A water-cooled UV curing device for plate processing

By setting up a curing heat dissipation module and cleaning module in the UV curing device, the problem of degradation of water-cooled heat dissipation effect caused by the rise in the heat dissipation channel is solved, ensuring the curing effect and device life, and achieving efficient heat dissipation and curing effects.

CN120327098BActive Publication Date: 2025-08-08SHENZHEN TECHSTAR PRECISION IND CO LTD
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Patent Information

Application Number
CN202510809936.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-06-17
Publication Date
2025-08-08
Estimated Expiration
2045-06-17

AI Technical Summary

Technical Problem

After working for a long time, the temperature of the existing UV curing device increases, resulting in a decrease in the water-cooled heat dissipation effect and affecting the curing effect.

Method used

A water-cooled UV curing device for sheet processing is designed, including a curing heat dissipation module and a curing cleaning module. By switching heat dissipation channels regularly and cleaning dust impurities, the heat dissipation effect and curing effect are ensured.

Benefits of technology

It effectively avoids the increase in the temperature of the heat dissipation channel affecting the curing effect, extends the service life of the device, and improves the heat dissipation and curing effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application provides a water-cooled UV curing device for plate processing, which relates to the field of circuit board manufacturing and includes: a curing chamber, wherein four fixed plates are provided inside the curing chamber, and the inner walls of the four fixed plates are fixedly connected to the same rectangular frame; three horizontal plate racks, wherein the three horizontal plate racks are provided on the inner walls of opposite sides of two of the fixed plates; and three curing heat dissipation modules, wherein the three curing heat dissipation modules are provided on the three horizontal plate racks and the rectangular frame. The present application achieves the function of maintaining the curing effect of the curing lamp body. When in use, the device can time-switch the heat dissipation channel body in contact with the curing lamp body to prevent the heat dissipation channel body from rising in temperature after long-term operation, thereby preventing the heat dissipation effect of the water-cooling heat dissipation effect from being affected by the temperature rise, thereby ensuring that the curing lamp body will not overheat and affect the curing effect after long-term use.
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Description

Technical Field

[0001] The present invention relates to the field of circuit board manufacturing, and in particular to a water-cooled UV curing device for plate processing. Background Art

[0002] A UV curing device is a device that uses ultraviolet light (UV) to trigger the rapid curing of photosensitive materials. A UV light source (such as a mercury lamp or UVLED) emits ultraviolet light with a wavelength of 200-400nm, which excites the photoinitiator in the material, triggering the polymerization reaction of monomers and oligomers, and solidifying the liquid material into a solid state within milliseconds to seconds.

[0003] The UV curing unit also includes a cooling system. Water-cooled: A circulating water pump drives coolant (such as deionized water) to remove heat from the lamp, maintaining a stable temperature and suitable for long-term high-load operation.

[0004] ‌PCB substrate‌ is the basic material of printed circuit boards, which carry electronic components and realize electrical connections between them.

[0005] Existing UV curing devices need to use water cooling to dissipate heat during use. However, during heat dissipation, since the heat of the UV curing device is mainly generated by the UV curing lamp, and the heat dissipation channels are mostly arranged near the UV curing lamp, after long-term operation, the temperature of the heat dissipation channels themselves will also rise, resulting in a decrease in the water cooling effect, causing the device to overheat and affect the curing effect.

[0006] Therefore, we made improvements to this and proposed a water-cooled UV curing device for plate processing. Summary of the Invention

[0007] The purpose of the present invention is to address the problem that currently existing heat dissipation channels are mostly arranged near UV curing lamps. Therefore, after long-term operation, the temperature of the heat dissipation channels themselves will also rise, resulting in a decrease in the effectiveness of water cooling and heat dissipation, causing the device to overheat and affect the curing effect.

[0008] In order to achieve the above-mentioned purpose of the invention, the present invention provides a water-cooled UV curing device for plate processing to improve the above-mentioned problem.

[0009] The specific application is as follows:

[0010] include:

[0011] A curing chamber, wherein four fixed plates are provided inside the curing chamber, and the inner walls of the four fixed plates are fixedly connected to the same rectangular frame;

[0012] Three horizontal plate racks, which are arranged on inner walls on opposite sides of two of the fixed plates;

[0013] Three curing and heat dissipation modules are arranged on three horizontal plates and a rectangular frame. The curing and heat dissipation modules are used to perform water cooling and heat dissipation on the UV curing lamps and maintain the water cooling and heat dissipation effect to ensure the curing effect;

[0014] Three curing cleaning modules, all of which are set on a rectangular frame. The curing cleaning modules are used to clean the UV curing lamps to ensure that dust and other impurities do not affect their operating state;

[0015] Two conveying brackets, both of which are arranged inside the curing chamber.

