Preparation method of light-emitting device

Abstract

The invention discloses a preparation method of a light-emitting device. The light-emitting device at least comprises a circuit substrate, a light-emitting unit and an integrated circuit chip. The circuit substrate comprises a first connecting surface and a second connecting surface deviating from the first connecting surface, the first connecting surface is used for being electrically connected with the light-emitting unit through a connecting material, and the second connecting surface is used for being electrically connected with the integrated circuit chip through the connecting material; the preparation method of the light-emitting device comprises the following steps: providing a circuit substrate; connecting a light-emitting unit to the first connecting surface of the circuit substrate; a first protective film is arranged on the side, away from the circuit substrate, of the light-emitting unit, and the first protective film is configured to protect the light-emitting unit and the circuit substrate; an integrated circuit chip is connected to the second connection surface of the circuit board. Based on the scheme, the light-emitting unit can be prevented from being adhered with foreign matters or damaged, so that the electrical performance of the light-emitting device is prevented from being influenced.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and particularly to a method for manufacturing a light-emitting device. Background Art

[0002] Mini-LED (Light Emitting Diode) adopts self-luminous technology and is an upgrade of traditional OLED (Organic Light-Emitting Diode). Compared with traditional OLED technology, Mini-LED can achieve higher display image quality based on a high-density LED light-emitting unit array.

[0003] Taking the preparation of a Mini-LED light-emitting device by the COB process as an example, it is necessary to electrically connect the light-emitting unit and the integrated circuit chip to a circuit board, generally by soldering, and this process will transfer the circuit board multiple times. The light-emitting unit is relatively fragile. If it is contaminated with foreign substances such as solder or dust or damaged, it will affect the electrical performance of the light-emitting device. Summary of the Invention

[0004] The present application provides a method for manufacturing a light-emitting device, and the light-emitting device at least includes a circuit board, a light-emitting unit, and an integrated circuit chip;

[0005] The circuit board includes a first connection surface and a second connection surface facing away from the first connection surface. The first connection surface is used to electrically connect the light-emitting unit through a connection material, and the second connection surface is used to electrically connect the integrated circuit chip through a connection material;

[0006] The manufacturing method includes:

[0007] Providing the circuit board;

[0008] Connecting the light-emitting unit to the first connection surface of the circuit board;

[0009] Providing a first protective film on a side of the light-emitting unit facing away from the circuit board, and the first protective film is configured to protect the light-emitting unit and the circuit board;

[0010] Connecting the integrated circuit chip to the second connection surface of the circuit board.

[0011] In the above solution, after connecting the light-emitting unit in the embodiment of the present application, a first protective film is directly disposed on the side of the light-emitting unit facing away from the circuit board. Thus, even if foreign matters such as solder or dust are generated in the subsequent process, they cannot adhere to the light-emitting unit, and due to the protection of the first protective film, damage to the light-emitting unit during the preparation process of the light-emitting unit can be avoided. In summary, the method for preparing a light-emitting device provided by the embodiment of the present application can prevent foreign matters from adhering to the light-emitting unit or causing damage, thereby avoiding affecting the electrical performance of the light-emitting device. Description of the Drawings

[0012] Figure 1 Schematic flow chart of a method for preparing a light-emitting device provided by one or more embodiments of the present application;

[0013] Figure 2 Schematic flow chart of another method for preparing a light-emitting device provided by one or more embodiments of the present application;

[0014] Figure 3 Schematic flow chart of another method for preparing a light-emitting device provided by one or more embodiments of the present application;

[0015] Figure 4 Schematic flow chart of another method for preparing a light-emitting device provided by one or more embodiments of the present application;

[0016] Figure 5 Schematic flow chart of another method for preparing a light-emitting device provided by one or more embodiments of the present application;

[0017] Figure 6 Schematic flow chart of another method for preparing a light-emitting device provided by one or more embodiments of the present application;

[0018] Figure 7 Schematic flow chart of another method for preparing a light-emitting device provided by one or more embodiments of the present application;

