A modular ceramic-based composite thermal insulation tile and its design method

Abstract

The present invention proposes a modular ceramic-based composite thermal insulation tile and a design method thereof. The thermal insulation tile includes a ceramic-based outer shell, which is filled with a plurality of hollow topologically configured particles. The plurality of hollow topologically configured particles form a lattice structure particle layer and are integrally formed with the ceramic-based outer shell; the gaps between adjacent hollow topologically configured particles and the cavities inside the hollow topologically configured particles are filled with lightweight, low-thermal conductivity materials and together constitute a filling layer. The method uses finite element simulation to calculate the temperature difference between the upper and lower surfaces of the modular ceramic-based composite thermal insulation tile model, and uses it as a basis for optimizing the thickness of the filling layer. The present invention is applicable to ultra-high temperature thermal protection structures, and the thermal insulation performance is significantly improved while taking into account the goal of lightweight thermal protection structures; at the same time, the finite element method is used for structural parametric design to reduce the time period from design to application of the thermal protection structure, thereby achieving rapid optimization of the ultra-high temperature thermal protection structure.

Description

Technical Field

[0001] The present invention belongs to the field of computer material science and technology, and relates to ceramic-based composite thermal insulation materials, and in particular to a modular ceramic-based composite thermal insulation tile and a design method thereof. Background Art

[0002] Hypersonic flight experiences extreme aerodynamic heating, frictional heating, and shock wave heating. Direct contact between the surface of the aircraft and the high-speed airflow causes the surface temperature of the aircraft to rise rapidly during flight, with local temperatures reaching as high as 1800K. Conventional heat-resistant alloys cannot withstand such high temperatures. Therefore, when designing and applying thermal protection systems, thermal insulation tiles are often used to cope with extreme aerodynamic heating for aircraft, especially hypersonic aircraft.

[0003] Traditional thermal insulation tiles are typically large in size. Especially when extensive thermal protection material is required to cover aircraft surfaces, tiles may need to be several meters or even larger. This large size makes machining precision and quality control more challenging, and deformation or surface defects may occur during the manufacturing process, affecting the thermal performance and structural strength of the material. Large tiles require specialized transportation and handling equipment, and highly precise alignment during installation on the aircraft to ensure effective thermal protection, making transportation and assembly difficult. Different aircraft components (such as the nose, wings, and tail) have varying shapes, requiring different types of thermal insulation tiles to meet the thermal protection requirements of each area. Furthermore, these areas often have significant surface curvature. To ensure a tight fit between the tiles and the aircraft surface, custom processing is typically required for each tile, resulting in long production cycles and high processing costs. Thermal insulation tiles for hypersonic aircraft typically require high-precision installation, and the integration of different materials and types requires meticulous care. The installation process is complex, demanding skilled workers, and time-consuming. During the later maintenance of aircraft, thermal insulation tiles will inevitably suffer from wear, aging or damage, and need to be inspected and replaced regularly. However, due to their complex shapes and diverse materials, repair and replacement are very difficult. Summary of the Invention

[0004] In view of the defects and shortcomings of the existing technology, the purpose of the present invention is to provide a modular ceramic-based composite thermal insulation tile and a design method thereof to solve the technical problems of the thermal insulation tiles used in hypersonic aircraft in the existing technology, such as heavy weight, large size, large curvature, use of multiple materials, complex processing, high cost, and difficulty in installation and maintenance.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A modular ceramic-based composite material thermal insulation tile comprises a ceramic-based outer shell, wherein the ceramic-based outer shell is a shell with a hollow regular hexagonal prism structure.

[0007] The ceramic-based outer shell is provided with a plurality of tightly arranged hollow topological configuration particles to form a lattice structure particle layer. The material of the hollow topological configuration particles is the same as that of the ceramic-based outer shell; the gaps between adjacent hollow topological configuration particles and the cavities inside the hollow topological configuration particles are filled with lightweight, low thermal conductivity materials, and the filled lightweight, low thermal conductivity materials together constitute a filling layer.

[0008] The gaps between adjacent porous topological configuration particles and the cavities inside the porous topological configuration particles are filled with lightweight low thermal conductivity materials, and the filled lightweight low thermal conductivity materials together constitute a filling layer.

[0009] The lightweight and low thermal conductivity material is selected from one of alumina fiber and thermal insulation aerogel, or a mixture of the two in any proportion.

[0010] The present invention also has the following technical features:

[0011] Specifically, the hollow topological configuration particles are composed of six hollow topological configuration particle first unit blocks and twelve hollow topological configuration particle second unit blocks.

