Semiconductor optical detection system

Abstract

The invention relates to the technical field of semiconductor optical detection, and discloses a semiconductor optical detection system which comprises a feeding assembly, a detection assembly and a discharging assembly which are sequentially arranged in the first direction. The detection assembly comprises a detection workbench, the detection workbench is provided with a plurality of conveying assemblies which are sequentially arranged in the second direction, the conveying assemblies extend in the first direction, and detection stations of the conveying assemblies are sequentially distributed in the second direction; the detector assembly comprises a detection Y-axis moving module and a detector, the detection Y-axis moving module extends in the second direction and is arranged above the multiple conveying assemblies, and the detection Y-axis moving module is installed on the detection workbench. The detector is installed on the detection Y-axis moving module in a sliding mode and can move above the detection stations of the multiple conveying assemblies in the second direction. Wherein the first direction is perpendicular to the second direction.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor optical detection, and particularly to a semiconductor optical detection system. Background Art

[0002] With the rapid development of the integrated circuit industry, the demand for chip packaging and detection is increasing. Currently, the existing semiconductor optical detection system detects the chip strips in the cassette. There is only one detection station in the entire detection production line. The next chip strip needs to wait for the previous chip strip to pass through the entire detection production line before it can enter the detection production line. Therefore, when multiple chip strips need to be detected, the detection efficiency of this system is relatively low. Summary of the Invention

[0003] The purpose of the present invention is to provide a semiconductor optical detection system, which can improve the detection efficiency of chip strips.

[0004] To achieve the above purpose, the present invention provides a semiconductor optical detection system, including: a loading component, a detection component, and an unloading component arranged in sequence along a first direction;

[0005] The detection component includes a detection workbench, and a plurality of transfer components are arranged on the detection workbench in sequence along a second direction. The transfer components extend along the first direction, and the transfer components are sequentially provided with a loading station, a code reading station, a detection station, and a material receiving station along the first direction. The transfer components are used to move the chip strips from the loading station to the code reading station, the detection station, and the material receiving station in sequence along the first direction. The detection stations of the plurality of transfer components are distributed in sequence in the second direction;

[0006] A code reading component, a detector component, and a material receiving component are sequentially arranged on the detection workbench along the first direction;

[0007] The code reading component is used to read the codes of the chip strips at the code reading station;

[0008] The detector component includes a detection Y-axis movement module and a detector. The detection Y-axis movement module extends along the second direction and is arranged above the plurality of transfer components. The detection Y-axis movement module is installed on the detection workbench. The detector is slidably installed on the detection Y-axis movement module and can move above the detection stations of the plurality of transfer components along the second direction;

[0009] The material receiving component is used to move the chip strips from the material receiving station to the unloading component;

[0010] The loading component is used to move a plurality of chip strips to the loading stations of the corresponding transfer components respectively;

[0011] Wherein, the first direction and the second direction are perpendicular to each other.

[0012] Preferably, a detection X-axis moving module is installed on the detection Y-axis moving module. The detection X-axis moving module extends along the first direction. One end of the detection X-axis moving module is slidably installed on the detection Y-axis moving module, and the detector is slidably installed on the detection X-axis moving module.

[0013] Preferably, a detection Z-axis moving module is installed on the detection X-axis moving module. The detection Z-axis moving module extends along the third direction and is slidably installed on the detection X-axis moving module, and the detector is slidably installed on the detection Z-axis moving module;

[0014] Wherein, the first direction, the second direction and the third direction are perpendicular to each other.

[0015] Preferably, a plurality of detection stations are arranged in sequence along the first direction between the code reading station and the material receiving station of the conveying assembly, and each detection station is correspondingly provided with a detector assembly;

[0016] The conveying assembly is used to sequentially move the chip strip along the first direction from the loading station to the code reading station, a plurality of detection stations and the material receiving station.

[0017] Preferably, the detectors of the detector assemblies corresponding to each detection station are of the same or different types;

[0018] When the detectors of the detector assemblies corresponding to each detection station are of the same type, the accuracies of a plurality of detectors arranged in sequence along the first direction increase in sequence.

[0019] Preferably, there are two detector assemblies arranged in sequence along the first direction between the code reading assembly and the material receiving assembly on the detection workbench, and there are two detection stations arranged in sequence along the first direction between the code reading station and the material receiving station of the conveying assembly;

[0020] A follower Y-axis moving member is arranged between two detection Y-axis moving modules along the first direction on the detection workbench. The follower Y-axis moving member extends along the second direction and is arranged above a plurality of conveying assemblies, and the follower Y-axis moving member is installed on the detection workbench;

[0021] Two Y-axis moving tracks extending along the second direction are provided on the follower Y-axis moving member. The two Y-axis moving tracks are arranged in sequence along the first direction and are parallel to each other. The two Y-axis moving tracks are respectively arranged on one side of the follower Y-axis moving member close to two detection Y-axis moving modules, and sliding blocks are provided on the Y-axis moving tracks;

[0022] The detection X-axis moving module is installed on the detection Y-axis moving module. The detection X-axis moving module extends along a first direction. Two ends of the detection X-axis moving module are respectively installed on the detection Y-axis moving module and the sliding block of the corresponding Y-axis moving track. The detector is slidably installed on the detection X-axis moving module.

[0023] Preferably, the conveying assembly includes a supporting assembly and a conveying track;

[0024] The supporting assembly extends along the first direction. The feeding station, the code reading station, the detection station and the material receiving station are sequentially arranged on the supporting assembly along the first direction. A plurality of the supporting assemblies are sequentially arranged on the detection workbench along a second direction. The supporting assembly is used for supporting the chip strip;

[0025] The conveying track and the supporting assembly are in one-to-one correspondence and are arranged in parallel. A clamping member that slides along the conveying track is installed on the conveying track. The clamping member is used for clamping the chip strip on the supporting assembly and sequentially moving it from the feeding station to the code reading station, the detection station and the material receiving station along the first direction.

[0026] Preferably, the feeding station, the code reading station, a plurality of detection stations and the material receiving station are sequentially arranged on the supporting assembly along the first direction. A transition station is arranged between two of the detection stations on the supporting assembly along the first direction;

[0027] There are two clamping members. Both of the two clamping members are installed on the conveying track and slide along the conveying track. One of the clamping members is used for clamping the chip strip on the supporting assembly and sequentially moving it from the feeding station to the code reading station, the detection station and the transition station along the first direction. The other clamping member is used for clamping the chip strip on the supporting assembly and sequentially moving it from the transition station to the detection station and the material receiving station along the first direction.

[0028] Preferably, the clamping member includes:

[0029] An upper clamping jaw;

[0030] A linear motor, which is installed on the conveying track and can slide along the conveying track;

[0031] An anti-damage guide rail, which is installed on the top of the linear motor;

[0032] A fixing block, which is installed on the top of the linear motor. The fixing block is located on one side of the anti-damage guide rail in the first direction;

[0033] A sliding block, which is installed on the anti-damage guide rail and can slide along the anti-damage guide rail;

[0034] A lower jaw, the lower jaw is mounted on the sliding block, and the height of the lower jaw is flush with the height of the support assembly;

[0035] A driving member, the driving member is mounted on the sliding block, the driving member is connected to the upper jaw and the lower jaw, and the driving member is used to drive the upper jaw to move in a direction close to or away from the lower jaw;

[0036] A tension and compression sensor, the tension and compression sensor is mounted between the sliding block and the fixed block, both ends of the tension and compression sensor are respectively connected to the sliding block and the fixed block, and the tension and compression sensor is electrically connected to the linear motor.

[0037] Preferably, the support assembly includes a fixed track, an adjustment track, a screw drive motor, a screw and a moving member;

[0038] The fixed track and the adjustment track are used to jointly support the chip strip, the fixed track and the adjustment track both extend along the first track, the fixed track and the adjustment track are arranged in parallel on the detection workbench, the heights of the fixed track and the adjustment track in the third direction are the same, and the adjustment track can move in a direction close to or away from the fixed track along the second direction; the screw is connected to the screw drive motor, and the screw extends along the second direction; a threaded hole is formed in the moving member, the screw passes through the threaded hole, and the moving member is connected to the adjustment track.

