Wafer cleaning machine

Abstract

The present application provides a wafer cleaning machine, which belongs to the field of wafer cleaning technology and solves the problem that it is difficult to achieve both good wafer damage rate and cleanliness in the prior art. The wafer cleaning machine of the present application includes a loading assembly, an ultrasonic cleaning assembly, a QDR cleaning assembly, a feeding assembly and a wafer scrubbing assembly. The wafer scrubbing assembly includes a roller brush mechanism and a rotating mechanism. The roller brush mechanism includes a first roller brush and a second roller brush. The first roller brush and the feeding surface extend upward together to form a bearing area. The bearing area is used to bear the wafer. The second roller brush is arranged above the bearing area. The second roller brush and the first roller brush rotate together to clean the wafer. The rotating mechanism includes a wheel body and a first driving mechanism. The wheel body has the freedom to move close to the bearing area to jointly clamp the wafer. The first driving mechanism acts on the wheel body to drive the wafer to rotate. The present application uses a rotating mechanism to drive the wafer to rotate, and cooperates with the roller brush mechanism to scrub. The scrubbing force during cleaning can be effectively controlled and evenly controlled, thereby improving the cleanliness of the wafer surface.

Description

Technical Field

[0001] The present application belongs to the field of wafer cleaning technology, and specifically relates to a wafer cleaning machine. Background Art

[0002] In semiconductor manufacturing, with the continuous advancement of process technology, the requirements for wafer surface flatness are increasing. Chemical mechanical polishing (CML), a process that combines mechanical grinding with chemical etching, effectively flattens the wafer surface by utilizing the grinding action of ultrafine particles and the chemical etching action of the polishing slurry, achieving a global planarization effect. However, in subsequent processing steps, the initial polishing process may cause contaminants to adhere to the wafer surface. These contaminants include abrasive particles (such as ceria and alumina), colloidal silica particles, and residues of surfactants, etchants, and other additives in the polishing slurry. The pressure during the CML process can cause these particles to embed into the wafer surface. To ensure device reliability and avoid introducing defects, the subsequent cleaning process is particularly critical and rigorous.

[0003] Conventional wafer cleaning brushes made of nylon are typically used with pure water to remove residue from the wafer surface. However, nylon is relatively hard, which can cause scratches on the wafer surface during use. Furthermore, the nylon bristle brush head makes uneven contact with the wafer surface, resulting in poor wafer surface cleanliness.

[0004] Based on the above, the technical problem of this application is: how to avoid wafer damage while improving surface cleanliness. Summary of the Invention

[0005] The purpose of this application is to address the above-mentioned problems existing in the prior art and propose a wafer cleaning machine that solves the problem of poor wafer surface cleanliness in the prior art, avoids wafer damage and improves the cleanliness of the wafer surface.

[0006] The purpose of the present application can be achieved through the following technical solutions: A wafer cleaning machine, comprising: a loading assembly, the loading assembly is used for wafer loading; an ultrasonic cleaning assembly, the ultrasonic cleaning assembly is arranged adjacent to the loading assembly; a QDR cleaning assembly, the QDR cleaning assembly is arranged adjacent to the ultrasonic cleaning assembly; a feeding assembly, the feeding assembly has a feeding surface, the feeding surface receives and transports the wafers cleaned by the QDR cleaning assembly; a wafer brushing assembly, the wafer brushing assembly comprises: a roller brush mechanism, the roller brush mechanism comprises: a first roller brush, the first roller brush is arranged on the On one side of the feeding surface, the first roller brush and the feeding surface extend upward together to form a carrying area, and the carrying area is used to carry wafers; a second roller brush, the second roller brush is arranged above the carrying area, and the second roller brush and the first roller brush rotate together to act on the carrying area to clean the wafers; a rotating mechanism, the rotating mechanism includes: a wheel body, the wheel body is multiple and distributed on the outer peripheral side of the carrying area, and the wheel body has the freedom to move close to the carrying area to jointly clamp the wafer; a first driving mechanism, the first driving mechanism acts on at least one of the wheel bodies to drive the wafer to rotate.

[0007] In the above-mentioned wafer cleaning machine, the wheel body includes: a front wheel, the front wheel is away from the QDR cleaning component relative to the first roller brush, and the front wheel is connected to a first lifting mechanism, the first lifting mechanism acts on the front wheel or the first driving mechanism to drive the front wheel to move up and down; a rear wheel, the rear wheel is close to the QDR cleaning component relative to the first roller brush, the rear wheel is connected to a second lifting mechanism, the second lifting mechanism acts on the rear wheel or the first driving mechanism to drive the rear wheel to move up and down.

[0008] In the above-mentioned wafer cleaning machine, an elastic portion is provided on the outer periphery of the wheel body, and the elastic portion is used for frictional contact with the outer periphery of the wafer, and the height of the elastic portion is not less than the height of the bearing area.

[0009] In the above-mentioned wafer cleaning machine, a raised limiting portion is further provided on the wheel body, the lowest point of the limiting portion is higher than the highest point of the elastic portion, and the limiting portion is used to limit the movement of the wafer.

[0010] In the above-mentioned wafer cleaning machine, a pressure sensor is embedded in the wheel body, and the pressure sensor is communicatively connected with the first driving mechanism.

[0011] In the above-mentioned wafer cleaning machine, at least one of the first roller brush and the second roller brush has a brushing portion on its periphery. The brushing portion is made of elastic water-absorbing material and is connected to a liquid channel for connecting to a liquid source.