[0012] Specifically, the main body of the first unit block of the hollow topological configuration particles is a block with a regular octagonal prism structure, and a first hole is opened in the middle of the main body of the first unit block of the hollow topological configuration particles along the axial direction. The first hole is a hole with a rectangular structure.

[0013] Specifically, the second unit block of the hollow topological configuration particles is a block with a rectangular structure.

[0014] Specifically, the first unit block of the hollow topological configuration particles has four sides connected to the second unit block of the hollow topological configuration particles, and the four sides are not adjacent to each other, and each side is connected to a second unit block of the hollow topological configuration particles; the space enclosed by the three first unit blocks of the hollow topological configuration particles and the three second unit blocks of the hollow topological configuration particles is the second hole, and the second hole is a hole with a regular hexagonal structure.

[0015] Specifically, the side length of the ceramic-based outer shell is 100 mm, and the wall thickness of the ceramic-based outer shell is 2 mm.

[0016] Specifically, the particle size of the hollow topological configuration particles is 8mm to 26mm, the thickness of the hollow topological configuration particle filling layer structure is 8mm to 26mm, and the thickness of the filling layer is equal to the particle size filling layer of the hollow topological configuration particles.

[0017] Specifically and preferably, the porosity of the lattice structure particle layer is 78.4%.

[0018] Most preferably and optionally, when the overall thickness of the modular ceramic-based composite insulation tile is 20 mm, the particle size of the hollow topological configuration particles is 16 mm, the thickness of the filling layer is 16 mm, and the lightweight and low thermal conductivity material is alumina fiber, it can meet the cooling requirement of 500°C.

[0019] Most preferably and optionally, when the overall thickness of the modular ceramic-based composite insulation tile is 22 mm, the particle size of the hollow topological configuration particles is 18 mm, the thickness of the filling layer is 18 mm, and the lightweight and low thermal conductivity material is insulating aerogel, it can meet the cooling requirement of 500°C.

[0020] Specifically, the modular ceramic-based composite material thermal insulation tile is suitable for ultra-high temperature environments greater than or equal to 1500°C.

[0021] The present invention also protects a method for designing the modular ceramic matrix composite thermal insulation tile described above. The method uses finite element simulation to calculate the temperature difference between the upper and lower surfaces of a modular ceramic matrix composite thermal insulation tile model, and uses this temperature difference as a basis for optimizing the structural parameters of the modular ceramic matrix composite thermal insulation tile. The method specifically comprises the following steps:

[0022] Step 1: Determine the structural parameters and materials:

[0023] The structural parameters include: the side length of the ceramic-based outer shell, the wall thickness of the ceramic-based outer shell, the particle size of the porous topological configuration particles, the thickness of the filling layer and the porosity of the lattice structure particle layer.

[0024] Step 2: Create a geometric model:

[0025] In the modeling software, a geometric model of the ceramic-based outer shell and a geometric model of a single hollow topological configuration particle are constructed, and several hollow topological configuration particles are tightly arranged to form a lattice structure particle layer. The geometric model of the lightweight and low thermal conductivity material is filled between the gaps between adjacent hollow topological configuration particles and in the cavities inside the hollow topological configuration particles to obtain the geometric model of the filling layer; the geometric models of the ceramic-based outer shell, the lattice structure particle layer and the filling layer are combined together to obtain a modular ceramic-based composite material insulation tile model.

[0026] Step 3: Parameter optimization design:

[0027] Based on the geometric model of the modular ceramic-based composite thermal insulation tile established in step 2, in the modeling software, combined with the structural parameters of step 1, the optimization range of the input parameters is set; specifically, the optimization range of the input parameters is: the particle size of the porous topological configuration particles is 8mm~26mm, the thickness of the filling layer is 8mm~26mm, and the overall thickness of the modular ceramic-based composite thermal insulation tile is set to 12mm~30mm.

[0028] Step 4: Perform entity mesh division:

[0029] In the finite element software, the various components of the model are divided into tetrahedral meshes. When dividing, the mesh encryption option is inserted in the mesh settings, and the encryption surface is selected as the filling layer and the lightweight low thermal conductivity material filling layer, and the mesh is updated. Specifically, when performing mesh encryption, the encryption cycle value is set to 3.