[0019] Figure 8 Schematic flow chart of another method for preparing a light-emitting device provided by one or more embodiments of the present application;

[0020] Figure 9 Schematic diagram of a circuit board structure provided by one or more embodiments of the present application;

[0021] Figure 10 Schematic diagram of another circuit board structure provided by one or more embodiments of the present application;

[0022] Figure 11 Schematic diagram of another circuit board structure provided by one or more embodiments of the present application;

[0023] Figure 12 Another schematic diagram of a circuit board structure provided for one or more embodiments of the present application;

[0024] Figure 13 Another schematic diagram of a circuit board structure provided for one or more embodiments of the present application;

[0025] Figure 14 Another schematic diagram of a circuit board structure provided for one or more embodiments of the present application;

[0026] Figure 15 Another schematic diagram of a circuit board structure provided for one or more embodiments of the present application;

[0027] Figure 16 Another schematic diagram of a circuit board structure provided for one or more embodiments of the present application;

[0028] Figure 17 Another schematic diagram of a circuit board structure provided for one or more embodiments of the present application;

[0029] Figure 18 Another schematic diagram of a circuit board structure provided for one or more embodiments of the present application;

[0030] Figure 19 Another schematic diagram of a circuit board structure provided for one or more embodiments of the present application;

[0031] Figure 20 Another schematic diagram of a circuit board structure provided for one or more embodiments of the present application;

[0032] Figure 21 Another schematic diagram of a circuit board structure provided for one or more embodiments of the present application. Detailed implementation manners

[0033] To make the objectives and implementation manners of the present application clearer, the following will clearly and completely describe the exemplary implementation manners of the present application with reference to the accompanying drawings in the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0034] It should be noted that the brief description of the terms in the present application is only for facilitating the understanding of the subsequent described implementation manners, rather than intending to limit the implementation manners of the present application. Unless otherwise specified, these terms should be understood according to their ordinary and common meanings.

[0035] In this application, terms such as "first", "second", "third", etc. in the description, claims, and the above-mentioned drawings are used to distinguish similar or homogeneous objects or entities, and do not necessarily imply a limitation on a specific order or sequence, unless otherwise noted. It should be understood that such terms can be interchanged under appropriate circumstances.

[0036] The terms "comprising", "having", and any variations thereof are intended to cover but not be exclusive of inclusion. For example, a product or device comprising a series of components does not necessarily have to be limited to all the components clearly listed, but may include other components not clearly listed or inherent to these products or devices.

[0037] An exemplary description of a method for manufacturing a light-emitting device provided in an embodiment of this application will be given below in conjunction with the drawings.

[0038] Manufacturing a display panel requires multiple complex processes. During the manufacturing process of the unfinished display substrate, operations such as soldering and transferring need to be performed multiple times. During this process, the light-emitting units are likely to be contaminated with foreign objects or damaged, which in turn affects the electrical performance of the light-emitting units, and ultimately affects the display of the light-emitting device.

[0039] To solve the above technical problems, an embodiment of this application provides a method for manufacturing a light-emitting device. Figure 1 It is a schematic flow diagram of a method for manufacturing a light-emitting device provided for one or more embodiments of this application. The light-emitting device at least includes a circuit board, a light-emitting unit, and an integrated circuit chip;

[0040] The circuit board includes a first connection surface and a second connection surface facing away from the first connection surface. The first connection surface is used to electrically connect the light-emitting unit through a connection material, and the second connection surface is used to electrically connect the integrated circuit chip through a connection material;

[0041] The method for manufacturing a light-emitting device includes:

[0042] S101. Provide a circuit board;

[0043] S102. Connect a light-emitting unit to the first connection surface of the circuit board;

[0044] S103. Provide a first protective film on the side of the light-emitting unit facing away from the circuit board. The first protective film is configured to protect the light-emitting unit and the circuit board;

[0045] S104. Connect an integrated circuit chip to the second connection surface of the circuit board.

