Injection molding packaging equipment and method for semiconductor with detection function

Abstract

The invention discloses semiconductor injection molding packaging equipment with a detection function and a method, and relates to the technical field of semiconductor injection molding packaging, the semiconductor injection molding packaging equipment comprises a packaging equipment main body and a controller, the two sides of the packaging equipment main body are respectively provided with a transmission belt, and the output end of the packaging equipment main body is provided with a cutting assembly; the output end of the cutting assembly is provided with a detection assembly, the cutting assembly can cut the injected and sealed semiconductor, and the detection assembly can detect the quality of a finished product chip, so that when the device is used, the device can detect the semiconductor after injection sealing, and then the quality of the semiconductor can be immediately known after injection sealing; according to the semiconductor packaging device, the pins of the packaged semiconductor can be detected through the detection assembly, and then good and bad semiconductors can be conveniently sorted in the follow-up process.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor injection packaging, and in particular to an injection packaging device and method for semiconductors with a detection function. Background Technique

[0002] Semiconductor packaging adheres a microelectronic chip to a plastic packaging substrate and uses a plastic packaging material for packaging. Among them, the chip can be fixedly packaged on the plastic packaging substrate using a molding matrix array packaging method;

[0003] However, in the existing injection packaging device, after the semiconductor is packaged, some plastic packaging materials will adhere to the mold. If the packaged semiconductor cannot be quickly separated from the mold, it will cause subsequent processes to be unable to proceed, which will further lead to an increase in the defective rate. At the same time, the existing injection packaging equipment cannot immediately clean the excess injection packaging materials after packaging the semiconductor. Subsequently, manual labor is required to clean the excess injection packaging materials. At the same time, when the existing equipment detects the packaged semiconductor, it can only detect the semiconductor separately through corresponding equipment, and the efficiency is slow, which will lead to a decrease in production efficiency. Summary of the Invention

[0004] The purpose of the present invention is to provide an injection packaging device and method for semiconductors with a detection function to solve the problems raised in the prior art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: An injection packaging device for semiconductors with a detection function, including a packaging device main body and a controller. Transmission belts are respectively installed on both sides of the packaging device main body. A cutting component is installed at the output end of the packaging device main body. A detection component is installed at the output end of the cutting component. The cutting component can cut the injected semiconductor, and the detection component can detect the quality of the finished chip.

[0006] Furthermore, the packaging device main body includes a support box. A packaging table and a support frame are installed above the support box. An upper mold and two sets of material grasping components are installed on the support frame. A lower groove is provided on the packaging table. The upper mold cooperates with the lower groove. Multiple push covers are provided at the bottom of the lower groove. The material grasping component can grasp the materials on the conveyor belt and in the lower groove. An auxiliary component is provided on the packaging table. The auxiliary component cooperates with the upper mold. The auxiliary component can assist the material to separate from the lower groove.

[0007] Further, a plurality of auxiliary slots are formed in the encapsulation table, and the auxiliary components are respectively installed in the auxiliary slots. The auxiliary component includes a limiting tube, and an airbag and a pressing magnetic ring are arranged inside the limiting tube. One end of the airbag is connected to the upper end of the limiting tube, and the other end of the airbag is connected to the pressing magnetic ring. The pressing magnetic ring can move inside the limiting tube. An exhaust hole is formed on the surface of the airbag in contact with the pressing magnetic ring, and the exhaust hole is matched with the push cover. An air inlet hole is formed at the other end of the airbag. A matching magnetic ring is arranged outside the limiting tube, and the matching magnetic ring is matched with the pressing magnetic ring. The matching magnetic ring is connected to the upper die, and a telescopic spring and a blocking block are installed inside the matching magnetic ring. The telescopic spring is installed between the matching magnetic rings, and the other end of the telescopic spring is installed with the blocking block. The blocking block is matched with the air inlet hole above the airbag.

[0008] Further, a cylinder and a storage tank are installed above the support frame. The output end of the cylinder is connected to the upper die, and the storage tank is connected to the upper die through a transmission pipe. A plurality of support rods are respectively installed at the bottom of the upper die. Each group of support rods is respectively matched with each group of auxiliary slots. The bottom of each group of support rods is respectively installed with the matching magnetic ring, and the telescopic spring is installed at the bottom of the support rod. The matching magnetic ring can move under the movement of the upper die.

