Spiral inductor integrated in electronic assembly and antenna
By using helical wound wires and an inductor design with optional magnetic cores in the electronic assembly, the problem of large space occupancy of the inductor is solved, and the compactness and performance improvement of the inductor in electronic devices is achieved.
Patent Information
- Application Number
- CN202411548851.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-01-16
- Filing Date
- 2024-11-01
- Publication Date
- 2025-07-18
AI Technical Summary
In existing electronic devices, inductors occupy a large amount of space due to their huge structure, it is difficult to reduce the shape factor on the substrate of the electronic assembly.
A helically wound wire forms an inductor around the side edge through the through holes of the substrate, and optionally a magnetic core to increase the inductance, which can be used as a discrete inductor or antenna.
Effectively reduces the inductor's footprint in electronic assembly while maintaining or improving inductor performance, and is suitable for a variety of electronic assembly configurations.
Smart Images
Figure CN120341013A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to inductors and antennas. Background Art
[0002] Inductors are well-known components used in many electronic devices. An inductor can be used as a discrete inductor or as an antenna of a circuit. Due to the bulky structure of an inductor including a wire wound in multiple turns, an inductor is generally taller and physically larger than most other components on an electronic assembly of an electronic device. The continuously shrinking form factor of today's electronic devices requires an inductor that does not occupy a large amount of space on a substrate of the electronic assembly. Summary of the Invention
[0003] In one embodiment, an electronic assembly includes a substrate, an inductor, and a circuit. The substrate includes a plurality of through-holes each penetrating through the substrate, and the plurality of through-holes of the substrate are disposed along a side edge of the substrate. The inductor includes a wire that is wound in multiple turns in a spiral manner around the side edge through the plurality of through-holes. The inductor is electrically connected to the circuit. A magnetic core can be disposed within the inductor. The inductor can be used as a discrete inductor or as an antenna.
[0004] In another embodiment, an electronic assembly includes a first substrate, a second substrate, and an inductor. The first substrate has a plurality of through-holes penetrating through the first substrate, and the plurality of through-holes of the first substrate are disposed along a side edge of the first substrate. The second substrate has a plurality of through-holes penetrating through the second substrate, and the plurality of through-holes of the second substrate are disposed along a side edge of the second substrate. The inductor includes a wire that is wound in multiple turns in a spiral manner around the side edge of the first substrate and the side edge of the second substrate through the plurality of through-holes of the first substrate and the plurality of through-holes of the second substrate. A magnetic material can be disposed within the inductor. The inductor can be used as a discrete inductor or as an antenna.
[0005] Those of ordinary skill in the art will readily understand these and other features of the present disclosure upon reading the entire content of the present disclosure including the drawings and the claims. Brief Description of the Drawings
[0006] A more complete understanding of the subject matter can be derived by referring to the detailed description and the claims when considered in conjunction with the following figures, in which like reference numerals refer to like elements throughout the figures.
[0007] Figures 1 to 3 Various views showing a spiral inductor according to an embodiment of the present invention.
[0008] Figures 4 to 7Shows various views of an electronic assembly according to an embodiment of the present invention.
[0009] Figure 8 Shows Figures 4 to 7 in the electronic assembly of Figure 1 a graph of the relative relationship between the simulated inductance and frequency of the spiral inductor of
[0010] Figures 9 to 11 Shows various views of an electronic assembly with a magnetic core according to another embodiment of the present invention.
[0011] Figure 12 Shows Figures 9 to 11 in the electronic assembly of Figure 1 a graph of the relative relationship between the simulated inductance and frequency of the spiral inductor of
[0012] Figures 13 to 16 Shows various views of an electronic assembly with stacked substrates according to yet another embodiment of the present invention.
[0013] Figures 17 to 19 Shows various views of an electronic assembly with stacked substrates and a magnetic core according to yet another embodiment of the present invention.
[0014] Figures 20 to 23 Shows various views of an electronic assembly with an electrical insulator layer between stacked substrates according to yet another embodiment of the present invention.
[0015] Figures 24 to 27 Shows various views of an electronic assembly with side-by-side substrates according to yet another embodiment of the present invention.
