Electronic device

Abstract

The invention discloses electronic equipment, and the electronic equipment comprises a battery cover which is provided with a first light-transmitting area; the mainboard support is located on one side of the battery cover, and a first through hole is formed in the mainboard support; the light-emitting assembly comprises a light source and a flexible circuit board, the light source is fixed to the flexible circuit board, the flexible circuit board is fixed to the face, back to the battery cover, of the main board support, and the light source extends into the first through hole from the face, back to the battery cover, of the main board support and faces the first light-transmitting area; the mainboard is located on the side, opposite to the battery cover, of the mainboard support, the flexible circuit board is located between the mainboard support and the mainboard, and the flexible circuit board is electrically connected with the mainboard.

Description

Technical Field

[0001] This application belongs to the field of communication technologies, and particularly relates to an electronic device. Background Art

[0002] For an electronic device with a flash, the flash is usually placed in the decorative ring part of the battery cover. The lamp shade of the flash is assembled on the upper surface of the decorative ring bracket, the lens / decorative piece is assembled above the lamp shade, and the lamp and the Flexible Printed Circuit (FPC) are assembled on the lower surface of the decorative ring bracket. The lamp, the FPC, the decorative ring bracket, etc. form a decorative ring assembly, which is jointly assembled on the outer surface of the battery cover. Since the position of the decorative ring is limited by the installation position of the camera, the installation position of the flash is also limited. Summary of the Invention

[0003] The purpose of the embodiments of this application is to provide an electronic device to solve the problem that the installation position of the light-emitting component is limited.

[0004] To solve the above technical problems, this application is implemented as follows:

[0005] In a first aspect, the embodiments of this application provide an electronic device, including:

[0006] A battery cover having a first light-transmitting area;

[0007] A main board bracket located on one side of the battery cover, and the main board bracket is provided with a first through hole;

[0008] A light-emitting component including a light source and a flexible circuit board, the light source is fixed to the flexible circuit board, the flexible circuit board is fixed to the side of the main board bracket facing away from the battery cover, and the light source extends into the first through hole from the side of the main board bracket facing away from the battery cover and is arranged towards the first light-transmitting area;

[0009] A main board located on the side of the main board bracket facing away from the battery cover, the flexible circuit board is located between the main board bracket and the main board, and the flexible circuit board is electrically connected to the main board.

[0010] In the embodiments of this application, the light-emitting component of the electronic device is fixed to the main board bracket and is electrically connected to the main board. The main board can control the light source to emit light, and the light is emitted through the first light-transmitting area on the battery cover. By arranging the light-emitting component inside the electronic device and through the cooperation of the light-emitting component with the main board bracket and the battery cover, the light-emitting component can be flexibly arranged, ensuring the effective assembly of the light-emitting component inside the electronic device and guaranteeing the use safety of the light-emitting component. Description of the Drawings

[0011] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, where:

[0012] Figure 1 is one of the schematic structural diagrams of the electronic device according to an embodiment of the present application;

[0013] Figure 2 is another schematic structural diagram of the electronic device according to an embodiment of the present application;

[0014] Figure 3 is a diagram showing the setting position of the first light-transmitting area according to an embodiment of the present application;

[0015] Figure 4 is a third schematic structural diagram of the electronic device according to an embodiment of the present application;

[0016] Figure 5 is one of the schematic diagrams of the main board bracket according to an embodiment of the present application;

[0017] Figure 6 is a schematic diagram of the inner surface of the battery cover according to an embodiment of the present application;

[0018] Figure 7 is one of the schematic diagrams of the light-emitting component according to an embodiment of the present application;

[0019] Figure 8 is a diagram showing the setting position of the heat-conducting film according to an embodiment of the present application;

[0020] Figure 9 is a fourth schematic structural diagram of the electronic device according to an embodiment of the present application;

[0021] Figure 10 is a fifth schematic structural diagram of the electronic device according to an embodiment of the present application;

[0022] Figure 11 is one of the schematic diagrams of the flexible circuit board according to an embodiment of the present application;

[0023] Figure 12 is another schematic diagram of the flexible circuit board according to an embodiment of the present application;

[0024] Figure 13 is a third schematic diagram of the flexible circuit board according to an embodiment of the present application;

[0025] Figure 14 is a second schematic diagram of the main board bracket according to an embodiment of the present application;

[0026] Figure 15 is a second schematic diagram of the light-emitting component according to an embodiment of the present application;

[0027] Figure 16 is a third schematic diagram of the light-emitting component according to an embodiment of the present application;

[0028] Figure 17 It is one of the schematic diagrams of the colloid corresponding to the light source cover in the embodiment of the present application;

[0029] Figure 18 It is the schematic diagram of the battery cover in the embodiment of the present application;

[0030] Figure 19 It is the second schematic diagram of the colloid corresponding to the light source cover in the embodiment of the present application;

[0031] Figure 20 It is the third schematic diagram of the colloid corresponding to the light source cover in the embodiment of the present application.