[0039] Preferably, the following are further provided on the detection workbench:

[0040] A lifting plate, the lifting plate is located between the fixed track and the adjustment track at the detection station, and the lifting plate is a light-transmitting plate;

[0041] A lifting drive member, the lifting drive member is connected to the lifting plate, and the lifting drive member is used to drive the lifting plate to move back and forth along the third direction from a first position to a second position, the first position is a position flush with the height of the fixed track, and the second position is a position corresponding to below the fixed track;

[0042] A light-emitting member, the light-emitting member is located below the lifting plate.

[0043] Preferably, the reading stations of the plurality of conveying assemblies are sequentially distributed in the second direction;

[0044] The reading assembly includes:

[0045] A reading moving module, the reading moving module extends along the second direction and is arranged above the plurality of conveying assemblies, and the reading moving module is mounted on the detection workbench;

[0046] A barcode reader, which is slidably mounted on a barcode reading moving module and can move above the barcode reading stations of a plurality of conveying components along a second direction.

[0047] Preferably, the receiving stations of the plurality of conveying components are sequentially distributed in the second direction;

[0048] The receiving component includes a receiving support and a plurality of vertical driving members;

[0049] The receiving support extends along the second direction and is mounted on the detection workbench;

[0050] The plurality of vertical driving members are sequentially mounted on the receiving support along the second direction. The plurality of vertical driving members correspond to the plurality of conveying components one by one in a first direction. The vertical driving members extend along a third direction. A horizontal driving member is mounted on the vertical driving members. The vertical driving members are used to drive the horizontal driving members to move along the vertical driving members. A pushing member is mounted on the horizontal driving members. The horizontal driving members are used to drive the pushing members to move along the first direction. The pushing members are used to push the chip strip at the receiving station of the corresponding conveying component into the blanking component.

[0051] Preferably, the loading component includes a loading workbench, and a plurality of chip strip pushing hand modules are sequentially arranged on the loading workbench along the second direction. The plurality of chip strip pushing hand modules correspond to the plurality of conveying components one by one in the first direction. The chip strip pushing hand modules are used to push the chip strip in the first direction to the loading stations of the corresponding conveying components.

[0052] Preferably, a loading platform module and a loading gripper module are sequentially arranged on the loading workbench along the second direction;

[0053] The loading platform module is used to place the cartridge containing the chip strip;

[0054] The loading gripper module includes a loading gripper track and a loading gripper component. The loading gripper track extends along the second direction and is mounted on the loading workbench. The loading gripper track is located between the chip strip pushing hand modules and the conveying components in the first direction. The loading gripper component is slidably mounted on the loading gripper track. The loading gripper component is used to grip the cartridge containing the chip strip and move it to a position corresponding to the plurality of chip strip pushing hand modules in the first direction;

[0055] The loading gripper component includes a loading moving module and a loading gripper. The loading moving module extends along the third direction and is slidably mounted on the loading gripper track. The loading gripper is slidably mounted on the loading moving module;

[0056] Wherein, the first direction, the second direction, and the third direction are perpendicular to each other;

[0057] The chip strip pusher module is used to push the chip strip in the cartridge containing the chip strip to the loading station of the corresponding transfer component in the first direction when the cartridge containing the chip strip moves to the corresponding position in the first direction;

[0058] The chip strip pusher module includes a pusher track and a pusher component;

[0059] The pusher track extends along the first direction and is installed on the loading workbench. The pusher track and the transfer component correspond to each other in the first direction, and the pusher component is slidably installed on the pusher track;

[0060] The loading platform module includes multiple layers of loading platform brackets connected along the third direction. The top of the loading platform bracket is provided with a loading conveyor belt that moves along the second direction.

[0061] Preferably, the unloading component includes an unloading workbench, and an unloading platform module and an unloading gripper module are sequentially arranged on the unloading workbench along the second direction;

[0062] The unloading platform module is used to place empty cartridges;

[0063] The unloading gripper module includes an unloading gripper track and an unloading gripper component. The unloading gripper track extends along the second direction and is installed on the unloading workbench. The unloading gripper track is located on the right side of the transfer component in the first direction. The unloading gripper component is slidably installed on the unloading gripper track, and the unloading gripper component is used to grab the empty cartridge and move it to the position corresponding to the unloading station of multiple transfer components in the first direction;

[0064] The unloading gripper component includes an unloading moving module and an unloading gripper. The unloading moving module extends along the third direction and is slidably installed on the unloading gripper track, and the unloading gripper is slidably installed on the unloading moving module;

[0065] Wherein, the first direction, the second direction, and the third direction are perpendicular to each other;

[0066] The unloading component is used to move the chip strip from the unloading station to the empty cartridge when the empty cartridge moves to the position corresponding to the unloading station in the first direction;

[0067] The unloading platform module includes multiple layers of unloading platform brackets connected along the third direction. The top of the unloading platform bracket is provided with an unloading conveyor belt that moves along the second direction.

[0068] Compared with the prior art, the beneficial effects of the semiconductor optical detection system according to the embodiments of the present invention are as follows:

[0069] Multiple chip strips are respectively moved to the loading stations of the corresponding transfer components through the loading component. The transfer component moves the chip strip from the loading station to the code reading station, and the code reading component reads the code of the chip strip at the code reading station. After the code reading is completed, the transfer component moves the chip strip from the code reading station to the detection station. The detection stations of multiple transfer components are sequentially distributed in the second direction. The entire system has multiple detection stations. The detector of the detector component moves in the second direction along the detection Y-axis moving module. After the detector finishes detecting the chip strip above the detection station of the previous transfer component, it can move along the second direction to the detection station of the next transfer component to detect the chip strip. Compared with the detection system with only one detection station in the prior art, the semiconductor optical detection system of the present application can detect multiple chip strips faster, improving the detection efficiency of the chip strips.

[0070] After the chip strip detection is completed, the transfer component moves the chip strip from the detection station to the unloading station, and the unloading component moves the chip strip from the unloading station to the blanking component until all the chip strips move to the blanking component. Description of the Drawings

[0071] Figure 1 is a schematic structural diagram of the semiconductor optical detection system according to the embodiments of the present invention;

[0072] Figure 2 is a schematic structural diagram of the detection component according to the embodiments of the present invention;

[0073] Figure 3 is a schematic structural diagram of the code reading component, detector component and unloading component according to the embodiments of the present invention;

[0074] Figure 4 is a top view of the code reading component, detector component and unloading component according to the embodiments of the present invention;

[0075] Figure 5 is a schematic structural diagram of the detector component according to the embodiments of the present invention;

[0076] Figure 6 is a top view of the support component according to the embodiments of the present invention;

[0077] Figure 7 is a schematic structural diagram of the support component according to the embodiments of the present invention;

[0078] Figure 8 is a schematic structural diagram of the conveying track and clamping member according to the embodiments of the present invention;

[0079] Figure 9It is a schematic structural diagram of the clamping member according to an embodiment of the present invention;

[0080] Figure 10 It is a schematic structural diagram of the lifting plate and the lifting driving member according to an embodiment of the present invention;

[0081] Figure 11 It is a schematic structural diagram of the light-emitting member according to an embodiment of the present invention;

[0082] Figure 12 It is a schematic structural diagram of the code reading assembly according to an embodiment of the present invention;

[0083] Figure 13 It is a schematic structural diagram of the material receiving assembly according to an embodiment of the present invention;

[0084] Figure 14 It is a schematic structural diagram of the feeding assembly according to an embodiment of the present invention;

[0085] Figure 15 It is a schematic structural diagram of the feeding platform module according to an embodiment of the present invention;

[0086] Figure 16 It is a schematic structural diagram of the feeding gripper module according to an embodiment of the present invention;

[0087] Figure 17 It is a schematic structural diagram of the chip strip pusher module according to an embodiment of the present invention;

[0088] Figure 18 It is a schematic structural diagram of the discharging assembly according to an embodiment of the present invention;

[0089] Figure 19 It is a schematic structural diagram of the discharging platform module according to an embodiment of the present invention;

[0090] Figure 20 It is a schematic structural diagram of the discharging gripper module according to an embodiment of the present invention;

