Wireless temperature measurement system and method using solar panel as antenna

Abstract

The invention relates to a wireless temperature measurement system and method using a solar panel as an antenna, belongs to the technical field of wireless temperature measurement, and realizes miniaturization and cost effectiveness of a temperature measurement module by integrating a monocrystalline silicon solar panel as a radiation antenna. The system is composed of a plurality of key modules including a power supply and signal emission module, a control module, a temperature acquisition module, an energy storage module and a temperature conversion and forwarding module. The modules work cooperatively, accurate acquisition, conversion and wireless transmission of temperature data are ensured, and power supply of the system is managed at the same time. Therefore, the antenna is not shielded by the structure of the temperature measuring device, the radiation performance of the temperature measuring device is remarkably improved, and the wireless transmitting distance of the module is greatly increased.

Description

Technical Field

[0001] The present invention relates to a wireless temperature measurement system and method using a solar panel as an antenna, belonging to the technical field of wireless temperature measurement. Background Art

[0002] In key industries such as power, chemical, petroleum, and metallurgy, wireless temperature measurement technology has become a core measure to ensure the safe operation of equipment and prevent accidents. Especially in the power field, it is particularly crucial to monitor the temperature anomalies at the joints of power lines in real time, which helps to give early warnings and quickly handle potential overheating risks, thereby ensuring the continuous and stable power supply. With the continuous evolution of technology, wireless temperature measurement systems are developing towards being smaller and more integrated to cope with more complex and demanding application environments.

[0003] In the design of miniaturized wireless temperature measurement products powered by solar energy, in order to balance the size of the equipment, the built-in antenna has to be hidden under the solar panel. Since the solar panel itself is a large metal body, its presence will significantly weaken the radiation effect of the built-in antenna, thereby affecting the communication distance of the module.

[0004] The patent application document with the publication number "CN108760062A" discloses a temperature sensor. The problem with this solution is that although it also mentions that the power supply module collects electrical energy from the environment and mentions that a self-discharging circuit can be set to avoid the voltage of the energy storage module being too high, it lacks specific intelligent energy management strategies, such as dynamically adjusting the working mode according to the light intensity or energy demand. Summary of the Invention

[0005] In order to solve the problems existing in the above-mentioned prior art, the present invention proposes a wireless temperature measurement system and method using a solar panel as an antenna.

[0006] The technical solution of the present invention is as follows:

[0007] On the one hand, the present invention provides a wireless temperature measurement system using a solar panel as an antenna, including a power supply and signal transmission module, a control module, a temperature acquisition module, an energy storage module, and a temperature conversion and forwarding module;

[0008] The output end of the temperature acquisition module is connected to the input end of the temperature conversion and forwarding module, the output end of the temperature conversion and forwarding module is connected to the input end of the power supply and signal transmission module, the control module is respectively connected to the power supply and signal transmission module and the energy storage module, and the output end of the power supply and signal transmission module is respectively connected to the input end of the energy storage module and the input end of the temperature conversion and forwarding module;

[0009] The temperature acquisition module outputs an electrical signal to the temperature conversion and forwarding module according to the measured temperature. The temperature conversion and forwarding module is used to convert the electrical signal into a temperature result and forward it to the power supply and signal transmission module;

[0010] The monocrystalline silicon solar panel of the power supply and signal transmission module acts as a radiation antenna to transmit the temperature result to the receiving device, and supplies power to the energy storage module, the control module, and the temperature conversion and forwarding module;

[0011] The energy storage module is used to supply power to the control module and the temperature conversion and forwarding module;

[0012] The control module is used to control whether the energy storage module supplies power to the control module and the temperature conversion and forwarding module, and to control whether the power supply and signal transmission module charges the energy storage module.

[0013] As a preferred embodiment, the power supply and signal transmission module further includes a transient voltage suppression diode D6, a first MOS transistor Q31, and a second ideal diode chip U11;

[0014] The negative electrode welding point J41 of the monocrystalline silicon solar panel is respectively connected to the temperature conversion and forwarding module and grounded through a first inductor L22;

[0015] The positive electrode welding point J42 of the monocrystalline silicon solar panel is connected to one end of a second inductor L23. The other end of the second inductor L23 is respectively connected to the positive electrode of the transient voltage suppression diode D6, one end of a first capacitor C35, one end of a first resistor R16, and the input terminal VIN of the second ideal diode chip U11. The negative electrode of the transient voltage suppression diode D6 and the other end of the first capacitor C35 are grounded. The transient voltage suppression diode D6 is used to protect the circuit behind it from being damaged by static electricity. The ground terminal GND of the second ideal diode chip U11 is grounded. The output terminal VOUT of the second ideal diode chip U11 is respectively connected to the input terminal of the energy storage module and the input terminal of the control module;

[0016] The other end of the first resistor R16 is connected to the drain D1 of the first MOS transistor Q31. The source S1 of the first MOS transistor Q31 is grounded. The gate G1 of the first MOS transistor Q31 is respectively grounded through a second resistor R15 and connected to the output terminal of the control module.

[0017] As a preferred embodiment, the energy storage module includes a lithium thionyl chloride battery BAT1, a super capacitor C34, and a first ideal diode chip U10;

[0018] The negative electrode of the lithium thionyl chloride battery BAT1 is grounded, and the positive electrode is connected to the input terminal VIN of the first ideal diode chip U10. The ground terminal GND of the first ideal diode chip is grounded;

[0019] The negative electrode of the supercapacitor C34 is grounded, and the positive electrode of the supercapacitor C34 is connected to the output terminal VOUT of the second ideal diode chip U11;

[0020] The output terminal VOUT of the first ideal diode chip U10 and the positive electrode of the supercapacitor C34 are connected to the input terminal of the control module.

