Wafer polishing and grinding automatic loading and unloading equipment

Abstract

The present application discloses an automatic loading and unloading device for wafer polishing and grinding, which is equipped with a polishing grinder, which includes several planetary wheels, each of which has multiple grinding and polishing stations. The device includes a material unloading motion detection module for detecting the relative position relationship of multiple grinding and polishing stations and generating a control signal; a wafer loading buffer module, including a wafer loading positioning buffer table and a buffer motion device, the wafer loading positioning buffer table including a positioning station and an adjustment platform, the buffer motion device can transfer the wafer in the wafer loading positioning buffer table to the positioning station, and the adjustment platform is used to adjust the wafer in the positioning station in response to the control signal; and a wafer loading and unloading motion module for moving the wafer to the grinding and polishing station. Before the device performs the grinding and polishing process, the relative position of the wafers is adjusted by calibration to facilitate the transfer of multiple wafers to the grinding and polishing stations at one time, improve the loading and unloading rhythm, and make the device have higher grinding and polishing efficiency.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to an automatic loading and unloading device for wafer polishing and grinding. Background Art

[0002] Wafer polishing and grinding is one of the key processes in semiconductor manufacturing. It is mainly used to flatten the wafer surface to ensure the accuracy and yield of subsequent processes such as lithography and thin film deposition.

[0003] In the early days of semiconductor manufacturing, wafer loading and unloading primarily relied on manual labor or semi-automated equipment, which suffered from low efficiency and poor precision. To overcome the shortcomings of traditional methods, automated loading and unloading equipment has gradually become mainstream. Currently, there are two main methods for automated loading and unloading of wafers for polishing and grinding: single-wafer loading and unloading, and three-wafer loading and unloading. In the first, single-wafer loading and unloading, the robot extracts one wafer at a time from the loading buffer and places it on the polishing and grinding machine's planetary wheel. During unloading, the robot extracts one wafer at a time from the planetary wheel and places it on the unloading buffer. In the second, three-wafer loading and unloading, the robot extracts three wafers at a time from the loading buffer (with intervals) and places them on the polishing and grinding machine's planetary wheel (with intervals). During unloading, the robot extracts three wafers at a time from the planetary wheel (with intervals) and places them on the unloading buffer (with intervals). However, existing automated wafer polishing and grinding loading and unloading equipment has a slow cycle time, with three wafers loaded at a time, one wafer unloaded at a time, or even a single wafer unloaded at a time. The visual positioning accuracy of the planetary wheel grinding and polishing station is low, and the wafer placement accuracy is low. Existing automated wafer polishing and grinding loading and unloading equipment still has problems such as slow loading and unloading cycle time, low visual positioning accuracy of the detection device, and low wafer placement accuracy. Summary of the Invention

[0004] In order to address the deficiencies of the prior art, the purpose of this application is to provide an automatic loading and unloading device for wafer polishing and grinding with high wafer placement accuracy and a fast loading and unloading cycle.

[0005] To achieve the above objectives, this application adopts the following technical solutions:

[0006] A wafer polishing and grinding automatic loading and unloading device is equipped with a polishing grinder, which is used to grind and polish wafers. The polishing grinder includes several planetary wheels, each of which has multiple grinding and polishing stations for fixing wafers. The wafer polishing and grinding automatic loading and unloading device includes a loading sampling module for carrying a wafer transfer box; a wafer unloading buffer module for storing wafers after grinding and polishing; a wafer unloading motion detection module for detecting the relative position relationship between multiple grinding and polishing stations in a planetary wheel and generating a control signal representing the relative position relationship; a wafer loading buffer module, including a wafer loading positioning buffer table and a buffer motion device, and the wafer loading positioning buffer table is used to For carrying or storing wafers, the upper wafer positioning cache table includes a positioning station and an adjustment platform. The number of positioning stations is consistent with the number of grinding and polishing stations in the planetary wheel. The cache motion device can transfer the wafers stored in the upper wafer positioning cache table to the corresponding positioning station. The adjustment platform is used to adjust the wafers located in the positioning station in response to the control signal so that the position distribution of the wafers is consistent with the position distribution of multiple grinding and polishing stations in the planetary wheel; the upper and lower wafer motion module is used to transfer the wafers in the wafer transfer box to the upper wafer cache module. The upper and lower wafer motion module is also used to grab all adjusted wafers in the positioning station and transfer the wafers to the corresponding grinding and polishing station.

[0007] Furthermore, the module for detecting the unloading motion includes a visual positioning component. When the visual positioning component moves to above the first planetary wheel, the visual positioning component detects a first relative position relationship among multiple grinding and polishing stations in the first planetary wheel, and generates a first control signal representing the first relative position relationship. The adjustment platform can adjust the wafer located in the positioning station in response to the first control signal; when the adjustment platform adjusts the wafer, the visual positioning component moves to above the second planetary wheel to detect a second relative position relationship among multiple grinding and polishing stations in the second planetary wheel, and generates a second control signal representing the second relative position relationship.

[0008] Furthermore, when the visual positioning component detects the second relative position relationship, the upper and lower wafer motion modules grab all the adjusted wafers in the positioning station and transfer the wafers to the corresponding grinding and polishing station in the first planetary wheel.

[0009] Furthermore, the visual positioning component includes a light source and a camera, the light source is used to illuminate the grinding and polishing station, and the camera is used to receive the light signal reflected from the grinding and polishing station, and determine the relative position relationship between multiple grinding and polishing stations in the planetary wheel based on the reflective imaging method.

[0010] Furthermore, the detection and unloading movement module includes a detection and unloading control device and a first supporting structure. The first supporting structure is installed on the detection and unloading control device and can move under the action of the detection and unloading control device. The first supporting structure is provided with a pressing block group whose number is consistent with the grinding and polishing stations. The distribution positions of the multiple pressing block groups are consistent with the distribution positions of the multiple grinding and polishing stations. The pressing block group includes several pressing blocks, and the pressing blocks can press the wafer located in the grinding and polishing station under the control of the detection and unloading control device; the visual positioning component is installed on the first supporting structure.

[0011] Furthermore, the module for detecting the unloading movement includes a sensor group installed on the first support structure. The number of the sensor groups is consistent with the number of the grinding and polishing stations, and the distribution positions of the multiple sensor groups are consistent with the distribution positions of the multiple grinding and polishing stations. The sensor group can detect whether the wafer is within the range defined by the grinding and polishing stations.

[0012] The sensor group includes several sensor units. In two adjacent sensor groups, the sensor units in one sensor group can be reused in the other sensor group.

[0013] Furthermore, the upper wafer positioning cache platform also includes a cache station, which is arranged below the adjustment platform. The cache station has several layers of storage areas distributed from top to bottom. Each layer of storage area can store several wafers transferred by the upper and lower wafer movement modules. The cache movement device can transfer the wafers in the storage area to the corresponding positioning station.