[0091] In the figure, 1 is the detection assembly; 101 is the detection workbench; 2 is the conveying assembly; 201 is the support assembly; 2011 is the fixed track; 2012 is the adjusting track; 2013 is the screw driving motor; 2014 is the screw; 2015 is the moving member; 202 is the conveying track; 203 is the clamping member; 2031 is the upper clamping jaw; 2032 is the lower clamping jaw; 2033 is the driving member; 2034 is the anti-damage guide rail; 2035 is the sliding block; 2036 is the fixed block; 2037 is the tension and compression sensor; 2038 is the linear motor;

[0092] 3. Code reading component; 301. Code reading moving module; 302. Code reader; 4. Detector component; 401. Detection Y-axis moving module; 402. Detector; 403. Detection X-axis moving module; 404. Detection Z-axis moving module; 5. Material receiving component; 501. Material receiving bracket; 502. Vertical driving part; 503. Horizontal driving part; 504. Pushing part; 6. Follow-up Y-axis moving part; 601. Y-axis moving track; 7. Lifting plate; 8. Lifting driving part; 9. Light-emitting part;

[0093] 10. Loading component; 1001. Loading workbench; 11. Chip strip pusher module; 1101. Pusher track; 1102. Pusher component; 11021. Push rod; 12. Loading platform module; 1201. Loading platform bracket; 1202. Loading conveyor belt; 13. Loading gripper module; 1301. Loading gripper track; 1302. Loading gripper component; 13021. Loading moving module; 13022. Loading gripper;

[0094] 14. Unloading component; 141. Unloading workbench; 15. Unloading platform module; 1501. Unloading platform bracket; 1502. Unloading conveyor belt; 16. Unloading gripper module; 1601. Unloading gripper track; 1602. Unloading gripper component; 16021. Unloading moving module; 16022. Unloading gripper. Detailed implementation manners

[0095] The following combines the drawings and embodiments to further describe in detail the specific implementation manners of the present invention. The following embodiments are used to illustrate the present invention, but are not used to limit the scope of the present invention.

[0096] In the description of the present invention, it should be understood that unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific situations.

[0097] In the description of the present invention, it should be understood that the terms "first", "second", and "third" used in the present invention are only for descriptive purposes and cannot be construed as indicating or implying relative importance. Additionally, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", "X-axis direction", "Y-axis direction", "Z-axis direction", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present invention. Moreover, in addition to being able to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to the specific circumstances.

[0098] As Figure 1-5 shown, a semiconductor optical detection system according to an embodiment of the present invention includes: a loading component 10, a detection component 1, and an unloading component 14 sequentially arranged along the first direction X;

[0099] The detection component 1 includes a detection workbench 101. A plurality of conveying components 2 are arranged on the detection workbench 101 sequentially along the second direction Y. The conveying components 2 extend along the first direction X. The conveying components 2 are sequentially provided with a loading station, a code reading station, a detection station, and a material receiving station along the first direction X. The conveying components 2 are used to move the chip strip along the first direction X from the loading station to the code reading station, the detection station, and the material receiving station in sequence. The detection stations of the plurality of conveying components 2 are distributed in sequence in the second direction Y;

[0100] A code reading component 3, a detector component 4, and a material receiving component 5 are sequentially arranged on the detection workbench 101 along the first direction X;

[0101] The code reading component 3 is used to read the code of the chip strip at the code reading station;

[0102] The detector component 4 includes a detection Y-axis movement module 401 and a detector 402. The detection Y-axis movement module 401 extends along the second direction Y and is arranged above the plurality of conveying components 2. The detection Y-axis movement module 401 is installed on the detection workbench 101. The detector 402 is slidably installed on the detection Y-axis movement module 401 and can move above the detection stations of the plurality of conveying components 2 along the second direction Y;

[0103] The material receiving component 5 is used to move the chip strip from the material receiving station to the unloading component 14;

[0104] The loading component 10 is used to move multiple chip strips to the loading stations of the corresponding transfer components 2 respectively;

[0105] Wherein, the first direction X and the second direction Y are perpendicular to each other.

[0106] It should be noted that multiple chip strips are respectively moved to the loading stations of the corresponding transfer components 2 through the loading component 10. The transfer component 2 moves the chip strip from the loading station to the code reading station. The code reading component 3 reads the code of the chip strip at the code reading station. After the code reading is completed, the transfer component 2 moves the chip strip from the code reading station to the detection station. The detection stations of multiple transfer components 2 are distributed in sequence in the second direction Y. The whole system has multiple detection stations. The detector 402 of the detector component 4 moves along the detection Y-axis moving module 401 in the second direction Y. After the detector 402 finishes detecting the chip strip above the detection station of the previous transfer component 2, it can move along the second direction Y to the detection station of the next transfer component 2 to detect the chip strip. Compared with the prior art detection system with only one detection station, the semiconductor optical detection system of the present application can detect multiple chip strips faster and improves the detection efficiency of the chip strips.

[0107] After the chip strip is detected, the transfer component 2 moves the chip strip from the detection station to the receiving station, and the receiving component 5 moves the chip strip from the receiving station to the unloading component 14 until all the chip strips are moved to the unloading component 14.

[0108] The driving mode of the detection Y-axis moving module 401 is not limited herein.

[0109] As Figure 3-5 shown, in a more specific embodiment, a detection X-axis moving module 403 is installed on the detection Y-axis moving module 401. The detection X-axis moving module 403 extends along the first direction X. One end of the detection X-axis moving module 403 is slidably installed on the detection Y-axis moving module 401, and the detector 402 is slidably installed on the detection X-axis moving module 403.

[0110] It should be noted that when the position of the detection station on the transfer component 2 changes, or when the length of the chip strip located at the detection station in the first direction X is too poor, resulting in limited detection vision of the detector 402, one end of the detection X-axis moving module 403 is slidably installed on the detection Y-axis moving module 401, and the detector 402 is slidably installed on the detection X-axis moving module 403. The detector 402 can slide along the first direction X for detection.

[0111] The driving mode of the detection X-axis moving module 403 is not limited herein.

[0112] AsFigure 3-5 As shown, in a more specific embodiment, a detection Z-axis moving module 404 is installed on the detection X-axis moving module 403. The detection Z-axis moving module 404 extends along the third direction Z and is slidably installed on the detection X-axis moving module 403, and the detector 402 is slidably installed on the detection Z-axis moving module 404;

[0113] Wherein, the first direction X, the second direction Y, and the third direction Z are perpendicular to each other.

[0114] It should be noted that the detection Z-axis moving module 404 is arranged to extend along the third direction Z and is slidably installed on the detection X-axis moving module 403, and the detector 402 is slidably installed on the detection Z-axis moving module 404, so that the detector 402 can slide along the third direction Z to adjust the distance between the detector 402 and the chip strip at the detection station, suitable for more usage scenarios.

[0115] The driving mode of the detection Z-axis moving module 404 is not limited herein.

[0116] As Figure 3-5 shown, in a more specific embodiment, a plurality of detection stations are arranged in sequence along the first direction between the code reading station and the material receiving station of the conveying assembly 2, and each detection station is correspondingly provided with a detector assembly 4;

[0117] The conveying assembly 2 is used to move the chip strip along the first direction X from the loading station to the code reading station, a plurality of detection stations, and the material receiving station in sequence.

[0118] It should be noted that by arranging a plurality of detection stations on one conveying assembly 2 and arranging a plurality of detector assemblies 4 corresponding to the detection stations on the detection workbench 101, the chip strip can be detected multiple times.

[0119] As Figure 3-5 shown, in a more specific embodiment, the types of the detectors 402 of the detector assemblies 4 corresponding to each detection station are the same or different;

[0120] When the types of the detectors 402 of the detector assemblies 4 corresponding to each detection station are the same, the accuracies of the plurality of detectors 402 arranged in sequence along the first direction increase in sequence.

[0121] It should be noted that the types of the detectors 402 of the detector assemblies 4 corresponding to each detection station are the same or different. When the types of the detectors 402 of the detector assemblies 4 corresponding to each detection station are different, for example: 2D detectors and 3D detectors, etc., various detections can be performed on the chip strip.

[0122] When the types of the detectors 402 of the detector assemblies 4 corresponding to each detection station are the same, the accuracies of the detectors 402 of the detector assemblies 4 arranged in sequence along the first direction increase in sequence, that is, the accuracy of the detector 402 on the right side in the first direction X is higher than that of the detector 402 on its left side. Thus, after the chip strip is detected by the detector 402 with lower accuracy, it is then detected by the detector 402 with higher accuracy, which can improve the reliability of the detection result.