[0021] As a preferred embodiment, the control module includes a first diode D5, a second MOS transistor Q26, and a logic control chip U2;

[0022] The gate G1 of the first MOS transistor Q31 is connected to the first output terminal PIN5 of the logic control chip U2;

[0023] The output terminal VOUT of the first ideal diode chip U10, the positive electrode of the supercapacitor C34, and the output terminal VOUT of the second ideal diode chip U11 are respectively grounded through a second capacitor C33, and are connected to the power input terminal VDD of the logic control chip U2, one end of a third resistor R14, and the source S1 of the second MOS transistor Q26. The other end of the third resistor R14 and the gate G1 of the second MOS transistor Q26 are connected to the second output terminal PIN12 of the logic control chip U2;

[0024] The drain D1 of the second MOS transistor Q26 is respectively connected to the positive electrode of the first diode D5 and outputs power. The negative electrode of the first diode D5 is connected to the third output terminal PIN13 of the logic control chip U2;

[0025] The ground terminal GND of the logic control chip U2 is grounded;

[0026] The input terminal PIN11 of the logic control chip U2 is connected to the positive electrode of the supercapacitor.

[0027] As a preferred embodiment, the temperature acquisition module includes a negative temperature coefficient thermistor R8;

[0028] One end of the negative temperature coefficient thermistor R8 is grounded, and the other end is respectively connected to one end of a fourth resistor R6 and one end of a fifth resistor R7;

[0029] The other end of the fourth resistor R6 and the other end of the fifth resistor R7 are connected to the input terminal of the temperature conversion and forwarding module.

[0030] As a preferred embodiment, the temperature conversion and forwarding module includes a wireless transceiver SOC chip U13;

[0031] The first ADC channel terminal PB3 of the wireless transceiver SOC chip U13 is connected to the other end of the fifth resistor R7;

[0032] The second ADC channel terminal PB4 and the general-purpose input / output terminal PB5 of the wireless transceiver SOC chip U13 are connected to the other end of the fourth resistor R6;

[0033] The first internal digital part power supply terminal VDD1 of the wireless transceiver SOC chip U13 is grounded through the third capacitor C56 and connected to the power supply;

[0034] The internal real-time clock power supply terminal VBAT of the wireless transceiver SOC chip U13 is grounded through the fourth capacitor C59 respectively and connected to the power supply;

[0035] The internal analog part power supply terminal VDDA of the wireless transceiver SOC chip U13 is grounded through the fifth capacitor C51 respectively and connected to the power supply;

[0036] The second internal digital part power supply terminal VDD2 of the wireless transceiver SOC chip U13 is grounded through the sixth capacitor C55;

[0037] The feedback terminal VFBSMPS of the internal switching power supply of the wireless transceiver SOC chip U13 is grounded through the seventh capacitor C49 respectively and connected to the switching terminal VLXSMPS of the internal switching power supply of the wireless transceiver SOC chip U13 through the third inductor L21;

[0038] The power supply terminal VDDSMPS of the internal switching power supply of the wireless transceiver SOC chip U13 is grounded through the eighth capacitor C54, and the ninth capacitor C60 is connected in parallel across the eighth capacitor C54;

[0039] The grounding terminal VSSSMPS and the heat dissipation terminal EXP of the internal switching power supply of the wireless transceiver SOC chip U13 are grounded;

[0040] The power supply terminal VDDRF1V55 of the first internal radio frequency part of the wireless transceiver SOC chip U13 is grounded through the tenth capacitor C57;

[0041] The power supply terminal VDDRF of the second internal radio frequency part of the wireless transceiver SOC chip U13 is connected to one end of the eleventh capacitor C53 and one end of the twelfth capacitor C50 respectively and connected to the power supply, and the other ends of the eleventh capacitor C53 and the twelfth capacitor C50 are grounded;

[0042] The power supply terminal VDDPA of the internal radio frequency amplifier of the wireless transceiver SOC chip U13 is grounded through the thirteenth capacitor C61 and the fourteenth capacitor C62 respectively and connected to the power supply terminal VDDRF1V55 of the first internal radio frequency part of the wireless transceiver SOC chip U13 and the feedback terminal VFBSMPS of the internal switching power supply of the wireless transceiver SOC chip;

[0043] The input terminal OSC_IN of the external high-speed crystal oscillator of the wireless transceiver SOC chip U13 is connected to the frequency input terminal 1 of the four-pin passive crystal oscillator X3, and the output terminal OSC_OUT of the external high-speed crystal oscillator of the wireless transceiver SOC chip U13 is connected to the frequency output terminal 3 of the four-pin passive crystal oscillator X3. The first ground terminal 2 and the second ground terminal 4 of the four-pin passive crystal oscillator X3 are grounded;

[0044] The upgrade configuration terminal BOOOT0 of the wireless transceiver SOC chip U13 is grounded through the sixth resistor R11, and the reset terminal NRST of the wireless transceiver SOC chip U13 is grounded through the sixteenth capacitor C58;

[0045] The output terminal VR_PA of the internal radio frequency amplifier power supply of the wireless transceiver SOC chip U13 is grounded through the seventeenth capacitor C43 and through the eighteenth capacitor C44 respectively, and is connected to one end of the fifth inductor L18 through the fourth inductor L19. The radio frequency signal output terminal RFO_LP of the wire transceiver SOC chip U13 is connected to one end of the fifth inductor L18. The other end of the fifth inductor L18 is connected to one end of the nineteenth capacitor C45 respectively, and is grounded through the twentieth capacitor C29. The twenty-first capacitor C46 is connected in parallel across the two ends of the fifth inductor L18. The other end of the nineteenth capacitor C45 is connected to one end of the twenty-second capacitor C47 through the sixth inductor L15 respectively, and is grounded through the twenty-third capacitor C21. The other end of the twenty-second capacitor C47 is grounded through the seventh inductor L17 respectively, and is connected to the negative welding point of the monocrystalline silicon solar panel.

[0046] On the other hand, the present invention also provides a wireless temperature measurement method using a solar panel as an antenna, including a power supply and signal transmission module, a control module, a temperature acquisition module, an energy storage module, and a temperature conversion and forwarding module;

[0047] The output terminal of the temperature acquisition module is connected to the input terminal of the temperature conversion and forwarding module, the output terminal of the temperature conversion and forwarding module is connected to the input terminal of the power supply and signal transmission module, the control module is respectively connected to the power supply and signal transmission module and the energy storage module, and the output terminal of the power supply and signal transmission module is respectively connected to the input terminal of the energy storage module and the input terminal of the temperature conversion and forwarding module;

[0048] The temperature acquisition module outputs an electrical signal to the temperature conversion and forwarding module according to the measured temperature, and the temperature conversion and forwarding module is used to convert the electrical signal into a temperature result and forward it to the power supply and signal transmission module;

[0049] The monocrystalline silicon solar panel of the power supply and signal transmission module serves as a radiation antenna to transmit the temperature result to the receiving device, and supplies power to the energy storage module, the control module, and the temperature conversion and forwarding module;

[0050] The energy storage module is used to supply power to the control module and the temperature conversion and forwarding module;

[0051] The control module is used to control whether the energy storage module supplies power to the control module and the temperature conversion and forwarding module, and to control whether the power supply and signal transmission module charges the energy storage module.