[0009] Further, the material grabbing component includes two L-shaped material grabbing rods. Two cylinder slots are respectively installed on the support frame. Cylinders are respectively installed in the two cylinder slots. The output ends of the two cylinders face each other. The L-shaped material grabbing rods are respectively installed at the bottoms of the two cylinders. A plurality of suction cups are arranged at the bottom of the L-shaped material grabbing rod, and semiconductors can be grabbed through the suction cups.

[0010] Further, the cutting component includes a support plate. The support plate is installed on the conveyor belt at the discharge end. A plurality of cutting cylinders are installed above the support plate. A cutting frame is installed at the bottom of the support plate. The output end of the cutting cylinder is connected to the cutting frame. The opening of the cutting frame faces the direction of the conveyor belt. The cutting frame can cut the encapsulated chip and cut off the redundant plastic.

[0011] Further, the detection component is also installed on the conveyor belt at the discharge end. The detection component includes a detection frame and a plurality of detection cylinders. The plurality of detection cylinders are respectively installed on the support platform at equal intervals. The detection frame is installed at the bottom of the support platform. The output ends of the detection cylinders are respectively connected to the detection frame. The opening of the detection frame faces the conveyor belt, and the edge of the detection frame can contact and detect the chip pins.

[0012] Further, the controller is installed inside the support box, and an operation panel is arranged outside the support box. The operation panel is connected to the controller.

[0013] A packaging method for an injection molding packaging device for semiconductors with a detection function, including: S1, feeding materials into the lower groove;

[0014] S2, pressing down the upper mold to inject and package the materials;

[0015] S3, the packaged materials pass through a cutting component to remove the scraps;

[0016] S4, the cut materials can be monitored by a detection component.

[0017] Furthermore, S1 includes: S11, the materials are grabbed by a material grabbing component and placed into the lower groove; S2 includes: S21, after the upper mold and the lower groove are engaged, the storage tank injects the packaging raw materials between the upper mold and the lower groove; S22, during demolding, the auxiliary component can assist the chip to disengage from the mold; S3 includes: S31, the cutting cylinder can push the cutting frame to remove the excess scraps; S4 includes: S41, the detection frame contacts multiple groups of pins of the chip and detects the chip.

[0018] Compared with the prior art, the beneficial effects of the present invention are:

[0019] 1. When the device is in use, the device can detect the semiconductor after injection molding, and then immediately know the quality of the semiconductor after injection molding, preventing damage to the semiconductor by the packaging device during semiconductor packaging. The device can detect the pins of the packaged semiconductor through the detection component, and then facilitate the subsequent sorting of good and bad semiconductors.

[0020] 2. At the same time, when the device is in use, it can assist the packaged semiconductor to separate from the lower groove through the auxiliary component, thereby facilitating the grabbing component to grab the finished semiconductor and move the finished semiconductor. Because after injection molding and packaging the semiconductor, some injection molding materials will adhere to the mold, and then external force is needed to make the semiconductor disengage from the mold. However, the existing devices generally separate the semiconductor and the mold after opening the mold, while the device can make the semiconductor separate from the mold while opening the mold through the auxiliary component when in use, thus saving the time required for the production of the device.

[0021] 3. Because there will be some injection molding materials remaining on the packaged semiconductor after the existing injection molding packaging device packages the semiconductor, which will affect the appearance of the semiconductor and also the use effect. When the device is in use, it can cut the excess injection molding materials through the cutting component. Description of the Drawings

[0022] Figure 1Isometric structural schematic diagram of the whole of the present invention;

[0023] Figure 2 Structural schematic diagram of a part of the present invention;

[0024] Figure 3 Structural schematic diagram of the support box of the present invention;

[0025] Figure 4 Expanded structural schematic diagram of the support box of the present invention;

[0026] Figure 5 Structural schematic diagram of the other side of the support plate of the present invention;

[0027] Figure 6 Structural schematic diagram of the other side of the support plate of the present invention;

[0028] Figure 7 Structural schematic diagram of the auxiliary component and the push cover of the present invention;

[0029] Figure 8 Structural schematic diagram of the present invention in cooperation with a magnetic ring, a telescopic spring and a plugging block;

[0030] Figure 9 For the present invention Figure 4 Enlarged schematic diagram at "A" in;

[0031] Figure 10 Injection sealing method schematic diagram of the present invention.