[0032] Reference numerals: 1. Battery cover; 11. First light-transmitting area; 12. First buffer structure; 13. Second light-transmitting area; 14. Camera decoration part; 15. Battery cover diaphragm; 2. Main board bracket; 21. First through hole; 22. Support part; 23. Second through hole; 3. Light-emitting component; 31. Light source; 32. Flexible circuit board; 33. Light source cover; 34. Temperature control device; 211. Inclined plane; 212. Extension hole; 331. Body; 332. Limiting part; 321. Second buffer structure; 322. First area; 3221. Connection end; 323. Second area; 324. Third area; 3241. First target area; 333. Circular colloid; 334. Annular colloid; 4. Main board; 5. Thermal conductive film; 6. Shielding cover; 7. First camera module; 71. Connector; 8. Reinforcing structure; 9. Main board upper cover; 10. Screen assembly. Detailed Description of the Embodiment

[0033] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and should not be construed as a limitation to the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts fall within the scope of protection of the present application.

[0034] The terms "first" and "second" in the specification and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects before and after.

[0035] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the present application.

[0036] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0037] The motor structure according to an embodiment of the present application will be described below with reference to the drawings.

[0038] As Figures 1 to 20 shown, an embodiment of the present application provides an electronic device, including:

[0039] A battery cover 1, the battery cover 1 having a first light-transmitting area 11;

[0040] A main board bracket 2, located on one side of the battery cover 1, the main board bracket 2 having a first through hole 21 opened therein;

[0041] A light-emitting component 3, including a light source 31 and a flexible circuit board 32, the light source 31 being fixed to the flexible circuit board 32, the flexible circuit board 32 being fixed to the side of the main board bracket 2 facing away from the battery cover 1, the light source 31 extending into the first through hole 21 from the side of the main board bracket 2 facing away from the battery cover 1 and being arranged towards the first light-transmitting area 11;

[0042] A main board 4, located on the side of the main board bracket 2 facing away from the battery cover 1, the flexible circuit board 32 being located between the main board bracket 2 and the main board 4, and the flexible circuit board 32 being electrically connected to the main board 4.

[0043] The light-emitting component 3 in the embodiment of the present application can be the light-emitting component of an electronic device flash (or called a soft light). The first light-transmitting area 11 on the battery cover 1 is the light-emitting hole corresponding to the flash. As Figure 3 and Figure 6As shown, optionally, the first light-transmitting area 11 may be an annular light-transmitting area.

[0044] As Figure 1 and Figure 4 shown, the main board bracket 2 is located on the side of the battery cover 1 facing the inside of the electronic device. As Figure 5 shown, a first through hole 21 is formed in the main board bracket 2. The light source 31 of the light-emitting component 3 can be fixed on one side of the flexible circuit board 32 in a patch form. During assembly, the light source 31 is first fixed on the flexible circuit board 32. The light source 31 extends into the first through hole 21 from the side of the main board bracket 2 facing away from the battery cover 1, and the light source 31 is disposed opposite to the first light-transmitting area 11 on the battery cover 1 to ensure that light can be emitted from the first light-transmitting area 11. The side of the flexible circuit board 32 fixing the light source 31 is fixed on the side of the main board bracket 2 facing away from the battery cover 1 through a colloid, realizing the fixation of the light-emitting component 3 and the main board bracket 2.

[0045] As Figure 1 and Figure 4 shown, the main board 4 is located on the side of the main board bracket 2 facing away from the battery cover 1. The flexible circuit board 32 is located between the main board bracket 2 and the main board 4, and the flexible circuit board 32 is electrically connected to the main board 4 through a plurality of connection ends, realizing the electrical connection between the main board 4 and the light-emitting component 3, so as to ensure that the light source 31 of the light-emitting component 3 can emit light.

[0046] Figure 4 is an exploded view of the structure of the electronic device. As Figure 4 shown, the battery cover 1, the main board bracket 2, the light-emitting component 3, the first camera module 7, the main board 4, the main board upper cover 9, and the screen component 10 are assembled together in sequence. The light-emitting component 3 is fixed to the main board bracket 2 and electrically connected to the main board 4. The light source 31 of the light-emitting component 3 is disposed opposite to the first light-transmitting area 11 on the battery cover 1. The main board 4 can control the light source 31 to emit light, and the light is emitted from the first light-transmitting area 11.

[0047] In the embodiment of the present application, the light-emitting component of the electronic device is fixed to the main board bracket, and the light-emitting component is electrically connected to the main board. The main board can control the light source to emit light, and the light is emitted through the first light-transmitting area on the battery cover. The light-emitting component is arranged inside the electronic device. Through the cooperation of the light-emitting component with the main board bracket and the battery cover, the light-emitting component is flexibly arranged, ensuring the effective assembly of the light-emitting component inside the electronic device and guaranteeing the use safety of the light-emitting component.

[0048] Optionally, the light-emitting component 3 further includes:

[0049] The light source cover 33 includes a main body 331 and a limiting portion 332 disposed circumferentially along the main body 331; the limiting portion 332 is fixed to the side of the battery cover 1 facing the main board bracket 2; the main body 331 covers the light source 31, and the light source cover 33 is disposed opposite to the first light-transmitting area 11;

[0050] A first buffer structure 12 is provided on the side of the battery cover 1 facing the main board bracket 2. The first buffer structure 12 surrounds the circumferential direction of the light source cover 33, and the first buffer structure 12 is sealed with the main board bracket 2 around the first through hole 21.