[0016] Figure 28 Shows Figures 24 to 27 in the electronic assembly of Figure 1 a graph of the relative relationship between the simulated inductance and frequency of the spiral inductor of
[0017] Figures 29 to 32 Shows various views of an electronic assembly with side-by-side substrates and a magnetic core according to yet another embodiment of the present invention.
[0018] Figure 33 Shows Figures 29 to 32 in the electronic assembly of Figure 1 a graph of the relative relationship between the simulated inductance and frequency of the spiral inductor of
[0019] Figure 34 Shows according to an embodiment of the present invention Figure 1 a magnetic field simulation of the spiral inductor of
[0020] Figure 35 Shows according to an embodiment of the present invention having a magnetic coreFigure 1 Side view of a spiral inductor.
[0021] Figure 36 Showing according to an embodiment of the present invention Figure 35 Graph showing the relative relationship between the simulated inductance and frequency of a spiral inductor. Detailed description
[0022] In this disclosure, numerous specific details (such as examples of components, structures, and methods) are provided to provide a thorough understanding of embodiments of the present invention. However, one of ordinary skill in the art will recognize that the present invention may be practiced without one or more of these specific details. In other instances, well-known details are not shown or described to avoid obscuring aspects of the present invention.
[0023] Figure 1 Perspective view of a spiral inductor 100 according to an embodiment of the present invention is shown. The spiral inductor 100 has a spiral structure in which a wire 112 is wound around a core region in a spiral manner for multiple turns, and the core region is air in the example of Figure 1 . The spiral inductor 100 includes a single-piece wire 112 that is continuous from a first end 113 to a second end 114. The ends 113 and 114 are shown as straight extensions to facilitate connecting the wire 112 to a circuit. The spiral inductor 100 may include an electrical conductor coated with an electrical insulating material, such as an enamel-coated copper wire. The diameter (i.e., gauge) of the wire 112 depends on the target inductance and / or current-carrying capacity. The inductance of the spiral inductor 100 can be adjusted by changing the physical dimensions of the spiral inductor 100, changing the number of turns of the wire 112, changing the diameter of the wire 112, adding a magnetic core within the spiral inductor 100, etc., and can be confirmed or determined using simulation software or through testing / measurement.
[0024] Figure 2 and 3 Side view and front view of a spiral inductor 100 according to an embodiment of the present invention are shown respectively. The spiral-wound portion of the spiral inductor 100 has a length L and an inner diameter D. It should be noted that the spiral-wound portion does not necessarily have to form a circle. For example, it may have an oval shape. The ends 113 and 114 of the wire 112 are shown as extending on the same side of an imaginary plane (not shown) on the long axis 115 of the spiral-wound portion. It can be understood that this may not be the case in actual situations. The ends 113 and 114 may extend on the same side or opposite sides of the plane. For example, the ends 113 and 114 may be on the same side or opposite sides of a substrate of an electronic assembly.
[0025] The spiral inductor 100 can be incorporated into an electronic assembly as a discrete inductor or as an antenna. Generally, an electronic assembly includes a plurality of electronic components mounted on a substrate (such as a printed circuit board (PCB)). Except for some exceptions, the electronic components are not shown in the following figures for the sake of clarity of illustration. Also, for the sake of clarity of illustration, only the portion of the substrate having the spiral inductor 100 is shown.
[0026] Figure 4 A perspective view of an electronic assembly 200 according to an embodiment of the present invention is shown. The electronic assembly 200 includes a substrate 210 and a plurality of electronic components including the spiral inductor 100. The substrate 210 includes a PCB having a first outermost surface 211 and an opposing second outermost surface 212. The substrate 210 includes a plurality of vias 213 disposed along a side edge of the substrate 210. Each via 213 completely penetrates the substrate 210, that is, completely penetrates the outermost surfaces 211 and 212. The spiral inductor 100 winds around the side edge by completely penetrating the substrate 210 through the vias 213. In Figure 4 the example, both the first end 113 and the second end 114 of the wire 112 are located above the outermost surface 211. Generally, the first end 113 and the second end 114 can be located above the same outermost surface or above different outermost surfaces of the substrate 210.
