A precision part polishing device

Abstract

This invention relates to the field of grinding and polishing equipment technology, and discloses a precision parts grinding device, including a polishing head sleeve assembly. A polishing head assembly is movably connected to the inner side of the polishing head sleeve assembly. The polishing head sleeve assembly includes an upper tube shell, and a lower tube shell is rotatably connected to the bottom of the upper tube shell. An annular plate is rotatably sleeved on the middle of the side of the lower tube shell. Four centrifugal components are fixedly connected to the bottom of the annular plate. The polishing head assembly includes a first motor, which consists of a body and a shaft. A gear is fixedly sleeved on the side of the middle of the shaft. The gear meshes with the inner side of the lower tube shell. The first motor drives the gear and the lower tube shell to rotate. The lower tube shell generates centrifugal force to separate the four centrifugal components outward. After the lower tube shell stops rotating, the annular plate continues to rotate due to inertia, and the four centrifugal components gradually lose centrifugal force and rotate to gather and clean the debris.

Description

Technical Field

[0001] This invention relates to the field of grinding and polishing equipment technology, and more specifically to a precision parts grinding device. Background Technology

[0002] Wafers are the core carrier for manufacturing semiconductor chips and one of the most important precision components in modern industry. They hold a crucial position in the semiconductor industry and are the basic material for chip manufacturing. All chip manufacturing processes are carried out on or inside the wafer surface, and its quality and performance directly affect the yield, performance, and reliability of the chip. The surface flatness of the wafer is one of the standards for measuring wafer quality. CMP polishing machines are key equipment for achieving global planarization of the wafer surface in semiconductor manufacturing. However, CMP polishing machines generate particulate contaminants such as silicon chips and metal chips during the polishing process. If these particles are not removed in a timely and effective manner, they will adhere to the wafer surface, leading to performance defects such as short circuits and leakage, and reducing the yield of the chip. To address these issues, we propose a precision component grinding device. Summary of the Invention

[0003] In order to overcome the above-mentioned defects of the prior art, the present invention provides a precision parts grinding device to solve the problems existing in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a precision parts grinding device, comprising a polishing head sleeve assembly, wherein a polishing head assembly is movably connected to the inner side of the polishing head sleeve assembly, the polishing head sleeve assembly includes an upper tube shell, a lower tube shell is rotatably connected to the bottom of the upper tube shell, an annular plate is rotatably sleeved on the middle of the side of the lower tube shell, the lower tube shell drives the annular plate in one direction, and four centrifugal components are fixedly connected to the bottom of the annular plate.

[0005] The polishing head assembly includes a first motor, which consists of a body and a shaft. A gear is fixedly sleeved on the side of the middle part of the shaft, and the gear meshes with the inner side of the lower tube shell.

[0006] The first motor drives the gear and the lower tube shell to rotate. The lower tube shell generates centrifugal force to separate the four centrifugal components outward. After the lower tube shell stops rotating, the annular plate continues to rotate due to inertia, and the four centrifugal components gradually lose centrifugal force and rotate to gather and clean the debris.

[0007] Furthermore, the lower tube shell is connected to the annular plate via a ratchet mechanism.

[0008] Furthermore, a gear tooth is fixedly connected to the inner side of the top end of the lower tube shell for meshing and rotation, and an inner circular tube is fixedly connected to the inner side of the bottom end of the lower tube shell. The lower tube shell and the inner circular tube form an annular space. The bottom of the lower tube shell is provided with six circular holes, and the inner side of the inner circular tube is provided with six square holes.

[0009] Furthermore, the centrifugal assembly includes a slide rail element, a first spring is fixedly connected to the inner side of one end of the slide rail element, a slider is fixedly connected to the other end of the first spring, the first spring is located in the inner cavity of the slide rail element, the slider moves in the inner cavity of the slide rail element, a connecting assembly is fixedly connected to the bottom of the slider, a chip collecting fan shell is fixedly connected to one end of the connecting assembly, a rectangular opening is provided at the top of the chip collecting fan shell, a brush is provided in the rectangular opening and fixedly connected to the chip collecting fan shell, and the top of the slide rail element is fixedly connected to the bottom of the annular plate.

