Temperature control system for ceramic copper-clad plate processing

Abstract

According to the temperature control system for ceramic copper-clad plate processing provided by the invention, the adjustment value of the temperature control device is determined based on the difference between the preset oxidation temperature and the oxidation temperature data of oxygen-free copper in the surface oxidation process of heating equipment, so that the forming quality of an oxygen-free copper oxide layer is ensured; the power adjustment value of the heating element in the laminating process is determined based on the characteristic difference between the resin adhesive melting characteristic and the standard melting characteristic of the resin adhesive in the laminating process, so that sufficient melting can be realized in the laminating process, and based on the relationship between the real-time heating temperature of the ceramic copper-clad plate in the hot press and the preset temperature range, the heating efficiency of the ceramic copper-clad plate is improved. The method comprises the following steps: determining an adjustment value of heating power of a hot press to ensure the final performance of a ceramic copper-clad plate, determining adjustment parameters of an etching temperature control device to ensure the etching precision and quality based on the etching rate of the ceramic copper-clad plate in the etching process, and determining cooling parameters of laser cutting based on heat generated by the ceramic copper-clad plate in the laser cutting process. The cutting quality is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of ceramic copper clad laminate processing, and particularly relates to a temperature control system for ceramic copper clad laminate processing. Background Art

[0002] A ceramic copper clad laminate is a substrate formed by bonding copper materials on the single / double surfaces of a ceramic substrate through a special process, and is mainly used for the packaging and electrical connection of power semiconductor products. Ceramic copper clad laminates are widely used in power semiconductor products, and their importance is second only to chips, being one of the core packaging materials for high-power and high-heat-dissipation products.

[0003] The process of ceramic copper clad laminates is as follows: 1) oxidation of the surface of oxygen-free copper; 2) lamination of resin glue; 3) ceramic substrate; 4) hot pressing and forming; 5) etching; 6) surface treatment and laser cutting;

[0004] In the above process of ceramic copper clad laminates, there are corresponding processing temperature ranges for the surface oxidation of oxygen-free copper, lamination of resin glue, hot pressing and forming, etching, and laser cutting. The control of temperature has a great impact on the quality of the processing technology for each step. Therefore, how to achieve precise temperature control for the processing of ceramic copper clad laminates and ensure the processing quality of ceramic copper clad laminates is particularly important in the processing of ceramic copper clad laminates. Summary of the Invention

[0005] The present invention provides a temperature control system for ceramic copper clad laminate processing to solve the problems raised in the background art.

[0006] A temperature control system for ceramic copper clad laminate processing, preferably including:

[0007] An oxidation control module, configured to determine an adjustment value for the temperature control device based on the difference between a preset oxidation temperature and oxidation temperature data during the surface oxidation process of oxygen-free copper in a heating device;

[0008] A lamination control module, configured to determine a power adjustment value for a heating element during the lamination process based on the characteristic difference between the resin glue melting characteristics of the resin glue during the lamination process and the standard melting characteristics;

[0009] A hot pressing control module, configured to determine an adjustment value for the heating power of a hot press based on the relationship between the real-time heating temperature of a ceramic copper clad laminate in the hot press and a preset temperature range;

[0010] An etching control module, configured to determine an adjustment parameter for an etching temperature control device based on the etching rate of a ceramic copper clad laminate during the etching process;

[0011] A cutting control module, configured to determine a cooling parameter for laser cutting based on the heat generated during the laser cutting of a ceramic copper clad laminate.

[0012] Preferably, the oxidation control module includes:

[0013] A temperature judgment unit, configured to obtain oxidation temperature data in real time, and judge whether the oxidation temperature data is consistent with a preset oxidation temperature. If so, it is determined that no adjustment needs to be made to the temperature control device; otherwise, it is determined that adjustment needs to be made to the temperature control device.

[0014] A temperature control adjustment unit, configured to determine an adjustment value based on the difference between the oxidation temperature data and the preset oxidation temperature when it is determined that adjustment needs to be made to the temperature control device. If the oxidation temperature data is greater than the preset oxidation temperature, it is determined that the direction of the adjustment value is downward adjustment; if the oxidation temperature data is less than the preset oxidation temperature, it is determined that the direction of the adjustment value is upward adjustment.

[0015] Preferably, the lamination control module includes:

[0016] A feature determination unit, configured to collect resin glue images during the lamination process of the resin glue, and extract resin glue melting features based on the resin glue images.

[0017] A feature comparison unit, configured to compare the resin glue melting features with standard melting features to obtain feature differences.

