Efficient temperature control system for die-casting forming of new energy automobile structural part

Abstract

The invention relates to the technical field of metal casting, in particular to an efficient temperature control system for die-casting forming of new energy automobile structural parts, which comprises the following steps: screening all module structure areas based on the segmentation unification degree to obtain all module structure areas to be analyzed; according to the structure complexity and the internal complexity of the to-be-analyzed module structure regions, obtaining the overall complexity of each to-be-analyzed module structure region; obtaining a temperature cooling coefficient of each to-be-analyzed module structure region according to the overall complexity and the internal temperature distribution condition of the to-be-analyzed module structure region; and performing temperature control on each to-be-analyzed module structure area in the mold product based on the cooling coefficient. According to the die-casting die, the quality of the automobile structural part in the die-casting process is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of metal casting, and particularly relates to an efficient temperature control system for die-casting forming of new energy vehicle structural parts. Background Art

[0002] In the production process of new energy vehicle structural parts, generally, after die-casting the structural parts into shape, a temperature control system is used to cool the die-cast structural parts to ensure normal production. Since when die-casting structural parts, molten metal needs to be filled into the mold cavity at high speed and high pressure to solidify it; and during the solidification process of die-casting structural parts, due to the uneven cooling rate of the metal, the mold temperature is uneven, so it is necessary to accurately control the temperature of different parts of the mold. Such a cooling treatment method can effectively reduce the deformation of vehicle structural parts; when cooling the die-cast vehicle structure, due to the different structural complexities of different regions of the vehicle structural parts, it is also impossible to control the temperature of different parts of the mold, resulting in thermal stress and deformation of the vehicle structural parts, and further making the die-casting quality of the vehicle structural parts poor. Summary of the Invention

[0003] The present invention provides an efficient temperature control system for die-casting forming of new energy vehicle structural parts to solve the existing problems.

[0004] The efficient temperature control system for die-casting forming of new energy vehicle structural parts of the present invention adopts the following technical solutions:

[0005] It includes the following modules:

[0006] An image acquisition module, configured to obtain infrared imaging images of the mold products at several moments during the die-casting process of the vehicle structural parts;

[0007] A module structure area classification module, configured to obtain several module structure areas in the infrared imaging image; according to the distribution of edge pixel points and the area change of the module structure areas at different moments, obtain the segmentation uniformity of each module structure area; and screen out the module structure areas to be analyzed from the module structure areas based on the segmentation uniformity;

[0008] An overall complexity acquisition module, configured to obtain several temperature clustering clusters within the module structure areas to be analyzed; by analyzing the internal temperature change of different temperature clustering clusters and the internal temperature drop of the module structure areas to be analyzed at adjacent moments, obtain the internal complexity of the module structure areas to be analyzed; according to the internal temperature difference between adjacent module structure areas to be analyzed, obtain the structural complexity of the module structure areas to be analyzed; and according to the structural complexity and the internal complexity, obtain the overall complexity of the module structure areas to be analyzed;

[0009] The temperature control module is used to obtain the temperature cooling coefficient of the module structure area to be analyzed according to the overall complexity; and perform temperature control on the module structure area to be analyzed based on the cooling coefficient.

[0010] Preferably, the method for obtaining several module structure areas in the infrared imaging image specifically includes:

[0011] For the infrared imaging image of the mold product at any moment, perform edge detection on the infrared imaging image, and take the area formed by the closed edge as the module structure area.

[0012] Preferably, the method for obtaining the segmentation uniformity of each module structure area according to the distribution of edge pixel points and the area change of the module structure area at different moments specifically includes:

[0013] Obtain the edge distribution similarity of each module structure area according to the distribution of edge pixel points of the module structure area at different moments;

[0014] Obtain the area similarity degree of the v-th module structure area according to the area change of the v-th module structure area in the infrared imaging image of the mold product at different moments;

[0015] Take the normalized value of the product between the area similarity degree of the v-th module structure area and the edge distribution similarity of the v-th module structure area as the segmentation uniformity of the v-th module structure area.

[0016] Preferably, the method for obtaining the edge distribution similarity of each module structure area according to the distribution of edge pixel points of the module structure area at different moments specifically includes:

[0017] Denote the sequence formed by the position coordinates of all edge pixel points of the v-th module structure area in the infrared imaging image of the mold product at the i-th moment as the edge distribution sequence of the v-th module structure area in the infrared imaging image of the mold product at the i-th moment; use the DTW algorithm to obtain the DTW value between the edge distribution sequence of the v-th module structure area in the infrared imaging image of the mold product at the i-th moment and the edge distribution sequence of the v-th module structure area in the infrared imaging image of the mold product at the i+1-th moment, and denote it as the edge distribution similarity factor of the v-th module structure area in the infrared imaging image of the mold product at the i-th moment;

[0018] The mean of the edge distribution similarity factors of the v-th module structure region in the infrared imaging images of the mold product at all times is denoted as the edge distribution similarity mean of the v-th module structure region; the absolute value of the difference between the edge distribution similarity factor of the v-th module structure region in the infrared imaging image of the mold product at the i-th time and the edge distribution similarity mean of the v-th module structure region is denoted as the similarity difference value of the v-th module structure region in the infrared imaging image of the mold product at the i-th time; the inverse normalization value of the similarity difference values of the v-th module structure region in the infrared imaging images of the mold product at all times is denoted as the edge similarity value of the v-th module structure region.