[0010] Furthermore, a fan blade is fixedly sleeved on the side of the middle part of the machine shaft, and the gear and the fan blade do not contact each other. A wafer adsorption head is fixedly connected to the bottom end of the first motor.

[0011] A connecting rod is fixedly connected to the middle of the top of the first motor. A first round tube is movably sleeved on the side of the top of the connecting rod. An air pump is fixedly connected to the top of the first round tube. A fixing plate is fixedly sleeved on the side of the first round tube.

[0012] Furthermore, the bottom of the wafer adsorption head is provided with adsorption holes.

[0013] Furthermore, a machine tool assembly is fixedly connected to the side of the top of the polishing head assembly, and a worktable assembly is fixedly connected to the top of the machine tool assembly.

[0014] Furthermore, the machine tool assembly includes a mounting platform, the top of which is fixedly connected to two connecting plates, and the tops of the two connecting plates are fixedly connected to a fixing plate.

[0015] Furthermore, the workbench assembly includes a rotary cylinder shell, a second circular tube is fixedly connected to the inner side of the bottom of the rotary cylinder shell, a movable rod is movably sleeved on the inner side of the top of the second circular tube, a second spring is fixedly connected to the bottom of the movable rod, a second motor is fixedly connected to the top of the movable rod, a polishing disc is fixedly connected to the top of the second motor, and a polishing pad is fixedly connected to the top of the polishing disc.

[0016] Furthermore, the bottom of the rotating cylinder shell is fixedly connected to the middle of the top of the mounting platform, a water pump is fixedly connected to one side of the top of the mounting platform, a connecting pipe is fixedly connected to one side of the water pump, a connecting water pipe is fixedly connected to the top of the water pump, and an infusion pipe is fixedly connected to one end of the connecting water pipe, with the infusion pipe located above the polishing pad.

[0017] The technical effects and advantages of this invention are as follows:

[0018] 1. A gear is connected to the motor shaft in the polishing head. The meshing action between the gear and the lower housing causes the motor to rotate the lower housing. The rotation of the lower housing generates centrifugal force, causing the chip collection fan housing to move towards the outer edge, thus opening up space for the polishing head to move downwards for polishing. After the wafer is polished, the motor stops running, but the annular plate continues to rotate under inertia, with the speed gradually decreasing. This gradually reduces the centrifugal force on the chip collection fan housing. The chip collection fan housing rotates while being brought together by the spring, allowing the brushes on the chip collection fan housing to clean particulate contaminants such as silicon chips and metal chips from the wafer surface when they come into contact with the wafer. These particles are then collected into the chip collection fan housing, preventing them from adhering to the wafer surface and causing short circuits or leakage in the chip, thereby improving the chip yield.

[0019] 2. When the polishing head is polishing, the motor generates a lot of heat as it overcomes the weight of the polishing head and the huge resistance from the polishing pad. This heat is spread to the lower housing by the downward airflow generated by the rotation of the fan blades, and then transferred to the polishing slurry on the surface of the polishing pad through the round hole of the lower housing. This increases the reaction temperature between the polishing slurry and the wafer, promotes the wafer oxidation reaction rate, and thus improves the polishing efficiency. When polishing is complete, the wafer returns to the lower housing with the polishing head, which opens the square hole on the inner side of the bottom of the lower housing to discharge the remaining heat and dry the wafer surface.