[0018] A temperature determination unit, configured to determine the morphological parameters of the resin glue melting process based on the feature differences, and determine the target temperature required to reach the target morphological parameters in combination with the current temperature based on the morphological parameters.

[0019] A power adjustment unit, configured to determine a power adjustment value for the heating element based on the difference between the current temperature and the target temperature.

[0020] Preferably, the hot pressing control module includes:

[0021] A temperature acquisition unit, configured to obtain the real-time heating temperature of each position of the ceramic copper clad laminate in the hot press based on a temperature sensor.

[0022] A power determination unit, configured to determine a heating power adjustment value for each heating plate of the hot press based on the relationship between the real-time heating temperature of each position and a preset temperature range.

[0023] Preferably, the etching control module includes:

[0024] An etching temperature acquisition unit, configured to obtain the etching rate of the ceramic copper clad laminate during the etching process, and obtain the real-time liquid temperature of the etching solution.

[0025] A relationship determination unit, configured to determine the relevant change relationship between temperature and rate based on the corresponding relationship between the historical real-time liquid temperature and the historical etching rate.

[0026] An etching temperature adjustment unit is used to obtain the liquid temperature corresponding to the target etching rate from the relevant change relationship, and determine the adjustment parameters for the etching temperature control device based on the rate difference between the etching rate and the target etching rate and the temperature difference between the real-time liquid temperature and the liquid temperature.

[0027] Preferably, the cutting control module includes:

[0028] A heat determination unit is used to collect the heat generated during the laser cutting of the ceramic copper clad laminate;

[0029] A cooling determination unit is used to determine the excess heat to be absorbed by the water cooling device based on the generated heat, and determine the cooling parameters for the water cooling device based on the excess heat.

[0030] Preferably, the feature determination unit includes:

[0031] A preprocessing unit is used to preprocess the resin glue image to obtain a standard image, and extract the target image where the resin glue area is located in the standard image;

[0032] A feature extraction unit is used to segment the target image into multiple image blocks, extract the color feature, texture feature and bubble feature of each image block, and obtain the shape feature of the melted resin glue based on all the image blocks;

[0033] A feature integration unit is used to use the color feature, texture feature, bubble feature and shape feature as the melted resin glue feature.

[0034] Preferably, the temperature determination unit includes:

[0035] A difference acquisition unit is used to obtain the color feature difference, texture feature difference, bubble feature difference and shape feature difference from the feature differences;

[0036] A difference analysis unit is used to determine the transparency coefficient based on the color feature difference, determine the melting level based on the texture feature difference, determine the melting uniformity coefficient based on the bubble feature difference, and determine the edge smoothness and volume expansion coefficient based on the shape feature difference;

[0037] A process determination unit is used to calculate the process coefficient at which the resin glue is currently melting based on the transparency coefficient, melting level, melting uniformity coefficient, edge smoothness and volume expansion coefficient;

[0038] A parameter determination unit is used to determine the stage of the melted resin glue based on the process coefficient, and obtain the morphological parameters corresponding to the stage from the database as the morphological parameters of the melted resin glue process;

[0039] A heat determination unit, configured to determine the required heat based on the difference between the morphological parameter and the target morphological parameter, and combine the current temperature to determine the target temperature required to reach the target morphological parameter.

[0040] Preferably, the power determination unit includes:

[0041] A heating temperature determination unit, configured to obtain the difference value between the real-time heating temperature at each position and the preset temperature range, and based on the distribution characteristics of each position, construct a difference array based on the difference value, and preliminarily determine the required heating temperature for each position based on the difference array to obtain a heating temperature array;

[0042] A fluctuation determination unit, configured to determine the heat dissipation capacity coefficient of each position based on the distribution characteristics of each position, and set the heat fluctuation amplitude for each position of the difference array based on the heat dissipation capacity coefficient to obtain a fluctuation amplitude array corresponding to the difference array;

[0043] A prediction unit, configured to determine the required heat for each position in a future period of time based on the heating temperature array, and perform weighted processing on the required heat in the future period of time based on the fluctuation amplitude array to obtain the target predicted heat, and obtain a predicted heat array;

[0044] A power determination unit, configured to determine a power-time set for the heating plate to satisfy the predicted heat array, and based on the heating rate requirements of each position, obtain a candidate power-time set that satisfies the heating rate requirements from the power-time set, and obtain a plurality of heating plate power working parameter arrays based on the power-time set;

[0045] A power selection unit, configured to determine a heat uniformity array caused by the mutual influence between adjacent heating plates under the heating plate power working parameter array based on the position distribution between the heating plates, select the heating plate power working parameter array corresponding to the most uniform heat uniformity array, and determine the heating power adjustment value for each heating plate of the hot press.

