Miniature composite I / O computer chip module based on OSM-L standard

Abstract

The invention discloses a miniature composite I / O computer chip module based on an OSM-L standard, and the module comprises an I / O circuit carrier board, the two surfaces of the I / O circuit carrier board are respectively provided with a carrier board first layer and a carrier board second layer which are electrically connected, the carrier board first layer is provided with a highly integrated I / O circuit design, and the carrier board second layer is provided with an OSM-L interface defined by SGeT; the composite I / O interface module is electrically connected and arranged on the first layer of the carrier plate, and the composite I / O interface module is provided with an I / O interface circuit, an I / O processor and / or a chip on a circuit board; the plurality of electric connectors are electrically connected and arranged on the first layer of the carrier plate; one surface of the shell is hollow, so that an accommodating space is formed in the shell, the accommodating space is used for arranging the I / O circuit carrier plate, and a space gap between the interior of the shell and the I / O circuit carrier plate and the composite I / O interface module is coated and filled with a heat-conducting interface material; therefore, the miniature input / output chip module with complete functions can be combined with an All-in-One computer in the future, and the miniature input / output chip module becomes a standard for common application among industries.

Description

Technical Field

[0001] The present invention relates to a composition of a micro composite I / O computer chip, in particular to a chip module integrating I / O circuits and hardware, enabling a micro composite I / O computer chip module based on the OSM-L standard for use in a micro All-in-One computer chip system architecture. Background Art

[0002] The use of computer devices has become a common device for modern people in work or life, including personal computers, industrial computers or other special-purpose computers. The hardware components of a computer can be divided into four major units, namely the central processing unit (CPU), memory, input / output interfaces (I / O ports), and power supply (PSU). The evolution of computers is mainly based on the central processing unit (CPU), which determines the computing power of the computer. All software and input / output interfaces (I / O) need to be designed according to its capabilities for various different applications and devices. Therefore, various computer motherboard manufacturers conduct wiring design, integration of memory and power supply according to the planning of the central processing unit (CPU). Thus, it can also be said that the CPU is the mainstream of computer chips and determines the development of the future information and communication technology industry / ICT (Information and Communication Technology).

[0003] As for the integration of the CPU, memory, and power supply, they are usually matched. That is, the changes among them are the placement and wiring within a limited space and achieving a balance of electromagnetic effects to avoid mutual interference. I / O devices often vary greatly due to differences in customer application fields. Wired devices rely on connectors of different sizes for transmission, while wireless devices rely on chips of different band frequencies to transmit information. Since the I / O device needs to cooperate with the application requirements of customers and the operation of entities such as the CPU, memory, and power supply in the device, when the CPU, memory, and power supply / power supply lines are better integrated in the current computer, the I / O device system also needs to be integrated accordingly, making the application of computer microchips feasible and becoming a common standard among industries. Furthermore, it enables the design of computer systems to greatly reduce their complexity, save a large amount of development time, and increase the stability of computer systems, which is the ideal direction for the design of computer chip systems at present.

[0004] Furthermore, in recent years, system module standards such as SMARC, Qseven, COMe, and PC / 104 have been widely adopted in the field of industrial computers to achieve high integration and flexibility of embedded computing. To further promote the development of this field, the Embedded Technology Standardization Organization (SGeT) launched the Open Standard Module (OSM / Open Standard Module) in 2020. Among them, the OSM-L standard uses a 45*45mm stamp-like size and is applied to the embedded systems of industrial computers. In recent years, due to its performance, cost, and space efficiency, the OSM-L module has become the preferred component for many manufacturers in the fields of the Internet of Things and edge computing. Therefore, how to effectively utilize the OSM-L module architecture, form an overall computer chip integration design with the main components of computer devices, and promote its application in industrial computer systems should be the key research and breakthrough direction for the industry.

[0005] Therefore, in view of the fact that there is no modular I / O device system integrated with the existing computer chip system architecture, the inventor of this case started to develop its solution, hoping to develop a micro composite I / O device that is more computer chip-based, standardized, and optimized its related performance, namely, a micro composite I / O computer chip module based on the OSM-L standard, in order to serve the general public and promote the development of this industry. After much deliberation, this invention was born. Summary of the Invention

[0006] The purpose of the present invention is to provide a micro composite I / O computer chip module based on the OSM-L standard, which can provide a highly integrated circuit design, place various IO interface circuits and related micro connectors in a space the size of a micro computer chip module, making it a complete-function micro computer input / output interface chip module, and constituting the input / output function expansion chip (MIOC) of an All-in-One computer (AIOC). The combination of these two chip modules can form an ultra-micro computer chip system, becoming a common standard for industrial applications, so as to simplify the complexity of future computer application designs and enjoy the advantages of shortening development time and increasing system stability.