[0030] Step 5: Set boundary conditions:

[0031] In the finite element software, a temperature boundary was applied to the upper surface of the ceramic-based housing, and a thermal radiation condition was set on the upper surface of the ceramic-based housing. Specifically, the temperature boundary applied to the upper surface of the ceramic-based housing was 1300°C. A surface-to-ambient thermal radiation condition was set on the upper surface of the ceramic-based housing with an emissivity of 0.8 and an ambient temperature of 22°C. The lower surface and side surfaces of the ceramic-based housing were set as adiabatic boundaries.

[0032] Step 6: Determine parameter variables and calculation scale:

[0033] In the finite element software, the output parameters are set as follows: the maximum temperature of the lower surface of the ceramic-based shell, the minimum temperature of the lower surface of the ceramic-based shell, and the average temperature of the lower surface of the ceramic-based shell. Based on the size restrictions of the usage scenario and according to the optimization range of the input parameters in step three, calculations are performed every 1 mm.

[0034] Step 7: Calculate thermal insulation performance:

[0035] The maximum temperature of the lower surface of the ceramic-based outer shell, the minimum temperature of the lower surface of the ceramic-based outer shell, and the average temperature of the lower surface of the ceramic-based outer shell are calculated and obtained in the finite element software.

[0036] Step 8: Determine the thickness of the filling layer:

[0037] Based on the calculation results in step seven, calculate the temperature difference between the upper and lower surfaces of the modular ceramic-based composite thermal insulation tile model, that is, subtract the maximum temperature of the lower surface of the ceramic-based outer shell from the temperature of the upper surface of the ceramic-based outer shell; based on the temperature difference between the upper and lower surfaces of the modular ceramic-based composite thermal insulation tile model, finally determine the thickness of the filling layer.

[0038] Compared with the prior art, the present invention has the following beneficial technical effects:

[0039] (I) The modular ceramic-based composite thermal insulation tiles designed in this invention are suitable for ultra-high temperature (≥1500°C) thermal protection structures. These tiles are regular hexagonal in shape and uniform in size. The uniformly sized modular insulation structure allows for large-scale, batch-by-batch production, significantly reducing both economic and time costs. Furthermore, the modular insulation structure's uniform specifications and consistent installation process over large areas reduce installation difficulty and worker skill requirements, avoiding assembly issues caused by varying worker skill levels while enabling rapid installation.

[0040] (II) Since the modular ceramic-based composite material thermal insulation tiles designed in the present invention are arranged in a regular hexagonal honeycomb pattern with multiple points tightly connected and densely laid, and are connected with six adjacent pieces to form a multi-point interlocking structure, the overall structural stability under aerodynamic load is improved; in addition, since the present invention uses a filling layer made of a lightweight and low thermal conductivity material and a high porosity (porosity greater than 75%) lattice structure particle layer, it can improve the thermal insulation performance while taking into account low cost and lightweight, so as to meet the current development trend of ultra-high temperature thermal protection structures.

[0041] (III) The present invention adopts the finite element method to design modular ceramic matrix composite thermal insulation tiles, which not only reduces the cost of material development and testing, but also analyzes the influence of different input variables on the thermal insulation performance of modular ceramic matrix composite thermal insulation tiles by utilizing the parametric model method; in addition, structural design using the finite element method can also reduce the time cycle from material design to application, thereby achieving rapid optimization of modular ceramic matrix composite thermal insulation tiles. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 Schematic diagram of the structure of modular ceramic matrix composite insulation tiles.

[0043] Figure 2 Schematic diagram of the filling layer structure.

[0044] Figure 3 Schematic diagram of the structure of particles with a hollow topological configuration.

[0045] Figure 4 Schematic diagram of the structure of a lattice structured particle layer composed of particles with a hollow topological configuration.

[0046] Figure 5 Graph showing thermal insulation performance of Example 2 and Example 3; Figure 5 Middle: The horizontal axis is the overall thickness of the modular ceramic matrix composite thermal insulation tile (unit: mm), and the vertical axis is the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite thermal insulation tile model (unit: °C).

[0047] Figure 6 Schematic diagram of the modular thermal insulation tile with a cross-shaped particle lattice structure of Comparative Example 1.

[0048] Figure 7 Schematic diagram of the structure of the cross-shaped particles of Comparative Example 1.

[0049] The meanings of the numbers in the figure are: 1-ceramic-based outer shell, 2-hollow topological configuration particles, 3-filling layer, 4-lattice structure particle layer.

[0050] 101 - upper plate of outer shell, 102 - lower plate of outer shell, 103 - boundary layer plate.