[0020] 3. As the centrifugal force on the centrifugal assembly gradually decreases, the chip collection fan housing gradually rotates and gathers. The airflow generated by the fan blades is discharged from the round hole at the bottom of the lower tube housing, blowing the debris particles brushed off by the brush on the chip collection fan housing, causing the particles to gather inward. The polishing head returns to the inside of the lower tube housing, causing the square hole on the inner side of the bottom of the lower tube housing to open, and the airflow is also discharged from the square hole. Under the combined action of the airflow discharged from the round hole and the square hole, the debris particles are blown into the chip collection fan housing. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the polishing head sleeve assembly structure of the present invention;

[0023] Figure 3 This is a schematic cross-sectional view of the casing assembly of the present invention;

[0024] Figure 4 This is a schematic diagram of a single cross-sectional structure of the centrifuge assembly of the present invention;

[0025] Figure 5 This is a schematic diagram of the polishing head assembly structure of the present invention;

[0026] Figure 6This is a schematic diagram of the adsorption wafer position structure of the present invention;

[0027] Figure 7 This is a schematic diagram of the machine tool component structure of the present invention;

[0028] Figure 8 This is a schematic diagram of the workbench assembly structure of the present invention;

[0029] Figure 9 This is a schematic cross-sectional view of the workbench assembly of the present invention;

[0030] Figure 10 This is a schematic cross-sectional view of the chip collection fan shell of the present invention.

[0031] The reference numerals in the attached figures are as follows: 1. Polishing head sleeve assembly; 101. Upper tube shell; 102. Lower tube shell; 103. Annular plate; 104. Centrifugal assembly; 1041. Slide rail element; 1042. First spring; 1043. Slider; 1044. Connecting assembly; 1045. Chip collection fan shell; 2. Polishing head assembly; 201. First motor; 202. Gear; 203. Fan blade; 204. Wafer adsorption head; 205. Connecting rod; 206. First circular tube; 207. Air pump; 3. Machine tool assembly; 301. Mounting platform; 302. Connecting plate; 303. Fixing plate; 4. Workbench assembly; 401. Rotary cylinder shell; 402. Second circular tube; 403. Movable rod; 404. Second spring; 405. Second motor; 406. Polishing disc; 407. Polishing pad; 408. Infusion tube; 409. Connecting water pipe; 410. Water pump; 411. Connecting pipe port. Detailed Implementation

[0032] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. In addition, the forms of the various structures described in the following embodiments are merely illustrative. The precision parts grinding apparatus of the present invention is not limited to the structures described in the following embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] Reference Figure 1 The present invention provides a precision parts grinding device, including a polishing head sleeve assembly 1, a polishing head assembly 2 movably connected to the inner side of the polishing head sleeve assembly 1, a machine tool assembly 3 fixedly connected to the side of the top of the polishing head assembly 2, and a worktable assembly 4 fixedly connected to the top of the machine tool assembly 3.

[0034] In this embodiment, it is necessary to further explain that the polishing head sleeve assembly 1 uses the rotation of the motor-driven assembly to generate centrifugal force, thereby moving the brush. When the brush comes into contact with the wafer, it cleans the wafer surface, preventing these particles from causing short circuits or leakage in the chip, thus improving the chip yield. The function of the polishing head assembly 2 is to increase the reaction temperature between the polishing slurry and the wafer, promote the wafer oxidation reaction rate and thus improve polishing efficiency, dry the wafer surface to prevent water stains from appearing on the wafer surface and affecting quality, and also to dissipate heat for the motor. The specific structure and working principle of the above components will be explained in detail later.

[0035] Reference Figure 2 The polishing head sleeve assembly 1 includes an upper tube shell 101, a lower tube shell 102 rotatably connected to the bottom of the upper tube shell 101, an annular plate 103 rotatably sleeved on the middle of the side of the lower tube shell 102, and four centrifugal components 104 fixedly connected to the bottom of the annular plate 103.

[0036] In this embodiment, it is necessary to further explain that the lower tube shell 102 and the annular plate 103 are connected by a ratchet mechanism, so that the lower tube shell 102 drives the annular plate 103 in one direction. When the lower tube shell 102 stops rotating, the annular plate 103 continues to rotate due to inertia and the speed gradually decreases until it stops. The ratchet mechanism is existing technology and will not be described in detail. The four centrifugal components 104 are fixedly connected to the front, back, left and right ends of the bottom of the annular plate 103 and are evenly distributed.