[0007] Another purpose of the present invention is to provide a micro composite I / O computer chip module based on the OSM-L standard, which can incorporate a specific interface recognized by the industry and integrate various input / output devices to achieve communication with All-in-One computers (AIOCs) with various functions and achieve excellent transmission and control effects.

[0008] Another object of the present invention is to provide a miniature composite I / O computer chip module based on the OSM-L standard, which can effectively eliminate the heat generated by the highly integrated circuits of various input / output devices through heat conduction and encapsulation heat dissipation design, thereby greatly reducing the temperature.

[0009] Another object of the present invention is to provide a chip module for various input / output devices of a miniature composite I / O based on the OSM-L standard, which can provide an anti-vibration PCB weldable module through the OSM-L standard, and has a streamlined shape with the largest pin area ratio, thereby taking into account the scalability of technology, meeting the integrated requirements of high performance and miniaturization, and being able to be widely applied to fields such as the Internet of Things, edge computing, and artificial intelligence.

[0010] The technical means adopted by the present invention to achieve the above object is that the present invention provides a miniature composite I / O computer chip module based on the OSM-L standard, including: an I / O circuit carrier board, which is a circuit carrier board with a length and width of 45mm * 45mm. The two sides of the I / O circuit carrier board are respectively a first carrier board layer and a second carrier board layer that are electrically connected. The first carrier board layer is provided with a highly circuit-integrated I / O line design, and the second carrier board layer has an OSM-L interface of an open standard module (OSM / Open Standard Module) defined by SGeT; a composite I / O interface module, which is electrically connected and disposed on the first carrier board layer, and the composite I / O interface module is a circuit board provided with I / O interface lines, I / O processors, and / or chips; a plurality of electrical connectors, which are electrically connected and disposed on the first carrier board layer; a chassis, which has an accommodating space for setting and combining the I / O circuit carrier board after the composite I / O interface module and the connector group.

[0011] In this embodiment, the OSM-L interface of the second carrier board layer defines 662 pins / nodes as an interface for external connection.

[0012] In this embodiment, the OSM-L interface uses a symmetric LGA package, and the contact technology uses LGA or BGA.

[0013] In this embodiment, a plurality of connector through-holes are provided on the chassis, and the plurality of connector through-holes are used to arrange relative to the plurality of electrical connectors, and the plurality of electrical connectors are correspondingly exposed at the plurality of connector through-holes.

[0014] In this embodiment, the space gaps between the inside of the chassis and the I / O circuit carrier board and the composite I / O interface module are coated and filled with a thermal interface material, such as thermal paste, heat sink, etc.

[0015] In this embodiment, the I / O circuit carrier board is electrically connected to a micro All-in-One computer chip module. The micro All-in-One computer chip module includes a system circuit carrier board. The system circuit carrier board has a carrier board top layer and a carrier board bottom layer that are electrically connected. The carrier board top layer is provided with integrated circuits with a highly integrated circuit design. The carrier board bottom layer has an OSM-L interface of an open standard module (OSM / Open Standard Module) defined by SGeT. The OSM-L interface of the system circuit carrier board is electrically connected and combined with the OSM-L interface of the I / O circuit carrier board.

[0016] In this embodiment, a system-on-a-chip (SoC), a memory system, and a power supply line module are electrically connected on the carrier board top layer for operating computer functions.

[0017] In this embodiment, the I / O circuit carrier board is electrically connected to a system main board. The system main board has a plurality of OSM-L interfaces for embedded computing. The OSM-L interface of the system main board is electrically connected to the OSM-L interface of the I / O circuit carrier board and the OSM-L interface of the system circuit carrier board.

[0018] In order to have a further understanding and recognition of the technical features and achieved effects of the present invention, the following is presented with the aid of preferred embodiment diagrams and detailed descriptions. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is an exploded schematic diagram of a micro All-in-One computer chip module;

[0020] Figure 2 It is a structural exploded schematic diagram of the present invention;

[0021] Figure 3A It is a combined side view schematic diagram of the present invention;

[0022] Figure 3B It is a combined top view schematic diagram of the present invention;

[0023] Figure 4 It is a schematic diagram of Application Example 1 of the present invention;

[0024] Figure 5 It is a schematic diagram of Application Example 2 of the present invention;

[0025] Figure 6 It is a schematic diagram of the circuit logic block operation of the present invention.