[0046] Preferably, the hot pressing control module further includes a preheating unit, which performs preheating treatment on the hot pressing die based on the hot pressing temperature before hot pressing forming.

[0047] Compared with the prior art, the present invention has achieved the following beneficial effects:

[0048] By determining the adjustment value of the temperature control device based on the difference between the preset oxidation temperature and the oxidation temperature data during the surface oxidation process of oxygen-free copper in the heating device, the quality of the formation of the oxygen-free copper oxide layer is ensured, providing a bonding basis for subsequent processes. By determining the power adjustment value of the heating element during the lamination process based on the characteristic difference between the resin glue melting characteristics and the standard melting characteristics of the resin glue during the lamination process, the lamination process can fully melt, flow, and bond well with the ceramic substrate and the oxidized copper foil, while avoiding the deterioration of the resin glue performance caused by excessive temperature. By determining the adjustment value of the heating power of the hot press based on the relationship between the real-time heating temperature of the ceramic copper clad laminate in the hot press and the preset temperature range, precise control of the hot pressing temperature is achieved, ensuring the final performance of the ceramic copper clad laminate. Based on the etching rate of the ceramic copper clad laminate during the etching process, the adjustment parameters of the etching temperature control device are determined to ensure the accuracy and quality of the etching. Based on the heat generated during the laser cutting of the ceramic copper clad laminate, the cooling parameters for the laser cutting are determined to timely remove the heat generated during cutting, prevent local overheating, and ensure the cutting quality.

[0049] Other features and advantages of the present invention will be described in the following specification, and in part will be obvious from the specification, or will be understood by implementing the present invention. The objectives and other advantages of the present invention can be achieved and obtained through the structures specifically pointed out in this application document.

[0050] The technical solutions of the present invention will be further described in detail below through the drawings and embodiments. Description of the Drawings

[0051] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention. In the drawings:

[0052] Figure 1 It is a structural diagram of a temperature control system for processing a ceramic copper clad laminate in an embodiment of the present invention;

[0053] Figure 2 It is a structural diagram of the oxidation control module in an embodiment of the present invention;

[0054] Figure 3 It is a structural diagram of the etching control module in an embodiment of the present invention. Detailed Embodiments

[0055] The following describes the preferred embodiments of the present invention with reference to the drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention and are not used to limit the present invention.

[0056] Embodiment 1:

[0057] An embodiment of the present invention provides a temperature control system for the processing of ceramic copper clad laminates, as Figure 1 shown, including:

[0058] An oxidation control module for determining an adjustment value for the temperature control device based on the difference between a preset oxidation temperature and oxidation temperature data during the surface oxidation process of oxygen-free copper in a heating device;

[0059] A lamination control module for determining a power adjustment value for the heating element during the lamination process based on the characteristic difference between the resin glue melting characteristics and the standard melting characteristics of the resin glue during the lamination process;

[0060] A hot pressing control module for determining an adjustment value for the heating power of the hot press based on the relationship between the real-time heating temperature of the ceramic copper clad laminate in the hot press and a preset temperature range;

[0061] An etching control module for determining an adjustment parameter for the etching temperature control device based on the etching rate of the ceramic copper clad laminate during the etching process;

[0062] A cutting control module for determining a cooling parameter for the laser cutting based on the heat generated during the laser cutting of the ceramic copper clad laminate.

[0063] In this embodiment, the acquisition of the real-time temperature value of each process flow is determined by a temperature sensor.

[0064] In this embodiment, the standard melting characteristics ensure the sufficiency of melting and prevent excessive melting.

[0065] In this embodiment, when the real-time heating temperature fluctuates and exceeds the preset temperature range, it is necessary to adjust the heating power of the hot press.

[0066] In this embodiment, the adjustment parameter of the etching temperature control device can be cooling or heating.