[0051] As Figure 1 and Figure 2 shown, the main body 331 of the light source cover 33 covers the light source 31 and is directly opposite to the light source 31. The limiting portion 332 of the light source cover 33 is disposed circumferentially along the edge of the main body 331 to form a flat plate portion. The light source cover 33 is located below the first light-transmitting area 11 of the battery cover 1 to ensure that light can be emitted from the first light-transmitting area 11. The light source cover 33 is fixed to the inner side of the battery cover 1 (i.e., the side facing the main board bracket 2) through the limiting portion 332, and the light source cover 33 is assembled with the battery cover 1. For example, the limiting portion 332 can be adhesively bonded to the inner surface of the battery cover 1 by a colloid. Optionally, as Figure 2 shown, it is a partial enlarged schematic diagram of the light-emitting component 3. The inner surface of the battery cover 1 can be pasted with a battery cover diaphragm 15, and the limiting portion 332 of the light source cover 33 is adhesively bonded to the inner surface of the battery cover diaphragm 15 by a colloid. Light is emitted from the light source 31, enters the light source cover 33, and is emitted from the first light-transmitting area 11 on the battery cover 1 after multiple reflections.

[0052] As Figure 1 and Figure 2 shown, on the inner surface of the battery cover 1 (i.e., the side facing the main board bracket 2), a first buffer structure 12 is disposed circumferentially around the light source cover 33. As Figure 6 shown, the first buffer structure 12 entirely surrounds the light source cover 33. The first buffer structure 12 is, for example, a foam or a soft rubber material, and can also be other materials with a relatively soft hardness. The first buffer structure 12 has a certain thickness and is sealed between the main board bracket 2 around the first through hole 21, which can prevent light from leaking from the edge of the light source cover 33 to other positions of the electronic device, and can prevent foreign objects on the light source cover 33 from entering other areas of the electronic device, and can protect the edge of the light source cover 33 from being easily squeezed and broken. The light source cover 33 above the light source 31 is surrounded by the first buffer structure 12, which can prevent light from leaking from the gap between the battery cover 1 and the main board bracket 2 to other positions of the whole machine.

[0053] Optionally, a second buffer structure 321 is provided around the light source 31 on the flexible circuit board 32, and the second buffer structure 321 is located within the first through hole 21; the bottom of the body 331 of the light source cover 33 close to the light source 31 is in contact with and sealed to the second buffer structure 321.

[0054] As Figure 2 and Figure 5 shown, the second buffer structure 321 can be fixed on the flexible circuit board 32 and provided around the light source 31. The second buffer structure 321 and the light source 31 are both located within the first through hole 21, as Figure 1 and Figure 2 shown. The light source cover 33 is located above the second buffer structure 321, and the bottom of the body 331 of the light source cover 33 on the side away from the battery cover 1 is in contact with and sealed to the second buffer structure 321, which can prevent light from leaking from below the light source cover 33 to other positions of the electronic device and can also prevent foreign objects from entering the area where the light source 31 is located. The second buffer structure 321 is, for example, a foam or a soft rubber material, or can also be other materials with a softer hardness.

[0055] In this embodiment, the first buffer structure 12 is sealed between the main board bracket 2, and the second buffer structure 321 is sealed between the body 331 of the light source cover 33, forming two seals, which can effectively ensure that the light emitted by the light source 31 will not leak to other positions of the electronic device and can also ensure that foreign objects will not enter the light source area and / or other areas of the electronic device.

[0056] Optionally, the inner wall circumference of the first through hole 21 has an inclined surface 211, and the body 331 is arranged at an interval from the inclined surface 211.

[0057] Figure 5 is the surface of the main board bracket 2 facing the battery cover 1. As Figure 5 shown, the light source 31 is located within the first through hole 21 opened on the main board bracket 2. The second buffer structure 321 is provided around the light source 31 and fixed on the flexible circuit board 32, and the second buffer structure 321 is also located within the first through hole 21. As Figure 7 shown, the inner wall of the first through hole 21 can have an inclined surface 211. The body 331 of the light source cover 33 is located above the light source 31 and the second buffer structure 321. There is an interval between the inclined surface 211 of the first through hole 21 and the body 331, that is, after the light source cover 33 is installed inside the battery cover 1, the body 331 does not contact the inclined surface 211 of the first through hole 21, preventing interference between the main board bracket 2 and the light source cover 33. It can also be understood that the body 331 of the light source cover 33 is suspended above the inclined surface 211, the bottom of the body 331 is in contact with and sealed to the second buffer structure 321, and the light emitted by the light source 31 will not leak to other positions of the main board bracket 2, for example, the light will not irradiate to the position of the inclined surface 211.

[0058] Optionally, as Figure 1 and Figure 2 shown, the electronic device further includes:

[0059] A thermal conductive film 5, a first portion of the thermal conductive film 5 covering at least a partial surface of the flexible circuit board 32 facing away from the main board bracket 2; a second portion of the thermal conductive film 5 covering a partial surface of the main board bracket 2 facing away from the battery cover 1, the first portion and the second portion being connected;

[0060] A shielding cover 6, disposed between the thermal conductive film 5 and the main board 4, and there being a first gap between the thermal conductive film 5 and the shielding cover 6.

[0061] In this embodiment, as Figure 8 shown is the surface of the main board bracket 2 facing the main board 4 (i.e., the main board bracket 2 facing away from the battery cover 1). The thermal conductive film 5 can be a graphite film (PGS), the upper surface of the thermal conductive film 5 covering one side of the flexible circuit board 32 facing away from the main board bracket 2, or it can be understood that the thermal conductive film 5 covers one side of the flexible circuit board 32 facing the main board 4. The thermal conductive film 5 covers the flexible circuit board 32 and is jointly fixed on the side surface of the main board bracket 2 facing the main board 4. Specifically, the thermal conductive film 5 can cover a part of the flexible circuit board 32, and the thermal conductive film 5 can also cover a part of the main board bracket 2, as Figure 8 shown. The thermal conductive film 5 has high thermal conductivity and can conduct the heat generated by the operation of the flexible circuit board 32 to the gap between it and the main board 4, preventing the flexible circuit board 32 from overheating and affecting the service life of the light-emitting component 3.