[0016] As a preferred technical solution of this application, the curing and heat dissipation module includes:

[0017] Two curing power sockets, both of which are fixedly connected to the rectangular frame, with lamp tubes fixedly connected to the outer walls of the two curing power sockets on opposite sides, and the same curing lamp body being provided at one end of the two lamp tubes;

[0018] A second fixed bracket is fixedly connected to one of the curing power supply bases. An electric push rod is provided on the second fixed bracket, and an output end of the electric push rod is fixedly connected to a mounting frame.

[0019] The fixing bracket 1 is fixedly connected to another curing power supply seat, and the fixing bracket 1 and the installation frame are both provided with connecting parts.

[0020] As a preferred technical solution of this application, the curing and heat dissipation module further includes:

[0021] A servo motor is provided on one of the connecting pieces, and an output shaft of the servo motor is connected to a water-cooled base chamber via a coupling. A fixing frame is fixedly connected to an outer wall of one side of the water-cooled base chamber, and the fixing frame is provided at one end of the other connecting piece;

[0022] Multiple heat dissipation channel bodies are all arranged on the water-cooled base chamber, and each of the multiple heat dissipation channel bodies is provided with a circulation pump, wherein the outer walls of two of the heat dissipation channel bodies are in contact with the outer wall of the curing lamp tube body.

[0023] As a preferred technical solution of this application, the curing and heat dissipation module further includes:

[0024] A connecting bracket is provided at the bottom of the horizontal plate frame, and two electric telescopic rods are provided on the connecting bracket, and one end of the two electric telescopic rods is fixedly connected to the same heat dissipation frame;

[0025] Two outer frames are fixedly connected to the outer wall of one side of the heat dissipation frame. Four circular holes are opened on the two outer frames, and the inner walls of the multiple circular holes are provided with mounting guide rods.

[0026] As a preferred technical solution of this application, the curing and heat dissipation module further includes:

[0027] Two heat dissipation fin groups, each of which is provided at one end of a plurality of mounting guide rods, and an adjustment plate is fixedly connected to one side outer wall of each of the two heat dissipation fin groups;

[0028] A universal motor is arranged on the heat dissipation frame. The output shaft of the universal motor is connected to an opening and closing plate through a coupling. The outer wall of the opening and closing plate contacts the outer walls of the opposite sides of the two adjustment plates.

[0029] As a preferred technical solution of this application, the curing and heat dissipation module further includes:

[0030] The air pump body is arranged on the heat dissipation frame. The output end of the air pump body is fixedly connected to two connecting pipes. The output ends of the two connecting pipes are fixedly connected to air bins. The outer walls of the two air bins facing the heat dissipation fin group are each provided with multiple air outlets. The two air bins are arranged on the two outer frames.

[0031] Multiple telescopic springs are respectively arranged on the outside of multiple mounting guide rods, one end of the multiple telescopic springs is respectively fixedly connected to the outer wall of one side of the two heat dissipation fin groups, and the other end of the multiple telescopic springs is respectively fixedly connected to the inner walls of both sides of the two outer frames.

[0032] As a preferred technical solution of this application, the solidification cleaning module includes:

[0033] A fixed rod, the fixed rod is arranged on the rectangular frame, and the outer wall of the fixed rod is fixedly connected to two fixed platforms;

[0034] The limiting guide rod is arranged on the rectangular frame, the limiting guide rod is located on one side of the fixed rod, and the outer wall of the limiting guide rod and the fixed rod is provided with the same movable bracket.

[0035] As a preferred technical solution of this application, the solidification cleaning module also includes:

[0036] An annular frame is provided on the movable bracket, the annular frame is located outside the curing lamp body, and a cleaning pad is provided on the inner wall of the annular frame;

[0037] Four shaft rods are respectively arranged on two fixed platforms, wherein the outer walls of two of the shaft rods are fixedly connected with guide wheels, and the outer walls of the other two shaft rods are fixedly connected with winding wheels and sprockets.