[0067] The beneficial effects of the above design solution are as follows: By determining the adjustment value for the temperature control device based on the difference between the preset oxidation temperature and the oxidation temperature data during the surface oxidation process of oxygen-free copper in the heating device, the quality of the formation of the oxygen-free copper oxide layer is ensured, providing a bonding basis for subsequent processes. By determining the power adjustment value for the heating element during the lamination process based on the difference between the resin glue melting characteristics and the standard melting characteristics of the resin glue during the lamination process, the lamination process can be fully melted, flowed, and well bonded with the ceramic substrate and the oxidized copper foil, while avoiding deterioration of the resin glue performance due to excessive temperature. By determining the adjustment value for the heating power of the hot press based on the relationship between the real-time heating temperature of the ceramic copper clad laminate in the hot press and the preset temperature range, precise control of the hot pressing temperature is achieved, ensuring the final performance of the ceramic copper clad laminate. Based on the etching rate of the ceramic copper clad laminate during the etching process, the adjustment parameters for the etching temperature control device are determined to ensure the accuracy and quality of etching. Based on the heat generated during the laser cutting of the ceramic copper clad laminate, the cooling parameters for the laser cutting are determined to timely remove the heat generated by cutting, prevent local overheating, and ensure the cutting quality.

[0068] Embodiment 2:

[0069] Based on Embodiment 1, an embodiment of the present invention provides a temperature control system for the processing of ceramic copper clad laminates, as Figure 2 shown, the oxidation control module includes:

[0070] A temperature judgment unit, configured to obtain oxidation temperature data in real time and judge whether the oxidation temperature data is consistent with the preset oxidation temperature. If so, it is determined that no adjustment needs to be made to the temperature control device; otherwise, it is determined that adjustment needs to be made to the temperature control device.

[0071] A temperature control adjustment unit, configured to determine the adjustment value based on the difference between the oxidation temperature data and the preset oxidation temperature when it is determined that adjustment needs to be made to the temperature control device. If the oxidation temperature data is greater than the preset oxidation temperature, it is determined that the direction of the adjustment value is downward adjustment; if the oxidation temperature data is less than the preset oxidation temperature, it is determined that the direction of the adjustment value is upward adjustment.

[0072] In this embodiment, the oxidation temperature data of the oxygen-free copper in the heating device is ensured, and a uniform and well-performing oxide layer is formed on the copper surface, providing a good bonding basis for subsequent processes.

[0073] The beneficial effects of the above design solution are as follows: By determining the adjustment value for the temperature control device based on the difference between the preset oxidation temperature and the oxidation temperature data during the surface oxidation process of oxygen-free copper in the heating device, a uniform and well-performing oxide layer is formed on the copper surface, providing a good bonding basis for subsequent processes.

[0074] Embodiment 3:

[0075] Based on Embodiment 1, an embodiment of the present invention provides a temperature control system for the processing of ceramic copper clad laminates. The lamination control module includes:

[0076] A feature determination unit, configured to collect resin glue images during the lamination process of the resin glue, and extract resin glue melting features from the resin glue images;

[0077] A feature comparison unit, configured to compare the resin glue melting features with standard melting features to obtain a feature difference;

[0078] A temperature determination unit, configured to determine the morphological parameters of the resin glue melting process based on the feature difference, and determine the target temperature required to reach the target morphological parameters based on the morphological parameters and the current temperature;

[0079] A power adjustment unit, configured to determine the power adjustment value for the heating element based on the difference between the current temperature and the target temperature.

[0080] In this embodiment, the resin glue melting features and the standard melting features are image features.

[0081] In this embodiment, the morphological parameters include fluidity, uniformity, viscosity characteristics, etc.

[0082] In this embodiment, the power adjustment value of the heating element is determined according to the difference. The larger the difference, the larger the corresponding power adjustment value.

[0083] The beneficial effects of the above design are as follows: By collecting resin glue images during the lamination process of the resin glue and extracting resin glue melting features from the resin glue images, it provides a basis for further analysis of the resin glue melting process. Comparing the resin glue melting features with the standard melting features to obtain a feature difference, determining the morphological parameters of the resin glue melting process based on the feature difference, determining the target temperature required to reach the target morphological parameters based on the morphological parameters and the current temperature, and determining the power adjustment value for the heating element based on the difference between the current temperature and the target temperature, it realizes ensuring the rationality of the temperature during the resin glue melting process by adjusting the power of the heating element in real time, enabling the lamination process to fully melt, flow and be well combined with the ceramic substrate and the oxidized copper foil, while avoiding the deterioration of the resin glue performance caused by too high temperature.

[0084] Embodiment 4:

[0085] Based on Embodiment 1, an embodiment of the present invention provides a temperature control system for the processing of ceramic copper clad laminates. The hot pressing control module includes:

[0086] A temperature acquisition unit, configured to obtain the real-time heating temperature of each position of the ceramic copper clad laminate in the hot press based on a temperature sensor;

[0087] A power determination unit for determining an adjustment value of the heating power of each heating plate of the hot press based on the relationship between the real-time heating temperature at each position and a preset temperature range.

