Low-thermal-resistance composite air duct ATR case

Abstract

The invention discloses a low-thermal-resistance composite air duct ATR case which comprises a left side plate and a right side plate which are oppositely arranged. Mounting frames are arranged between the left side plate and the right side plate and located at the front end and the rear end of the ATR case. A fan box body is arranged between the mounting frame at the front end and the front panel of the ATR case; a heat dissipation module in the front-back direction is arranged between the mounting frame at the front end and the mounting frame at the rear end. The heat dissipation module comprises an air duct penetrating through the front end and the rear end of the heat dissipation module, an air duct side plate of the air duct is used for being connected with a PCB, and the assembly face of the PCB faces the air duct side plate. The heat dissipation module in the front-back direction is designed, then the PCB is connected with the air duct side plate of the heat dissipation module, compared with an existing connection mode, the contact area of the PCB and the air duct side plate is increased, and therefore the heat dissipation effect is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic equipment chassis, and particularly relates to a low thermal resistance composite air duct ATR chassis. Background Art

[0002] Air Transport Radio (ATR) chassis for electronic equipment is widely used in the fields of aerospace, military, and high-performance computing, and is mainly used to install electronic equipment and provide functions of heat dissipation, shielding, and structural support.

[0003] The heat dissipation method of the ATR chassis is mainly air-cooled heat dissipation. Air-cooled heat dissipation uses devices such as fans to generate airflows and accelerate the dissipation of heat inside the chassis. Traditional air-cooled heat dissipation mainly relies on a forced air-cooling system for heat dissipation. Its basic heat dissipation structure is as follows: air ducts are arranged on both sides of the chassis, and heat dissipation fins are arranged in the air ducts; the PCB boards inside the chassis are fixed in the slots by wedge-shaped locking strips; the airflow is driven by an axial flow fan on the front panel, and cold air enters the air duct through the air inlet at the rear end of the side of the chassis, exchanges heat with the heat dissipation fins, and then is discharged.

[0004] However, due to the large number of heat transfer units, there is a high interfacial contact thermal resistance, resulting in a decrease in heat dissipation efficiency. Moreover, in high power density application scenarios, the existing ATR chassis usually uses copper heat pipes to assist in temperature equalization, but its weight is large, and the temperature equalization effect is limited, resulting in an unsatisfactory heat dissipation effect. Summary of the Invention

[0005] The purpose of the present invention is to provide a low thermal resistance composite air duct ATR chassis to improve the heat dissipation efficiency of the ATR chassis.

[0006] The present invention adopts the following technical solutions: a low thermal resistance composite air duct ATR chassis, including a left side plate and a right side plate arranged opposite to each other;

[0007] Mounting frames are arranged between the left side plate and the right side plate and at the front end and the rear end of the ATR chassis; a fan box body is arranged between the mounting frame at the front end and the front panel of the ATR chassis;

[0008] A heat dissipation module is arranged between the mounting frame at the front end and the mounting frame at the rear end and runs in the front-rear direction;

[0009] The heat dissipation module includes an air duct running through its front end and rear end. The air duct side plate of the air duct is used to connect with the PCB board, and the component surface of the PCB board faces the air duct side plate.

[0010] Furthermore, the air duct side plate and the PCB board are connected by a heat pipe.

[0011] Furthermore, the connecting surface of the heat pipe facing the air duct side plate is a flat surface;

[0012] The connection surface of the air duct side plate toward the temperature equalizing plate is a plane;

[0013] The temperature equalizing plate fits tightly with the side panels of the air duct.

[0014] Furthermore, the temperature homogenizing board has a plurality of filling pieces on the connection surface facing the PCB board;

[0015] The filling piece is made of the same material as the temperature equalizer;

[0016] The end surface of the filling piece is closely fitted to the heating element on the PCB board.

[0017] Furthermore, the temperature homogenizing plate is closely fitted to the component surface of the PCB board.

[0018] Furthermore, when the number of the heat dissipation modules is greater than or equal to two, a blocking plate is provided between adjacent air ducts.