[0062] It should be noted that the thermal conductive film 5 can cover most of the area of the flexible circuit board 32. As Figure 8 shown, the thermal conductive film 5 can cover most of the area of the flexible circuit board 32 except for the first region 322 and the third region 324. On the left side of the second region 323 of the flexible circuit board 32 shown in Figure 8 due to insufficient space in the thickness direction of the electronic device, the flexible circuit board 32 does not extend to this part, but the thermal conductive film 5 covers this part of the area, enabling a better heat dissipation effect. The flexible circuit board 32 covered with the thermal conductive film 5 is fixed to the main board bracket 2, and the main board bracket 2 can be fixed to the main board upper cover 9 by screws, and the main board 4 is located between the main board bracket 2 and the main board upper cover 9.

[0063] As Figure 1 and Figure 2As shown, a shielding cover 6 is provided between the main board bracket 2 and the main board 4. The shielding cover 6 is located below the heat-conducting film 5, and there is a certain interval between the heat-conducting film 5 and the shielding cover 6 in the thickness direction of the electronic device, which can be separated from the main board 4 that generates heat during operation, isolate the heat generated by the main board 4, and prevent the heat generated by the main board 4 from affecting the service life of the light-emitting component 3.

[0064] Optionally, two shielding covers 6 can be provided, as Figure 1 shown, one of the shielding covers 6 is disposed opposite to the light-emitting component 3. In Figure 1 , the light-emitting component 3 is located above the one shielding cover 6, which is used to isolate the heat of the main board 4.

[0065] Along the Figure 3 section made in the B-B direction shown, the cross-section of the light-emitting component 3 is as Figure 9 shown. Figure 10 is Figure 9 a partial enlarged schematic view of the light-emitting component 3 in

[0066] Optionally, as Figure 1 and Figure 7 shown, on the surface of the main board bracket 2 facing the battery cover 1, a support portion 22 is provided around the edge of the first through hole 21. The support portion 22 and the limiting portion 332 have a second interval in the thickness direction of the electronic device, and the second interval is smaller than the distance between the body 331 and the light source 31.

[0067] A plurality of support portions 22 can be provided around the first through hole 21. For example, Figure 7 shown, 4 support portions 22 are provided; or only one support portion 22 with a longer length can be provided around the first through hole 21, or 2 support portions 22 can be provided at the diagonal positions of the first through hole 21. The embodiments of the present application do not limit the number of the support portions 22, nor limit the shape of the support portions 22. The support portion 22 has a certain height in the vertical direction of the main board bracket 2, but the support portion 22 does not contact the body 331 of the light source cover 33. The interval between the support portion 22 and the limiting portion 332 of the light source cover 33 in the thickness direction of the electronic device is smaller than the interval between the body 331 of the light source cover 33 and the light source 31. In this way, when the battery cover 1 is impacted externally, the light source cover 33 is displaced and squeezed towards the direction of the light source 31. Due to the supporting effect of the support portion 22 on the limiting portion 332, the body 331 will not impact the light source 31 either, preventing the light source 31 from being damaged.

[0068] Optionally, as Figure 9As shown, the electronic device further includes: a first camera module 7 and its connector 71, and the connector 71 is disposed between the main board bracket 2 and the main board 4;

[0069] As Figure 11 , Figure 12 and Figure 13 shown, the flexible circuit board 32 includes:

[0070] A first region 322, where a plurality of connection terminals 3221 are provided in the first region 322, and the connection terminals 3221 are electrically connected to the main board 4;

[0071] A second region 323, connected to the first region 322, and the light source 31 is located in the second region 323;

[0072] A third region 324, connected to the second region 323, and the third region 324 is pressed against the connector 71.

[0073] Optionally, the connector 71 may be a board-to-board connector (BTB). Optionally, the first region 322 may be connected to the second region 323 through an FPC connection section, and the FPC connection section may be a routing region.

[0074] As Figure 11 shown, it is the side where the flexible circuit board 32 is fixed to the main board bracket 2. The light source 31 can be surface-mounted in the second region 323. After the flexible circuit board 32 is fixed to the surface of the main board bracket 2 by glue, the light source 31 and the second buffer structure 321 are located in the first through hole 21. As Figure 12 shown, it is the side of the flexible circuit board 32 facing away from the main board bracket 2. On this surface, a plurality of metal connection terminals 3221 are provided in the first region 322, and the flexible circuit board 32 is electrically connected to the main board 4 through the metal connection terminals. There may be a plurality of metal connection terminals 3221, for example Figure 12 a total of 6 connection terminals are included in , and the 6 connection terminals are correspondingly connected to the connection terminals on the main board 4.

[0075] As Figure 11 and Figure 12 shown, the flexible circuit board 32 further includes a third region 324, and the third region 324 is connected to the second region 313. The third region 324 is pressed against the connector 71. As Figure 9 shown, the electronic device includes a first camera module 7. There is a second through hole 23 on the main board bracket 2. The first camera module 7 is disposed on the main board upper cover 9 and passes through the second through hole 23 and faces the battery cover 1. The first camera module 7 has a connector 71. As Figure 9As shown, the connector 71 is located between the main board bracket 2 and the main board 4. The third region 324 of the flexible circuit board 32 is pressed against the connector 71, achieving a compact stack of the main board bracket 2, the flexible circuit board 32, the connector 71, and the main board 4 in the thickness direction of the electronic device, and can save the internal space of the electronic device.