[0046] The light-emitting device in the embodiment of the present application refers to a functional device capable of emitting light from a light-emitting unit, and the light-emitting unit is controlled by an integrated circuit chip. Exemplarily, the light-emitting device in the embodiment of the present application may be a MINI-LED display panel. Taking the MINI-LED display panel manufactured by the COB process as an example, both the light-emitting unit and the integrated circuit chip are electrically connected to the circuit board by soldering. The circuit board may be a PCB (Printed Circuit Board). The light-emitting unit may be a MINI LED chip, which is cut from an LED wafer. Generally, the length of the Mini LED chip is 100-300 μm, and the width of the MINI LED chip is 100-300 μm. The circuit board is provided with pads corresponding to the MINI LED chips, and the MINI LED chips are soldered on the corresponding pads to form a MINI LED chip array. The integrated circuit chip is a functional device for controlling the light-emitting unit to emit light, such as an IC chip, etc., and the integrated circuit chip is electrically connected to the light-emitting unit.

[0047] In the embodiment of the present application, after providing the circuit board, the light-emitting unit can be connected to the first connection surface of the circuit board. Among them, the methods of connecting the light-emitting unit and the integrated circuit chip can be soldering. After connecting the light-emitting unit, the circuit board needs to be transferred for subsequent processes. In the embodiment of the present application, a first protective film can be directly provided on the side of the light-emitting unit facing away from the circuit board after connecting the light-emitting unit. Among them, the method of providing the first protective film can be attaching the first protective film. The first protective film is used to protect the light-emitting unit that has been connected to the circuit board and the circuit board itself, preventing damage to the circuit board itself and the light-emitting unit during the transfer of the circuit board. In addition, since the first protective film covers the side of the light-emitting unit facing away from the circuit board, dust and other foreign objects during the manufacturing process cannot fall on the light-emitting unit and the circuit board.

[0048] After that, the circuit integration chip is connected to the second connection surface of the circuit board. The method of connecting the circuit integration chip is generally soldering by soldering. During this process, the solder is likely to splash, flow back, etc. Since the first protective film is provided on the side of the light-emitting unit facing away from the circuit board, the first protective film can better protect the light-emitting unit and the first connection surface of the circuit board. Therefore, even if the solder splashes, flows back, etc., it cannot contaminate the integrated circuit chip.

[0049] Based on the above solution, the embodiment of the present application can avoid foreign objects adhering to the light-emitting unit or causing damage, thereby avoiding affecting the electrical performance of the light-emitting device.

[0050] Figure 2Schematic flow chart of a preparation method for another light-emitting device provided for one or more embodiments of the present application; in some embodiments, before connecting the light-emitting unit to the first connection surface of the circuit board, it further includes:

[0051] S201. Set a second protective film on the first connection surface of the circuit board to protect the first connection surface.

[0052] S202. Set a third protective film on the second connection surface of the circuit board to protect the second connection surface.

[0053] The circuit board is generally stored in a vacuum package. To prepare the light-emitting device, the circuit board needs to be removed from the vacuum package and transferred to the machine for connecting the light-emitting unit. During the transfer of the circuit board, it may cause damage to the first connection surface and the second connection surface of the circuit board. There are a large number of pads on the first connection surface and the second connection surface of the circuit board, and the pads are used to connect the light-emitting unit and the integrated circuit chip. If the pads are damaged, the connection between the light-emitting unit and the integrated circuit chip will be affected.

[0054] In the embodiments of the present application, after providing the circuit board, that is, after removing the circuit board from the vacuum package and before transferring the circuit board to the machine for connecting the light-emitting unit, a second protective film can be set on the first connection surface of the circuit board, and a third protective film can be set on the second connection surface of the circuit board. Since the second protective film and the third protective film are respectively set on the first connection surface and the second connection surface of the circuit board, damage to the circuit board during the transfer of the circuit board can be prevented.

[0055] Since the pads on the first connection surface are more dense, more numerous and more precise, preferably, in the embodiments of the present application, the second protective film is first set on the first connection surface, and then the third protective film is set on the second connection surface. Based on the above solution, the embodiments of the present application can protect the circuit board to a greater extent and reduce the possibility of damage to the circuit board.