[0012] In the above-mentioned wafer cleaning machine, a roller body is embedded in the brushing part, one end of the roller body is connected to a liquid inlet shaft for relative rotation, the roller body and the liquid inlet shaft are both hollow to form the liquid channel, and a through hole is also provided on the roller body to connect the liquid channel with the brushing part.

[0013] In the above-mentioned wafer cleaning machine, the roller body has a first end and a second end, the first end is connected to a second driving mechanism, the second driving mechanism acts on the roller body to drive the roller body to rotate, and the second end is plugged into the liquid inlet shaft.

[0014] In the above-mentioned wafer cleaning machine, a sealing structure is also provided between the roller body and the liquid inlet shaft, and the sealing structure includes: a first protrusion, which is arranged on the roller body and close to the second end; a second protrusion, which is arranged on the liquid inlet shaft; a sleeve, which is simultaneously sleeved on the outer periphery of the first protrusion and the second protrusion; a first sealing ring, which is arranged around the first protrusion and the sleeve; and a second sealing ring, which is arranged around the second protrusion and the sleeve.

[0015] In the above-mentioned wafer cleaning machine, the feeding assembly includes: a first conveying wheel group, the first conveying wheel group is arranged on one side of the first roller brush, the first conveying wheel group has a plurality of first conveying belts, and the first conveying belts are elastic; a second conveying wheel group, the second conveying wheel group is arranged with the first roller brush spaced apart from the first conveying wheel group, the second conveying wheel group has a plurality of second conveying belts, and the second conveying belts are elastic;

[0016] Wherein, a plurality of the first conveyor belts and the second conveyor belts extend upward together to form the feeding surface.

[0017] In the above-mentioned wafer cleaning machine, the loading component includes: a drive roller group, the drive roller group has multiple drive rollers, and a conveying channel is formed between the multiple drive rollers. The conveying channel allows wafers to be put in and conveyed, and the conveying channel extends along a first direction, and the first direction is vertically downward or inclined downward; a third drive mechanism, the third drive mechanism acts on the drive roller to drive the wafer to move along the conveying channel; a material frame, the material frame is arranged below the drive roller group, and a plurality of material collection stations are provided in the material frame, and the material collection stations are located below the conveying channel.

[0018] In the above-mentioned wafer cleaning machine, a first robot is provided between the ultrasonic cleaning component and the QDR cleaning component, and the first robot has the freedom to grab the wafer in the material frame to the ultrasonic cleaning component or the QDR cleaning component; a second robot is provided outside the QDR cleaning component, and the second robot has multiple degrees of freedom of grabbing and flipping to grab the wafer of the QDR cleaning component to the feeding surface.

[0019] Compared with the prior art, this application has the following beneficial effects:

[0020] The present application gently removes dirt from the surface of the wafer through the rotation of the first roller brush and the second roller brush, reduces the mechanical friction in contact with the surface, and thus effectively avoids scratches. The multiple wheels of the rotating mechanism are used to drive the wafer to rotate, and the roller brush mechanism is used for brushing. The brushing force during cleaning can be effectively controlled and evenly controlled to avoid the existence of cleaning dead corners, thereby improving the cleanliness of the upper and lower surfaces of the entire wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural diagram of the wafer cleaning machine of the present application;

[0022] Figure 2 It is a structural diagram of the feeding component and wafer scrubbing component of the present application;

[0023] Figure 3 This is a schematic diagram of the structure of the feeding component and wafer scrubbing component of the present application after the hidden parts of the structure;

[0024] Figure 4 It is a structural diagram of the feeding assembly and the first brush roller of the present application;

[0025] Figure 5 This is a schematic diagram of the structure of the rotating mechanism of the present application when clamping a wafer;

[0026] Figure 6 It is a schematic diagram of the cross-sectional structure of the wheel body of the present application;

[0027] Figure 7 This is a schematic cross-sectional view of the first roller brush of the present application;

[0028] Figure 8 yes Figure 7 Schematic diagram of the enlarged structure of area A in the middle;

[0029] Figure 9 It is a structural diagram of the first manipulator of this application;

[0030] Figure 10 It is a structural diagram of the second manipulator of this application;

[0031] Figure 11It is a structural diagram of the feeding assembly of this application;

[0032] Figure 12 This is a schematic diagram of the structure of the transmission roller group and the third drive mechanism of this application Figure 1 ;

[0033] Figure 13 This is a schematic diagram of the structure of the transmission roller group and the third drive mechanism of this application Figure 2 ;

[0034] Figure 14 This is a simplified structural diagram of the transmission roller assembly and the yield area of ​​the present application;

[0035] In the figure, 100, feeding assembly; 110, transmission roller group; 111, first roller group; 1111, first main roller; 1112, first auxiliary roller; 112, second roller group; 1121, second main roller; 1122, second auxiliary roller; 113, third roller group; 1131, third main roller; 1132, third auxiliary roller; 1101, transmission roller; S, conveying channel; 120, third driving mechanism; 130, material frame; 131, collecting station; 140, roller group conveyor belt; 150, guide plate; 1 51. Guide groove; 160. Material frame drive mechanism; 200. Ultrasonic cleaning assembly; 300. QDR cleaning assembly; 400. Feeding assembly; 410. First conveyor wheel assembly; 411. First conveyor belt; 420. Second conveyor wheel assembly; 421. Second conveyor belt; M, feeding surface; 500. Wafer scrubbing assembly; 510. Roller brush mechanism; 511. First roller brush; 512. Second roller brush; 5101. Scrubbing portion; 5102. Roller body; 51021. First end; 51022. Second end; 51023, through hole; 5103, liquid inlet shaft; 5104, first protrusion; 5105, second protrusion; 5106, sleeve; 5107, first sealing ring; 5108, second sealing ring; 513, second driving mechanism; Y, liquid channel; Q, bearing area; 520, rotating mechanism; 521, wheel body; 521a, front wheel; 521b, rear wheel; 5211, elastic part; 5212, limit part; 5213, pressure sensor; 522, first driving mechanism; 530, First lifting mechanism; 540, second lifting mechanism; 600, first robot; 610, first X-axis moving module; 620, first Z-axis moving module; 630, first clamp; 631, material roller; 700, second robot; 710, second X-axis moving module; 720, second Z-axis moving module; 730, rotation module; 740, suction hand; 741, suction cup; J, wafer; R, yield zone; R1, first zone; R2, second zone; J2, second gap; J3, third gap. DETAILED DESCRIPTION