[0052] As a preferred embodiment, the power supply and signal transmission module further includes a transient voltage suppression diode D6, a first MOS transistor Q31, and a second ideal diode chip U11;

[0053] The negative electrode welding point J41 of the monocrystalline silicon solar panel is respectively connected to the temperature conversion and forwarding module and grounded through a first inductor L22;

[0054] The positive electrode welding point J42 of the monocrystalline silicon solar panel is connected to one end of a second inductor L23. The other end of the second inductor L23 is respectively connected to the positive electrode of the transient voltage suppression diode D6, one end of a first capacitor C35, one end of a first resistor R16, and the input terminal VIN of the second ideal diode chip U11. The negative electrode of the transient voltage suppression diode D6 and the other end of the first capacitor C35 are grounded. The ground terminal GND of the second ideal diode chip U11 is grounded. The output terminal VOUT of the second ideal diode chip U11 is respectively connected to the input terminal of the energy storage module and the input terminal of the control module;

[0055] The other end of the first resistor R16 is connected to the drain D1 of the first MOS transistor Q31. The source S1 of the first MOS transistor Q31 is grounded. The gate G1 of the first MOS transistor Q31 is respectively grounded through a second resistor R15 and connected to the output terminal of the control module.

[0056] As a preferred embodiment, the energy storage module includes a lithium thionyl chloride battery BAT1, a super capacitor C34, and a first ideal diode chip U10;

[0057] The negative electrode of the lithium thionyl chloride battery BAT1 is grounded, and the positive electrode is connected to the input terminal VIN of the first ideal diode chip U10. The ground terminal GND of the first ideal diode chip is grounded;

[0058] The negative electrode of the super capacitor C34 is grounded, and the positive electrode of the super capacitor C34 is connected to the output terminal VOUT of the second ideal diode chip U11;

[0059] The output terminal VOUT of the first ideal diode chip U10 and the positive electrode of the super capacitor C34 are connected to the input terminal of the control module.

[0060] As a preferred embodiment, the control module includes a first diode D5, a second MOS transistor Q26, and a logic control chip U2;

[0061] The gate G1 of the first MOS transistor Q31 is connected to the first output terminal PIN5 of the logic control chip U2;

[0062] The output terminal VOUT of the first ideal diode chip U10, the positive electrode of the super capacitor C34, and the output terminal VOUT of the second ideal diode chip U11 are respectively grounded through the second capacitor C33, and are connected to the power input terminal VDD of the logic control chip U2, one end of the third resistor R14, and the source S1 of the second MOS transistor Q26. The other end of the third resistor R14 and the gate G1 of the second MOS transistor Q26 are connected to the second output terminal PIN12 of the logic control chip U2;

[0063] The drain D1 of the second MOS transistor Q26 is respectively connected to the positive electrode of the first diode D5 and outputs power. The negative electrode of the first diode D5 is connected to the third output terminal PIN13 of the logic control chip U2;

[0064] The ground terminal GND of the logic control chip U2 is grounded;

[0065] The input terminal PIN11 of the logic control chip U2 is connected to the positive electrode of the super capacitor.

[0066] The present invention has the following beneficial effects:

[0067] The present invention creatively uses a monocrystalline silicon solar panel and its connecting wires as the radiation antenna of the temperature measurement module, thereby providing an open space and better size conditions for the antenna. In this way, the antenna will not be shielded by the structure of the temperature measurement device itself, significantly improving its radiation performance and greatly increasing the wireless transmission distance of the module. At the same time, this design realizes the miniaturization of the module while reducing the cost of the independent antenna, thus achieving an optimized balance between performance and cost. The solar panel has dual functions of power supply and signal transmission, makes full use of renewable energy, and intelligently manages the charging and discharging of the energy storage module through the control module (such as preventing overcharging, low voltage protection, etc.) to ensure the stable operation of the system even when the light is insufficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Figure 1 It is a connection diagram of the system modules of the present invention.

[0069] Figure 2 It is a circuit connection diagram of the power supply and signal transmission module, control module, and energy storage module of the present invention.

[0070] Figure 3 It is a circuit connection diagram of the temperature conversion and forwarding module and temperature acquisition module of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0071] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0072] It should be understood that the step numbers used in the text are only for convenient description and do not limit the order of execution of the steps.

[0073] It should be understood that the terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include the plural forms.

[0074] The terms "comprising" and "including" indicate the presence of the described features, wholes, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or their combinations.

[0075] The term "and / or" refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0076] Embodiment 1:

[0077] In this embodiment, the models of the second ideal diode chip U11 and the first ideal diode chip U10 are CH213K, the model of the lithium thionyl chloride battery BAT1 is ER14250, the models of the first MOS transistor Q31 and the second MOS transistor Q26 are YF3400, the model of the transient voltage suppression diode D6 is SMF60CA, the model of the logic control chip U2 is SLG4AX43713, the model of the negative temperature coefficient thermistor R8 is B3950NTC, the model of the wireless transceiver SOC chip U13 is STM32WLE5C8UTR, and the model of the four-pin passive crystal oscillator X3 is 32MHZ_20ppm

[0078] Figure 1 in Figure 2 in <<RF is a network name indicating a connection relationship, that is: the other end of the twenty-second capacitor C47 is connected to the negative welding point of the monocrystalline silicon solar panel; VCC is also a network name indicating the power supply connected to the drain D1 output of the second MOS transistor Q26; ADC, NTCctrl, and VSMPS are all network names, and having the same network name indicates a connection relationship, <<BOOT indicates the access of the upgrade signal, and <<RESET indicates the access of the reset signal.