[0027] The spiral inductor 100 is arranged such that the side edge is confined within the spiral inductor 100. This causes the spiral inductor 100 to extend beyond the side edge located within the spiral inductor 100. In Figure 4 the example, the side edge of the substrate 210 has an edge cutout 214. The spiral inductor 100 is disposed within the edge cutout 214 to minimize the portion of the spiral inductor 100 that extends beyond the perimeter of the substrate 210, thereby maintaining a relatively small profile.
[0028] Figure 5 A top view of an electronic assembly 200 according to an embodiment of the present invention is shown. Figure 5 The substrate 210 is shown with its outermost surface 211 facing upward in the page. The wire 112 of the spiral inductor 100 spirally passes through the substrate 210 through the vias 213 disposed along the side edge having the edge cutout 214. In Figure 5 the example, the spiral inductor 100 does not extend beyond the perimeter of the substrate 210 (see phantom line 215). In other embodiments, the spiral inductor 100 extends beyond the perimeter.
[0029] Figure 6 A side view of an electronic assembly 200 according to an embodiment of the present invention is shown. Figure 6A schematic representation of a circuit 220 showing a plurality of electronic components (e.g., resistors, capacitors, other inductors, integrated circuit (IC) chips) electrically connected to a spiral inductor 100 is presented. The circuit 220 can be mounted on the outermost surface 211 (as shown), on the outermost surface 212, and can be electrically connected to the second end 114 (as shown), electrically connected to the first end 113, or electrically connected to both ends 113 and 114.
[0030] Figure 7 A front view of an electronic assembly 200 according to an embodiment of the present invention is shown. A substrate 210 is shown, with the first end 113 of the wire 112 of the spiral inductor 100 facing the viewer for reference.
[0031] Figure 8 A graph showing the relative relationship between the simulated inductance and frequency of the spiral inductor 100 in the electronic assembly 200 according to an embodiment of the present invention is presented. The simulation is performed using ANSYS 2023R1 simulation software commercially available from ANSYS, Inc. In Figure 8 the simulation, the wire 112 is a copper wire with a wire diameter of 3 mils; the spiral inductor 100 has a spiral-wound portion with a length of 146 mils (see Figure 2 , length L) and an inner diameter of 20 mils (see Figure 3 , inner diameter D). The substrate 210 is a conventional PCB that does not significantly affect the inductance of the spiral inductor 100. In Figure 8 the example, the vertical axis represents the inductance in nH and the horizontal axis represents the frequency in kHz. For reference, at point m1 in Figure 8 , the spiral inductor 100 has an inductance of approximately 29 nH at approximately 1 kHz in the simulation.
[0032] Figure 9 A perspective view of an electronic assembly 250 according to an embodiment of the present invention is shown. The electronic assembly 250 is substantially the same as the electronic assembly 200 (shown in Figures 4 to 7 ), except that a magnetic core 251 is added and placed inside the spiral inductor 100. That is, in the electronic assembly 200, the spiral inductor 100 has an air core, while in the electronic assembly 250, the spiral inductor 100 has a magnetic core 251. The wire 112 is wound in a spiral around the side edges of the substrate 210 and the magnetic core 251 through vias 213 for multiple turns. The edge cut 214 is deeper in the electronic assembly 250 to accommodate the magnetic core 251. The electronic assemblies 200 and 250 are substantially the same in other respects.
[0033] Figure 10 and 11The top view and side view of the electronic assembly 250 are shown respectively. The magnetic core 251 may include magnetic materials commonly used in inductors, such as iron powder and ferrite. The magnetic core 251 may be disposed within the spiral inductor 100 by attaching the magnetic core to opposite edges of the substrate 210 in the edge notch 214, shape - fitting the magnetic core 251 into the inner diameter of the spiral inductor 100, or by some other means, depending on the implementation - specific details. The magnetic core 251 may have a rectangular box - like shape (as shown), a cylindrical shape, two semi - cylindrical shapes, or other shapes. Changing the shape, size, and / or material of the magnetic core 251 allows adjustment of the inductance of the spiral inductor 100 in the electronic assembly 250.