[0014] Furthermore, the cache movement device includes a transfer component and a fixed bracket, one end of the transfer component extends in the direction of the positioning cache table, and the other end is installed on the fixed bracket and can move relative to the fixed bracket in the height direction; the upper slice cache module includes a frame, and the frame is provided with a guide rail extending in a set direction. The fixed bracket is installed on the guide rail and can slide relative to the guide rail in the set direction.

[0015] Furthermore, the transfer assembly includes a transfer fork arm and a driving unit for driving the transfer fork arm to move. The transfer fork arm can move along the height direction under the action of the driving unit to grab the wafers in the corresponding storage area.

[0016] Furthermore, the transfer fork arm is set as a single-piece fork arm and / or a double-piece fork arm, the single-piece fork arm corresponds to one cache station and grabs the wafers in the storage area of ​​one cache station; the double-piece fork arm corresponds to two cache stations, and the double-piece fork arm can simultaneously grab the wafers in the corresponding storage areas of the two cache stations.

[0017] Furthermore, the upper and lower sheet movement module includes an upper and lower sheet control device, a second support structure and multiple adsorption component groups. The second support structure is installed on the upper and lower sheet control device and can move under the action of the upper and lower sheet control device. The number of adsorption component groups is consistent with the number of positioning stations. The distribution positions of the multiple adsorption component groups are consistent with the distribution positions of the multiple positioning stations. The adsorption components include several adsorption components, and the adsorption components can grab the wafers located at the positioning stations.

[0018] Furthermore, the upper and lower sheet movement module includes a movable mechanism, and at least two of the multiple adsorption component groups are configured with a movable mechanism. The movable mechanism can adjust the position of the adsorption component group so that the multiple adsorption component groups can correspond to the grabbing position of the wafer adjusted by the adjustment platform.

[0019] Furthermore, the lower wafer cache module includes a water tank and a moving bracket. The water tank forms a liquid storage space for storing liquid. The moving bracket can move relative to the water tank in the height direction to enter / leave the liquid storage space; when the moving bracket leaves the liquid storage space, the upper and lower wafer motion modules can grab the wafer in the same planetary wheel and transfer it to the moving bracket.

[0020] Furthermore, the moving bracket includes a first wafer fixing plate and a second wafer fixing plate that can move relative to each other in the height direction, and the first wafer fixing plate and the second wafer fixing plate are staggered in the horizontal direction.

[0021] Furthermore, when the upper and lower sheet motion modules grab the ground and polished wafers, the movable mechanism can drive the adsorption component group to move so that the surfaces of several wafers do not overlap. The upper and lower sheet motion modules transfer the wafers adjusted by the movable mechanism to the first wafer fixing plate and the second wafer fixing plate that are staggered.

[0022] The present application provides an automatic loading and unloading device for wafer polishing and grinding. This device achieves efficient and automated loading and unloading operations during the wafer polishing and grinding process through the coordinated operation of a loading sampling module, a loading buffer module, a detection and unloading motion module, an unloading and unloading motion module, and a unloading buffer module. The device detects the relative positions of multiple grinding and polishing stations in a planetary wheel through the detection and unloading motion module, and generates a control signal that is sent to the loading buffer module. The loading buffer module can adjust the relative positions of wafers in the positioning stations in real time based on the control signal. The unloading and unloading motion module grabs all adjusted wafers in the positioning stations at once, achieving the function of loading and unloading multiple wafers at a time, significantly reducing the loading and unloading cycle and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Schematic diagram of the automatic loading and unloading equipment for wafer polishing and grinding in an embodiment of the present application;

[0024] Figure 2A top view of the automatic loading and unloading equipment for wafer polishing and grinding in an embodiment of the present application;

[0025] Figure 3 Schematic diagram of an upper slice cache module in an embodiment of the present application;

[0026] Figure 4 Schematic diagram of the flip transfer module in the embodiment of the present application;

[0027] Figure 5 Schematic diagram of a blanking module in an embodiment of the present application;

[0028] Figure 6 A schematic diagram of a positioning station in an embodiment of the present application;

[0029] Figure 7 Schematic diagram of a blanking motion detection module in an embodiment of the present application;

[0030] Figure 8 This is a schematic diagram of a first supporting structure in an embodiment of the present application;

[0031] Figure 9 This is a schematic diagram of the distribution of sensor units in the sensor group in the embodiment of the present application;

[0032] Figure 10 Schematic diagram of the upper slice cache module from another perspective in an embodiment of the present application;

[0033] Figure 11 Schematic diagram of the upper and lower sheet motion module in an embodiment of the present application;

[0034] Figure 12 This is a schematic diagram of a second supporting structure in an embodiment of the present application;

[0035] Figure 13 Schematic diagram of the lower slice cache module in the embodiment of the present application;

[0036] Figure 14 This is a flow chart of the automatic loading and unloading method for wafer polishing and grinding in an embodiment of the present application.

[0037] Reference numerals: 100, automatic loading and unloading equipment for wafer polishing and grinding; 10, loading and sampling inspection module; 11, wafer transfer box; 20, loading and unloading movement module; 21, loading and unloading control device; 22, second supporting structure; 221, second supporting seat; 222, second fork arm; 23, adsorption member group; 231, adsorption member; 24, movable mechanism; 30, loading buffer module; 31, loading positioning buffer platform; 311, positioning station; 3111, fixed plate; 3112, support block; 3113, Support positioning module; 3113a, positioning member; 3113b, base; 3114, correction module; 3114a, correction base; 3114b, correction moving part; 3115, positioning station sensor; 3115a, reflection sensor; 3115b, through-beam photoelectric; 312, adjustment platform; 313, cache station; 3131, storage area; 32, cache motion device; 321, transfer assembly; 3211, transfer fork arm; 3211a, single-piece fork arm; 3211b, double-piece Fork arm; 3212, drive unit; 322, fixed bracket; 33, frame; 331, guide rail; 40, polishing grinder; 41, planetary wheel; 411, grinding and polishing station; 50, detection and unloading motion module; 51, detection and unloading control device; 52, first support structure; 521, first support seat; 522, visual positioning assembly; 5221, light source; 5222, camera; 523, film picking assembly; 5231, pneumatic gripper; 5232, clamping plate; 524, pressing block group; 5241. Pressing block; 525. Sensor group; 5251. Internal sensor; 5252. External sensor; 60. Unloading buffer module; 61. Water tank; 62. Motion bracket; 621. Linear motion unit; 622. First wafer fixing plate; 623. Second wafer fixing plate; 624. Accommodating slot; 70. Flip transfer module; 71. Transfer base; 72. Flip fixing block; 73. Rack module; 80. Unloading module; 81. Unloading water tank; 82. Wafer bracket; 821. Notch. DETAILED DESCRIPTION

[0038] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the specific implementation of the present application will be clearly and completely described below in conjunction with the drawings in the implementation of the present application.