[0019] The product of the edge distribution similarity mean of the v-th module structure region and the edge similarity value of the v-th module structure region is used as the edge distribution similarity of the v-th module structure region.

[0020] Preferably, the method for obtaining the area proximity degree of the v-th module structure region according to the area change of the v-th module structure region in the infrared imaging images of the mold product at different times includes the following specific method:

[0021] The set composed of the position coordinates of all pixel points in the v-th module structure region in the infrared imaging image of the mold product at the i-th time is denoted as the position distribution set of the v-th module structure region in the infrared imaging image of the mold product at the i-th time; the union of the position distribution sets of the v-th module structure region in the infrared imaging images of the mold product at all times is denoted as the overall position distribution set of the v-th module structure region; the intersection of the position distribution sets of the v-th module structure region in the infrared imaging images of the mold product at all times is denoted as the main position distribution set of the v-th module structure region; the ratio between the number of all elements in the main position distribution set of the v-th module structure region and the number of all elements in the overall position distribution set of the v-th module structure region is denoted as the area proximity degree of the v-th module structure region.

[0022] Preferably, the method for obtaining the internal complexity of the module structure region to be analyzed by analyzing the internal temperature change in different temperature clustering clusters and the internal temperature drop in the module structure region to be analyzed at adjacent times includes the following specific method:

[0023] By analyzing the internal temperature change in different temperature clustering clusters in the module structure region to be analyzed, the internal temperature difference of each module structure region to be analyzed is obtained;

[0024] The absolute value of the difference between the mean of the temperature values of all the pixel points within the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the i-th moment and the mean of the temperature values of all the pixel points within the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the (i + 1)-th moment is denoted as the temperature drop difference of the z-th module structure area in the infrared imaging image of the mold product at the i-th moment;

[0025] The mean of the temperature drop differences of the z-th module structure area in the infrared imaging images of the mold product at all moments is denoted as the mean temperature drop of the z-th module structure area; The absolute value of the difference between the temperature drop difference of the z-th module structure area in the infrared imaging image of the mold product at the i-th moment and the mean temperature drop of the z-th module structure area is denoted as the internal complexity factor of the z-th module structure area in the infrared imaging image of the mold product at the i-th moment;

[0026] The product of the sum of the internal complexity factors of the z-th module structure area in the infrared imaging images of the mold product at all moments and the internal temperature difference of the z-th module structure area is taken as the internal complexity degree of the z-th module structure area.

[0027] Preferably, the method for obtaining the internal temperature difference of each module structure area to be analyzed by analyzing the internal temperature change conditions within different temperature clustering clusters in the module structure area to be analyzed includes the following specific method:

[0028] The mean of the temperature values of all the pixel points in the q-th temperature clustering cluster within the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the i-th moment is denoted as the temperature mean of the q-th temperature clustering cluster; The absolute value of the difference between the maximum temperature value of all the pixel points in the q-th temperature clustering cluster and the temperature mean of the q-th temperature clustering cluster is denoted as the temperature difference value of the q-th temperature clustering cluster; The product of the sum of the temperature difference values of all the temperature clustering clusters within the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the i-th moment and the number of all the temperature clustering clusters within the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the i-th moment is denoted as the temperature difference factor within the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the i-th moment; The mean of the temperature difference factors within the z-th module structure area to be analyzed in the infrared imaging images of the mold product at all moments is taken as the internal temperature difference of the z-th module structure area.

[0029] Preferably, the method for obtaining the structural complexity of the module structure area to be analyzed according to the internal temperature difference conditions between adjacent module structures areas to be analyzed includes the following specific method:

[0030] Obtain all adjacent module structure regions of the z-th module structure region to be analyzed, and all of them are denoted as the adjacent module structure regions of the z-th module structure region to be analyzed;

[0031] For any one of the adjacent module structure regions of the z-th module structure region to be analyzed, the absolute value of the difference between the average value of the temperatures of all pixel points in the any one of the adjacent module structure regions and the average value of the temperatures of all pixel points in the z-th module structure region to be analyzed is denoted as the adjacent temperature difference of the any one of the adjacent module structure regions;

[0032] The normalized value of the product of the sum of the adjacent temperature differences of all adjacent module structure regions of the z-th module structure region to be analyzed and the number of all adjacent module structure regions of the z-th module structure region is denoted as the structural complexity of the z-th module structure region to be analyzed.

[0033] Preferably, the specific method for obtaining the overall complexity of the module structure region to be analyzed according to the structural complexity and the internal complexity includes:

[0034] The sum of 1 and the structural complexity of the z-th module structure region to be analyzed is denoted as the structural complexity factor; the normalized value of the product of the structural complexity factor and the internal complexity of the z-th module structure region is denoted as the overall complexity of the z-th module structure region to be analyzed.

[0035] Preferably, the specific method for obtaining the temperature cooling coefficient of the module structure region to be analyzed according to the overall complexity includes:

[0036] The difference between the average value of the temperatures of all pixel points in the z-th module structure region to be analyzed and the minimum value of the temperatures of all pixel points in the z-th module structure region is denoted as the first difference; the difference between the maximum value of the temperatures of all pixel points in the z-th module structure region to be analyzed and the minimum value of the temperatures of all pixel points in the z-th module structure region is denoted as the second difference; the ratio between the first difference and the second difference is denoted as the internal high temperature degree of the z-th module structure region to be analyzed;

[0037] The sum of 1 and the overall complexity of the z-th module structure region to be analyzed is denoted as the cooling factor; the product of the internal high temperature degree of the z-th module structure region to be analyzed and the cooling factor is used as the temperature cooling coefficient of the z-th module structure region to be analyzed.