[0123] As Figure 3-5 shown, in a more specific embodiment, there are two detector assemblies 4 arranged in sequence along the first direction X between the code reading assembly 3 and the material receiving assembly 5 on the detection workbench 101, and there are two detection stations arranged in sequence along the first direction X between the code reading station and the material receiving station of the conveying assembly 2;

[0124] A follower Y-axis moving member 6 is provided between the two detection Y-axis moving modules 401 along the first direction X on the detection workbench 101. The follower Y-axis moving member 6 extends along the second direction Y and is arranged above the plurality of conveying assemblies 2. The follower Y-axis moving member 6 is installed on the detection workbench 101;

[0125] Two Y-axis moving tracks 601 extending along the second direction Y are provided on the follower Y-axis moving member 6. The two Y-axis moving tracks 601 are arranged in sequence along the first direction and are parallel to each other. The two Y-axis moving tracks 601 are respectively arranged on one side of the follower Y-axis moving member 6 close to the two detection Y-axis moving modules 401. Sliding blocks are provided on the Y-axis moving tracks 601;

[0126] A detection X-axis moving module 403 is installed on the detection Y-axis moving module 401. The detection X-axis moving module 403 extends along the first direction. Two ends of the detection X-axis moving module 403 are respectively installed on the detection Y-axis moving module 401 and the sliding blocks on the corresponding Y-axis moving tracks 601. The detector 402 is slidably installed on the detection X-axis moving module 403.

[0127] It should be noted that, in order to ensure the stability of the two detection X-axis moving modules 403, a follower Y-axis moving member 6 is provided between the two detection Y-axis moving modules 401. Two Y-axis moving tracks 601 extending along the second direction Y are provided on the follower Y-axis moving member 6. The two Y-axis moving tracks 601 are arranged in sequence along the first direction and are parallel to each other. The two Y-axis moving tracks 601 are respectively arranged on one side of the follower Y-axis moving member 6 close to the two detection Y-axis moving modules 401. Sliding blocks are provided on the Y-axis moving tracks 601. Two ends of the detection X-axis moving module 403 are respectively installed on the detection Y-axis moving module 401 and the sliding blocks on the corresponding Y-axis moving tracks 601.

[0128] Therefore, when the detection X-axis moving module 403 moves along the detection Y-axis moving module 401, the slider connected to the other end of the detection X-axis moving module 403 can slide along the Y-axis moving track 601, playing a role in stably supporting the detection X-axis moving module 403.

[0129] As Figure 4-8 shown, in a more specific embodiment, the conveying assembly 2 includes a supporting assembly 201 and a conveying track 202;

[0130] The supporting assembly 201 extends along the first direction X. The supporting assembly 201 is sequentially provided with a loading station, a code reading station, a detection station, and a material collecting station along the first direction X. A plurality of supporting assemblies 201 are sequentially arranged on the detection workbench 101 along the second direction Y. The supporting assembly 201 is used to support the chip strip;

[0131] The conveying track 202 and the supporting assembly 201 are arranged in one-to-one correspondence and parallel. A clamping member 203 that slides along the conveying track 202 is installed on the conveying track 202. The clamping member 203 is used to clamp the chip strip on the supporting assembly 201 and move it sequentially from the loading station to the code reading station, the detection station, and the material collecting station along the first direction X.

[0132] It should be noted that the supporting assembly 201 supports the chip strip and does not have a conveying function. The clamping member 203 clamps the chip strip on the supporting assembly 201 along the conveying track 202 and moves it from the loading station to the code reading station, the detection station, and the material collecting station, realizing the conveyance of the chip strip at each process station. The driving method of the clamping member 203 is not limited herein.

[0133] When there are two conveying assemblies 2, the conveying tracks 202 of the two conveying assemblies 2 are arranged symmetrically with the first direction X as the central axis.

[0134] In another more specific embodiment, the conveying assembly 2 is an assembly with a conveying function itself, and moves the chip strip from the loading station to the code reading station, the detection station, and the material collecting station in sequence.

[0135] As Figure 4-8 shown, in a more specific embodiment, the supporting assembly 201 is sequentially provided with a loading station, a code reading station, a plurality of detection stations, and a material collecting station along the first direction. A transition station is arranged between two of the detection stations along the first direction X of the supporting assembly 201;

[0136] There are two clamping members 203, and both of the two clamping members 203 are installed on the conveying track 202 and slide along the conveying track 202. One of the clamping members 203 is used to clamp the chip strip on the support assembly 201 and move it sequentially from the loading station to the code reading station, the detection station, and the transition station along the first direction X. The other clamping member 203 is used to clamp the chip strip on the support assembly 201 and move it sequentially from the transition station to the detection station and the unloading station along the first direction X.

[0137] It should be noted that when there are multiple detection stations on the support assembly 201, the length of the support assembly 201 in the first direction X becomes longer. Therefore, the structures of the two clamping members 203 are the same or different, and in the initial state, the two clamping members 203 are respectively arranged at both ends of the conveying track 202.

[0138] One of the clamping members 203 first clamps the chip strip and moves it sequentially from the loading station to the code reading station and the detection station along the first direction X, and then clamps the chip strip and moves it from the detection station to the transition position. After each time the clamping member 203 clamps the chip strip to a detection station, it has to return to the safe position. After the chip strip is detected by the detector 402, it then clamps the chip strip to the next detection station. After clamping the chip strip to the transition station, it returns to the safe position.

[0139] The other clamping member 203 slides along the conveying track 202 to the position corresponding to the transition position, and then clamps the chip strip and moves it sequentially from the transition position to the subsequent detection stations along the first direction X. After each time the clamping member 203 clamps the chip strip to a detection station, it has to return to the safe position. After the chip strip is detected by the detector 402, it then clamps the chip strip to the next detection station. After clamping the chip strip to the unloading station, it returns to the safe position. The safe position can be the position in the initial state.

[0140] When there are two conveying assemblies 2, the two clamping members 203 on the conveying tracks 202 of the two conveying assemblies 2 are arranged in mirror symmetry with the first direction X as the central axis.

[0141] As Figure 9 shown, in a more specific embodiment, the clamping member 203 includes: an upper clamping jaw 2031, a linear motor 2038, an anti-damage guide rail 2034, a fixed block 2036, a sliding block 2035, a lower clamping jaw 2032, a driving member 2033, and a tensile and compressive force sensor 2037;

[0142] The linear motor 2038 is installed on the conveying track and can slide along the conveying track;

[0143] The anti-damage guide rail 2034 is installed on the top of the linear motor 2038;

[0144] The fixed block 2036 is installed on the top of the linear motor 2038, and the fixed block 2036 is located on one side of the anti-loss guide rail 2034 in the first direction X;

[0145] The sliding block 2035 is installed on the anti-loss guide rail 2034 and can slide along the anti-loss guide rail 2034;

[0146] The lower clamping jaw 2032 is installed on the sliding block 2035, and the height of the lower clamping jaw 2032 is flush with the height of the support assembly;

[0147] The driving member 2033 is installed on the sliding block 2035. The driving member 2033 connects the upper clamping jaw 2031 and the lower clamping jaw 2032, and the driving member 2033 is used to drive the upper clamping jaw 2031 to move in a direction close to or away from the lower clamping jaw 2032;

[0148] The tension and compression sensor 2037 is installed between the sliding block 2035 and the fixed block 2036. Both ends of the tension and compression sensor 2037 are respectively connected to the sliding block 2035 and the fixed block 2036, and the tension and compression sensor 2037 is electrically connected to the linear motor 2038.

[0149] It should be noted that the height of the support assembly is flush with the height of the lower clamping jaw 2032, and the lower clamping jaw 2032 is fixed on the sliding block 2035. When the driving member 2033 drives the upper clamping jaw 2031 to move in a direction close to the lower clamping jaw 2032, the upper clamping jaw 2031 and the lower clamping jaw 2032 can clamp the chip strip on the support assembly. When the driving member 2033 drives the upper clamping jaw 2031 to move in a direction away from the lower clamping jaw 2032, the upper clamping jaw 2031 and the lower clamping jaw 2032 are separated to release the chip strip, and when the clamping member 203 moves, the upper clamping jaw 2031 and the lower clamping jaw 2032 will not touch the chip strip.