[0038] As a preferred technical solution of this application, the solidification cleaning module also includes:

[0039] A drive motor is provided at the bottom of one of the fixed platforms, and an output shaft of the drive motor is connected to one end of one of the shaft members via a coupling;

[0040] A chain is provided on two sprockets, and both sprockets are located above the two winding wheels;

[0041] Two connecting cables, one end of the two connecting cables is respectively arranged on the two winding wheels, the outer walls of the two connecting cables are respectively in contact with the inner walls of the two guide wheels, and the other ends of the two connecting cables are respectively fixedly connected to the outer walls of both sides of the movable bracket.

[0042] As the preferred technical solution of the present application, two mounting shafts are provided on each of the two conveying brackets, the outer walls of the four mounting shafts are fixedly connected to driving wheels, the outer walls of the two driving wheels on the same side are provided with the same conveyor belt, and the outer walls of one side of the two conveying brackets are fixedly connected to a conveying motor, and the output shafts of the two conveying motors are respectively connected to one end of two of the mounting shafts through a coupling.

[0043] Compared with the prior art, the present invention has the following beneficial effects:

[0044] In the scheme of this application:

[0045] 1. In order to solve the problem that in the prior art, the heat dissipation channel is mostly arranged near the UV curing lamp tube, so after long-term operation, the temperature of the heat dissipation channel itself will also rise, thereby reducing the effect of water cooling heat dissipation, causing the device to overheat and affect the curing effect, the present application realizes the function of maintaining the curing effect of the curing lamp tube body by providing a curing heat dissipation module. When in use, the device can regularly switch the heat dissipation channel body in contact with the curing lamp tube body to prevent the heat dissipation channel body from rising in temperature after long-term operation, thereby preventing the heat dissipation channel body from affecting the water cooling heat dissipation effect due to its own temperature rise, thereby ensuring that the curing lamp tube body will not overheat and affect the curing effect after long-term use, thereby improving the use effect of the device, and after the heat dissipation channel body is switched, the curing heat dissipation module can quickly dissipate heat to it, avoiding that the temperature of the heat dissipation channel body has not completely dropped when it is subsequently switched back to the heat dissipation channel body and affecting the curing effect, thereby further improving the use effect of the device;

[0046] 2. The curing cleaning module is provided to clean dust and other impurities attached to the outer wall of the curing lamp body. During use, this cleaning can prevent the accumulation of dust and other impurities on the outer wall of the curing lamp body, thereby preventing the contact between the heat dissipation channel body and the curing lamp body from being reduced due to the accumulation of dust and other impurities. Therefore, the cleaning ensures the contact between the heat dissipation channel body and the curing lamp body, thereby improving the heat dissipation effect of the device. At the same time, the cleaning can prevent the heat dissipation channel body and the curing lamp body from squeezing dust and other impurities when they contact, thereby preventing the surface of the curing lamp from being worn due to squeezing, thereby increasing the service life of the device and solving the problem of dust accumulation causing poor heat dissipation contact and lamp surface wear in the prior art.

[0047] 3. The conveyor belt, drive wheel and conveyor motor are used to transport the PCB substrate and its substrate fixture for UV curing operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 This is a schematic diagram of the structure of the water-cooled UV curing device for plate processing provided in this application;

[0049] Figure 2 Schematic diagram of the combined structure of the fixed plate and the horizontal plate frame of the water-cooled UV curing device for plate processing provided in this application;

[0050] Figure 3 Schematic diagram of the combined structure of the rectangular frame and curing and cleaning module of the water-cooled UV curing device for plate processing provided in this application;

[0051] Figure 4 Schematic diagram of the curing and heat dissipation module structure of the water-cooled UV curing device for plate processing provided in this application;

[0052] Figure 5 Schematic diagram of the combined structure of the curing lamp body and the water-cooled base chamber of the water-cooled UV curing device for plate processing provided in this application;

[0053] Figure 6 Schematic diagram of the combined structure of the connector and the mounting frame of the water-cooled UV curing device for plate processing provided in this application;

[0054] Figure 7 Schematic diagram of the combined structure of the heat dissipation frame and the outer frame of the water-cooled UV curing device for plate processing provided in this application;

[0055] Figure 8 Schematic diagram of the combined structure of the heat dissipation fin group and telescopic spring of the water-cooled UV curing device for plate processing provided in this application;

[0056] Figure 9This is a schematic diagram of the curing and cleaning module structure of the water-cooled UV curing device for plate processing provided in this application;

[0057] Figure 10 Schematic diagram of the combined structure of the conveyor belt and drive wheel of the water-cooled UV curing device for plate processing provided in this application.

