistor chips will continue to be transported to the preset flipping position of the flipping mechanism 220. After the second incoming material detection device 221 detects the workpiece, the flipping piece 222 is activated to grab and flip the resistor chips.

[0281] In the second surface cleaning stage, the flipped resistor chips reach the preset cleaning position of the second laser cleaning device 212, and the second laser cleaning device 212 performs laser cleaning on the second surface of the resistor chips.

[0282] The second surface detection and sorting stage includes the second surface detection stage and the second sorting stage. In the second surface detection stage, the washed resistor chips continue to be transported to the second detection device 420, where the second detection device 420 detects the second surface of the resistor chips to ensure that they are clean and undamaged. In the second sorting stage, if the second detection device 420 detects a defective product, the second detection device 420 labels the defective product with the surface dirt information (stain depth or area) of the defective workpiece and feeds the information back to the control device 700. The control device 700 generates corresponding cleaning parameters based on the surface information of the workpiece and classifies the defective products according to their data information. The second detection device 420 sends a signal to the second sorting device 432, and the second sorting device 432 transfers the defective resistor chips from the transport unit 100 to the receiving platform 430a. The sorting hand sorts the defective products into the corresponding temporary storage areas according to the batches of the defective products.

[0283] In the collection stage, the resistor chips that are qualified after cleaning and detection continue to be transported to the collection unit 600, and the collection unit 600 stores these qualified resistor chips in an orderly manner.

[0284] In the secondary cleaning stage, the sorting robot places the non-conforming products on the transfer unit 100 according to batches. The control device 700 matches corresponding cleaning parameters based on the surface information of the non-conforming products and then performs secondary cleaning. During this process, the qualified workpieces are transferred to the collection unit 600, and the unqualified workpieces are picked out for inspection by the staff to determine whether tertiary cleaning or scrapping is required.

[0285] In the final dust collection stage, feeding will no longer continue. The resistive chips on the line will be cleaned one by one and collected by the collection unit 600. After there are no resistive chips on the transfer unit 100, the control device 700 will turn off the devices except the dust suction device 330 and send a signal reminder. The operator turns off the dust suction device 330, and then closes the system button to shut down the system.

[0286] In this specification, the embodiments or implementation manners are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other.

[0287] It should be noted that the embodiments referred to in the specification, such as "an embodiment", "embodiment", "exemplary embodiment", "some embodiments", etc., may include specific features, structures, or characteristics, but not necessarily every embodiment includes such specific features, structures, or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. Furthermore, when combining an embodiment to describe a specific feature, structure, or characteristic, implementing such a feature, structure, or characteristic in combination with other embodiments, whether explicitly or implicitly described, is within the knowledge scope of those skilled in the art.

[0288] Generally speaking, terms should be understood at least partially by their use in the context. For example, at least partially according to the context, the term "one or more" used in the text can be used to describe any feature, structure, or characteristic in the sense of a singular, or can be used to describe a combination of features, structures, or characteristics in the sense of a plural. Similarly, at least partially according to the context, terms such as "a" or "the" can also be understood to convey a singular usage or a plural usage.

[0289] It should be easily understood that the terms "on...", "above...", and "over..." in this disclosure should be interpreted in the broadest manner, so that "on..." not only means "directly on something", but also includes the meaning of "on something" with intermediate features or layers therebetween, and "above..." or "over..." not only includes the meaning of "above or over something", but also can include the meaning of "above or over something" without intermediate features or layers therebetween (i.e., directly on something).

[0290] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than limiting them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A surface cleaning system for electronic components, characterized in that, Comprising: A transmission unit (100) for transmitting workpieces; A cleaning unit (200) provided in the vicinity of the transmission unit (100). The cleaning unit (200) includes a first laser cleaning device (211), a flipping mechanism (220), and a second laser cleaning device (212) arranged in sequence along the transmission direction of the workpiece. The first laser cleaning device (211) is adapted to clean the first surface of the workpiece, the flipping mechanism (220) is used to flip the workpiece, and the second laser cleaning device (212) is used to clean the second surface of the workpiece; A dust treatment unit (300) having a dust suction chamber (310). The cleaning unit (200) is located within the dust suction chamber (310), and the transmission unit (100) passes through the dust suction chamber (310). The dust treatment unit (300) is used to suck the dust generated during the cleaning process; A detection unit (400) provided on the upstream side and the downstream side of the cleaning unit (200) to detect the surface of the workpiece; A control device (700) communicatively connected to the transmission unit (100), the cleaning unit (200), the dust treatment unit (300), and the detection unit (400), adapted to control the operation or shutdown of the components through a preset program, and adjust the preset program according to the detection results of the detection unit (400).

2. The surface cleaning system for electronic components according to claim 1, characterized in that, The detection unit (400) includes: A first detection device (410) provided on the upstream side and the downstream side of the first laser cleaning device (211) to detect the first surface of the workpiece before and after being cleaned by the first laser cleaning device (211); A second detection device (420) provided on the upstream side and the downstream side of the second laser cleaning device (212) to detect the second surface of the workpiece before and after being cleaned by the second laser cleaning device (212); The first detection device (410) and the second detection device (420) are configured to detect the dirt distribution on the surface of the workpiece and transmit the dirt distribution information to the control device (700).

