Sensor circuit board and manufacturing method thereof

Abstract

The invention provides a sensor circuit board and a manufacturing method thereof. The sensor circuit board comprises a movable unit, fixed units arranged around the movable unit at intervals, and a plurality of suspensions. The suspension is respectively connected with the movable unit and the fixed unit, wherein each of the movable unit, the fixed unit and the suspension respectively comprises a circuit board structure, a conductive layer and a metal layer. The conductive layer covers the surface of the circuit board structure, and the metal layer is arranged on the conductive layer. The conductive layer is located between the circuit board structure and the metal layer, and the metal layer contains titanium. The metal layer can provide rigid support for the suspension and improve the stability of the anti-shake function.

Description

Technical Field

[0001] The present invention relates to a circuit board, and particularly to a sensor circuit board and a manufacturing method thereof. Background Art

[0002] In order to improve the stability of a camera lens, a sensor anti-shake device is currently provided. An existing sensor anti-shake device uses a voice coil motor as the power for sensor movement. Since the voice coil motor includes a coil and a permanent magnet, there are problems of increased package size and interference of the permanent magnet with signals. Summary of the Invention

[0003] Therefore, the present invention provides a sensor circuit board and a manufacturing method thereof, thereby solving the problems of increased package size and interference of the permanent magnet with signals.

[0004] At least one embodiment of the present invention provides a sensor circuit board. The sensor circuit board includes a movable unit, a fixed unit, and a plurality of suspensions. The fixed unit is disposed around the movable unit at intervals, and the suspensions are respectively connected to the movable unit and the fixed unit. Each of the movable unit, the fixed unit, and the suspensions respectively includes a circuit board structure, a conductive layer, and a metal layer. The conductive layer covers the surface of the circuit board structure, and the metal layer is disposed on the conductive layer. The conductive layer is located between the circuit board structure and the metal layer, and the metal layer includes titanium.

[0005] In at least one embodiment of the present invention, the movable unit further includes a plurality of sensor connection pads.

[0006] In at least one embodiment of the present invention, the suspension is a suspension wire.

[0007] In at least one embodiment of the present invention, the circuit board structure includes an insulating layer, two circuit layers, two bonding layers, and two cover layers. The insulating layer is located between the two circuit layers, and the bonding layers respectively cover the circuit layers, wherein the insulating layer and the circuit layers are located between the bonding layers. The two cover layers are respectively located on the bonding layers, and the insulating layer, the circuit layers, and the bonding layers are located between the two cover layers.

[0008] In at least one embodiment of the present invention, the width range of the suspension falls between 100 μm and 900 μm.

[0009] In at least one embodiment of the present invention, the movable unit further includes two first connection blocks, and the first connection blocks are respectively disposed on opposite sides of the movable unit along the X axis. The fixed unit further includes a main body portion and two second connection blocks connecting the main body portion, and the second connection blocks are respectively disposed on opposite outer sides of the movable unit along the Y axis. Each suspension is respectively connected to the movable unit through the first connection block and connected to the fixed unit through the second connection block.

[0010] In at least one embodiment of the present invention, each first connection block and each second connection block are connected by at least two suspensions respectively.

[0011] In at least one embodiment of the present invention, the minimum distance between two suspensions connecting the same first connection block and second connection block ranges from 50 μm to 900 μm.

[0012] In at least one embodiment of the present invention, the fixing unit further includes a connecting portion connecting the main body portion, wherein the main body portion is located between the moving unit and the connecting portion.

[0013] For the above object of the present invention, a manufacturing method of a sensor circuit board is provided. The manufacturing method of the sensor circuit board includes providing a substrate, which includes a circuit substrate and two covering layers, wherein the circuit substrate is located between the covering layers; depositing a conductive layer on a part of the covering layer; depositing a metal layer on the conductive layer, wherein the metal layer includes titanium, and the way of depositing the metal layer includes electroplating.