[0056] It should be noted that in the embodiments of the present application, the order of setting the second protective film and the third protective film can also be changed according to actual needs. For example, the third protective film can be first set on the second connection surface of the circuit board, and then the second protective film can be set on the first connection surface of the circuit board.

[0057] Figure 3 Schematic flow chart of a preparation method for another light-emitting device provided for one or more embodiments of the present application; in some embodiments, after setting the third protective film on the second connection surface of the circuit board and before connecting the light-emitting unit to the first connection surface of the circuit board, it further includes:

[0058] S301. Remove the second protective film set on the first connection surface of the circuit board.

[0059] After a second protective film is provided on the first connection surface of the circuit board and a third protective film is provided on the second connection surface of the circuit board, it is relatively convenient to transfer the circuit board to the machine for connecting the light-emitting unit.

[0060] Before connecting the light-emitting unit, it is necessary to first remove the second protective film provided on the first connection surface of the circuit board, and then connect the light-emitting unit to the first connection surface.

[0061] During the process of providing the second protective film, there may still be a certain amount of dust and other foreign objects adhering to the surface of the first connection surface. In the embodiment of the present application, it can be set that one side of the second protective film facing the first connection surface has a certain adhesiveness. Thus, the dust and other foreign objects adhering to the surface of the first connection surface can be adhered and removed, playing a role in cleaning the first connection surface. After that, the light-emitting unit can be connected to the first connection surface of the circuit board.

[0062] Figure 4 It is a schematic flow chart of a preparation method of another light-emitting device provided for one or more embodiments of the present application; in some embodiments, after a first protective film is provided on the side of the light-emitting unit facing away from the circuit board and before an integrated circuit chip is connected to the second connection surface of the circuit board, it further includes:

[0063] S401. Remove the third protective film provided on the second connection surface of the circuit board.

[0064] After a first protective film is provided on the side of the light-emitting unit facing away from the circuit board, the integrated circuit chip can be connected to the second connection surface of the circuit board. During the process of providing the third protective film, there may still be a certain amount of dust and other foreign objects adhering to the second connection surface. Similarly to the corresponding embodiment above, in the embodiment of the present application, it can be set that one side of the third protective film facing the second connection surface has a certain adhesiveness. Thus, the dust and other foreign objects adhering to the surface of the second connection surface can be adhered and removed, playing a role in cleaning the second connection surface. After that, the integrated circuit chip can be connected to the second connection surface of the circuit board. Figure 3 After connecting the integrated circuit chip, subsequent processes of the light-emitting device need to be carried out, such as connecting other film layer structures. Therefore, it is necessary to transfer the circuit board.

[0065] Figure 5 It is a schematic flow chart of a preparation method of another light-emitting device provided for one or more embodiments of the present application; in some embodiments, after an integrated circuit chip is connected to the second connection surface of the circuit board, it further includes:

[0066] S501. Provide a fourth protective film on the side of the integrated circuit chip facing away from the circuit board.

[0067] After connecting the integrated circuit chip, subsequent processes of the light-emitting device need to be carried out, such as connecting other film layer structures. Therefore, it is necessary to transfer the circuit board.

[0068] In the embodiment of the present application, after connecting the integrated circuit chip to the second connection surface of the circuit board, a fourth protective film can be provided on the side of the integrated circuit chip facing away from the circuit board, which plays a role in protecting the integrated circuit chip, preventing the integrated circuit chip from being damaged or adhering to foreign matters such as dust during the process of transferring the circuit board.

[0069] Figure 6 It is a schematic flow chart of a preparation method of another light-emitting device provided for one or more embodiments of the present application; in some embodiments, after providing the fourth protective film on the side of the integrated circuit chip facing away from the circuit board, it further includes:

[0070] S601. Remove the fourth protective film provided on the side of the integrated circuit chip facing away from the circuit board;

[0071] S602. Seal the second connection surface where the integrated circuit chip is located.