3. The surface cleaning system for electronic components according to claim 2, wherein The first detection device (410) is a visual detection device; and / or, the second detection device (420) is a visual detection device.

4. The surface cleaning system for electronic components according to claim 1, wherein, Both the first laser cleaning device (211) and the second laser cleaning device (212) include: A first incoming material detection device (210a) for detecting whether the workpiece reaches a preset cleaning position; A laser generator (210b) for generating laser; A scanning reciprocating device for reciprocally scanning the surface of the workpiece; The control device (700) is configured to be communicatively connected to the first incoming material detection device (210a), the laser generator (210b), and the scanning reciprocating device respectively, to control the working states of the laser generator (210b) and the scanning reciprocating device according to the detection results of the first incoming material detection device (210a).

5. The surface cleaning system for electronic components according to claim 1, wherein, The control device (700) includes: A scanning trajectory planning module, communicatively connected to the detection unit (400), for analyzing the dirt distribution of the workpiece according to the detection feedback of the detection unit (400) and generating a cleaning trajectory; A secondary cleaning trigger module, communicatively connected to the detection unit (400), configured to trigger a secondary cleaning program when the detection unit (400) detects that the workpiece on the transfer unit (100) has completed the primary cleaning.

6. The surface cleaning system for electronic components according to claim 1, wherein, The control device (700) is configured as follows: When the detection unit (400) detects that the cleaning is unqualified, memorize instructions according to the dirt distribution of the workpiece, including adjusting the laser power, pulse frequency, and scanning speed of the cleaning unit (200), adjusting the suction parameters of the dust treatment unit (300), and controlling the transfer speed of the transfer unit (100); After the workpiece to be primarily cleaned has completed cleaning, trigger instructions to the cleaning unit (200), the dust treatment unit (300), and the transfer unit (100).

7. The surface cleaning system for electronic components according to claim 2, characterized in that, It further includes a picking unit (430), and the picking unit (430) includes: A first picking device (431), communicatively connected to the first detection device (410), and the first picking device (431) is used to pick out the workpieces detected as unqualified by the first detection device (410) from the transfer unit (100); A second picking device (432), communicatively connected to the second detection device (420), and the second picking device (432) is used to pick out the workpieces detected as unqualified by the second detection device (420) from the transfer unit (100).

8. The surface cleaning system for electronic components according to claim 7, characterized in that, The transfer unit (100) includes a conveyor belt (110), Both the first picking device (431) and the second picking device (432) include: A receiving platform (430a), provided on one side of the conveyor belt (110), and the receiving platform (430a) is used to receive unqualified workpieces; A push rod (430b), the push rod (430b) is provided on the side of the conveyor belt (110) opposite to the receiving platform (430a), and the piston rod of the push rod (430b) is retractable to transfer unqualified workpieces from the transfer unit (100) to the receiving platform (430a).

9. The surface cleaning system for electronic components according to claim 8, wherein, The control device (700) further includes: A classification labeling module, communicatively connected to the detection unit (400), for batch-labeling unqualified workpieces according to the stain depth or area.

10. The surface cleaning system for electronic components according to claim 9, characterized in that, It further includes a sorting hand, and the sorting hand is communicatively connected to the control device (700), for sorting workpieces from the receiving platform (430a) to different preset storage areas according to the batches of the labeled workpieces.

11. The surface cleaning system for electronic components according to claim 2, characterized in that, The flipping mechanism (220) includes: A second incoming material detection device (221), for detecting whether the workpiece has reached the preset flipping position; A flipping member (222), communicatively connected to the detection unit (400), and the flipping member (222) is used to grab and flip the workpiece.

12. The surface cleaning system for electronic components according to claim 1, characterized in that, The dust treatment unit (300) includes: The dust collection hood (320) is provided outside the cleaning unit (200), and the dust collection hood (320) defines the dust suction cavity (310); The dust suction device (330) includes a blower (332) and a suction pipe (331). The suction pipe (331) communicates with the dust collection hood (320), and the suction pipe (331) extends to a position corresponding to the first laser cleaning device (211) and the second laser cleaning device (212) of the transmission unit (100).

13. The surface cleaning system for an electronic component according to claim 12, characterized in that, The dust suction device (330) further includes: A concentration sensor (333) is disposed in the dust suction cavity (310) and is communicatively connected to the control device (700). The concentration sensor (333) is used to detect the concentration of dust; A plurality of air inlet pipes (334) are respectively communicated with the dust collection hood (320) and the suction pipe (331), and the plurality of air inlet pipes (334) are sequentially arranged at intervals along the conveying direction of the transmission unit (100); A plurality of adjusting plates (335), the adjusting plates (335) correspond to the air inlet pipes (334) one by one, and the adjusting plates (335) are slidably disposed at the air inlets of the air inlet pipes (334) and are adapted to adjust the size of the air inlets of the air inlet pipes (334); A plurality of adjusting driving members (336) are communicatively connected to the control device (700). The driving members (336) are fixedly disposed in the dust collection hood (320), the adjusting driving members (336) correspond to the adjusting plates (335) one by one, and the adjusting driving members (336) are drivingly connected to the adjusting plates (335).