[0036] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0037] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0039] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0040] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0041] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0042] Please refer to the attached drawings in the manual Figure 1 and Figure 2 The wafer cleaning machine of the present application includes: a loading assembly 100, an ultrasonic cleaning assembly 200, a QDR cleaning assembly 300, a feeding assembly 400, and a wafer scrubbing assembly 500. The loading assembly 100 is used to load wafers J. The ultrasonic cleaning assembly 200 is disposed adjacent to the loading assembly 100. The QDR cleaning assembly 300 is disposed adjacent to the ultrasonic cleaning assembly 200. The feeding assembly 400 has a feeding surface M. The feeding surface M receives and transports wafers J cleaned by the QDR cleaning assembly 300. Figure 2 and Figure 3 The wafer brushing assembly 500 includes a roller brush mechanism 510 and a rotating mechanism 520. The roller brush mechanism 510 includes a first roller brush 511 and a second roller brush 512. The first roller brush 511 is arranged on one side of the feeding surface M. Figure 4 The first roller brush 511 and the feeding surface M extend upward to form a carrying area Q, which is used to carry the wafer J. The second roller brush 512 is arranged above the carrying area Q. The second roller brush 512 rotates together with the first roller brush 511 to act on the carrying area Q to clean the wafer J. Figure 2 and Figure 5The rotating mechanism 520 includes a wheel body 521 and a first driving mechanism 522. The wheel bodies 521 are multiple and distributed on the outer peripheral side of the load-bearing area Q, and the wheel bodies 521 have the freedom to move close to the load-bearing area Q to jointly clamp the wafer J. The first driving mechanism 522 acts on at least one of the wheel bodies 521 to drive the wafer J to rotate. It can be understood that the loading assembly 100 is used for loading the wafer J, and the loading process can be operated manually or by a robot. The ultrasonic cleaning assembly 200 is used to ultrasonically clean the wafer J, which can remove tiny impurities and attached contaminants to ensure thorough cleaning. The QDR cleaning assembly 300 adopts a quick discharge technology to clean the surface of the wafer J and quickly discharge the wastewater, avoiding the uneven cleaning phenomenon existing in traditional equipment. The feeding assembly 400 delivers the wafer J cleaned by the previous process QDR to the roller brush mechanism 510 through the feeding surface M. The first roller brush 511 and the second roller brush 512 rotate to gently remove dirt on the surface of the wafer J, reduce the mechanical friction with the surface, and effectively avoid scratches. The multiple wheels 521 of the rotating mechanism 520 are used to drive the wafer J to rotate, and the roller brush mechanism 510 is used to brush it. The brushing force during cleaning can be effectively controlled and evenly controlled to avoid the existence of cleaning dead corners, thereby improving the cleanliness of the upper and lower surfaces of the entire chip.

[0043] Continue to refer to Figure 2 and Figure 5 In some embodiments, the wheel body 521 includes a front wheel 521a and a rear wheel 521b. The front wheel 521a is away from the QDR cleaning assembly 300 relative to the first roller brush 511, and the front wheel 521a is connected to a first lifting mechanism 530. The first lifting mechanism 530 acts on the front wheel 521a or the first driving mechanism 522 to drive the front wheel 521a to move up and down. The rear wheel 521b is close to the QDR cleaning assembly 300 relative to the first roller brush 511, and the rear wheel 521b is connected to a second lifting mechanism 540. The second lifting mechanism 540 acts on the rear wheel 521b or the first driving mechanism 522 to drive the rear wheel 521b to move up and down. It can be understood that after the wafer J is cleaned by the QDR cleaning assembly 300, it is transported to the carrying area Q. The front wheel 521a is driven to move up and down by the first lifting mechanism 530, and the rear wheel 521b is driven to move up and down by the second lifting mechanism 540, so that the lifting of each wheel body 521 can be controlled separately and orderly to allow the wafer J to pass through, or to clamp the wafer J together.

[0044] See also Figure 5 and Figure 6In some embodiments, an elastic portion 5211 is sleeved around the outer periphery of the wheel body 521. The elastic portion 5211 is configured to frictionally contact the outer periphery of the wafer J, and the height of the elastic portion 5211 is no less than the height of the bearing area Q. Exemplarily, the elastic portion 5211 is made of polyurethane. It is understood that by sleeved around the outer periphery of the shaft, the elastic portion 5211 is prevented from causing hard contact with the wafer J and causing loss of the wafer J. The elastic portion 5211 is of sufficient height to provide a floating margin, preventing one of the wheels 521 from failing to clamp the wafer J.

[0045] See also Figure 5 and Figure 6 In some embodiments, the wheel body 521 is further provided with a raised stopper 5212 . The lowest point of the stopper 5212 is higher than the highest point of the elastic portion 5211 . The stopper 5212 is used to limit the movement of the wafer J. It is understood that by providing the stopper 5212 on the wheel body 521 , the stopper 5212 is higher than the elastic portion 5211 , thereby preventing the wafer J from moving upward and leaving the supporting area Q.