[0032] In the figure: 1. Encapsulation equipment main body; 11. Conveyor belt; 12. Support plate; 2. Cutting component; 21. Cutting cylinder; 22. Cutting frame; 3. Detection component; 31. Detection cylinder; 32. Detection frame; 4. Support box; 41. Encapsulation table; 411. Lower groove; 412. Auxiliary groove; 42. Support frame; 421. Storage tank; 43. Upper mold; 5. Material grabbing component; 51. L-shaped material grabbing rod; 52. Suction cup; 6. Auxiliary component; 61. Limiting tube; 62. Airbag; 63. Extrusion magnetic ring; 64. Matching magnetic ring; 65. Telescopic spring; 66. Plugging block. Detailed implementation manners

[0033] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0034] Embodiment: As Figures 1-10As shown in the figure, the present invention provides a technical solution for an injection molding packaging device and method for semiconductors with a detection function, including a packaging device main body 1 and a controller. It is characterized in that: conveyor belts 11 are respectively installed on both sides of the packaging device main body 1, a cutting component 2 is installed at the output end of the packaging device main body 1, and a detection component 3 is installed at the output end of the cutting component 2. The cutting component 2 can cut the semiconductor after injection molding, and the detection component 3 can detect the quality of the finished chip;

[0035] When the device is in use, the semiconductor can be injection molded through the packaging device main body 1. For the conveyor belts 11 on both sides of the packaging device main body 1, one set of conveyor belts 11 is used to transport the unencapsulated semiconductor, and the other set of conveyor belts 11 is used to transport the encapsulated semiconductor. When the device encapsulates the semiconductor, it can assist the encapsulated semiconductor to separate from the mold during demolding, and then cooperate with the grasping component to assist in grasping the finished product onto the conveyor belt 11 at the output end. The finished semiconductor will move towards the cutting component 2 and the detection component 3 under the conveyance of the conveyor belt 11. When the encapsulated finished semiconductor moves to the bottom of the cutting component 2, the cutting component 2 can cut off the waste materials attached to the encapsulation. The finished semiconductor after cutting will move to the bottom of the detection component 3 under the conveyance of the conveyor belt 11. When the detection component 3 of the device is in use, it can press down on the pins of the semiconductor through the detection frame 32, and then perform relative detection on each group of pins to detect the quality of the chip. Therefore, when the device is in use, it can assist in material demolding and simultaneously detect the finished semiconductor, enabling the staff to sort out the finished products and failed products.

[0036] As Figures 1-5 and Figures 7-9 As shown in the figure, in this embodiment, specifically, the packaging device main body 1 includes a support box 4, a packaging table 41 and a support frame 42 are installed above the support box 4, an upper mold 43 and two sets of material grasping components 5 are installed on the support frame 42, a lower groove 411 is provided on the packaging table 41, the upper mold 43 cooperates with the lower groove 411, multiple push covers are provided at the bottom of the lower groove 411, the material grasping components 5 can grasp the materials in the conveyor belt and the lower groove 411, an auxiliary component 6 is provided on the packaging table 41, the auxiliary component 6 cooperates with the upper mold 43, and the auxiliary component 6 can assist the material to separate from the lower groove 411;

[0037] When the device is in use, the support box 4 plays a role in supporting the encapsulation table 41. The encapsulation table 41 can cooperate with the mold 43 to perform injection molding encapsulation on the semiconductor. The two sets of material gripping components 5 on the support frame 42 can assist the semiconductor to move between different components. When the two sets of material gripping components 5 are in use, one set of material gripping components 5 can only grip the semiconductor on the conveyor belt at the input end and transfer the semiconductor to the encapsulation table 41;

[0038] while the other set of gripping components can only grip the semiconductor on the encapsulation table 41 and grip and move the semiconductor on the encapsulation table 41 to the conveyor belt at the output end, so that the semiconductor can perform subsequent processes;

[0039] The auxiliary component 6 on the encapsulation table 41 can assist the finished semiconductor to separate from the mold after the semiconductor is injection molded and encapsulated, thereby facilitating the gripping component to grip the finished semiconductor and move the finished semiconductor.