[0076] Optionally, the third region 324 includes a first target region 3241 where no conductive material is laid;

[0077] and / or,

[0078] A covering layer is provided between the third region 324 and the connector 71, and the covering layer is a conductive material or a non-conductive material.

[0079] In this embodiment, the third region 324 includes a first target region 3241 where no conductive material is laid. When the light-emitting component 3, the main board bracket 2, and other components of the electronic device are assembled, since the third region 324 is pressed against the connector 71 of the first camera module 7 on the electronic device, in order to prevent signal interference between the flexible circuit board 32 and the first camera module 7, this first target region 3241 is provided. Since no conductive material is laid in the first target region 3231, no electrical signal is transmitted between the pins where the first target region 3231 is pressed against the connector 71. Therefore, there will be no electromagnetic interference or less interference between the flexible circuit board 32 and the first camera module.

[0080] Specifically, the first target region 3241 can correspond to the target function pins on the connector 71, and the two are pressed together without a gap. The target function pins can be the pins on the connector 71 for analog power supply. The frequency sensitivity of the target function pins is relatively high, and when there is electromagnetic interference, it is easy for the electronic device to have problems such as dark stripes in photos. Therefore, by aligning the first target region 3241 without conductive material with the target function pins, the electromagnetic interference of the flexible circuit board on the first camera module 7 can be reduced or avoided.

[0081] In this embodiment, by setting the first target region, while ensuring the supporting effect of the main board bracket 2 on the first camera module 7, it can also prevent signal interference between the flexible circuit board 32 and the first camera module 7. It should be noted that the setting of the first target region 3231 should take into account the height of the connector 71 so that the two can be pressed together on a plane. The first region 322 and the second region 323 are connected through a wiring region.

[0082] Optionally, a cover layer can also be provided between the third region 324 and the connector 71, covering the pins of the connector 71. The cover layer can be a conductive material, such as conductive cloth or other conductive sponges. There is no gap between the cover layer and the third region 324 and the connector 71. When the cover layer is a conductive material, the cover layer can absorb the electrical signals of the flexible circuit board. At this time, the cover layer is equivalent to a grounding function, which can prevent the electrical signals of the flexible circuit board from being transmitted to the connector 71 through the third region 324 and interfering with the first camera module 7. It should be noted that the cover layer can be provided simultaneously with the first target region 3241, which can further prevent the electrical signals of the flexible circuit board from interfering with the first camera module 7.

[0083] The cover layer can also be a non-conductive material, such as polyethylene terephthalate (PET) material, resin material, etc. Setting the non-conductive cover layer between the third region 324 and the connector 71 can prevent the flexible circuit board from being punctured by the reinforcement of the connector 71 and protect the flexible circuit board from being damaged.

[0084] It should be noted that the cover layer can be a material with a relatively high hardness to prevent the flexible circuit board from being damaged, or a material with a relatively low hardness, which can better improve the stress of the pins of the connector 71 or the main board.

[0085] In the above embodiments, by overlapping a part of the flexible circuit board of the light-emitting component on the connector 71 of the camera, the space in the thickness direction of the electronic device is effectively utilized. While the stacking is compact, the effective wiring area of the flexible circuit board can be increased. Since the wiring area of the flexible circuit board affects the effective working duration of the light-emitting component, this design can effectively improve the working duration of the light-emitting component.

[0086] Optionally, as Figure 5 and 7 shown, the light-emitting component 3 further includes: a temperature control device 34. The inner wall of the first through-hole 21 has a notch, and the notch extends towards the main board bracket 2 to form an extension hole 212;

[0087] The temperature control device 34 is fixed in the second region 323. The temperature control device 34 extends into the extension hole 212 from the side of the main board bracket 2 facing away from the battery cover 1 and is arranged towards the battery cover 1.

[0088] As Figure 7As shown in the figure, the first through hole 21 on the main board bracket 2 has a notch, and this notch is formed as an extended hole 212. During assembly, the temperature control device 34 is fixed to the flexible circuit board 32, and the temperature control device 34 is located outside the second buffer structure 321. The flexible circuit board 32 is fixed to the side of the main board bracket 2 facing away from the battery cover 1 by a colloid, so that the temperature control device 34 extends into the extended hole 212 and is arranged facing the battery cover 1. The temperature control device 34 can be a temperature sensor, which is used to sense the temperature of the flexible circuit board 32 to avoid damage caused by excessive temperature.

[0089] Optionally, the light-emitting component 3 further includes: a reinforcing structure 8, which is arranged on the side of the first region 322 facing the main board bracket 2, and / or, arranged on the side of the second region 323 facing away from the main board bracket 2.

[0090] As Figure 11 shown in the figure, the reinforcing structure 8 can be arranged on the side of the first region 322 facing the main board bracket 2, which can also be understood as arranging the reinforcing structure 8 between the first region 322 and the main board bracket 2. Since a connection end 3221 is arranged on the side of the first region 322 facing away from the main board bracket 2, the reinforcing structure 8 can ensure the strength of the first region and avoid damage to the connection end 3221.