[0088] In this embodiment, each heating plate of the hot press heats each position respectively, and the heating is controlled in zones to ensure the uniformity of heat reception.

[0089] The beneficial effects of the above design solution are as follows: By obtaining the real-time heating temperature at each position of the ceramic copper clad laminate in the hot press based on the temperature sensor, and determining the adjustment value of the heating power of each heating plate of the hot press based on the relationship between the real-time heating temperature at each position and the preset temperature range, the heating is controlled in zones to ensure the uniformity of heat reception, realize the precise control of the hot pressing temperature, and ensure the final performance of the ceramic copper clad laminate.

[0090] Embodiment 5:

[0091] Based on Embodiment 1, an embodiment of the present invention provides a temperature control system for processing a ceramic copper clad laminate, as Figure 3 shown, the etching control module includes:

[0092] An etching temperature acquisition unit for acquiring the etching rate of the ceramic copper clad laminate during the etching process and acquiring the real-time liquid temperature of the etching solution;

[0093] A relationship determination unit for determining the relevant change relationship between temperature and rate based on the corresponding relationship between the historical real-time liquid temperature and the historical etching rate;

[0094] An etching temperature adjustment unit for obtaining the liquid temperature corresponding to the target etching rate from the relevant change relationship, and determining the adjustment parameter for the etching temperature control device based on the rate difference between the etching rate and the target etching rate and the temperature difference between the real-time liquid temperature and the liquid temperature.

[0095] In this embodiment, the greater the rate difference, the greater the single adjustment amplitude of the corresponding adjustment parameter, and the longer the adjustment time of the adjustment parameter corresponding to the temperature difference, ensuring that the liquid temperature is quickly and accurately reached and maintained.

[0096] The beneficial effects of the above design solution are as follows: By determining the adjustment parameter for the etching temperature control device based on the etching rate of the ceramic copper clad laminate during the etching process, the liquid temperature is quickly and accurately reached and maintained, ensuring the accuracy and quality of the etching.

[0097] Embodiment 6:

[0098] Based on Embodiment 1, an embodiment of the present invention provides a temperature control system for processing a ceramic copper clad laminate, and the cutting control module includes:

[0099] A heat determination unit for collecting the heat generated during the laser cutting of a ceramic copper clad laminate;

[0100] A unit for determining the excess heat to be absorbed by the water cooling device based on the generated heat, and determining the cooling parameters for the water cooling device based on the excess heat.

[0101] In this embodiment, the cooling parameters include power and flow rate.

[0102] The beneficial effects of the above-mentioned solution are as follows: By collecting the heat generated during the laser cutting of the ceramic copper clad laminate, determining the excess heat to be absorbed by the water cooling device based on the generated heat, and determining the cooling parameters for the water cooling device based on the excess heat, the heat generated during cutting can be removed in a timely manner, preventing local overheating and ensuring the cutting quality.

[0103] Embodiment 7:

[0104] Based on Embodiment 3, an embodiment of the present invention provides a temperature control system for processing a ceramic copper clad laminate. The feature determination unit includes:

[0105] A preprocessing unit for preprocessing the resin glue image to obtain a standard image and extracting the target image where the resin glue area is located in the standard image;

[0106] A feature extraction unit for segmenting the target image into multiple image blocks, extracting the color features, texture features, and bubble features of each image block, and obtaining the shape features of the melted resin glue based on all the image blocks;

[0107] A feature integration unit for using the color features, texture features, bubble features, and shape features as the melted resin glue features.

[0108] In this embodiment, the methods for preprocessing the resin glue image include image enhancement, image denoising, image normalization, etc.

[0109] The beneficial effects of the above design are as follows: By segmenting the target image into multiple image blocks, extracting the color features, texture features, and bubble features of each image block, and obtaining the shape features of the melted resin glue based on all the image blocks, and using the color features, texture features, bubble features, and shape features as the melted resin glue features, the determination of features is realized from four factors affecting the melting effect, namely color, texture, bubbles, and shape, providing a basis for determining the morphological parameters of the resin glue melting process.