[0040] As Figures 1-5 and Figures 8-9 shown, in this embodiment, specifically, a plurality of auxiliary grooves 412 are formed on the encapsulation table 41, and the auxiliary components 6 are respectively installed in the auxiliary grooves 412. The auxiliary component 6 includes a limiting tube 61. An airbag 62 and a pressing magnetic ring 63 are arranged inside the limiting tube 61. One end of the airbag 62 is connected to the upper end of the limiting tube 61, and the other end of the airbag 62 is connected to the pressing magnetic ring 63. The pressing magnetic ring 63 can move inside the limiting tube 61. An exhaust hole is formed on the surface of the airbag 62 in contact with the pressing magnetic ring 63, and the exhaust hole is matched with the push cover. The other end of the airbag 62 is provided with an air inlet hole. A matching magnetic ring 64 is arranged outside the limiting tube 61. The matching magnetic ring 64 cooperates with the pressing magnetic ring 63. The matching magnetic ring 64 is connected to the upper mold 43. A telescopic spring 65 and a blocking block 66 are installed inside the matching magnetic ring 64. The telescopic spring 65 is installed between the matching magnetic rings 64, and the other end of the telescopic spring 65 is installed with the blocking block 66. The blocking block 66 cooperates with the air inlet hole above the airbag 62;

[0041] When the auxiliary component 6 of the device is in use, it assists in separating the semiconductor after injection molding encapsulation from the mold, enabling the grasping component to easily grasp the encapsulated semiconductor. When the upper mold 43 moves downward and contacts the encapsulation table 41 during the use of the auxiliary component 6 of the device, since each set of mating magnetic rings 64 can cooperate with each set of auxiliary components 6, when the mating magnetic ring 64 initially enters the auxiliary groove 412, the mating magnetic ring 64 will cooperate with the extrusion magnetic ring 63, thereby driving the extrusion magnetic ring 63 to move towards the bottom of the auxiliary groove 412. At the same time, the airbag 62 will also be extended, causing the airbag 62 to inhale through the other end intake hole. At this time, the plugging block 66 of the device will be pulled by the telescopic spring 65. Since the energized telescopic spring 65 will contract itself, it can pull the plugging block 66 away from the intake hole, thereby realizing inflation of the airbag 62. When the mating component moves to the bottom, the power supply to the telescopic spring 65 will be stopped, enabling the plugging block 66 to block the intake hole. After injection molding and encapsulating the semiconductor, when the upper mold 43 rises, the mating magnetic ring 64 will also rise simultaneously. At this time, the extrusion magnetic ring 63 will also squeeze the airbag 62. At this time, the gas in the airbag 62 will be discharged from the discharge hole, thereby pushing the push cover, causing the push cover to push the finished semiconductor, and enabling the finished semiconductor to disengage from the lower groove 411. Thus, when the device is in use, it can facilitate the separation of the finished product from the mold, enabling the finished semiconductor to be produced more completely.

[0042] As Figure 1 shown, in this embodiment, specifically, a cylinder and a storage tank 421 are installed above the support frame 42. The output end of the cylinder is connected to the upper mold 43. The storage tank 421 is connected to the upper mold 43 through a transmission pipe. Multiple groups of support rods are respectively installed at the bottom of the upper mold 43. Each group of support rods respectively cooperates with each group of auxiliary grooves 412. The bottom of each group of support rods is respectively installed with the mating magnetic ring 64. The telescopic spring 65 is installed at the bottom of the support rod. The mating magnetic ring 64 can move under the movement of the upper mold 43.

[0043] The cylinder on the support frame 42 is mainly used to push the upper mold 43 in the direction of the lower groove 411, and the storage tank 421 can store the injection liquid. Since multiple groups of support rods are installed at the bottom of the upper mold 43 and each group of support rods is respectively installed with the mating magnetic ring 64 at the bottom, when the upper mold 43 moves under the push of the cylinder, it will also drive the mating magnetic ring 64 to move, enabling the mating magnetic ring 64 to enter the auxiliary groove 412. A wire is provided inside the support rod of the device to supply power to the telescopic spring 65. In the initial stage of the descent of the upper mold 43, the controller will supply power to the telescopic spring 65 through the wire. When the upper mold 43 is in full contact with the encapsulation table 41, the controller will disconnect the power supply to the telescopic spring 65 through the wire.