[0019] Further, the air duct includes air duct side panels located on both sides;

[0020] The top and bottom ends of the two air duct side panels are connected by an air duct cover plate;

[0021] The air duct side plates and the air duct cover plate form a tubular structure with openings at both ends.

[0022] Furthermore, fins are provided between the two air duct side plates.

[0023] Furthermore, the fins include a plurality of vertical pieces, the plurality of vertical pieces extend from the top end to the bottom end of the air duct, and are staggeredly connected to the two air duct side panels;

[0024] Two adjacent vertical sheets are connected by a transverse sheet, and the transverse sheet extends from one side of the air duct to the other side.

[0025] Furthermore, the air inlet of the ATR chassis is arranged at the rear end of the rear panel or the side panel thereof.

[0026] The beneficial effect of the present invention is that the present invention designs a heat dissipation module that runs forward and backward, and then connects the PCB board with the air duct side plate of the heat dissipation module. Compared with the existing connection method, the contact area between the PCB board and the air duct side plate is increased, thereby improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic structural diagram of a low thermal resistance composite air duct ATR chassis according to an embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of the bottom structure of a low thermal resistance composite air duct ATR chassis according to an embodiment of the present invention;

[0029] Figure 3Schematic side view structure of a low thermal resistance composite air duct ATR chassis according to an embodiment of the present invention;

[0030] Figure 4 Schematic structure of a heat dissipation module according to an embodiment of the present invention;

[0031] Figure 5 Schematic diagram of the heat dissipation principle of a heat dissipation module according to an embodiment of the present invention;

[0032] Figure 6 Schematic structure of a heat dissipation module without a PCB board installed according to an embodiment of the present invention;

[0033] Figure 7 Schematic structure of the air duct of a heat dissipation module according to an embodiment of the present invention;

[0034] Figure 8 Schematic structure of a fin according to an embodiment of the present invention.

[0035] Wherein: 10. Right side plate; 20. Left side plate; 21. Left air inlet;

[0036] 30. Fan housing;

[0037] 40. Heat dissipation module; 41. Left isothermal plate; 42. Air duct cover plate; 43. Right isothermal plate; 44. Fin; 45. Air duct side plate; 46. PCB board; 47. Filler;

[0038] 50. Plug plate; 60. Mounting rack. Detailed implementation manners

[0039] The present invention will be described in detail below with reference to the accompanying drawings and specific implementation manners.

[0040] With the continuous improvement of the integration degree of electronic devices, the power consumption per unit area continues to increase, resulting in a significant increase in the heat flux density inside the ATR chassis. If the heat dissipation capacity is insufficient, the device will face the risk of overheating, affecting stability, reliability, and even shortening the service life. Especially for high-power and low-junction-temperature chips operating in high-temperature environments, higher requirements are put forward for the thermal management ability of the ATR chassis.

[0041] The overall thermal resistance of the traditional ATR chassis is relatively high, and the heat dissipation efficiency is limited. Specifically, the traditional ATR chassis has a large number of transfer units, a long heat conduction path, and the accumulation of contact thermal resistance at multiple interfaces, resulting in insufficient heat dissipation capacity. At the same time, the air duct design is fixed, making it difficult to adapt to different power consumption requirements and unable to flexibly adjust the air flow distribution according to the power consumption density of electronic devices, and the adaptability of the heat dissipation system is poor. Moreover, the heat sources (heating devices) are also signal radiation sources, and they are not effectively isolated, resulting in poor shielding effectiveness of the chassis and affecting the electromagnetic compatibility of the device.

[0042] In summary, the traditional air-cooling method is difficult to effectively reduce the thermal resistance, resulting in heat accumulation and affecting system performance. Therefore, improving the heat dissipation capacity of the chassis, optimizing the heat conduction path, reducing the heat transfer impedance, and improving the temperature uniformity of the heat source surface have become key technical issues to ensure the stable operation of electronic devices.