[0110] Embodiment 8:

[0111] Based on Embodiment 7, an embodiment of the present invention provides a temperature control system for processing a ceramic copper clad laminate. The temperature determination unit includes:

[0112] A difference acquisition unit, configured to acquire color feature differences, texture feature differences, bubble feature differences, and shape feature differences from the feature differences;

[0113] A difference analysis unit, configured to determine a transparency coefficient based on the color feature differences, determine a melting level based on the texture feature differences, determine a melting uniformity coefficient based on the bubble feature differences, and determine an edge smoothness and a volume expansion coefficient based on the shape feature differences;

[0114] A process determination unit, configured to calculate a process coefficient at which the resin glue is currently melting based on the transparency coefficient, the melting level, the melting uniformity coefficient, the edge smoothness, and the volume expansion coefficient;

[0115] The calculation formula of the process coefficient K is as follows:

[0116]

[0117] Wherein, H b represents the edge smoothness, H t represents the volume expansion coefficient, C represents the natural constant, with a value of 3, δ represents the transparency coefficient, β represents the melting level, and r represents the melting uniformity coefficient;

[0118] A parameter determination unit, configured to determine the stage of the resin glue melting based on the process coefficient, and acquire the morphological parameters corresponding to the stage from the database as the morphological parameters in the resin glue melting process;

[0119] A heat determination unit, configured to determine the required heat based on the difference between the morphological parameters and the target morphological parameters, and determine the target temperature required to reach the target morphological parameters in combination with the current temperature.

[0120] In this embodiment, the larger the process coefficient, the closer the corresponding process is to the state of complete melting.

[0121] In this embodiment, in the calculation of the process coefficient, the transparency coefficient, the melting level, the melting uniformity coefficient, the edge smoothness, and the volume expansion coefficient are all standardized first, and the values are (0, 1).

[0122] In this embodiment, the higher the melting degree, the higher the transparency; the less the texture, the higher the fusion level, the fewer the bubbles, the larger the melting uniformity coefficient; the higher the melting degree, the larger the edge smoothness and the volume expansion coefficient.

[0123] The beneficial effects of the above design are as follows: By calculating the process coefficient of the resin glue melting from the transparency coefficient, melting level, melting uniformity coefficient, edge smoothness, and volume expansion coefficient, and comprehensively determining the process based on multiple factors, the rationality and accuracy of the process are ensured. Based on the process coefficient, the stage of the resin glue melting is determined, and the morphological parameters corresponding to the stage are obtained from the database as the morphological parameters of the resin glue melting process. Based on the difference between the morphological parameters and the target morphological parameters, the required heat is determined, and combined with the current temperature, the target temperature required to reach the target morphological parameters is determined, realizing the accurate determination of the temperature required during the lamination process, providing a strong basis for temperature adjustment, thereby ensuring the lamination effect and the processing quality of the ceramic copper clad laminate.

[0124] Example 9:

[0125] Based on Example 4, an embodiment of the present invention provides a temperature control system for the processing of ceramic copper clad laminates. The power determination unit includes:

[0126] The heating temperature determination unit is used to obtain the difference value between the real-time heating temperature at each position and the preset temperature range, and based on the distribution characteristics of each position, construct a difference array based on the difference value, and preliminarily determine the required heating temperature for each position based on the difference array to obtain a heating temperature array;

[0127] The fluctuation determination unit is used to determine the heat dissipation capacity coefficient of each position based on the distribution characteristics of each position, and set the heat fluctuation amplitude for each position of the difference array based on the heat dissipation capacity coefficient to obtain a fluctuation amplitude array corresponding to the difference array;

[0128] The prediction unit is used to determine the required heat for each position within a future period of time based on the heating temperature array, and perform weighted processing on the required heat within a future period of time based on the fluctuation amplitude array to obtain the target predicted heat, and obtain a predicted heat array;

[0129] The power determination unit is used to determine the power-time set for the heating plate to meet the predicted heat array, and based on the heating rate requirements of each position, obtain the candidate power-time set that meets the heating rate requirements from the power-time set, and obtain multiple heating plate power working parameter arrays based on the power-time set;

[0130] The power selection unit is used to determine the heat reception uniformity array caused by the mutual influence between adjacent heating plates under the heating plate power working parameter array based on the position distribution between the heating plates, select the heating plate power working parameter array corresponding to the most average heat reception uniformity array, and determine the heating power adjustment value for each heating plate of the hot press.

[0131] In this embodiment, the distribution of the array is consistent with the position distribution.

[0132] In this embodiment, the fluctuation amplitude array is determined according to the heat dissipation capacity at each position. The combustion heat at the edge position is fast, and the heat is concentrated at the center position. The predicted heat array is determined on the premise of eliminating the difference brought by the heat dissipation capacity, ensuring the accuracy of the predicted heat.

[0133] In this embodiment, the power-time set gem combines different powers and different times to meet the requirements of predicted heat.

[0134] In this embodiment, if the parameters of adjacent heating plates differ too much, it will cause uneven heating. Selecting the heating plate power working parameter array corresponding to the most average heat uniformity array eliminates this influence.