[0044] As Figure 1 andFigure 5 As shown, in this embodiment, specifically, the material grabbing assembly 5 includes two groups of L-shaped material grabbing rods 51. Two cylinder grooves are respectively installed on the support frame 42, and cylinders are respectively installed in the two cylinder grooves. The output ends of the two cylinders face each other. The L-shaped material grabbing rods 51 are respectively installed at the bottoms of the two cylinders. Multiple suction cups 52 are arranged at the bottom of the L-shaped material grabbing rod 51, and semiconductors can be grabbed through the suction cups 52.

[0045] When the material grabbing assembly 5 of the device is in use, it can grab materials. One group of the material grabbing assembly 5 can only grab semiconductors on the input conveyor belt and transfer the semiconductors to the encapsulation table 41.

[0046] The other group of grabbing assemblies can only grab semiconductors on the encapsulation table 41 and grab and move the semiconductors on the encapsulation table 41 to the output conveyor belt, enabling the semiconductors to undergo subsequent processes. When the grabbing assembly is specifically in use, the cylinders in the cylinder grooves can drive the L-shaped material grabbing rods 51 to move in the cylinder grooves. When the L-shaped material grabbing rods 51 move to the corresponding positions, the suction cups 52 located at the bottoms of the L-shaped material grabbing rods 51 will suck the materials, and then grab the materials and move them.

[0047] As Figure 1 and Figure 6 As shown, in this embodiment, specifically, the cutting assembly 2 includes a support plate 12. The support plate 12 is installed on the conveyor belt 11 at the discharge end. Multiple cutting cylinders 21 are installed above the support plate 12. A cutting frame 22 is installed at the bottom of the support plate 12. The output end of the cutting cylinder 21 is connected to the cutting frame 22. The opening of the cutting frame 22 faces the direction of the conveyor belt 11. The cutting frame 22 can cut the encapsulated chips and cut off the excess plastic.

[0048] When the cutting assembly 2 of the device is in use, it can cut the semiconductors after injection molding encapsulation and cut off the excess plastic. When the cutting assembly 2 of the device is specifically in use, the cutting cylinder 21 can drive the cutting frame 22 to move, enabling the cutting frame 22 to cut the semiconductors after injection molding encapsulation. At this time, the sharp border of the cutting frame 22 will squeeze and cut the excess part of the excess semiconductor. At the same time, different sizes of cutting frames 22 can be replaced to cut different semiconductors, and the lengths of different pins can also be limited.

[0049] As Figure 1 and Figure 6As shown in the figure, in this embodiment, specifically, the detection component 3 is also installed on the conveyor belt 11 at the discharge end. The detection component 3 includes a detection frame 32 and multiple groups of detection cylinders 31. The multiple groups of detection cylinders 31 are respectively installed on the support platform at equal intervals. The detection frame 32 is installed at the bottom of the support platform. The output ends of the detection cylinders 31 are respectively connected to the detection frame 32. The opening of the detection frame 32 faces the conveyor belt 11, and the edge of the detection frame 32 can contact and detect the chip pins.

[0050] When the detection component 3 of this device is in use, it can detect the packaged semiconductor to check whether the packaging process has an impact on the finished semiconductor, resulting in the semiconductor being unusable. When the detection component 3 is specifically in use, the detection cylinder 31 can drive the detection frame 32 to move downward, so that the detection frame 32 can contact the pins of the semiconductor. Through the detection frame 32, every two corresponding pins can be detected, and then whether the entire semiconductor is normal can be detected.

[0051] As Figures 1-3 shown in the figure, in this embodiment, specifically, the controller is installed inside the support box 4, and an operation panel is arranged outside the support box 4. The operation panel is connected to the controller.

[0052] When this device is in use, the controller can control each device of this device. Because there is an operation panel outside the support box 4 and the operation panel is connected to the controller, the staff can control this device through the operation panel.