[0026] Explanation of the reference numerals: 1 ~ micro composite I / O computer chip module; 10 ~ I / O circuit carrier; 11 ~ carrier first layer; 12 ~ carrier second layer; 13 ~ OSM-L interface; 20 ~ composite I / O interface module; 30 ~ connector group; 31 ~ electrical connector; 40 ~ housing; 41 ~ storage space; 42 ~ connector port; 51 ~ system main board; 80 ~ micro All-in-One computer chip module; 80A ~ system circuit carrier; 81 ~ carrier top layer; 82 ~ carrier bottom layer; 821 ~ OSM-L interface; 83 ~ processor system chip; 84 ~ memory system; 85 ~ power circuit module; 86 ~ sealing shell cover; 861 ~ storage space. DETAILED DESCRIPTION

[0027] The drawings provided in the present invention are only used as examples for illustration purposes and are not intended to limit the specific implementation of the present invention and the scope of protection. The present invention provides a micro-complex I / O computer chip module (MIOC / Multiple I / O Chip) based on the OSM-L standard, which is mainly used in conjunction with a micro-All-in-One computer chip module (AIOC) to form an ultra-micro computer chip system, making it a standard commonly used by the industry.

[0028] like Figure 1 As shown, the micro All-in-One computer chip module 80 includes: a system circuit carrier 80A, the system circuit carrier 80A has a carrier top layer 81 and a carrier bottom layer 82 electrically connected, the carrier top layer 81 is provided with an integrated circuit with a high degree of circuit integration design, the carrier bottom layer 82 has an OSM-L interface 821 of an open standard module (OSM / OpenStandard Module) defined by SGeT; a processor system chip 83 (SoC / System on a chip) electrically connected to the carrier top layer 81 Chip), memory system 84 and power circuit module 85, for operating computer-related functions; in addition, a sealing shell cover 86, the bottom of which is hollow, so that the sealing shell cover 86 has an accommodating space 861 inside, and the accommodating space 861 is used to set up the system circuit carrier 80A after combining the processor system chip 83, memory system 84 and power circuit module 85, and make the OSM-L interface 821 (carrier bottom layer 82) of the system circuit carrier 80A exposed downward.

[0029] See also Figure 2 , Figure 3A and Figure 3B, to illustrate an embodiment of a Micro Integrated I / O Computer Chip Module (MIOC) based on the OSM-L standard of the present invention (I / O: Input / Output Interface). As can be seen from the drawings, the Micro Integrated I / O Computer Chip Module 1 of the present invention includes an I / O circuit carrier board 10, a Multiple I / O interface module 20, a connector group 30, and a chassis 40; wherein, the I / O circuit carrier board 10 is a circuit carrier board with a length and width of 45mm * 45mm. The two sides of the I / O circuit carrier board 10 are respectively an electrically connected first carrier layer 11 and a second carrier layer 12. The first carrier layer 11 is provided with an I / O integrated circuit design layout with high circuit integration. The second carrier layer 12 of the I / O circuit carrier board 10 has an OSM-L interface 13 of an open standard module (OSM / Open Standard Module) defined by SGeT. The OSM-L interface 13 of the second carrier layer 12 enables applications with embedded computing and defines 662 pins / nodes (pinout) as the interface for external connection; furthermore, the OSM-L interface 13 uses a symmetric LGA (land grid array / planar grid array package) package, and the contact technology can adopt LGA or BGA (ball grid array / ball grid array package). And the OSM-L interface 13 can be completely machined by machine during welding, assembly, and testing, and adopts a pre-tinned LGA package, which can be directly welded without a connector. At the same time, the OSM-L interface 13 is a pre-defined soft and hard interface.

[0030] Thus, the spatial size of the I / O circuit carrier board 10, its I / O integrated circuit, and the OSM-L interface 13 are used to communicate with the input interfaces of system motherboards 51 of various sizes and shapes (see Figure 4 ) to achieve the purpose of I / O transmission and control, and can become a standard for I / O chip modules commonly used in the industry, so as to reduce the complexity of future computer designs and enjoy the advantages of shortening development time and increasing system stability.

[0031] The Multiple I / O interface module 20 is electrically connected and disposed on the first carrier layer 11 of the I / O circuit carrier board 10. The Multiple I / O interface module 20 can be provided with relevant I / O processors, chips, and various I / O interface circuits, etc. (not shown) on a circuit board to cooperate with the operation of the I / O interface function of the aforementioned Micro All-in-One Computer Chip Module 80 (AIOC).