[0038] The beneficial effects of the technical solution of the present invention are as follows: The present invention screens all module structure regions based on the segmentation uniformity degree to obtain all module structure regions to be analyzed; according to the structural complexity and internal complexity of the module structure regions to be analyzed, the overall complexity of each module structure region to be analyzed is obtained; according to the overall complexity and the internal temperature distribution of the module structure regions to be analyzed, the temperature cooling coefficient of each module structure region to be analyzed is obtained; based on the cooling coefficient, temperature control is performed on each module structure region to be analyzed in the die-casting product of the automotive structural part; thereby improving the quality in the die-casting process of the automotive structural part. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0040] Figure 1 is a structural block diagram of an efficient temperature control system for die-casting forming of a new energy vehicle structural part according to the present invention;

[0041] Figure 2 is a characteristic relationship flowchart of an efficient temperature control system for die-casting forming of a new energy vehicle structural part according to the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0042] In order to further elaborate on the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the following will, in conjunction with the drawings and preferred embodiments, describe in detail the specific implementation manner, structure, characteristics, and effects of an efficient temperature control system for die-casting forming of a new energy vehicle structural part proposed according to the present invention. In the following description, different "one embodiment" or "another embodiment" do not necessarily refer to the same embodiment. In addition, the specific features, structures, or characteristics in one or more embodiments can be combined in any suitable form.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs.

[0044] The following will specifically describe the specific solution of an efficient temperature control system for die-casting forming of a new energy vehicle structural part provided by the present invention with reference to the drawings.

[0045] Please refer to Figure 1 , which shows a structural block diagram of an efficient temperature control system for die-casting forming of a new energy vehicle structural part provided by an embodiment of the present invention. The system includes the following modules:

[0046] An image acquisition module, configured to obtain infrared imaging images of a die product at several moments during the die casting process of an automotive structural part.

[0047] It should be noted that during the die casting process of automotive cast structural parts, the surface temperature of the die has a direct impact on the quality of the structural parts processed by the die; using an infrared thermal imager, the temperature change of the die surface can be monitored in real time without interrupting the production process, visually reflecting the current process conditions to achieve rapid adjustment of the die temperature.

[0048] Specifically, first, it is necessary to acquire infrared imaging images of the die product at several moments during the die casting process of the automotive structural part. The specific process is as follows:

[0049] During the die casting process of the automotive structural part, every 15 seconds is regarded as a moment. Each time, an infrared thermal imaging camera is used to take pictures of the automotive cast product, obtaining infrared imaging images of the die product at several moments, and a total of 30 minutes are collected.

[0050] Thus far, infrared imaging images of the die product at several moments during the die casting process of the automotive structural part are obtained through the above method.

[0051] A module structure region classification module, configured to obtain several module structure regions in the infrared imaging image; according to the distribution of edge pixel points and the area change of the module structure regions at different moments, obtain the segmentation uniformity degree of each module structure region; and screen out the module structure regions to be analyzed from the module structure regions based on the segmentation uniformity degree.

[0052] It should be noted that due to the structural changes in the die product and the stable local temperature change of the die product, the die product can be divided into blocks according to the temperature change in the die product; the infrared imaging image can obtain the temperature surface distribution of the die product, so the modules with a single structure in the die product are divided into blocks through the temperature distribution; where the single structure can be determined according to the uniformity of the temperature distribution of the current die product; if the temperature segmentation of a certain area is relatively uniform currently, it indicates that the structure of the current area is relatively unified, and if there is a temperature difference, it indicates that there is a structural segmentation situation in the current area. At the same time, since under the same temperature control condition, the temperature changes are relatively uniform, the segmentation effects of multiple infrared imaging images can be analyzed to determine each module of the die product.

[0053] Preferably, in some implementation manners of the embodiments of the present invention, when the automotive die-cast structural part is cooled, the temperatures of different module structure regions are different, while the temperature of the same module structure region is relatively uniform; in the infrared imaging image, the gray values of the pixel points in the module structure region with uniform temperature are uniformly distributed; therefore, the edges with temperature differences generally belong to the edges of adjacent module structure regions; then the specific method for obtaining several module structure regions in the infrared imaging image of the die product at each moment is as follows:

[0054] For the infrared imaging image of the die product at any moment, use the Canny edge detection algorithm to perform edge detection on the infrared imaging image of the die product at the any moment to obtain the edge detection result image of the infrared imaging image of the die product at the any moment; all the closed regions formed by edges in the edge detection result image are used as the module structure regions in the infrared imaging image of the die product at the any moment.

[0055] Among them, the Canny edge detection algorithm is a prior art, and it will not be elaborated too much here in this embodiment.

[0056] It should be noted that after edge segmentation is performed on the infrared imaging image of the die product, if the current edge is the real edge of the module structure region, it means that the segmented closed region represents the module structure region of the die product, then the temperature change inside the module structure region is relatively unified; and after multiple infrared imaging images are segmented, the similarity of the edges of the module structure region will be relatively unified, and at the same time the area size of the module structure region is also relatively close, so by combining the edge distribution similarity and area proximity degree of the module structure region, the segmentation uniformity degree of each module structure region is obtained.