[0037] Reference Figure 3 The inner side of the top end of the lower tube shell 102 is fixedly connected with gear teeth for meshing and rotation, and the inner side of the bottom end of the lower tube shell 102 is fixedly connected with an inner circular tube. The lower tube shell 102 and the inner circular tube form an annular space. The bottom of the lower tube shell 102 is provided with six circular holes, and the inner side of the inner circular tube is provided with six square holes.

[0038] In this embodiment, it should be specifically explained that the round holes are used to transfer heat during wafer polishing to improve the reaction rate, while the square holes are used to dry the wafer after polishing.

[0039] Reference Figure 4The centrifugal assembly 104 includes a slide rail element 1041. A first spring 1042 is fixedly connected to the inner side of one end of the slide rail element 1041. A slider 1043 is fixedly connected to the other end of the first spring 1042. The first spring 1042 is located in the inner cavity of the slide rail element 1041. The slider 1043 moves within the inner cavity of the slide rail element 1041. A connecting assembly 1044 is fixedly connected to the bottom of the slider 1043. A chip collecting fan shell 1045 is fixedly connected to one end of the connecting assembly 1044. A rectangular opening is provided at the top of the chip collecting fan shell 1045. A brush is provided in the rectangular opening and fixedly connected to the chip collecting fan shell 1045. The brush divides the rectangular opening into two parts, and the openings on both sides of the brush are the same size. The top of the slide rail element 1041 is fixedly connected to the bottom of the annular plate 103.

[0040] In this embodiment, it is necessary to further explain that the four chip collection fan shells 1045 are located at the lower opening of the lower casing 102. The meshing of the gear teeth of the lower casing 102 and the gear 202 drives the motor to rotate the lower casing 102. The centrifugal force of the rotating lower casing 102 causes the chip collection fan shells 1045 to move outward, thereby opening the bottom opening of the lower casing 102. After the wafer polishing is completed, the motor stops running, while the annular plate 103 continues to rotate under the action of the ratchet mechanism and inertia, and the speed gradually decreases. As a result, the centrifugal force of the chip collection fan shells 1045 gradually decreases. The chip collection fan shells 1045 rotate while converging under the action of the first spring 1042, so that when the brushes of the chip collection fan shells 1045 come into contact with the wafer, they clean the silicon chips, metal chips and other particulate contaminants on the wafer surface and collect the debris particles into the chip collection fan shells 1045. This prevents these particles from adhering to the wafer surface, causing short circuits and leakage of the chip, and improves the chip yield.

[0041] Reference Figure 10 The bottom ends of the brush are rotatably connected to shafts, and fan blades are fixedly connected to the sides of the two shafts.

[0042] In this embodiment, it is necessary to further explain that the brush structure consists of an upper part with fine bristles and a lower part with a handle that holds the fine bristles. A rotating shaft is rotatably connected to the bottom of the handle. One-way tubes are fixedly installed on both sides of the rectangular opening at the top of the chip collector 1045. A filter screen is installed at the opening of the one-way tube facing the inside of the chip collector 1045. The one-way tube is used to discharge airflow from inside the chip collector 1045 while preventing debris leakage. The one-way tube structure is conventional and will not be described in detail or shown in the accompanying drawings. After debris particles enter the chip collector 1045, the airflow flows within the chip collector 1045, causing the fan blades to block the rectangular opening. To prevent impurities from being carried out, the airflow in the chip collector fan housing 1045 is discharged through a one-way pipe. Without wind force, the fan blades fall and reset. Additionally, it should be noted that in practice, the airflow flowing towards the rectangular opening at the top of the chip collector fan housing 1045 is greater than the airflow entering the interior of the chip collector fan housing 1045. During the rotation of the chip collector fan housing 1045, debris will not be discharged from the rectangular opening. Debris discharge from the rectangular opening only occurs when the chip collector fan housing 1045 stops rotating, but residual airflow remains in the chip collector fan housing 1045. This residual airflow poses a risk of carrying debris out. Therefore, this invention designs the fan blades to prevent debris discharge.