[0032] The connector group 30 is electrically connected and disposed on the first carrier layer 11 of the I / O circuit carrier board 10. The connector group 30 includes various complex electrical connectors 31. The electrical connector 31 can be various micro I / O connectors, such as USB, D-SUB, HDMI, DVI, etc., but is not limited thereto. The composite I / O interface module 20 is correspondingly provided with relevant processors, chips, circuits, etc. required for the respective operations of the connector group 30.

[0033] The housing 40 has an inverted U-shaped cross-section housing design with a cover and four side covers. The other side of the housing 40 is hollow, so that the housing 40 has an accommodation space 41 inside. The accommodation space 41 is used to set and combine the I / O circuit carrier board 10 after the composite I / O interface module 20 and the connector group 30, and expose the OSM-L interface 13 of the I / O circuit carrier board 10 (the second carrier layer 12) downward; a plurality of connector openings 42 are provided on the housing 40. The plurality of connector openings 42 are used to be arranged opposite to the connector group 30, and the connector group 30 is correspondingly exposed at the plurality of connector openings 42 for convenient plugging and use. The space gap between the inside of the housing 40 (accommodation space 41) and the I / O circuit carrier board 10 and the composite I / O interface module 20 can be coated and filled with a thermal interface material (not shown), such as thermal paste, heat sink, etc. The thermal interface material is used for the heat conduction between the I / O circuit carrier board 10, the composite I / O interface module 20 and the housing 40, to balance the heat generated by all the modules, components and circuits of the micro composite I / O computer chip module 1 (MIOC), and is greatly reduced through the conduction design of the thermal interface material and the housing 40.

[0034] Please refer to Figure 4, which is Application Example 1 of the application of the micro composite I / O computer chip module based on the OSM-L standard of the present invention. It discloses a system motherboard 51 including an industrial computer / network computer. The system motherboard 51 has a plurality of OSM-L interfaces for embedded operations. A plurality of micro All-in-One computer chip modules 80 (AIOC) and the micro composite I / O computer chip module 1 (MIOC) are arranged on each of the corresponding OSM-L interfaces of the system motherboard 51. That is, the OSM-L interface 821 of the micro All-in-One computer chip module 80 and the OSM-L interface 13 of the micro composite I / O computer chip module 1 are respectively electrically connected to each of the OSM-L interfaces of the system motherboard 51. In this way, the assembly of the industrial computer / network computer can be completed simply, quickly and efficiently. And the industrial computer / network computer can select different numbers of micro All-in-One computer chip modules 80 (AIOC) and micro composite I / O computer chip modules 1 (MIOC) for assembly according to needs, or facilitate future expansion and improve its overall performance and efficacy. Thus, the micro composite I / O computer chip module 1 (MIOC) of the present invention can be combined with a plurality of micro All-in-One computer chip modules 80 (AIOC), and can be combined in the form of chips (Chip / IC), which is convenient for popularization and application in industrial computers, the Internet of Things, edge computing, artificial intelligence and computing centers for various forms of applications, and becomes a standard for joint development and operation among industries.

[0035] Please refer to Figure 5 , which is Application Example 2 of the application of the micro composite I / O computer chip module based on the OSM-L standard of the present invention. As shown in the figure, the housing 40 of the micro composite I / O computer chip module 1 is in an upward state with openings, and the second layer 12 of the carrier board of the I / O circuit carrier board 10 is upward, so that the OSM-L interface 13 is exposed. Then, the micro All-in-One computer chip module 80 is combined, that is, the OSM-L interface 821 of the system circuit carrier board 80A (the bottom layer 82 of the carrier board) is electrically connected to the OSM-L interface 13, thereby completing the rapid and simple assembly of a micro computer.

[0036] Please refer to Figure 6, is a schematic diagram of the operation of the circuit logic block of the present invention. As shown in the figure, the micro All-in-One computer chip module 80 (AIOC) is connected to the composite I / O interface module 20 (micro composite I / O computer chip module 1) through the OSM-L interface to connect the relevant power supply, control and input / output (I / O) signals; and the composite I / O interface module 20 (micro composite I / O computer chip module 1) can electrically connect the relevant power supply, control and input / output (I / O) signals to the external device through the connector group 30.