[0079] See Figure 1 Figure 1 , the present invention provides a wireless temperature measurement system with a solar panel as an antenna, including a power supply and signal transmission module, a control module, a temperature acquisition module, an energy storage module, and a temperature conversion and forwarding module;

[0080] The output end of the temperature acquisition module is connected to the input end of the temperature conversion and forwarding module, the output end of the temperature conversion and forwarding module is connected to the input end of the power supply and signal transmission module, the control module is respectively connected to the power supply and signal transmission module and the energy storage module, and the output end of the power supply and signal transmission module is respectively connected to the input end of the energy storage module and the input end of the temperature conversion and forwarding module;

[0081] The temperature acquisition module outputs an electrical signal to the temperature conversion and forwarding module according to the measured temperature, and the temperature conversion and forwarding module is used to convert the electrical signal into a temperature result and forward it to the power supply and signal transmission module;

[0082] The single-crystalline silicon solar panel of the power supply and signal transmission module serves as a radiation antenna to transmit the temperature result to the receiving device, and supplies power to the energy storage module, the control module, and the temperature conversion and forwarding module;

[0083] The energy storage module is used to supply power to the control module and the temperature conversion and forwarding module;

[0084] The control module is used to control whether the energy storage module supplies power to the control module and the temperature conversion and forwarding module, and control whether the power supply and signal transmission module charges the energy storage module.

[0085] See Figure 2 Figure 2 , as a preferred embodiment, the power supply and signal transmission module further includes a transient voltage suppression diode D6, a first MOS transistor Q31, and a second ideal diode chip U11;

[0086] The negative welding point J41 of the single-crystalline silicon solar panel is respectively connected to the temperature conversion and forwarding module, and grounded through a first inductor L22;

[0087] The positive welding point J42 of the single-crystalline silicon solar panel is connected to one end of a second inductor L23, the other end of the second inductor L23 is respectively connected to the positive electrode of the transient voltage suppression diode D6, one end of a first capacitor C35, one end of a first resistor R16, and the input end VIN of the second ideal diode chip U11, the negative electrode of the transient voltage suppression diode D6 and the other end of the first capacitor C35 are grounded, the ground end GND of the second ideal diode chip U11 is grounded, and the output end VOUT of the second ideal diode chip U11 is respectively connected to the input end of the energy storage module and the input end of the control module;

[0088] The other end of the first resistor R16 is connected to the drain D1 of the first MOS transistor Q31. The source S1 of the first MOS transistor Q31 is grounded. The gate G1 of the first MOS transistor Q31 is grounded through the second resistor R15 and is connected to the output terminal of the control module.

[0089] As a preferred embodiment, the energy storage module includes a lithium thionyl chloride battery BAT1, a super capacitor C34, and a first ideal diode chip U10.

[0090] The negative electrode of the lithium thionyl chloride battery BAT1 is grounded, and the positive electrode is connected to the input terminal VIN of the first ideal diode chip U10. The ground terminal GND of the first ideal diode chip is grounded.

[0091] The negative electrode of the super capacitor C34 is grounded, and the positive electrode of the super capacitor C34 is connected to the output terminal VOUT of the second ideal diode chip U11.

[0092] The output terminal VOUT of the first ideal diode chip U10 and the positive electrode of the super capacitor C34 are connected to the input terminal of the control module.

[0093] As a preferred embodiment, the control module includes a first diode D5, a second MOS transistor Q26, and a logic control chip U2.

[0094] The gate G1 of the first MOS transistor Q31 is connected to the first output terminal PIN5 of the logic control chip U2.

[0095] The output terminal VOUT of the first ideal diode chip U10, the positive electrode of the super capacitor C34, and the output terminal VOUT of the second ideal diode chip U11 are respectively grounded through the second capacitor C33 and are connected to the power input terminal VDD of the logic control chip U2, one end of the third resistor R14, and the source S1 of the second MOS transistor Q26. The other end of the third resistor R14 and the gate G1 of the second MOS transistor Q26 are connected to the second output terminal PIN12 of the logic control chip U2.

[0096] The drain D1 of the second MOS transistor Q26 is respectively connected to the positive electrode of the first diode D5 and outputs power. The negative electrode of the first diode D5 is connected to the third output terminal PIN13 of the logic control chip U2.

[0097] The ground terminal GND of the logic control chip U2 is grounded.

[0098] The input terminal PIN11 of the logic control chip U2 is connected to the positive electrode of the super capacitor.

[0099] As a preferred embodiment, the temperature acquisition module includes a negative temperature coefficient thermistor R8.

[0100] One end of the negative temperature coefficient thermistor R8 is grounded, and the other end is respectively connected to one end of the fourth resistor R6 and one end of the fifth resistor R7;

[0101] The other ends of the fourth resistor R6 and the fifth resistor R7 are connected to the input end of the temperature conversion and forwarding module.

[0102] The function of the first output terminal PIN5 of the logic control chip U2 is that when the logic control chip U2 detects that the voltage on the super capacitor C34 reaches 3.6V, it outputs a high level to control the conduction of the D pole and S pole of the MOS transistor Q31, discharging the current of the solar panel to GND to prevent overcharging from damaging the subsequent integrated chip.

[0103] The function of the second output terminal PIN12 of the logic control chip U2 is that when the logic control chip detects that the voltage on the super capacitor exceeds 3.2V, it outputs a low level to control the conduction of the D pole and S pole of the MOS transistor Q26, enabling the front super capacitor to supply power to the subsequent circuit; when the logic control chip detects that the voltage on the super capacitor is lower than 2.5V, it outputs a high level to control the cut-off of the D pole and S pole of the MOS transistor Q26, ending the power supply to the subsequent circuit.

[0104] The function of the third output terminal PIN13 of the logic control chip U2 is that when the logic control chip detects that the voltage on the super capacitor is lower than 2.5V, it outputs a low level to quickly consume the electrical energy of the subsequent circuit through the first diode D5. The subsequent circuit includes a temperature conversion and forwarding module and a temperature acquisition module.

[0105] The function of the input terminal PIN11 of the logic control chip U2 is that the logic control chip is used to detect the voltage on the super capacitor. VC is the network name, indicating that it is connected to the positive pole of the super capacitor.