[0150] When the linear motor 2038 slides back and forth along the conveying track in the first direction, if the lower clamping jaw 2032 suddenly encounters resistance, the lower clamping jaw 2032 will drive the sliding block 2035 to move on the anti-loss guide rail 2034, thereby changing the distance between the sliding block 2035 and the fixed block 2036. The tension and compression sensor 2037 between the sliding block 2035 and the fixed block 2036 will detect the change in tension and compression. When the tension and compression exceed the preset value, the tension and compression sensor 2037 sends a corresponding signal to the linear motor 2038, and the linear motor 2038 stops sliding on the conveying track, and the tension and compression sensor 2037 sends an alarm signal.

[0151] The driving member 2033 can be a cylinder or a motor, etc.

[0152] The tensile and compressive force sensor 2037 can be replaced by an electromagnet. The electromagnet is fixed on the sliding block 2035. The fixing block 2036 is made of iron. The electromagnet works in cooperation with the photoelectric sensor. When the lower jaw 2032 is subject to resistance, the lower jaw 2032 will drive the sliding block 2035 to move on the anti-damage guide rail 2034, thereby affecting the position of the electromagnet. For example, when the electromagnet adsorbs the fixing plate, it will drive the electromagnet to separate from the fixing plate. When the electromagnetic plate separates from the fixing plate, it will drive the electromagnet to adsorb the fixing plate. The photoelectric sensor detects the movement of the position of the electromagnet, and the photoelectric sensor transmits the corresponding signal to the linear motor 2038, and the linear motor 2038 stops sliding on the conveying track.

[0153] As Figure 4-8 shown, in a more specific embodiment, the support assembly 201 includes a fixed track 2011, an adjustment track 2012, a lead screw drive motor 2013, a lead screw 2014, and a moving member 2015;

[0154] The fixed track 2011 and the adjustment track 2012 are used to jointly support the chip strip. The fixed track 2011 and the adjustment track 2012 both extend along the first track. The fixed track 2011 and the adjustment track 2012 are arranged in parallel on the detection workbench 101. The fixed track 2011 and the adjustment track 2012 have the same height in the third direction Z. The adjustment track 2012 can move along the second direction Y towards or away from the fixed track 2011; the lead screw 2014 is connected to the lead screw drive motor 2013, and the lead screw 2014 extends along the second direction Y; a threaded hole is formed on the moving member 2015, the lead screw 2014 passes through the threaded hole, and the moving member 2015 is connected to the adjustment track 2012.

[0155] It should be noted that the fixed track 2011 and the adjustment track 2012 jointly support the chip strip, and the fixed track 2011 and the adjustment track 2012 have the same height in the third direction Z, so as to ensure that the supported chip strip has good flatness. The adjustment track 2012 can move along the second direction Y towards or away from the fixed track 2011, so that the distance between the fixed track 2011 and the adjustment track 2012 can be adjusted to adapt to chip strips of different widths. Two adjacent fixed tracks 2011 and two adjacent adjustment tracks 2012 can be symmetric about the same horizontal center line.

[0156] The lead screw drive motor 2013 drives the lead screw 2014 to rotate. A threaded hole is provided on the moving member 2015, and the lead screw 2014 passes through the threaded hole. Thus, when the lead screw 2014 rotates, it can drive the moving member 2015 to move along the lead screw 2014. Since the lead screw 2014 extends along the second direction Y, the moving member 2015 can move along the second direction Y. The moving member 2015 is connected to the adjustment track 2012, so that the adjustment track 2012 moves along the second direction Y.

[0157] In other embodiments, other driving methods can be adopted to drive the adjustment track 2012 to move along the second direction Y.

[0158] Such as Figure 4 、 10 -11 shows that in a more specific embodiment, a lifting plate 7, a lifting driving member 8 and a light emitting member 9 are further provided on the detection workbench 101;

[0159] The lifting plate 7 is located between the fixed track 2011 and the adjustment track 2012 at the detection station, and the lifting plate 7 is a light-transmitting plate;

[0160] The lifting driving member 8 is connected to the lifting plate 7. The lifting driving member 8 is used to drive the lifting plate 7 to move back and forth along the third direction Z from the first position to the second position. The first position is a position flush with the height of the fixed track 2011, and the second position is a position corresponding to the lower part of the fixed track 2011;

[0161] The light emitting member 9 is located below the lifting plate 7.

[0162] It should be noted that the lifting plate 7 is arranged on the detection workbench 101 and is located between the fixed track 2011 and the adjustment track 2012 at the detection station. That is, in the second direction Y, the fixed track 2011, the lifting plate 7 and the adjustment track 2012 are arranged in sequence. When the lifting driving member 8 drives the lifting plate 7 to rise, the lifting plate 7 rises to the first position, and the lifting plate 7 is flush with the height of the fixed track 2011. Since the heights of the fixed track 2011 and the adjustment track 2012 are the same, the heights of the lifting plate 7, the fixed track 2011 and the adjustment track 2012 are the same, and the middle part of the chip strip is lifted, improving the flatness during chip strip detection.

[0163] The lifting plate 7 is preferably a vacuum pallet, and the lifting driving member 8 is preferably a lifting module. The driving method of the lifting module is not limited herein.

[0164] The lifting plate 7 is a light-transmitting plate, specifically a transparent acrylic plate. The light-emitting component 9 on the detection workbench 101 is located below the lifting plate 7, so that the light emitted by the light-emitting component 9 can pass through the lifting plate 7 and irradiate the chip strip from the bottom, illuminating the chip strip at the detection station. The detector 402 is a vision detector 402, so the detection accuracy of the detector 402 can be improved.

[0165] The light-emitting component 9 includes a support base, a mounting block, and a light source component. The mounting block is mounted on the detection workbench 101 through the support base, and the light source component is mounted on the top of the mounting block.

[0166] As Figure 3-4 shown in FIGS. 11 and 12, in a more specific embodiment, the code reading stations of the plurality of conveying components 2 are sequentially distributed in the second direction Y;

[0167] The code reading component 3 includes a code reading moving module 301 and a code reader 302;

[0168] The code reading moving module 301 extends along the second direction Y and is arranged above the plurality of conveying components 2. The code reading moving module 301 is mounted on the detection workbench 101;

[0169] The code reader 302 is slidably mounted on the code reading moving module 301 and can move above the code reading stations of the plurality of conveying components 2 along the second direction Y.

[0170] It should be noted that the code reading stations of the plurality of conveying components 2 are sequentially distributed in the second direction Y. Therefore, the code reader 302 moves along the code reading moving module 301 in the second direction Y. After the code reader 302 finishes reading the code of the chip strip above the code reading station of the previous conveying component 2, it can move along the second direction Y to the position above the code reading station of the next conveying component 2 to read the code of the chip strip, realizing continuous code reading of the chip strips on the plurality of conveying components 2 and improving the code reading efficiency of the chip strips. The driving method of the code reading moving module 301 is not limited herein.

[0171] In another more specific embodiment, a code reader 302 adjustment mounting plate extending along the third direction Z is mounted on the code reading moving module 301. A track is provided on the code reader 302 adjustment mounting plate, and the code reader 302 is slidably mounted on the track and can slide along the third direction Z.

[0172] A code reader light source is provided on the code reader 302.

[0173] As Figure 3-4 shown in FIGS. 11 and 13, in a more specific embodiment, the receiving stations of the plurality of conveying components 2 are sequentially distributed in the second direction Y;

[0174] The receiving component 5 includes a receiving support 501 and a plurality of vertical driving members 502;

[0175] The material receiving bracket 501 extends along the second direction Y and is installed on the detection workbench 101;

[0176] A plurality of vertical driving members 502 are sequentially installed on the material receiving bracket 501 along the second direction Y. The plurality of vertical driving members 502 correspond one-to-one with the plurality of conveying assemblies 2 in the first direction X. The vertical driving members 502 extend along the third direction Z. A horizontal driving member 503 is installed on the vertical driving members 502. The vertical driving members 502 are used to drive the horizontal driving members 503 to move along the vertical driving members 502. A pushing member 504 is installed on the horizontal driving members 503. The horizontal driving members 503 are used to drive the pushing member 504 to move along the first direction X. The pushing member 504 is used to push the chip strip at the material receiving station of the corresponding conveying assembly 2 into the blanking assembly 14.