[0058] Indicated in the figure:

[0059] 1. Curing chamber; 2. Conveying motor; 3. Conveying bracket; 4. Fixing plate; 5. Horizontal plate frame; 6. Curing heat dissipation module; 601. Connecting bracket; 602. Heat dissipation channel body; 603. Circulating pump; 604. Fixing bracket 1; 605. Curing power socket; 606. Lamp tube connection; 607. Curing lamp body; 608. Electric push rod; 609. Fixing bracket 2; 610. Water-cooled base chamber; 611. Servo motor; 612. Fixing frame; 613. Connecting piece; 614. Mounting frame; 615. Electric telescopic rod; 616. Heat dissipation frame; 617. Outer frame; 618. Adjustment plate; 619. Air chamber; 620. Heat dissipation fin assembly; 621. Installation guide rod; 622. Universal motor; 623. Opening and closing plate; 624. Connecting pipe; 625. Air pump body; 626. Air outlet; 627. Telescopic spring; 7. Rectangular frame; 8. Curing and cleaning module; 801. Fixed rod; 802. Limiting guide rod; 803. Ring frame; 804. Cleaning pad; 805. Movable bracket; 806. Guide wheel; 807. Fixed platform; 808. Connecting cable; 809. Driving motor; 810. Shaft rod; 811. Chain; 812. Winding wheel; 813. Sprocket; 9. Conveyor belt; 10. Driving wheel; 11. Installation shaft rod. DETAILED DESCRIPTION

[0060] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0061] As described in the background art, the heat dissipation channel is usually arranged near the UV curing lamp. Therefore, after a long period of operation, the temperature of the heat dissipation channel itself will also rise, thereby reducing the effect of water cooling and causing the device to overheat and affect the curing effect.

[0062] In order to solve this technical problem, the present invention provides a water-cooled UV curing device for plate processing, which is applied to UV curing of PCB substrates.

[0063] Specifically, please refer to Figures 1-10 The water-cooled UV curing device for plate processing specifically includes:

[0064] The curing chamber 1 has four fixed plates 4 disposed therein, and the inner walls of the four fixed plates 4 are fixedly connected to a same rectangular frame 7;

[0065] Three horizontal plate racks 5, which are arranged on the inner walls of two of the fixed plates 4 on opposite sides;

[0066] Three curing heat dissipation modules 6 are arranged on three horizontal plate frames 5 and a rectangular frame 7. The curing heat dissipation modules 6 are used to perform water cooling on the UV curing lamps and maintain the water cooling effect to ensure the curing effect;

[0067] Three curing cleaning modules 8, all of which are arranged on the rectangular frame 7, are used to clean the UV curing lamp tubes to ensure that dust and other impurities do not affect their operating state;

[0068] Two conveying brackets 3 are both arranged inside the curing chamber 1 .

[0069] The water-cooled UV curing device for plate processing provided by the present invention achieves the function of maintaining the curing effect of the curing lamp tube body 607. When in use, the device can regularly switch the heat dissipation channel body 602 in contact with the curing lamp tube body 607 to avoid the temperature of the heat dissipation channel body 602 rising after long-term work, thereby avoiding the effect of water-cooling heat dissipation affected by the rise in its own temperature, thereby ensuring that the curing lamp tube body 607 will not be overheated and affect the curing effect after long-term use; it achieves the function of cleaning dust and other impurities attached to the outer wall of the curing lamp tube body 607. When in use, the cleaning can avoid the accumulation of dust and other impurities on the outer wall of the curing lamp tube body 607, thereby avoiding the dust and other impurities affecting the heat dissipation and the service life of the curing lamp tube body 607.

[0070] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0071] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions therein may be combined with each other.

[0072] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0073] Example 1, please refer to Figure 2-Figure 8, a water-cooled UV curing device for plate processing, wherein the curing and heat dissipation module 6 comprises:

[0074] Two curing power sockets 605, both of which are fixedly connected to the rectangular frame 7. Lamp tube connectors 606 are fixedly connected to the outer walls of opposite sides of the two curing power sockets 605. The same curing lamp body 607 is provided at one end of the two lamp tube connectors 606 (the curing power sockets 605 can provide power to the curing lamp body 607 through the lamp tube connectors 606 to facilitate UV curing).

[0075] The second fixing bracket 609 is fixedly connected to one of the curing power supply bases 605. The second fixing bracket 609 is provided with an electric push rod 608. The output end of the electric push rod 608 is fixedly connected to the mounting frame 614.