[0106] See Figure 3 , as a preferred embodiment, the temperature conversion and forwarding module includes a wireless transceiver SOC chip U13;

[0107] The first ADC channel terminal PB3 of the wireless transceiver SOC chip U13 is connected to the other end of the fifth resistor R7;

[0108] The second ADC channel terminal PB4 and the general input / output terminal PB5 of the wireless transceiver SOC chip U13 are connected to the other end of the fourth resistor R6;

[0109] The first internal digital part power supply terminal VDD1 of the wireless transceiver SOC chip U13 is grounded through the third capacitor C56 and connected to the power supply;

[0110] The internal real-time clock power supply terminal VBAT of the wireless transceiver SOC chip U13 is grounded through the fourth capacitor C59 respectively, and is connected to the power supply;

[0111] The internal analog part power supply terminal VDDA of the wireless transceiver SOC chip U13 is grounded through the fifth capacitor C51 respectively, and is connected to the power supply;

[0112] The second internal digital part power supply terminal VDD2 of the wireless transceiver SOC chip U13 is grounded through the sixth capacitor C55;

[0113] The feedback terminal VFBSMPS of the internal switching power supply of the wireless transceiver SOC chip U13 is grounded through the seventh capacitor C49 respectively, and is connected to the switching terminal VLXSMPS of the internal switching power supply of the wireless transceiver SOC chip U13 through the third inductor L21;

[0114] The power supply terminal VDDSMPS of the internal switching power supply of the wireless transceiver SOC chip U13 is grounded through the eighth capacitor C54, and the ninth capacitor C60 is connected in parallel across the eighth capacitor C54;

[0115] The grounding terminal VSSSMPS and the heat dissipation terminal EXP of the internal switching power supply of the wireless transceiver SOC chip U13 are grounded;

[0116] The power supply terminal VDDRF1V55 of the first internal radio frequency part of the wireless transceiver SOC chip U13 is grounded through the tenth capacitor C57;

[0117] The power supply terminal VDDRF of the second internal radio frequency part of the wireless transceiver SOC chip U13 is connected to one end of the eleventh capacitor C53 and one end of the twelfth capacitor C50 respectively, and is connected to the power supply. The other end of the eleventh capacitor C53 and the other end of the twelfth capacitor C50 are grounded;

[0118] The power supply terminal VDDPA of the internal radio frequency amplifier of the wireless transceiver SOC chip U13 is grounded through the thirteenth capacitor C61 and the fourteenth capacitor C62 respectively, and is connected to the power supply terminal VDDRF1V55 of the first internal radio frequency part of the wireless transceiver SOC chip U13 and the feedback terminal VFBSMPS of the internal switching power supply of the wireless transceiver SOC chip;

[0119] The input terminal OSC_IN of the external high-speed crystal oscillator of the wireless transceiver SOC chip U13 is connected to the frequency input terminal 1 of the four-pin passive crystal oscillator X3. The output terminal OSC_OUT of the external high-speed crystal oscillator of the wireless transceiver SOC chip U13 is connected to the frequency output terminal 3 of the four-pin passive crystal oscillator X3. The first grounding terminal 2 and the second grounding terminal 4 of the four-pin passive crystal oscillator X3 are grounded;

[0120] The upgrade configuration terminal BOOOT0 of the wireless transceiver SOC chip U13 is grounded through the sixth resistor R11, and the reset terminal NRST of the wireless transceiver SOC chip U13 is grounded through the sixteenth capacitor C58;

[0121] The output terminal VR_PA of the internal radio frequency amplifier power supply of the wireless transceiver SOC chip U13 is grounded through the seventeenth capacitor C43 and through the eighteenth capacitor C44 respectively, and is connected to one end of the fourth inductor L19 and the fifth inductor L18. The radio frequency signal output terminal RFO_LP of the line transceiver SOC chip U13 is connected to one end of the fifth inductor L18. The other end of the fifth inductor L18 is connected to one end of the nineteenth capacitor C45 respectively, and is grounded through the twentieth capacitor C29. The twenty-first capacitor C46 is connected in parallel at both ends of the fifth inductor L18. The other end of the nineteenth capacitor C45 is connected to one end of the twenty-second capacitor C47 through the sixth inductor L15 respectively, and is grounded through the twenty-third capacitor C21. The other end of the twenty-second capacitor C47 is grounded through the seventh inductor L17 respectively, and is connected to the negative welding point of the monocrystalline solar panel.

[0122] Circuit principle:

[0123] Power supply and signal transmission module:

[0124] Function: Using a monocrystalline solar panel as a radiation antenna, the collected temperature data is transmitted to the receiving device, and at the same time, power support is provided for other modules.

[0125] Circuit principle: Solar panel: As the energy source and antenna of the system, its positive and negative poles are connected to other modules through a specific circuit.

[0126] Transient voltage suppression diode (D6): Used to protect the subsequent circuit from electrostatic or other transient voltage damage.

[0127] Inductors (L22, L23): Used for filtering and impedance matching to ensure the stability and efficiency of power transmission.

[0128] Capacitors (C35, etc.): Used for energy storage and filtering to smooth the power supply.

[0129] Resistors (R16, etc.): Used for current limiting and voltage division to protect circuit components.

[0130] Ideal diode chip (U11): Used to achieve unidirectional conductivity and prevent reverse current.

[0131] MOS transistor (Q31): Under the control of the control module, realizes the on-off of the circuit and power management.

[0132] Control module:

[0133] Function: Responsible for controlling the charging and discharging process of the energy storage module, preventing overcharging and low-voltage protection, and ensuring the stable operation of the system under different lighting conditions.

[0134] Circuit principle: Diode (D5): Used to achieve unidirectional conductivity and protect the subsequent circuit.

[0135] MOS transistor (Q26): Under the control of the logic control chip, realizes the power supply control of the energy storage module to the subsequent circuit.

[0136] Logic control chip (U2): According to the preset logic and conditions (such as the voltage level of the energy storage module), controls the on and off of the MOS transistor to achieve intelligent energy management.

[0137] Capacitors (C33, etc.): Used for energy storage and filtering to ensure the stable operation of the logic control chip.

[0138] Resistors (R14, etc.): Used for current limiting and voltage division to protect circuit components.