[0177] It should be noted that the material receiving stations of the plurality of conveying assemblies 2 are sequentially distributed in the second direction Y. Therefore, the vertical driving members 502 on the material receiving bracket 501 and the conveying assemblies 2 correspond one-to-one in the first direction X. The vertical driving members 502 drive the horizontal driving members 503 to move along the vertical driving members 502 in the third direction Z. Therefore, when the chip strip is moved to the material receiving station, the vertical driving members 502 drive the horizontal driving members 503 to move downward in the third direction Z until the pushing member 504 is located on the left side of the strip in the first direction X. Then the horizontal driving members 503 drive the pushing member 504 to move to push the chip strip from the material receiving station into the blanking assembly 14, which can push the chip strip into the blanking assembly 14 more horizontally, facilitate the blanking assembly 14 to receive, and avoid damaging the chip strip. After the pushing member 504 finishes pushing, the horizontal driving members 503 drive the pushing member 504 to retract to the left, and the vertical driving members 502 drive the horizontal driving members 503 to move upward in the third direction Z, facilitating another chip strip to move from the detection station to the material receiving station.

[0178] The vertical driving members 502 and the horizontal driving members 503 are driven by air cylinders, and can also be driven by other driving methods.

[0179] The material receiving assembly 5 can also be other assemblies that can realize pushing the chip strip from the material receiving station into the blanking assembly 14.

[0180] Such as Figure 14 As shown, in a more specific embodiment, the loading assembly 10 includes a loading workbench 1001. A plurality of chip strip pushing hand modules 11 are provided on the loading workbench 1001 and are sequentially arranged along the second direction Y. The plurality of chip strip pushing hand modules 11 correspond one-to-one with the plurality of conveying assemblies 2 in the first direction X. The chip strip pushing hand modules 11 are used to push the chip strip in the first direction X to the loading station of the corresponding conveying assembly 2.

[0181] It should be noted that the loading workbench 1001 is provided with a plurality of chip strip pusher modules 11 arranged in sequence along the second direction Y. The plurality of chip strip pusher modules 11 and the plurality of conveying components 2 correspond one by one in the first direction X, so that the chip strip pusher module 11 can horizontally push the chip strip in the first direction X to the loading station of the corresponding conveying component 2, facilitating the conveying component 2 to receive it.

[0182] As Figure 14-17 shown, in a more specific embodiment, the loading workbench 1001 is provided with a loading platform module 12 and a loading gripper module 13 arranged in sequence along the second direction Y;

[0183] The loading platform module 12 is used to place the cartridge containing the chip strip;

[0184] The loading gripper module 13 includes a loading gripper track 1301 and a loading gripper component 1302. The loading gripper track 1301 extends along the second direction Y and is installed on the loading workbench 1001. The loading gripper track 1301 is located between the chip strip pusher module 11 and the conveying component 2 in the first direction X. The loading gripper component 1302 is slidably installed on the loading gripper track 1301. The loading gripper component 1302 is used to grab the cartridge containing the chip strip and move it to a position corresponding to the plurality of chip strip pusher modules 11 in the first direction X;

[0185] The loading gripper component 1302 includes a loading moving module 13021 and a loading gripper 13022. The loading moving module 13021 extends along the third direction Z and is slidably installed on the loading gripper track 1301. The loading gripper 13022 is slidably installed on the loading moving module 13021;

[0186] Wherein, the first direction X, the second direction Y and the third direction Z are perpendicular to each other;

[0187] The chip strip pusher module 11 is used to push the chip strip in the cartridge containing the chip strip to the loading station of the corresponding conveying component 2 in the first direction X when the cartridge containing the chip strip moves to the corresponding position in the first direction X;

[0188] The chip strip pusher module 11 includes a pusher track 1101 and a pusher component 1102;

[0189] The pusher track 1101 extends along the first direction X and is installed on the loading workbench 1001. The pusher track 1101 corresponds to the conveying component 2 in the first direction X. The pusher component 1102 is slidably installed on the pusher track 1101;

[0190] The loading platform module 12 includes multiple layers of loading platform brackets 1201 connected along the third direction Z. The top of the loading platform bracket 1201 is provided with a loading conveyor belt 1202, and the loading conveyor belt 1202 moves along the second direction Y.

[0191] It should be noted that the loading gripper assembly 1302 moves along the loading gripper track 1301 to a position close to the loading platform module 12, grabs the cartridge containing the chip strip, and then the loading gripper assembly 1302 moves along the loading gripper track 1301, so that the cartridge containing the chip strip stops at the positions corresponding to each chip strip pusher module 11 in the first direction X in sequence. Thus, the corresponding chip strip pusher module 11 pushes the corresponding chip strip in the cartridge to the loading station of the corresponding transfer component 2.

[0192] The loading gripper assembly 1302 includes a loading moving module 13021 and a loading gripper 13022. The loading moving module 13021 extends along the third direction Z and is slidably installed on the loading gripper track 1301. The loading gripper 13022 is slidably installed on the loading moving module 13021. Thus, the loading gripper 13022 can move along the loading moving module 13021 in the third direction Z and can also move along the loading gripper track 1301 in the second direction Y following the loading moving module 13021. The change in the height position of the loading gripper 13022 in the third direction Z can change the position of the chip strip pushed by the chip strip pusher module 11.

[0193] The driving methods of the loading gripper module 13, the loading gripper assembly 1302, and the loading gripper 13022 are not limited herein.

[0194] When the length of the cartridge grabbed by the loading gripper assembly 1302 in the first direction X is relatively long, the pusher assembly 1102 can move along the pusher track 1101 in a direction away from the detection component 1 to avoid the cartridge grabbed by the loading gripper assembly 1302. And when the pusher assembly 1102 moves along the pusher track 1101 in a direction close to the detection component 1, it can push the chip strip in the cartridge onto the transfer component 2 of the detection component 1, and can adapt to pushing chip strips of different lengths.

[0195] The driving method of the pusher assembly 1102 is not limited herein.

[0196] The chip strip pusher module 11 includes a push rod 11021 that can move along the first direction X. The push rod 11021 is used to push the chip strip in the first direction X to the loading station of the corresponding transfer component 2. The driving method of the push rod 11021 is not limited herein.

[0197] The loading platform module 12 includes multiple layers of loading platform brackets 1201 connected along the third direction Z. A cartridge containing a chip strip can be placed on one of the loading platform brackets 1201. After the chip strip pushing module has pushed all the chips in the cartridge, the loading gripper 13022 can place the empty cartridge on the loading platform bracket 1201.

[0198] At the top of the loading platform bracket 1201, there is a loading conveyor belt 1202 that moves along the second direction Y. The loading conveyor belt 1202 can be a synchronous belt driven by a motor. Placing the cartridge on the loading conveyor belt 1202 allows it to move along the second direction Y. When the cartridge moves along the second direction Y to be close to the loading gripper assembly 1302, it is convenient for the loading gripper assembly 1302 to grab.

[0199] The driving method of the loading conveyor belt 1202 is not limited herein.

[0200] As Figure 18-20 shown, in a more specific embodiment, the unloading assembly 14 includes an unloading workbench 141. On the unloading workbench 141, there are arranged an unloading platform module 15 and an unloading gripper module 16 in sequence along the second direction Y;

[0201] The unloading platform module 15 is used to place empty cartridges;

[0202] The unloading gripper module 16 includes an unloading gripper track 1601 and an unloading gripper assembly 1602. The unloading gripper track 1601 extends along the second direction Y and is installed on the unloading workbench 141. The unloading gripper track 1601 is located on the right side of the conveying assembly 2 in the first direction X. The unloading gripper assembly 1602 is slidably installed on the unloading gripper track 1601. The unloading gripper assembly 1602 is used to grab an empty cartridge and move it to a position corresponding to the receiving station of the multiple conveying assemblies 2 in the first direction X;

[0203] The unloading gripper assembly 1602 includes an unloading moving module 16021 and an unloading gripper 16022. The unloading moving module 16021 extends along the third direction Z and is slidably installed on the unloading gripper track 1601. The unloading gripper 16022 is slidably installed on the unloading moving module 16021;

[0204] Wherein, the first direction X, the second direction Y, and the third direction Z are perpendicular to each other;

[0205] The receiving assembly 5 is used to move the chip strip from the receiving station to the empty cartridge when the empty cartridge moves to a position corresponding to the receiving station in the first direction X;

[0206] The blanking platform module 15 includes multiple layers of blanking platform brackets 1501 connected along the third direction Z. A blanking conveyor belt 1502 is provided at the top of the blanking platform bracket 1501, and the blanking conveyor belt 1502 moves along the second direction Y.