[0043] Reference Figure 5 The polishing head assembly 2 includes a first motor 201, which consists of a body and a shaft. A gear 202 is fixedly sleeved on the side of the middle part of the shaft, and a fan blade 203 is rotatably sleeved on the side of the middle part of the shaft. The fan blade 203 is connected to the motor shaft through a ratchet mechanism. The gear 202 and the fan blade 203 do not contact each other. A wafer adsorption head 204 is fixedly connected to the bottom end of the first motor 201. A connecting rod 205 is fixedly connected to the middle of the top of the first motor 201. A first round tube 206 is movably sleeved on the side of the top of the connecting rod 205. An air pump 207 is fixedly connected to the top of the first round tube 206. A fixing plate 303 is fixedly sleeved on the side of the first round tube 206.

[0044] In this embodiment, it is necessary to specifically explain that the gear 202 meshes with the teeth of the lower tube shell 102, thereby achieving synchronous rotation of the gear 202 and the lower tube shell 102. The ratchet mechanism enables the motor shaft to drive the fan blade 203 in one direction. The ratchet mechanism is existing technology and will not be described in detail here. The air pump 207 pressurizes and depressurizes the first circular tube 206 to achieve the extension and retraction of the connecting rod 205, thereby achieving the purpose of extending and retracting the wafer adsorption head 204. When the polishing head is polishing, the motor shaft drives the fan blade 203 to rotate, generating a downward airflow. The heat generated by the motor operation is spread with the airflow to The bottom of the lower housing 102 is attached to the polishing platform during wafer polishing. Heat is transferred to the polishing slurry through the round hole at the bottom of the lower housing 102, which increases the reaction temperature between the polishing slurry and the wafer, promotes the wafer oxidation reaction rate and thus improves the polishing efficiency. When polishing is completed, the wafer returns to the interior of the lower housing 102 with the wafer adsorption head 204, which opens the square hole on the inner side of the bottom of the lower housing 102 to discharge the remaining heat, dry the wafer surface and prevent water stains from appearing on the wafer surface, which would affect the quality. In addition, the fan blades 203 generate airflow to cool the first motor 201.

[0045] As the centrifugal force on the centrifugal assembly 104 gradually decreases, the chip collection fan housing 1045 gradually rotates and gathers the debris. The airflow generated by the fan blades 203 is discharged from the round hole at the bottom of the lower tube housing 102, blowing the debris particles brushed off by the brush on the chip collection fan housing 1045, causing the particles to gather inward. The polishing head returns to the interior of the lower tube housing 102, so that the square hole on the inner side of the bottom of the lower tube housing 102 opens, and the airflow is also discharged from the square hole. Under the combined action of the airflow discharged from the round hole and the square hole, the debris particles are blown into the chip collection fan housing 1045.

[0046] Reference Figure 6 The bottom of the wafer adsorption head 204 is provided with an adsorption hole.

[0047] In this embodiment, it is necessary to further explain that the adsorption holes are used for vacuum adsorption, and the wafer adsorption head 204 uses vacuum to adsorb wafers. The vacuum adsorption structure is existing technology and will not be described in detail here.

[0048] Reference Figure 7 The machine tool assembly 3 includes a mounting platform 301, the top of which is fixedly connected to two connecting plates 302, and the top of the two connecting plates 302 is fixedly connected to a fixing plate 303.

[0049] Reference Figure 8 and Figure 9The workbench assembly 4 includes a rotary cylinder shell 401. A second circular tube 402 is fixedly connected to the inner side of the bottom of the rotary cylinder shell 401. A movable rod 403 is movably sleeved on the inner side of the top of the second circular tube 402. A second spring 404 is fixedly connected to the bottom of the movable rod 403. A second motor 405 is fixedly connected to the top of the movable rod 403. A polishing disc 406 is fixedly connected to the top of the second motor 405. A polishing pad 407 is fixedly connected to the top of the polishing disc 406. The bottom of the rotary cylinder shell 401 is fixedly connected to the middle of the top of the mounting platform 301. A water pump 410 is fixedly connected to one side of the top of the mounting platform 301. A connecting pipe port 411 is fixedly connected to one side of the water pump 410. A connecting water pipe 409 is fixedly connected to the top of the water pump 410. One end of the connecting water pipe 409 is fixedly connected to an infusion pipe 408. The infusion pipe 408 is located above the polishing pad 407.