[0043] In response to the challenge that high-power and low-junction-temperature chips are difficult to operate stably in a high-temperature environment (70°C), the present invention proposes a composite air-cooling system combining a heat pipe and a DC air duct. By reducing the heat transfer units, optimizing the contact thermal resistance between the units, and improving the heat pipe performance, etc., the overall thermal resistance of the ATR chassis is reduced, and the temperature uniformity of the heat source surface is improved, ultimately effectively enhancing the heat dissipation capacity of the ATR chassis.

[0044] The present invention discloses a low-thermal-resistance composite air-duct ATR chassis, as Figure 1 and Figure 2 shown, which includes a left side plate 20 and a right side plate 10 arranged opposite to each other; mounting brackets 60 are provided between the left side plate 20 and the right side plate 10 and at the front and rear ends of the ATR chassis; a fan housing 30 is provided between the front mounting bracket 60 and the front panel of the ATR chassis; a heat dissipation module 40 running in the front-rear direction is provided between the front mounting bracket 60 and the rear mounting bracket 60; the heat dissipation module 40 includes an air duct running through its front and rear ends, and the air duct side plate 45 of the air duct is used to connect with the PCB board 46, and the component side of the PCB board 46 faces the air duct side plate 45.

[0045] By designing the heat dissipation module 40 running in the front-rear direction in the present invention and then connecting the PCB board 46 with the air duct side plate 45 of the heat dissipation module 40, compared with the existing connection method, the contact area between the PCB board 46 and the air duct side plate 45 is increased, thereby improving the heat dissipation effect.

[0046] It should be noted that the low thermal resistance in the present invention means that the ATR chassis of the present invention has a lower thermal resistance compared with the traditional ATR chassis.

[0047] In the present invention, through the design of the heat dissipation module 40, the ATR chassis can be designed with multiple air ducts, that is, the number of air ducts matches the number of heat dissipation modules 40, making the ATR chassis scalable, and the heat dissipation efficiency is greatly improved compared with the heat dissipation structure of the traditional ATR chassis (only having air ducts on both sides of the chassis).

[0048] In addition, in the heat dissipation module, the air duct is parallel and attached to the heat source (PCB board 46), greatly increasing the heat transfer area compared with the traditional ATR chassis (only performing contact heat transfer at the locking strip), and improving the heat transfer efficiency.

[0049] The implementation forms of the mounting bracket 60 are diverse, such as an integrated bracket disposed between the left side plate 20 and the right side plate 10, or a separable bracket (composed of multiple components). Moreover, the structure of the mounting bracket 60 can be designed with hollowing or different thicknesses at different positions to reduce the overall weight or maintain mechanical properties.

[0050] As Figure 3 shown, an air outlet 31 is provided on the front panel of the fan housing 30, and the air flow inside the ATR chassis is discharged through the air outlet 31, thereby realizing the overall air flow circulation. Specifically, the front panel of the fan housing 30 can directly serve as the front side plate of the ATR chassis, thus simplifying the chassis structure.

[0051] In the present invention, as Figure 4 shown, the air duct side plate 45 and the PCB board 46 are connected by a heat pipe. By designing a composite air duct with low thermal resistance, which is composed of a direct current air duct and a heat pipe, the system thermal resistance and the temperature uniformity of the system heat source surface are improved. The present invention adopts a modular air duct structure, enabling the air duct to be flexibly adjusted according to the number of internal modules of the ATR chassis to meet the heat dissipation requirements of computer devices with different power consumptions.

[0052] Moreover, through the air duct compartment layout, the shielding effectiveness of each heat dissipation module in the ATR chassis is effectively improved. A power module is designed at the rear end of the ATR chassis, the functional modules are installed in the functional module compartment (i.e., the position where the heat dissipation modules are installed), and the power-related modules are installed in the power compartment. Through the above layout, the functional modules (sensitive sources) and the power modules (emission sources) are isolated, improving the overall electromagnetic compatibility performance of the device.