[0207] It should be noted that the blanking gripper assembly 1602 moves along the blanking gripper track 1601 to approach the blanking platform module 15, grabs an empty material box, and then the blanking gripper assembly 1602 moves along the blanking gripper track 1601 again, so that the empty material box stays at the positions corresponding to the material receiving stations of each conveying component 2 in the first direction X in sequence, so that the material receiving component 5 can push the chip strip on the corresponding material receiving station into the empty material box.

[0208] The blanking gripper assembly 1602 includes a blanking moving module 16021 and a blanking gripper 16022. The blanking moving module 16021 extends along the third direction Z and is slidably installed on the blanking gripper track 1601. The blanking gripper 16022 is slidably installed on the blanking moving module 16021. Therefore, the blanking gripper 16022 can move along the blanking moving module 16021 in the third direction Z and can also move along the blanking gripper track 1601 in the second direction Y following the blanking moving module 16021.

[0209] When the blanking gripper 16022 grabs an empty material box to the position corresponding to the material receiving station of the conveying component 2, the material receiving component 5 pushes the chip strip into the material box. As the chip strips in the material box stack up higher and higher, the blanking gripper 16022 gradually moves downward along the third direction Z, so that the material receiving component 5 can smoothly push the chip strip into the material box.

[0210] The driving methods of the blanking gripper module 16, the blanking gripper assembly 1602, and the blanking gripper 16022 are not limited herein.

[0211] The blanking platform module 15 includes multiple layers of blanking platform brackets 1501 connected along the third direction Z. An empty material box can be placed on one layer of the blanking platform bracket 1501. When the empty material box is full of chip strips, the blanking gripper 16022 can place the full material box on the blanking platform bracket 1501.

[0212] A blanking conveyor belt 1502 is provided at the top of the blanking platform bracket 1501. The blanking conveyor belt 1502 moves along the second direction Y. The blanking conveyor belt 1502 can be a synchronous belt driven by a motor. Placing the material box on the blanking conveyor belt 1502 can move along the second direction Y. When the material box moves along the second direction Y to approach the blanking gripper assembly 1602, it is convenient for the blanking gripper assembly 1602 to grab.

[0213] The driving method of the blanking conveyor belt 1502 is not limited herein.

[0214] The detection method of the above-mentioned semiconductor optical detection system includes the following steps:

[0215] S1. The feeding component 10 moves multiple chip strips in sequence along the second direction Y to the feeding station on the corresponding conveying component 2. After the chip strip moves to the feeding station, the conveying component 2 moves the chip strip from the feeding station to the code reading station, and the code reading component 3 reads the code of the chip strip. After the code reading component 3 finishes reading the code of the chip strip on the previous code reading station, the code reading component 3 then reads the code of the chip strip on the next code reading station;

[0216] S2. After the chip strip is read, the conveying component 2 moves the chip strip from the code reading station to the detection station, and the detector 402 of the detector component 4 detects the chip strip. After the detector 402 finishes detecting the chip strip on the previous detection station, the detector 402 moves along the detection Y-axis moving module 401 in the second direction Y to detect the chip strip on the next detection station;

[0217] S3. After the chip strip is detected, the conveying component 2 moves the chip strip from the detection station to the receiving station, and the receiving component 5 moves the chip strip from the receiving station to the discharging component 14. After the receiving component 5 finishes receiving the chip strip on the previous receiving station, the receiving component 5 then moves the chip strip on the next receiving station to the discharging component 14, and step S1 is repeatedly executed until all chip strips move to the discharging component 14.

[0218] The working process of the present invention is as follows: Multiple chip strips are respectively moved to the feeding stations of the corresponding conveying components 2 through the feeding component 10. The conveying component 2 moves the chip strip from the feeding station to the code reading station, and the code reading component 3 reads the code of the chip strip on the code reading station. After the code reading is completed, the conveying component 2 moves the chip strip from the code reading station to the detection station. The detection stations of multiple conveying components 2 are sequentially distributed in the second direction Y. The whole system has multiple detection stations. The detector 402 of the detector component 4 moves in the second direction Y along the detection Y-axis moving module 401. After the detector 402 finishes detecting the chip strip above the detection station of the previous conveying component 2, it can move along the second direction Y to above the detection station of the next conveying component 2 to detect the chip strip. After the chip strip is detected, the conveying component 2 moves the chip strip from the detection station to the receiving station, and the receiving component 5 moves the chip strip from the receiving station to the discharging component 14 until all chip strips move to the discharging component 14.

[0219] In summary, the embodiment of the present invention provides a semiconductor optical detection system, which can improve the detection efficiency of chip strips.

[0220] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and substitutions can be made, and these improvements and substitutions should also be regarded as the protection scope of the present invention.

Claims

1. A semiconductor optical detection system, characterized in that, Including: A loading component, a detection component, and an unloading component arranged in sequence along a first direction; The detection component includes a detection workbench, on which a plurality of conveying components are arranged in sequence along a second direction. The conveying components extend along the first direction, and the conveying components are sequentially provided with a loading station, a code reading station, a detection station, and a material receiving station along the first direction. The conveying components are used to move the chip strip along the first direction from the loading station to the code reading station, the detection station, and the material receiving station in sequence. The detection stations of the plurality of conveying components are distributed in sequence in the second direction; A code reading component, a detector component, and a material receiving component are sequentially arranged on the detection workbench along the first direction; The code reading component is used to read the code of the chip strip at the code reading station; The detector component includes a detection Y-axis moving module and a detector. The detection Y-axis moving module extends along the second direction and is arranged above the plurality of conveying components. The detection Y-axis moving module is installed on the detection workbench, and the detector is slidably installed on the detection Y-axis moving module and can move above the detection stations of the plurality of conveying components along the second direction; The material receiving component is used to move the chip strip from the material receiving station to the unloading component; The loading component is used to move a plurality of chip strips to the loading stations of the corresponding conveying components respectively; Wherein, the first direction and the second direction are perpendicular to each other.

2. The semiconductor optical detection system according to claim 1, wherein, A detection X-axis moving module is installed on the detection Y-axis moving module. The detection X-axis moving module extends along the first direction. One end of the detection X-axis moving module is slidably installed on the detection Y-axis moving module, and the detector is slidably installed on the detection X-axis moving module.

3. The semiconductor optical detection system according to claim 2, wherein A detection Z-axis moving module is installed on the detection X-axis moving module. The detection Z-axis moving module extends along a third direction and is slidably installed on the detection X-axis moving module, and the detector is slidably installed on the detection Z-axis moving module; Wherein, the first direction, the second direction, and the third direction are perpendicular to each other.

4. The semiconductor optical detection system according to claim 1, characterized in that, A plurality of detection stations are arranged in sequence along the first direction between the code reading station and the material receiving station of the conveying component, and each detection station is correspondingly provided with a detector component; The conveying component is used to move the chip strip along the first direction from the loading station to the code reading station, a plurality of detection stations, and the material receiving station in sequence.

5. The semiconductor optical detection system according to claim 4, wherein The types of the detectors of the detector components corresponding to each detection station are the same or different; When the types of the detectors of the detector components corresponding to each detection station are the same, the accuracies of the plurality of detectors arranged in sequence along the first direction increase in sequence.

6. The semiconductor optical detection system according to claim 4, wherein There are two detector components arranged in sequence along the first direction between the code reading component and the material receiving component on the detection workbench, and there are two detection stations arranged in sequence along the first direction between the code reading station and the material receiving station of the conveying component; A follower Y-axis moving member is provided between two detection Y-axis moving modules along the first direction on the detection workbench. The follower Y-axis moving member extends along the second direction and is arranged above a plurality of conveying components. The follower Y-axis moving member is mounted on the detection workbench; Two Y-axis moving tracks extending along the second direction are provided on the follower Y-axis moving member. The two Y-axis moving tracks are arranged in sequence along the first direction and are parallel to each other. The two Y-axis moving tracks are respectively arranged on one side of the follower Y-axis moving member close to the two detection Y-axis moving modules. A sliding block is provided on the Y-axis moving track; A detection X-axis moving module is mounted on the detection Y-axis moving module. The detection X-axis moving module extends along the first direction. Two ends of the detection X-axis moving module are respectively mounted on the detection Y-axis moving module and the sliding block of the corresponding Y-axis moving track. The detector is slidably mounted on the detection X-axis moving module.