[0034] In addition to the magnetic core 251, Figures 9 to 11 the numbered components of the electronic assembly 250 in
[0035] Figure 12 A graph showing the relative relationship between the simulated inductance and frequency of the spiral inductor 100 in the electronic assembly 250 according to an embodiment of the present invention is shown. The simulation is performed using ANSYS 2023R1 simulation software. In Figure 12 the simulation, the wire 112 is a copper wire with a wire diameter of 3 mils; the spiral inductor 100 has a spiral - wound portion with a length of 146 mils (see Figure 2 , length L) and an inner diameter of 20 mils (see Figure 3 , inner diameter D); and the magnetic core 251 is a ferrite core. The substrate 210 is a conventional PCB, which does not significantly affect the inductance of the spiral inductor 100. In Figure 12 , the vertical axis represents the inductance in nH and the horizontal axis represents the frequency in kHz. For reference, at the point m1 in Figure 12 , the spiral inductor 100 has an inductance of approximately 415.1 nH at approximately 1 kHz in the simulation. The increase in the inductance of the spiral inductor 100 in the electronic assembly 200 (see Figure 8 ) is attributed to the addition of the magnetic core 251 in the spiral inductor 100.
[0036] Figure 13 A perspective view of an electronic assembly 300 according to an embodiment of the present invention is shown. The electronic assembly 300 includes a substrate 301, a substrate 302, and a plurality of electronic components including the spiral inductor 100. Each of the substrates 301 and 302 may include a PCB on which a plurality of electronic components are mounted.
[0037] In electronic assembly 300, substrates 301 and 302 are in a configuration stacked one above the other. The spiral inductor 100 prevents substrates 301 and 302 from separating, but substrates 301 and 302 are not firmly attached together. The movement of substrates 301 and 302 can be limited by the inner diameter of the spiral inductor 100, the diameter of the through holes 313 of the wire 112 relative to substrates 301 and 302, and the shape and size of substrates 301 and 302.
[0038] In Figure 13 an example, substrates 301 and 302 have the same shape and size. Each of substrates 301 and 302 includes a plurality of through holes 313 that are correspondingly aligned and disposed along the corresponding side edges, where each through hole 313 completely penetrates the corresponding substrate. The spiral inductor 100 winds multiple turns in a spiral manner around the side edges of substrates 301 and 302 by passing completely through substrates 301 and 302 through the corresponding through holes 313. In Figure 13 an example, for illustrative purposes, both the first end 113 and the second end 114 of the wire 112 are located above the outermost surface of substrate 301.
[0039] The spiral inductor 100 is arranged such that the side edges of substrates 301 and 302 are confined within the spiral inductor 100. This causes the spiral inductor 100 to extend beyond the side edges located within the spiral inductor 100. In Figure 13 an example, each of substrates 301 and 302 has an edge notch 314. The spiral inductor 100 is disposed within the edge notch 314 to minimize the portion of the spiral inductor 100 that extends beyond the perimeter of substrates 301 and 302.
[0040] Figure 14 FIG. shows a top view of the electronic assembly 300 according to an embodiment of the present invention. Figure 14 The outermost surface of substrate 301 is shown, but Figure 14 equally applicable to substrate 302. The wire 112 of the spiral inductor 100 spirally passes through substrates 301 and 302 (not shown; below substrate 301) through the through holes 313 along the side edge having the edge notch 314. In Figure 14 an example, the spiral inductor 100 does not extend beyond the perimeter of substrates 301 and 302 (see phantom line 315). In other embodiments, the spiral inductor 100 extends beyond the perimeter.
[0041] Figure 15 FIG. shows a side view of the electronic assembly 300 according to an embodiment of the present invention. Figure 15Shows a schematic representation of a circuit 320 showing a plurality of electronic components (e.g., resistors, capacitors, other inductors, IC chips) electrically connected to a spiral inductor 100. The circuit 320 may be mounted on the outermost surface of a substrate 301 (as shown) or on the outermost surface of a substrate 302 and may be electrically connected to the second end 114 (as shown), electrically connected to the first end 113 or electrically connected to both ends 113 and 114.