[0037] The micro-composite I / O computer chip module based on the OSM-L standard provided by the present invention can provide a highly integrated circuit design through the above-mentioned structure, and can place various IO interface circuits and related micro-connectors in a space of the size of a micro-computer chip module, making it a fully functional micro-computer input / output interface chip module, and forming an input / output function expansion chip (MIOC) of an All-in-One Computer (AIOC), and making the two chip modules can be combined into an ultra-microcomputer chip system, becoming a standard commonly used by the industry, so as to reduce the complexity of future computer application design, and enjoy the advantages of shortening development time and increasing system stability; at the same time, the present invention The invention can also provide an industry-recognized specific interface to integrate various input / output devices, so as to achieve communication with All-in-One Computers (AIOC) with various functions and achieve excellent transmission and control functions; furthermore, the invention can effectively eliminate the problem of heat source generated by the circuits of highly integrated various input / output devices through the design of heat conduction and packaging heat dissipation, thereby greatly reducing the temperature; further, the invention can provide a vibration-resistant PCB solderable module through the OSM-L standard, and has a streamlined appearance with a maximum pin area ratio, thereby taking into account the scalability of the technology, achieving the integration requirements with high performance and miniaturization, and can be promoted and applied to the fields of Internet of Things, edge computing and artificial intelligence.

[0038] Thus, the above description has been used in conjunction with the drawings to fully describe the embodiment of the micro-composite I / O computer chip module based on the OSM-L standard and its technical features and functions. However, it must be emphasized that the above detailed description is a specific description of the feasible embodiment of the present invention, and the embodiment is not intended to limit the scope of the present invention. Any equivalent implementation or modification that does not deviate from the technical spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A micro composite I / O computer chip module based on the OSM-L standard, characterized in that, Comprising: An I / O circuit carrier board, which is a circuit carrier board with a length and width of 45mm * 45mm. The two sides of the I / O circuit carrier board are respectively a carrier board first layer and a carrier board second layer that are electrically connected. The carrier board first layer is provided with an I / O line design with highly integrated circuits, and the carrier board second layer has an OSM-L interface of an open standard module defined by SGeT; A composite I / O interface module, which is electrically connected and arranged on the carrier board first layer. The composite I / O interface module is provided with I / O interface lines, I / O processors and / or chips on a circuit board; A plurality of electrical connectors, which are electrically connected and arranged on the carrier board first layer; A chassis, which has an accommodation space for arranging and combining the I / O circuit carrier board after the composite I / O interface module and the plurality of electrical connectors are arranged.

2. The miniature composite I / O computer chip module based on the OSM-L standard according to claim 1, wherein The OSM-L interface of the carrier board second layer defines 662 pins / nodes as an interface for external connection.

3. The micro composite I / O computer chip module based on the OSM-L standard according to claim 2, characterized in that, The OSM-L interface uses a symmetric LGA package, and the contact technology uses LGA or BGA.

4. The micro composite I / O computer chip module based on the OSM-L standard according to claim 1, wherein A plurality of connector ports are provided on the chassis. The plurality of connector ports are used to be arranged opposite to the plurality of electrical connectors, and the plurality of electrical connectors are correspondingly exposed at the plurality of connector ports.

5. The micro composite I / O computer chip module based on the OSM-L standard according to claim 1, characterized in that, The space gaps between the inside of the chassis and the I / O circuit carrier board and the composite I / O interface module are coated and filled with a thermal interface material.

6. The micro composite I / O computer chip module based on the OSM-L standard according to claim 1, characterized in that The I / O circuit carrier board is electrically connected to a micro All-in-One computer chip module. The micro All-in-One computer chip module includes a system circuit carrier board. The system circuit carrier board has a carrier board top layer and a carrier board bottom layer that are electrically connected. The carrier board top layer is provided with an integrated circuit design with highly integrated circuits, and the carrier board bottom layer has an OSM-L interface of an open standard module defined by SGeT. The OSM-L interface of the system circuit carrier board is electrically connected and combined with the OSM-L interface of the I / O circuit carrier board.

7. The micro composite I / O computer chip module based on the OSM-L standard according to claim 6, characterized in that, A processor system chip, a memory system and a power supply line module that are electrically connected are provided on the carrier board top layer for operating computer functions.

8. The micro composite I / O computer chip module based on the OSM-L standard according to claim 7, characterized in that, The I / O circuit carrier board is electrically connected and arranged on a system main board. The system main board has a plurality of OSM-L interfaces for embedded computing. The OSM-L interface of the system main board is electrically connected to the OSM-L interface of the I / O circuit carrier board and the OSM-L interface of the system circuit carrier board.

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