[0039] It should be noted that the directional nouns such as up, down, left, right, front, and back, or ordinal numbers such as "first, second, third, and fourth" mentioned in this document are based on the drawings in the specification and are introduced for the convenience of description. They do not mean any limitation on the order of the components. In addition, since the functions of certain parts of the various components provided in the above embodiments are the same, this specification adopts a unified naming method for these parts. The above is a detailed introduction to the pipe fitting connection device provided by the relevant technical solution, and specific embodiments are used in this article for elaboration. The description of the above embodiments is only used to help understand the method and core concept of the present invention, and does not impose any form of limitation on the present invention.

[0040] like Figure 1 As shown, the present application provides a wafer polishing and grinding automatic loading and unloading device 100. In order to clearly illustrate the technical solution of the present invention, the following is also defined: Figure 1 The up-down, left-right, and front-back directions shown are used as the up-down, left-right, and front-back directions of the wafer polishing and grinding automatic loading and unloading equipment 100 .

[0041] like Figure 1 and Figure 2 As shown, as an implementation method, the wafer polishing and grinding automatic loading and unloading equipment 100 includes a loading and sampling inspection module 10, an loading and unloading movement module 20, a loading and unloading buffer module 30, a detection and unloading movement module 50 and a unloading buffer module 60.

[0042] Optionally, the wafer polishing and grinding automatic loading and unloading equipment 100 is further configured with a polishing machine 40 for grinding and polishing wafers.

[0043] The loading and sampling module 10 is used to carry the wafer transfer box 11. The wafer transfer box 11 is a container for safely transporting and storing wafers during the wafer manufacturing process. The upper and lower wafer movement module 20 is used to grab wafers from the wafer transfer box 11 and transfer the wafers to the upper wafer buffer module 30. When multiple wafers are placed on the upper wafer buffer module 30, the upper wafer buffer module 30 can adjust the relative positions between the multiple wafers. The upper and lower wafer movement module can also transfer the adjusted multiple wafers to the polishing machine 40. The detection and unloading movement module 50 can grab the ground and polished wafers and transfer them to the lower wafer buffer module 60. The lower wafer buffer module 60 is used to store the ground and polished wafers so that the wafers are immersed in the cleaning solution.

[0044] Specifically, the polishing machine 40 includes several circumferentially distributed planetary wheels 41. These rotating components are responsible for providing the power and pressure for polishing. Each planetary wheel 41 has multiple polishing stations 411, which are used to support and secure wafers, ensuring they do not shift during the polishing process. These stations also provide mechanical force for uniform polishing, ensuring a uniform surface finish.

[0045] Exemplarily, three grinding and polishing stations 411 are provided in each planetary wheel 41 , and the three grinding and polishing stations 411 are arranged in a triangle.

[0046] The unloading motion detection module 50 is used to detect the relative position relationship between multiple grinding and polishing stations 411 in a planetary wheel 41 and generate a control signal representing the relative position relationship. The control signal is used to guide the adjustment and placement of the wafer in the wafer loading buffer module 30.

[0047] For example, taking a planetary wheel 41 with three grinding and polishing stations 411, the relative positional relationship between the three grinding and polishing stations 411 can be detected by the blanking motion detection module 50. For example, the center-to-center distance between any two grinding and polishing stations 411, the angle between the centers of the three grinding and polishing stations 411, and the horizontality of each grinding and polishing station 411 can be detected.

[0048] like Figure 2 and Figure 3 As shown, the upper wafer cache module 30 includes an upper wafer positioning cache platform 31 and a cache motion device 32. The upper wafer positioning cache platform 31 is used to carry or store wafers. The upper wafer positioning cache platform 31 includes a positioning station 311 and an adjustment platform 312. The number of positioning stations 311 is consistent with the number of grinding and polishing stations 411 in the planetary wheel 41. The cache motion device 32 can transfer the wafers stored in the upper wafer positioning cache platform 31 to the corresponding positioning station 311. The adjustment platform 312 is used to adjust the wafers located in the positioning station 311 in response to a control signal so that the position distribution of the wafers is consistent with the position distribution of multiple grinding and polishing stations 411 in the planetary wheel 41.

[0049] It should be noted that due to the influence of manufacturing process or installation tolerance, the relative position relationship of the multiple grinding and polishing stations 411 in the planetary wheel 41 may deviate. Each time the wafer is transferred to the positioning station 311 through the upper and lower sheet movement module 20, the adjustment platform 312 can adjust the positioning station 311 in response to the control signal, so as to ensure that the position distribution of the multiple wafers in the positioning station 311 is consistent with the position distribution of the multiple grinding and polishing stations 411 in the planetary wheel 41.

[0050] In some examples, the wafer polishing and grinding automatic loading and unloading equipment 100 is configured with a controller for controlling the coordinated operation between the modules. The controller receives a control signal generated by the unloading motion module 50 and controls the adjustment platform 312 based on the control signal.

[0051] In other examples, an independent controller is configured in the adjustment platform 312 , and the controller is used to receive the control signal generated by the blanking motion detection module 50 and control the adjustment platform 312 to adjust the position distribution of the positioning station 311 .

[0052] The loading and unloading module 20 is used to transfer wafers from the wafer cassette 11 to the loading buffer module 30. The loading and unloading module 20 can pick up multiple wafers at a time. Furthermore, the loading and unloading module 20 is also used to pick up all wafers that have been adjusted in the positioning station 311 and transfer them to the corresponding grinding and polishing station 411.

[0053] Through the above settings, the device adjusts the relative positions of the wafers through calibration before performing the grinding and polishing process, making it easier to transfer multiple wafers to the grinding and polishing station 411 at a time, improving the rhythm of loading and unloading wafers, and making the device have higher grinding and polishing efficiency.

[0054] like Figure 2 and Figure 4 As shown, as an optional implementation, the automatic loading and unloading equipment 100 for wafer polishing and grinding also includes a flip transfer module 70. The flip transfer module 70 includes a transfer base 71, a flip fixing block 72, and a rack module 73. Multiple flip fixing blocks 72 are circumferentially distributed on the transfer base 71. The multiple flip fixing blocks 72 are spaced evenly apart. The multiple flip fixing blocks 72 provide support and fixation for the wafer. A flip transfer module sensor 711 is provided on the transfer base 71. The flip transfer sensor 711 is used to detect whether there is a wafer on the transfer base and provide feedback. The wafers grasped by the loading and unloading motion module 20 are placed in the flip transfer module 70 after maintaining the original front and back orientation of the wafer or flipping it according to the incoming material processing instructions. After the loading and unloading motion module 20 takes a wafer from the wafer transfer box 11 of the loading and sampling module 10, it first sends the wafer to the flip transfer module 70 to adjust the front and back orientation, and then moves it to the top layer of the loading buffer module 30.