[0014] Based on the above, the sensor circuit board in the present invention cooperates with an axial brake to generate a thrust or a pulling force. And because the suspension connects the moving unit and the fixing unit, through the cooperation of the suspension and the axial actuator, the sensor welded on the moving unit can be stabilized, achieving an anti-shake effect. The suspension in the sensor circuit board can provide a supporting function and a resilience function, and provide a signal and power transmission function, thus can replace the voice coil motor of the traditional anti-shake device, which helps to solve the problem of permanent magnet interfering with signals currently. On the other hand, forming a metal layer containing titanium on the outermost layer of the suspension can further improve the rigidity of the suspension. In addition, the present invention uses electroplating to replace the way of bonding with adhesive materials to form a metal layer containing titanium on the outermost layer of the sensor circuit board. In this way, better surface flatness can be obtained, and further improve the anti-shake effect of the sensor circuit board. Brief Description of the Drawings

[0015] To make the above and other objects, features, advantages and embodiments of the present disclosure more obvious and understandable, the descriptions of the accompanying drawings are as follows:

[0016] Figure 1 A top view schematic diagram of a sensor circuit board showing at least one embodiment of the present invention.

[0017] Figure 2 A schematic diagram showing the usage state of a sensor circuit board showing at least one embodiment of the present invention.

[0018] Figure 3 Showing the sensor circuit board along Figure 1 A cross-sectional schematic diagram along line A-A in

[0019] Figure 4Illustrating the sensor circuit board along Figure 1 a cross-sectional schematic view along line segment B-B in

[0020] Figure 5 Illustrating the sensor circuit board along Figure 1 a cross-sectional schematic view along line segment C-C in

[0021] Figures 6A to 6B Illustrating Figure 1 a cross-sectional schematic view of the manufacturing method of the sensor circuit board along line segment A-A.

[0022] Figures 7A to 7B Illustrating Figure 1 a cross-sectional schematic view of the manufacturing method of the sensor circuit board along line segment B-B. Detailed implementation manners

[0023] The embodiments of the present invention are discussed in detail below. However, it can be understood that the embodiments provide many applicable concepts, which can be implemented in various specific contexts. The discussed and disclosed embodiments are for illustration only and are not used to limit the scope of the present invention. For example, the description of "the first feature is formed on the second feature" includes embodiments where the first feature is in direct contact with the second feature, and also includes other embodiments where other features are formed between the first feature and the second feature, so that the first feature and the second feature are not in direct contact.

[0024] In addition, spatial relative terms, such as "below", "lower than", "above", "higher than", etc., are used to simply describe the relationship between the elements or features depicted in the drawings and other elements or features. These spatial relative terms cover different directions during use or operation in addition to the directions depicted in the drawings. When the element can be oriented in other ways (rotated 90 degrees or in other directions), the spatial relative descriptions used herein can also be interpreted correspondingly.

[0025] Figure 1 An upper view schematic diagram of a sensor circuit board 100 according to at least one embodiment of the present invention is illustrated. The sensor circuit board 100 includes a movable unit 110, a fixed unit 120, and a plurality of suspensions 131, 132, 133, 134, 135, 136, 137, and 138. The movable unit 110 further includes two connection blocks 112a and 112b, and these two connection blocks 112a and 112b are respectively disposed on opposite sides of the movable unit 110 along the X-axis DX. Specifically, the connection block 112a is located on the left side of the movable unit 110, and the connection block 112b is located on the right side of the movable unit 110.

[0026] The fixing unit 120 is disposed at intervals around the movable unit 110, that is, the fixing unit 120 surrounds the movable unit 110 and is separated from the movable unit 110. The fixing unit 120 includes a main body portion 122 and two connecting blocks 124a and 124b. The connecting blocks 124a and 124b are connected to the main body portion 122 and are respectively disposed on opposite outer sides of the movable unit 110 along the Y-axis direction DY. Specifically, the connecting block 124a is located above the movable unit 110, and the connecting block 124b is located below the movable unit 110. In addition, the fixing unit 120 further includes a connecting portion 126 that connects the main body portion 122, and the main body portion 122 is located between the movable unit 110 and the connecting portion 126.