[0057] Preferably, in some implementation manners of the embodiments of the present invention, the specific method for obtaining the edge distribution similarity of each module structure region according to the distribution of the edge pixel points of each module structure region in the infrared imaging image of the die product at different moments is as follows:

[0058] For the infrared imaging image of the die product at any moment, construct a rectangular coordinate system with the pixel point at the lower left corner of the infrared imaging image of the die product at the any moment as the coordinate origin, with the horizontal rightward direction as the positive direction of the horizontal axis and the vertical upward direction as the positive direction of the vertical axis;

[0059] The sequence composed of the position coordinates of all edge pixel points in the v-th module structure region of the infrared imaging image of the mold product at the i-th moment is denoted as the edge distribution sequence of the v-th module structure region in the infrared imaging image of the mold product at the i-th moment; the DTW value between the edge distribution sequence of the v-th module structure region in the infrared imaging image of the mold product at the i-th moment and the edge distribution sequence of the v-th module structure region in the infrared imaging image of the mold product at the i+1-th moment is obtained by using the DTW algorithm, and is denoted as the edge distribution similarity factor of the v-th module structure region in the infrared imaging image of the mold product at the i-th moment;

[0060] Among them, for any module structure region, starting from the edge pixel point directly above the center of the module structure region and rotating clockwise for one week, an edge distribution sequence is obtained; the optical flow method of the existing technology is used for target tracking to obtain the same module structure region in the infrared imaging images of the mold product at adjacent moments.

[0061] The mean value of the edge distribution similarity factors of the v-th module structure region in the infrared imaging images of the mold product at all moments is denoted as the edge distribution similarity mean of the v-th module structure region; the absolute value of the difference between the edge distribution similarity factor of the v-th module structure region in the infrared imaging image of the mold product at the i-th moment and the edge distribution similarity mean of the v-th module structure region is denoted as the similarity difference value of the v-th module structure region in the infrared imaging image of the mold product at the i-th moment; the inverse proportional normalization value of the similarity difference values of the v-th module structure region in the infrared imaging images of the mold product at all moments is denoted as the edge similarity value of the v-th module structure region;

[0062] The product of the edge distribution similarity mean of the v-th module structure region and the edge similarity value of the v-th module structure region is used as the edge distribution similarity of the v-th module structure region;

[0063] The specific formula is:

[0064]

[0065] In the formula, r v represents the edge distribution similarity of the v-th module structure region; dtw(l v ) represents the mean value of the edge distribution similarity factors of the v-th module structure region in the infrared imaging images of the mold product at all moments; n represents the number of infrared imaging images of the mold product at all moments; dtw(l i,v ,l i+1,v) represents the DTW value between the edge distribution sequence of the v-th module structure region in the infrared imaging image of the mold product at the i-th moment and the edge distribution sequence of the v-th module structure region in the infrared imaging image of the mold product at the (i + 1)-th moment; || represents taking the absolute value; exp() represents the exponential function with the natural constant as the base. In the embodiment, the exp(-x) model is used to present the inverse proportional relationship and normalization processing, where x is the input of the model, and the implementer can select the inverse proportional function and normalization function according to the actual situation.

[0066] Among them, obtaining the DTW value between two sequences is a prior art, and this embodiment will not elaborate too much here.

[0067] Preferably, in some implementation manners of the embodiment of the present invention, the specific method for obtaining the segmentation unity degree of each module structure region according to the area change situation and edge distribution similarity of each module structure region in the infrared imaging image of the mold product at different moments is as follows:

[0068] Denote the set composed of the position coordinates of all pixel points in the v-th module structure region in the infrared imaging image of the mold product at the i-th moment as the position distribution set of the v-th module structure region in the infrared imaging image of the mold product at the i-th moment; denote the union of the position distribution sets of the v-th module structure region in the infrared imaging images of the mold product at all moments as the overall position distribution set of the v-th module structure region; denote the intersection of the position distribution sets of the v-th module structure region in the infrared imaging images of the mold product at all moments as the main position distribution set of the v-th module structure region; denote the ratio between the number of all elements in the main position distribution set of the v-th module structure region and the number of all elements in the overall position distribution set of the v-th module structure region as the area similarity degree of the v-th module structure region;

[0069] Take the normalized value of the product of the area similarity degree of the v-th module structure region and the edge distribution similarity of the v-th module structure region as the segmentation unity degree of the v-th module structure region;

[0070] The specific formula is:

[0071]

[0072] In the formula, w v represents the segmentation unity degree of the v-th module structure region; r v represents the edge distribution similarity of the v-th module structure region; N0 v represents the number of all elements in the main position distribution sequence of the v-th module structure region; N1 vrepresents the number of all elements in the overall position distribution sequence of the v-th module structure region; norm() is a linear normalization function.

[0073] Preferably, in some implementation manners of the embodiments of the present invention, the specific method for screening all module structure regions based on the segmentation uniformity to obtain all module structure regions to be analyzed is as follows:

[0074] Preset a threshold parameter K. In this embodiment, K = 0.7 is taken as an example for description, and this embodiment does not make specific limitations, and K is determined according to specific implementation situations;

[0075] If the segmentation uniformity of the v-th module structure region is less than or equal to the threshold parameter K, the v-th module structure region is recorded as a module structure region to be analyzed.

[0076] Thus, the module structure regions to be analyzed are obtained through the above method.