[0046] Continue to refer to Figure 5 and Figure 6 In some embodiments, a pressure sensor 5213 is embedded in the wheel body 521, and the pressure sensor 5213 is communicatively connected to the first drive mechanism 522. It is understood that by disposing the pressure sensor 5213 in the wheel body 521, the pressure sensor 5213 is preferably configured as an annular embedding, so that the clamping force of each wheel body 521 on the wafer J can be detected in real time during rotation. The pressure sensor 5213 sends a detection signal to the first drive mechanism 522, and the power of the first drive mechanism 522 is adjusted based on the clamping force feedback to adjust the rotation speed of the wafer J and prevent damage to the wafer J.

[0047] See also Figure 3 and Figure 7 In some embodiments, at least one of the first roller brush 511 and the second roller brush 512 has a scrubbing portion 5101 on its outer periphery. The scrubbing portion 5101 is made of an elastic, water-absorbing material and is connected to a liquid channel Y for connection to a liquid source. Exemplarily, the elastic, water-absorbing material is a PVA sponge. A cleaning liquid can flow into the liquid channel Y. The scrubbing portion 5101 scrubs the wafer J with the cleaning liquid, adaptively adapting to the shape and pressure of the wafer J surface to minimize surface damage.

[0048] See also Figure 7 and Figure 8In some embodiments, a roller body 5102 is embedded in the scrubbing portion 5101. One end of the roller body 5102 is connected to a liquid inlet shaft 5103 for relative rotation. The roller body 5102 and the liquid inlet shaft 5103 are both hollow to form a liquid channel Y. The roller body 5102 is also provided with a through hole 51023 to connect the liquid channel Y with the scrubbing portion 5101. It can be understood that the liquid channel Y is used to transport the cleaning liquid. Because one side of the roller body 5102 needs to rotate to perform contact cleaning on the wafer J, and the other side needs to be connected to the cleaning liquid, the liquid inlet shaft 5103 is additionally provided. The liquid inlet shaft 5103 can serve as a fixed support while allowing the cleaning liquid to flow in. The liquid inlet shaft 5103 can also rotate relative to the roller body 5102 without affecting the cleaning operation of the roller body 5102. By opening a through hole 51023 on the roller body 5102, preferably opening a plurality of through holes 51023 evenly along the axial direction of the roller body 5102, it is convenient for the brushing part 5101 to access a relatively uniform, stable and appropriate amount of cleaning liquid. After the brushing part 5101 contacts the wafer J, the cleaning liquid can be squeezed out, and the distribution of the cleaning liquid on the brushing part 5101 is even, thereby improving the cleaning efficiency and quality.

[0049] See also Figure 7 and Figure 8 In some embodiments, the roller body 5102 has a first end 51021 and a second end 51022. The first end 51021 is connected to a second driving mechanism 513. The second driving mechanism 513 acts on the roller body 5102 to drive the roller body 5102 to rotate. The second end 51022 is plugged into the liquid inlet shaft 5103. It is understood that the first end 51021 of the roller body 5102 is driven to rotate by the second driving mechanism 513. The second driving mechanism 513 can be a drive motor. The rotation of the roller body 5102 can drive the brushing portion 5101 on the outside of the roller body 5102 to rotate synchronously. The second end 51022 of the roller body 5102 is plugged into the liquid inlet shaft 5103 in a manner similar to inserting a flared port. This prevents misalignment between the roller body 5102 and the liquid inlet shaft 5103 during rotation, improves sealing, reduces the probability of liquid leakage, and facilitates assembly, disassembly, and repair.

[0050] See also Figure 8In some embodiments, a sealing structure is further provided between the roller body 5102 and the liquid inlet shaft 5103, and the sealing structure includes: a first protrusion 5104, a second protrusion 5105, a sleeve 5106, a first sealing ring 5107 and a second sealing ring 5108. The first protrusion 5104 is arranged on the roller body 5102 and is close to the second end 51022. The second protrusion 5105 is arranged on the liquid inlet shaft 5103. The sleeve 5106 is simultaneously sleeved on the outer periphery of the first protrusion 5104 and the second protrusion 5105. The first sealing ring 5107 is arranged around the first protrusion 5104 and the sleeve 5106. The second sealing ring 5108 is arranged around the second protrusion 5105 and the sleeve 5106. It is understood that there is a certain probability of leakage at the contact portion between the roller body 5102 and the liquid inlet shaft 5103. By providing a first protrusion 5104 near the second end 51022 of the roller body 5102 and a second protrusion 5105 on the liquid inlet shaft 5103 near the roller body 5102, a seal is formed between the first and second protrusions 5104, 5105, and the sleeve 5106, and the first protrusion 5104 can rotate relative to the sleeve 5106. In addition, a first sealing ring 5107 is provided on the first protrusion 5104, and a second sealing ring 5108 is provided on the second protrusion 5105. Thus, a second sealing ring 5107, 5108, and the sleeve 5106 are formed as a second seal, further improving the sealing effect.