[0042] Figure 16 Shows a front view of an electronic assembly 300 according to an embodiment of the present invention. Substrates 301 and 302 are shown, with the first end 113 of the wire 112 of the spiral inductor 100 facing the viewer for reference.
[0043] Figure 17 Shows a perspective view of an electronic assembly 350 according to an embodiment of the present invention. The electronic assembly 350 is substantially the same as the electronic assembly 300 (shown in Figures 13 to 16 ), except that a magnetic core 351 is added and placed within the spiral inductor 100. That is, in the electronic assembly 300, the spiral inductor 100 has an air core, while in the electronic assembly 350, the spiral inductor 100 has a magnetic core 351. The wire 112 is wound in a spiral around the magnetic core 351 and the side edges of the substrates 301 and 302 through through-holes 313. The edge cut 314 is deeper in the electronic assembly 350 to accommodate the magnetic core 351. The electronic assemblies 300 and 350 are substantially the same in other respects.
[0044] Figure 18 and 19 Show a side view and a front view, respectively, of an electronic assembly 350 according to an embodiment of the present invention. The magnetic core 351 may include magnetic materials commonly used in inductors, such as iron powder and ferrite. The magnetic core 351 may be placed within the spiral inductor 100 by fitting the magnetic core 351 into the inner diameter of the spiral inductor 100 or by some other means, depending on the specific details of the implementation. The magnetic core 351 may have a rectangular box shape (as shown), a cylindrical shape, two semi-cylindrical shapes, or other shapes. Changing the shape, size, and / or material of the magnetic core 351 will allow adjustment of the inductance of the spiral inductor 100 in the electronic assembly 350.
[0045] Except for the magnetic core 351, Figures 17 to 19 the numbered components of the electronic assembly 350 in
[0046] Figure 20Shows a perspective view of an electronic assembly 400 according to an embodiment of the present invention. Except for adding an electrical insulator layer 401 between substrates 301 and 302, the electronic assembly 400 is substantially the same as the electronic assembly 350 (shown in Figures 17 to 19 ). Substrates 301 and 302 are firmly attached to the insulator layer 401. The insulator layer 401 includes a plurality of through-holes 313 aligned with the through-holes 313 of substrates 301 and 302. The wire 112 is wound around the magnetic core 351 and the side edges of substrates 301, insulator layer 401, and substrate 302 in a spiral manner through the through-holes 313 for multiple turns. The electronic assemblies 400 and 350 are substantially the same in other aspects.
[0047] The substrate of the electronic assembly 400 is suitable for applications where it is not desired for substrates 301 and 302 to contact or swing in place.
[0048] In an embodiment where substrates 301 and 302 are PCBs, the insulator layer 401 may include an electrical insulating material commonly used with PCBs and can be firmly attached to substrates 301 and 302 using processes common in the PCB industry. For illustrative purposes, a circuit 420 including a plurality of electronic components including electronic component 421 (e.g., an IC chip), 422 (e.g., a resistor), and 423 (e.g., a capacitor) is shown mounted on the outermost surface of substrate 301.
[0049] In Figure 20 example, substrates 301, substrate 302, and insulator layer 401 have the same shape and size. Each of substrates 301, substrate 302, and insulator layer 401 includes a plurality of through-holes 313 that are correspondingly aligned. The spiral inductor 100 is wound around the side edges of substrate 301, insulator layer 401, and substrate 302 in a spiral manner through the corresponding through-holes 313 and completely penetrates substrates 301, insulator layer 401, and substrate 302 for multiple turns. In Figure 20 example, for illustrative purposes, both the first end 113 and the second end 114 of the wire 112 are located above the outermost surface of substrate 301.