[0077] The overall complexity acquisition module is used to obtain several temperature clustering clusters within the module structure region to be analyzed; by analyzing the internal temperature change situation of different temperature clustering clusters and the internal temperature drop situation of the module structure region to be analyzed at adjacent moments, the internal complexity of the module structure region to be analyzed is obtained; according to the internal temperature difference situation between adjacent module structure regions to be analyzed, the structural complexity of the module structure region to be analyzed is obtained; according to the structural complexity and the internal complexity, the overall complexity of the module structure region to be analyzed is obtained.

[0078] It should be noted that since the above-mentioned edge segmentation can only distinguish module structure regions with relatively large gray-scale differences, and if the temperature difference is relatively small, the temperature of the module structure region cannot be distinguished; at the same time, there are also some module structure regions that cannot be structurally identified; therefore, in this embodiment, the temperature complexity inside the module structure region to be analyzed can be determined according to the temperature distribution and the uniformity of temperature change inside the module structure region to be analyzed, and at the same time, the regional structure complexity of the module structure region to be analyzed can be determined by comparing the temperature difference between the module structure region to be analyzed and adjacent modules and the module area, so as to obtain the overall complexity of the module structure region to be analyzed.

[0079] It should be noted that the temperature values of all pixel points in the module structure region to be analyzed are clustered by the DBSCAN clustering algorithm, and the structural complexity of the current module is determined according to the size of the divided blocks inside the current module after clustering and the temperature difference situation inside the divided blocks. Among them, the more divided blocks, the more likely the internal temperature is uneven, and the greater the complexity inside the module.

[0080] Preferably, in some implementation manners of the embodiments of the present invention, the specific method for clustering the temperature values of all pixel points in each region of the module structure to be analyzed to obtain several temperature clustering clusters in each module structure region is as follows:

[0081] Use the DBSCAN clustering algorithm to cluster the temperature values of all pixel points in the z-th region of the module structure to be analyzed in the infrared imaging image of the mold product at the i-th moment, and obtain several temperature clustering clusters in the z-th module structure region in the infrared imaging image of the mold product at the i-th moment.

[0082] Preferably, in some implementation manners of the embodiments of the present invention, the specific method for analyzing the internal temperature change situation in different temperature clustering clusters in each region of the module structure to be analyzed to obtain the internal temperature difference of each region of the module structure to be analyzed is as follows:

[0083] Denote the mean value of the temperature values of all pixel points in the q-th temperature clustering cluster in the z-th region of the module structure to be analyzed in the infrared imaging image of the mold product at the i-th moment as the temperature mean value of the q-th temperature clustering cluster; denote the absolute value of the difference between the maximum value of the temperature values of all pixel points in the q-th temperature clustering cluster and the temperature mean value of the q-th temperature clustering cluster as the temperature difference value of the q-th temperature clustering cluster; denote the product of the sum of the temperature difference values of all temperature clustering clusters in the z-th region of the module structure to be analyzed in the infrared imaging image of the mold product at the i-th moment and the number of all temperature clustering clusters in the z-th region of the module structure to be analyzed in the infrared imaging image of the mold product at the i-th moment as the temperature difference factor in the z-th region of the module structure to be analyzed in the infrared imaging image of the mold product at the i-th moment; take the mean value of the temperature difference factors in the z-th region of the module structure to be analyzed in the infrared imaging images of the mold product at all moments as the internal temperature difference of the z-th region of the module structure to be analyzed.

[0084] The specific formula is as follows:

[0085]

[0086] In the formula, d v represents the internal temperature difference of the z-th region of the module structure to be analyzed; n represents the number of infrared imaging images of the mold product at all moments; M i,v represents the number of all temperature clustering clusters in the z-th region of the module structure to be analyzed in the infrared imaging image of the mold product at the i-th moment; represents the mean value of the temperature values of all pixel points in the q-th temperature clustering cluster in the z-th region of the module structure to be analyzed in the infrared imaging image of the mold product at the i-th moment; Tmax i,v,qrepresents the maximum value of the temperature values of all pixel points in the q-th temperature clustering cluster in the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the i-th moment; || represents taking the absolute value.

[0087] Preferably, in some implementation manners of the embodiments of the present invention, since the more uniform the internal temperature drops in the module structure area to be analyzed, it indicates that there is no heat accumulation in the module structure area to be analyzed, which means that the internal structure of the module structure area to be analyzed is less complex; according to the temperature drop situation and internal temperature difference in each module structure area to be analyzed in the infrared imaging images of the mold product at adjacent moments, the specific method for obtaining the internal complexity of each module structure area to be analyzed is as follows:

[0088] The absolute value of the difference between the average value of the temperature values of all pixel points in the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the i-th moment and the average value of the temperature values of all pixel points in the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the i + 1-th moment is denoted as the temperature drop difference of the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the i-th moment.

[0089] The average value of the temperature drop differences of the z-th module structure area to be analyzed in the infrared imaging images of the mold product at all moments is denoted as the average temperature drop of the z-th module structure area to be analyzed; the absolute value of the difference between the temperature drop difference of the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the i-th moment and the average temperature drop of the z-th module structure area to be analyzed is denoted as the internal complexity factor of the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the i-th moment.

[0090] The product of the sum of the internal complexity factors of the z-th module structure area to be analyzed in the infrared imaging images of the mold product at all moments and the internal temperature difference of the z-th module structure area to be analyzed is used as the internal complexity of the z-th module structure area to be analyzed.