[0091] As Figure 12 shown in the figure, the reinforcing structure 8 can also be arranged on the side of the second region 323 facing away from the main board bracket 2, which can also be understood as arranging the reinforcing structure 8 on the side of the second region 323 facing the shielding cover 6. Since the light source 31 is installed on the side of the second region 323 facing the main board bracket 2, the reinforcing structure 8 can ensure the strength of the second region 323 and avoid damage to the light source 31.

[0092] The assembly situation of the light-emitting component 3 with the main board bracket 2, the flexible circuit board 32 and the reinforcing structure 8 will be described below.

[0093] Figure 13 is an exploded view of a partial structure of the light-emitting component 3. The sides of the second region 323 and the third region 324 facing the main board bracket 2 are adhesively fixed to the main board bracket 2 by a third colloid 311; the light source 31 and the temperature control device 34 are installed on the side of the second region 323 facing the main board bracket 2, and the reinforcing structure 8 is arranged on the side of the second region 323 facing away from the main board bracket 2. As Figure 11As shown, the light source 31 is completely surrounded by the second buffer structure 321, and a third colloid 311 that completely surrounds the second buffer structure 321 is disposed outside the second buffer structure 321. The third colloid 311 is used to bond the flexible circuit board 32 to the inner surface of the main board bracket 2, and can also prevent light from leaking out of the second buffer structure 321 and then leaking to other positions of the whole machine through the gap between the flexible circuit board 32 and the main board bracket 2. That is, the flexible circuit board 32 and the third colloid 311 have a dual function of preventing light leakage.

[0094] As Figure 11 shown, a reinforcing structure 8 can also be disposed on the surface of the first region 322 facing the main board bracket 2. The reinforcing structure 8 is adhesively fixed to the main board bracket 2 through a fourth colloid 81, and a connection end 3221 is installed on the surface of the first region 322 facing away from the main board bracket 2. All the colloids used for bonding on the flexible circuit board 32 are located on the surface facing the main board bracket 2.

[0095] As Figure 14 shown, optionally, a positioning structure for positioning the flexible circuit board 32 can be disposed on the main board bracket 2, such as Figure 14 the black region in, which can ensure that the flexible circuit board 32 is installed in the accurate position. No limiting structure is provided around the third region 324, which can facilitate the stretching of the flexible circuit board 32 and can also ensure that the region where the third region 324 contacts the connector 71 is the only plane.

[0096] By disposing the reinforcing structure 8 in the region where devices such as the light source 31 and the connection end are installed, the strength of this part of the region can be ensured, and device damage can be avoided. Optionally, the reinforcing structure 8 can be a metal material with a relatively high hardness, such as steel. As Figure 8 shown on the left side, a reinforcing structure 8 is not provided in a part of the region covered by the heat-conducting film 5. The height of the plane of the main board bracket 2 where this part of the region is located is not in the same plane as the region where the reinforcing structure 8 is provided on the right side, and there is a certain height difference between the two.

[0097] Among them, as Figure 14 shown, a reinforcing structure 8 is not provided at the position corresponding to the third region 324 of the flexible circuit board 32, that is, the third region 324 is directly fixed to the main board bracket 2 through a colloid.

[0098] Figure 15 is a schematic diagram obtained by making a cross-section along the Figure 5 C direction shown, Figure 16 is a schematic diagram obtained by making a cross-section along the Figure 5 D direction shown. As Figure 15 shown, the flexible circuit board 32 is pasted on two planes of the main board bracket 2. Among them, the third region 324 that is pressed against the connector 71 is a plane, and the second region 323 corresponding to the reinforcing structure 8 is another part of the plane.

[0099] As an alternative embodiment, as Figure 5 , Figure 8 and Figure 14 shown, the main board bracket 2 is further provided with a second through hole 23;

[0100] The electronic device further includes: a first camera module 7 and its connector 71, the first camera module 7 extends into the second through hole 23 and is disposed towards the battery cover 1; the connector 71 is disposed between the main board bracket 2 and the main board 4;

[0101] As Figure 3 and Figure 6 shown, the battery cover 1 further has a second light-transmitting area 13, the first camera module 7 is disposed opposite to the second light-transmitting area 13; the flexible circuit board 32 is pressed against the connector 71.

[0102] Optionally, as Figure 3 shown, the battery cover 1 includes: a camera decoration part 14, a lens is embedded on the camera decoration part 14; the second camera module of the electronic device is located on the side of the battery cover 1 facing the inside of the electronic device, and the second camera module is disposed opposite to the lens. The second camera module is not shown in the drawings, and the second camera module is a conventional camera module, which will not be specifically described here.

[0103] In this embodiment, the first camera module 7 corresponding to the connector 71 pressed against the third area 324 of the flexible circuit board 32 is not disposed below the camera decoration part 14, but is independently disposed differently from the second camera module below the camera decoration part 14. Therefore, the arrangement of the first camera module 7 and the light-emitting component 3 is not affected by the position of the second camera module, or is less affected by the arrangement position of the second camera module, facilitating the flexible layout of the light-emitting component 3 inside the electronic device. The second camera module is a conventional terminal camera module.