[0055] like Figure 2 and Figure 5As shown, as another optional implementation method, the wafer polishing and grinding automatic loading and unloading equipment 100 also includes a loading module 80. Specifically, the loading module 80 includes a loading water tank 81 and a wafer holder 82. The loading water tank 81 is used to provide a storage area, and the wafer holder 82 is used to provide a stable support structure so that the wafer will not be displaced or damaged during storage and transportation. A number of notches 821 are provided on the wafer holder for fixing the wafer. The loading module 80 is used to cooperate with the unloading buffer module 60 and the unloading motion detection module 50. The loading module 80 provides a stable and safe environment for storing and processing wafers that have completed the grinding and polishing process.

[0056] like Figure 3 and Figure 6 As shown, as an implementation method, the positioning station includes a fixed plate 3111, a support block 3112, a support and positioning module 3113, a correction module 3114, and a positioning station sensor 3115. The fixed plate 3111 serves as the base of the positioning station, and the support block 3112, the support and positioning module 3113, the correction module 3114, and the positioning station sensor 3115 are all mounted on one end surface of the fixed plate 3111. The support block 3112 and the support and positioning module 3113 are arranged diagonally. For example, the positioning station includes a pair of support blocks 3112 and a pair of support and positioning modules 3113. The pair of support blocks 3112 and the pair of support and positioning modules 3113 surround a rectangular area for accommodating a wafer, and a corresponding support and positioning module 3113 is provided diagonally to each support block 3112. The correction module 3114 is disposed between the pair of support blocks 3112 and is used to apply an adjustable force to the wafer along the radial direction of the wafer.

[0057] Specifically, the support block 3112 is used to abut the wafer in the radial direction of the wafer, and is specifically configured as a boss that provides supporting force. In addition to being used to abut the wafer in the radial direction of the wafer, the support positioning module 3113 can also limit the rotation of the wafer. The support positioning module 3113 includes a positioning member 3113a and a base 3113b. The positioning member 3113a is installed on the fixed disk 3111, which has a positioning panel extending toward the center of the wafer. The base 3113b is installed on the fixed disk 3111, and at least part of the base 3113b is located above the positioning panel, so that a gap is formed between the base 3113b and the positioning panel. When the wafer is in the positioning position, a part of the edge of the wafer can be embedded in the gap. The opposite ends of the base 3113b abut against the outer edge of the wafer to limit the movement of the wafer.

[0058] Furthermore, the alignment module 3114 includes an alignment base 3114a and an alignment movable portion 3114b. The alignment base 3114a is mounted on the fixed plate 3111, and the alignment movable portion 3114b is mounted on the alignment base 3114a. The alignment movable portion 3114b is configured as a slide that can reciprocate relative to the alignment base 3113b, and the movement direction of the alignment movable portion 3114b coincides with the radial direction of the wafer. For example, a reference straight line is defined whose extension direction is parallel to the movement direction of the alignment movable portion 3114b, and a pair of support and positioning modules 3113 are symmetrically distributed about the reference straight line. Through the cooperation between the alignment movable portion 3114b and the support and positioning modules 3113, the wafer is confined to a set position in the positioning station, preventing the wafer from shifting when adjusting the wafer position.

[0059] The positioning station sensor 3115 is used to detect whether there is a wafer on the positioning station 311 and simultaneously detect the tilt angle of the wafer on the positioning station 311 to detect whether the wafer is level. The detection result is fed back to the adjustment platform 312.

[0060] Exemplarily, the positioning station sensor 3115 includes a reflection sensor 3115a and two pairs of reflected photoelectric sensors 3115b diagonally arranged on the fixed plate 3111. The reflection sensor 3115a is used to detect whether there is a wafer on the positioning station 311, and the reflected photoelectric sensors 3115b are used to detect the tilt angle of the wafer on the positioning station 311 to detect whether the wafer is level.

[0061] Each group of positioning stations 311 is respectively installed on a group of adjustment platforms 312. The adjustment platforms 312 can realize linear motion along the width direction and the length direction. According to the control signal representing the relative position relationship of the three grinding and polishing stations 411 of the planetary wheel 41 obtained by the material unloading motion module 50, the position of the wafer on the positioning station 311 is adjusted in real time to keep the relative position consistent with the three grinding and polishing stations 411 of the planetary wheel 41.

[0062] In the embodiment of the present application, the loading and unloading motion module 20 takes out a wafer from the wafer transfer box 11 on the loading and sampling module 10, and transfers the wafer to the loading buffer module 30 until three wafers are placed, waiting for the loading instruction. When the loading instruction is received, the unloading motion module 50 is detected and moves to the planetary wheel 41, obtains the relative position relationship of the three grinding and polishing stations 411 of the planetary wheel 41, and generates a control signal representing the relative position of the grinding and polishing station 411. The loading buffer module 30 receives the control signal, and the adjustment platform 312 calibrates the positions of the three wafers on the positioning station 311 in real time to ensure that the relative position distribution of the wafers is consistent with the relative position distribution of the grinding and polishing stations 411 of the planetary wheel 41. The loading and unloading motion module 20 absorbs the three adjusted wafers at the same time and transfers the wafers to the corresponding grinding and polishing stations 411.

[0063] Through the above-mentioned setting, the detection and unloading motion module 50 and the loading cache module 30 work together to achieve high-precision matching of the wafer position on the positioning station 311 and the planetary wheel 41 grinding and polishing station 411, thereby improving the wafer placement accuracy; through the loading and unloading motion module 20, the three adjusted wafers are absorbed at one time, which greatly reduces the loading and unloading rhythm and improves production efficiency.

[0064] As a way to implement Figure 7 and Figure 8 As shown, the device for detecting the unloading movement further includes a visual positioning component 522, which includes a light source 5221 and a camera 5222. When the visual positioning component 522 moves above the first planetary wheel 41, the light source 5221 illuminates the surface of the grinding and polishing station 411 of the planetary wheel 41, and the camera 5222 receives the light signal reflected from the grinding and polishing station 411, thereby determining the first relative position relationship of the multiple grinding and polishing stations 411 in the first planetary wheel 41, generating a first control signal representing the first relative position relationship, and sending it to the adjustment platform 312. In response to the first control signal, the adjustment platform 312 can fine-tune the wafers in the positioning station 311 so that their distribution is completely matched with the grinding and polishing station 411 of the first planetary wheel 41, ensuring that there is no offset when the wafers are placed in the grinding and polishing station 411.