[0139] Temperature acquisition module:

[0140] Function: Uses a negative temperature coefficient thermistor as a temperature sensor to convert temperature changes into electrical signal outputs.

[0141] Circuit principle: Negative temperature coefficient thermistor (R8): Its resistance value changes with temperature, thereby converting temperature information into electrical signals.

[0142] Resistors (R6, R7, etc.): Used for voltage division and current limiting to ensure the stability and measurability of the thermistor output signal.

[0143] Energy storage module:

[0144] Function: Includes lithium thionyl chloride batteries and supercapacitors, used to store the electrical energy converted by solar panels and provide continuous and stable power support for the system.

[0145] Circuit principle: Lithium thionyl chloride battery (BAT1): As a long-term energy storage component, provides stable electrical energy output.

[0146] Supercapacitor (C34): As a short-term energy storage component, provides instantaneous high-power output to compensate for the fluctuations in the electrical energy output of solar panels.

[0147] Ideal diode chip (U10): Prevents the reverse flow of current in the energy storage module and protects the battery and capacitor.

[0148] Temperature conversion and forwarding module:

[0149] Function: Converts the electrical signal output by the temperature acquisition module into a temperature result and sends it to the receiving device wirelessly.

[0150] Circuit principle: Wireless transceiver SOC chip (U13): Integrates functions such as an analog-to-digital converter (ADC), a processor, and a radio frequency transmitter, and realizes the acquisition, processing, and wireless transmission of temperature signals.

[0151] Capacitors (C56, C59, etc.): Used for energy storage and filtering to ensure the stable operation of the SOC chip.

[0152] Inductors (L19, L21, etc.): Used for impedance matching and filtering to improve the transmission efficiency of radio frequency signals.

[0153] Four-pin passive crystal oscillator (X3): Provides a stable clock signal for the SOC chip.

[0154] Embodiment 2:

[0155] The present invention also provides a wireless temperature measurement method using a solar panel as an antenna, including a power supply and signal transmission module, a control module, a temperature acquisition module, an energy storage module, and a temperature conversion and forwarding module;

[0156] The output end of the temperature acquisition module is connected to the input end of the temperature conversion and forwarding module, the output end of the temperature conversion and forwarding module is connected to the input end of the power supply and signal transmission module, the control module is respectively connected to the power supply and signal transmission module and the energy storage module, and the output end of the power supply and signal transmission module is respectively connected to the input end of the energy storage module and the input end of the temperature conversion and forwarding module;

[0157] The temperature acquisition module outputs an electrical signal to the temperature conversion and forwarding module according to the measured temperature, and the temperature conversion and forwarding module is used to convert the electrical signal into a temperature result and forward it to the power supply and signal transmission module;

[0158] The single-crystalline silicon solar panel of the power supply and signal transmission module serves as a radiation antenna to transmit the temperature result to the receiving device and supply power to the energy storage module, the control module, and the temperature conversion and forwarding module;

[0159] The energy storage module is used to supply power to the control module and the temperature conversion and forwarding module;

[0160] The control module is used to control whether the energy storage module supplies power to the control module and the temperature conversion and forwarding module, and control whether the power supply and signal transmission module charges the energy storage module.

[0161] As a preferred embodiment, the power supply and signal transmission module further includes a transient voltage suppression diode D6, a first MOS transistor Q31, and a second ideal diode chip U11;

[0162] The negative electrode welding point J41 of the single-crystalline silicon solar panel is respectively connected to the temperature conversion and forwarding module and grounded through a first inductor L22;

[0163] The positive welding point J42 of the single-crystalline silicon solar panel is connected to one end of the second inductor L23. The other end of the second inductor L23 is respectively connected to the positive electrode of the transient voltage suppression diode D6, one end of the first capacitor C35, one end of the first resistor R16, and the input terminal VIN of the second ideal diode chip U11. The negative electrode of the transient voltage suppression diode D6 and the other end of the first capacitor C35 are grounded. The ground terminal GND of the second ideal diode chip U11 is grounded. The output terminal VOUT of the second ideal diode chip U11 is respectively connected to the input terminal of the energy storage module and the input terminal of the control module;

[0164] The other end of the first resistor R16 is connected to the drain D1 of the first MOS transistor Q31. The source S1 of the first MOS transistor Q31 is grounded. The gate G1 of the first MOS transistor Q31 is respectively grounded through the second resistor R15 and connected to the output terminal of the control module.

[0165] As a preferred embodiment, the energy storage module includes a lithium thionyl chloride battery BAT1, a super capacitor C34, and a first ideal diode chip U10;

[0166] The negative electrode of the lithium thionyl chloride battery BAT1 is grounded, and the positive electrode is connected to the input terminal VIN of the first ideal diode chip U10. The ground terminal GND of the first ideal diode chip is grounded;

[0167] The negative electrode of the super capacitor C34 is grounded, and the positive electrode of the super capacitor C34 is connected to the output terminal VOUT of the second ideal diode chip U11;

[0168] The output terminal VOUT of the first ideal diode chip U10 and the positive electrode of the super capacitor C34 are connected to the input terminal of the control module.

[0169] As a preferred embodiment, the control module includes a first diode D5, a second MOS transistor Q26, and a logic control chip U2;

[0170] The gate G1 of the first MOS transistor Q31 is connected to the first output terminal PIN5 of the logic control chip U2;

[0171] The output terminal VOUT of the first ideal diode chip U10, the positive electrode of the super capacitor C34, and the output terminal VOUT of the second ideal diode chip U11 are respectively grounded through the second capacitor C33, and are connected to the power input terminal VDD of the logic control chip U2, one end of the third resistor R14, and the source S1 of the second MOS transistor Q26. The other end of the third resistor R14 and the gate G1 of the second MOS transistor Q26 are connected to the second output terminal PIN12 of the logic control chip U2;

[0172] The drain D1 of the second MOS transistor Q26 is connected to the positive electrode of the first diode D5 and the output power supply respectively. The negative electrode of the first diode D5 is connected to the third output terminal PIN13 of the logic control chip U2;

[0173] The ground terminal GND of the logic control chip U2 is grounded;

[0174] The input terminal PIN11 of the logic control chip U2 is connected to the positive electrode of the super capacitor.