[0135] The beneficial effects of the above design scheme are as follows: By constructing a difference array based on the difference value, and preliminarily determining the heating temperature required for each position based on the difference array to obtain a heating temperature array. Based on the heat dissipation capacity coefficient, set the heat fluctuation amplitude for each position of the difference array to obtain a fluctuation amplitude array corresponding to the difference array. The predicted heat array is determined on the premise of eliminating the difference brought by the heat dissipation capacity, ensuring the accuracy of the predicted heat, ensuring that the heat required for the hot pressing process in the future period meets the practical requirements. Determine the power-time set of the heating plate that satisfies the predicted heat array, and based on the heating rate requirements of each position, obtain a candidate power-time set that satisfies the heating rate requirements from the power-time set, so that the candidate power-time set meets the heating rate requirements, ensuring the quality of the hot pressing process. Based on the position distribution between the heating plates, determine the heat uniformity array caused by the mutual influence of adjacent heating plates under the heating plate power working parameter array, select the heating plate power working parameter array corresponding to the most average heat uniformity array, determine the heating power adjustment value for each heating plate of the hot press, eliminate the uneven heating situation, and ensure the heat uniformity through zone control heating, realizing precise control of the hot pressing temperature and ensuring the final performance of the ceramic copper clad laminate.

[0136] Embodiment 10:

[0137] Based on Embodiment 4, the embodiment of the present invention provides a temperature control system for processing a ceramic copper clad laminate. The hot pressing control module further includes a preheating unit, which preheats the hot pressing mold based on the hot pressing temperature before hot pressing forming.

[0138] The beneficial effects of the above design scheme are as follows: By preheating the hot pressing mold based on the hot pressing temperature before hot pressing forming, the temperature uniformity and stability of the entire hot pressing process are ensured.

[0139] Obviously, those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of this application document and its equivalent technologies, the present invention is also intended to include these modifications and variations.

Claims

1. A temperature control system for the processing of ceramic copper clad laminates, characterized in that, Including: An oxidation control module, configured to determine an adjustment value for a temperature control device based on a difference between a preset oxidation temperature and oxidation temperature data during the surface oxidation process of oxygen-free copper in a heating device; A lamination control module, configured to determine a power adjustment value for a heating element during the lamination process based on a characteristic difference between the resin glue melting characteristics and the standard melting characteristics of the resin glue during the lamination process; A hot pressing control module, configured to determine an adjustment value for the heating power of a hot press based on the relationship between the real-time heating temperature of a ceramic copper clad laminate in the hot press and a preset temperature range; An etching control module, configured to determine an adjustment parameter for an etching temperature control device based on the etching rate of a ceramic copper clad laminate during the etching process; A cutting control module, configured to determine a cooling parameter for laser cutting based on the heat generated during the laser cutting of a ceramic copper clad laminate.

2. The temperature control system for processing a ceramic copper clad laminate according to claim 1, wherein, The oxidation control module includes: A temperature judgment unit, configured to obtain oxidation temperature data in real time and judge whether the oxidation temperature data is consistent with the preset oxidation temperature. If so, it is determined that no adjustment needs to be made to the temperature control device; otherwise, it is determined that an adjustment needs to be made to the temperature control device; A temperature control adjustment unit, configured to determine an adjustment value based on the difference between the oxidation temperature data and the preset oxidation temperature when it is determined that an adjustment needs to be made to the temperature control device. If the oxidation temperature data is greater than the preset oxidation temperature, the direction of the adjustment value is determined to be downward adjustment; if the oxidation temperature data is less than the preset oxidation temperature, the direction of the adjustment value is determined to be upward adjustment.

3. The temperature control system for the processing of a ceramic clad copper board according to claim 1, wherein, The lamination control module includes: A characteristic determination unit, configured to collect resin glue images of the resin glue during the lamination process and extract resin glue melting characteristics from the resin glue images; A characteristic comparison unit, configured to compare the resin glue melting characteristics with the standard melting characteristics to obtain a characteristic difference; A temperature determination unit, configured to determine the morphological parameters of the resin glue melting process based on the characteristic difference, and based on the morphological parameters and in combination with the current temperature, determine the target temperature required to reach the target morphological parameters; A power adjustment unit, configured to determine a power adjustment value for the heating element based on the difference between the current temperature and the target temperature.

4. The temperature control system for processing a ceramic clad copper board according to claim 1, characterized in that, The hot pressing control module includes: A temperature acquisition unit, configured to obtain the real-time heating temperature of each position of a ceramic copper clad laminate in a hot press based on a temperature sensor; A power determination unit, configured to determine a heating power adjustment value for each heating plate of the hot press based on the relationship between the real-time heating temperature of each position and the preset temperature range.