[0104] As Figure 3 shown, the battery cover 1 has a second light-transmitting area 13, as Figure 5 shown, the main board bracket 2 has a second through hole 23, as Figure 4 and Figure 9As shown, the first camera module 7 is fixed to the upper cover 9 of the main board, and the first camera module 7 extends into the second through hole 23 of the main board bracket 2 and is arranged facing the second light-transmitting area 13. The second light-transmitting area 13 and the first light-transmitting area 11 are located on the same side of the traditional camera decoration part 14 and are arranged along the length direction of the battery cover 1. Then, the first camera module 7 and the light-emitting component 3 are also located on the same side of the second camera module, and the first camera module 7 and the light-emitting component 3 are arranged in the length direction of the electronic device. In this way, the setting position of the light-emitting component 3 is not restricted by the setting position of the second camera module. As Figure 9 and Figure 10 shown, the connector 71 of the first camera module 7 is located between the main board 4 and the main board bracket 2, and the third area 324 of the flexible circuit board 32 of the light-emitting component 3 is pressed against the connector 71. At this time, the arrangement in the thickness direction of the electronic device is: the main board bracket 2, the third area 324 of the flexible circuit board 32, the connector 71, and the main board 4, which can meet the compact stacking of each component in the thickness direction of the electronic device and can save the internal space of the electronic device.

[0105] In this embodiment, by moving the light-emitting hole (the first light-transmitting area 11) of the flash from the camera decoration part of the battery cover to the battery cover, it is convenient to arrange the relative position relationship between the light-emitting hole and the camera according to the imaging requirements. The position of the light-emitting hole can be flexibly arranged, which can meet the stacking requirements of the internal structure of the electronic device, is convenient for ID styling, improves the situation that the setting position of the camera restricts the ID styling more, and is beneficial to improving the aesthetic feeling of the product appearance.

[0106] Optionally, as Figure 17 shown, the body 331 is fixed to one side of the battery cover 1 facing the main board bracket 2 through a circular colloid 333; the limiting part 332 is fixed to one side of the battery cover 1 facing the main board bracket 2 through an annular colloid 334.

[0107] In this embodiment, the first light-transmitting area 11 can be an annular light-transmitting area; the body 331 of the light source cover 33 is fixed to the inner circle of the annular light-transmitting area through a circular colloid 333; the limiting part 332 of the light source cover 33 is fixed to the outer periphery of the annular light-transmitting area through an annular colloid 334. It can also be understood that the light source cover 33 is fixed to the inner surface of the battery cover 1 through two parts of colloid. The circular colloid 333 is adhesively bonded to the inner circle of the annular light-transmitting area, and the annular colloid 334 is arranged around the outer periphery of the annular light-transmitting area. As Figure 18The following is a schematic diagram of the outer surface and the inner surface of the battery cover 1. A battery cover diaphragm 15 is provided on the inner surface of the battery cover 1. The annular light-transmitting region divides the battery cover diaphragm 15 into two parts. One part is the circular battery cover diaphragm 15 provided at the inner circle position of the annular light-transmitting region, and the other part is the battery cover diaphragm 15 provided outside the annular light-transmitting region. The region between the circular colloid 333 and the annular colloid 334 corresponds to the annular light-transmitting region. Light rays are emitted from the light source 31, enter the light source cover 33, and after multiple reflections, are emitted from the annular light-transmitting region to the outside of the electronic device. Therefore, the light source cover 33 is bonded to the inner surface of the battery cover 1 through two parts of colloids, and it will not affect the emission of the light rays emitted by the light-emitting component 3.

[0108] It should be noted that the "annular" described in the embodiments of the present application does not specifically refer to a circular ring, and can be an annular shape of any shape arranged circumferentially.

[0109] Along Figure 6 Make a cross-section in the direction of E-E shown, and obtain as Figure 19 and Figure 20 shown. The light source cover 33 is bonded to the inner surface of the battery cover through two parts of colloids. The outer colloid is the annular colloid 334, and the inner colloid is the circular colloid 333. The position corresponding to the annular light-transmitting region between the two parts of colloids does not affect the emission of light rays. The circular colloid 333 is the colloid pasted on the inner circle of the annular light-transmitting region. This part of the colloid can prevent the part of the battery cover corresponding to the circular battery cover diaphragm 15 provided at the inner circle position of the annular light-transmitting region from detaching from the battery cover 1 after the glass battery cover cracks. The annular colloid 334 is the colloid pasted outside the annular light-transmitting region. When the battery cover is broken, it can still provide the function of the limiting part 332 for fixing the light source cover 33, and at the same time, it can prevent water and other substances outside from entering the electronic device from the annular region after the annular light-transmitting region is broken.

[0110] In the embodiments of the present application, the light-emitting component of the electronic device is fixed to the main board bracket, and the light-emitting component is electrically connected to the main board. The main board can control the light source to emit light, and the light rays are emitted through the first light-transmitting region on the battery cover. The light-emitting component is arranged inside the electronic device. Through the cooperation of the light-emitting component with the main board bracket and the battery cover, the light-emitting component is flexibly arranged, ensuring the effective assembly of the light-emitting component inside the electronic device and guaranteeing the use safety of the light-emitting component.