[0051] 201 - the first unit block of the hollow topological configuration particle, 202 - the second unit block of the hollow topological configuration particle, 203 - the first hole, 204 - the second hole.

[0052] The technical solution of the present invention is further described below in conjunction with embodiments. DETAILED DESCRIPTION

[0053] In the present invention, the particle size of the hollow topological configuration particles 2 refers to the maximum vertical distance between two first unit blocks of the hollow topological configuration particles.

[0054] It should be noted that the software used in this invention, unless otherwise specified, is conventional software known in the art. For example, the modeling software uses the SpaceClaim module of Ansys Workbench, which is commonly known in the art. The finite element analysis software uses the Steady-State Thermal module of Ansys Workbench, which is commonly known in the art.

[0055] It should be noted that the materials mentioned in this invention, unless otherwise specified, are conventional materials known in the art. For example, alumina fiber is lightweight, fibrous aluminum oxide. Insulating aerogel is a nanoporous gel, including gelatin, gum arabic, and silica gel.

[0056] It should be noted that the present invention is a computer simulation design. In actual production, the preparation method of modular ceramic-based composite thermal insulation tiles can adopt conventional methods known in the prior art, for example: using 3D printing technology to manufacture a ceramic-based outer shell 1 without a lower plate and a lattice structure particle layer 4, and then pouring the melted alumina fiber or melted thermal insulation aerogel into the ceramic-based outer shell 1, so that the alumina fiber or thermal insulation aerogel fills the gaps in the lattice structure particle layer 4, and after the alumina fiber or thermal insulation aerogel solidifies, the pre-3D printed lower plate will be bonded with high-temperature ceramic glue, and the bonding accuracy will be guaranteed during bonding to achieve an one-piece molding effect.

[0057] In accordance with the above technical solution, specific embodiments of the present invention are given below. It should be noted that the present invention is not limited to the following specific embodiments, and all equivalent changes made on the basis of the technical solution of this application fall within the protection scope of the present invention.

[0058] Example 1:

[0059] This embodiment provides a modular ceramic matrix composite insulation tile, such as Figure 1 、 Figure 2 and Figure 4 As shown, it includes a ceramic-based outer shell 1, which is a shell with a hollow regular hexagonal prism structure; a plurality of tightly arranged hollow topological configuration particles 2 are arranged in the ceramic-based outer shell 1 and form a lattice structure particle layer 4, and the material of the hollow topological configuration particles 2 is the same as that of the ceramic-based outer shell 1; the gaps between adjacent hollow topological configuration particles 2 and the cavities inside the hollow topological configuration particles 2 are filled with lightweight and low thermal conductivity materials, and the filled lightweight and low thermal conductivity materials together constitute a filling layer 3.

[0060] As a specific solution of this embodiment, the lightweight and low thermal conductivity material is selected from one of alumina fiber and thermal insulation aerogel, or a mixture of the two in any proportion.

[0061] As a specific solution of this embodiment, Figure 1 As shown, a plurality of porous topological configuration particles 2 are arranged in a single layer.

[0062] As a specific solution of this embodiment, Figure 1 As shown, the ceramic-based outer shell 1 includes an outer shell upper plate 101 and an outer shell lower plate 102 arranged in parallel and opposite to each other. The outer shell upper plate 101 is a plate exposed to the external environment, and the outer shell lower plate 102 is a plate close to the aircraft; the outer shell upper plate 101 and the outer shell lower plate 102 are exactly the same in shape and size, and are both flat plates with a hexagonal structure; six boundary layer plates 103 are arranged between the outer shell upper plate 101 and the outer shell lower plate 102, and the closed cavity surrounded by the outer shell upper plate 101, the outer shell lower plate 102 and the six boundary layer plates 103 is a sandwich filling cavity, and the filling layer 3 is arranged in the sandwich filling cavity.

[0063] As a specific solution of this embodiment, Figure 3 As shown, the hollow topological configuration particle 2 is a hollow truncated octahedron structure as a whole, and is composed of six hollow topological configuration particle first unit blocks 201 and twelve hollow topological configuration particle second unit blocks 202.

[0064] As a specific solution of this embodiment, Figure 3As shown, the main body of the first unit block 201 of the hollow topological configuration particle is a block of a regular octagonal prism structure, and a first hole 203 is opened in the middle of the main body of the first unit block 201 of the hollow topological configuration particle along the axial direction. The first hole 203 is a hole of a rectangular structure.

[0065] As a specific solution of this embodiment, Figure 3 As shown, the second unit block 202 of the hollow topological configuration particles is a block of a rectangular parallelepiped structure.