[0091] The specific formula is:

[0092]

[0093] In the formula, G v represents the internal complexity of the z-th module structure area to be analyzed; d v represents the internal temperature difference of the z-th module structure area to be analyzed; n represents the number of infrared imaging images of the mold product at all moments; TX i,v represents the temperature drop difference of the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the i-th moment. Represents the average temperature drop of the z-th module structure area to be analyzed; || represents taking the absolute value.

[0094] It should be noted that if the module structure area to be analyzed is a fine part of the vehicle structure, or the structure of the module structure area to be analyzed is relatively complex, and there are depressions and protrusions, etc., then the temperature difference detection between the adjacent modules of the module structure area to be analyzed and the module structure area to be analyzed will be relatively large; if the module structure area to be analyzed has a relatively large number of module structure areas docked with it, and is relatively large in shape compared to other module structure areas, it indicates that the module structure area to be analyzed is the skeleton part of the vehicle structure member, and due to having the connection positions of multiple module structure areas, its structure is relatively complex.

[0095] Preferably, in some implementation manners of the embodiments of the present invention, the specific method for obtaining the structure complexity of each module structure area to be analyzed according to the internal temperature difference between each module structure area to be analyzed and the surrounding module structure areas is as follows:

[0096] Obtain all adjacent module structure areas of the z-th module structure area to be analyzed, and all are denoted as the adjacent module structure areas of the z-th module structure area to be analyzed;

[0097] For any one of the adjacent module structure areas of the z-th module structure area to be analyzed, the absolute value of the difference between the average temperature of all pixel points in the any one of the adjacent module structure areas and the average temperature of all pixel points in the z-th module structure area to be analyzed is denoted as the adjacent temperature difference of the any one of the adjacent module structure areas;

[0098] The normalized value of the product of the sum of the adjacent temperature differences of all adjacent module structure areas of the z-th module structure area to be analyzed and the number of all adjacent module structure areas of the z-th module structure area to be analyzed is denoted as the structure complexity of the z-th module structure area to be analyzed;

[0099] The specific formula is:

[0100]

[0101] In the formula, E z Represents the structure complexity of the z-th module structure area to be analyzed; L z Represents the number of all adjacent module structure areas of the z-th module structure area to be analyzed; T z,l Represents the average temperature of all pixel points in the l-th adjacent module structure area of the z-th module structure area to be analyzed; T z Represents the average temperature of all pixel points in the z-th module structure area to be analyzed; norm() is a linear normalization function.

[0102] Preferably, in some implementation manners of the embodiments of the present invention, the specific formula for obtaining the overall complexity of each module structure region to be analyzed according to the structural complexity and internal complexity of each module structure region to be analyzed is as follows:

[0103] Denote the sum of 1 and the structural complexity of the z-th module structure region to be analyzed as the structural complexity factor; denote the normalized value of the product between the structural complexity factor and the internal complexity of the z-th module structure region to be analyzed as the overall complexity of the z-th module structure region to be analyzed;

[0104] The specific formula is as follows:

[0105] F v = G v ×(1 + E z )

[0106] In the formula, F v represents the overall complexity of the z-th module structure region to be analyzed; G v represents the internal complexity of the z-th module structure region to be analyzed; E z represents the structural complexity of the z-th module structure region to be analyzed.

[0107] Thus, the overall complexity of each module structure region to be analyzed is obtained through the above method.

[0108] The temperature control module is used to obtain the temperature cooling coefficient of the module structure region to be analyzed according to the overall complexity; and perform temperature control on the module structure region to be analyzed based on the cooling coefficient.

[0109] It should be noted that the more complex the overall complexity of the module structure region to be analyzed is, the higher the possibility of heat accumulation is, and thus it is necessary to increase its cooling coefficient; since the higher the internal temperature of the module structure region to be analyzed is, it indicates that it is necessary to cool it down faster, and thus the cooling coefficient of the module structure region to be analyzed is higher. Therefore, it is also necessary to consider the high temperature degree inside the module structure region to be analyzed, and thus comprehensively determine the temperature cooling coefficient of the module structure region to be analyzed.

[0110] Preferably, in some implementation manners of the embodiments of the present invention, the specific method for obtaining the temperature cooling coefficient of each module structure region to be analyzed according to the overall complexity and the internal temperature distribution of each module structure region to be analyzed is as follows:

[0111] The difference between the average temperature of all pixel points in the z-th module structure area to be analyzed and the minimum temperature of all pixel points in the z-th module structure area to be analyzed is denoted as the first difference; the difference between the maximum temperature of all pixel points in the z-th module structure area to be analyzed and the minimum temperature of all pixel points in the z-th module structure area to be analyzed is denoted as the second difference; the ratio between the first difference and the second difference is denoted as the internal high temperature degree of the z-th module structure area to be analyzed.

[0112] The sum of 1 and the overall complexity degree of the z-th module structure area to be analyzed is denoted as the cooling factor; the product of the internal high temperature degree of the z-th module structure area to be analyzed and the cooling factor is used as the temperature cooling coefficient of the z-th module structure area to be analyzed.