[0053] In one embodiment, the connecting surface of the heat pipe facing the air duct side plate 45 is a flat surface; the connecting surface of the air duct side plate 45 facing the heat pipe is a flat surface. Through the two flat surface designs, the heat pipe can be closely attached to the air duct side plate 45, increasing the heat transfer area and reducing the thermal resistance. Moreover, the flat surface shape is easier to process, which can reduce the processing cost while ensuring the heat dissipation effect.

[0054] As Figure 5 shown, it is a schematic diagram of the heat dissipation principle of the heat dissipation module in the embodiment of the present invention. It can be seen from this figure that the PCB board 46 is respectively attached to the left heat pipe 41 and the right heat pipe 43, and the arrow direction in the figure is the heat propagation direction. The heat on the PCB board 46 is transferred to the air duct side plate 45 through the left heat pipe 41 and the right heat pipe 43, and then transferred to the fins 44 through the air duct side plate 45. When there is air flow in the air duct, the air flow will cool the air duct side plate 45 and the fins 44, thereby realizing the heat dissipation process of the heat dissipation module. Compared with the prior art in which the end of the PCB board transfers heat to the air duct through a locking part, the heat dissipation effect of the full-area contact between the air duct and the PCB board 46 in the present invention is significantly more efficient.

[0055] Furthermore, as Figure 6 shown, there are several filling parts 47 on the connecting surface of the heat pipe plate facing the PCB board 46, and the two can be integrally formed; the filling parts 47 are made of the same material as the heat pipe plate; the end faces of the filling parts 47 are in close contact with the heating elements on the PCB board 46. The filling parts 47 are structural parts, and they are filled between the heating elements of the PCB board 46 and the heat pipe plate. As Figure 6 shown, the filling parts 47 have shapes such as cuboid, cylinder, prism, tube, bar, and irregular shape, and these shapes are designed according to the surface shape of the heating elements. For example, when the surface of the heating element is rectangular, the corresponding filling part 47 is designed as a cuboid shape, so that the surfaces of the two are more closely fitted.

[0056] The filling parts 47 can directly transfer the heat generated by the heating elements to the heat pipe plate, and then the heat pipe plate diffuses the heat outward, thereby improving the heat dissipation effect of the heating elements on the PCB board 46. Moreover, the connection stability between the heat pipe plate and the PCB board 46 can also be increased through the filling parts 47. When vibration occurs, it supports the PCB board 46, thus achieving a protective effect.

[0057] More specifically, the heat pipe plate is in close contact with the component surface of the PCB board 46. That is to say, on the basis of adding the filling parts 47, heat-conducting materials can also be added at other positions, so that the heat generated by the PCB board 46 can be quickly dissipated. Preferably, the heat-conducting material is selected as a flexible material, so that the connection heads on the PCB board 46 can be protected.

[0058] In the present invention, the number of the heat dissipation modules 40 can be designed as required. When the number of the heat dissipation modules 40 is greater than or equal to two, there is a baffle 50 between adjacent air ducts. By adding the baffle 50, more cold source gas inhaled from the outside can enter the pre-designed air ducts, increasing the utilization efficiency of the cold source gas.

[0059] In one embodiment, as Figure 7 shown, the air duct includes air duct side plates 45 located on both sides; the tops and bottoms of the two air duct side plates 45 are both connected by air duct covers 42; the air duct side plates 45 and the air duct covers 42 form a tubular structure with openings at both ends. The internal space of this tubular structure forms an air duct, and the air flow circulates through it, taking away the heat to achieve heat dissipation.

[0060] Furthermore, fins 44 are arranged between the two air duct side plates 45. By adding the fins 44, the contact area between the air flow and the air duct can be increased, improving the heat dissipation effect.

[0061] As a realization method, as Figure 8As shown, the fin 44 includes a number of vertical fins (aligned with the direction of the air duct side plate 45). The number of vertical fins extends from the top end to the bottom end of the air duct and is staggeredly connected to the two air duct side plates 45. Each pair of adjacent vertical fins is connected by a horizontal fin (aligned with the direction of the air duct cover plate 42), and the horizontal fin extends from one side of the air duct to the other side. The multiple vertical fins and horizontal fins are integrated into a sheet body with a serpentine shape. By increasing the connection between the vertical fins and the air duct side plate 45, the connection area between the fin 44 and the air duct side plate 45 is increased, enhancing the heat transfer effect.