[0053] As Figure 10 shown in the figure, in this embodiment, specifically, S1. The material is supplied into the lower groove;

[0054] S2. Press down the upper mold to inject and package the material;

[0055] S3. The packaged material passes through the cutting component to remove the scraps;

[0056] S4. The cut material can be monitored by the detection component.

[0057] As Figure 10 shown in the figure, in this embodiment, specifically, S1 includes S11. The material is grabbed into the lower groove by the material grabbing component; S2 includes S21. After the upper mold and the lower groove are matched, the storage tank will inject the packaging raw material between the upper mold and the lower groove; S22. When demolding, the auxiliary component can assist the chip to separate from the mold; S3 includes S31. The cutting cylinder can push the cutting frame to remove the excess scraps; S4 includes S41. The detection frame contacts multiple groups of pins of the chip and detects the chip.

[0058] Working principle: When in use, the device can perform injection molding encapsulation on semiconductors through the encapsulation device main body 1. The conveyor belts 11 on both sides of the encapsulation device main body 1 are divided into two groups. One group of conveyor belts 11 is used to transport the unencapsulated semiconductors, and the other group of conveyor belts 11 is used to transport the encapsulated semiconductors. When the device encapsulates semiconductors, it can assist the encapsulated semiconductors to separate from the mold during demolding. Then, in cooperation with the grasping component, it can assist in grasping the finished products onto the conveyor belt 11 at the output end. The finished semiconductor products will move in the direction of the cutting component 2 and the detection component 3 under the conveyance of the conveyor belt 11. When the encapsulated finished semiconductor moves to the bottom of the cutting component 2, the cutting component 2 can cut off the scraps attached to the encapsulation. After being cut, the finished semiconductor products will move to the bottom of the detection component 3 under the conveyance of the conveyor belt 11. When the detection component 3 of the device is in use, it can press down on the pins of the semiconductor through the detection frame 32, and then perform relative detection on each group of pins to detect the quality of the chip. Therefore, when in use, the device can assist in demolding the materials and simultaneously detect the finished semiconductors, enabling the staff to sort out the finished products and defective products.

[0059] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, in any regard, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, it is intended to encompass all changes falling within the meaning and scope of the equivalent elements of the claims in the present invention. Any reference signs in the claims should not be regarded as limiting the claims involved.

Claims

1. An injection molding encapsulation device for semiconductors with a detection function, comprising an encapsulation device main body (1) and a controller, characterized in that: On both sides of the encapsulation device main body (1), conveyor belts (11) are respectively installed. At the output end of the encapsulation device main body (1), a cutting component (2) is installed. At the output end of the cutting component (2), a detection component (3) is installed. The cutting component (2) can cut the semiconductor after injection encapsulation, and the detection component (3) can detect the quality of the finished chips.

2. The injection molding and encapsulation device for semiconductors with a detection function according to claim 1, characterized in that: The encapsulation device main body (1) includes a support box (4). Above the support box (4), an encapsulation table (41) and a support frame (42) are installed. On the support frame (42), an upper mold (43) and two sets of material grasping components (5) are installed. On the encapsulation table (41), a lower groove (411) is provided. The upper mold (43) cooperates with the lower groove (411). At the bottom of the lower groove (411), multiple sets of push covers are provided. The material grasping component (5) can grasp the materials on the conveyor belt and in the lower groove (411). On the encapsulation table (41), an auxiliary component (6) is provided. The auxiliary component (6) cooperates with the upper mold (43), and the auxiliary component (6) can assist the separation of the material from the lower groove (411).