[0051] See also Figure 1 and Figure 9 In some embodiments, a first robot 600 is provided between the ultrasonic cleaning assembly 200 and the QDR cleaning assembly 300. The first robot 600 has the freedom to grab the wafer J in the material frame 130 and move it to the ultrasonic cleaning assembly 200 or the QDR cleaning assembly 300; see Figure 1 and Figure 10, a second robot 700 is provided on the outside of the QDR cleaning component 300. The second robot 700 has multiple degrees of freedom of grasping and flipping to grasp the wafer J of the QDR cleaning component 300 to the feeding surface M. Exemplarily, the first robot 600 includes a first X-axis moving module 610, a first Z-axis moving module 620 and a first clamping claw 630. The first X-axis moving module 610 is arranged between the ultrasonic cleaning component 200 and the QDR cleaning component 300, the first Z-axis moving module 620 is arranged on the first X-axis moving module 610, the first clamping claw 630 is arranged on the first Z-axis moving module 620, and a plurality of material rollers 631 are arranged on the first clamping claw 630. The first X-axis moving module 610 and the first Z-axis moving module 620 are cylinders or cylinders. The movable module 610 can drive the first Z-axis moving module 620 to move in the horizontal direction, and the first Z-axis moving module 620 can drive the first clamping jaw 630 to move in the vertical direction. The first clamping jaw 630 has the freedom of movement of telescopic clamping, and the multiple rollers 631 on the first clamping jaw 630 are used to support the wafer J; it can be understood that when a sufficient number of wafers J are filled in the material frame 130, the first robot 600 can grab the material frame 130 and put the material frame 130 into the ultrasonic cleaning component 200 or the QDR cleaning component 300 for cleaning in different steps, or directly The first robot 600 grabs the wafer J in the material frame 130 and puts it into the ultrasonic cleaning component or the QDR cleaning component 300 for cleaning; the second robot 700 includes a second X-axis moving module 710, a second Z-axis moving module 720, a rotation module 730 and an adsorption hand 740. The adsorption hand 740 is provided with a suction cup 741 to adsorb the wafer J. The second X-axis moving module 710 is provided outside the QDR cleaning component 300, the second Z-axis moving module 720 is provided on the second X-axis moving module 710, and the rotation module 730 is provided on the second Z-axis moving module 720, the adsorption hand 740 is set on the rotation module 730, the second X-axis moving module 710 and the second Z-axis moving module 720 are cylinders or electric cylinders, and the rotation module 730 can be a combination of a rotating disk and a motor. After the ultrasonic cleaning of the wafer J is completed, the adsorption hand 740 is used to adsorb the single wafer J. The wafer J is adsorbed and fixed, and then driven to move by the second X-axis moving module 710 and the second Z-axis moving module 720. After the rotation module 730 is flipped, the wafer J can be placed on the feeding surface M of the feeding assembly 400, and then the wafer J is transported by the feeding assembly 400.

[0052] See also Figure 11 and Figure 12In some embodiments, the feeding assembly 400 includes a first conveying wheel group 410 and a second conveying wheel group 420. The first conveying wheel group 410 is arranged on one side of the first roller brush 511. The first conveying wheel group 410 has multiple first conveying belts 411. The first conveying belts 411 are elastic. The second conveying wheel group 420 is arranged with the first roller brush 511 between the first conveying wheel group 410 and the second conveying wheel group 420. The second conveying wheel group 420 has multiple second conveying belts 421. The second conveying belts 421 are elastic; wherein, the multiple first conveying belts 411 and the second conveying belts 421 extend upward together to form a feeding surface M. It is understood that both the first conveyor wheel assembly 410 and the second conveyor wheel assembly include multiple conveyor wheels (not shown). A first conveyor belt 411 and a second conveyor belt 421 are provided on each conveyor wheel to achieve transmission and conveying. The two conveyor wheel assemblies are spaced apart by the first roller brush 511. One conveyor wheel assembly is responsible for feeding the wafer J onto the first roller brush 511, that is, feeding it between the first roller brush 511 and the second roller brush 512. The other conveyor wheel assembly is responsible for feeding the wafer J, after being cleaned by the first roller brush 511 and the second roller brush 512, to the next process. The feeding surface M formed by the first conveyor belt 411 and the second conveyor belt 421 is used to support and transport the wafer J.

[0053] See also Figure 11 and Figure 12 In some embodiments, the loading assembly 100 includes a drive roller assembly 110, a third drive mechanism 120, and a material frame 130. The drive roller assembly 110 includes a plurality of drive rollers 1101. A conveying channel S is formed between the plurality of drive rollers 1101. The conveying channel S allows wafers J to be loaded and conveyed. The conveying channel S extends along a first direction, which may be vertically downward or inclined downward. The third drive mechanism 120 acts on the drive rollers 1101 to move the wafers J along the conveying channel S. The material frame 130 is disposed below the drive roller assembly 110. The material frame 130 includes a plurality of material collection stations 131, which are located below the conveying channel S. Exemplarily, the loading assembly 100 further includes a guide plate 150 having a guide groove 151 formed therein. The guide groove 151 communicates with the conveying channel S. Wafers J can be loaded into the guide groove 151 manually or by a robot, and then enter the conveying channel S between the drive rollers 1101 through the guide groove 151. Different from the existing water slide loading method, the two sides of the wafer J can be tightly attached to the adjacent transmission rollers 1101, thereby cooperating with the drive of the third drive mechanism 120. The transmission rollers 1101 rotate to drive the wafer J along the conveying channel S to the collection station 131 below. The width of the conveying channel S, the friction coefficient between the transmission rollers 1101 and the wafer J, and the driving power of the third drive mechanism 120 are controllable, thereby ensuring the stability of the feeding process and reducing the damage rate of the wafer J during the feeding process.