[0062] The air inlet of the ATR chassis is arranged at the rear end of its rear panel or side panel. As a specific implementation, as Figure 2 shown, a left air inlet 21 is provided at the rear end of the left side plate 20, and a right air inlet (not shown in the figure) is provided at the rear end of the right side plate 10.

[0063] In summary, in the embodiment of the present invention, a low thermal resistance heat conduction path is formed, and the heat transfer path is simplified as: heat source (heating device) → heat pipe → air duct (air duct side plate 45) → air duct (fin 44), thereby reducing the heat transfer unit, reducing the interfacial contact thermal resistance, and improving the heat dissipation efficiency.

[0064] In addition, to meet the lightweight requirements of the chassis, while taking into account corrosion resistance, heat dissipation performance, electromagnetic shielding ability, and structural strength, the present invention uses a Mg alloy cold-sprayed Al coating to optimize the corrosion resistance of the chassis air duct and improve the thermal conductivity and heat dissipation performance. The chassis air duct (air duct side plate 45 and air duct cover plate 42) uses Mg alloy + cold-sprayed Al coating to improve corrosion resistance and thermal conductivity. The chassis shell (such as 6 panels) uses PEEK-CFRP sprayed with Al coating to enhance the electromagnetic shielding ability, thereby breaking through the application bottleneck of composite materials in electronic device chassis and providing an innovative solution for the engineering of lightweight and high-performance chassis.

[0065] By solving the two technical problems of "improving heat dissipation capacity" and "lightweight", the comprehensive performance of the electronic device is significantly improved. In terms of heat dissipation, the optimized composite air-cooling system reduces the internal thermal resistance of the chassis, improves the temperature uniformity of the heat source surface, and ensures the stable operation of high heat flux density electronic devices in high-temperature environments, thereby enhancing the reliability and service life of the device. In terms of lightweight, the chassis weight is reduced through new materials and surface modification technologies, while maintaining structural strength and electromagnetic shielding ability, reducing system load, and improving the mobility and endurance of the device. Overall, the research results not only improve the thermal management performance of the chassis but also optimize the structural design, providing technical support for the application of high-performance and lightweight electronic devices in complex environments.

[0066] To verify the performance of the ATR chassis of the present invention, a test experiment was carried out with a traditional ATR chassis.

[0067] The test was carried out in a high - temperature environment with the temperature set at +70°C to compare and test the heat dissipation performance of the low - thermal - resistance ATR chassis of the present invention and the traditional ATR chassis. The ATR chassis of the present invention has three heat - dissipation modules (one of the heat - dissipation modules is only connected to the PCB board 46 on one side), and the air ducts of the traditional ATR chassis are only distributed on the left and right sides of its chassis.

[0068] The two chassis use the same air duct (that is, under the same heat - dissipation conditions for a single air duct, the air - duct size and material are the same), fan, and heat - source (heating module) parameters, which are specifically as follows:

[0069] Fan parameters: 2 axial - flow fans are arranged at the front end of the chassis, with an air volume of 4.98 m 3 / h and a wind pressure of 130.1 Pa.

[0070] Air - duct design: The fin thickness is 2.2 mm and the spacing is 3 mm.

[0071] Thermal power consumption: The full - load power consumption of the whole machine is about 281 W. Among them: for 4 functional modules, the thermal power consumption of a single module is 60.6 W; for 1 power module, the thermal power consumption is 38.6 W.

[0072] Thermal - conductive interface material: A thermal - conductive cotton (with a thermal - conductivity coefficient of about 15 W / m·K) is filled between the chip and the heat - spreader.

[0073] Test results:

[0074] 1. Test results of the low - thermal - resistance ATR chassis.

[0075] When operating at full load in a high - temperature environment of +70°C, after reaching thermal equilibrium (about 45 minutes), the temperature peak of the device with the maximum power consumption in the functional module (CPU) is 90.7°C. This temperature does not exceed the processor's shutdown temperature (100°C), meeting the usage requirements in a high - temperature environment.