3. The injection molding and encapsulation device for semiconductors with a detection function according to claim 2, wherein: Multiple sets of auxiliary grooves (412) are formed on the encapsulation table (41). The auxiliary components (6) are respectively installed in the auxiliary grooves (412). The auxiliary component (6) includes a limit tube (61). Inside the limit tube (61), an airbag (62) and an extrusion magnetic ring (63) are provided. One end of the airbag (62) is connected to the upper end of the limit tube (61), and the other end of the airbag (62) is connected to the extrusion magnetic ring (63). The extrusion magnetic ring (63) can move inside the limit tube (61). An exhaust hole is formed on the surface of the airbag (62) in contact with the extrusion magnetic ring (63), and the exhaust hole cooperates with the push cover. An air inlet hole is formed at the other end of the airbag (62). A cooperating magnetic ring (64) is provided outside the limit tube (61). The cooperating magnetic ring (64) cooperates with the extrusion magnetic ring (63). The cooperating magnetic ring (64) is connected to the upper mold (43). Inside the cooperating magnetic ring (64), a telescopic spring (65) and a blocking block (66) are installed. The telescopic spring (65) is installed between the cooperating magnetic rings (64), and the other end of the telescopic spring (65) is installed with the blocking block (66). The blocking block (66) cooperates with the air inlet hole above the airbag (62).

4. A semiconductor injection molding and encapsulation device with a detection function according to claim 3, characterized in that: Above the support frame (42), a cylinder and a storage tank (421) are installed. The output end of the cylinder is connected to the upper mold (43). The storage tank (421) is connected to the upper mold (43) through a transfer pipe. Multiple sets of support rods are respectively installed at the bottom of the upper mold (43). Each set of support rods respectively cooperates with each set of auxiliary grooves (412). At the bottom of each set of support rods, the cooperating magnetic rings (64) are respectively installed. The telescopic spring (65) is installed at the bottom of the support rod. The cooperating magnetic ring (64) can move under the movement of the upper mold (43).

5. A semiconductor injection packaging device with a detection function according to claim 4, characterized in that: The material grabbing assembly (5) includes two groups of L-shaped material grabbing rods (51). Two cylinder grooves are respectively installed on the support frame (42). Two cylinders are respectively installed in the two cylinder grooves. The output ends of the two cylinders face each other. The L-shaped material grabbing rods (51) are respectively installed at the bottoms of the two cylinders. Multiple suction cups (52) are arranged at the bottom of the L-shaped material grabbing rod (51). The semiconductor can be grabbed through the suction cups (52).

6. The injection molding and encapsulation device for semiconductor with detection function according to claim 5, wherein: The cutting assembly (2) includes a support plate (12). The support plate (12) is installed on the conveyor belt (11) at the discharge end. Multiple cutting cylinders (21) are installed above the support plate (12). A cutting frame (22) is installed at the bottom of the support plate (12). The output end of the cutting cylinder (21) is connected to the cutting frame (22). The opening of the cutting frame (22) faces the direction of the conveyor belt (11). The cutting frame (22) can cut the packaged chips to remove the excess plastic.

7. An injection molding and encapsulation device for semiconductors with a detection function according to claim 6, characterized in that: The detection assembly (3) is also installed on the conveyor belt (11) at the discharge end. The detection assembly (3) includes a detection frame (32) and multiple detection cylinders (31). The multiple detection cylinders (31) are respectively installed on the support platform at equal intervals. The detection frame (32) is installed at the bottom of the support platform. The output ends of the detection cylinders (31) are respectively connected to the detection frame (32). The opening of the detection frame (32) faces the conveyor belt (11). The edge of the detection frame (32) can contact the chip pins for detection.

8. The injection molding and encapsulation device for semiconductor with detection function according to claim 7, characterized in that: The controller is installed inside the support box (4). An operation panel is arranged outside the support box (4). The operation panel is connected to the controller.

9. The encapsulation method of an injection molding encapsulation device for semiconductors with a detection function according to claim 8, characterized in that: S1. The material is supplied into the lower groove; S2. The upper mold is pressed down to inject and package the material; S3. The packaged material passes through the cutting assembly to remove the scraps; S4. The cut material can be monitored by the detection assembly.

10. A semiconductor injection packaging method with a detection function according to claim 9, characterized in that: The S1 includes S11. The material is grabbed into the lower groove by the material grabbing assembly; the S2 includes S21. After the upper mold and the lower groove are matched, the storage tank injects the packaging raw material between the upper mold and the lower groove; S22. During demolding, the auxiliary assembly can assist the chip to separate from the mold; the S3 includes S31. The cutting cylinder can push the cutting frame to remove the excess scraps; the S4 includes S41. The detection frame contacts multiple pins of the chip and detects the chip.

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