[0027] As Figure 1 shown, the suspensions 131, 132, 133, 134, 135, 136, 137 and 138 are respectively connected to the movable unit 110 and the fixing unit 120. In this embodiment, each suspension is connected to the movable unit 110 through the connecting block 112a or 112b, and is connected to the fixing unit 120 through the connecting block 124a or 124b. In other words, both ends of each suspension are respectively connected to the movable unit 110 and the fixing unit 120. Specifically, the suspensions 131, 132, 137 and 138 are connected to the movable unit 110 through the connecting block 112a, and the suspensions 133, 134, 135 and 136 are connected to the movable unit 110 through the connecting block 112b. On the other hand, 131, 132, 133 and 134 are connected to the fixing unit 120 through the connecting block 124a, and the suspensions 135, 136, 137 and 138 are connected to the fixing unit 120 through the connecting block 124b.

[0028] It should be particularly noted that, in this embodiment, each connecting block (connecting block 112a or connecting block 112b) and each connecting block (connecting block 124a or connecting block 124b) are respectively connected by at least two suspensions. Specifically, the connecting block 112a and the connecting block 124a are connected by the suspensions 131 and 132; the connecting block 112a and the connecting block 124b are connected by the suspensions 137 and 138; the connecting block 112b and the connecting block 124a are connected by the suspensions 133 and 134; and the connecting block 112b and the connecting block 124b are connected by the suspensions 135 and 136.

[0029] Although the above embodiment takes the connection between each connecting block and each connecting block by two suspensions as an example, the present invention is not limited thereto. In other embodiments, each connecting block and each connecting block may also be respectively connected by more than two suspensions, such as three suspensions.

[0030] In this embodiment, the movable unit 110 further includes a plurality of sensor connection pads 113. The sensor connection pads 113 are disposed around the edge of the movable unit 110. Please refer to Figure 1 and Figure 2 where Figure 2 FIG. shows a schematic diagram of the usage state of the sensor circuit board 100 according to at least one embodiment of the present invention. In the camera lens 200, the sensor 250 can be soldered onto the sensor connection pads 113 of the movable unit 110.

[0031] Although in Figure 2 the illustrated embodiment, the sensor 250 is disposed on the sensor circuit board 100 by means of Chips On Board (COB), the present invention is not limited thereto. In other embodiments, the sensor 250 can also be first encapsulated on a substrate (the substrate can be a printed circuit board or a ceramic substrate) by a plurality of solder materials (not shown). Then, the substrate is disposed on the sensor connection pads 113 by a plurality of solder materials.

[0032] It should be particularly noted that the suspensions 131, 132, 133, 134, 135, 136, 137, and 138 have relatively large rigidity and bending fatigue resistance characteristics to provide a support function and a resilience function. In addition, the suspensions can also provide transmission of signals, electric energy, etc. That is, the signals of the sensor 250 can be transmitted to the fixed unit 120 through the suspensions 131, 132, 133, 134, 135, 136, 137, and 138, and then transmitted to the connection portion 126. In this embodiment, the suspensions 131, 132, 133, 134, 135, 136, 137, and 138 can be suspension wires, that is, the shapes of these suspensions can be filamentous, but the present invention is not limited thereto. In other embodiments, the suspensions 131, 132, 133, 134, 135, 136, 137, and 138 can also be members having support and resilience properties such as elastic sheets.

[0033] The suspensions 131, 132, 133, 134, 135, 136, 137, and 138 can be formed in different sizes by etching, such as a smaller width and a larger thickness. In this embodiment, the width of the suspensions 131, 132, 133, 134, 135, 136, 137, and 138 is less than the thickness, that is, each suspension has a high aspect ratio, thereby achieving movement and resilience in the planar direction and high bending resistance characteristics in the height direction. For example, the width range of the suspensions 131, 132, 133, 134, 135, 136, 137, and 138 falls between 100 μm and 900 μm, and the thickness can fall between 50 μm and 500 μm.

[0034] In addition, the minimum distance range between two (adjacent) suspensions connecting the same connection block falls between 50 μm and 900 μm. For example, the minimum distance between suspension 131 and 132, and the minimum distance between suspension 133 and 134, the range of the above minimum distances can all fall between 50 μm and 900 μm.