[0066] As a specific solution of this embodiment, Figure 3 As shown, the first unit block 201 of the hollow topological configuration particle has four sides connected to the second unit block 202 of the hollow topological configuration particle, and the four sides are not adjacent to each other, and each side is connected to a second unit block 202 of the hollow topological configuration particle; the space enclosed by the three first unit blocks 201 of the hollow topological configuration particle and the three second unit blocks 202 of the hollow topological configuration particle is the second hole 204, and the second hole 204 is a hole with a regular hexagonal structure.

[0067] Example 2:

[0068] This embodiment provides a design method for a modular ceramic matrix composite thermal insulation tile according to embodiment 1, which specifically includes the following steps:

[0069] Step 1: Determine the structural parameters and materials:

[0070] In this embodiment, the side length of the outer shell upper plate 101 and the outer shell lower plate 102 (i.e., the side length of the ceramic-based outer shell 1) is 100 mm, the particle size of the porous topological configuration particles is 8 mm, the thickness of the filling layer 3 is 8 mm, the thickness of the outer shell upper plate 101, the outer shell lower plate 102 and the boundary layer plate 103 is 2 mm, and the overall thickness of the modular ceramic-based composite insulation tile (i.e., the sum of the thickness of the outer shell upper plate 101, the thickness of the outer shell lower plate 102 and the thickness of the filling layer 3) is 12 mm; the porosity of the filling layer lattice structure is 78.4%.

[0071] In this embodiment, the material of the ceramic-based outer shell 1 is a high-entropy carbide ceramic with a Zr-Ta-W-TiC-SiC-based carbon reinforcement. The density of the material is 853 kg / m 3 , thermal conductivity is 18.2 W / m·℃, specific heat is 1420 J / kg·℃, and surface emissivity is 0.8; the material of the filling layer 3 is alumina fiber, that is, the light-weight, low-thermal-conductivity material filled between the porous topological configuration particles 2 and their pores is alumina fiber; the density of the alumina fiber filling layer 3 is 56 kg / m 3 , specific heat is 1000 J / kg·℃, thermal expansion coefficient is 3.0×10-6 / ℃, and the isotropic thermal conductivity is 0.02W / m·℃.

[0072] In this embodiment, the temperature reduction requirement is 500°C, that is, the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite material insulation tile model needs to be greater than or equal to 500°C.

[0073] Step 2: Create a geometric model:

[0074] In the modeling software, a geometric model of the ceramic-based outer shell 1 and a geometric model of a single hollow topological configuration particle 2 are constructed, and several hollow topological configuration particles 2 are tightly arranged to form a lattice structure particle layer 4. The geometric model of the lightweight and low thermal conductivity material is filled between the gaps between adjacent hollow topological configuration particles 2 and in the cavities inside the hollow topological configuration particles 2 to obtain a geometric model of the filling layer 3; the geometric models of the ceramic-based outer shell 1, the lattice structure particle layer 4 and the filling layer 3 are combined together to obtain a modular ceramic-based composite material insulation tile model.

[0075] Step 3: Parameter optimization design:

[0076] Based on the geometric model of the modular ceramic matrix composite thermal insulation tile established in step 2, the modeling software sets the optimal range of input parameters in combination with the structural parameters from step 1. In this embodiment, the optimal range of input parameters is as follows: the particle size of the open-hole topological configuration particles is 8 mm to 26 mm, the thickness of the filling layer 3 is 8 mm to 26 mm, and the overall thickness of the modular ceramic matrix composite thermal insulation tile is set to 12 mm to 30 mm.

[0077] Step 4: Perform entity mesh division:

[0078] In the finite element software, the geometric models of the various components of the model, namely the ceramic-based outer shell 1, the hollow topological configuration particles 2 and the lightweight low thermal conductivity material filling layer 3, are divided into tetrahedral meshes; since there are a large number of small planes in the hollow special-shaped polygonal topological configuration lattice structure and the lightweight low thermal conductivity material filling layer, it is necessary to encrypt the mesh to ensure the mesh quality and result accuracy. The mesh encryption option is inserted in the mesh settings, and the encryption surface is selected as the hollow topological configuration particle 2 lattice structure and the lightweight low thermal conductivity material filling layer 3 lightweight low thermal conductivity material. The encryption cycle value is set to 3, and the mesh is updated.