[0054] Continue to refer to Figure 11 and Figure 12 In some embodiments, a feed frame drive mechanism 160 is provided on one side of the feed frame 130. This mechanism acts on the feed frame to drive the feed frame 130 to switch between one of the collection stations 131 and the conveying channel S. A clearance area R is formed between the collection station 131 and the drive roller assembly 110 to allow for wafers moving synchronously with the collection station 131. It should be noted that because wafers tend to move downward due to gravity, they are clamped by two adjacent drive rollers 1101 to maintain stability and prevent them from falling directly onto the feed frame 130. During wafer conveyance, the third drive mechanism 120 only needs to provide a small driving force to achieve rotational conveyance of the drive rollers 1101. Furthermore, because the wafer's falling speed is consistent with the rotational speed of the drive rollers 1101, the third drive mechanism 120 can control the corresponding rotational speed, thereby synchronously controlling the wafer's falling speed. This effectively improves conveying stability and controllability, thereby reducing the damage rate during wafer loading. Each collection station 131 of the material frame 130 collects the wafers, and then transfers them to other processes for cleaning. The material frame drive mechanism 160 of the present application can be configured as a linear module, and the material frame drive mechanism 160 is used to drive the material frame 130 to move linearly, thereby driving the collection station 131 to move to the bottom of the conveying channel S for docking. After one of the wafers falls to one of the collection stations 131, the material frame 130 moves to switch different collection stations 131 to dock with the conveying channel S in turn, so that wafers are collected on each collection station 131. It should be noted that by setting a clearance area R between the collection station 131 and the transmission roller group 110, it can be avoided that the wafers on the collection station 131 move synchronously when the material frame 130 moves and interfere with the transmission roller group 110, thereby ensuring that the wafer loading process can run smoothly and improve the loading rate.

[0055] See also Figure 13 and Figure 14 In some embodiments, the clearance zone R includes a first zone R1 and a second zone R2. The first zone R1 is formed by the hollowing of the drive roller assembly 110 on the side close to the moving direction of the material frame 130. The space in the first zone R1 gradually expands from top to bottom. The second zone R2 is formed between the first zone R1 and the collection station 131. It can be understood that by setting the side of the drive roller assembly 110 close to the moving direction of the material frame 130 to be hollow, space in the first zone R1 is reserved to avoid the movement of the wafer. The space in the first zone R1 gradually expands from top to bottom to adapt to the shape of the wafer. The cross-section of the first zone R1 is close to a fan shape. The space in the second zone R2 also avoids the movement of the wafer. The space in the second zone R2 is larger than that in the first zone R1, which can provide more room for the movement of the wafer.

[0056] Continue to refer to Figure 13 and Figure 14In some embodiments, the transmission roller group 110 includes a first roller group 111, a second roller group 112 and a third roller group 113. The first roller group 111 includes a first main roller 1111 and a first auxiliary roller 1112. The first main roller 1111 is connected to the output end of the third driving mechanism 120. The first auxiliary roller 1112 and the first main roller 1111 are spaced apart by a conveying channel S. The second roller group 112 includes a second main roller 1121 and a second auxiliary roller 1122. The second main roller 1121 is arranged below the first main roller 1111. The second auxiliary roller 1122 and the second main roller 1121 are spaced apart by a conveying channel S. The third roller group 113 includes a third main roller 1131 and a third auxiliary roller 1132. The third main roller 1131 is arranged below the second main roller 1121. The third auxiliary roller 1132 and the third main roller 1131 are separated by a conveying channel S, and the third auxiliary roller 1132 is disconnected in the middle to form a third gap J3. The length of the second gap J2 is less than that of the third gap J3. The second gap J2 and the third gap J3 form part of the first zone R1. The second zone R2 is formed below the third gap J3 and between the collecting station 131 and the third main roller 1131. It should be noted that the first main roller 1111, the first auxiliary roller 1112, the second main roller 1121, the second auxiliary roller 1122, the third main roller 1131 and the third auxiliary roller 1132 in this application all belong to the transmission roller 1101 mentioned above. Exemplarily, the second main roller 1121 can be transmission-connected to the first main roller 1111 via the roller conveyor belt 140, and the third main roller 1131 can be transmission-connected to the second main roller 1121 via the roller conveyor belt 140. After the first main roller 1111 is driven by the third drive mechanism 120, the wafer can be dropped into the conveying channel S, so that one side of the wafer contacts the first main roller 1111 and the other side of the wafer contacts the first auxiliary roller 1112. The movement of the first main roller 1111 can simultaneously drive the wafer to fall and the first auxiliary roller 1112 to rotate. Similarly, since the rotation of the first main roller 1111 can also synchronously drive the second main roller 1121 and the third main roller 1131 to rotate, the wafer can be continuously conveyed along the conveying channel S until it falls onto the collection station 131. Exemplarily, the second main roller 1121 and the third main roller 1131 can also be independently provided with corresponding drive mechanisms for driving, without the need for transmission by the roller conveyor belt 140. It should be noted that the middle parts of the second auxiliary roller 1122 and the third auxiliary roller 1132 in the present application are hollow to form the second gap J2 and the third gap J3. Alternatively, the second auxiliary roller 1122 may be composed of two independent and spaced short rollers, and the gap between the short rollers is the second gap J2. The third auxiliary roller 1132 may be composed of two independent and spaced ultra-short rollers, and the gap between the ultra-short rollers is the third gap J3.Both the second gap J2 and the third gap J3 are formed to allow for wafer movement. The first region R1 includes not only the second gap J2 and the third gap J3, but also the space between the second gap J2 and the third gap J3, and may also include the space between the second gap J2 and the first auxiliary roller 1112. This allows a portion of the wafer to pass through the first region R1. The second region R2, encompassing the area below the third gap J3 and between the collection station 131, allows the remainder of the wafer to pass through. In some embodiments, the first auxiliary roller 1112 may be hollow to form the first gap (not shown), with the length of the first gap being smaller than the second gap J2.