[0111] In this application, the light-emitting aperture of the flash is moved from the battery cover decorative ring to the battery cover, which facilitates arranging the relative positional relationship between the light-emitting aperture and the camera according to imaging requirements. The set position can be flexibly arranged to meet the stacking requirements of the electronic device structure and is conducive to improving the aesthetic appearance of the product. The flexible circuit board part of the light-emitting component is partially lapped on the BTB of the camera, effectively utilizing the internal space of the electronic device, increasing the effective routing area of the flexible circuit board, and thus increasing the effective working duration of the light-emitting component. The third area on the flexible circuit board is used to be pressed against the BTB of the camera. No conductive material is laid on the first target area of this third area, which can effectively prevent electrical signal interference between the flexible circuit board and the camera BTB; alternatively, a covering layer is additionally provided between the third area and the BTB, which can not only prevent electrical signal interference between the flexible circuit board and the camera BTB but also prevent the flexible circuit board from being damaged by the reinforcing structure where the BTB is located. A support part is added to the main board bracket to cooperate with the light source cover, which can effectively prevent the light source cover from hitting the light source when it is displaced. The light source cover is adhered to the inner surface of the battery cover by two parts of glue. The circular glue used for adhering to the inner circle of the annular light-transmitting area can prevent the annular through-hole part of the battery cover from cracking and falling off; the annular glue used for adhering to the outside of the annular light-transmitting area can fix the light source cover to the inner surface of the battery cover and at the same time avoid the liquid ingress problem when the annular through-hole part of the battery cover is broken. By providing the first buffer structure and the second buffer structure, multi-level anti-light leakage is achieved. Buffer structures are provided between the main board bracket and the battery cover, between the light source cover and the flexible circuit board, and between the main board bracket and the flexible circuit board, which can effectively prevent the light emitted by the light source from entering the area where the camera is located or prevent foreign objects from entering the area where the light source is located.

[0112] Other components of the electronic device in the embodiments of this application, such as the housing, etc., and operations are known to those of ordinary skill in the art and will not be described in detail here. The electronic device of this application can be products such as mobile phones, e-books, tablet computers, etc., and is not limited here.

[0113] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0114] Although embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, Comprising: A battery cover having a first light-transmitting region; A main board bracket located on one side of the battery cover, the main board bracket being provided with a first through hole; A light-emitting component including a light source and a flexible circuit board, the light source being fixed to the flexible circuit board, the flexible circuit board being fixed to a side of the main board bracket facing away from the battery cover, the light source extending into the first through hole from the side of the main board bracket facing away from the battery cover and being arranged towards the first light-transmitting region; A main board located on a side of the main board bracket facing away from the battery cover, the flexible circuit board being located between the main board bracket and the main board, and the flexible circuit board being electrically connected to the main board.

2. The electronic device according to claim 1, wherein The light-emitting component further includes: A light source cover including a body and a limiting portion arranged along the circumference of the body; the limiting portion is fixed to a side of the battery cover facing the main board bracket; the body covers the light source, and the light source cover is arranged opposite to the first light-transmitting region; A first buffer structure is arranged on a side of the battery cover facing the main board bracket, the first buffer structure surrounds the circumference of the light source cover, and the first buffer structure is sealed with the main board bracket in the circumference of the first through hole.

3. The electronic device according to claim 2, wherein A second buffer structure is arranged on the flexible circuit board around the light source, and the second buffer structure is located in the first through hole; The bottom of the body close to the light source is in contact with and sealed to the second buffer structure.

4. The electronic device according to claim 1, characterized in that, The electronic device further includes: A heat-conducting film, a first part of the heat-conducting film covers at least a part of the surface of the flexible circuit board on a side facing away from the main board bracket; a second part of the heat-conducting film covers a part of the surface of the main board bracket on a side facing away from the battery cover, and the first part and the second part are connected; A shielding cover is arranged between the heat-conducting film and the main board, and there is a first gap between the heat-conducting film and the shielding cover.

5. The electronic device according to claim 2, wherein On a surface of the main board bracket facing the battery cover, a support portion is arranged around the edge of the first through hole, and there is a second gap between the support portion and the limiting portion in the thickness direction of the electronic device, and the second gap is smaller than the distance between the body and the light source.

6. The electronic device according to claim 2, wherein The inner wall circumference of the first through hole has an inclined surface, and the body is arranged at an interval from the inclined surface.

7. The electronic device according to claim 1, wherein The electronic device further includes: a first camera module and its connector, the connector is arranged between the main board bracket and the main board; the flexible circuit board includes: A first region, a plurality of connection ends are arranged in the first region, and the connection ends are electrically connected to the main board; A second region, connected to the first region, and the light source is located in the second region; A third region, connected to the second region, and the third region is pressed against the connector.

8. The electronic device according to claim 7, characterized in that, The third region includes a first target region where no conductive material is laid; And / or, A covering layer is arranged between the third region and the connector, and the covering layer is a conductive material or a non-conductive material.

9. The electronic device according to claim 7, wherein The light-emitting component further includes: a temperature control device; The inner wall of the first through hole has a notch, and the notch extends towards the main board bracket to form an extension hole; The temperature control device is fixed in the second area, and the temperature control device extends into the extension hole from the side of the main board bracket facing away from the battery cover and is arranged towards the battery cover.

10. The electronic device according to claim 7, characterized in that, The light-emitting component further includes: A reinforcing structure is arranged on the side of the first area facing the main board bracket and / or on the side of the second area facing away from the main board bracket.

11. The electronic device according to claim 1, wherein The main board bracket further defines a second through hole; The electronic device further includes: a first camera module and its connector. The first camera module extends into the second through hole and is arranged towards the battery cover; the connector is arranged between the main board bracket and the main board; The battery cover further has a second light-transmitting area, and the first camera module is arranged opposite to the second light-transmitting area; the flexible circuit board is pressed against the connector.

12. The electronic device according to claim 2, wherein The body is fixed to the side of the battery cover facing the main board bracket by a circular colloid; The limiting part is fixed to the side of the battery cover facing the main board bracket by an annular colloid.

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