[0050] The spiral inductor 100 is arranged such that the side edges of substrate 301, insulator layer 401, and substrate 302 are confined within the spiral inductor 100. This causes the spiral inductor 100 to extend beyond the side edges located within the spiral inductor 100. In Figure 20 example, each of substrates 301, insulator layer 401, and substrate 302 has an edge cut 314. The spiral inductor 100 is arranged within the edge cut 314 to minimize the portion of the spiral inductor 100 that extends beyond the perimeter of substrates 301, insulator layer 401, and substrate 302.
[0051] Figure 21 Shows a top view of an electronic assembly 400 according to an embodiment of the present invention. Figure 21 Shows the outermost surface of the substrate 301, but Figure 21 equally applicable to the substrate 302. The wire 112 of the spiral inductor 100 spirally passes through the substrate 301, the insulator layer 401 (not shown), and the substrate 302 (not shown) through the through hole 313 along the side edge having the edge cut 314. In Figure 21 the example, the spiral inductor 100 does not extend beyond the perimeter of the substrate 301, the insulator layer 401, and the substrate 302 (see the imaginary line 316). In other embodiments, the spiral inductor 100 extends beyond the perimeter.
[0052] Figure 22 and 23 show a side view and a front view of the electronic assembly 400 according to an embodiment of the present invention, respectively. Except for the insulator layer 401, Figures 20 to 23 the numbered components of the electronic assembly 400 in
[0053] Figure 24 are described with the same reference numerals as in the previous figures.
[0054]
[0055] Figure 24 In Figure 24 the example, the substrates 451 and 452 have the same shape and size. Each of the substrates 451 and 452 includes a plurality of through holes 453, where each through hole 453 completely penetrates the corresponding substrate. The spiral inductor 100 spirally winds multiple turns around the side edges of the substrates 451 and 452 by completely passing through the substrates 451 and 452 through the corresponding through holes 453. In Figure 24 the example, for illustrative purposes, the first end 113 of the wire 112 is located above the outermost surface of the substrate 452.
[0056] The spiral inductor 100 is arranged such that the side edges of the substrates 451 and 452 are confined within the spiral inductor 100. In Figure 24 an example, each of the substrates 451 and 452 has an edge cut that together forms a channel 454 within the spiral inductor 100. The spiral inductor 100 has an air core in the electronic assembly 450, where the channel 454 is hollow. As will become more apparent hereinafter, a magnetic core can be disposed within the channel 454 to increase the inductance of the spiral inductor 100.
[0057] Figure 25 A top view of the electronic assembly 450 according to an embodiment of the present invention is shown. Figure 25 Another view of the channel 454 within the spiral inductor 100 is provided. The wire 112 of the spiral inductor 100 spirally passes through the substrates 451 and 452 through through-holes 453 along the side edges having edge cuts.
[0058] Figure 26 A side view of the electronic assembly 450 according to an embodiment of the present invention is shown. Figure 26 A schematic representation of a circuit 470 including a plurality of electronic components (e.g., resistors, capacitors, other inductors, IC chips) electrically connected to the spiral inductor 100 is shown. The circuit 470 can be mounted on the outermost surface of the substrate 451 or the substrate 452 and can be electrically connected to the first end 113 of the wire 112 (as shown), electrically connected to the second end 114, or electrically connected to both the first end 113 and the second end 114. The first end 113 and the second end 114 can be on opposite sides of the plane formed by the substrates 451 and 452 (as shown) or on the same side of the plane.
[0059] Figure 27 A front view of the electronic assembly 450 according to an embodiment of the present invention is shown. The substrates 451 and 452 are shown, with the second end 114 of the wire 112 of the spiral inductor 100 facing the viewer for reference.
[0060] Figure 28 A graph showing the relative relationship between the simulated inductance and frequency of the spiral inductor 100 in the electronic assembly 450 according to an embodiment of the present invention is shown. The simulation is performed using ANSYS 2023R1 simulation software. In Figure 28 the simulation, the wire 112 is a copper wire with a wire diameter of 3 mils; the spiral inductor 100 has a spiral winding portion with a length of 146 mils (see Figure 2 , length L) and an inner diameter of 20 mils (see Figure 3 , inner diameter D). Each of the substrates 451 and 452 is a conventional PCB, which does not significantly affect the inductance of the spiral inductor 100. InFigure 28 In the example of, the vertical axis represents inductance in nH and the horizontal axis represents frequency in gHz. For reference, at point m1 in Figure 28 , the spiral inductor 100 has an inductance of approximately 29.2 nH at approximately 1 kHz in the simulation.