[0057] The working principle of the wafer cleaning machine in this application:

[0058] First, the wafer J is manually / manipulator-operated and placed into the conveying channel S of the loading assembly 100. The third drive mechanism 120 drives the transmission roller 1101 to rotate, thereby driving the wafer J to be conveyed along the conveying channel S into the material frame 130. Then, the first robot 600 moves to transfer the wafer J to the ultrasonic cleaning assembly 200 for ultrasonic cleaning. After ultrasonic cleaning, the first robot 600 transfers the wafer J to the QDR cleaning assembly 300. After QDR cleaning, the second robot 700 flips and transfers the wafer J to the feeding surface M until the wafer J is located in the carrying area. Q, the wheel body 521 is controlled to rise and fall by the first lifting mechanism 530 and the second lifting mechanism 540 respectively, so that the multiple wheel bodies 521 jointly clamp the wafer J, wherein the first driving mechanism 522 drives the wheel body 521 to rotate, so that the wafer J is driven to rotate by the wheel body 521, and at the same time, the liquid inlet channel sends the cleaning liquid into the first roller brush 511 and / or the second roller brush 512, the first roller brush 511 and the second roller brush 512 abut against the wafer J, and the first roller brush 511 and the second roller brush 512 rotate to squeeze out the cleaning liquid to clean the surface of the wafer J.

[0059] Beneficial effects:

[0060] The present application gently removes dirt from the surface of the wafer J by rotating the first roller brush 511 and the second roller brush 512, reduces the mechanical friction with the surface, and effectively avoids scratches, and utilizes the multiple wheel bodies 521 of the rotating mechanism 520 to drive the wafer J to rotate, and cooperates with the roller brush mechanism 510 to brush, so that the brushing force during cleaning can be effectively controlled and uniform, avoiding the existence of cleaning dead corners, thereby improving the cleanliness of the upper and lower surfaces of the entire wafer; by arranging an elastic part 5211 on the outer periphery of the shaft, hard contact with the wafer J and loss of the wafer J are avoided, and the height of the elastic part 5211 is sufficient, so that there is a deviation margin for floating up and down, so as to avoid one of the wheel bodies 521 from falling and not clamping the wafer J; by arranging a limiting part 5212 on the wheel body 521, the limiting part 5212 is higher than the elastic part 5211, so as to avoid the wafer J from jumping upward and leaving the carrying area Q; A pressure sensor 5213 is provided, and the pressure sensor 5213 is preferably configured to be annularly embedded, so that the clamping force of each wheel body 521 on the wafer J can be detected in real time during rotation. The pressure sensor 5213 sends the detection signal to the first drive mechanism 522, so that the power of the first drive mechanism 522 is adjusted based on the clamping force feedback to adjust the rotation speed of the wafer J and avoid damage to the wafer J; the brushing part 5101 is made of PVA sponge, and the liquid channel Y can be passed into the cleaning liquid. The brushing part 5101 squeezes out the cleaning liquid to brush the wafer J, and can adapt to the shape and pressure of the surface of the wafer J for brushing, thereby reducing damage to the surface of the wafer J; by arranging a sealing structure between the roller body 5102 and the liquid inlet shaft 5103, it can be ensured that the roller body 5102 and the liquid inlet shaft 5103 have a better sealing effect while rotating relative to each other, thereby avoiding leakage and reducing the cleaning effect of the roller brush mechanism 510.

[0061] The specific embodiments described herein are merely illustrative of the spirit of the present application. Persons skilled in the art may make various modifications, additions, or substitutions to the described specific embodiments without departing from the spirit of the present application or exceeding the scope defined by the appended claims.

Claims

1. A wafer cleaning machine, characterized in that: include: A loading assembly (100), the loading assembly (100) is used for loading a wafer (J), the loading assembly (100) comprising: A transmission roller group (110), the transmission roller group (110) having a plurality of transmission rollers (1101), a conveying channel (S) being formed between the plurality of transmission rollers (1101), the conveying channel (S) allowing wafers (J) to be put in and conveyed, the conveying channel (S) extending along a first direction, the first direction being vertically downward or obliquely downward; a third driving mechanism (120), the third driving mechanism (120) acting on the transmission roller (1101) to drive the wafer (J) to move along the conveying channel (S); and A material frame (130) is provided below the transmission roller group (110). A plurality of material collecting stations (131) are provided in the material frame (130). The material collecting stations (131) are located below the conveying channel (S). A material frame driving mechanism (160) is further provided on one side of the material frame (130). The material frame driving mechanism (160) acts on the material frame (130) to drive the material frame (130) to move and switch one of the material collecting stations (131) to dock with the conveying channel. Road (S); wherein a clearance zone (R) is formed between the material collection station (131) and the transmission roller group (110), and the clearance zone (R) includes a first zone (R1) and a second zone (R2), the first zone (R1) is formed by the hollow setting of the transmission roller group (110) on one side close to the moving direction of the material frame (130), the space of the first zone (R1) gradually expands from top to bottom, and the second zone (R2) is formed between the first zone (R1) and the material collection station (131); an ultrasonic cleaning assembly (200), the ultrasonic cleaning assembly (200) being arranged adjacent to the feeding assembly (100); A QDR cleaning component (300), the QDR cleaning component (300) being arranged adjacent to the ultrasonic cleaning component (200); A feeding assembly (400), the feeding assembly (400) having a feeding surface (M), the feeding surface (M) receiving and transporting the wafer (J) cleaned by the QDR cleaning assembly (300); and A wafer scrubbing assembly (500), comprising: A roller brush mechanism (510), the roller brush mechanism (510) comprising: A first roller brush (511), the first roller brush (511) being arranged on one side of the feeding surface (M), the first roller brush (511) and the feeding surface (M) extending upward together to form a bearing area (Q), the bearing area (Q) being used to bear a wafer (J); A second roller brush (512), the second roller brush (512) being arranged above the carrying area (Q), and the second roller brush (512) and the first roller brush (511) rotating together to act on the carrying area (Q) to clean the wafer (J); A rotating mechanism (520), the rotating mechanism (520) comprising: Wheel bodies (521), the wheel bodies (521) are multiple and distributed on the outer peripheral side of the carrying area (Q), and the wheel bodies (521) have the freedom to move close to the carrying area (Q) to jointly clamp the wafer (J); A first driving mechanism (522), wherein the first driving mechanism (522) acts on at least one of the wheel bodies (521) to drive the wafer (J) to rotate.