[0079] Step 5: Set boundary conditions:

[0080] In the finite element software, a temperature boundary of 1300°C was applied to the surface of the outer shell upper plate 101. A surface-to-ambient thermal radiation condition with an emissivity of 0.8 and an ambient temperature of 22°C was set for the outer shell upper plate 102. The bottom and side surfaces of the ceramic-based outer shell were set as adiabatic boundaries.

[0081] Step 6: Determine parameter variables and calculation scale:

[0082] The output parameters set in the finite element software are: the maximum temperature of the lower plate surface of the outer shell, the minimum temperature of the lower plate surface of the outer shell, and the average temperature of the lower plate surface of the outer shell. Based on the size constraints of the use case and the optimized range of the input parameters in step 3, the particle size of the open topological configuration particles is 8mm to 26mm, the thickness of the filling layer 3 is 8mm to 26mm, and the overall thickness of the modular ceramic matrix composite insulation tile is set to 12mm to 30mm. Calculations are performed every 1mm. In this example, the calculation scale is a total of 19 cases.

[0083] Step 7: Calculate thermal insulation performance:

[0084] In the finite element software, the calculation sequence is set as follows: Calculate from small to large within the range of 8mm to 26mm to obtain the maximum temperature, minimum temperature, and average temperature of the lower plate surface of the outer shell. It should be noted that only the maximum temperature of the lower plate surface is used in the subsequent temperature difference calculation. The purpose of outputting the minimum and average temperatures here is to use the results to determine the accuracy of the simulation.

[0085] Step 8: Determine the thickness of the filling layer:

[0086] Based on the calculation results in step 7, calculate the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite insulation tile model, that is, use the temperature of the upper plate surface of the outer shell (that is, 1300℃ set in step 5 minus the maximum temperature of the lower plate surface of the outer shell). The specific results are as follows Figure 5 As shown. Figure 5 It can be seen that as the thickness of the filling layer 3 increases, the thermal insulation effect gradually increases. Combined with the cooling requirement of 500°C, in this embodiment, the overall thickness of the modular ceramic-based composite thermal insulation tile finally designed should be no less than 22 mm, that is, the thickness of the outer shell upper plate 101, the outer shell lower plate 102 and the boundary layer plate 103 is 2 mm, and the thickness of the filling layer 3 should be no less than 18 mm.

[0087] Example 3:

[0088] This embodiment provides a design method for a modular ceramic matrix composite thermal insulation tile according to embodiment 1, which specifically includes the following steps:

[0089] Step 1: Determine the structural parameters and materials:

[0090] In this embodiment, the side length of the outer shell upper plate 101 and the outer shell lower plate 102 is 100 mm, the particle size of the porous topological configuration particles is 8 mm, the thickness of the filling layer 3 is 8 mm, the thickness of the outer shell upper plate 101, the outer shell lower plate 102 and the boundary layer plate 103 is 2 mm, and the overall thickness of the modular ceramic-based composite insulation tile is 12 mm; the porosity of the filling layer lattice structure is 78.4%.

[0091] In this embodiment, the material of the ceramic-based outer shell 1 is a high-entropy carbide ceramic with a carbon reinforcement (Zr-Ta-W-Ti) C-SiC base, and the material of the filling layer 3 is a thermal insulation aerogel (i.e., the lightweight, low thermal conductivity material filled between the pores of the porous topological configuration particles 2 is a thermal insulation aerogel); the density of the thermal insulation aerogel filling layer is 300 kg / m 3 , the specific heat is 559.0 J / kg·℃, and the isotropic thermal conductivity is 0.00016×T+0.05 W / m·℃ (T is temperature, unit is ℃).

[0092] In this embodiment, the temperature reduction requirement is 500°C, that is, the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite material insulation tile model needs to be greater than or equal to 500°C.

[0093] Steps 2 to 7 are exactly the same as those in Example 2.

[0094] Step 8: Determine the thickness of the filling layer:

[0095] Based on the calculation results in step 7, calculate the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite insulation tile model, that is, subtract the maximum temperature of the lower surface of the outer shell from the temperature of the upper surface of the outer shell, which is 1300℃ set in step 5. The specific results are as follows: Figure 5 As shown. Figure 5 It can be seen that as the thickness of the filling layer 3 increases, the thermal insulation effect gradually increases. Combined with the cooling requirement of 500°C, in this embodiment, the overall thickness of the modular ceramic-based composite thermal insulation tile finally designed should be no less than 20 mm, that is, the thickness of the outer shell upper plate 101, the outer shell lower plate 102 and the boundary layer plate 103 is 2 mm, and the thickness of the filling layer 3 should be no less than 16 mm.