[0072] In the embodiment of the present application, after providing the fourth protective film on the side of the integrated circuit chip facing away from the circuit board, the circuit board is transferred to the machine platform for sealant preparation. Before sealant application, the fourth protective film provided on the side of the integrated circuit chip facing away from the circuit board can be removed, and the second connection surface where the integrated circuit chip is located is sealed to form a sealant layer. Among them, the sealant layer is used to protect and fix the integrated circuit chip.

[0073] In the embodiment of the present application, epoxy resin, expansion monomer and curing agent can be mixed and then coated on the integrated circuit chip, and an encapsulation layer is formed on the integrated circuit chip after the coating is dried.

[0074] In a specific embodiment of the present application, the weight ratio of each component in the encapsulation layer is 85 - 115 parts by weight of epoxy resin, 2 - 7 parts by weight of expansion monomer and 0.1 - 1 part by weight of curing agent. The epoxy resin includes but is not limited to epoxy resin, and can also be modified epoxy resin, preferably epoxy acrylate.

[0075] Epoxy resin refers to an organic compound containing two or more epoxy groups in the molecule. The molecular structure of epoxy resin is characterized by the presence of active epoxy groups in the molecular chain. The epoxy groups can be located at the end, middle or in a cyclic structure of the molecular chain. The cured epoxy resin has good physical and chemical properties. It has excellent adhesion strength to the surfaces of metal and non-metal materials, good dielectric properties, small deformation shrinkage rate, good dimensional stability of the product, high hardness and good flexibility. Such as glycidyl ether epoxy resin, glycidyl ester epoxy resin or glycidyl amine epoxy resin, bisphenol A epoxy resin, etc. Epoxy acrylate, also known as vinyl ester resin, is a modified epoxy resin obtained by reacting epoxy resin and acrylic acid and dissolving it in styrene, and is a thermosetting resin. It has excellent water resistance, hot water resistance, drug resistance, adhesiveness and toughness, and bisphenol A epoxy acrylate can be selected, etc.

[0076] An expanding monomer is a type of monomer substance that can expand in volume during the polymerization process, and the volume of the substance is significantly increased compared to the monomer state after the polymerization reaction is completed. In the embodiments of the present application, the expanding monomer is a spiro orthoester SOE, a spiro orthocarbonate SOC, a ketal lactone PKl, or a bicyclic orthoester BOE, such as ethylenediaminetetraacetic anhydride EDTAD, 2-chlorotoluene-8,9-benzo-1,4,6-trioxaspiro[4,4]nonane, or 3,9-bis(p-methoxybenzyl)-1,5,7,11-tetraoxaspiro[5,5]undecane, etc. The expanding monomer opens the ring during the curing process and the volume becomes larger, which can be used to offset the shrinkage stress generated during the curing of the encapsulation layer.

[0077] The curing agent, also known as the hardening agent, is used to enhance and control the curing reaction of the epoxy resin, enabling the epoxy resin to achieve curing through condensation, ring closure, addition, or catalysis, etc., to ensure the performance of the encapsulation layer after curing. An expanding monomer is a type of monomer substance that can expand in volume during the polymerization process, and the volume of the substance is significantly increased compared to the monomer state after the polymerization reaction is completed. The curing agent can be a chain-flexible aromatic diamine, etc.

[0078] Adding a curing agent and an expanding monomer to the epoxy acrylate not only ensures the original excellent properties of the epoxy acrylate but also reduces the curing shrinkage rate of the epoxy acrylate and reduces the curing stress, which can both ensure the firmness of the encapsulation and effectively avoid the displacement of the integrated circuit chip and the light-emitting unit during the encapsulation process.

[0079] Figure 7 It is a schematic flow chart of a preparation method of another light-emitting device provided for one or more embodiments of the present application; in some embodiments, after sealing the second connection surface where the integrated circuit chip is located, it further includes:

[0080] S701. Remove the first protective film provided on the side of the light-emitting unit facing away from the circuit board;

[0081] S702. Seal the first connection surface where the light-emitting unit is located.