[0076] 2. Test results of the traditional ATR chassis.

[0077] When tested under the same conditions, after reaching thermal equilibrium (about 45 minutes), the temperature peak of the device with the maximum power consumption in the functional module (CPU) reaches 113.6°C. Shutdown occurred before thermal equilibrium, exceeding the processor's shutdown temperature (100°C), and it cannot meet the high - temperature usage requirements.

[0078] Test conclusion:

[0079] The results of the comparative tests show that the heat dissipation performance of the low thermal resistance ATR chassis of the present invention is significantly better than that of the traditional ATR chassis. Under the same environmental and thermal load conditions, the low thermal resistance ATR chassis can effectively reduce the CPU temperature and enable it to operate stably in a high-temperature environment, while the traditional ATR chassis causes the CPU to overheat and crash due to insufficient heat dissipation. This verifies the advantage of the present invention in high-temperature heat dissipation and can meet the usage requirements of electronic devices in harsh environments.

Claims

1. A low thermal resistance composite air duct ATR chassis, characterized in that, It comprises a left side plate (20) and a right side plate (10) which are arranged opposite to each other; A mounting frame (60) is disposed between the left side plate (20) and the right side plate (10) and at the front and rear ends of the ATR chassis; a fan housing (30) is disposed between the mounting frame (60) at the front end and the front panel of the ATR chassis; A heat dissipation module (40) extending forward and backward is arranged between the front mounting frame (60) and the rear mounting frame (60); The heat dissipation module (40) comprises an air duct running through the front and rear ends thereof, the air duct side plate (45) of the air duct being used to be connected to a PCB board (46), and the component surface of the PCB board (46) facing the air duct side plate (45).

2. The low thermal resistance composite air duct ATR chassis according to claim 1, wherein The air duct side plate (45) and the PCB board (46) are connected via a temperature equalizing plate.

3. The low thermal resistance composite air duct ATR chassis according to claim 2, characterized in that, The connection surface of the temperature equalizing plate toward the air duct side plate (45) is a plane; The connection surface of the air duct side plate (45) facing the temperature uniform plate is a plane; The temperature equalizing plate is tightly fitted to the air duct side plate (45).

4. A low thermal resistance composite air duct ATR chassis according to claim 2 or 3, characterized in that, The temperature equalizing plate has a plurality of filling pieces (47) on its connection surface facing the PCB board (46); The filling piece (47) is made of the same material as the temperature equalizing plate; The end surface of the filling piece (47) is tightly fitted to the heating element on the PCB board (46).

5. The low thermal resistance composite air duct ATR chassis according to claim 4, characterized in that, The temperature equalizing plate is tightly fitted to the component surface of the PCB board (46).

6. A low thermal resistance composite air duct ATR chassis according to claim 2 or 3, characterized in that When the number of the heat dissipation modules (40) is greater than or equal to two, a blocking plate (50) is provided between adjacent air ducts.

7. The low thermal resistance composite air duct ATR chassis according to claim 6, characterized in that, The air duct comprises air duct side plates (45) located on both sides; The top ends and bottom ends of the two air duct side plates (45) are connected via an air duct cover plate (42); The air duct side plate (45) and the air duct cover plate (42) form a tubular structure with openings at both ends.

8. The low thermal resistance composite air duct ATR chassis according to claim 2 or 3, characterized in that, A fin (44) is provided between the two air duct side plates (45).

9. The low thermal resistance composite air duct ATR chassis according to claim 8, wherein, The fins (44) include a plurality of vertical pieces, the plurality of vertical pieces extending from the top end to the bottom end of the air duct and being staggeredly connected to the two air duct side plates (45); Two adjacent vertical sheets are connected by a transverse sheet, and the transverse sheet extends from one side of the air duct to the other side.

10. A low thermal resistance composite air duct ATR chassis according to claim 9, characterized in that, The air inlet of the ATR chassis is arranged at the rear end of the rear panel or the side panel thereof.

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