[0050] In this embodiment, it is necessary to specifically explain that during the wafer polishing process, the first motor 201 starts first. When the centrifugal force causes the centrifugal component 104 to expand, the water pump 410 starts to deliver polishing liquid. Then, the second motor 405 starts to rotate the polishing disc 406. Finally, the air pump 207 runs to perform polishing.

[0051] The working principle of this invention is as follows: During wafer polishing, the first motor 201 starts first, and the gear 202 meshes with the inner side of the lower housing 102, causing the lower housing 102 to rotate with the gear 202. The centrifugal force of the rotating lower housing 102 causes the chip collecting fan housing 1045 to move outward, thereby opening the bottom opening of the lower housing 102. The fan blade 203 rotates, generating a downward airflow. The heat generated by the motor operation is transferred to the lower housing 102 with the airflow. The lower housing 102 adheres to the polishing pad 407 during wafer polishing, and the heat is transferred to the polishing fluid through the circular hole at the bottom of the lower housing 102, increasing the reaction temperature between the polishing fluid and the wafer, promoting the wafer oxidation reaction rate, and thus improving the polishing efficiency. When the wafer polishing is completed, the motor stops running, but the annular plate 103 and the fan blade 203 continue to rotate under the action of the ratchet mechanism and inertia, and the speed gradually decreases, thereby gradually reducing the centrifugal force of the chip collecting fan housing 1045. The small, small chip collecting fan housing 1045 rotates while being gathered together by the first spring 1042. This allows the brush in the chip collecting fan housing 1045 to brush off particulate contaminants such as silicon chips and metal chips from the wafer surface when it comes into contact with the wafer, preventing these particles from adhering to the wafer surface and causing short circuits or leakage in the chip, thereby improving the chip yield. The airflow generated by the fan blade 203 is discharged from the round hole at the bottom of the lower housing 102, blowing the debris particles brushed off by the brush on the chip collecting fan housing 1045, causing the particles to gather inward. The polishing head returns to the interior of the lower housing 102, causing the square hole on the inner side of the bottom of the lower housing 102 to open, and the airflow is also discharged from the square hole. Under the combined action of the airflow discharged from the round hole and the square hole, the debris particles are blown into the chip collecting fan housing 1045, while the remaining heat is discharged, drying the wafer surface and preventing water stains from appearing on the wafer surface. At the same time, the airflow generated by the fan blade 203 has a heat dissipation effect on the first motor 201.

[0052] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can be mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change.

[0053] Secondly: The accompanying drawings of the embodiments disclosed in this invention only involve the structures involved in the embodiments disclosed in this invention. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this invention can be combined with each other.

[0054] In conclusion, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A precision parts grinding apparatus, comprising a polishing head sleeve assembly (1), wherein a polishing head assembly (2) is movably connected to the inner side of the polishing head sleeve assembly (1), characterized in that, The polishing head sleeve assembly (1) includes an upper tube shell (101), a lower tube shell (102) is rotatably connected to the bottom of the upper tube shell (101), an annular plate (103) is rotatably sleeved on the middle of the side of the lower tube shell (102), the lower tube shell (102) drives the annular plate (103) in one direction, and four centrifugal components (104) are fixedly connected to the bottom of the annular plate (103). The polishing head assembly (2) includes a first motor (201), which is composed of a body and a shaft. A gear (202) is fixedly sleeved on the side of the middle part of the shaft, and the gear (202) meshes with the inner side of the lower tube shell (102). The first motor (201) drives the gear (202) and the lower tube shell (102) to rotate. The lower tube shell (102) generates centrifugal force to separate the four centrifugal components (104) outward. After the lower tube shell (102) stops rotating, the annular plate (103) continues to rotate due to inertia, and the four centrifugal components (104) gradually lose centrifugal force and rotate to gather and clean the debris.