[0076] The fixing bracket 1 604 is fixedly connected to another curing power supply seat 605 . The fixing bracket 1 604 and the installation frame 614 are both provided with connecting parts 613 .

[0077] Please refer to Figure 4-Figure 8 , a water-cooled UV curing device for plate processing, wherein the curing and heat dissipation module 6 further comprises:

[0078] Servo motor 611, servo motor 611 is mounted on one of the connectors 613, the output shaft of servo motor 611 is connected to water-cooled base chamber 610 via a coupling, a fixing frame 612 is fixedly connected to one outer wall of the water-cooled base chamber 610, and the fixing frame 612 is mounted on one end of the other connector 613;

[0079] Multiple heat dissipation channel bodies 602 are all arranged on the water-cooled base chamber 610, and a circulation pump 603 is provided on each of the multiple heat dissipation channel bodies 602, wherein the outer walls of two heat dissipation channel bodies 602 are in contact with the outer walls of the curing lamp tube body 607 (the operation of the circulation pump 603 can transport the coolant inside the water-cooled base chamber 610 to the inside of the heat dissipation channel body 602, and transport it back to the water-cooled base chamber 610 as it runs).

[0080] Please refer to Figure 4-Figure 8 , a water-cooled UV curing device for plate processing, wherein the curing and heat dissipation module 6 further comprises:

[0081] Connecting bracket 601, which is arranged at the bottom of the horizontal plate frame 5. Two electric telescopic rods 615 are provided on the connecting bracket 601. One end of the two electric telescopic rods 615 is fixedly connected to the same heat dissipation frame 616 (the operation of the electric telescopic rods 615 can drive the heat dissipation frame 616 to move);

[0082] The two outer frames 617 are fixedly connected to the outer wall of one side of the heat dissipation frame 616. The two outer frames 617 are each provided with four circular holes, and the inner walls of the multiple circular holes are each provided with mounting guide rods 621.

[0083] Please refer to Figure 4-Figure 8 , a water-cooled UV curing device for plate processing, wherein the curing and heat dissipation module 6 further comprises:

[0084] Two heat dissipation fin groups 620, each of which is disposed at one end of a plurality of mounting guide rods 621, and an adjustment plate 618 is fixedly connected to one outer wall of each heat dissipation fin group 620;

[0085] Universal motor 622, universal motor 622 is set on the heat dissipation frame 616, the output shaft of universal motor 622 is connected to the opening and closing plate 623 through a coupling, the outer wall of the opening and closing plate 623 is in contact with the outer wall on the opposite side of the two adjustment plates 618 (the operation of universal motor 622 drives the opening and closing plate 623 to rotate, and the rotation of the opening and closing plate 623 can adjust the distance between the two adjustment plates 618).

[0086] Please refer to Figure 4-Figure 8 , a water-cooled UV curing device for plate processing, wherein the curing and heat dissipation module 6 further comprises:

[0087] The air pump body 625 is mounted on the heat dissipation frame 616. The output end of the air pump body 625 is fixedly connected to two connecting pipes 624. The output ends of the two connecting pipes 624 are fixedly connected to an air bin 619. The outer walls of the two air bins 619 facing the heat dissipation fin assembly 620 are each provided with a plurality of air vents 626. The two air bins 619 are mounted on the two outer frames 617 (the air pump body 625 transports gas to the air bins 619 through the connecting pipes 624 and discharges the gas through the air vents 626).

[0088] Multiple telescopic springs 627 are respectively arranged on the outside of multiple mounting guide rods 621, one end of the multiple telescopic springs 627 is respectively fixedly connected to the outer wall of one side of the two heat dissipation fin groups 620, and the other end of the multiple telescopic springs 627 is respectively fixedly connected to the inner walls on both sides of the two outer frames 617.

[0089] The curing heat dissipation module 6 maintains the curing effect of the curing lamp tube body 607. When in use, the device can periodically switch the heat dissipation channel body 602 in contact with the curing lamp tube body 607 to avoid the temperature of the heat dissipation channel body 602 rising after a long period of work, thereby avoiding the effect of water cooling heat dissipation affected by the rise in its own temperature, thereby ensuring that the curing lamp tube body 607 will not overheat and affect the curing effect after long-term use, thereby improving the use effect of the device, and after switching the heat dissipation channel body 602, the curing heat dissipation module 6 can quickly dissipate heat for it, thereby avoiding the temperature of the heat dissipation channel body 602 not completely dropping when switching back to the heat dissipation channel body 602, affecting the curing effect, thereby further increasing the use effect of the device.