[0061] Figure 29 Shows a perspective view of an electronic assembly 500 according to an embodiment of the present invention. The electronic assembly 500 is substantially the same as the electronic assembly 450 (shown in Figures 24 to 27 ), except that a magnetic core 501 is added and placed inside the spiral inductor 100. That is, in the electronic assembly 450, the spiral inductor 100 has an air core, while in the electronic assembly 500, the spiral inductor 100 has a magnetic core 501. The magnetic core 501 is placed in a channel 454 formed by edge cuts on the side edges of the substrates 451 and 452. The wire 112 is wound around the magnetic core 501 and the side edges of the substrates 451 and 452 in a spiral manner through corresponding through holes 453 for multiple turns. The electronic assemblies 450 and 500 are substantially the same in other aspects.
[0062] Figure 30 and 31 Show a top view and a side view of the electronic assembly 500 according to an embodiment of the present invention, respectively. The magnetic core 501 may include magnetic materials commonly used in inductors, such as iron powder and ferrite. The magnetic core 501 can be placed inside the spiral inductor 100 by fitting the shape of the magnetic core 501 into the inner diameter of the spiral inductor 100, or by some other means, depending on the specific details of the implementation. The magnetic core 501 can have a rectangular box shape (as shown), a cylindrical shape, two semi-cylindrical shapes, or other shapes. Changing the shape, size, and / or material of the magnetic core 501 allows adjusting the inductance of the spiral inductor 100 in the electronic assembly 500.
[0063] Figure 32 Shows a front view of the electronic assembly 500 according to an embodiment of the present invention. The substrates 451 and 452 are shown, and for reference, the second end 114 of the wire 112 of the spiral inductor 100 faces the viewer.
[0064] Except for the magnetic core 501, Figures 29 to 32 the numbered components of the electronic assembly 500 in
[0065] Figure 33 Shows a graph of the relative relationship between inductance and frequency from the simulation of the spiral inductor 100 in the electronic assembly 500 according to an embodiment of the present invention. The simulation is performed using ANSYS 2023R1 simulation software. In Figure 33In the simulation, wire 112 is a copper wire with a wire diameter of 3 mils; the spiral inductor 100 has a length of 146 mils (see Figure 2 , length L) and a spiral-wound portion with an inner diameter of 20 mils (see Figure 3 , inner diameter D); and the magnetic core 501 is a ferrite core. Each of the substrates 451 and 452 is a conventional PCB that does not significantly affect the inductance of the spiral inductor 100. In Figure 33 , the vertical axis represents inductance in nH and the horizontal axis represents frequency in kHz. For reference, at point m1 in Figure 33 , the spiral inductor 100 has an inductance of approximately 414.68 nH at approximately 1 kHz in the simulation. The increase in inductance with respect to the spiral inductor 100 in the electronic assembly 450 (see Figure 28 ) is attributed to the addition of the magnetic core 501 in the spiral inductor 100.
[0066] Figure 34 Shows a magnetic field simulation of the spiral inductor 100 according to an embodiment of the present invention. The simulation is performed using ANSYS 2023R1 simulation software. In Figure 34 's simulation, wire 112 is a copper wire with a wire diameter of 3 mils; the spiral inductor 100 has a length of 146 mils (see Figure 2 , length L) and a spiral-wound portion with an inner diameter of 20 mils (see Figure 3 , inner diameter D). In Figure 34 's simulation, there is no PCB together with the spiral inductor 100. The simulation indicates that the spiral inductor 100 can generate a magnetic flux density ranging from approximately 231.76 microteslas to approximately 9879.83 microteslas.