[0113] Preferably, in some implementation manners of the embodiments of the present invention, when using temperature control technology to control the temperature of each module structure area to be analyzed inside the die product during the die casting process of automotive structural parts, the temperature can be reduced through the temperature cooling coefficient; wherein the temperature cooling coefficient affects the flow rate of the coolant, the temperature change rate, and the temperature distribution of the cooling area, and the specific method for controlling the temperature of each module structure area to be analyzed in the die product based on the cooling coefficient is as follows:

[0114] Input the temperature cooling coefficients of all module structure areas to be analyzed into the temperature control system. The temperature control system will optimize the temperature balance of the die by automatically setting the temperature cooling coefficients of each module structure area to be analyzed, reduce thermal stress and deformation, and thereby improve the die casting quality of automotive structural parts.

[0115] Please refer to Figure 2 , which shows the characteristic relationship flow chart of an efficient temperature control system for die casting of new energy vehicle structural parts;

[0116] Thus, this embodiment is completed.

[0117] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An efficient temperature control system for die-casting forming of new energy vehicle structural parts, characterized in that, The system includes the following modules: An image acquisition module, which is used to obtain infrared imaging images of the die-cast product of the automotive structural part at several moments during the die-casting process; A module structure area classification module, which is used to obtain several module structure areas in the infrared imaging image; according to the distribution of edge pixel points and the area change of the module structure area at different moments, obtain the segmentation uniformity of each module structure area; based on the segmentation uniformity, screen out the module structure areas to be analyzed from the module structure areas; An overall complexity acquisition module, which is used to obtain several temperature clustering clusters within the module structure area to be analyzed; by analyzing the internal temperature change of different temperature clustering clusters and the internal temperature drop of the module structure area to be analyzed at adjacent moments, obtain the internal complexity of the module structure area to be analyzed; according to the internal temperature difference between adjacent module structure areas to be analyzed, obtain the structural complexity of the module structure area to be analyzed; according to the structural complexity and the internal complexity, obtain the overall complexity of the module structure area to be analyzed; A temperature control module, which is used to obtain the temperature cooling coefficient of the module structure area to be analyzed according to the overall complexity; Based on the cooling coefficient, perform temperature control on the module structure area to be analyzed.

2. The high-efficiency temperature control system for die-casting forming of a structural component of a new energy vehicle according to claim 1, wherein The specific method for obtaining several module structure areas in the infrared imaging image includes: For the infrared imaging image of the die-cast product at any moment, perform edge detection on the infrared imaging image, and take the area formed by the closed edge as the module structure area.

3. The high-efficiency temperature control system for die-casting forming of a structural part of a new energy vehicle according to claim 1, characterized in that, The specific method for obtaining the segmentation uniformity of each module structure area according to the distribution of edge pixel points and the area change of the module structure area at different moments includes: According to the distribution of edge pixel points of the module structure area at different moments, obtain the edge distribution similarity of each module structure area; According to the area change of the v-th module structure area in the infrared imaging image of the die-cast product at different moments, obtain the area similarity of the v-th module structure area; Take the normalized value of the product between the area similarity of the v-th module structure area and the edge distribution similarity of the v-th module structure area as the segmentation uniformity of the v-th module structure area.

4. The high-efficiency temperature control system for die-casting forming of a structural part of a new energy vehicle according to claim 3, characterized in that, The specific method for obtaining the edge distribution similarity of each module structure area according to the distribution of edge pixel points of the module structure area at different moments includes: Denote the sequence composed of the position coordinates of all edge pixel points of the v-th module structure area in the infrared imaging image of the die-cast product at the i-th moment as the edge distribution sequence of the v-th module structure area in the infrared imaging image of the die-cast product at the i-th moment; use the DTW algorithm to obtain the DTW value between the edge distribution sequence of the v-th module structure area in the infrared imaging image of the die-cast product at the i-th moment and the edge distribution sequence of the v-th module structure area in the infrared imaging image of the die-cast product at the i+1-th moment, and denote it as the edge distribution similarity factor of the v-th module structure area in the infrared imaging image of the die-cast product at the i-th moment; The mean of the edge distribution similarity factors of the v-th module structure region in the infrared imaging images of the mold product at all times is denoted as the edge distribution similarity mean of the v-th module structure region; the absolute value of the difference between the edge distribution similarity factor of the v-th module structure region in the infrared imaging image of the mold product at the i-th time and the edge distribution similarity mean of the v-th module structure region is denoted as the similarity difference value of the v-th module structure region in the infrared imaging image of the mold product at the i-th time; the inverse normalization value of the similarity difference values of the v-th module structure region in the infrared imaging images of the mold product at all times is denoted as the edge similarity value of the v-th module structure region. The product of the edge distribution similarity mean of the v-th module structure region and the edge similarity value of the v-th module structure region is used as the edge distribution similarity of the v-th module structure region.

5. The high-efficiency temperature control system for die-casting forming of a structural part of a new energy vehicle according to claim 3, wherein, The specific method for obtaining the area proximity degree of the v-th module structure region according to the area change situation of the v-th module structure region in the infrared imaging images of the mold product at different times includes: The set composed of the position coordinates of all pixel points in the v-th module structure region in the infrared imaging image of the mold product at the i-th time is denoted as the position distribution set of the v-th module structure region in the infrared imaging image of the mold product at the i-th time; the union of the position distribution sets of the v-th module structure region in the infrared imaging images of the mold product at all times is denoted as the overall position distribution set of the v-th module structure region; the intersection of the position distribution sets of the v-th module structure region in the infrared imaging images of the mold product at all times is denoted as the main position distribution set of the v-th module structure region; the ratio between the number of all elements in the main position distribution set of the v-th module structure region and the number of all elements in the overall position distribution set of the v-th module structure region is denoted as the area proximity degree of the v-th module structure region.