[0096] Comparative Example 1:

[0097] This comparative example provides a modular ceramic matrix composite thermal insulation tile, which differs from Example 3 in that: cross-shaped particles (structured as Figure 7 As shown) replaces the hollow topological configuration particles 2 of Example 3, and no filling layer 3 is provided; the overall thickness of the modular ceramic matrix composite thermal insulation tile is 8 mm; the thickness of the cross-shaped particles is 1 mm, and the cross-shaped particle lattice structure (structure as shown) Figure 6The porosity of the composite material (shown) is 76.6%.

[0098] Finite element simulation was used to analyze the thermal insulation performance of the modular ceramic-based composite insulation tile. The results showed that the maximum temperature of the lower plate surface of the outer shell was 1023.3°C, the minimum temperature was 990.3°C, the average temperature was 1006°C, and the temperature difference between the upper and lower surfaces was 276.7°C.

[0099] Comparison of the effects of Examples 2 and 3:

[0100] Depend on Figure 5 It can be seen that, under the condition of the same thickness, the thermal insulation effect of the thermal insulation aerogel filling layer in Example 3 is better than that of the alumina fiber filling layer in Example 2. The initial weight of the alumina fiber filling layer in Example 2 is 2.88g, and the initial total weight of the monolithic modular thermal insulation structure is 223.47g. The initial weight of the thermal insulation aerogel filling layer in Example 3 is 11.59g, and the initial total weight of the monolithic modular thermal insulation structure is 232.18g. Under the condition of the same size, the weight of the thermal insulation tile of the alumina fiber filling layer is less than that of the thermal insulation tile of the thermal insulation aerogel filling layer. It can be seen that when determining the applicable filling layer structure design in step eight, the weight requirements of the thermal protection structure should also be comprehensively considered to meet the lightweight design of the thermal protection structure.

[0101] Comparison of the effects of Example 3 and Comparative Example 1:

[0102] The interlayer thickness of Example 3 and Comparative Example 1 is the same, differing in the different particle structures and the lack of a filling layer. When both have an overall thickness of 8 mm, the temperature difference between the upper and lower surfaces of the modular ceramic-based composite thermal insulation tile model of Example 3 is 401.2°C, while the temperature difference between the upper and lower surfaces of the modular ceramic-based composite thermal insulation tile model of Comparative Example 1 is 276.7°C. This indicates that, at the same thickness, the thermal insulation tile designed in accordance with the present invention, with its perforated topologically configured particles 2 and filling layer 3, offers superior insulation performance.

Claims

1. A modular ceramic-based composite thermal insulation tile, comprising a ceramic-based outer shell (1), characterized in that: The ceramic-based outer shell (1) is a shell with a hollow regular hexagonal prism structure; The ceramic-based outer shell (1) is provided with a plurality of closely arranged permeable topological configuration particles (2) to form a lattice structure particle layer (4), and the material of the permeable topological configuration particles (2) is the same as that of the ceramic-based outer shell (1); The gaps between adjacent permeable topological configuration particles (2) and the cavities inside the permeable topological configuration particles (2) are filled with a lightweight, low thermal conductivity material, and the filled lightweight, low thermal conductivity material together constitutes a filling layer (3); The lightweight and low thermal conductivity material is selected from one of alumina fiber and thermal insulation aerogel, or a mixture of the two in any proportion; The permeable topological configuration particles (2) are composed of six permeable topological configuration particle first unit blocks (201) and twelve permeable topological configuration particle second unit blocks (202); The main body of the first unit block (201) of the hollow topological configuration particle is a block with a regular octagonal prism structure. A first hole (203) is provided in the middle of the main body of the first unit block (201) of the hollow topological configuration particle along the axial direction. The first hole (203) is a rectangular structure. The second unit block (202) of the permeable topological configuration particle is a block with a rectangular parallelepiped structure; The first unit block (201) of the hollow topological configuration particle has four sides connected to the second unit block (202) of the hollow topological configuration particle, and the four sides are not adjacent to each other, and each side is connected to a second unit block (202) of the hollow topological configuration particle; the space enclosed by the three first unit blocks (201) of the hollow topological configuration particle and the three second unit blocks (202) of the hollow topological configuration particle is the second hole (204), and the second hole (204) is a hole with a regular hexagonal structure.

2. The modular ceramic matrix composite thermal insulation tile according to claim 1, characterized in that: The side length of the ceramic-based outer shell (1) is 100 mm, and the wall thickness of the ceramic-based outer shell (1) is 2 mm.