14. The surface cleaning system of an electronic component according to claim 13, wherein At least one dust outlet is provided on the suction pipe (331). A sealing plate is slidably disposed at the dust outlet. A sealing driving member is further provided on the suction pipe, and the sealing driving member is drivingly connected to the sealing plate. The sealing driving member is communicatively connected to the control device (700); The dust treatment unit further includes a dust collection device, and the dust collection device includes: A filter element (341) is disposed in the suction pipe (331), and the filter element (341) is disposed at the dust outlet; A dust collection member (342) is disposed below the dust outlet.

15. The surface cleaning system for an electronic component according to claim 14, wherein The dust collection device (340) further includes: A pneumatic hammer (343) is connected to the filter element (341), and the pneumatic hammer (343) is communicatively connected to the control device (700).

16. The surface cleaning system for an electronic component according to claim 14, wherein The filter element (341) includes a first filter screen (341a) and a second filter screen (341b). The first filter screen (341a) and the second filter screen (341b) are arranged at intervals along the suction pipe (331), and the second filter screen (341b) is disposed on the downstream side of the first filter screen (341a), The mesh size of the first filter screen (341a) is larger than the mesh size of the second filter screen (341b), There are two dust collection members (342), and the two dust collection members (342) respectively correspond to the first filter screen (341a) and the second filter screen (341b).

17. The surface cleaning system for an electronic component according to claim 1, wherein, It further includes: Feeding unit (500), the feeding unit (500) is used to feed the transfer unit (100), and the feeding unit (500) includes: Feeding trolley (510), on which a material platform for carrying workpieces is provided; Loading device (520), used to transfer the workpieces on the material platform to the transfer unit (100).

18. The surface cleaning system for an electronic component according to claim 2, wherein It further includes: Collection unit (600), arranged on the downstream side of the cleaning unit (200), and the collection unit (600) is used to receive the workpieces that have passed the cleaning of the cleaning unit (200) and the inspection of the inspection unit (400) from the transfer unit (100).

19. A surface cleaning method for an electronic component, applied to the surface cleaning system for an electronic component described in any one of claims 1-18, characterized in that, It includes the following steps: Control the dust treatment unit (300) to start; Load the workpiece onto the transfer unit (100), and the transfer unit (100) transfers the workpiece to the cleaning unit (200); Control the cleaning unit (200) to perform laser cleaning on the workpiece; Control the inspection unit (400) to inspect the surface of the workpiece to determine whether the cleaning is qualified; If it is qualified, transfer the inspected qualified workpiece to the collection unit (600); If it is unqualified, pick out the inspected unqualified workpiece; After the initial cleaning of the workpiece on the transfer unit (100) is completed, trigger the secondary cleaning program; Control the inspection unit (400) to inspect again.

20. The surface cleaning method of the electronic component according to claim 19, characterized in that, The control of the cleaning unit (200) to perform laser cleaning on the workpiece includes: Control the first laser cleaning device (211) to clean the first surface of the workpiece; Control the flipping mechanism (220) to flip the workpiece; Control the second laser cleaning device (212) to clean the second surface of the workpiece.

21. The surface cleaning method of the electronic component according to claim 19, wherein, The control of the inspection unit (400) to inspect the surface of the workpiece and the control of the inspection unit (400) to inspect again include: Perform image inspection on the first surface of the workpiece after being cleaned by the first laser cleaning device (211); Pick out the workpiece with unqualified first surface inspection from the transfer unit (100); Perform image inspection on the second surface of the workpiece after being cleaned by the second laser cleaning device (212); Pick out the workpiece with unqualified second surface inspection from the transfer unit (100).

22. The surface cleaning method of an electronic component according to claim 19, characterized in that, The picking out of the inspected unqualified workpiece includes: Generate a secondary scanning trajectory according to the dirt distribution of the unqualified workpiece.

23. The surface cleaning method of an electronic component according to claim 19, wherein, The picking out of the inspected unqualified workpiece includes: Classify and label the unqualified workpieces according to the stain depth or area, and sort them into different batches; Obtain corresponding laser parameters and dust suction parameters for different batches of workpieces.

24. The surface cleaning method of the electronic component according to claim 23, characterized in that The laser parameters include laser power, pulse frequency and scanning speed; The dust suction parameters include the size of the air inlet of the air duct (334) and the suction force of the air blower (332).

25. The surface cleaning method of an electronic component according to claim 19, characterized in that, The control of the inspection unit (400) to inspect again includes: If it is qualified, transfer the inspected qualified workpiece to the collection unit (600); If it is unqualified, pick out the inspected unqualified workpiece.

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