[0082] In the embodiments of the present application, after sealing the second connection surface where the integrated circuit chip is located, the first connection surface where the light-emitting unit is located can be sealed. Before sealing the first connection surface where the light-emitting unit is located, the first protective film provided on the side of the light-emitting unit facing away from the circuit board can be removed, and then the first connection surface where the light-emitting unit is located is sealed to form a sealing layer. Among them, the sealing layer is used to protect and fix the light-emitting unit and the integrated circuit chip. Among them, the sealing layer is used to protect and fix the integrated circuit chip.

[0083] In the embodiments of the present application, epoxy resin, an expanding monomer, and a curing agent can be mixed and then coated on an integrated circuit chip. After the coating dries, a packaging layer is formed on the integrated circuit chip. Among them, the encapsulation layer is used to protect and fix the light-emitting unit.

[0084] In the embodiments of the present application, epoxy resin, an expanding monomer, and a curing agent can be mixed and then coated on the light-emitting unit. After the coating dries, a packaging layer is formed on the light-emitting unit.

[0085] In some embodiments, if the encapsulation of the first connection surface where the light-emitting unit is located and the second connection surface where the integrated circuit chip is located is carried out in the same machine, the fourth protective film provided on the side of the integrated circuit chip facing away from the circuit board and the first protective film provided on the side of the light-emitting unit facing away from the circuit board can be removed in sequence first, and then the second connection surface where the integrated circuit chip is located and the first connection surface where the light-emitting unit is located are encapsulated.

[0086] In some embodiments, the materials of the first protective film, the second protective film, the third protective film, and the fourth protective film at least include polyimide.

[0087] The polyimide material has better high-temperature resistance, radiation resistance, chemical corrosion resistance, waterproof and moisture-proof properties, and electrical insulation properties. Using the first protective film, the second protective film, the third protective film, and the fourth protective film made of polyimide can play a better protective role for the first connection surface, the second connection surface, the light-emitting unit, and the integrated circuit chip.

[0088] In some embodiments, the thicknesses of the first protective film, the second protective film, the third protective film, and the fourth protective film are between 0.03 mm and 0.1 mm.

[0089] After research, it is found that when the thicknesses of the first protective film, the second protective film, the third protective film, and the fourth protective film are between 0.03 mm and 0.1 mm, it can not only play a better protective role, but also will not cause the weight of the protective film itself to be too large to crush the corresponding device due to excessive thickness. And the protective film with a thickness between 0.03 mm and 0.1 mm is relatively common, which can reduce the difficulty of providing the protective film.

[0090] In some embodiments, the melting temperatures of the first protective film, the second protective film, the third protective film, and the fourth protective film are greater than or equal to 300 °C.

[0091] During the process of manufacturing a light-emitting device, there are scenarios with relatively high temperatures. If the melting temperatures of the first protective film, the second protective film, the third protective film, and the fourth protective film are too low, they will adhere to the corresponding surfaces they are set on after melting, not only failing to play a protective role but also causing contamination. Based on the actual situation, in the embodiments of the present application, the melting temperatures of the first protective film, the second protective film, the third protective film, and the fourth protective film are set to be greater than or equal to 300 °C. Thus, even when encountering high-temperature scenarios during the process of manufacturing a light-emitting device, the first protective film, the second protective film, the third protective film, and the fourth protective film will not melt, and a better protective effect can be achieved. Preferably, the first protective film, the second protective film, the third protective film, and the fourth protective film in the embodiments of the present application can withstand a temperature of 260 °C for a long time and 300 °C for a short time (10 minutes).

[0092] To more clearly illustrate the embodiments of the present application, the following provides a schematic diagram of the completion process of a method for manufacturing a light-emitting device and a corresponding schematic diagram of the structure of the light-emitting device. Figure 8 A schematic diagram of the process of another method for manufacturing a light-emitting device provided by one or more embodiments of the present application.