[0175] In the embodiments of the present application, "at least one" means one or more, and "a plurality" means two or more. "And / or" describes the association relationship of associated objects and indicates that three relationships can exist. For example, A and / or B can represent the cases of A existing alone, A and B existing simultaneously, and B existing alone. Where A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects before and after. "At least one of the following" and its similar expressions refer to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b, and c can represent: a, b, c, a and b, a and c, b and c, or a and b and c, where a, b, and c can be single or multiple.

[0176] Those of ordinary skill in the art can realize that the units and algorithm steps described in the embodiments disclosed herein can be implemented by a combination of electronic hardware, computer software, and electronic hardware. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present application.

[0177] Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the systems, devices, and units described above can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated herein.

[0178] In several embodiments provided by the present application, if any function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in various embodiments of the present application. The aforementioned storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memories (ROM), random access memories (RAM), magnetic disks, or optical discs that can store program codes.

[0179] The above are only the embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A wireless temperature measurement system with a solar panel as an antenna, characterized in that, It includes a power supply and signal transmission module, a control module, a temperature acquisition module, an energy storage module, and a temperature conversion and forwarding module; The output end of the temperature acquisition module is connected to the input end of the temperature conversion and forwarding module, the output end of the temperature conversion and forwarding module is connected to the input end of the power supply and signal transmission module, the control module is respectively connected to the power supply and signal transmission module and the energy storage module, and the output end of the power supply and signal transmission module is respectively connected to the input end of the energy storage module and the input end of the temperature conversion and forwarding module; The temperature acquisition module outputs an electrical signal to the temperature conversion and forwarding module according to the measured temperature, and the temperature conversion and forwarding module is used to convert the electrical signal into a temperature result and forward it to the power supply and signal transmission module; The single-crystal silicon solar panel of the power supply and signal transmission module serves as a radiation antenna to transmit the temperature result to the receiving device, and supplies power to the energy storage module, the control module, and the temperature conversion and forwarding module; The energy storage module is used to supply power to the control module and the temperature conversion and forwarding module; The control module is used to control whether the energy storage module supplies power to the control module and the temperature conversion and forwarding module, and control whether the power supply and signal transmission module charges the energy storage module.

2. The wireless temperature measurement system with a solar panel as an antenna according to claim 1, characterized in that, The power supply and signal transmission module further includes a transient voltage suppression diode, a first MOS transistor, and a second ideal diode chip; The negative electrode welding point of the single-crystal silicon solar panel is respectively connected to the temperature conversion and forwarding module, and grounded through a first inductor; The positive electrode welding point of the single-crystal silicon solar panel is connected to one end of a second inductor, the other end of the second inductor is respectively connected to the positive electrode of the transient voltage suppression diode, one end of a first capacitor, one end of a first resistor, and the input end of the second ideal diode chip, the negative electrode of the transient voltage suppression diode and the other end of the first capacitor are grounded, the grounding end of the second ideal diode chip is grounded, and the output end of the second ideal diode chip is respectively connected to the input end of the energy storage module and the input end of the control module; The other end of the first resistor is connected to the drain of the first MOS transistor, the source of the first MOS transistor is grounded, and the gate of the first MOS transistor is respectively grounded through a second resistor and connected to the output end of the control module.

3. The wireless temperature measurement system with a solar panel as an antenna according to claim 2, wherein The energy storage module includes a lithium thionyl chloride battery, a super capacitor, and a first ideal diode chip; The negative electrode of the lithium thionyl chloride battery is grounded, and the positive electrode is connected to the input end of the first ideal diode chip, and the grounding end of the first ideal diode chip is grounded; The negative electrode of the super capacitor is grounded, and the positive electrode of the super capacitor is connected to the output end of the second ideal diode chip; The output end of the first ideal diode chip and the positive electrode of the super capacitor are connected to the input end of the control module.

4. The wireless temperature measurement system with a solar panel as an antenna according to claim 3, characterized in that, The control module includes a first diode, a second MOS transistor, and a logic control chip; The gate of the first MOS transistor is connected to the first output end of the logic control chip; The output end of the first ideal diode chip, the positive electrode of the super capacitor, and the output end of the second ideal diode chip are respectively grounded through a second capacitor, and connected to the power input end of the logic control chip, one end of a third resistor, and the source of the second MOS transistor, and the other end of the third resistor and the gate of the second MOS transistor are connected to the second output end of the logic control chip; The drain of the second MOS transistor is connected to the positive electrode of the first diode and the output power supply respectively, and the negative electrode of the first diode is connected to the third output terminal of the logic control chip; The ground terminal of the logic control chip is grounded; The input terminal of the logic control chip is connected to the positive electrode of the super capacitor.

5. The wireless temperature measurement system with a solar panel as an antenna according to claim 4, wherein The temperature acquisition module includes a negative temperature coefficient thermistor; One end of the negative temperature coefficient thermistor is grounded, and the other end is connected to one end of the fourth resistor and one end of the fifth resistor respectively; The other ends of the fourth resistor and the fifth resistor are connected to the input terminal of the temperature conversion and forwarding module.