[0065] It should be noted that the camera 5222 is used to receive light signals reflected from the grinding and polishing stations 411 and determine the relative positional relationship between the multiple grinding and polishing stations 411 in the planetary wheel 41 based on a reflective imaging method. The reflective imaging method is to irradiate light onto the grinding and polishing stations 411 through the light source 5221. After the light is reflected by the grinding and polishing stations 411, it is received and imaged by the camera 5222. The acquired image data is analyzed using an image processing algorithm to identify the positions of the multiple grinding and polishing stations 411 on the planetary wheel 41. Typically, image processing uses techniques such as edge detection and morphological analysis to accurately determine the position of the grinding and polishing stations 411, calculate the relative positional relationship of each grinding and polishing station 411, and calculate the wafer position difference based on the image processed data to generate a control signal.

[0066] When the adjustment platform 312 adjusts the wafer, the visual positioning component 522 moves to the top of the second planetary wheel 41 to detect the second relative position relationship of the multiple grinding and polishing stations 411 in the second planetary wheel 41, and generate a second control signal representing the second relative position relationship. The second control signal will be used for the subsequent wafer placement position adjustment of the second planetary wheel 41.

[0067] When the visual positioning component 522 detects the second relative position relationship, the upper and lower wafer motion module 20 grabs all the adjusted wafers in the positioning station 311 and transfers the wafers to the corresponding grinding and polishing station 411 in the first planetary wheel 41 to complete high-precision loading.

[0068] Through the above settings, the visual positioning component 522 performs detection of the second planetary wheel 41 and the loading operation of the first planetary wheel 41 by the upper and lower sheet motion module 20 simultaneously, thereby eliminating the waiting time of the automatic loading and unloading equipment 100 for wafer polishing and grinding and shortening the working rhythm of the automatic loading and unloading equipment 100 for wafer polishing and grinding.

[0069] like Figure 7 and Figure 8 As shown, as an implementation method, the detection and blanking movement module 50 includes a detection and blanking control device 51 and a first support structure 52. The first support structure 52 is installed on the detection and blanking control device 51 and can move under the action of the detection and blanking control device 51.

[0070] Exemplarily, the detection and blanking control device 51 is configured as a robot arm for controlling the movement of the first supporting structure 52 .

[0071] Furthermore, the first support structure 52 is provided with a first support seat 521, a visual positioning assembly 522, a wafer picking assembly 523, and a pressing block group 524. The visual positioning assembly 522 and the wafer picking assembly 523 are provided on the first support seat 521. The number of pressing block groups 524 is set to be consistent with the number of grinding and polishing stations 411. The distribution positions of the multiple pressing block groups 524 are consistent with the distribution positions of the multiple grinding and polishing stations 411 in the same planetary wheel 41. The pressing block group 524 includes a plurality of pressing blocks 5241. The pressing blocks 5241 can press the wafer located in the grinding and polishing station 411 under the control of the detection and unloading control device 51 to discharge excess liquid under the wafer in the grinding and polishing station 411 during the grinding process. The wafer removal assembly 523 is located at one end of the support base and is equipped with a pneumatic clamp 5231 and two clamping plates 5232. One end of each clamping plate 5232 is connected to the pneumatic clamp 5231. Under the control of the pneumatic clamp 5231, the clamping plates 5232 can grasp and release the wafer by clamping or loosening. Each clamping plate 5232 controls one side of the wafer, allowing the clamping plates 5232 to evenly apply clamping force to the wafer between the two clamping plates 5232, ensuring wafer stability during the retrieval process.

[0072] Furthermore, the unloading motion detection module 50 also includes a sensor group 525 mounted on the first support structure 52. The number of sensor groups 525 is consistent with the number of grinding and polishing stations 411, and the distribution of the multiple sensor groups 525 is consistent with the distribution of the multiple grinding and polishing stations 411. The sensor group 525 can detect whether the wafer is within the range defined by the grinding and polishing stations 411. The sensor group 525 includes a plurality of sensor units. In two adjacent sensor groups 525, the sensor units in one sensor group 525 can be reused in the other sensor group 525.

[0073] like Figure 9 As shown, each sensor group 525 exemplarily includes three identical inner sensors 5251 and three identical outer sensors 5252. The orthographic projections of the inner sensors 5251 on the planetary wheel 41 are located within the grinding and polishing station 411 and are used to measure the height of the wafer. The outer sensors 5252 are arranged around the grinding and polishing station 411 and are used to measure the height of the planetary wheel 51. Two adjacent sensor groups 525 share one outer sensor 5252. In this embodiment of the present application, the three inner sensors 5251 and the three outer sensors 5252 are all distributed in a triangular pattern.

[0074] By working together, multiple sensor groups 525 can simultaneously detect the relative height differences and parallelism between multiple wafers and multiple grinding and polishing stations 411. This helps determine whether the wafers are correctly placed within the grinding and polishing stations 411, preventing the wafers from being improperly placed within the grinding and polishing stations 411 during the grinding process, causing pressure on the planetary wheel 41 and subsequent damage. Furthermore, because sensor units in one sensor group 525 can be reused in the other sensor group 525, the number of sensor units is reduced, lowering equipment costs.

[0075] like Figure 10 As shown, as an implementation method, the upper wafer positioning buffer station 31 also includes a buffer station 313, which is arranged below the adjustment platform 312. The buffer station 313 has several layers of storage areas 3131 distributed from top to bottom. Each layer of storage area 3131 can store a number of wafers transferred by the upper and lower wafer motion module 20. The buffer motion device 32 can transfer the wafers in the storage area 3131 to the corresponding positioning station 311. The buffer station 313 provides a multi-level storage space, allowing wafers to be temporarily stored in the buffer station 313, waiting to be transferred to the positioning station 311 by the buffer motion device 32.

[0076] like Figure 10As shown, as an implementation method, the cache movement device 32 includes a transfer component 321 and a fixed bracket 322. One end of the transfer component 321 extends in the direction of the upper wafer positioning cache platform 31, and the other end is installed on the fixed bracket 322 and can move relative to the fixed bracket 322 in the height direction; the upper wafer cache module 30 includes a frame 33, and the frame 33 is provided with a guide rail 331 extending in a set direction. The fixed bracket 322 is installed on the guide rail 331 and can slide relative to the guide rail 331 in the set direction. Specifically, the set direction is the direction in which one end of the transfer component 321 extends to the upper wafer positioning cache platform 31. The fixed bracket 322 is used to support the transfer component 321. The fixed bracket 322 moves horizontally along the guide rail 331, so that the transfer component 321 can reach different workstation positions, thereby being able to grab or place wafers.

[0077] Specifically, the transfer assembly 321 includes a transfer fork arm 3211 and a drive unit 3212 for driving the transfer fork arm 3211. The transfer fork arm 3211 can move in the height direction under the action of the drive unit 3212 to grab the wafers in the corresponding storage area 3131. Specifically, the drive unit 3212 is used to adjust the position of the transfer fork arm 3211 in the height direction so that the transfer fork arm 3211 can grab or place the wafer.