3. The modular ceramic matrix composite thermal insulation tile according to claim 1, characterized in that: The particle size of the porous topological configuration particles (2) is 8 mm to 26 mm, the thickness of the filling layer (3) is 8 mm to 26 mm, and the particle size of the porous topological configuration particles (2) is equal to the thickness of the filling layer (3).

4. The modular ceramic matrix composite thermal insulation tile according to claim 1, characterized in that: The porosity of the lattice structure particle layer (4) is 78.4%.

5. The modular ceramic matrix composite thermal insulation tile according to claim 1, characterized in that: Suitable for ultra-high temperature environments greater than or equal to 1500℃.

6. A design method for modular ceramic matrix composite insulation tiles according to any one of claims 1 to 5, characterized in that: This method uses finite element simulation to calculate the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite thermal insulation tile model, and uses it as the basis for optimizing the structural parameters of the modular ceramic matrix composite thermal insulation tile.

7. The design method of modular ceramic matrix composite insulation tile according to claim 6, characterized in that: The method specifically comprises the following steps: Step 1: Determine the structural parameters and materials: The structural parameters include: the side length of the ceramic-based outer shell (1), the wall thickness of the ceramic-based outer shell (1), the particle size of the porous topological configuration particles (2), the thickness of the filling layer (3) and the porosity of the lattice structure particle layer (4); Step 2: Create a geometric model: A geometric model of a ceramic-based outer shell (1) and a geometric model of a single permeable topological configuration particle (2) are constructed in a modeling software, a plurality of permeable topological configuration particles (2) are closely arranged to form a lattice structure particle layer (4), and a geometric model of a lightweight, low thermal conductivity material is filled between gaps between adjacent permeable topological configuration particles (2) and in cavities inside the permeable topological configuration particles (2) to obtain a geometric model of a filling layer (3); the geometric models of the ceramic-based outer shell (1), the lattice structure particle layer (4) and the filling layer (3) are combined to obtain a modular ceramic-based composite material insulation tile model; Step 3: Parameter optimization design: Based on the geometric model of the modular ceramic matrix composite insulation tile established in step 2, in the modeling software, combined with the structural parameters of step 1, set the optimization range of the input parameters; Step 4: Perform entity mesh division: In the finite element software, the components of the model are divided into tetrahedral meshes; when dividing, the mesh encryption option is inserted in the mesh settings, and the encryption surface is selected as the porous topological configuration particles (2) and the lightweight low thermal conductivity material, and the mesh is updated; Step 5: Set boundary conditions: In the finite element software, a temperature boundary is applied to the upper surface of the ceramic-based outer shell (1), and a heat radiation condition is set on the lower surface of the ceramic-based outer shell (1); Step 6: Determine parameter variables and calculation scale: The output parameters are set in the finite element software as follows: the maximum temperature of the lower surface of the ceramic-based outer shell (1), the minimum temperature of the lower surface of the ceramic-based outer shell (1), and the average temperature of the lower surface of the ceramic-based outer shell (1); based on the size limit of the use scenario and according to the optimization range of the input parameters in step 3, the calculation is performed every 1 mm; Step 7: Calculate thermal insulation performance: Calculating and obtaining the maximum temperature of the lower surface of the ceramic-based outer shell (1), the minimum temperature of the lower surface of the ceramic-based outer shell (1), and the average temperature of the lower surface of the ceramic-based outer shell (1) in finite element software; Step 8: Determine the thickness of the filling layer: Based on the calculation results in step seven, the temperature difference between the upper and lower surfaces of the modular ceramic-based composite thermal insulation tile model is calculated, that is, the maximum temperature of the lower surface of the ceramic-based outer shell (1) is subtracted from the temperature of the upper surface of the ceramic-based outer shell (1); based on the temperature difference between the upper and lower surfaces of the modular ceramic-based composite thermal insulation tile model, the thickness of the filling layer (3) is finally determined.

8. The design method of modular ceramic matrix composite insulation tile according to claim 7, characterized in that: In step 4, when performing mesh encryption, the encryption value is set to 3.

9. The design method of modular ceramic matrix composite thermal insulation tile according to claim 7, characterized in that: In step five, the temperature boundary applied to the upper surface of the ceramic-based outer shell (1) is 1300° C.; the thermal radiation conditions set on the lower surface of the ceramic-based outer shell (1) are: emissivity is 0.8, and the radiation temperature is 22° C.

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