[0090] Example 2 further optimizes the water-cooled UV curing device for plate processing provided in Example 1. Specifically, Figure 3 and Figure 9 As shown, the curing cleaning module 8 includes:

[0091] A fixed rod 801 is provided on the rectangular frame 7, and the outer wall of the fixed rod 801 is fixedly connected to two fixed platforms 807;

[0092] The limiting guide rod 802 is provided on the rectangular frame 7 . The limiting guide rod 802 is located on one side of the fixed rod 801 . The outer wall of the limiting guide rod 802 and the fixed rod 801 is provided with the same movable bracket 805 .

[0093] Further, such as Figure 9 As shown, the curing and cleaning module 8 also includes:

[0094] An annular frame 803 is provided on a movable bracket 805 and is located outside the curing lamp body 607. A cleaning pad 804 is provided on the inner wall of the annular frame 803.

[0095] Four shaft members 810 are respectively arranged on two fixed platforms 807, wherein the outer walls of two shaft members 810 are fixedly connected to the guide wheel 806, and the outer walls of the other two shaft members 810 are fixedly connected to the winding wheel 812 and the sprocket 813 (the winding wheel 812 and the sprocket 813 can move synchronously through the shaft members 810).

[0096] Further, such as Figure 9 As shown, the curing and cleaning module also includes:

[0097] A drive motor 809 is disposed at the bottom of one of the fixed platforms 807 , and an output shaft of the drive motor 809 is connected to one end of one of the shaft members 810 via a coupling (the drive motor 809 can drive the shaft member 810 to rotate);

[0098] Chain 811, chain 811 is set on two sprockets 813, and the two sprockets 813 are both located above the two winding wheels 812;

[0099] Two connecting cables 808, one end of the two connecting cables 808 is respectively set on the two winding wheels 812, the outer walls of the two connecting cables 808 are respectively in contact with the inner walls of the two guide wheels 806, and the other ends of the two connecting cables 808 are respectively fixedly connected to the outer walls on both sides of the movable bracket 805.

[0100] The curing cleaning module 8 realizes the cleaning function of dust and other impurities attached to the outer wall of the curing lamp tube body 607. During use, the accumulation of dust and other impurities on the outer wall of the curing lamp tube body 607 can be avoided by cleaning, thereby avoiding the decrease in the contact effect between the heat dissipation channel body 602 and the curing lamp tube body 607 due to the accumulation of dust and other impurities. Therefore, the contact effect between the heat dissipation channel body 602 and the curing lamp tube body 607 is ensured by cleaning, thereby improving the heat dissipation effect of the device. At the same time, cleaning can avoid the heat dissipation channel body 602 and the curing lamp tube body 607 from squeezing dust and other impurities when they contact, thereby avoiding wear on the surface of the curing lamp tube due to squeezing, thereby increasing the service life of the device.

[0101] Example 3 further optimizes the water-cooled UV curing device for plate processing provided in Example 1 or 2. Specifically, Figure 1 、 Figure 2 and Figure 10 As shown, two conveying brackets 3 are each provided with two mounting shafts 11, and the outer walls of the four mounting shafts 11 are fixedly connected to the driving wheels 10, and the outer walls of the two driving wheels 10 on the same side are provided with the same conveyor belt 9, and the outer walls of one side of the two conveying brackets 3 are fixedly connected to the conveying motor 2, and the output shafts of the two conveying motors 2 are respectively connected to one end of two of the mounting shafts 11 through couplings (the conveying motor 2 drives the mounting shaft 11 to rotate, and drives the driving wheel 10 and the conveyor belt 9 to run through the mounting shaft 11).

[0102] The conveyor belt 9, the driving wheel 10 and the conveying motor 2 realize the conveyance of the PCB substrate and its substrate fixture for UV curing operation.