2. The wafer cleaning machine according to claim 1, characterized in that: The wheel body (521) comprises: a front wheel (521a), the front wheel (521a) facing away from the QDR cleaning assembly (300) relative to the first roller brush (511), and the front wheel (521a) is connected to a first lifting mechanism (530), the first lifting mechanism (530) acting on the front wheel (521a) or the first driving mechanism (522) to drive the front wheel (521a) to move up and down; A rear wheel (521b), the rear wheel (521b) is close to the QDR cleaning assembly (300) relative to the first roller brush (511), the rear wheel (521b) is connected to a second lifting mechanism (540), and the second lifting mechanism (540) acts on the rear wheel (521b) or the first driving mechanism (522) to drive the rear wheel (521b) to move up and down.

3. The wafer cleaning machine according to claim 1, characterized in that: The outer periphery of the wheel body (521) is provided with an elastic portion (5211), the elastic portion (5211) is used for frictional contact with the outer periphery of the wafer (J), and the height of the elastic portion (5211) is not less than the height of the bearing area (Q).

4. The wafer cleaning machine according to claim 3, characterized in that: The wheel body (521) is further provided with a raised limiting portion (5212), the lowest point of the limiting portion (5212) being higher than the highest point of the elastic portion (5211), and the limiting portion (5212) being used to limit the movement of the wafer (J).

5. The wafer cleaning machine according to claim 1, characterized in that: A pressure sensor (5213) is embedded in the wheel body (521), and the pressure sensor (5213) is communicatively connected to the first driving mechanism (522).

6. The wafer cleaning machine according to claim 1, characterized in that: The outer periphery of at least one of the first roller brush (511) and the second roller brush (512) has a brushing portion (5101), the brushing portion (5101) is made of an elastic water-absorbing material, and the brushing portion (5101) is connected to a liquid channel (Y), and the liquid channel (Y) is used to connect to a liquid source.

7. The wafer cleaning machine according to claim 6, characterized in that: The brushing portion (5101) is embedded with a roller body (5102), one end of the roller body (5102) is connected to a liquid inlet shaft (5103) for relative rotation, the roller body (5102) and the liquid inlet shaft (5103) are both hollow to form the liquid channel (Y), and the roller body (5102) is also provided with a through hole (51023) to connect the liquid channel (Y) with the brushing portion (5101).

8. The wafer cleaning machine according to claim 7, characterized in that: The roller body (5102) has a first end (51021) and a second end (51022), the first end (51021) is connected to a second driving mechanism (513), the second driving mechanism (513) acts on the roller body (5102) to drive the roller body (5102) to rotate, and the second end (51022) is plugged into the liquid inlet shaft (5103).

9. The wafer cleaning machine according to claim 8, characterized in that: A sealing structure is further provided between the roller body (5102) and the liquid inlet shaft (5103), and the sealing structure comprises: a first protrusion (5104), the first protrusion (5104) being disposed on the roller body (5102) and close to the second end (51022); A second protrusion (5105), the second protrusion (5105) is provided on the liquid inlet shaft (5103); a sleeve (5106), the sleeve (5106) being sleeved on the outer periphery of the first protrusion (5104) and the second protrusion (5105); a first sealing ring (5107), the first sealing ring (5107) being disposed around and between the first protrusion (5104) and the sleeve (5106); and A second sealing ring (5108), the second sealing ring (5108) is arranged around and between the second protrusion (5105) and the sleeve (5106).

10. The wafer cleaning machine according to claim 1, wherein: The feeding assembly (400) comprises: A first conveying wheel assembly (410), the first conveying wheel assembly (410) being arranged on one side of the first roller brush (511), the first conveying wheel assembly (410) having a plurality of first conveying belts (411), the first conveying belts (411) being elastic; a second conveying wheel group (420), wherein the second conveying wheel group (420) and the first conveying wheel group (410) are arranged with the first roller brush (511) spaced apart, and the second conveying wheel group (420) has a plurality of second conveying belts (421), and the second conveying belts (421) are elastic; Wherein, a plurality of the first conveyor belts (411) and the second conveyor belts (421) extend upward together to form the feeding surface (M).

11. The wafer cleaning machine according to claim 1, wherein: A first robot (600) is provided between the ultrasonic cleaning component (200) and the QDR cleaning component (300), and the first robot (600) has the freedom to grab the wafer (J) in the material frame (130) to the ultrasonic cleaning component (200) or the QDR cleaning component (300); a second robot (700) is provided outside the QDR cleaning component (300), and the second robot (700) has multiple degrees of freedom of grabbing and flipping to grab the wafer (J) of the QDR cleaning component (300) to the feeding surface (M).

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