Micro-channel heat dissipation structure

Abstract

The invention relates to a micro-channel heat dissipation structure which comprises an upper-layer micro-channel chip and a lower-layer micro-channel chip, the surface of the upper-layer micro-channel chip and the surface of the lower-layer micro-channel chip are each provided with a plurality of corrugated micro-channels, one end of each corrugated micro-channel serves as a coolant inlet, and the other end of each corrugated micro-channel serves as a coolant outlet. And the wave crests and the wave troughs of the plurality of corrugated micro-channels are communicated through secondary channels. The main channel of the micro-channel heat dissipation structure adopts the corrugated micro-channel, and the corrugated structure can periodically change the flowing direction of the coolant, disturb the boundary layer of the coolant, improve the turbulence effect and remarkably improve the heat exchange efficiency. And meanwhile, the wave crests and the wave troughs of the multiple corrugated micro-channels communicate through the secondary channels, when flowing to the secondary channels, coolants can be divided in the secondary channels, flowing dead zones are reduced, mixing of the coolants is promoted, and the heat exchange efficiency is further improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip heat dissipation, and particularly relates to a microchannel heat dissipation structure. Background Art

[0002] With the integration and high efficiency of integrated circuits, the power consumption of chips has increased sharply, resulting in a significant rise in heat generation. Research shows that when electronic devices are in an environment of 70°C - 80°C, for every 1°C increase in temperature, their reliability decreases by 5%. Therefore, how to improve the heat dissipation ability of chips is one of the key points in the development of integrated circuits.

[0003] Microchannel heat dissipation is an efficient cooling method, which refers to dissipating heat through microscale channels etched on a substrate. Its implementation form usually means that heat is conducted through the substrate to the working fluid flowing in the microchannels, and then conducted by the working fluid to the outside of the device. Due to the advantages of good temperature uniformity, simple structure of the equipment system, small mass, and stable operation, the microchannel heat dissipation system is expected to become one of the solutions for heat dissipation of future high-density heat-generating electronic devices.

[0004] However, existing microchannel heat sinks (MCHS) usually adopt a straight-channel design, with a single coolant flow path, poor fluidity, low heat flux density, and limited heat transfer efficiency. Summary of the Invention

[0005] The main purpose of the present invention is to propose a microchannel heat dissipation structure, which can effectively solve the problems in the background art.

[0006] To achieve the above object, the present invention is realized through the following technical solutions:

[0007] A microchannel heat dissipation structure includes an upper microchannel chip and a lower microchannel chip. A plurality of corrugated microchannels are provided on the surfaces of the upper microchannel chip and the lower microchannel chip. One end of the plurality of corrugated microchannels serves as a coolant inlet, and the other end serves as a coolant outlet. The peaks and valleys of the plurality of corrugated microchannels are connected through secondary channels.

[0008] 2. The microchannel heat dissipation structure according to claim 1, wherein the positions of the coolant inlets and coolant outlets of the upper microchannel chip and the lower microchannel chip are swapped.

[0009] Preferably, the corrugated microchannel is in the form of a sine wave structure.

[0010] Preferably, the amplitude directions of the corrugated microchannels of the upper microchannel chip and the corrugated microchannels of the lower microchannel chip are opposite.

[0011] Preferably, the upper microchannel chip and the lower microchannel chip have a length of 11800 um and a width of 4600 um.

[0012] Preferably, the width of the corrugated microchannel is 150 um, the spacing between adjacent corrugated microchannels is 100 um, and the width of the secondary channel is 100 um.

[0013] Preferably, the coolant inlet of the corrugated microchannel has a horizontal buffer section.

[0014] Preferably, the length of the buffer section is 1000 um.

[0015] The present invention provides a microchannel heat dissipation structure, which has the following beneficial effects:

[0016] 1. The present invention adopts a double-layer heat dissipation structure of an upper microchannel chip and a lower microchannel chip to increase the structural heat flux.

[0017] 2. The main channel of the microchannel heat dissipation structure of the present invention adopts a corrugated microchannel. The corrugated structure can periodically change the flow direction of the coolant, disturb the boundary layer of the coolant, improve the turbulent effect, and significantly improve the heat transfer efficiency.

[0018] 3. At the same time, the peaks and valleys of several corrugated microchannels of the present invention are connected through secondary channels. When the coolant flows to the secondary channels, it will be divided in the secondary flow channels, reducing the flow dead zone, promoting the mixing of the coolant, further improving the heat transfer efficiency, and reducing the flow resistance by dividing the coolant, optimizing the pressure drop distribution, and suppressing the flow boiling instability.

[0019] 4. The positions of the coolant inlet and the coolant outlet of the upper microchannel chip and the lower microchannel chip of the present invention are swapped, so that cross-flow heat transfer can be formed, enabling the coolant to absorb heat more evenly, that is, while increasing the structural heat flux in the double-layer heat dissipation, the heat dissipation uniformity can also be ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic diagram of the microchannel heat dissipation structure of the present invention;

[0021] Figure 2 is a schematic diagram of the upper microchannel chip of the present invention;

[0022] Figure 3 is a schematic diagram of the corrugated microchannel and the secondary channel of the present invention;

[0023] Figure 4 is a Comsol simulation result diagram of the present invention.

[0024] In the figure: 1. Upper microchannel chip; 2. Lower microchannel chip; 3. Coolant inlet; 4. Coolant outlet; 5. Corrugated microchannel; 6. Secondary channel; 7. Buffer section. Specific embodiments

[0025] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions in the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention.