[0078] In some examples, the transfer fork arm 3211 is configured as a single-wafer fork arm 3211a, in other examples, the transfer fork arm 3211 is configured as a dual-wafer fork arm 3211b, and in yet other examples, multiple transfer forks 3211 are configured as either single-wafer fork arms 3211a or dual-wafer fork arms 3211b, acting together at different buffer stations 313. A single-wafer fork arm 3211a corresponds to one buffer station 313 and grabs wafers from a storage area 3131 within that buffer station 313. A single-wafer fork arm 3211a can place a single wafer from a positioning station 311 into a buffer station 313, or place a wafer stored in a buffer station 313 into the positioning station 311. A dual-wafer fork arm 3211b corresponds to two buffer stations 313 and can simultaneously grab wafers from corresponding storage areas in two buffer stations 313. The double-wafer fork arm 3211b is used to simultaneously place two wafers from the positioning station 311 into the buffer station 313 , or to place wafers stored in the buffer station 313 into the positioning station 311 .

[0079] Through the above-mentioned setting, the transfer fork arm 3211 can grab one and / or simultaneously grab multiple wafers in the storage area 3131 and place them from the positioning station 311 to the cache station 313, or place the wafers stored in the cache station 313 to the positioning station 311, so that the transfer fork arm 3211 can complete the wafer grabbing, transfer or placement operations at multiple positions, thereby realizing the needs of serving multiple stations.

[0080] like Figure 11 As shown, as an implementation, the upper and lower sheet movement module 20 includes an upper and lower sheet control device 21 , a second support structure 22 and a plurality of adsorption member groups 23 .

[0081] Exemplarily, the loading and unloading control device 21 is configured as a robot arm for controlling the movement of the second supporting structure 22 .

[0082] like Figure 12 As shown, further, the second support structure 22 includes a second support base 221 and a second fork arm 222. One end of the second fork arm 222 is connected to the second support base 221, and the other end of the second fork arm 222 is set as a U-shaped sheet structure with an adsorption function. The second fork arm 222 is used to absorb the wafers in the wafer transfer box 11 and place them on the flip transfer module 70. The second support structure 22 is installed on the upper and lower wafer control device 21 and can move under the action of the upper and lower wafer control device 21. The number of adsorption component groups 23 is consistent with the number of positioning stations 311. The distribution positions of multiple adsorption component groups 23 are consistent with the distribution positions of multiple positioning stations 311. The adsorption component 23 can grab the wafer located at the positioning station 311, so that the upper and lower wafer movement module 20 can absorb multiple wafers at one time, which greatly improves the loading and unloading rhythm.

[0083] like Figure 12 As shown, further, the upper and lower sheet motion module 20 further includes a movable mechanism 24, and the movable mechanism 24 is configured as a linear motion mechanism along the height direction.

[0084] Exemplarily, the movable mechanism 24 is configured as a pneumatic slide.

[0085] At least two of the multiple adsorption component groups 23 are equipped with a movable mechanism 24, and the movable mechanism 24 is arranged at the end of the second support seat 221. The movable mechanism 24 can adjust the position of the adsorption component group 23 so that the multiple adsorption component groups 23 can correspond to the grabbing position of the wafer adjusted by the adjustment platform 312. After the adjustment platform 312 of the upper wafer buffer module 30 completes the wafer position calibration, the movable mechanism 24 drives the adsorption component group 23 to move in the height direction so that it accurately matches the calibrated wafer grabbing position. The adsorption component 231 adsorbs the wafer, and the movable mechanism 24 retracts to the initial position, ready to transfer the wafer to the polishing grinder 40 or the lower wafer buffer module 60. Through the above-mentioned setting, the movable mechanism 24 can be dynamically adjusted, and thus can adapt to wafers of different specifications for grabbing work.

[0086] like Figure 13As shown, as an implementation method, the lower wafer buffer module 60 includes a water tank 61 and a motion bracket 62. The water tank 61 has a liquid storage space for storing liquid. The motion bracket 62 includes a plurality of paired linear motion units 621. The motion bracket 62 is arranged on the water tank 61 so as to be liftable. The motion bracket 62 is arranged in a U-shape. One end of the linear motion unit 621 is arranged at the end of the motion bracket 62, and the other end of the linear motion unit 621 is arranged outside the water tank 61, so that the motion bracket 62 can move relative to the water tank 61 in the height direction to enter / exit the liquid storage space. When the linear motion unit 621 is extended, the motion bracket 62 is raised out of the water tank 61. When the linear motion unit 621 is retracted, the motion bracket 62 is lowered into the water tank 61. When the motion bracket 62 leaves the liquid storage space, the upper and lower wafer motion modules 20 can grab the wafers in the same planetary wheel 41 and transfer them to the motion bracket 62.

[0087] The motion bracket 62 includes a first wafer fixing plate 622 and a second wafer fixing plate 623 that can move relative to each other in the height direction. The first wafer fixing plate 622 and the second wafer fixing plate 623 are staggered in the horizontal direction. Through this arrangement, independent storage space is provided for multiple wafers in the lower wafer buffer module 60. The first wafer fixing plate 622 and the second wafer fixing plate 623 are provided with a receiving groove 624 for placing wafers. Specifically, the first wafer fixing plate 622 is fixed and used to support a wafer, and the second wafer fixing plate 623 can move relative to each other in the height direction and can be adjusted to support additional wafers.

[0088] When the upper and lower wafer motion modules 20 grab the polished wafers, the movable mechanism 24 can drive the suction assembly 23 to move so that the surfaces of the wafers do not overlap. The upper and lower wafer motion modules 20 then transfer the wafers adjusted by the movable mechanism 24 to the staggered first and second wafer holding plates 622 and 623. Through this arrangement, the first and second wafer holding plates 622 and 623 can staggeredly receive the wafers brought by the upper and lower wafer motion modules 20 and adjusted in height by the movable mechanism 24, ensuring that the wafers in the lower wafer buffer module 60 have sufficient space to be stored without interfering with each other.

[0089] In summary, the wafer polishing and grinding automatic loading and unloading equipment 100 provided in the present application uses the visual positioning component 522 to detect the grinding and polishing station 411 by a reflective imaging method, thereby accurately detecting the relative position of the wafer in the grinding and polishing station 411, and generating a control signal to send to the adjustment platform 312. The adjustment platform 312 can adjust the relative position of the wafer in the positioning station 311 in real time according to the control signal, and has the function of high-precision positioning, detection and adjustment of the wafer during the processing process. The equipment adjusts the relative position of the wafer through the adjustment platform 312, and the suction cup 231 absorbs all the adjusted wafers in the positioning station 311 at one time, realizing the function of loading and unloading multiple wafers at a time, greatly reducing the loading and unloading rhythm and improving production efficiency.