[0103] The use process of the water-cooled UV curing device for plate processing provided by the present invention is as follows:

[0104] When in use, the PCB substrate and the substrate fixture are placed on the conveyor belt 9. At this time, the conveying motor 2 is running, and the conveying motor 2 drives the installation shaft 11 to rotate, and drives the driving wheel 10 and the conveyor belt 9 to run through the installation shaft 11 to convey the PCB substrate and the substrate fixture for UV curing;

[0105] During curing, the curing power supply base 605 is started, and the curing power supply base 605 can provide power to the curing lamp body 607 through the lamp tube pipe 606, so that the curing lamp body 607 performs UV curing on the PCB substrate;

[0106] During curing and heat dissipation, the heat dissipation channel body 602 contacts the curing lamp body 607. At this time, the circulation pump 603 is running, and the circulation pump 603 transports the coolant inside the water-cooled base chamber 610 to the heat dissipation channel body 602, and then transports it back to the water-cooled base chamber 610 as it runs. In this process, the coolant absorbs the heat emitted by the curing lamp body 607 to achieve heat dissipation;

[0107] When the temperature of the heat dissipation channel body 602 rises to a certain temperature, the electric push rod 608 is started, and the electric push rod 608 drives the installation frame 614 to move, and further moves the two connecting parts 613, so that the electric push rod 608 drives the water-cooling base chamber 610 and one end of the heat dissipation channel body 602 to rise until the heat dissipation channel body 602 is separated from the curing lamp body 607. At this time, the servo motor 611 is running, and the servo motor 611 drives the water-cooling base chamber 610 to rotate to switch the heat dissipation channel body 602. After the switching, the electric push rod 608 drives the water-cooling base chamber 610 to reset, and makes the replaced heat dissipation channel body 602 contact with the curing lamp body 607 to ensure the heat dissipation effect;

[0108] After the switch, the electric telescopic rod 615 is operated, and the electric telescopic rod 615 drives the heat dissipation frame 616 to move, so that the original heat dissipation channel body 602 is located inside the heat dissipation frame 616. At this time, the universal motor 622 is started, and the universal motor 622 drives the opening and closing plate 623 to rotate. With the rotation of the opening and closing plate 623 and the thrust applied to the heat dissipation fin group 620 by the telescopic spring 627, the two heat dissipation fin groups 620 are able to approach each other until they contact the original heat dissipation channel body 602, so that the heat dissipation fin group 620 absorbs the heat of the original heat dissipation channel body 602 itself. At the same time, the air pump body 625 is started, and the air pump body 625 transports gas to the air bin 619 through the connecting pipe 624 and discharges it through the air outlet 626, so that the air flow blows the heat dissipation fin group 620 while taking away the heat thereon, so as to quickly dissipate heat from the original heat dissipation channel body 602. After heat dissipation, the device resets.

[0109] During the switching operation, as the heat dissipation channel body 602 separates from the curing lamp tube, the drive motor 809 starts to operate, and the drive motor 809 drives the shaft member 810 to rotate, and cooperates with the sprocket 813 and the chain 811 to make the two winding wheels 812 run synchronously. At this time, the two winding wheels 812 tighten and loosen the two connecting cables 808 respectively, so that one of the connecting cables 808 drives the movable bracket 805 to move on the fixed rod 801 and the limiting guide rod 802. As the movable bracket 805 moves, it can drive the annular frame 803 and the cleaning pad 804 to move, and make the cleaning pad 804 contact with the curing lamp tube body 607 to clean the dust and other impurities on its outer wall.

[0110] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0111] Obviously, the embodiments described above are only some embodiments of the present invention, rather than all embodiments. The preferred embodiments of the present invention are given in the accompanying drawings, but they do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions described in the aforementioned specific embodiments, or to make equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the present invention specification and drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present invention.

Claims

1. A water-cooled UV curing device for plate processing, characterized in that: include: A curing chamber, wherein four fixed plates are provided inside the curing chamber, and the inner walls of the four fixed plates are fixedly connected to the same rectangular frame; Three horizontal plate racks, which are arranged on inner walls on opposite sides of two of the fixed plates; Three curing and heat dissipation modules are arranged on three horizontal plates and a rectangular frame. The curing and heat dissipation modules are used to perform water cooling and heat dissipation on the UV curing lamps and maintain the water cooling and heat dissipation effect to ensure the curing effect; Three curing cleaning modules, all of which are set on a rectangular frame. The curing cleaning modules are used to clean the UV curing lamps to ensure that dust and impurities do not affect their operating state; Two conveying brackets, both of which are arranged inside the curing chamber; The curing and heat dissipation module includes: Two curing power sockets, both of which are fixedly connected to the rectangular frame, with lamp tubes fixedly connected to the outer walls of the two curing power sockets on opposite sides, and the same curing lamp body being provided at one end of the two lamp tubes; A second fixed bracket is fixedly connected to one of the curing power supply bases. An electric push rod is provided on the second fixed bracket, and an output end of the electric push rod is fixedly connected to a mounting frame. Fixed bracket 1, fixedly connected to another curing power supply seat, and both the fixed bracket 1 and the mounting frame are provided with connecting pieces; The curing and cooling module also includes: A servo motor is provided on one of the connecting pieces, and an output shaft of the servo motor is connected to a water-cooled base chamber via a coupling. A fixing frame is fixedly connected to an outer wall of one side of the water-cooled base chamber, and the fixing frame is provided at one end of the other connecting piece; Multiple heat dissipation channel bodies, each of which is disposed on a water-cooled base chamber, each of which is provided with a circulation pump, wherein the outer walls of two of the heat dissipation channel bodies are in contact with the outer wall of the curing lamp body; The curing and cooling module also includes: A connecting bracket is provided at the bottom of the horizontal plate frame, and two electric telescopic rods are provided on the connecting bracket, and one end of the two electric telescopic rods is fixedly connected to the same heat dissipation frame; Two outer frames are fixedly connected to the outer wall of one side of the heat dissipation frame. Four circular holes are opened on the two outer frames, and the inner walls of the multiple circular holes are provided with mounting guide rods.