[0067] Figure 35 Shows a side view of the spiral inductor 100 with a magnetic core 120 according to an embodiment of the present invention. Figure 35 's spiral inductor 100 is the same as that in Figures 1 to 3 , except that a magnetic core 120 schematically illustrated as a virtual rectangular box is added. The magnetic core 120 is disposed within the spiral-wound portion of the spiral inductor 100.
[0068] Figure 36 Shows a graph of the relative relationship between the inductance and frequency of the simulation of Figure 35 's spiral inductor 100 according to an embodiment of the present invention. The simulation is performed using ANSYS 2023R1 simulation software. In Figure 36 's simulation, wire 112 is a copper wire with a wire diameter of 3 mils; the spiral inductor 100 has a length of 146 mils (see Figure 2 , length L) and an inner diameter of 20 mils (seeFigure 3 , a helically wound portion (inner diameter D); and the magnetic core 120 is a ferrite core. In Figure 36 the simulation of, there is no PCB together with the spiral inductor 100. In Figure 36 , the vertical axis represents inductance in nH and the horizontal axis represents frequency in kHz. For reference, at the point m1 in Figure 36 , the spiral inductor 100 has an inductance of approximately 414.3 nH at approximately 1 kHz in the simulation.
[0069] Although specific embodiments of the present invention have been provided, it should be understood that these embodiments are for illustrative purposes and not for limitation. Many additional embodiments will be apparent to those of ordinary skill in the art who read this disclosure.
Claims
1. An electronic assembly, comprising: A first substrate including a plurality of through holes each penetrating the first substrate, the plurality of through holes of the first substrate being disposed along a side edge of the first substrate; An inductor including a wire that spirally winds multiple turns around the side edge of the first substrate through the plurality of through holes of the first substrate; And A circuit electrically connected to the inductor.
2. The electronic assembly according to claim 1, wherein the first substrate is a printed circuit board, and the circuit is mounted on the printed circuit board.
3. The electronic assembly according to claim 1, further comprising: A magnetic core disposed within the inductor.
4. The electronic assembly according to claim 3, wherein the magnetic core is disposed within a notch cut out on the side edge of the first substrate.
5. The electronic assembly according to claim 1, wherein the inductor serves as an antenna for the circuit.
6. The electronic assembly according to claim 1, further comprising: A second substrate including a plurality of through holes each penetrating the second substrate, the plurality of through holes of the second substrate being disposed along a side edge of the second substrate, wherein the wire spirally winds multiple turns around the side edge of the first substrate and the side edge of the second substrate.
7. The electronic assembly according to claim 6, further comprising a magnetic core disposed within the inductor.
8. The electronic assembly according to claim 6, further comprising an electrical insulator layer disposed between the first substrate and the second substrate.
9. The electronic assembly according to claim 6, wherein the first substrate and the second substrate are disposed side by side.
10. The electronic assembly according to claim 6, wherein the first substrate and the second substrate are stacked.
11. An electronic assembly, comprising: A first substrate having a plurality of through holes each penetrating the first substrate, the plurality of through holes of the first substrate being disposed along a side edge of the first substrate; A second substrate having a plurality of through holes each penetrating the second substrate, the plurality of through holes of the second substrate being disposed along a side edge of the second substrate; And An inductor including a wire that spirally winds multiple turns around the side edge of the first substrate and the side edge of the second substrate through the plurality of through holes of the first substrate and the plurality of through holes of the second substrate.
12. The electronic assembly according to claim 11, further comprising: A magnetic core disposed within the inductor.
13. The electronic assembly according to claim 12, wherein the magnetic core is disposed within a notch on the side edge of the first substrate and a notch on the side edge of the second substrate.
14. The electronic assembly according to claim 11, further comprising: An electrical insulator located between the first substrate and the second substrate.
15. The electronic assembly according to claim 11, wherein the first substrate and the second substrate are arranged side by side.
16. The electronic assembly according to claim 15, further comprising a magnetic core disposed in a channel formed by notches on the side edges of the first substrate and the side edges of the second substrate.
17. The electronic assembly according to claim 11, wherein the first substrate and the second substrate are stacked.
18. The electronic assembly according to claim 11, wherein the inductor serves as an antenna for the circuit of the electronic assembly.