5. The temperature control system for processing a ceramic copper clad laminate according to claim 1, wherein, The etching control module includes: An etching temperature acquisition unit, configured to obtain the etching rate of a ceramic copper clad laminate during the etching process and obtain the real-time liquid temperature of the etching solution; A relationship determination unit, configured to determine the relevant change relationship between temperature and rate based on the corresponding relationship between the historical real-time liquid temperature and the historical etching rate; An etching temperature adjustment unit, configured to obtain the liquid temperature corresponding to the target etching rate from the relevant change relationship, and determine an adjustment parameter for the etching temperature control device based on the rate difference between the etching rate and the target etching rate and the temperature difference between the real-time liquid temperature and the liquid temperature.

6. The temperature control system for the processing of a ceramic copper clad laminate according to claim 1, wherein, The cutting control module includes: A heat determination unit, configured to collect the heat generated during the laser cutting of a ceramic copper clad laminate; A cooling determination unit, configured to determine the excess heat to be absorbed by the water cooling device based on the generated heat, and determine the cooling parameters for the water cooling device based on the excess heat.

7. A temperature control system for the processing of a ceramic clad copper board according to claim 3, wherein, The feature determination unit includes: A preprocessing unit, configured to preprocess the resin glue image to obtain a standard image, and extract a target image where the resin glue area is located in the standard image; A feature extraction unit, configured to segment the target image into multiple image blocks, extract the color feature, texture feature, and bubble feature of each image block, and obtain the shape feature of the melted resin glue based on all the image blocks; A feature integration unit, configured to use the color feature, texture feature, bubble feature, and shape feature as the melted resin glue feature.

8. A temperature control system for the processing of ceramic clad copper laminates according to claim 7, characterized in that, The temperature determination unit includes: A difference acquisition unit, configured to acquire the color feature difference, texture feature difference, bubble feature difference, and shape feature difference from the feature differences; A difference analysis unit, configured to determine the transparency coefficient based on the color feature difference, determine the melting level based on the texture feature difference, determine the melting uniformity coefficient based on the bubble feature difference, and determine the edge smoothness and volume expansion coefficient based on the shape feature difference; A process determination unit, configured to calculate the process coefficient at which the resin glue is currently melting based on the transparency coefficient, melting level, melting uniformity coefficient, edge smoothness, and volume expansion coefficient; A parameter determination unit, configured to determine the stage of the melted resin glue based on the process coefficient, and obtain the morphological parameters corresponding to the stage from the database as the morphological parameters of the melted resin glue process; A heat determination unit, configured to determine the required heat based on the difference between the morphological parameters and the target morphological parameters, and combine with the current temperature to determine the target temperature required to reach the target morphological parameters.

9. The temperature control system for the processing of a ceramic clad copper board according to claim 4, wherein, The power determination unit includes: A heating temperature determination unit, configured to obtain the difference value between the real-time heating temperature at each position and the preset temperature range, and based on the distribution characteristics of each position, construct a difference array based on the difference value, and preliminarily determine the required heating temperature for each position based on the difference array to obtain a heating temperature array; A fluctuation determination unit, configured to determine the heat dissipation capacity coefficient of each position based on the distribution characteristics of each position, and set the heat fluctuation amplitude for each position of the difference array based on the heat dissipation capacity coefficient to obtain a fluctuation amplitude array corresponding to the difference array; A prediction unit, configured to determine the required heat for each position in a future period of time based on the heating temperature array, and perform weighted processing on the required heat in the future period of time based on the fluctuation amplitude array to obtain the target predicted heat, and obtain a predicted heat array; A power determination unit, configured to determine the power-time set for the heating plate to meet the predicted heat array, and based on the heating rate requirements of each position, obtain a candidate power-time set that meets the heating rate requirements from the power-time set, and obtain multiple heating plate power working parameter arrays based on the power-time set; A power selection unit is used to determine a heat uniformity array caused by the mutual influence between adjacent heating plates under an array of heating plate power working parameters based on the position distribution between the heating plates, select the array of heating plate power working parameters corresponding to the most average heat uniformity array, and determine the heating power adjustment values for each heating plate of the hot press.

10. A temperature control system for processing ceramic clad copper plates according to claim 4, characterized in that, The hot pressing control module further includes a preheating unit that preheats the hot pressing die process based on the hot pressing temperature before hot pressing forming.

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