[0035] Please refer to Figure 1 , Figure 3 , Figure 4 and Figure 5 as well. The movable unit 110, the fixed unit 120, and the suspensions 131, 132, 133, 134, 135, 136, 137, and 138 respectively include a circuit board structure, a conductive layer, and a metal layer. Figure 3 Figure shows a cross-sectional schematic view of the sensor circuit board 100 along Figure 1 the line A-A in

[0036] Figure 4 , that is, a cross-sectional view of the suspensions 133 and 134. The suspension 133 includes a circuit board structure 320, a conductive layer 340, and a metal layer 360. The conductive layer 340 covers the surface 320s of the circuit board structure 320, and the metal layer 360 is disposed on the conductive layer 340. Among them, the conductive layer 340 is located between the circuit board structure 320 and the metal layer 360, and the material of the metal layer 360 includes titanium (for example, the metal layer 360 is a titanium alloy). Figure 1 Figure shows a cross-sectional schematic view of the sensor circuit board 100 along

[0037] Figure 5 the line B-B in Figure 1 , that is, a partial cross-sectional view of the movable unit 110. The movable unit 110 includes a circuit board structure 420, a conductive layer 440, and a metal layer 460. The conductive layer 440 covers the surface 420s of the circuit board structure 420, and the metal layer 460 is disposed on the conductive layer 440. Among them, the conductive layer 440 is located between the circuit board structure 420 and the metal layer 460, and the material of the metal layer 460 includes titanium (for example, the metal layer 460 is a titanium alloy).

[0038] It should be particularly noted that please refer to Figure 3, the conductive layer 340 and the metal layer 360 completely surround the surface 320s of the circuit board structure 320. However, please refer to Figure 4 , the conductive layer 440 and the metal layer 460 only cover the bottom and both sides of the surface 420s of the circuit board structure 420. In this way, the sensor connection pads 113 can be exposed to connect the sensor to the sensor circuit board 100 through the sensor connection pads 113. However, the present invention is not limited thereto. In other embodiments, the conductive layer 440 (or the conductive layer 540) and the metal layer 460 (the metal layer 560) may also only cover the bottom of the surface 420s of the circuit board structure 420, but not cover both sides of the surface 420s of the circuit board structure 420.

[0039] Specifically, as Figure 3 shown, the circuit board structure 320 further includes an insulating layer 322, two circuit layers 324, two bonding layers 326, and two cover layers 328. The insulating layer 322 is located between the circuit layers 324, and the bonding layers 326 respectively cover the circuit layers 324, wherein the insulating layer 322 and the circuit layers 324 are located between the two bonding layers 326. The cover layers 328 are respectively located on the bonding layers 326, and the insulating layer 322, the circuit layers 324, and the bonding layers 326 are located between the two cover layers 328. The material of the insulating layer 322 includes but is not limited to materials such as polyimide (PI), liquid crystal polymer (LCP), etc.; the material of the circuit layer 324 may include copper; the material of the bonding layer 326 may include but is not limited to materials such as polyimide or epoxy resin, etc.; and the material of the cover layer 328 may include but is not limited to polyimide or ink.

[0040] In this embodiment, the circuit board structure 320 further includes two other insulating layers (not labeled) located on opposite sides of the insulating layer 322, two other circuit layers (not labeled) located on opposite sides of the circuit layer 324, and two other bonding layers (not labeled) located on opposite sides of the bonding layer 326. However, in various embodiments of the present invention, the number of insulating layers, circuit layers, and bonding layers is not limited to the above embodiments. For example, in some embodiments, the circuit board structure 320 may only include one insulating layer, two circuit layers, and two bonding layers. In other embodiments, the circuit board structure 320 may include five insulating layers, six circuit layers, and six bonding layers.

[0041] Please refer to Figure 4 and Figure 5, the circuit board structures 420 and 520 are similar to the circuit board structure 320, so they will not be described herein. It is worth mentioning that, in this embodiment, the circuit board structure 420 (and the circuit board structure 520) further includes sensor connection pads 113 and a plurality of conductive buried vias 425. The conductive buried vias 425 are disposed between circuit layers (not labeled) within the circuit board structure 420 to electrically connect these circuit layers.