2. The precision parts grinding device according to claim 1, characterized in that: The lower tube shell (102) and the annular plate (103) are connected by a ratchet mechanism.

3. The precision parts grinding device according to claim 1, characterized in that: The inner side of the top end of the lower tube shell (102) is fixedly connected with gear teeth for meshing and rotation. The inner side of the bottom end of the lower tube shell (102) is fixedly connected with an inner round tube. The lower tube shell (102) and the inner round tube form an annular space. The bottom of the lower tube shell (102) is provided with six round holes, and the inner side of the inner round tube is provided with six square holes.

4. The precision parts grinding device according to claim 1, characterized in that: The centrifugal assembly (104) includes a slide rail element (1041). A first spring (1042) is fixedly connected to the inner side of one end of the slide rail element (1041). A slider (1043) is fixedly connected to the other end of the first spring (1042). The first spring (1042) is located in the inner cavity of the slide rail element (1041). The slider (1043) moves in the inner cavity of the slide rail element (1041). A connecting assembly (1044) is fixedly connected to the bottom of the slider (1043). A chip collecting fan shell (1045) is fixedly connected to one end of the connecting assembly (1044). A rectangular opening is provided at the top of the chip collecting fan shell (1045). A brush is provided in the rectangular opening and is fixedly connected to the chip collecting fan shell (1045). The top of the slide rail element (1041) is fixedly connected to the bottom of the annular plate (103).

5. The precision parts grinding device according to claim 1, characterized in that: A fan blade (203) is fixedly sleeved on the side of the middle part of the machine shaft. The gear (202) and the fan blade (203) do not contact each other. A wafer adsorption head (204) is fixedly connected to the bottom end of the first motor (201). A connecting rod (205) is fixedly connected to the middle of the top of the first motor (201). A first round tube (206) is movably sleeved on the side of the top of the connecting rod (205). An air pump (207) is fixedly connected to the top of the first round tube (206). A fixing plate (303) is fixedly sleeved on the side of the first round tube (206).

6. The precision parts grinding apparatus according to claim 5, characterized in that: The bottom of the wafer adsorption head (204) is provided with an adsorption hole.

7. The precision parts grinding apparatus according to claim 1, characterized in that: A machine tool assembly (3) is fixedly connected to the side of the top of the polishing head assembly (2), and a worktable assembly (4) is fixedly connected to the top of the machine tool assembly (3).

8. The precision parts grinding apparatus according to claim 7, characterized in that: The machine tool assembly (3) includes a mounting platform (301), the top of which is fixedly connected to two connecting plates (302), and the top of the two connecting plates (302) is fixedly connected to a fixing plate (303).

9. A precision parts grinding apparatus according to claim 7, characterized in that: The workbench assembly (4) includes a rotary cylinder shell (401), a second round tube (402) is fixedly connected to the inner side of the bottom of the rotary cylinder shell (401), a movable rod (403) is movably sleeved on the inner side of the top of the second round tube (402), a second spring (404) is fixedly connected to the bottom of the movable rod (403), a second motor (405) is fixedly connected to the top of the movable rod (403), a polishing disc (406) is fixedly connected to the top of the second motor (405), and a polishing pad (407) is fixedly connected to the top of the polishing disc (406).

10. A precision parts grinding apparatus according to claim 9, characterized in that: The bottom of the rotating shell (401) is fixedly connected to the middle of the top of the mounting platform (301). A water pump (410) is fixedly connected to one side of the top of the mounting platform (301). A connecting pipe port (411) is fixedly connected to one side of the water pump (410). A connecting water pipe (409) is fixedly connected to the top of the water pump (410). One end of the connecting water pipe (409) is fixedly connected to an infusion pipe (408). The infusion pipe (408) is located above the polishing pad (407).

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