2. The water-cooled UV curing device for plate processing according to claim 1, characterized in that: The curing and heat dissipation module also includes: Two heat dissipation fin groups, each of which is provided at one end of a plurality of mounting guide rods, and an adjustment plate is fixedly connected to one side outer wall of each of the two heat dissipation fin groups; A universal motor is arranged on the heat dissipation frame. The output shaft of the universal motor is connected to an opening and closing plate through a coupling. The outer wall of the opening and closing plate contacts the outer walls of the opposite sides of the two adjustment plates.

3. The water-cooled UV curing device for plate processing according to claim 2, characterized in that: The curing and heat dissipation module also includes: The air pump body is arranged on the heat dissipation frame. The output end of the air pump body is fixedly connected to two connecting pipes. The output ends of the two connecting pipes are fixedly connected to air bins. The outer walls of the two air bins facing the heat dissipation fin group are each provided with multiple air outlets. The two air bins are arranged on the two outer frames. Multiple telescopic springs are respectively arranged on the outside of multiple mounting guide rods, one end of the multiple telescopic springs is respectively fixedly connected to the outer wall of one side of the two heat dissipation fin groups, and the other end of the multiple telescopic springs is respectively fixedly connected to the inner walls of both sides of the two outer frames.

4. The water-cooled UV curing device for plate processing according to claim 1, characterized in that: The curing and cleaning module includes: A fixed rod, the fixed rod is arranged on the rectangular frame, and the outer wall of the fixed rod is fixedly connected to two fixed platforms; The limiting guide rod is arranged on the rectangular frame, the limiting guide rod is located on one side of the fixed rod, and the outer wall of the limiting guide rod and the fixed rod is provided with the same movable bracket.

5. The water-cooled UV curing device for plate processing according to claim 4, characterized in that: The curing and cleaning module also includes: An annular frame is provided on the movable bracket, the annular frame is located outside the curing lamp body, and a cleaning pad is provided on the inner wall of the annular frame; Four shaft rods are respectively arranged on two fixed platforms, wherein the outer walls of two of the shaft rods are fixedly connected with guide wheels, and the outer walls of the other two shaft rods are fixedly connected with winding wheels and sprockets.

6. The water-cooled UV curing device for plate processing according to claim 5, characterized in that: The curing and cleaning module also includes: A drive motor is disposed at the bottom of one of the fixed platforms, and an output shaft of the drive motor is connected to one end of one of the shaft members through a coupling; A chain is provided on two sprockets, and both sprockets are located above the two winding wheels; Two connecting cables, one end of the two connecting cables is respectively arranged on the two winding wheels, the outer walls of the two connecting cables are respectively in contact with the inner walls of the two guide wheels, and the other ends of the two connecting cables are respectively fixedly connected to the outer walls of both sides of the movable bracket.

7. The water-cooled UV curing device for plate processing according to claim 1, characterized in that: Two mounting shafts are provided on each of the two conveying brackets, and the outer walls of the four mounting shafts are fixedly connected to driving wheels. The outer walls of the two driving wheels on the same side are provided with the same conveyor belt, and the outer walls of one side of the two conveying brackets are fixedly connected to a conveying motor, and the output shafts of the two conveying motors are respectively connected to one end of two of the mounting shafts through a coupling.

Citation Information

Patent Citations

  • Device for dry printing

    CN109397869A

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    CN111251518A