[0042] Please refer to Figure 2 , the present invention can use an axial actuator (not shown) to drive the movable unit 110 of the sensor circuit board 100 to move in the xy plane direction. The axial actuator can be an actuator driven by thermal expansion or voltage, but the present invention is not limited thereto. In addition, embodiments using various actuators as axial actuators are slightly different in structure, so the way of setting them on the sensor circuit board 100 is not limited in the present invention. Further, since the suspensions 131, 132, 133, 134, 135, 136, 137 and 138 have large rigidity and bending fatigue resistance characteristics, they can cooperate with the axial brake to achieve movement and rebound in the plane direction, and high anti-bending characteristics in the height direction. Therefore, during vibration, the sensor 250 disposed on the movable unit 110 only moves in the plane (i.e., the XY plane), and its height does not change, thus not affecting the image quality.

[0043] Please refer to Figures 6A to 6B , which shows Figure 1 a schematic cross-sectional view of the manufacturing method of the sensor circuit board 100 along the line segment A-A in Figure 6A As shown, a substrate 600 is provided. The substrate 600 includes a circuit substrate 602 and two cover layers 328, wherein the circuit substrate 602 is located between the cover layers 328.

[0044] Specifically, the forming steps of the substrate 600 can be as follows: Provide a copper clad laminate (CCL), and pattern the copper clad laminate through processes such as photolithography and etching to form the circuit substrate 602. After forming the circuit substrate 602, copper clad laminates each including an insulating layer and a metal layer are bonded to opposite sides of the circuit substrate 602 with bonding layers 326, and the insulating layer is located between the two metal layers. Then, the metal layers are patterned to form outer circuit layers (not labeled). After forming the above-mentioned outer circuit layers, the cover layers 328 are bonded to the outer circuit layers through two additional bonding layers respectively.

[0045] Next, please refer to Figure 6B, a conductive layer 340 can be deposited on a partial cover layer 328 by means such as sputtering, electroless plating, or evaporation. After forming the conductive layer 340, a metal layer 360 (shown in Figure 3 ) is deposited on the conductive layer 340 by electroplating, and the metal layer 360 contains titanium. In particular, since the metal layer 360 is deposited by electroplating, the material of the conductive layer 340 can include conductive materials such as nickel, chromium, titanium, or graphene, etc., to serve as an electrode layer during the electroplating process, enabling the metal layer 360 to adhere to the conductive layer 340. Thus, the partial sensor circuit board 100 as shown in Figure 3 is substantially completed.

[0046] Please refer to Figures 7A to 7B , which shows Figure 1 a schematic cross-sectional view of the manufacturing method of the sensor circuit board 100 along the B-B line segment in Figure 7A . Please refer to

[0047] . First, a substrate 700 is provided. Since the block (suspension area) along the A-A line segment and the block (active unit area) along the B-B line segment in the sensor circuit board 100 can be formed in the same process, the formation steps of the substrate 700 are the same as those of the substrate 600, so they will not be elaborated here.

[0047] In particular, since the conductive layer 440 and the metal layer 460 in this embodiment do not cover the top of the surface 420s of the circuit board structure 420 (please refer to Figure 4 ). Therefore, please refer to Figure 7B , before forming the conductive layer 440, it also includes setting a mask (not shown) on the top surface 700t of the substrate 700. After setting the mask, the conductive layer 440 is formed on the substrate 700. In this way, after removing the mask, the conductive layer 440 only covers the bottom and both sides of the surface 700s of the substrate 700.

[0048] In summary, the sensor circuit board in the present invention cooperates with the axial brake to generate a thrust or a pulling force. And since the suspension connects the active unit and the fixed unit, through the cooperation of the suspension and the axial actuator, the sensor welded on the active unit can be stabilized, achieving an anti-shake effect. In this way, the sensor can only move in the XY plane and its height will not change, thereby ensuring the stability of the image quality. The suspension in the sensor circuit board can provide a support function and a resilience function, and also provide a signal and power transmission function, thus helping to solve the problem of permanent magnet interfering with signals at present. On the other hand, forming a metal layer containing titanium on the outermost layer of the suspension can further improve the rigidity of the suspension.