[0090] Exemplarily, the number of grinding and polishing stations 411 is three, and the number of storage areas 3131 is five.

[0091] like Figure 14 As shown, the present application also provides a method for automatic loading and unloading of wafer polishing and grinding, which includes the following steps:

[0092] Step S1401: The second fork arm 222 takes out the wafer from the wafer pod 11 and places it into the flip transfer module 70;

[0093] For example, the second fork arm 222 of the upper and lower wafer movement module 20 takes out a wafer from the wafer transfer box 11, and according to the incoming material processing instructions, the wafer is kept in its original front and back orientation or flipped after being judged by the flip transfer sensor 711, and temporarily stored in the flip transfer module 70.

[0094] Step S1402: The suction member 231 of the wafer loading and unloading movement module 20 suctions the wafer and places it in the storage area of ​​the buffer station 313;

[0095] For example, the suction part 231 of the upper and lower wafer movement module 20 transfers the wafer from the flip transfer module 70 to the top layer of the upper wafer cache module 30. When the top layer is full of three wafers, the single-wafer fork arm 3211a and the double-wafer fork arm 3211b work together to transfer the three wafers to the storage area 3131 of the cache station 313.

[0096] Step S1401 and step S1402 are repeated until the wafer loading buffer module 30 is fully loaded with fifteen wafers.

[0097] Step S1403: the blanking motion detection module 50 detects the grinding and polishing station 411 and generates a control signal, causing the adjustment platform 312 to adjust the relative position of the positioning station 311 according to the control signal;

[0098] Exemplarily, the detection unloading motion module 50 moves to above the first planetary wheel 41, and the relative position relationship of the three grinding and polishing stations 411 in the planetary wheel 41 is obtained through the visual positioning component 522, and a control signal representing the relative position relationship is generated. The adjustment platform 312 of the upper wafer cache module 30 receives the control signal and calibrates the relative positions of the three wafers in the positioning station 311 of the upper wafer cache module 30 according to the control signal, so that the relative position relationship of the wafers in the positioning station 311 is consistent with the relative position relationship of the grinding and polishing station 411.

[0099] Step S1404: The suction member 231 simultaneously absorbs three wafers from the positioning station 311 and places them into the first planetary wheel 41;

[0100] For example, the suction component group 23 of the upper and lower wafer motion module 20 moves to the positioning station 311 of the upper wafer buffer module 30, and the suction components 231 simultaneously absorb three wafers. The suction component group 23 of the upper and lower wafer motion module 20 moves to the first planetary wheel 41 and simultaneously places the three wafers in the grinding and polishing station 411 of the first planetary wheel 41.

[0101] Step S1405: The polishing and grinding machine 40 rotates, and the detection and unloading motion module 50 performs a press detection on the second planetary wheel 41;

[0102] Exemplarily, the polishing grinder 40 rotates, and the first planetary wheel 41 on which the wafer is placed moves to the second planetary wheel 41. The pressing block 5241 on the unloading motion module 50 performs a pressing detection function to discharge excess liquid in the grinding and polishing station 411, and detects the wafer position through the sensor group 525. If the wafer is not accurately placed in the grinding and polishing station 411, an alarm is triggered. If the detection is normal, the loading of three wafers is completed.

[0103] Repeat steps S1403 to S1405 until all the planetary wheels 41 in the polishing and grinding machine 40 are filled with wafers, completing the loading process.

[0104] Step S1406 : The suction component assembly 23 moves to above the first planetary wheel 41 , sucks three wafers at a time, and transfers them to the lower wafer buffer module 60 .

[0105] For example, when the polishing machine 40 completes processing and receives a wafer unloading instruction, the suction component group 23 of the upper and lower wafer movement module 20 moves to the first planetary wheel 41, grabs three wafers at a time and transfers them to the lower wafer buffer module 60 for temporary storage.

[0106] Step S1407 : the wafer taking assembly 523 delivers the wafer from the wafer unloading buffer module 60 to the unloading module 80 .

[0107] For example, when the unloading buffer module 60 is full of wafers, the wafer picking component 523 of the unloading motion module 50 detects and grabs a wafer and transfers the wafers one by one to the unloading module 80 for storage.

[0108] Repeat steps S1406 to S1407 until all wafers are unloaded.

[0109] Through the above-mentioned settings, the automatic loading and unloading equipment 100 for wafer polishing and grinding provided by the present application can realize the loading and unloading of three wafers at a time, greatly shortening the loading and unloading cycle. The visual positioning component 522 is coordinated with the adjustment platform 312 for calibration, and the wafer placement accuracy is high. The detection and unloading motion module 50 can press and detect three wafers at the same time, and the pressing detection efficiency is high.

[0110] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the claims appended to this application.

Claims

1. A wafer polishing and grinding automatic loading and unloading device, which is equipped with a polishing grinder (40), the polishing grinder is used to grind and polish wafers, the polishing grinder (40) includes a plurality of planetary wheels (41), each of the planetary wheels (41) has a plurality of polishing stations (411) for fixing wafers, It is characterized in that The wafer polishing and grinding automatic loading and unloading equipment includes: A loading and sampling module (10) for carrying a wafer transfer box (11); A lower wafer buffer module (60) for storing wafers after grinding and polishing; A blanking motion detection module (50) is used to detect the relative position relationship between the plurality of grinding and polishing stations (411) in a planetary wheel (41) and generate a control signal representing the relative position relationship; A wafer caching module (30) comprises a wafer positioning caching platform (31) and a caching motion device (32), wherein the wafer positioning caching platform (31) is used to carry or store wafers, and the wafer positioning caching platform (31) comprises a positioning station (311) and an adjustment platform (312), wherein the number of the positioning stations (311) is consistent with the number of the grinding and polishing stations (411) in the planetary wheel (41), and the caching motion device (32) is capable of transferring the wafers stored in the wafer positioning caching platform (31) to the corresponding positioning station (311), and the adjustment platform (312) is used to adjust the wafers located in the positioning station (311) in response to the control signal, so that the position distribution of the wafers is consistent with the position distribution of the plurality of the grinding and polishing stations (411) in the planetary wheel (41); an upper and lower wafer movement module (20) for transferring the wafers in the wafer transfer box (11) to the upper wafer buffer module (30); the upper and lower wafer movement module (20) is further used for grabbing all wafers adjusted in the positioning station (311) and transferring the wafers to the corresponding grinding and polishing station (411); Wherein, the detection and unloading motion module (50) includes a visual positioning component (522). When the visual positioning component (522) moves to the top of the first planet wheel, the visual positioning component (522) detects the first relative position relationship of the plurality of grinding and polishing stations (411) in the first planet wheel, and generates a first control signal representing the first relative position relationship. The adjustment platform (312) can adjust the wafer located in the positioning station (311) in response to the first control signal; when the adjustment platform (312) adjusts the wafer, the visual positioning component (522) moves to the top of the second planet wheel to detect the second relative position relationship of the plurality of grinding and polishing stations (411) in the second planet wheel, and generates a second control signal representing the second relative position relationship.