[0093] S801. Take out the circuit board 100 from the vacuum packaging;

[0094] The structure of the circuit board 100 is as Figure 9 shown Figure 9 A schematic diagram of the structure of a circuit board provided by one or more embodiments of the present application.

[0095] S802. Set the second protective film 202 on the first connection surface of the circuit board 100;

[0096] The structure of the circuit board 100 after setting the second protective film 202 is as Figure 10 shown Figure 10 Another schematic diagram of the structure of a circuit board provided by one or more embodiments of the present application.

[0097] S803. Set the third protective film 203 on the second connection surface of the circuit board 100;

[0098] The structure of the circuit board 100 after setting the third protective film 203 is as Figure 11 shown Figure 11 Another schematic diagram of the structure of a circuit board provided by one or more embodiments of the present application.

[0099] S804. Transfer the circuit board 100 to the machine where the light-emitting unit 200 is connected;

[0100] S805. Remove the second protective film 202 set on the first connection surface of the circuit board 100;

[0101] The structure of the circuit board 100 after removing the second protective film 202 is as follows Figure 12 shown Figure 12 which is another schematic diagram of the structure of the circuit board provided by one or more embodiments of the present application.

[0102] S806. Connect the light-emitting unit 200 to the first connection surface of the circuit board 100;

[0103] The structure of the circuit board 100 after connecting the light-emitting unit 200 is as follows Figure 13 shown Figure 13 which is another schematic diagram of the structure of the circuit board provided by one or more embodiments of the present application.

[0104] S807. Provide a first protective film 201 on the side of the light-emitting unit 200 facing away from the circuit board 100;

[0105] The structure of the circuit board 100 after providing the first protective film 201 is as follows Figure 14 shown Figure 14 which is another schematic diagram of the structure of the circuit board provided by one or more embodiments of the present application.

[0106] S808. Transfer the circuit board 100 to the machine where the integrated circuit chip 300 is connected;

[0107] S809. Remove the third protective film 203 provided on the second connection surface of the circuit board 100;

[0108] The structure of the circuit board 100 after removing the third protective film 203 is as follows Figure 15 shown Figure 15 which is another schematic diagram of the structure of the circuit board provided by one or more embodiments of the present application.

[0109] S810. Connect the integrated circuit chip 300 to the second connection surface of the circuit board 100;

[0110] The structure of the circuit board 100 after connecting the integrated circuit chip 300 is as follows Figure 16 shown Figure 16 which is another schematic diagram of the structure of the circuit board provided by one or more embodiments of the present application.

[0111] S811. Provide a fourth protective film 204 on the side of the integrated circuit facing away from the circuit board 100;

[0112] The structure of the circuit board 100 after providing the fourth protective film 204 is as follows Figure 17 shown Figure 17 which is another schematic diagram of the structure of the circuit board provided by one or more embodiments of the present application.

[0113] S812. Transfer the circuit board 100 to the machine for encapsulating the second connection surface where the integrated circuit chip 300 is located;

[0114] S813. Remove the fourth protective film 204 provided on the side of the integrated circuit chip 300 facing away from the circuit board 100;

[0115] The structure of the circuit board 100 after the fourth protective film 204 is provided is as Figure 18 shown, Figure 18 which is another schematic diagram of the circuit board structure provided by one or more embodiments of the present application.

[0116] S814. Encapsulate the second connection surface where the integrated circuit chip 300 is located to form the first encapsulation layer 400;

[0117] The structure of the circuit board 100 after the first encapsulation layer 400 is formed is as Figure 19 shown, Figure 19 which is another schematic diagram of the circuit board structure provided by one or more embodiments of the present application.

[0118] S815. Transfer the circuit board 100 to the machine for encapsulating the first connection surface where the light-emitting unit 200 is located;

[0119] S816. Remove the first protective film 201 provided on the side of the light-emitting unit 200 facing away from the circuit board 100;

[0120] The structure of the circuit board 100 after the first protective film 201 is removed is as Figure 20 shown, Figure 20 which is another schematic diagram of the circuit board structure provided by one or more embodiments of the present application.