[0049] In addition, since the sensor circuit board has high requirements for surface flatness and stability, the present invention uses electroplating to replace the method of bonding with adhesive materials to form a metal layer containing titanium on the outermost layer of the sensor circuit board. In this way, better surface flatness can be obtained, and thus the anti-shake effect of the sensor circuit board can be improved.

[0050] Although the present disclosure has been disclosed as above by way of examples, it is not intended to limit the present disclosure. Any person skilled in the art in this technical field can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to that defined by the appended claims.

[0051]

Symbol Description

[0052] 100: Sensor circuit board

[0053] 110: Moving unit

[0054] 112a, 112b, 124a, 124b: Connection block

[0055] 113: Sensor connection pad

[0056] 120: Fixed unit

[0057] 122: Main body part

[0058] 126: Connection part

[0059] 131, 132, 133, 134, 135, 136, 137, 138: Suspension

[0060] 200: Camera lens

[0061] 250: Sensor

[0062] 320, 420, 520: Circuit board structure

[0063] 322: Insulating layer

[0064] 324: Circuit layer

[0065] 326: Bonding layer

[0066] 328: Cover layer

[0067] 340, 440, 540: Conductive layer

[0068] 360, 460, 560: Metal layer

[0069] 320s, 420s, 520s, 700s: Surface

[0070] 600, 700: Substrate

[0071] 602: Circuit board

[0072] 700t: Top surface

[0073] A-A, B-B, C-C: Line segments

[0074] DX: X-axis direction

[0075] DY: Y-axis direction.

Claims

1. A sensor circuit board, characterized in that, Comprising: An active unit; A fixed unit, spaced around the active unit; and A plurality of suspensions, each of which connects the active unit and the fixed unit; Wherein each of the active unit, the fixed unit and the suspension comprises: A circuit board structure; A conductive layer covering the surface of the circuit board structure; and A metal layer disposed on the conductive layer, wherein the conductive layer is between the circuit board structure and the metal layer, and the metal layer contains titanium.

2. The sensor circuit board according to claim 1, wherein The active unit includes a plurality of sensor connection pads.

3. The sensor circuit board according to claim 1, wherein The suspension is a suspension wire.

4. The sensor circuit board according to claim 1, characterized in that, The circuit board structure comprises: An insulating layer; Two circuit layers, with the insulating layer between the circuit layers; Two bonding layers respectively covering the circuit layers, with the insulating layer and the circuit layers between the bonding layers; And Two covering layers respectively on the bonding layers, and the insulating layer, the circuit layers and the bonding layers are between the covering layers.

5. The sensor circuit board according to claim 1, characterized in that, The width range of the suspension falls between 100μm and 900μm.

6. The sensor circuit board according to claim 1, characterized in that, The active unit further comprises: Two first connection blocks, respectively disposed on opposite sides of the active unit along the X-axis; Wherein the fixed unit further comprises: A main body portion; and Two second connection blocks connecting the main body portion and respectively disposed on opposite outer sides of the active unit along the Y-axis; Wherein each of the suspensions is connected to the active unit through the first connection block and to the fixed unit through the second connection block.

7. The sensor circuit board according to claim 6, wherein, Each of the first connection blocks and each of the second connection blocks are respectively connected by at least two of the suspensions.

8. The sensor circuit board according to claim 7, characterized in that, The minimum spacing range between two of the suspensions connecting the same first connection block and the second connection block falls between 50μm and 900μm.

9. The sensor circuit board according to claim 6, characterized in that, The fixed unit further comprises: A connecting portion connecting the main body portion, with the main body portion between the active unit and the connecting portion.

10. A manufacturing method of a sensor circuit board, characterized in that, Comprising: Providing a substrate, the substrate comprising: A circuit substrate; and Two covering layers, with the circuit substrate between the covering layers; Depositing a conductive layer on a part of the covering layer; Depositing a metal layer on the conductive layer, wherein the metal layer contains titanium, and the way of depositing the metal layer includes electroplating.

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