2. The wafer polishing and grinding automatic loading and unloading equipment according to claim 1 is characterized in that: When the visual positioning component (522) detects the second relative position relationship, the upper and lower piece motion module (20) grabs all the adjusted wafers in the positioning station (311) and transfers the wafers to the corresponding grinding and polishing station (411) in the first planetary wheel.

3. The automatic wafer polishing and grinding loading and unloading equipment according to claim 1 is characterized in that: The visual positioning component (522) includes a light source (5221) and a camera (5222), wherein the light source (5221) is used to illuminate the grinding and polishing station (411), and the camera (5222) is used to receive light signals reflected from the grinding and polishing station (411), and to determine the relative positional relationship between the plurality of grinding and polishing stations (411) in the planetary wheel (41) based on a reflective imaging method.

4. The automatic wafer polishing and grinding loading and unloading equipment according to claim 1, characterized in that: The detection and unloading motion module (50) includes a detection and unloading control device (51) and a first support structure (52), wherein the first support structure (52) is mounted on the detection and unloading control device (51) and can move under the action of the detection and unloading control device (51), and the first support structure (52) is provided with a pressing block group (524) whose number is consistent with the number of the grinding and polishing stations (411), and the distribution positions of the plurality of pressing block groups (524) are consistent with the distribution positions of the plurality of grinding and polishing stations (411) in the same planetary wheel, and the pressing block group (524) includes a plurality of pressing blocks (5241), and the pressing blocks (5241) can press the wafer located in the grinding and polishing station (411) under the control of the detection and unloading control device (51); the visual positioning component (522) is mounted on the first support structure (52).

5. The automatic wafer polishing and grinding loading and unloading equipment according to claim 4 is characterized in that: The detection and unloading motion module (50) includes a sensor group (525) installed on the first support structure (52), the number of the sensor groups (525) is consistent with the number of the grinding and polishing stations (411), and the distribution positions of the plurality of the sensor groups (525) are consistent with the distribution positions of the plurality of the grinding and polishing stations (411), and the sensor group (525) can detect whether the wafer is within the range defined by the grinding and polishing stations (411); The sensor group (525) includes a plurality of sensor units, and in two adjacent sensor groups (525), the sensor units in one of the sensor groups (525) can be reused in the other sensor group (525).

6. The wafer polishing and grinding automatic loading and unloading equipment according to claim 1, characterized in that: The upper wafer positioning cache platform (31) also includes a cache station (313), which is arranged below the adjustment platform (312). The cache station (313) has several layers of storage areas (3131) distributed from top to bottom. Each layer of storage area (3131) can store several wafers transferred by the upper and lower wafer movement modules (20). The cache movement device (32) can transfer the wafers in the storage area (3131) to the corresponding positioning station (311).

7. The automatic wafer polishing and grinding loading and unloading equipment according to claim 6, characterized in that: The cache movement device (32) includes a transfer component (321) and a fixed bracket (322), one end of the transfer component (321) extends in the direction of the positioning cache platform (31), and the other end is installed on the fixed bracket (322) and can move relative to the fixed bracket (322) in the height direction; the upper slice cache module (30) includes a frame (33), and the frame (33) is provided with a guide rail (331) extending in a set direction, and the fixed bracket (322) is installed on the guide rail (331) and can slide relative to the guide rail (331) in the set direction.

8. The automatic wafer polishing and grinding loading and unloading equipment according to claim 7, characterized in that: The transfer assembly (321) includes a transfer fork arm (3211) and a driving unit (3212) for driving the transfer fork arm (3211) to move. The transfer fork arm (3211) can move along the height direction under the action of the driving unit (3212) to grab the wafer in the corresponding storage area (3131).

9. The automatic wafer polishing and grinding loading and unloading equipment according to claim 8, characterized in that: The transfer fork arm is configured as a single-piece fork arm (3211a) and / or a double-piece fork arm (3211b), wherein the single-piece fork arm (3211a) corresponds to one of the cache stations (313) and grabs the wafers in the storage area (3131) in one of the cache stations (313); the double-piece fork arm (3211b) corresponds to two of the cache stations (313), and the double-piece fork arm (3211b) can simultaneously grab the wafers in the corresponding storage areas (3131) in the two cache stations (313).

10. The automatic wafer polishing and grinding loading and unloading equipment according to claim 1, characterized in that: The upper and lower slice movement module (20) includes an upper and lower slice control device (21), a second support structure (22) and a plurality of adsorption component groups (23). The second support structure (22) is installed on the upper and lower slice control device (21) and can move under the action of the upper and lower slice control device (21). The number of the adsorption component groups (23) is consistent with the number of the positioning stations (311). The distribution positions of the plurality of adsorption component groups (23) are consistent with the distribution positions of the plurality of positioning stations (311). The adsorption component group (23) includes a plurality of adsorption components (231). The adsorption components (231) can grab the wafer located at the positioning station (311).

11. The automatic wafer polishing and grinding loading and unloading equipment according to claim 10, characterized in that: The upper and lower sheet movement module (20) includes a movable mechanism (24), and at least two of the multiple adsorption component groups (23) are equipped with the movable mechanism (24). The movable mechanism (24) can adjust the position of the adsorption component group (23) so that the multiple adsorption component groups (23) can correspond to the grasping position of the wafer adjusted by the adjustment platform (312).

12. The automatic wafer polishing and grinding loading and unloading equipment according to claim 11, characterized in that: The lower wafer buffer module (60) includes a water tank (61) and a moving bracket (62), wherein the water tank (61) forms a liquid storage space for storing liquid, and the moving bracket (62) can move relative to the water tank (61) in the height direction to enter / leave the liquid storage space; when the moving bracket (62) leaves the liquid storage space, the upper and lower wafer moving modules (20) can grab the wafer in the same planetary wheel (41) and transfer it to the moving bracket (62).

13. The automatic wafer polishing and grinding loading and unloading equipment according to claim 12, characterized in that: The motion bracket (62) comprises a first wafer fixing plate (622) and a second wafer fixing plate (623) capable of relative movement in a height direction, wherein the first wafer fixing plate (622) and the second wafer fixing plate (623) are staggered in a horizontal direction.

14. The automatic wafer polishing and grinding loading and unloading equipment according to claim 13, characterized in that: When the upper and lower sheet motion modules (20) grab the ground and polished wafers, the movable mechanism (24) can drive the adsorption component group (23) to move so that the surfaces of the wafers do not overlap, and the upper and lower sheet motion modules (20) transfer the wafers adjusted by the movable mechanism (24) to the first wafer fixing plate (622) and the second wafer fixing plate (623) that are staggered.

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