6. The wireless temperature measurement system with a solar panel as an antenna according to claim 5, characterized in that, The temperature conversion and forwarding module includes a wireless transceiver SOC chip; The first ADC channel terminal of the wireless transceiver SOC chip is connected to the other end of the fifth resistor; The second ADC channel terminal and the general input / output terminal of the wireless transceiver SOC chip are connected to the other end of the fourth resistor; The first internal digital part power supply terminal of the wireless transceiver SOC chip is grounded through a third capacitor and connected to the power supply; The internal real-time clock power supply terminal of the wireless transceiver SOC chip is grounded through a fourth capacitor and connected to the power supply respectively; The internal analog part power supply terminal of the wireless transceiver SOC chip is grounded through a fifth capacitor and connected to the power supply respectively; The second internal digital part power supply terminal of the wireless transceiver SOC chip is grounded through a sixth capacitor; The feedback terminal of the internal switching power supply of the wireless transceiver SOC chip is grounded through a seventh capacitor and connected to the switching terminal of the internal switching power supply of the wireless transceiver SOC chip through a third inductor; The power supply terminal of the internal switching power supply of the wireless transceiver SOC chip is grounded through an eighth capacitor, and a ninth capacitor is connected in parallel across the eighth capacitor; The ground terminal and the heat dissipation terminal of the internal switching power supply of the wireless transceiver SOC chip are grounded; The power supply terminal of the first internal radio frequency part of the wireless transceiver SOC chip is grounded through a tenth capacitor; The power supply terminal of the second internal radio frequency part of the wireless transceiver SOC chip is connected to one end of the eleventh capacitor and one end of the twelfth capacitor respectively and connected to the power supply, and the other ends of the eleventh capacitor and the twelfth capacitor are grounded; The power supply terminal of the internal radio frequency amplifier of the wireless transceiver SOC chip is grounded through a thirteenth capacitor and a fourteenth capacitor respectively and connected to the power supply terminal of the first internal radio frequency part of the wireless transceiver SOC chip and the feedback terminal of the internal switching power supply of the wireless transceiver SOC chip; The input terminal of the external high-speed crystal oscillator of the wireless transceiver SOC chip is connected to the frequency input terminal of the four-pin passive crystal oscillator, the output terminal of the external high-speed crystal oscillator of the wireless transceiver SOC chip is connected to the frequency output terminal of the four-pin passive crystal oscillator, and the first ground terminal and the second ground terminal of the four-pin passive crystal oscillator are grounded; The upgrade configuration terminal of the wireless transceiver SOC chip is grounded through a sixth resistor, and the reset terminal of the wireless transceiver SOC chip is grounded through a sixteenth capacitor; The output terminals of the internal RF amplifier power supply of the wireless transceiver SOC chip are respectively grounded through a seventeenth capacitor and an eighteenth capacitor, and are connected to one end of a fourth inductor and a fifth inductor. The RF signal output terminal of the wire transceiver SOC chip is connected to one end of the fifth inductor. The other end of the fifth inductor is respectively connected to one end of a nineteenth capacitor and is grounded through a twentieth capacitor. A twenty-first capacitor is connected in parallel across the two ends of the fifth inductor. The other end of the nineteenth capacitor is respectively connected to one end of a twenty-second capacitor through a sixth inductor and is grounded through a twenty-third capacitor. The other end of the twenty-second capacitor is respectively grounded through a seventh inductor and is connected to the negative welding point of the monocrystalline silicon solar panel.

7. A wireless temperature measurement method using a solar panel as an antenna, characterized in that, It includes a power supply and signal transmission module, a control module, a temperature acquisition module, an energy storage module, and a temperature conversion and forwarding module; The output terminal of the temperature acquisition module is connected to the input terminal of the temperature conversion and forwarding module. The output terminal of the temperature conversion and forwarding module is connected to the input terminal of the power supply and signal transmission module. The control module is respectively connected to the power supply and signal transmission module and the energy storage module. The output terminal of the power supply and signal transmission module is respectively connected to the input terminal of the energy storage module and the input terminal of the temperature conversion and forwarding module; The temperature acquisition module outputs an electrical signal to the temperature conversion and forwarding module according to the measured temperature. The temperature conversion and forwarding module is used to convert the electrical signal into a temperature result and forward it to the power supply and signal transmission module; The monocrystalline silicon solar panel of the power supply and signal transmission module acts as a radiation antenna to transmit the temperature result to the receiving device and supplies power to the energy storage module, the control module, and the temperature conversion and forwarding module; The energy storage module is used to supply power to the control module and the temperature conversion and forwarding module; The control module is used to control whether the energy storage module supplies power to the control module and the temperature conversion and forwarding module, and to control whether the power supply and signal transmission module charges the energy storage module.

8. The wireless temperature measurement method using a solar panel as an antenna according to claim 7, characterized in that, The power supply and signal transmission module further includes a transient voltage suppression diode, a first MOS transistor, and a second ideal diode chip; The negative welding point of the monocrystalline silicon solar panel is respectively connected to the temperature conversion and forwarding module and is grounded through a first inductor; The positive welding point of the monocrystalline silicon solar panel is connected to one end of a second inductor. The other end of the second inductor is respectively connected to the positive electrode of the transient voltage suppression diode, one end of a first capacitor, one end of a first resistor, and the input terminal of the second ideal diode chip. The negative electrode of the transient voltage suppression diode and the other end of the first capacitor are grounded. The grounding terminal of the second ideal diode chip is grounded. The output terminal of the second ideal diode chip is respectively connected to the input terminal of the energy storage module and the input terminal of the control module; The other end of the first resistor is connected to the drain of the first MOS transistor. The source of the first MOS transistor is grounded. The gate of the first MOS transistor is respectively grounded through a second resistor and is connected to the output terminal of the control module.

9. The wireless temperature measurement method using a solar panel as an antenna according to claim 8, characterized in that, The energy storage module includes a lithium thionyl chloride battery, a super capacitor, and a first ideal diode chip; The negative electrode of the lithium thionyl chloride battery is grounded, and the positive electrode is connected to the input terminal of the first ideal diode chip. The grounding terminal of the first ideal diode chip is grounded; The negative electrode of the supercapacitor is grounded, and the positive electrode of the supercapacitor is connected to the output terminal of the second ideal diode chip; The output terminal of the first ideal diode chip and the positive electrode of the supercapacitor are connected to the input terminal of the control module.

10. The wireless temperature measurement method using a solar panel as an antenna according to claim 9, characterized in that, The control module includes a first diode, a second MOS transistor, and a logic control chip; The gate of the first MOS transistor is connected to the first output terminal of the logic control chip; The output terminal of the first ideal diode chip, the positive electrode of the supercapacitor, and the output terminal of the second ideal diode chip are respectively grounded through a second capacitor, and are connected to the power input terminal of the logic control chip, one end of a third resistor, and the source electrode of the second MOS transistor. The other end of the third resistor and the gate of the second MOS transistor are connected to the second output terminal of the logic control chip; The drain of the second MOS transistor is respectively connected to the positive electrode of the first diode and outputs power. The negative electrode of the first diode is connected to the third output terminal of the logic control chip; The grounding terminal of the logic control chip is grounded; The input terminal of the logic control chip is connected to the positive electrode of the supercapacitor.

Images