[0026] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0027] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

[0028] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless otherwise specifically defined. In addition, the terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] Embodiment

[0030] Refer to Figures 1 - 3, A microchannel heat dissipation structure includes an upper microchannel chip 1 and a lower microchannel chip 2. The surfaces of the upper microchannel chip 1 and the lower microchannel chip 2 are both provided with a number of corrugated microchannels 5. Specifically, the microchannels are etched on the substrates of the microchannel chips. One end of the number of corrugated microchannels 5 serves as a coolant inlet 3, and the other end serves as a coolant outlet 4. The peak and valley positions of the number of corrugated microchannels 5 are connected through secondary channels 6.

[0031] When the microchannel heat dissipation structure dissipates heat, the coolant flows in from the coolant inlet 3, absorbs the heat of the chip and then flows out from the coolant outlet 4. The coolant can be deionized water or nanofluid.

[0032] The present invention adopts a double-layer heat dissipation structure of the upper microchannel chip 1 and the lower microchannel chip 2 to increase the structural heat flux. The main channels of the microchannel heat dissipation structure of the present invention adopt corrugated microchannels 5. The corrugated structure can periodically change the flow direction of the coolant, disturb the boundary layer of the coolant, improve the turbulent effect, and significantly improve the heat transfer efficiency. At the same time, the peak and valley positions of the number of corrugated microchannels 5 of the present invention are connected through secondary channels 6. When the coolant flows to the secondary channels 6, it will be split in the secondary flow channels, reducing the flow dead zone, promoting the mixing of the coolant, further improving the heat transfer efficiency, and also being able to reduce the flow resistance by splitting the coolant, optimizing the pressure drop distribution, and suppressing the flow boiling instability.

[0033] In a specific embodiment, the positions of the coolant inlets 3 and the coolant outlets 4 of the upper microchannel chip 1 and the lower microchannel chip 2 are swapped, that is, cross-flow heat exchange is formed between the upper microchannel chip 1 and the lower microchannel chip 2. In this embodiment, the left side of the upper microchannel chip 1 is the coolant inlet 3, and the right side is the coolant outlet 4. The right side of the lower microchannel chip 2 is the coolant inlet 3, and the left side is the coolant outlet 4.

[0034] In the traditional design, the coolant gradually heats up from the inlet to the outlet, forming a temperature gradient, resulting in a poor heat transfer effect and uneven heat dissipation near the outlet position.

[0035] The positions of the coolant inlets 3 and the coolant outlets 4 of the upper microchannel chip 1 and the lower microchannel chip 2 of the present invention are swapped, which can form cross-flow heat exchange, enabling the coolant to absorb heat more evenly, that is, while increasing the structural heat flux of the double-layer heat dissipation, the heat dissipation uniformity can also be ensured.

[0036] In a specific embodiment, the corrugated microchannel 5 is in the form of a sine wave structure.

[0037] In a specific embodiment, the amplitude directions of the corrugated microchannels 5 of the upper microchannel chip 1 are opposite to those of the corrugated microchannels of the lower microchannel chip 2.

[0038] In a specific embodiment, the lengths of the upper microchannel chip 1 and the lower microchannel chip 2 are 11800 um, and the widths are 4600 um. The width of the corrugated microchannel 5 is 150 um, the spacing between adjacent corrugated microchannels 5 is 100 um, and the width of the secondary channel 6 is 100 um. The coolant inlet 3 of the corrugated microchannel 5 has a horizontal buffer section 7. The length of the buffer section 7 is 1000 um.

[0039] In this embodiment, Figure 4 For the Comsol simulation result diagram, the heat transfer coefficient of this microchannel heat dissipation structure is 0.975 W / cm 2 ·K, and the heat flux density is 565.607 W / cm 2 , compared with the traditional microchannel heat dissipation structure, through the design of double-layer heat dissipation, the corrugated microchannel 5 and the secondary channel 6, the heat exchange efficiency of the present invention can be greatly improved. In addition, the weighted average temperature of the coolant outlet of the upper microchannel chip 1 of this microchannel heat dissipation structure is 32.142 °C, and the weighted average temperature of the coolant outlet of the lower microchannel chip 2 is 51.479 °C. Through cross-flow heat exchange, the present invention controls the weighted average temperature difference between the upper and lower layers within 20 °C, and the heat dissipation is uniform.

[0040] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A microchannel heat dissipation structure, characterized in that: It includes an upper microchannel chip and a lower microchannel chip. A number of corrugated microchannels are provided on the surfaces of the upper microchannel chip and the lower microchannel chip. One end of the number of corrugated microchannels serves as a coolant inlet, and the other end serves as a coolant outlet. The peak and valley positions of the number of corrugated microchannels are connected and communicated through secondary channels.

2. The microchannel heat dissipation structure according to claim 1, characterized in that: The positions of the coolant inlets and coolant outlets of the upper microchannel chip and the lower microchannel chip are swapped.

3. The microchannel heat dissipation structure according to claim 1, characterized in that: The corrugated microchannel is in the form of a sine wave structure.

4. A microchannel heat dissipation structure according to claim 3, characterized in that: The amplitude directions of the corrugated microchannels of the upper microchannel chip are opposite to those of the corrugated microchannels of the lower microchannel chip.

5. A microchannel heat dissipation structure according to claim 1, characterized in that: The lengths of the upper microchannel chip and the lower microchannel chip are 11800um, and the widths are 4600um.

6. The microchannel heat dissipation structure according to claim 1, wherein: The width of the corrugated microchannel is 150um, the spacing between adjacent corrugated microchannels is 100um, and the width of the secondary channel is 100um.

7. A microchannel heat dissipation structure according to claim 1, characterized in that: The coolant inlet of the corrugated microchannel has a horizontal buffer section.

8. A microchannel heat dissipation structure according to claim 7, characterized in that: The length of the buffer section is 1000um.

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