7. The semiconductor optical detection system according to claim 1, wherein The conveying component includes a support component and a conveying track; The support component extends along the first direction. The support component is sequentially provided with the loading station, the code reading station, the detection station and the unloading station along the first direction. A plurality of the support components are sequentially arranged on the detection workbench along the second direction. The support component is used for supporting the chip strip; The conveying track and the support component are in one-to-one correspondence and are arranged in parallel. A clamping member slidable along the conveying track is mounted on the conveying track. The clamping member is used for clamping the chip strip on the support component and moving it sequentially from the loading station to the code reading station, the detection station and the unloading station along the first direction.

8. The semiconductor optical detection system according to claim 7, wherein The support component is sequentially provided with the loading station, the code reading station, a plurality of detection stations and the unloading station along the first direction. A transition station is provided between two of the detection stations along the first direction of the support component; There are two clamping members. Both of the two clamping members are mounted on the conveying track and slide along the conveying track. One of the clamping members is used for clamping the chip strip on the support component and moving it sequentially from the loading station to the code reading station, the detection station and the transition station along the first direction. The other clamping member is used for clamping the chip strip on the support component and moving it sequentially from the transition station to the detection station and the unloading station along the first direction.

9. The semiconductor optical detection system according to claim 7, wherein The clamping member includes: An upper clamping jaw; A linear motor, which is mounted on the conveying track and can slide along the conveying track; An anti-damage guide rail, which is mounted on the top of the linear motor; A fixing block, which is mounted on the top of the linear motor. The fixing block is located on one side of the anti-damage guide rail in the first direction; A sliding block, which is mounted on the anti-damage guide rail and can slide along the anti-damage guide rail; A lower clamping jaw, which is mounted on the sliding block. The height of the lower clamping jaw is flush with the height of the support component; A driving member, which is mounted on the sliding block. The driving member connects the upper clamping jaw and the lower clamping jaw. The driving member is used for driving the upper clamping jaw to move in a direction close to or away from the lower clamping jaw; A tension and compression sensor, which is installed between the sliding block and the fixed block. The two ends of the tension and compression sensor are respectively connected to the sliding block and the fixed block, and the tension and compression sensor is electrically connected to the linear motor.

10. The semiconductor optical detection system according to claim 7, wherein, The support assembly includes a fixed track, an adjustment track, a lead screw drive motor, a lead screw, and a moving member; The fixed track and the adjustment track are used to jointly support the chip strip. The fixed track and the adjustment track both extend along the first track. The fixed track and the adjustment track are arranged in parallel on the detection workbench. The fixed track and the adjustment track have the same height in the third direction. The adjustment track can move in the second direction towards or away from the fixed track; the lead screw is connected to the lead screw drive motor, and the lead screw extends along the second direction; a threaded hole is provided on the moving member, and the lead screw passes through the threaded hole, and the moving member is connected to the adjustment track.

11. The semiconductor optical detection system according to claim 10, wherein The following are also provided on the detection workbench: A lifting plate, which is located between the fixed track and the adjustment track at the detection station. The lifting plate is a light-transmitting plate; A lifting driving member, which is connected to the lifting plate. The lifting driving member is used to drive the lifting plate to move back and forth in the third direction from a first position to a second position. The first position is a position flush with the height of the fixed track, and the second position is a position corresponding to the lower part of the fixed track; A light-emitting member, which is located below the lifting plate.

12. The semiconductor optical detection system according to claim 1, wherein The reading positions of the multiple conveying assemblies are sequentially distributed in the second direction; The reading assembly includes: A reading moving module, which extends along the second direction and is arranged above the multiple conveying assemblies. The reading moving module is installed on the detection workbench; A reader, which is slidably installed on the reading moving module and can move above the reading positions of the multiple conveying assemblies in the second direction.

13. The semiconductor optical detection system according to claim 1, wherein The receiving positions of the multiple conveying assemblies are sequentially distributed in the second direction; The receiving assembly includes a receiving bracket and multiple vertical driving members; The receiving bracket extends along the second direction and is installed on the detection workbench; The multiple vertical driving members are sequentially installed on the receiving bracket in the second direction. The multiple vertical driving members correspond to the multiple conveying assemblies one by one in the first direction. The vertical driving members extend along the third direction. A horizontal driving member is installed on the vertical driving members. The vertical driving members are used to drive the horizontal driving members to move along the vertical driving members. A pushing member is installed on the horizontal driving members. The horizontal driving members are used to drive the pushing members to move in the first direction. The pushing members are used to push the chip strips at the receiving positions of the corresponding conveying assemblies into the discharging assembly.

14. The semiconductor optical detection system according to claim 1, wherein The loading assembly includes a loading workbench, and multiple chip strip pushing modules are sequentially arranged on the loading workbench along the second direction. The multiple chip strip pushing modules correspond to the multiple conveying assemblies one by one in the first direction. The chip strip pushing modules are used to push the chip strips in the first direction to the loading positions of the corresponding conveying assemblies.

15. The semiconductor optical detection system according to claim 14, wherein The feeding workbench is provided with a feeding platform module and a feeding gripper module arranged in sequence along the second direction; The feeding platform module is used for placing a cartridge containing a chip strip; The feeding gripper module includes a feeding gripper track and a feeding gripper assembly. The feeding gripper track extends along the second direction and is installed on the feeding workbench. The feeding gripper track is located between the chip strip pusher module and the conveying assembly in the first direction. The feeding gripper assembly is slidably installed on the feeding gripper track, and the feeding gripper assembly is used for gripping the cartridge containing the chip strip and moving it to a position corresponding to a plurality of chip strip pusher modules in the first direction; The feeding gripper assembly includes a feeding moving module and a feeding gripper. The feeding moving module extends along the third direction and is slidably installed on the feeding gripper track, and the feeding gripper is slidably installed on the feeding moving module; Wherein, the first direction, the second direction and the third direction are perpendicular to each other; The chip strip pusher module is used for pushing the chip strip in the cartridge containing the chip strip to the feeding station of the corresponding conveying assembly in the first direction when the cartridge containing the chip strip moves to the corresponding position in the first direction; The chip strip pusher module includes a pusher track and a pusher assembly; The pusher track extends along the first direction and is installed on the feeding workbench. The pusher track and the conveying assembly correspond to each other in the first direction, and the pusher assembly is slidably installed on the pusher track; The feeding platform module includes multiple layers of feeding platform brackets connected along the third direction. The top of the feeding platform bracket is provided with a feeding conveyor belt, and the feeding conveyor belt moves along the second direction.

16. The semiconductor optical detection system according to claim 1, characterized in that, The discharging assembly includes a discharging workbench, and the discharging workbench is provided with a discharging platform module and a discharging gripper module arranged in sequence along the second direction; The discharging platform module is used for placing empty cartridges; The discharging gripper module includes a discharging gripper track and a discharging gripper assembly. The discharging gripper track extends along the second direction and is installed on the discharging workbench. The discharging gripper track is located on the right side of the conveying assembly in the first direction. The discharging gripper assembly is slidably installed on the discharging gripper track, and the discharging gripper assembly is used for gripping the empty cartridge and moving it to a position corresponding to the receiving stations of a plurality of conveying assemblies in the first direction; The discharging gripper assembly includes a discharging moving module and a discharging gripper. The discharging moving module extends along the third direction and is slidably installed on the discharging gripper track, and the discharging gripper is slidably installed on the discharging moving module; Wherein, the first direction, the second direction and the third direction are perpendicular to each other; The receiving assembly is used for moving the chip strip from the receiving station to the empty cartridge when the empty cartridge moves to the position corresponding to the receiving station in the first direction; The discharging platform module includes multiple layers of discharging platform brackets connected along the third direction. The top of the discharging platform bracket is provided with a discharging conveyor belt, and the discharging conveyor belt moves along the second direction.

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