6. The high-efficiency temperature control system for die-casting forming of a structural component of a new energy vehicle according to claim 1, wherein, The specific method for obtaining the internal complexity of the module structure region to be analyzed by analyzing the internal temperature change situation within different temperature clustering clusters and the internal temperature drop situation of the module structure region to be analyzed at adjacent times includes: By analyzing the internal temperature change situation within different temperature clustering clusters in the module structure region to be analyzed, the internal temperature difference of each module structure region to be analyzed is obtained. The absolute value of the difference between the mean of the temperature values of all pixel points in the z-th module structure region to be analyzed in the infrared imaging image of the mold product at the i-th time and the mean of the temperature values of all pixel points in the z-th module structure region to be analyzed in the infrared imaging image of the mold product at the i + 1-th time is denoted as the temperature drop difference of the z-th module structure region to be analyzed in the infrared imaging image of the mold product at the i-th time. The mean of the temperature decrease differences of the z-th module structure area to be analyzed in the infrared imaging images of the mold product at all times is denoted as the mean temperature decrease of the z-th module structure area to be analyzed; the absolute value of the difference between the temperature decrease difference of the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the i-th time and the mean temperature decrease of the z-th module structure area to be analyzed is denoted as the internal complexity factor of the z-th module structure area in the infrared imaging image of the mold product at the i-th time. The product of the sum of the internal complexity factors of the z-th module structure area to be analyzed in the infrared imaging images of the mold product at all times and the internal temperature difference of the z-th module structure area to be analyzed is taken as the internal complexity degree of the z-th module structure area to be analyzed.

7. The high-efficiency temperature control system for die-casting forming of a structural part of a new energy vehicle according to claim 6, wherein The specific method for obtaining the internal temperature difference of each module structure area to be analyzed by analyzing the internal temperature change conditions of different temperature clustering clusters in the module structure area to be analyzed includes: The mean of the temperature values of all pixel points in the q-th temperature clustering cluster in the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the i-th time is denoted as the mean temperature of the q-th temperature clustering cluster; the absolute value of the difference between the maximum value of the temperature values of all pixel points in the q-th temperature clustering cluster and the mean temperature of the q-th temperature clustering cluster is denoted as the temperature difference value of the q-th temperature clustering cluster; the product of the sum of the temperature difference values of all temperature clustering clusters in the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the i-th time and the number of all temperature clustering clusters in the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the i-th time is denoted as the temperature difference factor of the z-th module structure area to be analyzed in the infrared imaging image of the mold product at the i-th time; the mean of the temperature difference factors of the z-th module structure area to be analyzed in the infrared imaging images of the mold product at all times is taken as the internal temperature difference of the z-th module structure area to be analyzed.

8. The high-efficiency temperature control system for die-casting forming of a structural part of a new energy vehicle according to claim 1, wherein, The specific method for obtaining the structural complexity of the module structure area to be analyzed according to the internal temperature difference situation between adjacent module structures areas to be analyzed includes: All adjacent module structure areas of the z-th module structure area to be analyzed are obtained and are all denoted as the adjacent module structure areas of the z-th module structure area to be analyzed. For any one of the adjacent module structure areas of the z-th module structure area to be analyzed, the absolute value of the difference between the mean of the temperatures of all pixel points in the any one of the adjacent module structure areas and the mean of the temperatures of all pixel points in the z-th module structure area to be analyzed is denoted as the adjacent temperature difference of the any one of the adjacent module structure areas. The normalized value of the product of the sum of the adjacent temperature differences of all adjacent module structure areas of the z-th module structure area to be analyzed and the number of all adjacent module structure areas of the z-th module structure area to be analyzed is denoted as the structural complexity of the z-th module structure area to be analyzed.

9. The high-efficiency temperature control system for die-casting forming of a structural component of a new energy vehicle according to claim 1, wherein The method for obtaining the overall complexity of the structural area of the module to be analyzed according to the structural complexity and internal complexity includes the following steps: Denote the sum of 1 and the structural complexity of the z-th structural area of the module to be analyzed as the structural complexity factor; denote the normalized value of the product between the structural complexity factor and the internal complexity of the z-th structural area of the module to be analyzed as the overall complexity of the z-th structural area of the module to be analyzed.

10. The high-efficiency temperature control system for die-casting forming of a structural part of a new energy vehicle according to claim 1, wherein, The method for obtaining the temperature cooling coefficient of the structural area of the module to be analyzed according to the overall complexity includes the following steps: Denote the difference between the average temperature of all pixel points in the z-th structural area of the module to be analyzed and the minimum temperature of all pixel points in the z-th structural area of the module to be analyzed as the first difference; denote the difference between the maximum temperature of all pixel points in the z-th structural area of the module to be analyzed and the minimum temperature of all pixel points in the z-th structural area of the module to be analyzed as the second difference; denote the ratio between the first difference and the second difference as the internal high temperature degree of the z-th structural area of the module to be analyzed. Denote the sum of 1 and the overall complexity of the z-th structural area of the module to be analyzed as the cooling factor; take the product of the internal high temperature degree of the z-th structural area of the module to be analyzed and the cooling factor as the temperature cooling coefficient of the z-th structural area of the module to be analyzed.

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