[0121] S817. Encapsulate the first connection surface where the light-emitting unit 200 is located to form the second encapsulation layer 500.

[0122] The structure of the circuit board 100 after the second encapsulation layer 500 is formed is as Figure 21 shown, Figure 21 which is another schematic diagram of the circuit board structure provided by one or more embodiments of the present application.

[0123] Among them, in the embodiments of the present application, the method of setting and / or removing the first protective film, the second protective film, the third protective film, and the fourth protective film may be manual removal or machine removal, which is not limited herein.

[0124] The embodiments of the present application also provide a light-emitting device, which is made by the above-mentioned preparation method of the light-emitting device.

[0125] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0126] For the sake of explanation, the above description has been made in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or to limit the embodiments to the specific forms disclosed above. According to the above teachings, various modifications and variations can be obtained. The selection and description of the above embodiments are for the purpose of better explaining the principles and practical applications, so that those skilled in the art can better use the embodiments and various different modified embodiments suitable for specific use considerations.

Claims

1. A method for preparing a light-emitting device, characterized in that, The light-emitting device at least includes a circuit board, a light-emitting unit, and an integrated circuit chip; The circuit board includes a first connection surface and a second connection surface facing away from the first connection surface. The first connection surface is used to electrically connect the light-emitting unit through a connection material, and the second connection surface is used to electrically connect the integrated circuit chip through a connection material; The manufacturing method of the light-emitting device includes: Providing the circuit board; Connecting the light-emitting unit to the first connection surface of the circuit board; Providing a first protective film on a side of the light-emitting unit facing away from the circuit board, the first protective film being configured to protect the light-emitting unit and the circuit board; Connecting the integrated circuit chip to the second connection surface of the circuit board.

2. The manufacturing method of the light-emitting device according to claim 1, characterized in that, Before connecting the light-emitting unit to the first connection surface of the circuit board, it further includes: Providing a second protective film on the first connection surface of the circuit board to protect the first connection surface; Providing a third protective film on the second connection surface of the circuit board to protect the second connection surface.

3. The manufacturing method of the light-emitting device according to claim 2, characterized in that, After providing the third protective film on the second connection surface of the circuit board and before connecting the light-emitting unit to the first connection surface of the circuit board, it further includes: Removing the second protective film provided on the first connection surface of the circuit board.

4. The method for preparing a light-emitting device according to claim 2, wherein After providing the first protective film on a side of the light-emitting unit facing away from the circuit board and before connecting the integrated circuit chip to the second connection surface of the circuit board, it further includes: Removing the third protective film provided on the second connection surface of the circuit board.

5. The manufacturing method of the light-emitting device according to claim 2, characterized in that, After connecting the integrated circuit chip to the second connection surface of the circuit board, it further includes: Providing a fourth protective film on a side of the integrated circuit chip facing away from the circuit board.

6. The method for preparing the light-emitting device according to claim 5, wherein, After providing the fourth protective film on a side of the integrated circuit chip facing away from the circuit board, it further includes: Removing the fourth protective film provided on a side of the integrated circuit chip facing away from the circuit board; Sealing the second connection surface where the integrated circuit chip is located.

7. The manufacturing method of the light-emitting device according to claim 6, characterized in that, After sealing the second connection surface where the integrated circuit chip is located, it further includes: Removing the first protective film provided on a side of the light-emitting unit facing away from the circuit board; Sealing the first connection surface where the light-emitting unit is located.

8. The method for preparing a light-emitting device according to claim 5, characterized in that, The materials of the first protective film, the second protective film, the third protective film, and the fourth protective film at least include polyimide.

9. The method for preparing the light-emitting device according to claim 5, characterized in that, The thicknesses of the first protective film, the second protective film, the third protective film, and the fourth protective film are between 0.03 mm and 0.1 mm.

10. The manufacturing method of the light-emitting device according to claim 5, characterized in that, The melting temperatures of the first protective film, the second protective film, the third protective film, and the fourth protective film are greater than or equal to 300 °C.

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